WO2021082696A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2021082696A1
WO2021082696A1 PCT/CN2020/111814 CN2020111814W WO2021082696A1 WO 2021082696 A1 WO2021082696 A1 WO 2021082696A1 CN 2020111814 W CN2020111814 W CN 2020111814W WO 2021082696 A1 WO2021082696 A1 WO 2021082696A1
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Prior art keywords
pressure
circuit board
flexible circuit
middle frame
electronic device
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PCT/CN2020/111814
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English (en)
French (fr)
Inventor
王绪军
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维沃移动通信有限公司
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Publication of WO2021082696A1 publication Critical patent/WO2021082696A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof

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  • the embodiment of the present invention relates to the technical field of communication applications, and in particular to an electronic device.
  • the common implementation of pressure-sensitive buttons is based on the strain principle of resistive pressure sensors.
  • the pressure sensor is attached to the side wall of the middle frame. When the user presses the middle frame, the pressure is detected by detecting the deformation of the pressure-sensitive adhesive of the sensor.
  • the sensor pressure-sensitive adhesive As a pressure-sensitive material, the sensor pressure-sensitive adhesive has the material characteristics of thermal expansion and contraction. When the ambient temperature around the sensor is unstable or changes sharply, it will have a greater impact on the pressure performance and make the pressure performance worse, such as high temperature. It is easy to cause problems such as delayed release and insensitivity of pressing.
  • the embodiment of the present invention provides an electronic device to solve the problem that the pressure performance of the existing pressure-sensitive key is degraded when the ambient temperature of the sensor is unstable or changes sharply.
  • the present invention is implemented as follows:
  • An embodiment of the present invention provides an electronic device, including:
  • a pressure sensor module connected to the middle frame
  • the temperature shielding layer is arranged between the pressure sensor module and the middle frame.
  • the temperature shielding layer is provided between the pressure sensor module connected to the middle frame of the electronic device and the middle frame, which can effectively improve the influence of external temperature changes on the pressure sensor, thereby solving the problem of the electronic device
  • FIG. 1 is one of the schematic structural diagrams of an electronic device provided by an embodiment of the present invention.
  • Fig. 2 is a second structural diagram of an electronic device provided by an embodiment of the present invention.
  • the electronic device includes: a middle frame 1; a pressure sensor module 2 connected to the middle frame 1; a temperature shielding layer 3 arranged between the pressure sensor module 2 and the middle frame 1.
  • the pressure sensor module 2 includes: a steel sheet 4; a first flexible circuit board 5 disposed between the middle frame 1 and the steel sheet 4, the first flexible circuit board 5 is connected to the inner side wall of the middle frame 1, and the first flexible circuit board 5 is connected to the inner side wall of the middle frame 1.
  • a flexible circuit board 5 is provided with a first pressure-sensitive member 6; a second flexible circuit board 7, a steel sheet 4 is located between the first flexible circuit board 5 and the second flexible circuit board 7, and the second flexible circuit board 7 is provided with a first Two pressure-sensitive parts 8, wherein the first pressure-sensitive part 6 and the second pressure-sensitive part 8 are arranged opposite to each other.
  • first pressure-sensitive member 6 and the second pressure-sensitive member 8 are both pressure-sensitive adhesives.
  • first pressure-sensitive member 6 is printed on the first flexible circuit board 5
  • second pressure-sensitive member 8 is printed on the second flexible circuit board 7.
  • the pressure-sensitive adhesive is a resistive pressure-sensitive material with a special material, and its impedance will change when it is deformed.
  • the working principle of pressure sensing is specifically as follows: when the user presses the middle frame 1, the pressure-sensitive adhesive in the middle frame 1 and the pressure sensor module 2 inside it will be deformed. The position of the element 8 is different, and the impedance change caused by its deformation is also different. By detecting the resistance/voltage change of the first pressure-sensitive element 6 and the second pressure-sensitive element 8, the pressure is calculated by an algorithm.
  • Pressure sensitive adhesive is very sensitive to temperature. When the temperature of the whole machine is high, when the user presses the middle frame, the temperature of the finger is lower than the temperature of the electronic device case, and the low temperature load is transmitted to the pressure sensor module 2 through the middle frame.
  • the first pressure-sensitive part 6 pressure-sensitive adhesive
  • the temperature shielding layer 3 is located between the inner side wall of the middle frame 1 and the first flexible circuit board 4.
  • the material used for the temperature shielding layer 3 is a heat-insulating material or a heat-conducting material.
  • the temperature shielding layer 3 can use a PGS graphite film with a fast thermal conductivity function, with a thermal conductivity of 151, which can quickly guide the temperature on the middle frame area near the pressure sensor module 2 to other parts of the middle frame 1. Area, to achieve thermal equilibrium, thereby reducing the temperature transfer to the inside, which affects the pressure sensor module 2.
  • the temperature shielding layer 3 can also use a temperature insulating film with a good heat shielding effect to isolate the temperature from transferring to the inside and affecting the pressure sensor module 2.
  • the inner side wall of the middle frame 1 and the first flexible circuit board 5 are connected by a double-sided adhesive layer 9, and the temperature shielding layer 3 is provided between the first flexible circuit board 5 and the double-sided adhesive layer 9 ,As shown in Figure 1.
  • the inner side wall of the middle frame 1 and the first flexible circuit board 5 are connected by a double-sided adhesive layer 9, and the temperature shielding layer 3 is provided between the middle frame 1 and the double-sided adhesive layer 9, that is, the figure The position of the double-sided adhesive layer 9 in 1 and the position of the temperature shielding layer 3 are exchanged.
  • a protrusion 10 is provided on the inner side wall of the middle frame 1; the protrusion 10 is provided with a first groove 11, and the groove of the first groove 11 The port is opposite to the first pressure-sensitive member 6, and the raised portion 10 is connected to the first flexible circuit board 5 through the double-sided adhesive layer 9; wherein, the first groove 11 and the first flexible circuit board 5 are enclosed to form a temperature shielding layer 3.
  • the double-sided adhesive layer 9 is provided with a first through hole 12, the first through hole 12 is opposite to the first groove 11, the first groove 11, the first through hole 12 and the first flexible
  • the circuit board 5 is enclosed to form a temperature shielding layer 3.
  • the convex portion 10 is opened
  • the temperature shielding layer 3 is formed by enclosing the first groove 11, that is, by designing a layer of space, the temperature shielding layer 3 is formed, so that the first pressure-sensitive member 6 does not directly contact the middle frame 1, and the temperature shielding layer can isolate
  • the temperature is transmitted to the first pressure-sensitive part 6, so as to avoid a temperature difference between the first pressure-sensitive part 6 and the second pressure-sensitive part 8, which affects normal pressure detection.
  • the temperature shielding layer 3 may be a vacuum insulation layer.
  • the electronic device provided by the embodiment of the present invention can effectively improve the influence of external temperature changes on the pressure sensor through the device temperature shielding layer between the pressure sensor module connected to the middle frame of the electronic device and the middle frame, thereby solving the problem of the electronic device
  • the temperature shielding layer described in the above embodiments of the present invention is not limited to thermally conductive materials, heat dissipation materials, or structural design changes, etc., and any design that adds a temperature shielding layer to the pressure sensor module to solve the temperature effect is in the present invention Within the scope of protection.

Abstract

本发明提供一种电子设备。该电子设备包括：中框；与中框连接的压力传感器模组；设置于压力传感器模组外部或压力传感器模组内的温度屏蔽层。

Description

电子设备
相关申请的交叉引用
本申请主张在2019年10月28日在中国提交的中国专利申请号No.201911031670.9的优先权，其全部内容通过引用包含于此。
技术领域
本发明实施例涉及通信应用技术领域，尤其涉及一种电子设备。
背景技术
目前市场上已有较多手机通过压力检测的方式来替代传统的实体按键，这样可以让手机的机身更加一体化，更加美观。而且，通过引入压力检测技术还可以增加手机对游戏方面的支持和体验，压力按键在未来会有更多的发挥空间。
压感按键常见的实现方式为电阻式压力传感器应变原理，压力传感器贴在中框的侧壁，用户按压中框时，通过检测传感器感压胶形变量来检测压力大小。传感器感压胶作为一种感压材料，具有热胀冷缩的材料特性，当传感器周边环境温度不稳定或者急剧变化时，就会对压力性能产生较大影响，使得压力性能变差，比如高温时容易导致按压延迟释放、不灵敏等问题的发生。
发明内容
本发明实施例提供一种电子设备，以解决现有压感按键在传感器周边环境温度不稳定或者急剧变化时压力性能变差的问题。
为了解决上述技术问题，本发明是这样实现的：
本发明的实施例提供了一种电子设备，包括：
中框；
与所述中框连接的压力传感器模组；
温度屏蔽层，设置于所述压力传感器模组与所述中框之间。
本发明实施例的上述方案中，通过在与电子设备的中框连接的压力传感 器模组与该中框之间设置温度屏蔽层，能够有效改善外界温度变化对压力传感器的影响，从而解决电子设备的压力按键在传感器周边环境温度不稳定或者急剧变化时压力性能变差的问题，提升压力按键的稳定性和耐用性。
附图说明
图1为本发明实施例提供的电子设备的结构示意图之一；
图2为本发明实施例提供的电子设备的结构示意图之二。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1～图2所示，该电子设备包括：中框1；与中框1连接的压力传感器模组2；温度屏蔽层3，设置于压力传感器模组2与中框1之间。
较优地，压力传感器模组2包括：钢片4；设置于中框1与钢片4之间的第一柔性电路板5，第一柔性电路板5与中框1的内侧壁连接，第一柔性电路板5设有第一感压件6；第二柔性电路板7，钢片4位于第一柔性电路板5与第二柔性电路板7之间，第二柔性电路板7设有第二感压件8，其中，第一感压件6与第二感压件8相对设置。
具体的，第一感压件6和第二感压件8均为感压胶。这里，第一感压件6印刷于第一柔性电路板5上，第二感压件8印刷于第二柔性电路板7上。
这里，感压胶为一种特殊材质的电阻式感压材料，发生形变时其阻抗会发生变化。其中，压力感应工作原理具体为：用户按压中框1时，会引起中框1及其内部的压力传感器模组2中的感压胶发生形变，由于第一感压件6和第二感压件8所处位置不同，其发生形变引起的阻抗变化也不同，通过检测第一感压件6和第二感压件8电阻/电压的变化，通过算法计算出压力的大小。
下面具体说明压感按键在传感器周边环境温度不稳定或者急剧变化时压 力性能变差的原因：
感压胶对温度很敏感，在整机温度较高的情况下，当用户手指按压中框时，手指温度低于电子设备机壳温度，低温载荷通过中框传递到压力传感器模组2中的第一感压件6(感压胶)，使第一感压件6与第二感压件8存在温差，从而影响正常的压力检测，具体可表现为高温时按压延迟释放、不灵敏的问题。
为了解决上述问题，作为一可选的实现方式，如图1所示，该温度屏蔽层3位于中框1的内侧壁与第一柔性电路板4之间。
需要说明的是，本实施例中，该温度屏蔽层3采用的材料为隔热材料或导热材料。
例如，该温度屏蔽层3可采用具有快速导热功能的PGS石墨膜，其导热系数为151，可以快速将压力传感器模组2附近的中框区域上的温度导走，导到中框1的其他区域，达到热平衡，从而减小温度往内部传递，影响压力传感器模组2。
还有，该温度屏蔽层3还可采用具有良好热屏蔽作用的温度绝缘膜，隔绝温度往内部传递影响压力传感器模组2。
基于本实施例，可选地，中框1的内侧壁与第一柔性电路板5通过双面胶层9连接，温度屏蔽层3设于第一柔性电路板5与双面胶层9之间，如图1所示。
或者，可选地，中框1的内侧壁与第一柔性电路板5通过双面胶层9连接，温度屏蔽层3设于中框1与双面胶层9之间，也就是，将图1中双面胶层9的位置与温度屏蔽层3的位置相交换。
基于本实施例，可选地，如图2所示，中框1的内侧壁上设有凸起部10；凸起部10上开设有第一凹槽11，该第一凹槽11的槽口与第一感压件6相对，凸起部10通过双面胶层9与第一柔性电路板5相连接；其中，第一凹槽11和第一柔性电路板5围合形成温度屏蔽层3。
进一步地，如图2所示，双面胶层9开设有第一通孔12，第一通孔12与第一凹槽11相对，第一凹槽11、第一通孔12和第一柔性电路板5围合形成温度屏蔽层3。
本实施例中，通过更改电子设备的中框结构，即在中框内部增加凸点支撑位，即凸起部10，如此，通过第一柔性电路板5、所述凸起部10上开设的第一凹槽11围合形成温度屏蔽层3，即通过设计一层隔空层，形成该温度屏蔽层3，使得第一感压件6不与中框1直接接触，该温度屏蔽层能够隔绝温度向第一感压件6上传递，从而能够避免第一感压件6与第二感压件8之间产生温差，影响正常的压力检测。
本实施例中，具体的，该温度屏蔽层3可以为真空绝热层。
本发明实施例提供的电子设备，通过在与电子设备的中框连接的压力传感器模组与该中框之间设备温度屏蔽层，能够有效改善外界温度变化对压力传感器的影响，从而解决电子设备的压力按键在传感器周边环境温度不稳定或者急剧变化时压力性能变差的问题，提升压力按键的稳定性和耐用性。
需要说明的是，本发明上述实施例中所述的温度屏蔽层不局限于导热材料、散热材料或者结构设计更改等，凡是对压力传感器模组增加温度屏蔽层解决温度影响的设计均在本发明保护范围内。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本发明的保护之内。

Claims (10)

  1. 一种电子设备，其特征在于，包括：
    中框；
    与所述中框连接的压力传感器模组；
    温度屏蔽层，设置于所述压力传感器模组与所述中框之间。
  2. 根据权利要求1所述的电子设备，其特征在于，所述压力传感器模组包括：
    钢片；
    设置于所述中框和所述钢片之间的第一柔性电路板，所述第一柔性电路板与所述中框的内侧壁连接，所述第一柔性电路板设有第一感压件；
    第二柔性电路板，所述钢片位于所述第一柔性电路板与所述第二柔性电路板之间，所述第二柔性电路板设有第二感压件；
    其中，所述第一感压件与所述第二感压件相对设置。
  3. 根据权利要求2所述的电子设备，其特征在于，所述温度屏蔽层位于所述中框的内侧壁与所述第一柔性电路板之间。
  4. 根据权利要求3所述的电子设备，其特征在于，所述中框的内侧壁与所述第一柔性电路板通过双面胶层连接，所述温度屏蔽层设于所述第一柔性电路板与所述双面胶层之间。
  5. 根据权利要求3所述的电子设备，其特征在于，所述中框的内侧壁与所述第一柔性电路板通过双面胶层连接，所述温度屏蔽层设于所述中框与所述双面胶层之间。
  6. 根据权利要求3所述的电子设备，其特征在于，所述中框内侧壁上设有凸出部，所述凸出部上开设有第一凹槽，所述第一凹槽的槽口与所述第一感压件相对，所述凸出部通过双面胶层与所述第一柔性电路板相连接；
    其中，所述第一凹槽和所述第一柔性电路板围合形成所述温度屏蔽层。
  7. 根据权利要求6所述的电子设备，其特征在于，所述双面胶层开设有第一通孔，所述第一通孔与所述第一凹槽相对，所述第一凹槽、所述第一通孔和所述第一柔性电路板围合形成所述温度屏蔽层。
  8. 根据权利要求2所述的电子设备，其特征在于，所述第一感压件和所述第二感压件均为感压胶。
  9. 根据权利要求4或5所述的电子设备，其特征在于，所述温度屏蔽层采用的材料为隔热材料或者导热材料。
  10. 根据权利要求6或7所述的电子设备，其特征在于，所述温度屏蔽层为真空绝热层。
PCT/CN2020/111814 2019-10-28 2020-08-27 电子设备 WO2021082696A1 (zh)

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