CN217443851U

CN217443851U - Touch control device

Info

Publication number: CN217443851U
Application number: CN202221188414.8U
Authority: CN
Inventors: 张胜斌; 张�荣; 郭益平
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-09-16
Anticipated expiration: 2032-05-17
Also published as: TWI847520B; TW202347105A; WO2023221515A1

Abstract

The application discloses a touch device. The touch device comprises a circuit board, a touch control unit and a control unit, wherein the circuit board is provided with an upper surface and a lower surface back to the upper surface; a cover plate adhered to the upper surface; the pressure-containing module is arranged on the lower surface; a vibration motor disposed on the lower surface; and the signal processor is electrically connected with the vibration motor and the pressure-capacitance module.

Description

Touch control device

Technical Field

The utility model relates to a technical field of touch device especially relates to a pressure detection's touch device.

Background

Current touch devices (e.g., touch phones, touch keyboards) typically utilize pressure sensors to detect pressure from a human finger touch. The pressure detection structure of the touch equipment is arranged on a middle frame of the touch equipment and comprises a cover plate, a display device and a pressure sensor. The old touch pad can not realize pressure induction and tactile feedback, has poor experience for users, and can not realize the development of some application terminals.

Therefore, it is necessary to develop a scheme capable of detecting force values and tactile feedback.

SUMMERY OF THE UTILITY MODEL

One objective of the present disclosure is to disclose a touch device, which generates capacitance change through a capacitance-voltage module to solve the technical problems of the background art.

An embodiment of the application discloses a touch device. The touch device comprises a circuit board, a touch detection unit and a touch control unit, wherein the upper surface of the circuit board comprises a touch detection electrode for detecting the touch position of a finger; the pressure-capacitance module is arranged below the circuit board, is electrically connected with the signal processor and is used for deforming under the action of pressure applied when the finger presses the touch device so as to change the pressure sensing capacitance of a finger pressing area; the vibration motor is installed and fixed on the lower surface of the circuit board, electrically connected with the signal processor and used for responding to the pressure applied by the fingers to perform vibration feedback; and the signal processor is fixedly arranged on the lower surface of the circuit board and is used for receiving the touch sensing signals and the pressure sensing signals from the touch detection electrodes and the pressure-capacitance module and determining the touch position of the finger on the touch device and the pressure applied by the finger.

In one possible implementation manner, the number of the pressure-capacitance module is multiple, the pressure-capacitance module comprises an upper electrode and a lower electrode, an air gap is formed between the upper electrode and the lower electrode, and the upper electrode or the lower electrode comprises multiple elastic cantilevers.

In one possible implementation, the pressure-capacitance module comprises an upper electrode and a lower electrode separated by a silicone rubber pad.

In one possible implementation, the distance between the upper electrode and the lower electrode is between about 0.05 mm and about 0.3 mm.

In one possible implementation manner, the pressure-capacitance module further comprises a reinforcing frame for supporting the lower electrode; and the flexible printed circuit board is arranged on the reinforcing frame and supports the upper electrode.

In one possible implementation, the upper electrode is attached to the lower surface of the circuit board by an adhesive.

In one possible implementation, the upper electrode or the lower electrode includes a plurality of cantilevers having elasticity.

In a possible implementation manner, the upper electrode or the lower electrode includes a central region and a peripheral region, a portion of the central region and a portion of the peripheral region are hollow, and the central region and the peripheral region are connected through the cantilever.

In one possible implementation, the thickness of the cantilever and the thickness of the central region are thinner than the thickness of the peripheral region.

Another embodiment of the present application discloses a touch device. The touch device comprises a circuit board, a touch control unit and a control unit, wherein the circuit board is provided with an upper surface and a lower surface back to the upper surface; a cover plate adhered to the upper surface; an upper electrode in the circuit board; a lower electrode disposed corresponding to the upper electrode and partially joined to the circuit board; a support block supporting the lower electrode; a vibration motor disposed on the lower surface; and the signal processor is arranged on the lower surface and is electrically connected with the upper electrode and the lower electrode through the circuit board.

In one possible implementation, the upper electrode is a pad or a solder joint in the circuit board.

In one possible implementation, the lower electrode has a horizontal portion and a vertical portion connected to the horizontal portion, and the vertical portion is joined to the circuit board.

In a possible implementation manner, the upper electrode and the lower electrode form a pressure-capacitance module, and the support block supports the pressure-capacitance module through a silica gel pad.

In a possible implementation manner, the touch device further includes a housing supporting the supporting block.

In one possible implementation, the support block has screws or screw holes attached to it for locking the support block to the screw holes or screws on the shell.

In one possible implementation, the vibration motor or the signal processor is disposed between the circuit board and the case.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.

FIG. 1 is a schematic diagram of a touch device in the prior art;

fig. 2 is a schematic cross-sectional view of a touch device according to the present invention;

FIG. 3 is an exploded perspective view of the touch device shown in FIG. 2;

FIG. 4 is a schematic cross-sectional view of the pressure-containing module shown in FIG. 2;

FIG. 5 is a perspective view of the pressure-containing module shown in FIG. 4;

FIGS. 6a, 6b, 7a, 7b, 8a, 8b, 9a, 9b, 10a, 10b, 11a, 11b, 12a, 12b, 13a and 13b are schematic diagrams of different appearances of the upper and lower electrodes in FIG. 4 or FIG. 5, respectively;

FIG. 14 is a schematic diagram illustrating a principle of pressing the pressure-capacitance module by using the touch device of FIG. 2;

fig. 15 is a schematic cross-sectional view of another touch device according to the present invention;

FIG. 16 is an exploded perspective view of the touch device shown in FIG. 15;

FIG. 17 is a schematic cross-sectional view of the pressure-containing module shown in FIG. 15;

fig. 18 is a perspective view of the pressure-containing module shown in fig. 17.

Detailed Description

The following disclosure provides various embodiments or illustrations that can be used to implement various features of the disclosure. The embodiments of the components and arrangements described below serve to simplify the present disclosure. It is to be understood that such descriptions are merely illustrative and are not intended to limit the present disclosure. For example, in the description that follows, forming a first feature on or over a second feature may include certain embodiments in which the first and second features are in direct contact with each other; and may also include embodiments in which additional elements are formed between the first and second features described above, such that the first and second features may not be in direct contact. Moreover, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Although numerical ranges and parameters setting forth the broad scope of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain standard deviations found in their respective testing measurements. As used herein, "about" generally refers to actual values within plus or minus 10%, 5%, 1%, or 0.5% of a particular value or range. Alternatively, the term "about" indicates that the actual value falls within the acceptable standard error of the mean, subject to consideration by those of ordinary skill in the art to which this application pertains. It is understood that all ranges, amounts, values and percentages used herein (e.g., to describe amounts of materials, length of time, temperature, operating conditions, quantitative ratios, and the like) are modified by the term "about" in addition to the experimental examples or unless otherwise expressly stated. Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained. At the very least, these numerical parameters are to be understood as meaning the number of significant digits recited and the number resulting from applying ordinary carry notation. Herein, numerical ranges are expressed from one end to the other or between the two ends; unless otherwise indicated, all numerical ranges set forth herein are inclusive of the endpoints.

Generally, the main pressure detection in the market is the strain gauge solution. Fig. 1 is a schematic structural diagram of a touch device in the prior art. Referring to fig. 1, the touch device 3 includes a touch panel 4, an elastic support 5, a linear motor 6, four external force sensors 7, and four flexible pads 8. Four external force sensors 7 are arranged on the elastic support 5, and flexible pads 8 are positioned on two opposite sides of the elastic support 5. This type of external force sensor 7 uses a strain gauge solution.

The strain gauge scheme adopts a strain gauge, and common strain gauges are all resistance type strain gauges. The resistance type strain gauge is a sensor (namely an external force sensor 7) for converting strain into resistance change, and a resistance sensitive material is attached to the elastic support 5 for strain detection. The working principle of the resistance strain gauge is based on the strain effect, that is, the resistance value of the material is changed when the material is deformed by stress.

However, the resistive strain gauge has a high cost, a low yield, and a complex overall structure, which may even increase the volume or weight of the product, and affect the popularization of pressure sensing and touch feedback. Therefore, in order to solve the above problems, the present application proposes a capacitance detection scheme, which detects finger pressing by using a principle that the two electrodes are actively sensitive to displacement and surface; the force value detection is realized, the capacitance change is fed back to the signal processor through the force value detection, and the signal processor receives the capacitance change information and sends a signal to the vibration motor, so that the vibration motor generates vibration, the application of touch feedback is realized, and different pressure touch feedback effects are realized by combining an application software scheme according to the pressure-capacitance signal difference.

Fig. 2 is a schematic cross-sectional view of a touch device according to the present invention. Referring to fig. 2, the touch device 1 includes a circuit board 10 for carrying a cover plate 20 and a plurality of pressure-containing modules 30. In some embodiments, the cover plate 20 is adhered to the circuit board 10 by the adhesive 15, and the plurality of pressure-containing modules 30 are adhered to the circuit board 10 by the adhesive 25.

The circuit board 10 is used for sensing a touch signal applied to the cover plate 20, conducting or collecting a signal, the upper surface of the circuit board 10 includes a touch detection electrode for detecting a touch position of a finger, and an electrical circuit or electronic components (such as a resistor or a capacitor) may be disposed on the circuit board 10. The circuit board 10 has an upper surface 10a and a lower surface 10b opposite to the upper surface 10 a. In some embodiments, the circuit board 10 may be a flexible printed circuit board (FPC), a rigid Printed Circuit Board (PCB), or other circuit boards.

The cover plate 20 is used for providing operations such as touching or pressing by a user. In some embodiments, the cover sheet 20 may be a glass material or a polyester material, such as a Mylar (r) sheet that may contain polyethylene terephthalate (PET).

Each of the pressure-containing modules 30 has an upper surface 30a and a lower surface 30b opposite to the upper surface 30 a. In some embodiments, the number of the pressure-containing modules 30 may be two, four, six, eight or more, and only two pressure-containing modules 30 are shown in fig. 2 depending on the area size of the cover plate 20. The pressure-containing modules 30 are symmetrically arranged on the lower surface 10b of the circuit board 10. In other embodiments, the number of the pressure-containing modules 30 may be odd. In some embodiments, the pressure-containing module 30 is adhered to the support block 40 by an adhesive 35.

The support block 40 is a carrier for physically supporting the pressure-containing module 30. In some embodiments, the support block 40 is made of a polymer, such as acrylic sheet. In some embodiments, screws 48 (or screw holes) are attached to the support block 40, and the screws 48 (or screw holes) may be used to lock the support block 40 to the screw holes (or screws) on the housing 50. In some embodiments, the housing 50 may be made of metal or polymer. In other embodiments, the support block 40 may be attached to the housing 50 by glue or glue.

The vibration motor 60 is used for vibration feedback in response to the pressure applied by the finger, and the vibration motor 60 is disposed between the circuit board 10 and the housing 50 and surrounded by the plurality of pressure-containing modules 30. In some embodiments, the vibration motor 60 is attached to the lower surface of the circuit board 10 by an adhesive 45. The vibration motor 60 is electrically connected to the circuit board 10. The vibration motor 60 has a vibrator therein, which generates reciprocating vibrations, which can be used to provide feedback of the signal vibrations by the amplitude of the generated vibrations. In some embodiments, the vibration motor 60 may be a linear motor, an electromagnetic motor, or a piezo ceramic motor.

In some embodiments, the adhesive 15, 25, 35, and 45 may be Optically Clear Adhesive (OCA), double-sided adhesive, or thermosetting adhesive. Specifically, the adhesive 15 is used to attach and fix the cover plate 20 to the upper surface 10a of the circuit board 10, the adhesive 25 is used to attach and fix the upper surface 30a of the pressure-containing module 30 to the lower surface 10b of the circuit board 10, the adhesive 35 is used to attach and fix the lower surface 30b of the pressure-containing module 30 to the supporting block 40, and the adhesive 45 is used to attach and fix the vibration motor 60 to the lower surface 10b of the circuit board 10.

The signal processor 70 is disposed on the lower surface 10b of the circuit board 10 between the circuit board 10 and the housing 50. The signal processor 70 is spaced apart from the vibration motor 60 and is surrounded by a plurality of pressure-containing modules 30. In some embodiments, the signal processor 70 may be an Integrated Circuit (IC), which is electrically connected to the circuit board 10, and thus electrically connected to the vibration motor 60, and electrically connected to the voltage-capacitance electrodes in the voltage-capacitance module 30. The signal processor 70 is configured to receive the touch sensing signal and the pressure sensing signal from the touch detection electrode and the pressure volume module 30 on the upper surface of the circuit board 10 and determine the touch position of the finger on the touch device and the pressure applied by the finger. The signal processor 70 generates signals of different magnitudes or magnitudes according to the magnitude of the pressure, and transmits the signals to the vibration motor 60 through the circuit board 10, so that the vibration motor 60 generates vibration.

Fig. 3 is an exploded perspective view of the touch device 1 in fig. 2. Referring to fig. 3, fig. 3 shows four pressure-containing modules 30 and two supporting blocks 40, wherein each two pressure-containing modules 30 are supported by the same supporting block 40. A plurality of screws 48 (or screw holes) are attached to each support block 40, and the bottom of the compression-housing module 30 can be locked to the support block 40 by the screws 48. The bottom of the pressure-containing module 30 is reinforced by being fixed with the supporting block 40. The shape and size of the support block 40 may be determined according to the overall structure or mechanical structure, and the structure of the support block 40 shown in fig. 2 or 3 is only an exemplary structure and is not an exclusive structure.

Fig. 4 is a schematic cross-sectional view of the pressure-containing module 30 in fig. 2. Referring to fig. 4, in some embodiments, the pressure-containing module 30 includes an upper electrode 31, a lower electrode 33 and a silicone pad 32. The upper electrode 31 and the lower electrode 33 serve as pressure-capacitance electrodes, and the silicone pad 32 separates the upper electrode 31 and the lower electrode 33.

In some embodiments, the upper electrode 31 and the lower electrode 33 are made of a conductive material, such as copper, silver, gold, aluminum, iron, cobalt, nickel, titanium, tungsten, or alloys thereof. In some embodiments, the silicone pad 32 is made of an insulator material, such as a silicone-containing insulator material. In some embodiments, the distance H1 between the upper electrode 31 and the lower electrode 33 is in the range of about 0.05 millimeters (mm) to about 0.3 mm, which is sufficient to produce a sufficiently large change in capacitance when the distance between the upper electrode 31 and the lower electrode 33 is changed. In some cases, when the distance between the upper electrode 31 and the lower electrode 33 is too small, a distance change of a sufficient magnitude between the two electrodes cannot be generated, and the resulting change in capacitance will be insignificant. In some cases, when the distance between the upper electrode 31 and the lower electrode 33 is too large, the pressure-volume module 30 is too thick, and the volume of the touch device 1 is increased. In the present embodiment, the distance H1 between the upper and

lower electrodes

31, 33 is approximately equal to the thickness of the silicone pad 32. In some embodiments, the silicone pad 32 may be replaced with air.

In some embodiments, the lower electrode 33 and a Flexible Printed Circuit (FPC)36 are respectively disposed on the reinforcing frame 37, and the lower electrode 33 does not contact the FPC 36. The FPC 36 and the reinforcing frame 37 do not belong to the pressure-containing module but belong to separate components, respectively. The reinforcing frame 37 may be made of an insulator material as a carrier for providing physical support for the lower electrode 33 and the FPC 36. The lower electrode 33 is disposed at the center of the reinforcing frame 37, and the FPC 36 is disposed at the periphery of the reinforcing frame 37 and partially covers the reinforcing frame 37. In some embodiments, the cantilever 31a of the upper electrode 31 is attached to the FPC 36 around the reinforcing frame 37 by an adhesive layer 38. In such an embodiment, the upper electrode 31 may be supported by the reinforcing frame 37 through the FPC 36 and the adhesive layer 38, and at the same time, the upper electrode 31 is also supported by the reinforcing frame 37 through the silicone pad 32 and the lower electrode 33. The FPC 36 transmits electrical signals between the signal processor 70 and the upper electrode 31 and the lower electrode 33 of the pressure-capacitance module 30, so that the pressure detection of the pressure-capacitance module 30 is facilitated.

In the schematic cross-sectional view of the pressure-capacitance module 30 in fig. 4, the upper electrode 31 and the cantilever 31a thereof are n-shaped, and a silicon pad 32 is sandwiched between the space in the center of the upper electrode 31 and the lower electrode 33. In some embodiments, the silicone pad 32 may not be filled in the entire central space of the upper electrode 31, but may be spaced apart from the FPC 36 and the adhesive layer 38. In some embodiments, the upper surface 30a of the pressure-containing module 30 refers to a surface of the upper electrode 31 facing away from the silicone pad 32. In some embodiments, the lower surface 30b of the pressure-containing module 30 is the surface of the reinforcing frame 37 opposite to the silicone pad 32.

Fig. 5 is a perspective view of the pressure-containing module 30 in fig. 4. Referring to fig. 5, the cover plate 20 is disposed on the circuit board 10, and the pressure-containing module 30 is disposed on a side of the circuit board 10 opposite to the cover plate 20. The circuit board 10 is located between the cover plate 20 and the pressure-containing module 30. In some embodiments, the pressure-containing module 30 is completely covered by the circuit board 10 and is adhered to the circuit board 10 by the adhesive 25 (as shown in fig. 2). In some embodiments, the upper and

lower electrodes

31, 33 of the pressure-containing module 30 are electrically connected to the circuit board 10, and the appearance of the upper and

lower electrodes

31, 33 is as shown in fig. 6a, 6b, 7a, 7b, 8a, 8b, 9a and 9 b. The upper electrode 31 illustrated in FIG. 5 is the upper electrode 31 illustrated in FIGS. 6a and 6b, and a portion of the upper electrode 31 can be seen in FIG. 5

A word-shaped cantilever 31a extends from the upper electrode. In some embodiments, the upper electrode 31 has a disk-like structure, and the lower electrode 33 has a planar structure. In such an embodiment, the silicone pad 32 may be disposed in the space between the upper electrode 31 and the lower electrode 33. In order to support the silicone pad 32, the area of the lower electrode 33 is at least greater than or equal to the area of the silicone pad 32. The upper and

lower electrodes

31, 33 are electrically connected to the circuit board 10, so that the capacitance change measured by the voltage-capacitance module 30 can be transmitted to other components on the circuit board 10, such as the vibration motor 60 or the signal processor 70 (shown in fig. 2), through the circuit board 10.

Fig. 6a, 6b, 7a, 7b, 8a, 8b, 9a and 9b are schematic diagrams illustrating different appearances of the upper and

lower electrodes

31 and 33 in fig. 4 or fig. 5, respectively. The upper and

lower electrodes

31 and 33 with different appearances can be formed by processes such as die stamping, laser cutting or metal etching according to the requirements of different images.

Referring to fig. 6a and 6b, in some embodiments, the upper and

lower electrodes

31, 33 are circular electrodes comprising a central region R1 and a peripheral region R2, the peripheral region R2 surrounds the central region R1, a hollow region O1 is between the central region R1 and the peripheral region R2, and the central region R1 and the peripheral region R2 are formed by a plurality of regions R1

The word-shaped cantilever 31a is connected. In the present embodiment, both the central region R1 and the peripheral region R2 are circular in shape from the top view. In some embodiments, the cantilever 31a and the central region R1 are thinner portions of the electrode. The thickness of the central region R1 is thinner than that of the peripheral region R2, so that the electrode assumes a structure having a concave portion in the middle. In some embodiments, the central region R1 is the primary force-bearing region of the electrode when an external force F presses against the cover plate 20. The cantilever 31a has elasticity or flexibility, so that when the cover plate 20 is pressed by an external force F of the same magnitude, the displacement change amount of the upper and

lower electrodes

31 and 33 is larger, and a more significant capacitance change Δ C is generated. In addition, the cantilever 31a itself has elasticity and can be partially bent when subjected to an external force F, allowing more deformation under force, thereby increasing the sensing sensitivity. In some embodiments, the peripheral region R2 may be used for adhesion to the circuit board 10.

Referring to fig. 7a and 7b, the electrode shown in fig. 7a, 7b is similar to the electrode shown in fig. 6a, 6 b. The difference is that, in the present embodiment, the central region R1 is circular and the peripheral region R2 is square in top view.

Referring to fig. 8a and 8b, the electrode shown in fig. 8a, 8b is similar to the electrode shown in fig. 7a, 7 b. The difference is that in the present embodiment, the central region R1 can be rotated from R1 of fig. 7 from the top view, and further,

the letter-shaped cantilevers 31a may be distributed with lengths of different lengths.

Referring to fig. 9a and 9b, the upper electrode 31 and the lower electrode 33 shown in fig. 9a and 9b are in a parallel structure. The upper electrode 31 and the lower electrode 33 are separated from each other by a support pillar 33 b.

Referring to fig. 10a and 10b, fig. 10a is a top view of the lower electrode 33 according to an embodiment, the lower electrode 33 has a "king" appearance. Fig. 10b is an elevation view of the upper electrode 31 according to the present embodiment, in which the upper electrode 31 has a "king" appearance corresponding to the lower electrode 33. In some embodiments, the "king" shape is a concave portion of the upper electrode 31 or the lower electrode 33.

Referring to fig. 11a and 11b, fig. 11a is a side view of a lower electrode 33 according to an embodiment, the lower electrode 33 may have a horizontal portion 33h and a protruding portion 33p connected to the horizontal portion 33h, such that the lower electrode 33 has a "T" shape. Fig. 11b shows a top view of the upper electrode 31 according to the present embodiment, and in some embodiments, the upper electrode 31 has a horizontal portion 31h and a concave portion 31c in the horizontal portion 31h corresponding to the lower electrode 33. In some embodiments, the protrusion 33p of the lower electrode 33 may be combined with the recess 31c of the upper electrode 31.

Referring to fig. 12a and 12b, in some embodiments, the upper and

lower electrodes

31, 33 are disk-shaped electrodes comprising a central region R3 and a peripheral region R4, the peripheral region R4 surrounding the central region R3 and connected to the central region R3. In some embodiments, the central region R3 presents a disk-like appearance that is concave on one side and convex on the other side relative to the peripheral region R4.

Referring to fig. 13a and 13b, in some embodiments, the lower electrode 33 is an "S" shaped electrode, the two large upper electrodes 311 may be linear and positioned on the two stems 33c of the "S" shape of the lower electrode 33, and the plurality of small upper electrodes 312 may be positioned between the two stems 33 c. The plurality of

upper electrodes

311, 312 may be used to measure a plurality of capacitance magnitudes and obtain an average thereof. In some embodiments, the distance between the upper electrode 312 and the lower electrode 33 is the same as the distance between the upper electrode 311 and the lower electrode 33. In other embodiments, the distance between the upper electrode 312 and the lower electrode 33 may be changed, for example, a support pillar 33d may be disposed between the lower electrode 33 and the upper electrode 312 to simultaneously obtain the capacitance magnitude between parallel electrodes of different distances.

Fig. 14 is a schematic diagram illustrating a principle of pressing the pressure-containing module 30 by using the touch device 1 of fig. 2. According to the formula for capacitance:

wherein C is the capacitance, epsilon is the dielectric permittivity, A is the electrode area, and d is the distance between two parallel electrodes, it can be known that when the electrode area A is fixed, the capacitance C is in inverse proportion to the distance d between the two parallel electrodes.

Referring to fig. 14, in some embodiments, when a user's finger or other object presses on the cover plate 20, the cover plate 20 is pressed by an external force F, and under the external force F, the cover plate 20, the circuit board 10, and the adhesive 15 and 25 in the touch device 1 are forced to move downward and press the container pressing module 30.

Referring to fig. 4 again, when the pressure-capacitance module 30 is pressed, the upper electrode 31 is forced to move downward to press the silicone pad 32, and at this time, since the lower electrode 33 on the reinforcing frame 37 is still fixed, the distance between the upper and

lower electrodes

31, 33 changes by Δ H1. In some embodiments, the cantilever 31a of the upper electrode 31 is elastic and can withstand the micro-deformation of the upper electrode 31 caused by the compression of the pressure-capacitance module 30. In some embodiments, when the upper electrode 31 is forced to move downward, the FPC 36, due to its elasticity, may also be elastically compressed to bear the compression of the silicone pad 32.

According to the capacitance formula, when there is a distance change Δ H1, that is, the distance d between two parallel electrodes in the formula changes, the capacitance C between the two electrodes changes accordingly.

That is, the distance between the upper and lower electrodes changes Δ H1 by the external force F, and further, a capacitance change Δ C occurs. In some embodiments, a greater external force F will produce a greater distance change Δ H1, and thus a greater capacitance change Δ C.

In some embodiments, the upper electrode 31 and the lower electrode 33 may not have the silicone pad 32. An air gap may be between the upper electrode 31 and the lower electrode 33. In such an embodiment, the capacitance magnitude C is calculated in the dielectric permittivity of air (about 1.00054).

In some embodiments, when the signal processor 70 receives a capacitance change Δ C from the capacitance-compression module 30 through the circuit board 10, a signal corresponding to the magnitude of the capacitance change Δ C is generated by an algorithm built in the signal processor 70 and transmitted to the vibration motor 60 through the circuit board 10, and the vibration motor 60 generates vibration with an amplitude corresponding to the magnitude of the signal after receiving the signal.

In some embodiments, the different capacitance variations Δ C will generate signals with different magnitudes or magnitudes, so that the vibration motor 60 generates vibrations with different amplitudes, and the user's finger will thus feel the vibration with different amplitudes, thereby achieving different pressure touch feedback effects.

In some embodiments, when the external force F presses different positions of the cover plate 20, the capacitance change Δ C is generated in the plurality of capacitive modules 30 near the pressed position, and the signal processor 70 may simultaneously process the capacitance change Δ C generated in the plurality of capacitive modules 30 and send a corresponding signal to vibrate the vibration motor 60 to identify the pressed position on the cover plate.

Fig. 15 is a schematic cross-sectional view of another touch device according to the present invention. Referring to fig. 15, the structure of the touch device 2 is substantially similar to that of the touch device 1 of fig. 2, and the same or similar elements are denoted by the same or similar reference numerals. The touch device 2 is different from the touch device 1 in that the pressure-volume module of the touch device 1 is an independent electronic component, and the pressure-volume module of the touch device 2 is integrated on a circuit board.

The touch device 2 includes a circuit board 110 for carrying a cover plate 120 and a plurality of pressure-containing modules 130. In some embodiments, the cover plate 120 is adhered to the circuit board 110 by the adhesive 115, and the plurality of pressure-containing modules 130 are respectively attached to the surface of the circuit board 110 opposite to the cover plate 120, and the pressure-containing modules 130 are electrically connected to the circuit board 110. The circuit board 110 is used for sensing a touch signal applied to the cover plate 120, conducting or collecting a signal, and an electrical circuit or electronic components (such as a resistor or a capacitor) may be disposed on the circuit board 110. The circuit board 110 has an upper surface 110a and a lower surface 110b opposite to the upper surface 10 a. In some embodiments, the circuit board 110 may be a flexible printed circuit board, a rigid printed circuit board, or other circuit boards.

The cover 120 is used for providing a user touch or press operation. In some embodiments, the cover plate 120 may be a glass material or a polyester material, such as a mylar sheet that may include polyethylene terephthalate.

In some embodiments, the number of the pressure-containing modules 130 may be two, four, six, eight or more, and only two pressure-containing modules 130 are shown in fig. 15 depending on the area of the cover plate 120. In other embodiments, the number of the pressure-containing modules 130 may be an odd number. Each of the capacitive modules 130 includes an upper electrode 131 and a lower electrode 133 as capacitive electrodes, and it should be noted that in the present embodiment, the upper electrode 131 is a pad or solder joint in the circuit board 110, and the lower electrode 133 is a n-shaped conductor.

The supporting block 140 is a carrier for physically supporting the pressure-containing module 130. In some embodiments, support block 140 is made of metal or polymer, such as iron or acrylic. In some embodiments, the supporting block 140 supports the pressure-containing module 130 through a silicone pad 135, and the silicone pad 135 is disposed between the supporting block 140 and the pressure-containing module 130. In some embodiments, the silicone pad 135 is made of an insulator material, such as a silicone-containing insulator material. In other embodiments, the support block 140 may be attached to the housing 150 by glue or glue.

In some embodiments, support block 140 has screws 148 (or threaded holes) attached thereto, and screws 148 (or threaded holes) may be used to lock support block 140 to threaded holes (or screws) on a housing 150. In some embodiments, the shell 150 may be made of metal or polymer. In other embodiments, the support block 140 may be attached to the housing 150 by glue or glue.

The vibration motor 160 is disposed between the circuit board 110 and the case 150, and is surrounded by the plurality of pressure-containing modules 130. In some embodiments, the vibration motor 160 is attached to the lower surface 110b of the circuit board 110 by the adhesive 145. The vibration motor 160 is electrically connected to the circuit board 110. The vibration motor 160 has a vibrator therein, which generates reciprocating vibration, which can be used to provide feedback of signal vibration by the generated amplitude. In some embodiments, the vibration motor 160 may be a linear motor, an electromagnetic motor, or a piezo ceramic motor.

The signal processor 170 is disposed on the lower surface 110b of the circuit board 110 between the circuit board 110 and the case 150. The signal processor 170 is spaced apart from the vibration motor 160 and is surrounded by one or more pressure-containing modules 130. In some embodiments, the signal processor 170 may be an integrated circuit, which is electrically connected to the circuit board 110, and thus electrically connected to the vibration motor 160, and electrically connected to the upper electrode 131 and the lower electrode 133 in the voltage-capacitance module 130. The signal processor 170 generates signals of different magnitudes or magnitudes, and transmits the signals to the vibration motor 160 through the circuit board 110, so that the vibration motor 160 generates vibrations.

Fig. 16 is an exploded perspective view of the touch device 2 in fig. 15. Referring to fig. 16, fig. 16 shows four pressure-containing modules 130 and two supporting blocks 140, wherein each two pressure-containing modules 130 are supported by the same supporting block 140. The supporting block 140 supports the pressure-containing module 130 through the silicone pad 135. The shape and size of the supporting block 140 may be determined according to the overall structure or mechanical structure, and the structure of the supporting block 140 shown in fig. 15 or 12 is only an exemplary structure and is not an exclusive structure. In some embodiments, the upper and

lower electrodes

131, 133 of the capacitive module 130 are electrically connected to the circuit board 110, so that the capacitance change measured by the capacitive module 130 can be transmitted to other components on the circuit board 110, such as the vibration motor 160 or the signal processor 170 (as shown in fig. 15), through the circuit board 110.

Fig. 17 is a schematic cross-sectional view of the pressure-containing module 130 in fig. 15. Referring to fig. 17, in some embodiments, before forming the pressure-capacitance module 130, a region to be an upper electrode and a region to be attached or wired to a lower electrode are separately designed in advance on the circuit board 110, and the two regions are staggered from each other. In some embodiments, the "n" -shaped bottom electrode 133 includes a horizontal portion 133a and a vertical portion 133b connected to the horizontal portion 133 a. In assembling the bottom electrode 133 to the circuit board 110 to form the pressure-containing module 130, in some embodiments, the vertical portion 133b may be adhered to the bottom surface 110b of the circuit board 110 by an adhesive layer 138 (e.g., a conductive adhesive or a conductive foam), as shown in fig. 16. In other embodiments, the circuit board 110 and the vertical portion 133b may be joined by spot-welding solder paste or conductive silver paste on one side of the circuit board 110 or the vertical portion 133 b. In some embodiments, the connection between the circuit board 110 and the lower electrode 133 may be formed by a large-area conductive adhesive or a small-area conductive adhesive (e.g., a primer) to bond a non-conductive adhesive, so as to increase the adhesion force. When the lower electrode 133 is attached to the circuit board 110, the vertical portion 133b of the lower electrode 133 and the upper electrode 131 in the circuit board 110 are staggered from each other. In some embodiments, there is an air gap between the upper electrode 131 and the lower electrode 133.

Fig. 18 is a perspective view of the pressure-containing module 130 in fig. 17. Referring to fig. 18, the cap plate 120 is disposed on the circuit board 110, and the upper electrode 131 in the circuit board 110 and the lower electrode 133 attached to the circuit board 110 form a voltage capacitance module 130. The pressure-containing module 130 is disposed on a side of the circuit board 110 opposite to the cover plate 120. The silicone pad 135 is disposed between the supporting block 140 and the pressure-containing module 130. A plurality of screws 148 (or threaded holes) are attached to each support block 140, and the screws 148 (or threaded holes) may be used to latch the support block 140 to a housing 150 (shown in fig. 11).

Referring to fig. 15, in some embodiments, the touch device 2 may implement the principle of pressing the capacitance-pressing module 130 according to a method similar to that of the touch device 1 in fig. 10. When a user presses the cover plate 120 with an external force such as a finger or other object, a capacitance change occurs between the upper electrode 131 and the lower electrode 133, the signal processor 170 generates a signal according to the capacitance change and transmits the signal to the vibration motor 160, and the vibration motor 160 receives the signal and generates a vibration having an amplitude corresponding to the capacitance change.

The utility model provides a low-cost, high performance and simple structure's touch device. The utility model discloses a touch device adopts the pressure to hold and detects, compares in prior art, need not use the strainometer, and relative cost is lower. Furthermore, the utility model provides a touch device's sensitivity is high and the whole total thickness of touch device is thinner, can accurate realization touch-control pressure detection to realize tactile feedback.

The foregoing description has set forth briefly the features of certain embodiments of the present application so that those skilled in the art may more fully appreciate the various aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should understand that they can still make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

Claims

1. A touch device, comprising:

a circuit board, an upper surface of which includes a touch detection electrode for detecting a finger touch position;

the pressure-capacitance module is arranged below the circuit board, is electrically connected with the signal processor and is used for deforming under the action of pressure applied when the finger presses the touch device so as to change the pressure sensing capacitance of a finger pressing area;

the vibration motor is installed and fixed on the lower surface of the circuit board, electrically connected with the signal processor and used for responding to the pressure applied by the fingers to perform vibration feedback; and

the signal processor is fixedly arranged on the lower surface of the circuit board and used for receiving touch sensing signals and pressure sensing signals from the touch detection electrodes and the pressure-capacitance module and determining the touch position of the finger on the touch device and the pressure applied by the finger.

2. The touch device of claim 1, wherein the number of the pressure-capacitance modules is plural, the pressure-capacitance modules comprise an upper electrode and a lower electrode, an air gap is formed between the upper electrode and the lower electrode, and the upper electrode or the lower electrode comprises a plurality of elastic cantilevers.

3. The touch device of claim 1, wherein the pressure-capacitance module comprises an upper electrode and a lower electrode separated by a silicone pad.

4. The touch device of claim 2 or 3, wherein a distance between the upper electrode and the lower electrode is between about 0.05 mm and about 0.3 mm.

5. The touch device of claim 2 or 3, wherein the pressure-volume module further comprises:

a reinforcing frame supporting the lower electrode; and

the flexible printed circuit board is arranged on the reinforcing frame and supports the upper electrode.

6. The touch device of claim 2 or 3, wherein the upper electrode is attached to the lower surface of the circuit board by an adhesive.

7. The touch device of claim 3, wherein the upper electrode or the lower electrode comprises a plurality of elastic cantilevers.

8. The touch device of claim 2 or 7, wherein the upper electrode or the lower electrode comprises a central region and a peripheral region, the central region and the peripheral region are partially hollow, and the central region and the peripheral region are connected by the cantilever.

9. The touch device of claim 8, wherein the thickness of the cantilever and the thickness of the central region are thinner than the thickness of the peripheral region.

10. A touch device, comprising:

a circuit board having an upper surface and a lower surface opposite the upper surface;

a cover plate adhered to the upper surface;

an upper electrode in the circuit board;

a lower electrode disposed corresponding to the upper electrode and partially joined to the circuit board;

a support block supporting the lower electrode;

a vibration motor disposed on the lower surface; and

and the signal processor is arranged on the lower surface and is electrically connected with the upper electrode and the lower electrode through the circuit board.

11. The touch device of claim 10, wherein the top electrode is a pad or a solder joint in the circuit board.

12. The touch device as defined in claim 10, wherein the bottom electrode has a horizontal portion and a vertical portion connected to the horizontal portion, the vertical portion being bonded to the circuit board.

13. The touch device of claim 10, wherein the upper electrode and the lower electrode form a pressure-volume module, and the support block supports the pressure-volume module through a silicone pad.

14. The touch device of claim 10, further comprising a housing supporting the support block.

15. The touch device as recited in claim 14, wherein the support block has screws or threaded holes for locking the support block to the threaded holes or screws on the housing.

16. The touch device of claim 14, wherein the vibration motor or the signal processor is disposed between the circuit board and the housing.