WO2021103684A1 - 一种掩膜版的张网设备 - Google Patents

一种掩膜版的张网设备 Download PDF

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Publication number
WO2021103684A1
WO2021103684A1 PCT/CN2020/111055 CN2020111055W WO2021103684A1 WO 2021103684 A1 WO2021103684 A1 WO 2021103684A1 CN 2020111055 W CN2020111055 W CN 2020111055W WO 2021103684 A1 WO2021103684 A1 WO 2021103684A1
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WO
WIPO (PCT)
Prior art keywords
mask
welding
moving mechanism
welding head
ultrasonic welding
Prior art date
Application number
PCT/CN2020/111055
Other languages
English (en)
French (fr)
Inventor
齐英旭
Original Assignee
云谷（固安）科技有限公司
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Filing date
Publication date
Application filed by 云谷（固安）科技有限公司 filed Critical 云谷（固安）科技有限公司
Publication of WO2021103684A1 publication Critical patent/WO2021103684A1/zh
Priority to US17/536,595 priority Critical patent/US20220081754A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means

Definitions

  • This application relates to the technical field of mask making, for example, a mask spreading device.
  • the resolution of the display panel needs to be improved.
  • the higher the resolution of the display panel the thinner the thickness of the mask strips of the mask used in the manufacture of the display panel.
  • the process of welding the mask strips to the mask frame is prone to wrinkles, thereby increasing the mask.
  • the present application provides a mask spreading device to reduce the wrinkles of the mask and improve the accuracy and service life of the mask.
  • an embodiment of the present application provides a mask printing device, including:
  • a supporting device configured to place a mask frame
  • An ultrasonic welding device the ultrasonic welding device includes an ultrasonic welding head, the ultrasonic welding head is fixedly connected to the first moving mechanism, the mask frame is arranged on the supporting device, and the ultrasonic welding head is arranged on The side of the mask frame away from the supporting device.
  • the netting equipment for setting the mask includes an ultrasonic welding device, so that the mask strip and the mask frame are welded by high-frequency vibration waves. Because ultrasonic welding uses pressure to rub the surface of the mask strip and the mask frame to form a fusion between the molecular layers, the welding surface of the mask strip and the mask frame can be closely attached, reducing the mask The wrinkle phenomenon and virtual welding of the strip improve the welding quality of the mask strip and the mask frame, and at the same time improve the pixel position Alaccuracy (PPA) of the opening on the mask strip, and improve the use of mask evaporation The evaporation yield rate at the time.
  • PPA pixel position Alaccuracy
  • the phenomenon of rework of the mask is greatly reduced, which not only reduces the material cost and labor cost caused by the rework of the mask, but also saves time and cost.
  • the mask strip and the welding surface of the mask frame are closely attached, the phenomenon of solder joints can be reduced when the mask is used for multiple evaporation and cleaning, and the service life of the mask is greatly improved.
  • ultrasonic welding requires relatively low flatness of the welded metal surface.
  • high-frequency vibration waves can also rub the surface of the mask strip and the mask frame to form a fusion between the molecular layers, and realize the relationship between the mask strip and the mask frame. Between the welding. In addition, the local temperature rise during ultrasonic welding is relatively small, and there is no damage to the weld metal surface, so there is no slag splashing into the metal particles.
  • Fig. 1 is a schematic diagram of the laser welding structure of a mask
  • Figure 2 is a schematic cross-sectional view taken along the AA' section of Figure 1;
  • FIG. 3 is a schematic diagram of the structure of a mask netting device provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of ultrasonic welding of a mask provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of another mask spreading device provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a welding structure of a mask provided by an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of still another mask spreading device provided by an embodiment of this application.
  • FIG. 8 is a schematic structural diagram of another mask spreading device provided by an embodiment of the application.
  • OLED Organic Light Emitting Diode
  • a mask can be used to evaporate materials corresponding to the three primary colors of red, green and blue to different sub-pixel areas to achieve color display, so the position of the opening on the mask needs to be ensured
  • the precision makes the openings of the mask correspond to the sub-pixel areas in the OLED display panel one-to-one, avoiding the color mixing of vapor-deposited materials of multiple colors in the same sub-pixel area.
  • Fig. 1 is a schematic diagram of a laser welding structure of a mask
  • Fig. 2 is a schematic cross-sectional view taken along the AA' section of Fig. 1. As shown in FIGS. 1 and 2, when the jaws 10 stretch the mask strip 20, the mask strip 20 is prone to wrinkles due to uneven force.
  • the wrinkles will extend to the effective evaporation area of the mask strip 20, resulting in the reduction of the PPA of the opening on the mask strip 20, and the phenomenon of color mixing and the like is prone to occur.
  • the mask strip 20 and the mask frame 30 are not closely attached during laser welding, and false welding is prone to occur.
  • the welding firmness between the mask strip 20 and the mask frame 30 is relatively low, which will not only reduce the mask strip
  • the PPA with an opening on 20 will reduce the yield of the mask for vapor deposition at the same time.
  • solder joints may fall off after multiple cleanings, and the PPA of the opening on the mask strip 20 decreases, which reduces the service life of the mask.
  • FIG. 3 is a schematic diagram of a structure of a mask spreading device provided by an embodiment of the application.
  • the netting equipment includes a supporting device 110, a first moving mechanism 120 and an ultrasonic welding device 130.
  • the supporting device 110 is configured to place the mask frame 210.
  • the ultrasonic welding device 130 includes an ultrasonic welding head 131.
  • the ultrasonic welding head 131 is fixedly connected to the first moving mechanism 120.
  • the mask frame 210 is arranged on the supporting device 110, and the ultrasonic welding head 131 is arranged on the side of the mask frame 210 away from the supporting device 110.
  • the supporting device 110 includes a supporting platform, and the supporting device 110 is configured to place the mask frame 210.
  • a mask strip 220 is placed on the mask frame 210, and a mask for vapor deposition is formed by welding the mask frame 210 and the mask strip 220.
  • the mask strip 220 is placed on the mask frame 210 after being aligned, and the first moving mechanism 120 drives the ultrasonic welding device 130 to move, so that the ultrasonic welding head 131 is opposite to the welding area on the mask frame 210 ,
  • the ultrasonic welding head 131 is controlled by the first moving mechanism 120 to weld the mask strip 220 on the mask frame 210, so that the mask strip 220 and the mask frame 210 are welded on the mask frame 210
  • the area is welded to form a mask for vapor deposition.
  • the ultrasonic welding head 131 During the welding process, the ultrasonic welding head 131 generates high-frequency vibration waves.
  • the high-frequency vibration waves may be 20-80 kHz vibration waves.
  • the high-frequency vibration wave is transmitted to the mask bar 220 and the mask frame 210. Under pressure, the surfaces of the mask strip 220 and the mask frame 210 rub against each other to form a fusion between the molecular layers, thereby realizing the welding between the mask strip 220 and the mask frame 210.
  • the ultrasonic welding uses pressure to make the surfaces of the mask strip 220 and the mask frame 210 rub against each other to form a fusion between the molecular layers
  • the welding surface of the mask strip 220 and the mask frame 210 can be closely attached,
  • the wrinkle phenomenon and virtual welding of the mask strip 220 are reduced, and the welding quality of the mask strip 220 and the mask frame 210 is improved.
  • the PPA of the opening on the mask strip 220 is improved, and the evaporation time of the mask strip is improved.
  • the evaporation yield Furthermore, the phenomenon of rework of the mask is greatly reduced, which not only reduces the material cost and labor cost caused by the rework of the mask, but also saves time and cost.
  • the time required to rework each mask after mass production is about 5 hours. Calculated by reducing the number of masks that need to be reworked by 10 masks per month, the monthly mask rework time can be saved by about 50 hour.
  • the phenomenon of solder joint detachment can be reduced when the mask is used for multiple evaporation and cleaning, which greatly improves the quality of the mask. Service life.
  • ultrasonic welding requires relatively low flatness of the welded metal surface.
  • high-frequency vibration waves can also rub the surfaces of the mask strip 220 and the mask frame 210 to form a fusion between the molecular layers, and realize the mask strip 220 and the mask. Welding between the plate frames 210.
  • the local temperature rise during ultrasonic welding is relatively small, and there is no damage to the weld metal surface, so there is no slag splashing into the metal particles.
  • FIG. 4 is a schematic structural diagram of ultrasonic welding of a mask provided by an embodiment of the application.
  • the mask frame 210 includes a welding area 211.
  • the ultrasonic welding head 131 includes a welding surface 1311, and the area of the welding surface 1311 is larger than that of the welding zone 211.
  • the welding surface 1311 of the ultrasonic welding head 131 is opposite to the welding area 211 of the mask frame 210.
  • the ultrasonic welding head 131 When the welding surface 1311 is in contact with the welding area 211, the ultrasonic welding head 131 generates high-frequency vibration waves and pressure through the welding surface 1311, so that the mask strip on the welding area 211 is pressed against the welding area 211 and vibrates at high frequency. It is welded to the welding zone 211 under the action of the wave.
  • the mask strip on the welding area 211 can be uniformly welded under the action of the high frequency vibration wave and pressure of the welding surface 1311 at the same time, which not only improves the welding efficiency At the same time, it can improve the welding yield and reduce the wrinkles and false welding during the welding process.
  • the mask frame 210 includes two welding areas 211, and the corresponding ultrasonic welding head 131 may also include two.
  • the two ultrasonic welding heads 131 weld the mask strip at the same time, so that both ends of the mask strip are welded to the mask frame 210 at the same time, thereby realizing the welding of the mask strip and the mask frame 210, forming Mask plate.
  • FIG. 5 is a schematic structural diagram of another mask spreading device provided by an embodiment of the application.
  • the net stretching equipment further includes a laser welding device 140.
  • the laser welding device 140 includes a laser welding head 141, the laser welding head 141 is fixedly connected to the first moving mechanism 120, and the laser welding head 141 is arranged on a side of the mask frame 210 away from the supporting device 110.
  • the laser welding head 141 can be used to weld the mask strip 220 and the mask frame 210 again, so as to avoid the occurrence of the welding process.
  • the welding firmness between the mask strip 220 and the mask frame 210 is increased.
  • the laser welding head 141 is fixedly connected to the first moving mechanism 120. Therefore, during the laser welding process, the first moving mechanism 120 can drive the laser welding head 141 to move, so that the laser welding head 141 is opposite to the welding area on the mask frame 210, and the laser welding head 141 is moved by the first moving mechanism 120.
  • the mask strip 220 on the pair of mask frames 210 is controlled to be welded so that the mask strip 220 and the mask frame 210 are welded again at the welding area.
  • the ultrasonic welding device 130 and the laser welding device 140 are arranged side by side.
  • the ultrasonic welding device 130 and the laser welding device 140 are arranged side by side by being arranged along the length direction X of the mask frame 210.
  • the first moving mechanism 120 can only move along the length direction X of the mask frame 210, which can not only quickly move the mask frame 210
  • the ultrasonic welding device 130 corresponding to the welding zone is switched to the laser welding device 140, and the alignment of the laser welding device 140 with the welding zone along the width direction of the mask frame 210 can be avoided, and the alignment difficulty of the laser welding device 140 can be reduced.
  • FIG. 6 is a schematic diagram of a welding structure of a mask provided by an embodiment of the application.
  • the number of ultrasonic welding heads 131 is two, and the number of laser welding heads 141 is two; along the length direction X of the mask frame 210, the two opposite frames of the mask frame 210 include the welding area 211; the distance between the corresponding welding areas 211 on the two frames is the first distance; the distance between the two ultrasonic welding heads 131 is the first distance, and the distance between the two laser welding heads 141 is also the first distance .
  • the welding area 211 of the mask frame 210 is configured as a welding mask strip.
  • one mask strip corresponds to two welding areas 211, and the two ends of the mask strip are respectively welded to the welding areas 211 of the mask frame 210.
  • each welding area 211 on the mask strip corresponds to one ultrasonic welding head 131 and one laser welding head 141.
  • the ultrasonic welding head 131 corresponding to each welding area 211 is directly opposite to the welding area 211, so as to realize the ultrasonic welding of all welding areas 211.
  • the laser welding head 141 corresponding to each welding area 211 is directly opposite to the welding area 211, so that laser welding of all welding areas 211 is realized. Therefore, by setting the number of ultrasonic welding heads 131 and the number of laser welding heads 141 to be two, the welding efficiency of the mask strip and the mask frame 210 can be improved.
  • the distance between two ultrasonic welding heads 131 may be equal to the distance between two corresponding welding areas 211 on the mask frame 210.
  • the two ultrasonic welding heads 131 and the two welding areas 211 can be aligned at the same time, respectively, so that the two welding areas can be aligned. 211 simultaneous welding.
  • the distance between the two laser welding heads 141 can be equal to the distance between the two corresponding welding areas 211 on the mask frame 210.
  • the two laser welding heads 141 and its corresponding welding area 211 can be respectively aligned at the same time, so that the two welding areas can be aligned. 211 simultaneous welding.
  • the distance d between the ultrasonic welding head 131 and the laser welding head 141 corresponding to the same welding zone 211 is equal to the distance d between the ultrasonic welding head 131 and the laser welding head 141 corresponding to another welding zone 211.
  • the ultrasonic welding is converted to laser welding, after moving the distance d between the ultrasonic welding head 131 and the laser welding head 141 corresponding to the same welding area 211 along the length direction X of the mask frame 210, the two welding areas 211 correspond to each other All of the laser welding heads 141 can correspond to the welding area 211, so as to prepare for laser welding.
  • the mask frame 210 includes a bonding area 211.
  • the distance d between the ultrasonic welding head 131 and the laser welding head 141 is greater than or equal to the width of the welding area 211.
  • the distance d between the ultrasonic welding head 131 and the laser welding head 141 is set to be greater than or equal to the width of the welding area 211, when the ultrasonic welding head 131 is opposite to the welding area 211, the laser welding head 141 is located outside the welding area 211, The ultrasonic welding head 131 is completely attached to the welding area 211 and ultrasonic welding is performed to prevent the laser welding head 141 from affecting the welding of the ultrasonic welding head 131. Similarly, when the laser welding head 131 is opposite to the welding area 211, the ultrasonic welding head 131 is located outside the welding area 211 to prevent the ultrasonic welding head 131 from affecting the laser welding.
  • the first moving mechanism 120 includes at least one group having a first moving arm and a first driving unit; the first driving unit in each group is connected to the first moving arm, and the first driving unit is configured to drive The first moving arm of the same group moves.
  • the first driving unit may include a motor and a single-chip microcomputer, and the single-chip microcomputer controls the rotation direction and rotation rate of the motor.
  • the first moving arm may be a mechanical arm that moves along the track.
  • the single-chip microcomputer controls the rotation direction and speed of the motor, and the first moving arm drives the ultrasonic welding head and the laser welding head to move.
  • the ultrasonic welding head corresponds to a group of first moving arms and a first driving unit
  • the laser welding head corresponds to another group of first moving arms and a first driving unit.
  • the first driving unit separately controls the movement of the ultrasonic welding head and the laser welding head through the first moving arm, so that the ultrasonic welding head or the laser welding head can be made to correspond to the welding area in different time.
  • FIG. 7 is a schematic diagram of the structure of another mask spreading device provided by an embodiment of the application.
  • the net spreading device further includes a second moving mechanism 150.
  • the ultrasonic welding head 131 and the laser welding head 141 are fixedly connected to the first moving mechanism 120 through the second moving mechanism 150.
  • the moving step length of the second moving mechanism 150 is smaller than the moving step length of the first moving mechanism 120.
  • the first moving mechanism 120 may be a fast moving mechanism.
  • the moving step length of the second moving mechanism 150 is smaller than the moving step length of the first moving mechanism 120. That is, relative to the first moving mechanism 120, the second moving mechanism 150 may be a highly accurate moving mechanism.
  • the ultrasonic welding head 131 and the laser welding head 141 can be quickly moved to the vicinity of the target position by the first moving mechanism 120, and then the ultrasonic welding head 131 or the laser welding head 141 can be moved by the second moving mechanism 150.
  • the laser welding head 141 is accurately moved to the target position, so that the ultrasonic welding head 131 and the laser welding head 141 can be moved quickly and accurately, and the welding efficiency of the mask strip 220 and the mask frame 210 is improved.
  • the second moving mechanism includes at least one group having a second moving arm and a second driving unit, the second driving unit in each group is connected to the second moving arm, and the second driving unit is configured to drive the same group of The second moving arm moves.
  • the second driving unit may include a motor and a single-chip microcomputer, and the single-chip microcomputer controls the rotation direction and rotation rate of the motor.
  • the second moving arm may be a mechanical arm that moves along the track.
  • the second moving mechanism controls the movement of the ultrasonic welding head and the laser welding head
  • the single-chip microcomputer controls the rotation direction and speed of the motor
  • the second moving arm drives the ultrasonic welding head and the laser welding head to move.
  • the second moving mechanism includes two groups each having a second moving arm and a second driving unit, the ultrasonic welding head corresponds to one of the two groups of the second moving arm and the second driving unit, and the laser welding head corresponds to two groups.
  • the second driving unit separately controls the movement of the ultrasonic welding head and the laser welding head through the second moving arm, so that the ultrasonic welding head or the laser welding head can correspond to the welding area at different times.
  • the number of groups of the first moving mechanism can be equal to the number of groups of the second moving mechanism, so that each ultrasonic welding head and mechanical welding head can be controlled to move by the first moving mechanism and the second moving mechanism in cooperation.
  • FIG. 8 is a schematic structural diagram of another mask spreading device provided by an embodiment of the application.
  • the net stretching device further includes a clamping jaw 160 and a third moving mechanism 170.
  • the clamping jaw 160 is connected to the third moving mechanism 170.
  • the clamping jaw 160 is configured to clamp the mask strip 220 on the mask frame 210 under the driving of the third moving mechanism 170.
  • each of the two ends of the mask strip 220 includes two clamping jaws 160.
  • the two clamping jaws 160 at the same end are symmetrical with respect to the center line extending along the length of the mask strip 220.
  • the clamping jaws 160 at different ends are symmetrical with respect to the center line extending along the width direction of the mask strip 220. Therefore, when the clamping jaws 160 clamp the mask strip 220, the force on the mask strip 220 is uniform, and the probability of wrinkles on the mask strip 220 is reduced.
  • the third moving mechanism 170 can drive the clamping jaw 160 to move and clamp. In the process of opening the screen, the third moving mechanism 170 controls the clamping jaws 160 to move to the two ends of the mask strip 220 and clamp the mask strip 220 so as to realize the opening of the mask strip 220.
  • the third moving mechanism 170 may include two groups having a third moving arm and a third driving unit, the third driving unit in each group is connected to the third moving arm, and the third driving unit is configured to drive the same group.
  • the third moving arm moves.

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Abstract

本申请公开了一种掩膜版的张网设备。该张网设备包括支撑装置、第一移动机构和超声波焊接装置；支撑装置设置为放置掩膜版框架；超声波焊接装置包括超声波焊接头，超声波焊接头固定连接于第一移动机构，掩膜版框架设置于支撑装置上，超声波焊接头设置于掩膜版框架远离支撑装置的一侧。

Description

一种掩膜版的张网设备
本申请要求在2019年11月28日提交中国专利局、申请号为201922093507.7的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及掩膜版制作的技术领域，例如一种掩膜版的张网设备。
背景技术
随着科技的飞速发展，人们对于显示更加追求细节的清晰度及表现，因此，显示面板的分辨率需要提升。但是，显示面板分辨率越高，在制作显示面板时使用的掩膜版的掩膜条厚度就越薄，将掩膜条焊接到掩膜版框架上的过程中容易产生褶皱，从而增加了掩膜条的虚焊，以及显示面板色偏、混色的风险。
发明内容
本申请提供一种掩膜版的张网设备，以减少掩膜版的褶皱，提高掩膜版的精度和使用寿命。
第一方面，本申请实施例提供了一种掩膜版的张网设备，包括：
支撑装置，所述支撑装置设置为放置掩膜版框架；
第一移动机构；
超声波焊接装置，所述超声波焊接装置包括超声波焊接头，所述超声波焊接头固定连接于所述第一移动机构，所述掩膜版框架设置于所述支撑装置上，所述超声波焊接头设置于所述掩膜版框架远离所述支撑装置的一侧。
本申请实施例的技术方案，通过设置掩膜版的张网设备包括超声波焊接装置，使掩膜条和掩膜版框架通过高频振动波实现焊接。由于超声波焊接通过加压，使掩膜条和掩膜版框架的表面相互摩擦而形成分子层之间的熔合，因此掩膜条和掩膜版框架的焊接表面可以紧密贴合，减少了掩膜条的褶皱现象和虚焊， 提高了掩膜条和掩膜版框架的焊接质量，同时提高了掩膜条上开口的像素位置精度(Pixel Position Alaccuracy，PPA)，提高了使用掩膜版蒸镀时的蒸镀良率。进而大幅度的减少了掩膜版返工现象，不仅能够降低因掩膜版返工导致的物料成本和人工成本，而且能够节约时间成本。而且，由于掩膜条和掩膜版框架的焊接表面紧密贴合，在使用掩膜版多次蒸镀及清洗时可以减少焊点脱离的现象，很大程度上提高了掩膜版的使用寿命。另外，由于超声波焊接过程中具有高频振动波，因此超声波焊接对焊接金属表面的平整度要求比较低。在焊接金属表面存在氧化或微小颗粒的情况下，高频振动波同样能够使掩膜条和掩膜版框架的表面相互摩擦形成分子层之间的熔合，实现掩膜条和掩膜版框架之间的焊接。并且，超声波焊接时局部温升比较小，不会对焊接金属表面产生损伤，因此不会产生熔渣飞溅带入金属颗粒。
附图说明
图1为一种掩膜版的激光焊接的结构示意图；
图2为图1沿AA’剖面得到的剖面示意图；
图3为本申请一实施例提供的一种掩膜版的张网设备的结构示意图；
图4为本申请一实施例提供的一种掩膜版的超声波焊接的结构示意图；
图5为本申请一实施例提供的另一种掩膜版的张网设备的结构示意图；
图6为本申请一实施例提供的一种掩膜版的焊接的结构示意图；
图7为本申请一实施例提供的又一种掩膜版的张网设备的结构示意图；
图8为本申请一实施例提供的又一种掩膜版的张网设备的结构示意图。
具体实施方式
有机发光二极管(Organic Light Emitting Diode，OLED)显示器的制备通常采用蒸镀法形成各个膜层。在制作OLED显示面板的发光层时，可以采用掩膜版分别将红、绿和蓝三基色对应的材料蒸镀至不同的子像素区域实现彩色化显 示，因此需要保证掩膜版上开口的位置精度，使得掩膜版的开口与OLED显示面板中的子像素区域一一对应，避免同一子像素区域内蒸镀多种颜色的材料发生混色。在掩膜版的张网过程中，张网设备上的夹爪拉伸掩膜条实现掩膜条的张网，使掩膜条放置在掩膜版框架上并进行激光焊接，将掩膜条与掩膜版框架固定在一起，从而形成蒸镀用掩膜版。图1为一种掩膜版的激光焊接的结构示意图，图2为图1沿AA’剖面得到的剖面示意图。如图1和图2所示，在夹爪10拉伸掩膜条20时，掩膜条20因受力不均匀容易产生褶皱现象。褶皱会延伸至掩膜条20的蒸镀有效区，导致掩膜条20上开口的PPA降低，容易出现混色等现象。另外，激光焊接时掩膜条20与掩膜版框架30贴合不紧密，容易出现虚焊，掩膜条20与掩膜版框架30之间的焊接牢固性比较低，不仅会降低掩膜条20上开口的PPA，同时会降低蒸镀用掩膜版的良率。且随着蒸镀用掩膜版的重复使用，多次清洗后会出现焊点脱落，掩膜条20上开口的PPA下降，降低了掩膜版的使用寿命。
本申请提供了一种掩膜版的张网设备。图3为本申请一实施例提供的一种掩膜版的张网设备的结构示意图。如图3所示，该张网设备包括支撑装置110、第一移动机构120和超声波焊接装置130。支撑装置110设置为放置掩膜版框架210。超声波焊接装置130包括超声波焊接头131。超声波焊接头131固定连接于第一移动机构120。掩膜版框架210设置于支撑装置110上，超声波焊接头131设置于掩膜版框架210远离支撑装置110的一侧。
示例性的，支撑装置110包括支撑平台，支撑装置110设置为放置掩膜版框架210。掩膜版框架210上放置掩膜条220，通过焊接掩膜版框架210和掩膜条220形成蒸镀用掩膜版。在焊接过程中，掩膜条220通过对位后放置在掩膜版框架210上，第一移动机构120带动超声波焊接装置130移动，使得超声波焊接头131与掩膜版框架210上的焊接区相对，超声波焊接头131受到第一移动机构120控制，从而对掩膜版框架210上的掩膜条220焊接，使得掩膜条220和掩膜版框架210在所述掩膜版框架210上的焊接区处焊接，从而形成蒸镀用 掩膜版。
在焊接过程中，超声波焊接头131产生高频振动波，示例性地，高频振动波可以为20-80kHz的振动波。高频振动波传递到掩膜条220和掩膜版框架210上。在加压的情况下，掩膜条220和掩膜版框架210的表面相互摩擦而形成分子层之间的熔合，从而实现掩膜条220和掩膜版框架210之间的焊接。由于超声波焊接通过加压，使掩膜条220和掩膜版框架210的表面相互摩擦而形成分子层之间的熔合，因此掩膜条220和掩膜版框架210的焊接表面可以紧密贴合，减少了掩膜条220的褶皱现象和虚焊，提高了掩膜条220和掩膜版框架210的焊接质量，同时提高了掩膜条220上开口的PPA，提高了使用掩膜版蒸镀时的蒸镀良率。进而大幅度的减少了掩膜版返工现象，不仅能够降低因掩膜版返工导致的物料成本和人工成本，而且能够节约时间成本。示例性地，量产后每条掩膜版返工需要的时间约为5小时，每月按减少10条掩膜版需要返工的数量进行计算，则每月可以节约掩膜版返工时间约为50小时。
而且，由于掩膜条220和掩膜版框架210的焊接表面紧密贴合，在使用掩膜版多次蒸镀及清洗时可以减少焊点脱离的现象，很大程度上提高了掩膜版的使用寿命。另外，由于超声波焊接过程中具有高频振动波，因此超声波焊接对焊接金属表面的平整度要求比较低。在焊接金属表面存在氧化或微小颗粒的情况下，高频振动波同样能够使掩膜条220和掩膜版框架210的表面相互摩擦形成分子层之间的熔合，实现掩膜条220和掩膜版框架210之间的焊接。并且，超声波焊接时局部温升比较小，不会对焊接金属表面产生损伤，因此不会产生熔渣飞溅带入金属颗粒。
图4为本申请一实施例提供的一种掩膜版的超声波焊接的结构示意图。如图4所示，掩膜版框架210包括焊接区211。超声波焊接头131包括焊接表面1311，焊接表面1311的面积大于焊接区211的面积。
示例性的，在超声波焊接的过程中，超声波焊接头131的焊接表面1311与 掩膜版框架210的焊接区211相对。当焊接表面1311与焊接区211接触后，超声波焊接头131通过焊接表面1311产生高频率振动波和压力，使焊接区211上的掩膜条受到压力贴合于焊接区211，同时在高频率振动波的作用下与焊接区211焊接。由于焊接表面1311的面积大于焊接区211的面积，因此在焊接时，焊接区211上的掩膜条能够同时在焊接表面1311的高频率振动波和压力的作用下均匀焊接，不仅能够提高焊接效率，同时能够提高焊接的良率，减少了焊接过程中的褶皱和虚焊。
参考图4，掩膜版框架210包括两个焊接区211，对应的超声波焊接头131也可以包括两个。在焊接过程中，两个超声波焊接头131同时对掩膜条焊接，使得掩膜条的两端同时焊接在掩膜版框架210上，从而实现掩膜条与掩膜版框架210的焊接，形成掩膜版。
图5为本申请一实施例提供的另一种掩膜版的张网设备的结构示意图。如图5所示，张网设备还包括激光焊接装置140。激光焊接装置140包括激光焊接头141，激光焊接头141固定连接于第一移动机构120，激光焊接头141设置于掩膜版框架210远离支撑装置110的一侧。
示例性的，在超声波焊接头131焊接掩膜条220和掩膜版框架210后，可以采用激光焊接头141对掩膜条220和掩膜版框架210再次焊接，从而可以在避免焊接过程中产生褶皱和虚焊的基础上，增加掩膜条220和掩膜版框架210之间的焊接牢固性。
激光焊接头141固定连接于第一移动机构120上。因此在激光焊接的过程中，可以通过第一移动机构120带动激光焊接头141移动，使得在激光焊接头141与掩膜版框架210上的焊接区相对，激光焊接头141被第一移动机构120控制成对掩膜版框架210上的掩膜条220焊接，使得掩膜条220和掩膜版框架210在焊接区处再次焊接。
参考图5，沿掩膜版框架210的长度方向X，超声波焊接装置130与激光焊 接装置140并列设置。
示例性的，通过设置沿掩膜版框架210的长度方向X，超声波焊接装置130与激光焊接装置140并列设置。在超声波焊接装置130对掩膜条220和掩膜版框架210焊接后，第一移动机构120可以只沿掩膜版框架210的长度方向X移动，不仅可以能够快速的将掩膜版框架210的焊接区对应的超声波焊接装置130切换为激光焊接装置140，而且能够避免激光焊接装置140沿掩膜版框架210的宽度方向与焊接区的对位，降低了激光焊接装置140的对位难度。
图6为本申请一实施例提供的一种掩膜版的焊接的结构示意图。如图6所示，超声波焊接头131的数量为两个，激光焊接头141的数量为两个；沿掩膜版框架210的长度方向X，掩膜版框架210相对的两个边框包括焊接区211；两个边框上对应的焊接区211之间的距离为第一距离；两个超声波焊接头131之间的距离为第一距离，两个激光焊接头141之间的距离也为第一距离。
示例性的，掩膜版框架210的焊接区211设置为焊接掩膜条。在焊接掩膜条时，一个掩膜条对应两个焊接区211，分别将掩膜条的两端焊接在掩膜版框架210的焊接区211处。通过设置超声波焊接头131和激光焊接头141的数量均为两个，掩膜条上每个焊接区211对应一个超声波焊接头131和一个激光焊接头141。当进行超声波焊接时，每个焊接区211对应的超声波焊接头131与焊接区211正对，从而实现所有焊接区211的超声波焊接。当进行激光焊接时，每个焊接区211对应的激光焊接头141与焊接区211正对，从而实现所有焊接区211的激光焊接。因此，通过设置超声波焊接头131的数量和激光焊接头141的数量均为两个，可以提高了掩膜条和掩膜版框架210的焊接效率。
需要说明的是，沿掩膜版框架210的长度方向X，两个超声波焊接头131之间的距离可以与掩膜版框架210上两个对应焊接区211之间的距离相等。在进行超声波焊接时，当其中一个超声波焊接头131与其对应的焊接区211对位准确后，即可同时实现两个超声波焊接头131与两个焊接区211分别对位，实 现对两个焊接区211同时焊接。同理，两个激光焊接头141之间的距离可以与掩膜版框架210上两个对应焊接区211之间的距离相等。在进行激光焊接时，当其中一个激光焊接头141与其对应的焊接区211对位准确后，即可同时实现两个激光焊接头141与两个焊接区211分别对位，实现对两个焊接区211同时焊接。
另外，同一焊接区211对应的超声波焊接头131和激光焊接头141之间的距离d，与另一焊接区211对应的超声波焊接头131和激光焊接头141之间的距离d相等。在进行超声波焊接转换为激光焊接时，在沿掩膜版框架210的长度方向X移动同一焊接区211对应的超声波焊接头131和激光焊接头141之间的距离d后，两个焊接区211对应的激光焊接头141均能与焊接区211对应，从而为激光焊接做准备。
参考图6，掩膜版框架210包括焊接区211。沿掩膜版框架210的长度方向X，超声波焊接头131和激光焊接头141的距离d大于或等于焊接区211的宽度。
示例性的，通过设置超声波焊接头131和激光焊接头141的距离d大于或等于焊接区211的宽度，当超声波焊接头131与焊接区211相对时，激光焊接头141位于焊接区211的外侧，超声波焊接头131完全贴合焊接区211，对其进行超声波焊接，避免激光焊接头141影响超声波焊接头131的焊接。同理，当激光焊接头131与焊接区211相对时，超声波焊接头131位于焊接区211的外侧，避免超声波焊接头131影响激光焊接。
在一实施例中，第一移动机构120包括至少一个具有第一移动臂和第一驱动单元的组；每一组中的第一驱动单元与第一移动臂连接，第一驱动单元设置为驱动同组的第一移动臂移动。
示例性的，第一驱动单元可以包括电机和单片机，单片机控制电机的转动方向和转动速率。第一移动臂可以为沿轨道运动的机械臂。在第一移动机构控制超声波焊接头和激光焊接头运动时，单片机控制电机的转动方向和速率，通 过第一移动臂带动超声波焊接头和激光焊接头运动。示例性地，超声波焊接头对应一组第一移动臂和第一驱动单元，激光焊接头对应另一组第一移动臂和第一驱动单元。第一驱动单元通过第一移动臂分别控制超声波焊接头和激光焊接头运动，从而可以在不同时间内，使得超声波焊接头或激光焊接头与焊接区对应。
图7为本申请一实施例提供的又一种掩膜版的张网设备的结构示意图。如图7所示，张网设备还包括第二移动机构150。超声波焊接头131和激光焊接头141通过第二移动机构150固定连接接于第一移动机构120。第二移动机构150的移动步长小于第一移动机构120的移动步长。
示例性的，第二移动机构150可以有多个，分别带动超声波焊接头131和激光焊接头141移动。在张网设备包括第二移动机构150的情况下，第一移动机构120可以为快速移动机构。第二移动机构150的移动步长小于第一移动机构120的移动步长。即相对于第一移动机构120，第二移动机构150可以为精确度高的移动机构。在移动超声波焊接头131和激光焊接头141时，可以通过第一移动机构120将超声波焊接头131或激光焊接头141快速移动至目标位置附近，然后通过第二移动机构150将超声波焊接头131或激光焊接头141准确地移动至目标位置，从而实现将超声波焊接头131和激光焊接头141快速准确的移动，提高了掩膜条220和掩膜版框架210的焊接效率。
示例性地，第二移动机构包括至少一个具有第二移动臂和第二驱动单元的组，每一组中的第二驱动单元与第二移动臂连接，第二驱动单元设置为驱动同组的第二移动臂移动。
示例性的，第二驱动单元可以包括电机和单片机，单片机控制电机的转动方向和转动速率。第二移动臂可以为沿轨道运动的机械臂。在第二移动机构控制超声波焊接头和激光焊接头运动时，单片机控制电机的转动方向和速率，通过第二移动臂带动超声波焊接头和激光焊接头运动。示例性地，第二移动机构 包括两组均具有第二移动臂和第二驱动单元的组，超声波焊接头对应两组中的一组第二移动臂和第二驱动单元，激光焊接头对应两组中的另一组第二移动臂和第二驱动单元。第二驱动单元通过第二移动臂分别控制超声波焊接头和激光焊接头运动，从而可以在不同时间内，使超声波焊接头或激光焊接头与焊接区对应。
需要说明的是，第一移动机构的组数可以与第二移动机构的组数相等，从而实现每个超声波焊接头和机构焊接头均可以通过第一移动机构和第二移动机构配合控制移动。
图8为本申请一实施例提供的又一种掩膜版的张网设备的结构示意图。如图8所示，张网设备还包括夹爪160和第三移动机构170。夹爪160与第三移动机构170连接。夹爪160设置为在第三移动机构170的驱动下夹持掩膜版框架210上的掩膜条220。
示例性的，掩膜条220的两端中的每一端包括两个夹爪160。同一端的两个夹爪160，相对于沿着掩膜条220长度方向延伸的中线，对称。不同端的夹爪160，相对于沿着掩膜条220的宽度方向延伸的中线，对称。从而使得夹爪160夹持掩膜条220时，掩膜条220上的受力均匀，降低掩膜条220上褶皱现象的概率。第三移动机构170可以驱动夹爪160移动和夹持。在张网过程中，第三移动机构170控制夹爪160移动至掩膜条220的两端，并夹持掩膜条220，从而实现对掩膜条220的张网。
同理，第三移动机构170可以包括两个具有第三移动臂和第三驱动单元的组，每一组中的第三驱动单元与第三移动臂连接，第三驱动单元设置为驱动同组的第三移动臂移动。

Claims (13)

  1. 一种掩膜版的张网设备，包括：
    支撑装置，所述支撑装置设置为放置掩膜版框架；
    第一移动机构；
    超声波焊接装置，所述超声波焊接装置包括超声波焊接头，所述超声波焊接头固定连接于所述第一移动机构，所述掩膜版框架设置于所述支撑装置上，所述超声波焊接头设置于所述掩膜版框架远离所述支撑装置的一侧。
  2. 根据权利要求1所述的张网设备，其中，所述掩膜版框架包括焊接区，所述第一移动机构带动所述超声波焊接装置移动，使得所述超声波焊接头与所述掩膜版框架的所述焊接区相对。
  3. 根据权利要求2所述的张网设备，其中，所述掩膜版框架上放置掩膜条，所述超声波焊接头受到所述第一移动机构控制，对所述掩膜版框架上的所述掩膜条焊接，使得所述掩膜条和所述掩膜版框架在所述掩膜版框架的所述焊接区焊接，从而形成蒸镀用掩膜版。
  4. 根据权利要求2所述的张网设备，其中，所述超声波焊接头包括焊接表面，所述焊接表面的面积大于所述焊接区的面积。
  5. 根据权利要求1所述的张网设备，还包括激光焊接装置；
    所述激光焊接装置包括激光焊接头，所述激光焊接头固定连接于所述第一移动机构，所述激光焊接头设置于所述掩膜版框架远离所述支撑装置的一侧。
  6. 根据权利要求5所述的张网设备，其中，沿所述掩膜版框架的长度方向，所述超声波焊接装置与所述激光焊接装置并列设置。
  7. 根据权利要求5所述的张网设备，其中，所述掩膜版框架包括焊接区；沿所述掩膜版框架的长度方向，所述超声波焊接头和所述激光焊接头的距离大于或等于所述焊接区的宽度。
  8. 根据权利要求7所述的张网设备，其中，所述超声波焊接头的数量为两个，所述激光焊接头的数量为两个；沿所述掩膜版框架的长度方向，所述掩膜版框架相对的两个边框包括焊接区；两个所述边框上对应的焊接区之间的距离 为第一距离；两个所述超声波焊接头之间的距离为所述第一距离，两个所述激光焊接头之间的距离为所述第一距离。
  9. 根据权利要求7所述的张网设备，其中，所述第一移动机构包括至少一个具有第一移动臂和第一驱动单元的组；每一组中的所述第一驱动单元与所述第一移动臂连接，所述第一驱动单元设置为驱动同一组的所述第一移动臂移动。
  10. 根据权利要求9所述的张网设备，还包括第二移动机构；
    所述超声波焊接头和所述激光焊接头通过所述第二移动机构固定连接于所述第一移动机构；所述第二移动机构的移动步长小于所述第一移动机构的移动步长。
  11. 根据权利要求10所述的张网设备，其中，所述第二移动机构包括至少一个具有第二移动臂和第二驱动单元的组，每一组中的所述第二驱动单元与所述第二移动臂连接，所述第二驱动单元设置为驱动同一组的所述第二移动臂移动。
  12. 根据权利要求11所述的张网设备，其中，所述第二移动机构包括两组均具有所述第二移动臂和所述第二驱动单元的组，所述超声波焊接头对应所述两组中的一组第二移动臂和第二驱动单元，所述激光焊接头对应所述两组中的另一组第二移动臂和第二驱动单元。
  13. 根据权利要求1所述的张网设备，还包括夹爪和第三移动机构，所述夹爪与所述第三移动机构连接，所述夹爪设置为在所述第三移动机构的驱动下夹持所述掩膜版框架上的掩膜条。
PCT/CN2020/111055 2019-11-28 2020-08-25 一种掩膜版的张网设备 WO2021103684A1 (zh)

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CN114054925A (zh) * 2021-11-10 2022-02-18 合肥维信诺科技有限公司 一种掩膜板的制作方法

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