TW202347105A - Touch device - Google Patents

Abstract

The utility model discloses a touch device. The touch device comprises: a circuit board having an upper surface and a lower surface opposite to the upper surface; the cover plate is adhered to the upper surface; the pressure capacity module is arranged on the lower surface; the vibration motor is arranged on the lower surface; and the signal processor is electrically connected with the vibration motor and the pressure capacity module.

Description

touch device

The present invention relates to the technical field of touch devices, and in particular, to a touch device with pressure detection.

Current touch devices (such as touch phones and touch keyboards) usually use pressure sensors to detect the pressure of human finger touch. The pressure detection structure of the touch device is installed on the middle frame of the touch device and includes a cover plate, a display element and a pressure sensor. The old touch pads were unable to achieve pressure sensing and tactile feedback, resulting in a poor user experience and the development of some applications was not possible.

Therefore, there is a need to develop solutions that can detect force values and tactile feedback.

One object of the present invention is to disclose a touch device that generates capacitance changes through a pressure-capacitance module to solve the technical problems of the above background technology.

An embodiment of the invention discloses a touch device. The touch device includes: a circuit board, the upper surface of the circuit board includes touch detection electrodes for detecting the touch position of a finger; a pressure capacitance module placed below the circuit board and electrically connected to a signal processor. Sexual connection, used to deform under the pressure exerted by the finger when pressing the touch device to change the pressure sensing capacitance of the finger pressing area; a vibration motor, installed and fixed on the lower surface of the circuit board, and is electrically connected to the signal processor for providing vibration feedback in response to the pressure exerted by the finger; and the signal processor is installed and fixed on the lower surface of the circuit board for detecting the touch from the The electrodes and the pressure capacitance module receive the touch sensing signal and the pressure sensing signal and determine the touch position of the finger on the touch device and the amount of pressure exerted by the finger.

In a possible implementation, there are multiple pressure capacitor modules, and the pressure capacitor module includes an upper electrode and a lower electrode, and there is an air gap between the upper electrode and the lower electrode. The upper electrode or the lower electrode includes a plurality of elastic cantilevers.

In a possible implementation, the pressure-capacitive module includes an upper electrode and a lower electrode separated by a silicone pad.

In a possible implementation, the distance between the upper electrode and the lower electrode is between about 0.05 mm and about 0.3 mm.

In a possible implementation, the pressure-capacitive module further includes: a reinforcing frame that supports the lower electrode; and a flexible printed circuit board that is disposed on the reinforcing frame and supports the upper electrode.

In a possible implementation, the upper electrode is adhered to the lower surface of the circuit board through adhesive glue.

In a possible implementation, the upper electrode or the lower electrode includes a plurality of elastic cantilevers.

In a possible implementation, the upper electrode or the lower electrode includes a central area and a surrounding area, the central area and the surrounding area are partially hollowed out, and the central area and the surrounding area are connected by the Cantilever connection.

In a possible implementation, the thickness of the cantilever and the thickness of the central region are thinner than the thickness of the peripheral region.

Another embodiment of the present invention discloses a touch device. The touch device includes: a circuit board having an upper surface and a lower surface facing away from the upper surface; a cover plate adhered to the upper surface; an upper electrode located in the circuit board; and a lower electrode corresponding to the upper surface. Electrodes are arranged and partially joined to the circuit board; a support block supports the lower electrode; a vibration motor is arranged on the lower surface; and a signal processor is arranged on the lower surface and passes through the circuit board It is electrically connected to the upper electrode and the lower electrode.

In a possible implementation, the upper electrode is a pad or a solder joint in the circuit board.

In a possible implementation, the lower electrode has a horizontal part and a vertical part connected to the horizontal part, and the vertical part is joined to the circuit board.

In a possible implementation, the upper electrode and the lower electrode form a pressure-capacitive module, and the support block supports the pressure-capacitive module through a silicone pad.

In a possible implementation, the touch device further includes a shell supporting the support block.

In a possible implementation, screws or screw holes are attached to the support block for locking the support block to the screw holes or screws on the shell.

In a possible implementation, the vibration motor or the signal processor is disposed between the circuit board and the shell.

The following disclosure provides various implementations, or examples, by which various features of the present invention can be implemented. Specific examples of components and arrangements described below are intended to simplify the disclosure. It should be understood that these descriptions are only examples and are not intended to limit the scope of the present invention. For example, in the following description, forming a first feature on or over a second feature may include some embodiments in which the first and second features are in direct contact with each other; and may also include In some embodiments, additional elements are formed between the first and second features, such that the first and second features may not be in direct contact. Additionally, this disclosure may reuse element symbols and/or reference numerals in various embodiments. Such repeated use is for the purposes of brevity and clarity and does not in itself represent a relationship between the various embodiments and/or configurations discussed.

Notwithstanding that the numerical ranges and parameters defining the broader scope of the invention are approximations, the relevant numerical values in the specific embodiments are presented as precisely as possible. Any numerical value, however, inherently contains the standard deviation resulting from the individual testing methods used. As used herein, "about" generally means that the actual value is within plus or minus 10%, 5%, 1% or 0.5% of a specific value or range. Alternatively, the word "about" means that the actual value falls within an acceptable standard error of the mean, as would be considered by a person of ordinary skill in the art to which this invention belongs. When it can be understood that, except for experimental examples, or unless otherwise expressly stated, all ranges, quantities, numerical values and percentages used here (for example, to describe the amount of material, length of time, temperature, operating conditions, quantity proportions and other Similar ones) are all modified by "approval". Therefore, unless otherwise stated to the contrary, the numerical parameters disclosed in the description of the present invention and the accompanying patent claims are approximate values and may be changed as required. At a minimum, these numerical parameters should be understood to mean the number of significant digits indicated and the value obtained by applying ordinary rounding. As used herein, numerical ranges are expressed from one endpoint to the other endpoint or between the two endpoints; unless otherwise stated, numerical ranges stated herein are inclusive of the endpoints.

Generally speaking, the main pressure detection method on the market uses strain gauge solutions. FIG. 1 is a schematic structural diagram of a touch device in the prior art. Referring to FIG. 1 , the touch device 3 includes a touch panel 4 , an elastic bracket 5 , a linear motor 6 , four external force sensors 7 and four flexible pads 8 . Four external force sensors 7 are arranged on the elastic bracket 5 , and the flexible pads 8 are located on opposite sides of the elastic bracket 5 . This type of external force sensor 7 adopts a strain gauge solution.

The strain gauge solution uses strain gauges, and general strain gauges are resistive strain gauges. The resistance strain gauge is a sensor that converts strain into resistance changes (i.e., the external force sensor 7). It uses resistance-sensitive materials and is attached to the elastic bracket 5 for strain detection. The working principle of resistive strain gauges is based on the strain effect, which means that when the material is deformed by stress, its resistance value will also change accordingly.

However, the cost of resistive strain gauges is high, and generally speaking, the yield rate is low, and the structure of the whole machine is complex, which even increases the volume or weight of the product, affecting the promotion of pressure sensing and touch feedback. Therefore, in order to solve the above problems, the present invention proposes a capacitance detection scheme, which uses the principle of positive sensitivity to displacement and surface between two electrodes to detect finger presses; realizes force value detection, and feeds back capacitance changes to the signal processor through force value detection. The signal processor receives the capacitance change information and sends a signal to the vibration motor, causing the vibration motor to vibrate to realize the application of touch feedback. According to the difference in pressure-capacitance signal, it is combined with the application software solution to achieve different pressure touch feedback effects.

Figure 2 is a schematic cross-sectional view of a touch device provided according to the present invention. Referring to FIG. 2 , the touch device 1 includes a circuit board 10 for carrying a cover 20 and a plurality of pressure capacitive modules 30 . In some embodiments, the cover 20 is adhered to the circuit board 10 through adhesive glue 15 , and the plurality of pressure-capacitance modules 30 are adhered to the circuit board 10 through adhesive glue 25 respectively.

The circuit board 10 is used to sense touch signals, conduct or collect signals applied to the cover 20. The upper surface of the circuit board 10 includes touch detection electrodes for detecting the touch position of the finger. Electrical lines can also be arranged on the circuit board 10. or equipped with electronic components (such as resistors or capacitors). The circuit board 10 has an upper surface 10a and a lower surface 10b facing away from the upper surface 10a. In some embodiments, the circuit board 10 may be a flexible printed circuit board (FPC), a rigid printed circuit board (PCB), or other circuit boards.

The cover 20 is used to provide users with touch or press operations. In some embodiments, the cover 20 may be a glass material or a polyester material, such as a Mylar sheet that may contain polyethylene terephthalate (PET).

Each pressure volume module 30 has an upper surface 30a and a lower surface 30b facing away from the upper surface 30a. In some embodiments, the number of pressure-containing modules 30 may be two, four, six, eight or more, depending on the area of the cover plate 20 . Only two pressure-containing modules 30 are shown in FIG. 2 . Each pressure capacitor module 30 is symmetrically arranged on the lower surface 10b of the circuit board 10. In some other embodiments, the number of pressure capacity modules 30 may be an odd number. In some embodiments, the pressure-containing module 30 is adhered to the support block 40 through adhesive glue 35 .

The support block 40 is a carrier that provides physical support to the pressure capacity module 30 . In some embodiments, the support block 40 is made of polymer, such as an acrylic sheet. In some embodiments, screws 48 (or screw holes) are attached to the support block 40 , and the screws 48 (or screw holes) can be used to lock the support block 40 to the screw holes (or screws) on the housing 50 . In some embodiments, housing 50 may be made of metal or polymer. In other embodiments, the support block 40 may be attached to the housing 50 by adhesive or glue.

The vibration motor 60 is used to provide vibration feedback in response to the pressure exerted by the finger. The vibration motor 60 is disposed between the circuit board 10 and the housing 50 and is surrounded by a plurality of pressure capacity modules 30 . In some embodiments, the vibration motor 60 is adhered to the lower surface 10b of the circuit board 10 through adhesive glue 45 . The vibration motor 60 is electrically connected to the circuit board 10 . The vibration motor 60 has a vibrator that generates reciprocating vibration, and the generated amplitude can be used to provide a feedback effect of signal vibration. In some embodiments, the vibration motor 60 may be a linear motor, an electromagnetic motor, or a piezoelectric ceramic motor.

In some embodiments, the adhesives 15, 25, 35 and 45 may be optically clear adhesive (OCA), double-sided tape, or thermosetting glue. Specifically, the adhesive glue 15 is used to adhere and fix the cover plate 20 to the upper surface 10a of the circuit board 10, and the adhesive glue 25 is used to adhere and fix the upper surface 30a of the pressure capacity module 30 to the lower surface 10b of the circuit board 10. Above, the adhesive glue 35 is used to adhere and fix the lower surface 30b of the pressure-capacitive module 30 on the support block 40, and the adhesive glue 45 is used to adhere and fix the vibration motor 60 on the lower surface 10b of the circuit board 10.

The signal processor 70 is disposed on the lower surface 10b of the circuit board 10 and is located between the circuit board 10 and the housing 50 . The signal processor 70 is separated from the vibration motor 60 by a certain distance and is surrounded by a plurality of pressure-containing modules 30 . In some embodiments, the signal processor 70 may be an integrated circuit (IC), which is electrically connected to the circuit board 10 and thus to the vibration motor 60 and to the pressure capacitor module 30 . The pressure capacitor electrodes are electrically connected. The signal processor 70 is used to receive touch sensing signals and pressure sensing signals from the touch detection electrodes and the pressure capacitance module 30 on the upper surface 10 a of the circuit board 10 and determine the touch position of the finger on the touch device and the touch position of the finger. The amount of pressure applied. The signal processor 70 generates signals of different magnitudes or sizes according to the pressure, and transmits the signals to the vibration motor 60 through the circuit board 10 to cause the vibration motor 60 to vibrate.

FIG. 3 is an exploded perspective view of the touch device 1 in FIG. 2 . Referring to FIG. 3 , four pressure-capacity module groups 30 and two support blocks 40 are shown in FIG. 3 , where each two pressure-capacity module groups 30 are supported by the same support block 40 . A plurality of screws 48 (or screw holes) are attached to each support block 40, and the bottom of the pressure capacity module 30 can be locked to the support block 40 through the screws 48. The bottom of the pressure capacity module 30 is reinforced by being fixed together with the support block 40 . The shape and size of the support block 40 can be determined according to the overall machine structure or mechanical structure. The structure of the support block 40 shown in Figure 2 or 3 is only schematic and not the only structure.

FIG. 4 is a schematic cross-sectional view of the pressure capacity module 30 in FIG. 2 . Referring to FIG. 4 , in some embodiments, the pressure capacitor module 30 includes an upper electrode 31 , a lower electrode 33 and a silicone pad 32 . The upper electrode 31 and the lower electrode 33 serve as pressure capacitive electrodes, and a silicone pad 32 separates the upper electrode 31 and the lower electrode 33 .

In some embodiments, the upper electrode 31 and the lower electrode 33 are made of conductive materials such as copper, silver, gold, aluminum, iron, cobalt, nickel, titanium, tungsten or alloys thereof. In some embodiments, the silicone pad 32 is made of an insulating material, such as an insulating material containing polysiloxane. In some embodiments, the distance H1 between the upper electrode 31 and the lower electrode 33 is in the range of about 0.05 millimeter (mm) to about 0.3 mm. Within this distance range, when the distance between the upper electrode 31 and the lower electrode 33 When the distance between them changes, it is enough to produce a large enough capacitance change. In some cases, when the distance between the upper electrode 31 and the lower electrode 33 is too small, a sufficient amplitude change in the distance between the two electrodes will not occur, and the resulting capacitance change will not be obvious. In some cases, when the distance between the upper electrode 31 and the lower electrode 33 is too large, the pressure capacitive module 30 will be too thick, increasing the volume of the touch device 1 . In this embodiment, the distance H1 between the upper electrode 31 and the lower electrode 33 is approximately equal to the thickness of the silicone pad 32 . In some embodiments, the silicone pad 32 can be replaced with air.

In some embodiments, the lower electrode 33 and the flexible printed circuit board (FPC) 36 are respectively disposed on the reinforcing frame 37 , and the lower electrode 33 does not contact the flexible printed circuit board 36 . The flexible printed circuit board 36 and the reinforcing frame 37 do not belong to the pressure-capacitive module, but each belong to an independent component. The reinforcing frame 37 may be made of an insulator material and serves as a carrier to provide physical support for the lower electrode 33 and the flexible printed circuit board 36 . The lower electrode 33 is disposed at the center of the reinforcing frame 37 , and the flexible printed circuit board 36 is disposed around the reinforcing frame 37 and partially covers the reinforcing frame 37 . In some embodiments, the cantilever 31 a of the upper electrode 31 is adhered to the flexible printed circuit board 36 located around the reinforcing frame 37 through an adhesive layer 38 . In such an embodiment, the upper electrode 31 can be supported by the reinforcing frame 37 through the flexible printed circuit board 36 and the adhesive layer 38 , and at the same time, the upper electrode 31 is also supported by the reinforcing frame 37 through the silicone pad 32 and the lower electrode 33 . The flexible printed circuit board 36 transmits electrical signals between the signal processor 70 and the upper electrode 31 and the lower electrode 33 of the pressure capacitor module 30 to facilitate pressure detection by the pressure capacitor module 30 .

In the schematic cross-sectional view of the pressure capacitive module 30 in FIG. 4 , the upper electrode 31 and its cantilever 31 a are in the shape of a "U", and a silicone pad 32 is sandwiched between the space in the center of the upper electrode 31 and the lower electrode 33 . In some embodiments, the silicone pad 32 does not need to fill the entire space in the center of the upper electrode 31 , but can maintain a certain distance from the flexible printed circuit board 36 and the adhesive layer 38 respectively. In some embodiments, the upper surface 30a of the pressure capacitor module 30 refers to the surface of the upper electrode 31 facing away from the silicone pad 32. In some embodiments, the lower surface 30b of the pressure-capacitive module 30 is the surface of the reinforcing frame 37 facing away from the silicone pad 32.

FIG. 5 is a schematic perspective view of the pressure capacity module 30 in FIG. 4 . Referring to FIG. 5 , the cover plate 20 is disposed on the circuit board 10 , and the pressure-capacitance module 30 is disposed on the side of the circuit board 10 facing away from the cover plate 20 . The circuit board 10 is located between the cover plate 20 and the pressure capacitor module 30 . In some embodiments, the pressure capacitor module 30 is completely covered by the circuit board 10 and is adhered to the circuit board 10 through the adhesive glue 25 (as shown in FIG. 2 ). In some embodiments, the upper electrode 31 and the lower electrode 33 in the pressure capacitor module 30 are electrically connected to the circuit board 10. The specific appearance of the upper electrode 31 and the lower electrode 33 is shown in Figures 6a, 6b, 7a, 7b, and 8a. , 8b, 9a and 9b shown. The upper electrode 31 depicted in Figure 5 is based on the upper electrode 31 in Figures 6a and 6b as an example. As shown in Figure 5, a "𠃑"-shaped cantilever 31a extends from the upper electrode 31. In some embodiments, the upper electrode 31 has a disk-shaped structure, and the lower electrode 33 has a planar structure. In such an embodiment, the silicone pad 32 may be disposed in the space between the upper electrode 31 and the lower electrode 33 . In order to support the silicone pad 32 , the area of the lower electrode 33 is at least greater than or equal to the area of the silicone pad 32 . The upper electrode 31 and the lower electrode 33 are electrically connected to the circuit board 10 so that the capacitance change measured by the pressure capacitor module 30 can transmit electrical signals to other components on the circuit board 10 through the circuit board 10, such as the vibration motor 60 or signals. Processor 70 (shown in Figure 2).

Figures 6a, 6b, 7a, 7b, 8a, 8b, 9a and 9b are schematic diagrams of different appearances of the upper electrode 31 and the lower electrode 33 in Figure 4 or 5 respectively. According to the requirements of different images, the upper electrode 31 and the lower electrode 33 with different appearances can be formed through processes such as mold stamping, laser cutting or metal etching.

Referring to Figures 6a and 6b, in some embodiments, the upper electrode 31 and the lower electrode 33 are circular electrodes. The electrodes include a central area R1 and a surrounding area R2. The surrounding area R2 surrounds the central area R1, and the central area R1 and the surrounding area R2 There is a hollow area O1 in between, and the central area R1 and the surrounding area R2 are connected by a plurality of "𠃑"-shaped cantilevers 31a. In this embodiment, when viewed from above, both the central region R1 and the surrounding region R2 are circular. In some embodiments, cantilever 31a and central region R1 are thinner portions of the electrode. The thickness of the central region R1 is thinner than that of the surrounding region R2, so that the electrode exhibits a structure with a concave portion in the middle. In some embodiments, the central area R1 is the main force-bearing area of the electrode when the external force F presses the cover plate 20 . The cantilever 31a has elasticity or flexibility, which can cause the displacement change of the upper electrode 31 and the lower electrode 33 to be larger when the same external force F presses the cover 20, thus producing a more obvious capacitance change ΔC. In addition, the cantilever 31a itself has elasticity and can be partially bent when subjected to external force F, allowing more force deformation, thereby increasing the sensing sensitivity. In some embodiments, the surrounding area R2 may be adhered to the circuit board 10 .

Referring to Figures 7a and 7b, the electrodes shown in Figures 7a and 7b are similar to the electrodes shown in Figures 6a and 6b. The difference is that in this embodiment, when viewed from above, the central region R1 is circular, while the surrounding region R2 is square.

Referring to Figures 8a and 8b, the electrodes shown in Figures 8a and 8b are similar to the electrodes shown in Figures 7a and 7b. The difference is that in this embodiment, when viewed from above, the central area R1 can be rotated from the central area R1 in Figures 7a and 7b. In addition, the "𠃑"-shaped cantilever 31a can have unequal length distribution. .

Referring to Figures 9a and 9b, the upper electrode 31 and the lower electrode 33 shown in Figures 9a and 9b are parallel structures. The upper electrode 31 and the lower electrode 33 are separated by support pillars 33b.

Referring to Figures 10a and 10b, Figure 10a shows a top view of the lower electrode 33 according to an embodiment. The lower electrode 33 has a "king"-shaped appearance. Figure 10b shows an elevation view of the upper electrode 31 according to this embodiment. The upper electrode 31 has a "king"-shaped appearance corresponding to the lower electrode 33. In some embodiments, the “king”-shaped appearance is a concave portion of the upper electrode 31 or the lower electrode 33 .

Referring to Figures 11a and 11b, Figure 11a shows a side view of the lower electrode 33 according to an embodiment. The lower electrode 33 may have a horizontal portion 33h and a protruding portion 33p connected to the horizontal portion 33h, so that the lower electrode 33 presents a "T" Character-like appearance. Figure 11b shows a top view of the upper electrode 31 according to this embodiment. In some embodiments, the upper electrode 31 corresponds to the lower electrode 33 and has a horizontal portion 31h and a recessed portion 31c in the horizontal portion 31h. In some embodiments, the protruding portion 33p of the lower electrode 33 may be combined with the concave portion 31c of the upper electrode 31.

Referring to Figures 12a and 12b, in some embodiments, the upper electrode 31 and the lower electrode 33 are disc-shaped electrodes. The electrodes include a central area R3 and a surrounding area R4. The surrounding area R4 surrounds the central area R3 and is connected to the central area R3. In some embodiments, the central region R3 has a disk-like appearance with one side being concave and the other side being protruding relative to the surrounding region R4.

Referring to Figures 13a and 13b, in some embodiments, the lower electrode 33 is an "S"-shaped electrode, and the two large upper electrodes 311 can be linear and located at the two "S"-shaped torsos 33c of the lower electrode 33. On the upper body, a plurality of small upper electrodes 312 may be located between the two torsos 33c. Multiple upper electrodes 311 and 312 can be used to measure multiple capacitances and obtain their average value. In some embodiments, the distance between the upper electrode 312 and the lower electrode 33 is the same as the distance between the upper electrode 311 and the lower electrode 33 . In some other embodiments, the distance between the upper electrode 312 and the lower electrode 33 can be changed. For example, a support post 33d can be provided between the lower electrode 33 and the upper electrode 312 to simultaneously obtain the capacitance between parallel electrodes at different distances. size.

FIG. 14 is a schematic diagram of the principle of using the touch device 1 of FIG. 2 to press the pressure capacitive module 30 . According to the formula of capacitance: Where C is the capacitance size, ε is the dielectric permittivity, A is the electrode area, and d is the distance between two parallel electrodes. It can be seen that when the electrode area A is constant, the capacitance size C is inversely proportional to the distance d between the two parallel electrodes. .

Referring to FIG. 14 , in some embodiments, when the user's fingers or other objects press the cover 20 , the cover 20 is squeezed by the external force F. Under the external force F, the cover 20 in the touch device 1 , the circuit board 10 and the adhesive tape 15 and 25 will all be forced to move downward and squeeze the pressure capacity module 30 .

Referring again to FIG. 4 , when the pressure capacitor module 30 is squeezed, the upper electrode 31 will be forced to move downward and squeeze the silicone pad 32 . At this time, because the lower electrode 33 on the reinforcing frame 37 is still fixed, the upper electrode 31 will be forced to move downward and squeeze the silicone pad 32 . 31. The distance between the lower electrodes 33 changes by ΔH1. In some embodiments, the cantilever 31a of the upper electrode 31 is elastic and can withstand the micro-deformation of the upper electrode 31 caused when the pressure capacitor module 30 is squeezed. In some embodiments, when the upper electrode 31 is forced to move downward, the flexible printed circuit board 36 can also be elastically compressed to withstand the extrusion of the silicone pad 32 due to its elasticity.

According to the formula of capacitance, when the distance changes ΔH1, that is, the distance d between two parallel electrodes in the formula changes, which will cause a corresponding change in the capacitance C between the two electrodes.

In other words, the external force F causes the distance between the upper and lower electrodes to change ΔH1, which in turn produces a capacitance change ΔC. In some embodiments, a greater external force F will produce a greater distance change ΔH1, which will in turn produce a greater capacitance change ΔC.

In some embodiments, the upper electrode 31 and the lower electrode 33 may not have silicone pads 32 . There may be an air gap between the upper electrode 31 and the lower electrode 33 . In such an embodiment, the capacitance C is calculated based on the dielectric permittivity of air (approximately 1.00054).

In some embodiments, when the signal processor 70 receives a capacitance change ΔC from the pressure capacitor module 30 through the circuit board 10, a built-in algorithm of the signal processor 70 will generate a capacitance change ΔC corresponding to the capacitance change ΔC. The signal of magnitude is transmitted to the vibration motor 60 through the circuit board 10. After receiving the signal, the vibration motor 60 generates vibration with an amplitude corresponding to the magnitude of the signal.

In some embodiments, different capacitance changes ΔC will generate signals of different magnitudes or sizes, causing the vibration motor 60 to generate vibrations of different amplitudes. Therefore, the user's fingers will feel vibrations of different amplitudes, thereby achieving different functions. The effect of pressure touch feedback.

In some embodiments, when the external force F is pressed at different positions of the cover 20, the multiple pressure capacitor modules 30 near the pressed position will produce capacitance changes ΔC. The signal processor 70 can process multiple pressure capacitor modules 30 at the same time. The capacitance generated by each pressure-capacitance module 30 changes ΔC and sends a corresponding signal to cause the vibration motor 60 to vibrate to identify the pressed position point on the cover 20 .

Figure 15 is a schematic cross-sectional view of another touch device provided according to the present invention. Referring to FIG. 15 , the structure of the touch device 2 is basically similar to the structure of the touch device 1 of FIG. 2 , and the same or similar components are represented by the same or similar component symbols. The difference between the touch device 2 and the touch device 1 is that the pressure capacitive module of the touch device 1 is an independent electronic component, while the pressure capacitive module of the touch device 2 is integrated on the circuit board.

The touch device 2 includes a circuit board 110 for carrying a cover 120 and a plurality of pressure-capacitive modules 130 . In some embodiments, the cover 120 is adhered to the circuit board 110 through adhesive glue 115, and the plurality of pressure-containing modules 130 are respectively attached to the surface of the circuit board 110 on the side facing away from the cover 120. The pressure-containing molds The group 130 is electrically connected to the circuit board 110 . The circuit board 110 is used to sense touch signals, conduct or collect signals applied to the cover 120. Electrical circuits or electronic components (such as resistors or capacitors) can also be arranged on the circuit board 110. The circuit board 110 has an upper surface 110a and a lower surface 110b facing away from the upper surface 10a. In some embodiments, the circuit board 110 may be a flexible printed circuit board, a rigid printed circuit board, or other circuit boards.

The cover 120 is used to provide users with touch or press operations. In some embodiments, the cover 120 may be a glass material or a polyester material, such as a Mylar sheet that may contain polyethylene terephthalate.

In some embodiments, the number of pressure-containing modules 130 may be two, four, six, eight, or more, depending on the area of the cover plate 120 . Only two pressure-containing modules 130 are shown in FIG. 15 . In some other embodiments, the number of pressure capacity modules 130 may be an odd number. Each pressure capacitor module 130 includes an upper electrode 131 and a lower electrode 133 as pressure capacitor electrodes. It should be noted that in this embodiment, the upper electrode 131 is a pad or solder joint in the circuit board 110, and the lower electrode 133 It is a "ㄇ" shaped conductor.

The support block 140 is a carrier that provides physical support for the pressure capacity module 130 . In some embodiments, the support block 140 is made of metal or polymer, such as iron sheet or acrylic sheet. In some embodiments, the support block 140 supports the pressure-capacitance module 130 through a silicone pad 135 , and the silicone pad 135 is disposed between the support block 140 and the pressure-capacity module 130 . In some embodiments, the silicone pad 135 is made of an insulating material, such as an insulating material containing polysiloxane. In other embodiments, the support block 140 may be attached to the shell 150 by adhesive or glue.

In some embodiments, screws 148 (or screw holes) are attached to the support block 140, and the screws 148 (or screw holes) can be used to lock the support block 140 to the screw holes (or screws) on a shell 150. In some embodiments, shell 150 may be made of metal or polymer. In other embodiments, the support block 140 may be attached to the shell 150 by adhesive or glue.

The vibration motor 160 is disposed between the circuit board 110 and the shell 150 and is surrounded by a plurality of pressure-capacitive modules 130 . In some embodiments, the vibration motor 160 is adhered to the lower surface 110 b of the circuit board 110 through adhesive glue 145 . The vibration motor 160 is electrically connected to the circuit board 110 . The vibration motor 160 has a vibrator that generates reciprocating vibration, and the generated amplitude can be used to provide a feedback effect of signal vibration. In some embodiments, the vibration motor 160 may be a linear motor, an electromagnetic motor, or a piezoelectric ceramic motor.

The signal processor 170 is disposed on the lower surface 110b of the circuit board 110 and is located between the circuit board 110 and the casing 150 . The signal processor 170 is separated from the vibration motor 160 and surrounded by one or more pressure-containing modules 130 . In some embodiments, the signal processor 170 may be an integrated circuit that is electrically connected to the circuit board 110 and thus to the vibration motor 160 and to the upper electrode 131 and the lower electrode in the pressure capacitor module 130 133 electrical connection. The signal processor 170 generates signals of different magnitudes or sizes, and transmits the signals to the vibration motor 160 through the circuit board 110 to cause the vibration motor 160 to vibrate.

FIG. 16 is an exploded perspective view of the touch device 2 in FIG. 15 . Referring to FIG. 16 , four pressure-capacity module groups 130 and two support blocks 140 are shown in FIG. 16 , in which each two pressure-capacity module groups 130 are supported by the same support block 140 . The support block 140 supports the pressure volume module 130 through the silicone pad 135 . The shape and size of the support block 140 can be determined according to the overall machine structure or mechanical structure. The structure of the support block 140 shown in Figure 15 or Figure 12 is only schematic and not the only structure. In some embodiments, the upper electrode 131 and the lower electrode 133 in the pressure capacitor module 130 are electrically connected to the circuit board 110, so that the capacitance change measured by the pressure capacitor module 130 transmits electrical signals to the circuit through the circuit board 110. Other components on the board 110, such as the vibration motor 160 or the signal processor 170 (as shown in Figure 15).

FIG. 17 is a schematic cross-sectional view of the pressure capacity module 130 in FIG. 15 . Referring to FIG. 17 , in some embodiments, before forming the pressure capacitor module 130 , a region to be used as the upper electrode and a region to be attached or wired to the lower electrode are designed in advance on the circuit board 110 , and the two regions are mutually exclusive. staggered. In some embodiments, the "U"-shaped lower electrode 133 includes a horizontal part 133a and a vertical part 133b connected to the horizontal part 133a. When assembling the lower electrode 133 to the circuit board 110 to form the pressure capacitor module 130, in some embodiments, the vertical portion 133b can be adhered to the lower surface of the circuit board 110 through an adhesive layer 138 (such as conductive glue or conductive foam). 110b, as shown in Figure 16. In other embodiments, the circuit board 110 and the vertical part 133b may be joined by spot soldering paste or conductive silver paste on one side of the circuit board 110 or the vertical part 133b. In some embodiments, the connection between the circuit board 110 and the lower electrode 133 can be bonded using a large area of conductive glue, or a small area of conductive glue combined with non-conductive glue (such as primer) to increase the adhesion force. After the lower electrode 133 is attached to the circuit board 110, the vertical portion 133b of the lower electrode 133 and the upper electrode 131 in the circuit board 110 are offset from each other. In some embodiments, there is an air gap between upper electrode 131 and lower electrode 133 .

FIG. 18 is a schematic three-dimensional view of the pressure capacity module 130 in FIG. 17 . Referring to FIG. 18 , the cover plate 120 is disposed on the circuit board 110 , and the upper electrode 131 in the circuit board 110 and the lower electrode 133 attached to the circuit board 110 form a pressure capacitive module 130 . The pressure capacity module 130 is disposed on the side of the circuit board 110 facing away from the cover 120 . The silicone pad 135 is disposed between the support block 140 and the pressure capacity module 130 . A plurality of screws 148 (or screw holes) are attached to each support block 140, and the screws 148 (or screw holes) can be used to lock the support block 140 to a shell 150 (as shown in FIG. 11).

Referring to FIG. 15 , in some embodiments, the touch device 2 can press the pressure capacitor module 130 according to a principle similar to that of the touch device 1 in FIG. 10 . When the user's fingers or other objects press the cover 120 with an external force, a capacitance change will occur between the upper electrode 131 and the lower electrode 133 . The signal processor 170 generates a signal based on the capacitance change and transmits the signal to the vibration sensor. The motor 160 and the vibration motor 160 receive the signal and generate vibration corresponding to the amplitude of the capacitance change.

The invention provides a touch control device with low cost, high performance and simple structure. The touch device of the present invention adopts pressure capacitance detection. Compared with the existing technology, it does not require the use of strain gauges and has a relatively low cost. In addition, the touch device provided by the present invention has high sensitivity and a thin overall thickness, which can accurately detect touch pressure and achieve tactile feedback.

The foregoing description briefly presents the features of certain embodiments of the present invention, so that those with ordinary skill in the art to which the present invention belongs can more fully understand the various aspects of the present invention. It will be obvious to those with ordinary skill in the technical field to which the present invention belongs, that they can easily use the content of the present invention as a basis to design or modify other processes and structures to achieve the same goals and/or achieve the same goals as the embodiments described here. Same advantages. Those with ordinary knowledge in the technical field to which the present invention belongs should understand that these equivalent embodiments still belong to the spirit and scope of the present invention, and various changes, substitutions and modifications can be made without departing from the spirit and scope of the present invention. .

1,2,3:Touch device 10,110:Circuit board 10a, 110a: upper surface of circuit board 10b, 110b: Lower surface of circuit board 115,145,15,25,35,45: Adhesive 120,20:Cover 130,30: Pressure capacity module 131,31,311,312: Upper electrode 133,33: Lower electrode 133a,31h: Horizontal part 133b: vertical part 135,32: Silicone pad 138,38:Adhesive layer 140,40: support block 148,48:Screw 150:shell 160,60:Vibration motor 170,70:Signal processor 30a: Upper surface of pressure capacity module 30b: Lower surface of pressure capacity module 31a:Cantilever 31c: concave part 33b,33d: support column 33c: Torso 33p:Protrusion 36: Flexible printed circuit board 37: Reinforcement frame 4:Contact panel 5: Elastic bracket 50: Shell 6: Linear motor 7:External force sensor 8:Flexible pad F: external force R1,R3: Central area R2, R4: Surrounding area O1: Hollow area

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of explaining the embodiments of the present invention or the technical solutions in the prior art. For some of the embodiments described in the invention, a person with ordinary knowledge in the art can also obtain other drawings based on these drawings. Figure 1 is a schematic structural diagram of a touch device in the prior art; Figure 2 is a schematic cross-sectional view of a touch device provided according to the present invention; Figure 3 is an exploded perspective view of the touch device in Figure 2; Figure 4 is a schematic cross-sectional view of the pressure capacity module in Figure 2; Figure 5 is a three-dimensional schematic diagram of the pressure capacity module in Figure 4; Figures 6a, 6b, 7a, 7b, 8a, 8b, 9a, 9b, 10a, 10b, 11a, 11b, 12a, 12b, 13a and 13b are schematic diagrams of different appearances of the upper and lower electrodes in Figure 4 or 5 respectively; Figure 14 is a schematic diagram of the principle of using the touch device of Figure 2 to press the pressure-capacitive module; Figure 15 is a schematic cross-sectional view of another touch device provided according to the present invention; Figure 16 is an exploded perspective view of the touch device in Figure 15; Figure 17 is a schematic cross-sectional view of the pressure capacity module in Figure 15; and FIG. 18 is a schematic perspective view of the pressure capacity module in FIG. 17 .

10:Circuit board

10a: Upper surface of circuit board

10b: Lower surface of circuit board

15,25,35,45: Adhesive

20:Cover

30: Pressure capacity module

30a: Upper surface of pressure capacity module

30b: Lower surface of pressure capacity module

40:Support block

48:Screw

50: Shell

60:Vibration motor

70:Signal processor

Claims (12)

A touch device, including: A circuit board, the upper surface of the circuit board includes a touch detection electrode for detecting the touch position of a finger; A pressure-capacitive module is disposed below the circuit board and is electrically connected to a signal processor for deforming under the pressure exerted by the finger when pressing the touch device to change the pressing area of the finger. a pressure sensing capacitor; A vibration motor is installed and fixed on the lower surface of the circuit board and is electrically connected to the signal processor for providing vibration feedback in response to the pressure exerted by the finger; and The signal processor is installed and fixed on the lower surface of the circuit board for receiving a touch sensing signal and a pressure sensing signal from the touch detection electrode and the pressure capacitance module and determining the touch of the finger on the touch device. position and the amount of pressure exerted by that finger. The touch device according to claim 1, wherein the number of the pressure capacitor modules is multiple, the pressure capacitor modules include an upper electrode and a lower electrode, and there is an air gap between the upper electrode and the lower electrode, The upper electrode is located in the circuit board, and the lower electrode includes a plurality of elastic cantilevers. The touch device according to claim 1, wherein the pressure capacitive module includes an upper electrode and a lower electrode separated by a silicone pad, the upper electrode is located in the circuit board, and the lower electrode includes a plurality of elastic of cantilever. The touch device of claim 2 or 3, wherein the distance between the upper electrode and the lower electrode is between about 0.05 mm and about 0.3 mm. The touch device according to claim 2 or 3, wherein the pressure capacitive module further includes: A reinforcing frame supports the lower electrode. The touch device according to claim 2 or 5, wherein the upper electrode or the lower electrode includes a central area and a surrounding area, and a portion is hollowed out between the central area and the surrounding area. are connected via the cantilever. The touch device of claim 6, wherein the thickness of the cantilever and the thickness of the central region are thinner than the thickness of the surrounding region. A touch device, including: A circuit board having an upper surface and a lower surface facing away from the upper surface; A cover plate adhered to the upper surface; An upper electrode located in the circuit board; The lower electrode is arranged corresponding to the upper electrode and is partially connected to the circuit board; a support block to support the lower electrode; A vibration motor is provided on the lower surface; and A signal processor is disposed on the lower surface and is electrically connected to the upper electrode and the lower electrode through the circuit board. The touch device of claim 8, wherein the upper electrode is a pad or a solder joint in the circuit board. The touch device of claim 8, wherein the lower electrode has a horizontal part and a vertical part connected to the horizontal part, and the vertical part is joined to the circuit board. The touch device of claim 8, wherein the upper electrode and the electrode form a pressure-capacitive module, and the support block supports the pressure-capacitive module through a silicone pad. The touch device according to claim 8, wherein the touch device further includes a shell to support the support block; Screws or screw holes are attached to the support block for locking the support block to the screw holes or screws on the shell.