KR20150025389A

KR20150025389A - Touch Sensor Module

Info

Publication number: KR20150025389A
Application number: KR20130103015A
Authority: KR
Inventors: 유진문
Original assignee: 삼성전기주식회사
Priority date: 2013-08-29
Filing date: 2013-08-29
Publication date: 2015-03-10

Abstract

A touch sensor module according to an embodiment of the present invention includes: a base substrate on which an electrode pattern is formed and on which an electrode pad is formed to transmit an electrical signal of the electrode pattern to the outside; And a dummy pad formed on the other surface of the base substrate and formed at a position corresponding to the electrode pad to prevent warpage.
In addition, by forming the dummy pad corresponding to the electrode pad, the shape of the dummy pattern can be variously changed as needed to minimize the occurrence of warping of the base substrate.

Description

A touch sensor module

The present invention relates to a touch sensor module.

With the development of computers using digital technology, auxiliary devices of computers are being developed together. Personal computers, portable transmission devices, and other personal information processing devices use various input devices such as a keyboard and a mouse And performs text and graphics processing.

However, as the use of computers is gradually increasing due to the rapid progress of the information society, there is a problem that it is difficult to efficiently operate a product by using only a keyboard and a mouse which are currently playing an input device. Therefore, there is an increasing need for a device that is simple and less error-prone, and that allows anyone to easily input information.

In addition, the technology related to the input device is shifting beyond the level that satisfies the general functions, such as high reliability, durability, innovation, design and processing related technology, etc. In order to achieve this purpose, As a possible input device, a touch sensor has been developed.

Such a touch sensor can be applied to a flat display device such as an electronic organizer, a liquid crystal display device (LCD), a plasma display panel (PDP), and an electroluminescence display device, and a display device such as a CRT (Cathode Ray Tube) And is a tool used to allow the user to select desired information while viewing the display.

The types of touch sensors include Resistive Type, Capacitive Type, Electro-Magnetic Type, SAW (Surface Acoustic Wave Type) and Infrared Type).

These various types of touch sensors are employed in electronic products in consideration of problems of signal amplification, difference in resolution, difficulty in design and processing technology, optical characteristics, electrical characteristics, mechanical characteristics, environmental characteristics, input characteristics, durability and economical efficiency Currently, the most widely used methods are resistive touch sensors and capacitive touch sensors.

As one specific example of the touch sensor according to the related art, there is an example of a touch sensor disclosed in Korean Patent Laid-open No. 10-2011-0107590.

The structure of the touch sensor disclosed in the above description of the prior art includes a substrate, electrodes formed on the substrate, electrode wirings extending from the electrodes and gathered to one end of the substrate, And a controller connected through a flexible printed circuit board (hereinafter referred to as a 'flexible cable').

Here, the flexible cable transmits a signal generated by the electrode to the control unit via the electrode wiring. At this time, the flexible cable is electrically connected to the electrode wiring to transmit the signal. However, frequent connection defects occur in the flexible cable and the electrode wiring, and the reliability of the product is deteriorated due to frequent connection failure.

KR 10-2011-0107590 A

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a touch sensor module in which an electrode pad connected to an electrode wiring is not bent electrically.

A touch sensor module according to an embodiment of the present invention includes: a base substrate on which an electrode pattern is formed and on which an electrode pad is formed to transmit an electrical signal of the electrode pattern to the outside; And a dummy pad formed on the base substrate and formed at a position corresponding to the electrode pad to prevent warpage.

In the touch sensor module according to an embodiment of the present invention, a plurality of electrode pads are alternately formed on one surface and the other surface of the base substrate.

In the touch sensor module according to an embodiment of the present invention, the dummy pad is formed to be equal to or larger than the area of the electrode pad.

In the touch sensor module according to an embodiment of the present invention, a metal layer of a metal material is used to prevent warping of the dummy pad.

In the touch sensor module according to an embodiment of the present invention, the dummy pad is formed of a metal corresponding to a thermal expansion coefficient generated in the electrode pad.

A touch sensor module according to an embodiment of the present invention includes: a base substrate on which an electrode pattern is formed and on which an electrode pad is formed to transmit an electrical signal of the electrode pattern to the outside; And a dummy pad formed in correspondence with the electrode pad and corresponding to the opposite surface of the base plate on which the electrode pad is formed, the flexible cable having a terminal portion electrically connected to transmit a signal, .

In the touch sensor module according to an embodiment of the present invention, the electrode pad includes a dummy pad having the same or larger area than the electrode pad.

In the touch sensor module according to an embodiment of the present invention, the dummy pad is formed to maintain rigidity by inserting a metal.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the present invention, by forming the dummy pad corresponding to the electrode pad, it is possible to prevent disconnection and poor contact between the electrode pad and the FPCB due to repeated use.

Further, by forming the dummy pad corresponding to the electrode pad, there is an effect of securing the reliability of the product by preventing electrical shorting between the electrode pad and the FPCB.

Further, by forming the dummy pad corresponding to the electrode pad, it is possible to prevent the base substrate from being warped due to the pressure generated when the electrode pad and the FPCB are coupled.

In addition, by forming the dummy pad corresponding to the electrode pad, a dummy pad corresponding to the density and size of the electrode pattern is formed, and it has the effect of being bent by heat or coping with physical change.

In addition, by forming the dummy pad corresponding to the electrode pad, the shape of the dummy pattern can be variously changed as necessary to minimize the occurrence of warping of the base substrate.

1 is a partial view of a touch sensor according to an embodiment of the present invention,
Fig. 2 is an assembled cross-sectional view of the flexible cable and the touch sensor of section AA in Fig. 1,
3 is an assembled cross-sectional view of the flexible cable of BB section and the touch sensor of Fig. 1,
Fig. 4 is an assembled sectional view of the flexible cable and the touch sensor of the CC section in Fig. 1,
5 is a front view of the flexible cable of the present invention,
6 is an exemplary view of a dummy pad according to a first modification of the present invention;
7 is an exemplary view of a dummy pad according to a second modification of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms "one side,"" first, ""first,"" second, "and the like are used to distinguish one element from another, no. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention, detailed description of related arts which may unnecessarily obscure the gist of the present invention will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a partial cross-sectional view of a touch sensor according to an embodiment of the present invention, FIG. 2 is an assembled cross-sectional view of a soft cable and a touch sensor of an AA cross section in FIG. 1, Fig. 5 is a front view of the flexible cable of the present invention, Fig. 6 is a plan view of the dummy according to the first modification of the present invention, Fig. FIG. 7 is an exemplary view of a dummy pad according to a second modification of the present invention. FIG.

The term " touch " as used throughout this specification is intended to be broadly interpreted to mean not only direct contact with the contact receiving surface, but also means that the input means is proximate a considerable distance from the contact receiving surface.

A touch sensor module 1 according to an embodiment of the present invention includes a base substrate 100 on which electrode patterns 120 and 130 are formed and electrode pads 140 are formed to transmit electrical signals of the electrode patterns 120 and 130 to the outside, The flexible cable 300 and the electrode pads 120 and 103 formed corresponding to the electrode pads 140 and the terminal portions 320 and 330 that are electrically connected to each other to transmit signals are provided on the opposite side of the base substrate 100 on which the electrode pads 120 and 103 are formed. And a dummy pad (400) formed on the dummy pad (400).

Referring to FIG. 1, the base substrate 100 serves to provide a region in which the electrode patterns 120 and 130 and the electrode wirings 150 and 160 are to be formed. Here, the base substrate 100 is divided into an active region and a bezel region. The active region is provided at the center of the base substrate 100 as a portion where the electrode patterns 120 and 130 are formed so as to recognize the touch of the input means, The bezel region is a portion where the electrode wirings 150 and 160 extending from the electrode patterns 120 and 130 are formed, and is provided at the edge of the active region. At this time, the base substrate 100 should have a supporting force capable of supporting the electrode patterns 120 and 130 and the electrode wirings 150 and 160, and transparency that allows the user to recognize an image provided by an image display device (not shown). The material of the base substrate 100 may be selected from the group consisting of polyethylene terephthalate (PET), polycarbonate (PC), polymethylmethacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone PES), cyclic olefin polymer (COC), TAC (triacetylcellulose) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, polystyrene (PS), biaxially oriented polystyrene Biaxially oriented PS (BOPS), glass, tempered glass or the like, but is not limited thereto.

2 and 4, and the electrode patterns 120 and 130 are formed on the base substrate 100 to allow the input unit to generate a signal upon touch to recognize the touch coordinates in the controller . The electrode pattern formed in the X axis direction of the base substrate 100 may be referred to as a first electrode pattern 120 and the electrode pattern formed in the Y axis direction of the base substrate 100 may be referred to as a second electrode pattern 120. [ Quot; pattern 130 ".

The electrode patterns 120 and 130 can be formed by a plating process or a deposition process using a sputtering process. The electrode patterns 120 and 130 may be formed of a metal formed by exposing / developing the silver salt emulsion layer, and various materials capable of forming a mesh pattern with a conductive metal may be selected. Do. The electrode patterns 120 and 130 may be formed of any pattern known in the art, such as a rhombic pattern, a square pattern, a triangular pattern, and a circular pattern.

The electrode patterns 120 and 130 may be touch-operated by a mutual type touch sensor that forms a bar pattern orthogonal to the unidirectional bar pattern on the base substrate 100 and couples the substrates to each other. The base substrate 100 is formed by arranging crossing patterns of diamond or the like orthogonal to each other using a bridge that is an insulating material on one surface to form an electrode pattern 120 on one base substrate 100, 1). &Lt; / RTI >

The electrode wires 150 and 160 electrically connect the above-described electrode patterns 120 and 130 and the flexible cable 300. The electrode wirings 150 and 160 may be formed on the base substrate 100 by various printing methods such as a silk screen method, a Lubian printing method, or an inkjet printing method. As the material of the electrode wirings 150 and 160, copper (Cu), aluminum (Al), gold (Au), silver (Ag), titanium (Ti), palladium (Pd), and chromium (Cr) As the electrode wirings 150 and 160, AG paste or organic silver having excellent electrical conductivity may be used. However, the present invention is not limited to this example, and may be made of a low-resistance metal material such as a conductive polymer, carbon black (including CNT), metal oxides such as ITO, and metals.

The electrode wiring 160 is connected only to one end of the electrode pattern 120 according to the touch sensor module 1 system. An electrode pad 140 electrically connected to the flexible cable 300 is disposed at a distal end of the electrode wires 150 and 160. In other words, the electrode pad 140 is formed on a part of the electrode wiring 150, 160 and the flexible cable 300 is electrically connected.

The electrode pads 140 are formed on the base substrate 100 by being connected to the electrode wirings 150 and 160. The electrode pad 140 is formed so as not to invade the active area of the flexible cable 300 and the base substrate 100, that is, the area recognizing the user's touch. The electrode pad 140 is located at one end of the base substrate 100 and is connected to the electrode wires 150 and 160. The electrode pad 140 is formed to contact the conductive layer 200 and conduct electricity through the flexible cable 300. The electrode pad 140 is pressed and coupled with the conductive layer 200 and the flexible cable 300. At this time, the electrode pad 140 is coupled with the conductive layer 200 in the stacking direction of the base substrate 100. The electrode pad 140 has a contact surface that contacts the conductive ball 220 of the conductive layer 200. The contact surface is formed larger than the diameter of the conductive ball 220.

A plurality of electrode pads 140 are formed at one end of the base substrate 100. At this time, the electrode pads 140 are spaced apart from each other by a distance that does not cause electrical interference between adjacent electrode pads. The electrode pad 140 is formed with a dummy pattern 400 at a position corresponding to one surface and the other surface of the base substrate 100. At this time, if the plurality of electrode pads 140 are arranged alternately with respect to each other, the dummy patterns 400 may be formed at corresponding areas of the electrode pads 140.

The conductive layer 200 contacts and is electrically connected to the electrode pad 140. When the conductive layer 200 is pressurized or bonded by pressure, conductive balls 220 having conductivity are provided inside. The conductive ball 220 is electrically connected to the electrode pad 140 and the terminal unit 320 in one direction while being pressurized and bonded to each other. The lower end face of the conductive layer 200 is connected to the electrode pad 140 and the upper end face of the conductive layer 200 is bonded to the terminal portion 320. That is, one surface of the conductive ball 220 inside the conductive layer 200 is bonded to the electrode pad 140 and the other surface is bonded to the terminal portion 320. This is not intended to limit the manner in which the conductive layer 200 is bonded to the electrode pad 140 and the terminal portion 320.

The conductive layer 200 is preferably formed of an anisotropic conductive film (ACF). In some cases, it may be made of a conductive material such as an anisotropic conductive adhesive (ACA) or the like.

Referring to FIG. 5, the flexible cable 300 includes terminal portions 320 and 330 contacting the conductive layer 200. The flexible cable 300 is electrically connected to the electrode pad 140 and electrically connects the electrode patterns 120 and 130 and a control unit (not shown). The terminal portions 320 and 330 are electrically connected to the conductive balls 220 in contact with each other. The terminal portions 320 and 330 are formed at positions corresponding to the plurality of electrode pads 140. The terminal portions 320 and 330 are coupled to the electrode pad 140 by being pressurized when coupled to the conductive layer 200. At this time, a dummy pad 400 for supporting the pressing of the terminal portions 320 and 330 and the electrode pad 140 is formed.

The dummy pad 400 is formed at a position corresponding to the electrode pad 140 to improve the electrical reliability of the touch sensor module 1 of the present invention. In addition, it can be applied to products of various touch sensor modules 1 by preventing warpage of the base substrate 100 in correspondence with the thermal window coefficient and pressure generated in the electrode pad 140.

The dummy pad 400 is formed at a position corresponding to the electrode pad 140. The dummy pads 400 are disposed so as to be offset from each other (corresponding to the electrode pads 140) (see FIG. 1). The dummy pad 400 is formed to correspond to the opposite surface on which the plurality of electrode pads 140 are disposed (see FIG. 6). Further, the dummy pad 400 forms an area corresponding to a region where a plurality of electrode pads are disposed (see FIG. 7).

The dummy pad 400 prevents the base substrate 100 from being bent when the conductive layer 200 is pressed by pressing the flexible cable 300 and the electrode pad 140. This is because, since the flexible cable 300 and the conductive layer 200 are made of a flexible material, it is appropriate to use a material having rigidity on one side for the connection.

The dummy pad 400 is suitably made of a metal material corresponding to the density of the electrode pad 140. The dummy pad 400 prevents a physical amount of change due to heat generated in the electrode pad 140. In addition, since the electrode pads 140 and the dummy pads 400 maintain the same density on both sides corresponding to each other, warpage is prevented. The dummy pad 400 is formed to have a physical density, a size, and the like on both sides of the base substrate 100. The dummy pad 400 minimizes the warpage of the base substrate 100 by maintaining the degree of compression and compression of each component generated in the electrode pad 140 in a similar manner.

The dummy pad 400 is formed of the same metal material to correspond to the electrode pad 140. Further, the dummy pad 400 is formed of a metal material having a corresponding thermal expansion coefficient corresponding to the electrode pad 140. In addition, the dummy pad 400 is formed to have a shape corresponding to the electrode pad 140. The area and thickness of the dummy pad 400 are formed to correspond to the electrode pad 140, thereby preventing warpage in the base substrate 100.

The dummy pad 400 is formed in correspondence with the density of the electrode pad 140, having a plurality of rectangular shapes, a bar shape formed in one direction, a circular shape, and an interdigitally intersecting or arranged structure.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be apparent that modifications and improvements can be made by those skilled in the art.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: Touch sensor
100: base substrate 120: electrode pattern (first electrode pattern)
130: second electrode pattern 140: electrode pad
160: electrode wiring 200: conductive layer (ACF)
220: conductive ball 300: flexible cable
320, 330:

Claims

A base substrate on which an electrode pattern is formed and on which electrode pads are formed to transmit an electric signal of the electrode pattern to the outside;
And a dummy pad formed on the base substrate and formed at a position corresponding to the electrode pad to prevent warpage.

The method according to claim 1,
And a plurality of electrode pads are formed alternately on one surface and the other surface of the base substrate.

The method according to claim 1,
Wherein the dummy pad has a size equal to or larger than an area of the electrode pad.

The method according to claim 1,
Wherein the dummy pad has a metal layer made of a metal material so as to prevent warping.

The method of claim 4,
Wherein the dummy pad is formed of a metal corresponding to a thermal expansion coefficient generated in the electrode pad.

A base substrate on which an electrode pattern is formed and on which electrode pads are formed to transmit an electric signal of the electrode pattern to the outside;
A flexible cable formed corresponding to the electrode pad and having a terminal portion electrically connected to transmit a signal,
And a dummy pad formed corresponding to an opposite surface of the base substrate on which the electrode pad is formed.

The method of claim 6,
And a plurality of electrode pads are alternately formed on one surface and the other surface of the base substrate.

The method of claim 6,
Wherein the electrode pad includes a dummy pad having the same or larger area than the electrode pad.

The method of claim 6,
Wherein the dummy pad is formed to insert a metal to maintain rigidity.

The method of claim 9,
Wherein the dummy pad is formed of a metal corresponding to a thermal expansion coefficient generated in the electrode pad.