WO2021100881A3 - フラーレン誘導体含有樹脂組成物の製法、これにより得られるフラーレン誘導体含有樹脂組成物、樹脂塗料、樹脂塗膜およびエナメル線 - Google Patents

フラーレン誘導体含有樹脂組成物の製法、これにより得られるフラーレン誘導体含有樹脂組成物、樹脂塗料、樹脂塗膜およびエナメル線 Download PDF

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Publication number
WO2021100881A3
WO2021100881A3 PCT/JP2021/011006 JP2021011006W WO2021100881A3 WO 2021100881 A3 WO2021100881 A3 WO 2021100881A3 JP 2021011006 W JP2021011006 W JP 2021011006W WO 2021100881 A3 WO2021100881 A3 WO 2021100881A3
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WIPO (PCT)
Prior art keywords
fullerene derivative
resin composition
containing resin
resin
producing
Prior art date
Application number
PCT/JP2021/011006
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English (en)
French (fr)
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WO2021100881A2 (ja
Inventor
昭夫 原田
泰明 宮下
武 野口
葛西　壽一
Original Assignee
東タイ株式会社
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Publication date
Application filed by 東タイ株式会社 filed Critical 東タイ株式会社
Priority to KR1020227029551A priority Critical patent/KR20220161548A/ko
Priority to JP2021558485A priority patent/JPWO2021100881A1/ja
Priority to US17/912,400 priority patent/US20230041408A1/en
Priority to DE112021002076.5T priority patent/DE112021002076T5/de
Priority to CN202180018912.XA priority patent/CN115244135A/zh
Publication of WO2021100881A2 publication Critical patent/WO2021100881A2/ja
Publication of WO2021100881A3 publication Critical patent/WO2021100881A3/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/045—Fullerenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Abstract

サージ電圧に対する絶縁材の寿命低下を抑制する材料、つまり高い絶縁破壊寿命を付加する材料の製法として下記を提供する。　フラーレン誘導体と、極性溶媒に親和性のある樹脂とを含有するフラーレン誘導体含有樹脂組成物を製造する方法であって、下記（Ｉ）および（II）の工程を備えることを特徴とするフラーレン誘導体含有樹脂組成物の製法。 （Ｉ）フラーレン誘導体を極性溶媒に分散させる工程 （II）フラーレン誘導体が分散した極性溶媒を、極性溶媒と親和性のある樹脂と混合する工程
PCT/JP2021/011006 2020-03-30 2021-03-18 フラーレン誘導体含有樹脂組成物の製法、これにより得られるフラーレン誘導体含有樹脂組成物、樹脂塗料、樹脂塗膜およびエナメル線 WO2021100881A2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020227029551A KR20220161548A (ko) 2020-03-30 2021-03-18 플라렌 유도체 함유 수지 조성물의 제법, 이에 의해 얻어지는 플라렌 유도체 함유 수지 조성물, 수지 도료, 수지 도막 및 에나멜 선
JP2021558485A JPWO2021100881A1 (ja) 2020-03-30 2021-03-18
US17/912,400 US20230041408A1 (en) 2020-03-30 2021-03-18 Method for producing fullerene-derivative-containing resin composition, fullerene-derivative-containing resin composition obtained from same, resin paint, resin coating, and enamel wire
DE112021002076.5T DE112021002076T5 (de) 2020-03-30 2021-03-18 Verfahren zur herstellung einer fullerenderivat-haltigen harzzusammensetzung, fullerenderivat-haltige harzzusammensetzung, erhalten aus demselbigen, harzfarbe, harzbeschichtung und emaildraht
CN202180018912.XA CN115244135A (zh) 2020-03-30 2021-03-18 含富勒烯衍生物的树脂组合物的制法、由此得到的含富勒烯衍生物的树脂组合物、树脂涂料、树脂涂膜及漆包线

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020060339 2020-03-30
JP2020-060339 2020-03-30

Publications (2)

Publication Number Publication Date
WO2021100881A2 WO2021100881A2 (ja) 2021-05-27
WO2021100881A3 true WO2021100881A3 (ja) 2021-07-15

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ID=75981646

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Application Number Title Priority Date Filing Date
PCT/JP2021/011006 WO2021100881A2 (ja) 2020-03-30 2021-03-18 フラーレン誘導体含有樹脂組成物の製法、これにより得られるフラーレン誘導体含有樹脂組成物、樹脂塗料、樹脂塗膜およびエナメル線

Country Status (6)

Country Link
US (1) US20230041408A1 (ja)
JP (1) JPWO2021100881A1 (ja)
KR (1) KR20220161548A (ja)
CN (1) CN115244135A (ja)
DE (1) DE112021002076T5 (ja)
WO (1) WO2021100881A2 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331539A (ja) * 1999-05-21 2000-11-30 Hitachi Cable Ltd 耐インバータサージエナメル線
JP2005097329A (ja) * 2003-08-28 2005-04-14 Mitsubishi Chemicals Corp フラーレン誘導体を含有する組成物、並びに前記組成物を用いた塗膜及び粉体の製造方法
JP2005179480A (ja) * 2003-12-18 2005-07-07 Sumitomo Bakelite Co Ltd 絶縁材用樹脂組成物及びこれを用いた絶縁材
JP2006160799A (ja) * 2004-12-02 2006-06-22 Toyota Industries Corp 塗料組成物、塗料組成物を用いた摺動層の製造方法および摺動層を有する摺動部材
JP2007145894A (ja) * 2005-11-24 2007-06-14 Tamagawa Gakuen 複層摺動部材
US20100101828A1 (en) * 2008-10-28 2010-04-29 Magnekon, S. A. De C. V. Magnet wire with coating added with fullerene-type nanostructures
JP2016017063A (ja) * 2014-07-10 2016-02-01 国立大学法人大阪大学 長鎖アルキルエーテル化フラーレン誘導体およびその製造方法、並びにそれを用いた樹脂組成物
EP3141539A1 (en) * 2015-09-11 2017-03-15 Totai Co. Ltd. Long-chain alkyl-etherified fullerene derivative, production method for the same, and resin composition using the same
JP2018177895A (ja) * 2017-04-07 2018-11-15 昭和電工株式会社 樹脂組成物、絶縁ワニス及びその用途

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4061981B2 (ja) 2002-06-17 2008-03-19 日立電線株式会社 耐インバータサージ性コイル絶縁ワニス及び耐インバータサージ性コイル
JP2005251505A (ja) 2004-03-03 2005-09-15 Teijirou Azuma プロトン伝導体
JP2014072865A (ja) 2012-10-01 2014-04-21 Sharp Corp メッセージ発信サーバ、プログラム、メッセージ発信システム、メッセージ発信方法、および端末
CN105255112B (zh) * 2015-10-29 2017-11-21 国家纳米科学中心 一种环氧树脂富勒烯复合材料及其制备方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331539A (ja) * 1999-05-21 2000-11-30 Hitachi Cable Ltd 耐インバータサージエナメル線
JP2005097329A (ja) * 2003-08-28 2005-04-14 Mitsubishi Chemicals Corp フラーレン誘導体を含有する組成物、並びに前記組成物を用いた塗膜及び粉体の製造方法
JP2005179480A (ja) * 2003-12-18 2005-07-07 Sumitomo Bakelite Co Ltd 絶縁材用樹脂組成物及びこれを用いた絶縁材
JP2006160799A (ja) * 2004-12-02 2006-06-22 Toyota Industries Corp 塗料組成物、塗料組成物を用いた摺動層の製造方法および摺動層を有する摺動部材
JP2007145894A (ja) * 2005-11-24 2007-06-14 Tamagawa Gakuen 複層摺動部材
US20100101828A1 (en) * 2008-10-28 2010-04-29 Magnekon, S. A. De C. V. Magnet wire with coating added with fullerene-type nanostructures
JP2016017063A (ja) * 2014-07-10 2016-02-01 国立大学法人大阪大学 長鎖アルキルエーテル化フラーレン誘導体およびその製造方法、並びにそれを用いた樹脂組成物
EP3141539A1 (en) * 2015-09-11 2017-03-15 Totai Co. Ltd. Long-chain alkyl-etherified fullerene derivative, production method for the same, and resin composition using the same
JP2018177895A (ja) * 2017-04-07 2018-11-15 昭和電工株式会社 樹脂組成物、絶縁ワニス及びその用途

Also Published As

Publication number Publication date
WO2021100881A2 (ja) 2021-05-27
DE112021002076T5 (de) 2023-01-26
KR20220161548A (ko) 2022-12-06
JPWO2021100881A1 (ja) 2021-05-27
CN115244135A (zh) 2022-10-25
US20230041408A1 (en) 2023-02-09

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