KR20150021832A

KR20150021832A - Touch Sensor Module

Info

Publication number: KR20150021832A
Application number: KR20130099265A
Authority: KR
Inventors: 박호준; 위성권
Original assignee: 삼성전기주식회사
Priority date: 2013-08-21
Filing date: 2013-08-21
Publication date: 2015-03-03

Abstract

A touch sensor module according to an embodiment of the present invention includes: a base substrate having electrode pads on one surface; And a conductive layer formed between the electrode pad and the terminal portion so as to electrically connect the electrode pad and the terminal portion, and a conductive layer formed to correspond to the electrode pad and having a terminal portion electrically connected to transmit a signal, And a touch sensor module.

Description

A touch sensor module

The present invention relates to a touch sensor module.

With the development of computers using digital technology, auxiliary devices of computers are being developed together. Personal computers, portable transmission devices, and other personal information processing devices use various input devices such as a keyboard and a mouse And performs text and graphics processing.

However, as the use of computers is gradually increasing due to the rapid progress of the information society, there is a problem that it is difficult to efficiently operate a product by using only a keyboard and a mouse which are currently playing an input device. Therefore, there is an increasing need for a device that is simple and less error-prone, and that allows anyone to easily input information.

In addition, the technology related to the input device is shifting beyond the level that satisfies the general functions, such as high reliability, durability, innovation, design and processing related technology, etc. In order to achieve this purpose, As a possible input device, a touch sensor has been developed.

Such a touch sensor is installed on the display surface of a display such as an electronic notebook, a flat panel display device such as a liquid crystal display device (LCD), a plasma display panel (PDP), and an el (electroluminescence) and a cathode ray tube And is a tool used to allow the user to select desired information while viewing the display.

The types of touch sensors include Resistive Type, Capacitive Type, Electro-Magnetic Type, SAW (Surface Acoustic Wave Type) and Infrared Type).

These various types of touch sensors are employed in electronic products in consideration of problems of signal amplification, difference in resolution, difficulty in design and processing technology, optical characteristics, electrical characteristics, mechanical characteristics, environmental characteristics, input characteristics, durability and economical efficiency Currently, the most widely used methods are resistive touch sensors and capacitive touch sensors.

As one specific example of the touch sensor according to the related art, there is an example of a touch sensor disclosed in Korean Patent Laid-open No. 10-2011-0107590.

The structure of the touch sensor disclosed in the above description of the prior art includes a substrate, electrodes formed on the substrate, electrode wirings extending from the electrodes and gathered to one end of the substrate, And a controller connected through a flexible printed circuit board (hereinafter referred to as a 'flexible cable').

Here, the flexible cable transmits a signal generated from the electrode to the control unit via the electrode wiring. At this time, the flexible cable is electrically connected to the electrode wiring to transmit a signal. However, frequent connection defects occur in the flexible cable and the electrode wiring, and the reliability of the product is deteriorated due to frequent connection failure.

KR 10-2011-0107590 A

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems of the prior art, and it is an object of the present invention to provide a touch sensor module which improves the reliability of a product according to a connection defect rate when a touch sensor and a flexible cable are connected.

A touch sensor module according to an embodiment of the present invention includes: a base substrate having electrode pads; And a conductive layer disposed between the electrode wiring and the terminal portion to electrically connect the electrode pad and the terminal portion, wherein the flexible cable includes a terminal portion formed in correspondence with the electrode pad and having a terminal portion electrically connected to transmit a signal, A touch sensor module is provided.

It is preferable that the electrode pad is formed to protrude in the thickness direction of the surface of the base substrate according to an embodiment of the present invention.

In the touch sensor module according to an embodiment of the present invention, the terminal portion may be formed to surround the electrode pad.

In the touch sensor module according to an embodiment of the present invention, it is preferable that the electrode pads are spaced apart from each other by a predetermined distance so that electricity is not short-circuited.

In the touch sensor module according to an embodiment of the present invention, the conductive layer may use an anisotropic conductive film (ACF) or an anisotropic conductive adhesive (ACA).

In the touch sensor module according to the second embodiment of the present invention, it is appropriate that the electrode pad is inserted in the thickness direction.

In the touch sensor module according to the second embodiment of the present invention, it is preferable that the conductive layer and the terminal portion are partially inserted into the electrode pad.

In the touch sensor module according to the second embodiment of the present invention, it is preferable that at least one electrode pad is disposed at a predetermined distance so as not to short-circuit electricity.

In the touch sensor module according to the second embodiment of the present invention, it is preferable that the conductive layer uses an anisotropic conductive film (ACF) or an anisotropic conductive adhesive (ACA).

In the touch sensor module according to the second embodiment of the present invention, protrusions or grooves are formed between the terminals on a surface of the base substrate, and the soft cable corresponds to the protrusions or grooves It is appropriate that a corresponding portion to be fastened is formed.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the present invention, by forming the electrode pad and the terminal portion surrounding the conductive layer, it is possible to increase the contact area between the electrode pad and the conductive layer to increase the bonding force and the bonding force, thereby improving the reliability.

In addition, by providing the terminal portion surrounding the electrode pad and the conductive layer, it is possible to provide a touch sensor having improved electrical reliability by increasing the contact area between the electrode pad, the conductive layer, and the terminal portion.

In addition, by forming the terminal portion surrounding the electrode pad and the conductive layer, the adhesion between the electrode pad and the flexible cable is improved, thereby improving the operability of the touch sensor and the reliability of the driving.

In addition, the electrode pad, the conductive layer, and the terminal portion are inserted into the base substrate, thereby increasing the bonding force and bonding force of the adhesive sheet.

In addition, by inserting the electrode pad, the conductive layer, and the terminal portion into the base substrate, the thickness of the touch sensor module can be minimized.

1 is an assembled view of a touch sensor according to an embodiment of the present invention;
2 is a sectional view of a touch sensor according to an embodiment of the present invention;
Fig. 3 is a partially enlarged view of Fig. 1,
FIG. 4 is a joint sectional view of a flexible circuit according to one embodiment of FIG. 1,
5 is a sectional view of a flexible circuit according to a modification of the present invention,
6 is a junction sectional view of a flexible circuit according to a second embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms "one side,"" first, ""first,"" second, "and the like are used to distinguish one element from another, no. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention, detailed description of related arts which may unnecessarily obscure the gist of the present invention will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The term " touch " as used throughout this specification is intended to be broadly interpreted to mean not only direct contact with the contact receiving surface, but also means that the input means is proximate a considerable distance from the contact receiving surface.

FIG. 1 is an assembled view of a touch sensor according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a touch sensor according to an embodiment of the present invention, FIG. FIG. 5 is a joint sectional view of a flexible circuit according to a modification of the present invention, and FIG. 6 is a junction sectional view of a flexible circuit according to a second embodiment of the present invention.

A touch sensor module according to an embodiment of the present invention includes a base substrate 10 having electrode pads 14 formed on one surface thereof and a terminal portion 32 that is electrically connected to transmit signals and is formed corresponding to the electrode pads 14 And a conductive layer 20 disposed between the electrode pad 14 and the terminal portion 32 so as to electrically connect the electrode wiring 16 and the terminal portion 32. [

In the touch sensor module 1 of the present invention, the terminal portions 32 surrounding the electrode pads 14 are connected to each other so as to improve reliability of electrical operation. In addition, operational reliability can be ensured from the external impact of the touch sensor module 1, so that it is possible to diversify the operation of the touch sensor module 1 with respect to the user's convenience and the various products to which the touch sensor module 1 is applied.

1 and 2, it is appropriate that the base substrate 10 is made of a transparent material while retaining a predetermined strength or more. This is because the material of the base substrate 10 is not particularly limited but may be selected from the group consisting of polyethylene terephthalate (PET), polycarbonate (PC), polymethylmethacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone ), Cyclic olefin polymer (COC), TAC (triacetylcellulose) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, polystyrene (PS), biaxially oriented polystyrene biaxially oriented PS (BOPS), glass, tempered glass, or the like. Since a transparent electrode may be formed on one surface of the base substrate 10, a high frequency process or a primer process may be performed on one surface of the base substrate 10 to improve adhesion between the base substrate 10 and the transparent electrode To form a surface treatment layer.

The electrode pattern 12 plays a role of enabling a user to recognize a touch coordinate by generating a signal upon touch. The electrode pattern 12 can be formed by a plating process or a deposition process using a sputtering process. The electrode pattern 12 may be formed of a metal formed by exposing / developing the silver salt emulsion layer, and various kinds of materials capable of forming a mesh pattern with a conductive metal may be selected. Do. The electrode pattern 12 may be formed in any pattern known in the art, such as a rhombic pattern, a square pattern, a triangular pattern, and a circular pattern.

The electrode pattern 12 may be formed in a bar pattern. Are electrically insulated from the plurality of bar patterns of the electrode pattern (12). The electrode pattern 12 may be formed as a conductive pattern, and the shape thereof is formed in the same mesh pattern as the conductive pattern described above. When the electrode pattern 12 is formed in a bar-shaped pattern, the electrode pattern 12 should be electrically insulated between the electrode patterns 12, and each electrode pattern 12 is connected to the electrode wiring 16, The device including the touch sensor can be driven by calculating the input sinusoidal value.

The electrode pattern 12 can be touch-driven by a mutual type touch sensor in which a bar pattern orthogonal to the unidirectional bar pattern is formed on the base substrate 10 and the both substrates are coupled to each other. An electrode pattern 12 is formed on one base substrate 10 by arranging crossing patterns of diamond or the like orthogonal to each other using a bridge as an insulating material on one surface of the base substrate 10 to form a touch sensor module 1 ).

The electrode wiring 16 is electrically connected to the above-described electrode pattern 12 and the flexible cable 30. The electrode wirings 16 may be formed on the base substrate 10 by various printing methods such as a silk screen method, a lybia printing method, or an inkjet printing method. As the material of the electrode wiring 16, copper (Cu), aluminum (Al), gold (Au), silver (Ag), titanium (Ti), palladium (Pd), and chromium (Cr) The electrode wiring 16 may be an AG paste or organic silver having excellent electrical conductivity. However, the present invention is not limited to this example, and may be made of a low-resistance metal material such as a conductive polymer, carbon black (including CNT), metal oxides such as ITO, and metals.

1 and 2, the electrode wiring 16 is connected to only one end of the electrode pattern 12 in accordance with the touch sensor module 1 system. However, the electrode wiring 16 is provided at both ends of the electrode pattern 12 Of course. An electrode pad (14) electrically connected to the flexible cable (30) is disposed at a distal end portion of the electrode wiring (16). In other words, the electrode pad 14 is formed on a part of the electrode wiring 16 and the flexible cable 30 is electrically connected.

1 to 3, the electrode pad 14 is formed on the base substrate 10 by being connected to the electrode wiring 16. The electrode pad 14 is formed so as not to invade the active area of the flexible cable 30 and the base substrate 10, that is, the area recognizing the user's touch. The electrode pad 14 is located at one end of the base substrate 10 and is connected to the electrode wiring 16. The electrode pad 14 is formed to contact the conductive layer 20 and conduct electricity through the flexible cable 30. [ The conductive layer 20 and the flexible cable 30 are pressed and joined to the electrode pad 14. At this time, the electrode pads 14 are protruded (height: H) in the stacking direction of the base substrate 10 to improve the bonding force. That is, the conductive layer 20 surrounds the protruding surface of the electrode pad 20 to improve the bonding force and bonding force. The electrode pad 14 is formed with a contact surface in contact with the conductive ball 22 of the conductive layer 20. The length L of the contact surface is larger than the diameter of the conductive ball 22. [

A plurality of electrode pads 14 are formed so as to have a plane in contact with the conductive layer 20. At this time, the electrode pads 14 are spaced apart from each other by a distance that does not cause electrical interference between adjacent electrode pads. This is formed in such a range that the conductive layer 20 coupled to the electrode pad 14 and the terminal portion 32 are not electrically interfered with each other. The electrode pad 14 is formed so as to have a protrusion (height: H) <a length L of the contact surface. This is to maximize the contact area of the conductive balls 22 to minimize the electrical failure rate.

Referring to FIG. 4, the conductive layer 20 is in contact with the electrode pad 14 and electrically connected thereto. The conductive layer 20 is formed so as to surround a portion where the electrode pad 14 protrudes. That is, one surface of the conductive layer 20 surrounds the electrode pad 14, and the other surface of the conductive layer 20 is inserted into the terminal portion 32. The conductive layer 20 may be electrically connected to only a part of the electrode pad 14 as occasion demands. This is not intended to limit the manner in which the conductive layer 20 contacts the electrode pad 14.

The conductive layer 20 is preferably formed of an anisotropic conductive film (ACF). In some cases, it may be made of a conductive material such as an anisotropic conductive adhesive (ACA) or the like. The conductive layer 20 is disposed inside the conductive ball 22. The conductive balls 22 are electrically connected in one direction while the electrode pad 14 and the flexible cable 30 are pressurized and bonded together during the coupling process.

The flexible cable 30 includes a terminal portion 32 that contacts the conductive layer 20. The flexible cable 30 is electrically connected to the electrode pad 14 and electrically connects the electrode pattern 12 and a control unit (not shown). The terminal portion 32 is in contact with and electrically connected to the conductive ball 22. The terminal portion 32 is formed to surround the conductive layer to improve the bonding force and the bonding force. The terminal portion 32 is formed at a position corresponding to the electrode pad 14 and is formed so as to surround the electrode pad 14. This improves the bonding force and the bonding force while keeping the contact area of the conductive balls 22 wide, thereby minimizing the defective rate. Furthermore, the reliability of the product can be maintained even with external shocks.

The terminal portion 14 is formed so as to surround the conductive layer, thereby increasing the receiving contact area of the conductive ball 22, thereby improving the electrical reliability. The terminal portion 14 is formed so that the tubular electrode pattern 12 is made of a material such as copper (Cu), aluminum (Al), gold (Au), silver (Ag), titanium (Ti), palladium (Pd) use.

As in the case of Fig. 5, the projections 18 are formed while the plurality of electrode pads 14 are arranged. The protrusions 18 prevent electrical interference generated between the electrode pads 14 and the electrode pads 14. Further, the projecting portion 18 engages with the flexible cable 30, thereby enhancing the bonding force by an external impact. Further, by using the corresponding portion of the flexible cable 30 corresponding to the projecting portion 18, the coupling process is easy.

The touch sensor module according to the second embodiment of the present invention will not be described in detail with reference to the first embodiment, and the structure of the touch sensor module according to the second embodiment of the present invention will be described in detail. The repeated structure and material description of the base substrate 10 electrode patterns 12 and 13, the electrode wiring 16, the electrode pad 14, the conductive layer 20, and the terminal portion 32, which are repeated in the same manner as in the embodiment, It is omitted.

Referring to FIG. 6, the electrode pad 14 is connected to the electrode wiring 16 and is formed on the base substrate 10. The conductive layer 20 and the flexible cable 30 are pressed and joined to the electrode pad 14. At this time, the electrode pad 14 is inserted into the base substrate 10 to improve the bonding force. That is, the conductive layer 20 is inserted into the electrode pad 20 to improve the bonding force and bonding force. The electrode pad 14 is formed with a contact surface in contact with the conductive ball 22 of the conductive layer 20. The length L of the contact surface is larger than the diameter of the conductive ball 22. [

A plurality of electrode pads 14 are formed so as to have a plane in contact with the conductive layer 20. At this time, the electrode pads 14 are spaced apart from each other by a distance that does not cause electrical interference between adjacent electrode pads. At this time, the conductive layer 20 coupled to the electrode pad 14 and the terminal portion 32 are formed in a range that does not electrically interfere with each other. The electrode pad 14 is formed so as to be inserted (height: H) <length (L) of the contact surface. This is to maximize the contact area of the conductive balls 22 to minimize the defective rate.

The conductive layer 20 contacts the electrode pad 14 and is electrically connected. In the conductive layer 20, the electrode pad 14 is inserted therein. That is, the outer circumferential surface of the conductive layer 20 is formed so as to surround the electrode pad 14. That is, one surface of the conductive layer 20 is formed so as to surround the electrode pad 14 and to insert the terminal portion 32 on the other surface. The conductive layer 20 may be electrically charged by inserting only a part of the electrode pad 14 as the case may be. This does not mean that the conductive layer 20 is in contact with the electrode pad 14.

The flexible cable 30 includes a terminal portion 32 that contacts the conductive layer 20. The flexible cable 30 is electrically connected to the electrode pad 14 and electrically connects the electrode pattern 12 and a control unit (not shown). The terminal portion 32 is in contact with and electrically connected to the conductive ball 22. The terminal portion 32 is inserted into the conductive layer 20 to improve the bonding force and the bonding force. The terminal portion 32 is formed at a position corresponding to the electrode pad 14 and is formed to be inserted into the electrode pad 14. This can improve the bonding force and the bonding force of the conductive balls 22, thereby maintaining the reliability of the product even in an external impact.

The terminal portion 14 is formed to be inserted into the conductive layer 20, thereby increasing the bonding force and the bonding force of the conductive ball 22, thereby improving the electrical reliability.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be apparent that modifications and improvements can be made by those skilled in the art.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: Touch sensor
10: base substrate, 12: electrode pattern
14: electrode pad 16: electrode wiring
20: conductive layer (ACF) 22: conductive ball
30: flexible cable 32: terminal portion

Claims

A base substrate on which an electrode pad is formed;
A flexible cable formed corresponding to the electrode pad and having a terminal portion electrically connected to transmit a signal,
And a conductive layer disposed between the electrode pad and the terminal portion to electrically connect the electrode pad and the terminal portion.

The method according to claim 1,
Wherein the electrode pad is protruded in the thickness direction of the surface of the base substrate.

The method of claim 2,
And the terminal portion is configured to surround the electrode pad.

The method of claim 3,
Wherein at least one electrode pad is spaced apart from the electrode pad by a predetermined distance so as not to short-circuit electricity.

Claim 4
Wherein the conductive layer comprises an anisotropic conductive film (ACF) or an anisotropic conductive adhesive (ACA).

Claim 1
Wherein the electrode pad is inserted in the thickness direction.

Claim 6
And the conductive layer and the terminal portion are partially inserted into the electrode pad.

The method of claim 7,
Wherein at least one electrode pad is spaced apart from the electrode pad by a predetermined distance so as not to short-circuit electricity.

Claim 7
Wherein the conductive layer comprises an anisotropic conductive film (ACF) or an anisotropic conductive adhesive (ACA).

The method of claim 8,
Wherein protrusions or grooves are formed on a surface of the base substrate at a predetermined distance between two or more terminal portions,
Wherein the flexible cable has a corresponding portion to be fastened corresponding to the protruding portion or the groove portion.