WO2021082183A1 - Dustproof structure and manufacturing method therefor - Google Patents

Abstract

Disclosed are a dustproof structure and a manufacturing method therefor. The dustproof structure is used for carrying out dustproofing for a sensor, and the sensor comprises a housing and a sensing unit arranged inside the housing, wherein the housing is provided with a communicating hole, the communicating hole is in communication with the sensing unit and the external environment, and a dustproof portion of the dustproof structure covers the communicating hole. The manufacturing method for the dustproof structure comprises the following steps: providing a substrate, and arranging a release film on a surface of the substrate; carrying out deposition on a surface of the release film to form a metal layer; forming a plurality of dustproof net holes in the metal layer by means of laser drilling, wherein the plurality of dustproof net holes jointly form a dustproof portion; and separating the metal layer on which the dustproof portion is formed from the release film. According to the technical solution of the present invention, the dustproof structure has a good dustproof function, can allow a dustproof sensor to communicate with the external environment, and guarantees the detection sensitivity and the measurement accuracy of the sensor.

Description

Dust-proof structure and manufacturing method thereof Technical field

The invention relates to the technical field of sensors, in particular to a dust-proof structure and a manufacturing method thereof.

Background technique

The sensor core of an open sensor (such as a microphone sensor, a thermometer and hygrometer, etc.) needs to be connected to the external environment to be able to perceive changes in the surrounding environment. In order to facilitate the communication between the core of the sensor and the external environment, a communication hole is generally provided. When the core of the sensor communicates with the external environment, environmental foreign objects (such as solid pollutants such as dust and dirt, and liquid pollutants such as water mist) easily enter the sensor through the communication hole, which interferes with the detection sensitivity and measurement accuracy of the sensor.

In the exemplary technology, a dust-proof structure is provided in the communication hole to prevent foreign matter from entering. However, since the sensor also needs to be connected to the external environment, the general dust-proof structure only has a dust-proof function, and cannot take into account the connection between the dust-proof parts and the external environment. This reduces the detection sensitivity and measurement accuracy of the sensor.

The above is only used to assist the understanding of the technical solutions of this application, and does not mean that they are recognized as prior art.

Summary of the invention

The main purpose of the present invention is to provide a dust-proof structure and a manufacturing method thereof, aiming to make the dust-proof structure have a better dust-proof function, and enable the dust-proof sensor to communicate with the external environment, and ensure the detection sensitivity and measurement of the sensor Accuracy.

In order to achieve the above objective, the present invention provides a method for manufacturing a dust-proof structure. The dust-proof structure is used to prevent dust from a sensor. The sensor includes a housing and a sensing unit arranged in the housing. The housing is provided with The communicating hole communicates the sensing unit and the external environment, the dustproof part of the dustproof structure covers the communicating hole, and the manufacturing method of the dustproof structure includes the following steps:

Provide a substrate, and set a release film on one surface of the substrate;

Depositing and forming a metal layer on the surface of the release film;

Laser drilling is used to make the metal layer form a plurality of dust-proof mesh holes, wherein the plurality of dust-proof mesh holes jointly form a dust-proof part;

Separate the metal layer forming the dust-proof part and the release film from each other.

In some embodiments of the present invention, the step of drilling a metal layer to form a plurality of dust-proof meshes by laser drilling includes:

Preset the processing path of the laser to the metal layer;

Start the laser at the first power to form the first laser beam;

Focusing the laser focus of the first laser beam on the surface of the metal layer away from the release film;

Scan the metal layer through a galvanometer, and use a first laser beam to ablate the metal layer according to the processing path to form the dust-proof mesh.

In some embodiments of the present invention, the step of presetting the processing path of the metal layer by the laser includes:

Obtain image information of at least three marking points on the surface to be processed;

Confirming the offset of the marking point according to the image information of at least three of the marking points and the image information of the preset marking point;

Adjusting the initial processing position of the laser according to the offset of the marking point;

The laser processes the metal layer along a preset processing path according to the adjusted initial processing position.

In some embodiments of the present invention, the step of scanning the metal layer through a galvanometer and using a first laser beam to ablate the metal layer to form the dust-proof mesh further includes:

Obtain the image of the hole of the dust-proof mesh of the dust-proof part after processing;

Detecting whether the orifice of the dust-proof mesh has burrs according to the image;

If so, remove the burrs.

In some embodiments of the present invention, after the step of forming a plurality of dust-proof mesh holes in the metal layer by laser drilling, wherein the plurality of dust-proof mesh holes together form a dust-proof part, the dust-proof part will be formed Before the step of separating the metal layer and the release film from each other, it also includes:

Form the first slit in the metal layer around the dustproof part;

Set a support material layer on the metal layer and process it to form a support part;

A mounting board is arranged on the side of the support part away from the metal layer.

In some embodiments of the present invention, the step of disposing a support material layer on the metal layer and processing to form the support portion includes:

Coating supporting material on the surface of the metal layer and forming a supporting material layer;

Start the laser at the second power to form a second laser beam;

Focusing the laser focus of the second laser beam on the surface of the support material layer away from the metal layer;

Scan the support material layer through a galvanometer, and use a second laser beam to ablate the support material layer, so that the support material layer forms an opening that exposes the dust-proof part, and forms a second slit that exposes the first slit ,Get the support part.

In some embodiments of the present invention, the step of separating the metal layer forming the dust-proof part and the release film from each other includes:

Processing the surface where the release film and the metal layer are bonded to each other to remove viscosity;

Control the separation of the metal layer forming the dust-proof part from the release film that has lost its adhesion.

In some embodiments of the present invention, after the step of controlling the separation of the metal layer forming the dust-proof part from the release film that loses its viscosity, the method further includes:

When the metal layer is provided with a first slit, the supporting part is provided with a second slit, and the dust-proof structure is provided with a mounting plate, the cutting device is controlled to cut along the extension path of the first slit and the second slit The placement board.

In some embodiments of the present invention, the thickness of the metal layer is less than 2um;

And/or, the hole diameter of the dust-proof mesh is less than 3um;

And/or, the distance between two adjacent dust-proof mesh holes is less than 1um.

The present invention also provides a dust-proof structure, the dust-proof structure is manufactured by the above-mentioned method for manufacturing the dust-proof structure, the dust-proof structure is used for dust-proofing the sensor, and the sensor includes a housing and a sensor arranged in the housing. The housing is provided with a communicating hole, the communicating hole communicates the sensing unit and the external environment, the dustproof part of the dustproof structure covers the communicating hole, and the manufacturing method of the dustproof structure includes The following steps:

Provide a substrate, and set a release film on one surface of the substrate;

Depositing and forming a metal layer on the surface of the release film;

Laser drilling is used to make the metal layer form a plurality of dust-proof mesh holes, wherein the plurality of dust-proof mesh holes jointly form a dust-proof part;

Separate the metal layer forming the dust-proof part and the release film from each other.

The technical solution of the present invention is to provide a release film on one surface of a substrate, and deposit a metal layer on the surface of the release film away from the substrate, and then perforate the metal layer to form a plurality of dust-proof mesh holes, wherein , A plurality of dust-proof mesh holes together form a dust-proof part, and then the release film and substrate are removed to form a dust-proof structure. When needed, the dust-proof structure is placed in the communicating hole of the sensor, and the dust-proof structure is The dustproof part covers the communicating hole, so that solid or liquid foreign matter in the external environment cannot enter the sensor from the communicating hole, and the sensing unit in the sensor housing can still pass through the hollow part of the dustproof mesh to sense The change of the external environment ensures the detection sensitivity of the sensor and the accuracy of the measurement. In this way, the technical solution of the present invention can make the dust-proof structure have better dust-proof function, and can make the dust-proof sensor communicate with the external environment, and ensure the detection sensitivity of the sensor and the accuracy of the measurement.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on the structure shown in these drawings.

1 is a schematic structural view of an embodiment in a state where the substrate, the release film, the metal layer, the supporting part and the placement plate are not separated in the manufacturing method of the dust-proof structure of the present invention;

2 is a schematic diagram of another embodiment of the method for manufacturing the dust-proof structure of the present invention, the substrate, the release film, the metal layer, the supporting part and the mounting plate are rotated 180° and are in a separated state;

Figure 3 is a top view of an embodiment of the dustproof structure of the present invention;

4 is a top view of an embodiment of the dustproof structure of the present invention installed on the sensor;

Fig. 5 is a flow chart of an embodiment of a method for manufacturing a dust-proof structure of the present invention;

Fig. 6 is a flow chart of another embodiment of the manufacturing method of the dust-proof structure of the present invention;

FIG. 7 is a flow chart of another embodiment of the manufacturing method of the dust-proof structure of the present invention;

Fig. 8 is a flow chart of another embodiment of the manufacturing method of the dust-proof structure of the present invention;

9 is a flow chart of another embodiment of the manufacturing method of the dust-proof structure of the present invention;

Fig. 10 is a flow chart of another embodiment of the manufacturing method of the dust-proof structure of the present invention;

11 is a flow chart of another embodiment of the manufacturing method of the dust-proof structure of the present invention;

Fig. 12 is a flow chart of another embodiment of the manufacturing method of the dust-proof structure of the present invention.

Attached icon number description:

Label	name	Label		name
1000	sensor	1031	First seam
100	Dust-proof structure	104	Support
10	Dustproof Department	1041	Perforation
11	Dustproof mesh	1042	Second slit
20	Fixed part	105	Placement board
101	Substrate	200	case
102	Release film	210	Connecting hole
103	Metal layer	300	Sensing unit

The realization of the objectives, functional characteristics and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between components in a specific posture (as shown in the accompanying drawings). If the relative position relationship, movement situation, etc. change, the directional indication will change accordingly.

In addition, descriptions related to "first", "second", etc. in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on what can be achieved by a person of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that this combination of technical solutions does not exist , Is not within the protection scope of the present invention.

1, 2, 4, and 5, the present invention proposes a method for fabricating a dust-proof structure 100. The dust-proof structure 100 is used for dust-proofing a sensor 1000, and the sensor 1000 includes a housing 200 and a housing 200 arranged in the housing. The sensing unit 300 in the body 200, the housing 200 is provided with a communication hole 210 that communicates the sensing unit 300 and the external environment, and the dust-proof part 10 of the dust-proof structure 100 covers the Connecting holes 210, the manufacturing method of the dust-proof structure 100 includes the following steps:

Step S10, a substrate 101 is provided, and a release film 102 is provided on one surface of the substrate 101; in some embodiments of the present invention, the shape of the substrate 101 can be determined according to actual production conditions, and the material of the substrate 101 can include, for example, glass material , Metal materials or plastic materials (such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI)) or Various substrates can be formed as long as they can support the components of the dust-proof structure 100 and facilitate light transmission and/or heat transfer. The release film 102 is an auxiliary film material for thermal transfer. The substrate is generally PET, and the conventional thickness is 12um-100um. In one embodiment, the hot and cold tear-off film 102 can be used, and the release film 102 can be used when needed. The film 102 may be attached to the surface of the substrate 101.

In step S20, a metal layer 103 is deposited on the surface of the release film 102; in some embodiments of the present invention, the metal layer 103 can be deposited by a sputtering process or the metal layer 103 can be deposited by a pulsed laser deposition method. Specifically, an alloy target can be used to pass argon gas for sputtering to form the metal layer 103. The thickness of the metal layer 103 can be less than 2um. When the thickness of the metal layer 103 is greater than 2um, the dust-proof structure 100 can be caused. On the one hand, it will occupy the installation space inside the sensor 1000, which is not conducive to the miniaturization of the sensor 1000. On the other hand, when the thickness of the metal layer 103 is large, the amount of production materials required for processing will increase, which increases Production cost and processing cost, and the thickness of the metal layer 103 is larger. After the subsequent formation of the dust-proof mesh 11, the depth of the dust-proof mesh 11 will also be deeper, which increases the transmission of changes in the external environment to the sensor 1000. The noise of the unit 300 reduces the detection sensitivity and measurement accuracy of the sensing components of the sensor 1000. When the thickness of the metal layer 103 is less than 2um, on the one hand, it will not occupy much installation space inside the sensor 1000, which is conducive to the miniaturization of the sensor 1000, and can ensure the dustproof function of the dustproof structure 100. On the other hand, When the thickness of the metal layer 103 is less than 2um, the amount of production materials required for processing will not be too much, which reduces the production cost and processing cost, and the thickness of the metal layer 103 is small. After the subsequent formation of the dust-proof mesh 11, The depth of the dust-proof mesh 11 will also be shallow, which reduces the noise transmitted to the sensing unit 300 of the sensor 1000 from changes in the external environment, and improves the detection sensitivity and measurement accuracy of the sensing components of the sensor 1000. It is understandable that the thickness of the metal layer 103 can also be specifically 50 nm, 80 nm, 100 nm, 300 nm, 500 nm, 700 nm, 1000 nm, 1200 nm, 1500 nm, 1800 nm, etc., or a value between any two of the foregoing. In this way, the protection can be guaranteed. The dust structure 100 has a better dustproof function, and improves the detection sensitivity and measurement accuracy of the sensing component of the sensor 1000.

Step S30, the metal layer 103 is drilled by laser to form a plurality of dust-proof meshes 11, wherein the plurality of dust-proof meshes 11 together form the dust-proof part 10; laser drilling is a laser drilling process, which is mainly used The laser beam performs photothermal ablation and photochemical ablation to quickly remove the substrate 101 material to be processed. Photothermal ablation means that the processed material absorbs high-energy laser light, which is heated to melt and evaporate into holes in a very short time. Photochemical ablation refers to the high photon energy in the ultraviolet region, which destroys the long molecular chains of organic materials and becomes smaller particles. The energy is greater than the force of the original molecules. Under the external force, the substrate 101 material is quickly removed. Form micropores. In addition, laser drilling can be carried out on various materials such as hard, brittle, and soft, and the drilling has no tool loss. As a result, the metal layer 103 better forms the dust-proof mesh 11, and the plurality of dust-proof meshes 11 form the dust-proof part 10, so that the dust-proof part 10 covers the communicating hole 210, so that the communicating hole 210 has a dustproof function and prevents Foreign objects have entered. It can be understood that the outer contour of the dust-proof portion 10 is substantially the same as the outer contour of the cross section of the communicating hole 210, so as to ensure the utilization rate of the dust-proof portion 10 and reduce the processing cost.

In step S40, the metal layer 103 forming the dust-proof portion 10 and the release film 102 are separated from each other. In this embodiment, different operations can be performed according to different types of release film 102 to remove the adhesion between the metal layer 103 and the release film 102, so that the release film 102 initially used to carry the metal layer 103 is processed and completed. The metal layer 103 with the dustproof portion 10 is separated.

It should be noted that the housing 200 of the sensor 1000 may be provided with a plurality of communicating holes 210 under the condition of ensuring the structural strength, and the plurality of communicating holes 210 may be arranged at intervals (may be arranged in a circular array or along a straight line). Orientation, as long as it is convenient for the sensing of the sensor 1000), providing multiple communication holes 210 can increase the contact area of the sensing unit 300 of the sensor 1000 with the external environment, and better allow the sensing unit 300 of the sensor 1000 to sense The condition of the external environment improves the detection sensitivity and measurement accuracy of the sensing unit 300 of the sensor 1000. When the housing 200 has multiple communicating holes 210, the number of the dust-proof structure 100 may be multiple. At this time, the dust-proof portion 10 of one dust-proof structure 100 may cover the multiple communicating holes 210, and/or A dust-proof structure 100 covers a communication hole 210, as long as it is convenient to prevent foreign matter from entering the sensor 1000 from the communication hole 210 to ensure the normal operation of the sensor 1000.

In the technical solution of the present invention, a release film 102 is provided on one surface of the substrate 101, and a metal layer 103 is deposited on the surface of the release film 102 away from the substrate 101, and then a plurality of protective films are formed on the metal layer 103 by laser drilling. The dust-proof mesh 11, wherein a plurality of dust-proof meshes 11 jointly form the dust-proof part 10, and then the metal layer 103 and the release film 102 forming the dust-proof part 10 are separated from each other, thereby forming a dust-proof part with the dust-proof part 10 In the structure 100, when needed, the dust-proof structure 100 is placed in the communicating hole 210 of the sensor 1000, and the dust-proof portion 10 of the dust-proof structure 100 is covered with the communicating hole 210, so that solid foreign objects or Liquid foreign matter cannot enter the inside of the sensor 1000 from the communicating hole 210, and the sensing unit 300 in the housing 200 of the sensor 1000 can still pass through the hollow part of the dust-proof mesh 11 to sense changes in the external environment, ensuring the detection sensitivity of the sensor 1000 and The accuracy of the measurement. In this way, the technical solution of the present invention can enable the dust-proof structure 100 to have a better dust-proof function, and enable the dust-proof sensor 1000 to communicate with the external environment, and ensure the detection sensitivity and measurement accuracy of the sensor 1000.

Referring to FIG. 6, in some embodiments of the present invention, the step of forming a plurality of dust-proof mesh holes 11 in the metal layer 103 by laser drilling includes:

Step S31, preset the processing path of the laser to the metal layer 103; in this embodiment, the time and moving speed mapping table is established in the storage device of the electric control board that controls the laser in advance, and the electric control board receives the input control After the signal, look up the table to determine the moving speed corresponding to the time; for example, if the control signal A1 is received, look up the correspondence between the time and the moving speed according to the control signal.

Step S32, start the laser at the first power to form a first laser beam; different material layers have different materials, so that the laser has different ablation effects. When processing the metal layer 103, a fixed first power is used It can ensure that the depth of laser ablation is consistent, and the yield of products is guaranteed. In an embodiment, the value of the first power may be 1W-8W, specifically 2W, 3W, 4W, 5W, 6W, 7W, etc., which can ensure a better processing effect on the metal layer 103.

Step S33, focus the laser focus of the first laser beam on the surface of the metal layer 103 away from the release film 102; focus the laser focus on the upper surface of the metal layer 103, and process through the focus of the laser to make the processing result It is more precise and facilitates the production of products.

Step S34, scanning the metal layer 103 through a galvanometer, and using a first laser beam to ablate the metal layer 103 according to the processing path to form the dust-proof mesh 11. In one embodiment, the scanning speed of the galvanometer can be 100mm-8000mm/s. After scanning by the galvanometer, the laser is controlled to use the first laser beam to ablate the metal layer 103 according to the processing path. The preset processing path controls the ablation. The ablation time and the ablation movement speed can control the size of the aperture formed by the dust-proof mesh 11 and the distance between the holes, and the specific parameters can be set according to the actual needs of the user.

In one embodiment, the aperture of the dust-proof mesh 11 is less than 3um. When the aperture of the dust-proof mesh 11 is greater than 3um, solid pollutants and liquid pollutants with a diameter greater than 3um can enter the sensor 1000 from the dust-proof mesh 11 Internally, the distance between the two electrodes of the adjacent capacitors of the sensor 1000 is generally 3um. After foreign objects with a diameter greater than 3um enter, the two electrodes of the capacitor may be connected, and this will cause the capacitor to fail. When the aperture of the dust-proof mesh 11 is less than 3um, solid pollutants and liquid pollutants with a diameter greater than 3um cannot enter the sensor 1000 from the dust-proof mesh 11, and the distance between the two electrodes of the adjacent capacitor of the sensor 1000 is normal It is 3um. After foreign objects with a diameter of less than 3um enter, the two electrodes of the capacitor will not be connected. In this way, the normal operation of the capacitor can be ensured. It is understandable that the pore size of the dust-proof mesh 11 can also be 50nm, 80nm, 100nm, 300nm, 500nm, 700nm, 1000nm, 1200nm, 1500nm, 1800nm, 2000nm, 2200nm, 12500nm, 2800nm, etc., or any of the foregoing. In this way, solid pollutants and liquid pollutants with a diameter greater than 3um can be prevented from entering the sensor 1000 from the dust-proof mesh 11, so as to ensure the normal operation of the capacitor.

In one embodiment, the distance between two adjacent dust-proof mesh holes 11 is less than 1um. It should be noted that the two adjacent dust-proof mesh holes 11 are the closest distances between the outer edges of the two dust-proof mesh holes 11 ( It can be the vertical distance of the tangent in the radial direction). If the distance between two adjacent dust-proof meshes 11 is greater than 1um, the distance between the dust-proof meshes 11 in the dust-proof part 10 will be larger, which is not conducive to maintenance. A higher through hole rate reduces the contact area of the sensing unit 300 of the sensor 1000 with the external environment, and reduces the sensing sensitivity and sensing accuracy of the sensing unit 300. When the distance between two adjacent dust-proof mesh holes 11 is less than 1um, the distance between the dust-proof mesh holes 11 in the dust-proof part 10 can be made smaller. In a limited area, it is beneficial for the dust-proof part 10 to maintain a relatively long distance. It has a high through hole rate and a good dust-proof effect, so that the sensing unit 300 of the sensor 1000 guarantees the contact area with the external environment, and guarantees the sensing sensitivity and the sensing accuracy of the sensing unit 300. It is understandable that the distance between two adjacent dust-proof mesh holes 11 can also be 100nm, 300nm, 500nm, 700nm, 900nm, etc., so that the sensing unit 300 of the sensor 1000 can ensure the contact area with the external environment and ensure the sensing The sensing sensitivity and sensing accuracy of the sensing unit 300.

By forming the dust-proof mesh 11 on the metal layer 103 by a laser drilling process, the dust-proof mesh 11 can block some external foreign objects (foreign objects that affect the normal operation of the sensor 1000) from entering the inside of the sensor 1000, and the sensing unit 300 of the sensor 1000 The change of the external environment can be sensed through the hollow part of the dust-proof mesh 11, which ensures the normal operation of the sensor 1000. In addition, the production efficiency and yield rate of the laser drilling technology are relatively high, which is convenient for mass production of the dust-proof structure 100.

Referring to FIG. 7, in some embodiments of the present invention, the step of presetting the processing path of the metal layer 103 by the laser includes:

Step S311, acquiring image information of at least three marking points on the surface to be processed; in this embodiment, after the metal layer 103 is deposited, the entire surface to be processed is collected by an image sensor device (specifically, an image sensor 1000 or a camera, etc.) The marking points can be holes or protrusions formed when the metal layer 103 is deposited, or holes or protrusions provided on the substrate 101. Since three points can determine a plane, the state of the surface to be processed can be judged through the three mark points. It is understandable that the state of the surface to be processed can be judged through positioning lines or other positioning structures.

Step S312: Confirm the offset of the mark point according to the image information of the at least three mark points and the image information of the preset mark point; in one embodiment, after the image information is obtained, at least the image information can be obtained according to the image information. Two corner point information, a corner point is defined as the intersection of two edges. More strictly speaking, the local neighborhood of the corner point should have two different areas with different directions. In practical applications, most of the so-called corner detection methods detect image points with specific characteristics, not just "corners". These feature points have specific coordinates in the image and have certain mathematical features, such as local maximum or minimum gray levels, and certain gradient features. Specifically, the corner points can be obtained through the Moravec corner detection algorithm (Molavik). The algorithm detects each pixel of the image, and uses a neighborhood around the pixel as a patch (patch), and detects this patch and other surroundings The relevance of the patch. This correlation is measured by the sum of squared differences (SSD) between two patches. The smaller the SSD value, the higher the similarity. If the pixels are in the smooth image area, the surrounding patches will be very similar. If the pixel is on the edge, the surrounding patches will be very different in the direction orthogonal to the edge, and similar in the direction parallel to the edge. And if the pixel is a feature point that changes in all directions, all surrounding patches will not be very similar. Moravec will calculate the minimum SSD of each pixel patch and surrounding patches as the intensity value, and take the point with the highest local intensity as the feature point. Or use Harris corner detection algorithm or Shi-Tomasi algorithm, Shi-Tomasi algorithm is an improvement of Harris algorithm. The original definition of Harris algorithm is to subtract the determinant value of matrix M from the trace of M, and then compare the difference with a predetermined threshold. If the smaller of the two eigenvalues is greater than the minimum threshold, a corner point will be obtained. Furthermore, the coordinate information of the at least two corner points in the preset coordinate system is determined according to the at least two corner point information; specifically, the preset coordinate system may be a geodetic coordinate system, or the plane coordinates of the plane where the plane to be processed is located may be selected The system can also be established based on the location of the camera used to collect image information. The edge recognition method is used to determine the position of the corner point in each image data, and the image coordinates of each corner point in the respective image coordinate system are determined according to the position of each corner point in the corresponding image data. According to the image coordinates and The preset conversion relationship determines the coordinates of each corner point in the preset coordinate system as the coordinate information of the corresponding corner point in the preset coordinate system. Through the coordinate information of the corner points, the actual coordinate information of the marked point can be further determined.

When the actual coordinate information of the marker point is obtained, it is compared with the preset coordinate information to obtain the coordinate offset, so that the next step can be performed according to the coordinate offset of the marker point. It should be noted that there may be several situations for the offset of the coordinates. In one scenario, the actual coordinates of the three marker points are different from the preset coordinates. At this time, the difference between the preset coordinates and the actual coordinates can be obtained. The offset of the coordinate spacing. In another scenario, one of the actual coordinates of the three marker points is the same as the preset coordinates, and the other two are different from the actual coordinates. At this time, it is confirmed that the offset is the rotation angle. At this time, the actual coordinates and preset coordinates of the same marking point are selected, and a line is formed with another marking point with the same actual coordinates and preset coordinates, and the projection image is further obtained through the perspective transformation algorithm. Perspective transformation is also called projection mapping, which is an image formed by projecting an image onto another plane. In this way, the angle formed by the two connecting lines is obtained, and the angle is the rotation angle of the offset.

Step S313: Adjust the initial processing position of the laser according to the offset of the marking point; after determining the offset, if the offset is the offset of the coordinate spacing, adjust the initial position of the laser according to the value obtained by the difference, So that the laser can process the surface to be processed at a suitable initial position, and then obtain a suitable dust-proof mesh 11; or if the offset is a rotation angle, adjust the initial position of the laser according to the obtained rotation angle, so that the laser can be in a suitable position. The surface to be processed is processed at the initial position, and then a suitable dust-proof mesh 11 is obtained.

In step S314, the laser processes the metal layer 103 along a preset processing path according to the initial processing position after adjustment. Since the initial position of the laser has been adjusted, as long as the laser is processed along the preset processing path, the corresponding dust-proof mesh 11 can be obtained, which facilitates production and improves production efficiency.

In this embodiment, the image information of the surface to be processed is obtained, and then the offset of the marking point is confirmed according to the image information of the marking point and the image information of the preset marking point, and then according to the offset of the marking point Adjust the initial processing position of the laser. Due to the adjustment of the initial processing position, the laser can process the surface to be processed at a proper initial position along the preset processing path, thereby obtaining a suitable dust-proof mesh 11.

Referring to FIG. 8, in some embodiments of the present invention, after the step of scanning the metal layer 103 through a galvanometer and ablating the metal layer 103 with a first laser beam to form the dust-proof mesh 11 Also includes:

In step S50, an image of the hole of the dust-proof mesh 11 of the dust-proof part 10 after processing is acquired; after processing, a metallurgical microscope, a confocal microscope or a three-dimensional inspection can be used to detect the hole of the dust-proof mesh 11 formed by processing.

Step S60, detecting whether the opening of the dust-proof mesh 11 has burrs according to the image; because the burrs will affect the laying of the support material layer, it will be unevenly laid, so that the openings of the laser-processed dust-proof mesh 11 checking. Moreover, if the orifice has burrs, the burrs may lie across the orifice of the dust-proof mesh 11, affect the hollow part of the dust-proof mesh 11, and reduce the area of the sensing unit 300 of the sensor 1000 communicating with the external environment.

Step S70, if yes, remove the burr. In one embodiment, ultrasonic waves can be used to remove burrs. When the sound pressure reaches a certain value, the bubbles will expand rapidly and then suddenly close, and shock waves are generated when the bubbles are closed, thereby destroying the burrs.

By detecting and removing burrs, the production efficiency and production yield of the dust-proof structure 100 are improved, and the hollow area of the hollow part of the dust-proof mesh 11 is ensured, and the area of the sensing unit 300 of the sensor 1000 communicating with the external environment is increased.

Referring to FIG. 9, in some embodiments of the present invention, a plurality of dust-proof mesh holes 11 are formed in the metal layer 103 by laser drilling, wherein the plurality of dust-proof mesh holes 11 together form the dust-proof part 10 after the step Before the step of separating the metal layer 103 and the release film 102 forming the dust-proof portion 10 from each other, the method further includes:

In step S301, a first slit 1031 surrounding the dustproof portion 10 is formed on the metal layer 103; in one embodiment, after the step of coating a photoresist on the surface of the metal layer 103, the photoresist can be exposed and developed to obtain At the same time as the photoresist of the preset size of the dust-proof mesh 11, the photoresist also has the preset size of the first slit 1031. It is only necessary to adjust the light-transmitting area of the photomask during the exposure process, so that After the photoresist is developed, a photoresist with a first slit 1031 can be formed, and then the metal layer 103 can be etched to obtain the first slit 1031. Or by means of laser cutting, the metal layer 103 is cut by laser to form the first slit 1031. The provision of the first slit 1031 makes it possible to mass-produce the dust-proof structure 100, and the metal layer 103 is separated through the first slit 1031 to improve production efficiency.

In step S302, a supporting material layer is provided on the metal layer 103, and the supporting portion 104 is processed by processing; the supporting portion 104 can be provided so that the dust-proof portion 10 of the metal layer 103 may not be directly connected to the housing 200 when covering the communicating hole 210. Instead, it is connected to the housing 200 through the supporting portion 104. Since the texture of the metal layer 103 and the housing 200 may be different, the supporting portion 104 is provided to connect the housing 200 to ensure that the dust-proof portion 10 of the metal layer 103 covers the connecting hole 210. stability. The thickness of the support part 104 can be less than 50um. Since the dust-proof structure 100 needs to be adsorbed and transported after the production is completed, the thickness of the support part 104 is set to be less than 50um. The thickness of the dust-proof structure 100 is not increased, and the installation space of the dust-proof structure 100 is reduced. It is understandable that the thickness of the support part 104 can also be 25um, 30um, 35um, 40um, 45um, etc., or a value between any of the foregoing, which can facilitate suction nozzle adsorption on the one hand, but not on the other hand. The thickness of the dust-proof structure 100 will be larger, and the installation space of the dust-proof structure 100 will be reduced. And, it can be understood that when the supporting material layer is laid on the metal layer 103, the metal layer 103 has already formed the dust-proof part 10 (and/or the first slit 1031). At this time, the supporting material layer will be filled with anti-dust parts. In the gap between the dust-proof mesh 11 of the dust part 10 and the first slit 1031, it is ensured that each part of the metal layer 103 is provided with a supporting material layer, thereby facilitating the subsequent forming steps.

In step S303, a mounting plate 105 is provided on the side of the supporting portion 104 away from the metal layer 103. When the dust-proof structure 100 is mass-produced, the mounting plate 105 is provided to facilitate the simultaneous transfer of multiple dust-proof structures 100. The mounting plate 105 can be made of blue film or other supporting film materials. When the dust-proof structure 100 is needed, it can be lifted and supported. The connecting part 104 makes the supporting part 104 independent of the mounting plate 105.

By providing the first slit 1031, the multiple dust-proof mesh holes 11 (that is, the multiple dust-proof parts 10) formed by the metal layer 103 can be separated from each other during mass production, thereby improving production efficiency. Both the supporting portion 104 and the placement plate 105 can facilitate the transportation of the dust-proof structure 100 and further improve the production efficiency.

10, in some embodiments of the present invention, the step of disposing a supporting material layer on the metal layer 103 and processing to form the supporting portion 104 includes:

In step 3021, a support material is coated on the surface of the metal layer 103, and a support material layer is formed; in this embodiment, the spin coater can also be controlled to coat the support material on the surface of the metal layer 103 according to the spin coating method. The coating machine spin-coats the photosensitive material on the metal layer 103. The spin-coating method includes three steps: batching, high-speed rotation, and volatilization to form a film. The process is controlled by controlling the time, rotation speed, drop volume, and the concentration and viscosity of the solution used. The thickness of the film. The spin coating method can uniformly shape the support material on the surface of the metal layer 103.

Step 3022: Start the laser at the second power to form a second laser beam; different material layers have different materials, so the laser has different ablation effects. When processing the support material layer, a fixed second power is used It can ensure that the depth of laser ablation is consistent, and the yield of products is guaranteed. In an embodiment, the value of the second power can be 0.5W-12W, specifically 1W, 2W, 3W, 4W, 5W, 6W, 7W, etc., which can ensure a better processing effect on the support material layer. .

Step 3023, focus the laser focus of the second laser beam on the surface of the support material layer away from the metal layer 103; focus the laser focus on the upper surface of the support material layer, and process through the focus of the laser to make the processing result better. To be precise and easy to produce.

Step 3024, scan the support material layer through a galvanometer, and use a second laser beam to ablate the support material layer, so that the support material layer forms an opening 1041 that exposes the dustproof portion 10, and forms a first slit The second slit 1042 of 1031 obtains the supporting portion 104. By means of laser cutting, the support material layer is processed by laser to form the opening 1041 and the second slit 1042. The second slit 1042 is provided so that the dust-proof structure 100 can be mass-produced, and the support portion 104 is separated by the second slit 1042, which improves the production efficiency. It should be noted that the remaining part of the support part 104 after being processed by the laser may be connected to the part of the metal layer 103 where the dust-proof mesh 11 is not formed (or it may be connected to a part of the dust-proof net on the outer edge of the dust-proof part 10). The hole 11 is connected), so as to ensure that the dust-proof mesh hole 11 in the middle is facing the communicating hole 210 to block the entry of foreign objects.

The supporting material layer can be better formed into the supporting portion 104 by laser processing, which is convenient for the installation and transportation of the dust-proof structure 100.

11, in some embodiments of the present invention, the step of arranging a mounting plate 105 on the side of the supporting portion 104 away from the metal layer 103 includes:

In step S3031, a mounting plate 105 is provided, and glue is applied to a surface of the mounting plate 105; in one embodiment, the mounting plate 105 can be made of UV film, which has a lower cost and can be transported for mass production. Dust-proof structure 100.

In step S3032, the surface of the mounting plate 105 coated with glue is controlled to be attached to the surface of the supporting portion 104 away from the metal layer 103. Through glue bonding, the connection between the mounting board 105 and the supporting structure can be ensured stably.

When the dust-proof structure 100 needs to be used, the connection between the mounting plate 105 and the supporting part 104 can be released, so that the supporting part 104 is independent of the mounting plate 105 and the production efficiency is improved.

2 and 12, in some embodiments of the present invention, the step of separating the metal layer 103 forming the dustproof portion 10 and the release film 102 from each other includes:

In step S41, the surface on which the release film 102 and the metal layer 103 are attached is processed to remove the adhesion; usually, the metal layer 103 and the substrate 101 will stick to each other after processing, and it is not easy to separate. A release film 102 is provided between the metal layer 103 and the processed metal layer 103 and the substrate 101. The release film 102 is usually slightly viscous. It is heated or irradiated by light (UV light). Or a laser with a specific wavelength) will cause the release film 102 to lose its viscosity, so that the metal layer 103, the release film 102 and the substrate 101 can be separated from each other. It should be noted that in the process of forming the dust-proof portion 10 on the metal layer 103, the substrate 101, the release film 102, and the metal layer 103 are stacked in the vertical direction, from bottom to top, so as to facilitate the removal of the metal layer 103. Deposition and molding. In the process of removing the adhesion between the release film 102 and the metal layer 103, the entire workpiece to be processed is turned over 180°, thereby forming the metal layer 103, the release film 102 and the substrate 101 in the up and down direction, from bottom to top They are stacked one after another to facilitate the removal of adhesiveness. It is understandable that the surface of the release film 102 after removing the adhesiveness is not adhesive. In this way, the substrate 101 can be transported away by the conveying device, and the dustproof device can be transported away. Keep on the production line to continue transportation.

In step S42, the metal layer 103 forming the dust-proof portion 10 is controlled to be separated from the release film 102 that has lost its viscosity. In this embodiment, a vacuum suction device (specifically, a vacuum suction nozzle, or a suction nozzle of a Die Bonder placement machine) can be controlled to adsorb the dustproof device, and then be transported to a suitable place. After the mounting plate 105 is removed, the dust-proof structure 100 can be lifted up by a thimble, and then the dust-proof structure 100 can be transferred through the suction nozzle.

By removing the viscosity between the release film 102 and the metal layer 103, the two can be separated from each other, which ensures the production yield of the dust-proof part 10 and has high production efficiency.

In some embodiments of the present invention, after the step of controlling the separation of the metal layer 103 forming the dust-proof portion 10 from the release film 102 that loses its viscosity, it further includes:

When the metal layer 103 is provided with a first slit 1031, the supporting portion 104 is provided with a second slit 1042, and the dust-proof structure 100 is provided with a mounting plate 105, the cutting device is controlled to move along the first slit 1031 and the first slit 1031. The extension path of the second slit 1042 cuts the mounting plate 105.

The installation board 105 can make the mass-produced dust-proof structure 100 more transported. When it is necessary to obtain a part of the dust-proof structure 100 distributed on the installation board 105, it can be aligned along the path of the first slit 1031 and the second slit 1042. The placement plate 105 is cut, so that a certain number of dustproof structures 100 can be obtained, which is convenient for users to transport and use. It can be understood that the cutting device may be a wire cutting device or a laser cutting device, as long as it is convenient for cutting.

1 to 4, the present invention also proposes a dust-proof structure 100, which is prepared by the method for manufacturing the dust-proof structure 100 as described above. The dust-proof structure 100 prepared by the present invention has a better dust-proof function, and can connect the dust-proof sensor 1000 with the external environment, so as to ensure the detection sensitivity and measurement accuracy of the sensor 1000. In some embodiments, the dust-proof structure 100 further includes a fixing portion 20. The fixing portion 20 is the part where the dust-proof mesh 11 is not formed during the manufacturing process. When the supporting portion 104 is provided, the fixing portion 20 is mainly connected to The support portion 104 is connected to improve the fixing effect of the support portion 104. When the support portion 104 is not provided, the fixing portion 20 can be directly fixed to the sensor 1000, and the dustproof portion 10 covers the communication hole 210. The combined outer contour of the dust-proof part 10 and the fixed part 20 of the dust-proof structure 100 is generally arranged in a quadrilateral sheet shape. The outer contour can be changed according to the arrangement of the first slit 1031 and the second slit 1042. The outer contour of the dust part 10 can be set according to the cross-sectional contour of the communicating hole 210, so as to ensure the covering efficiency of the communicating hole 210, prevent foreign matter from entering, and facilitate the internal sensing unit 300 to sense the external environment. The supporting portion 104 of the dust-proof structure 100 is formed with an opening that exposes the dust-proof portion 10, and one side of the supporting portion 104 is connected to the fixing portion 20. The other side of the supporting portion 104 may also be provided with anti-skid bumps, thereby improving the fixing effect with the sensor 1000 and ensuring the dust-proof stability of the dust-proof structure 100.

Since the dust-proof structure 100 adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

The above descriptions are only the preferred embodiments of the present invention, and do not limit the scope of the present invention. Under the inventive concept of the present invention, equivalent structural transformations made by using the contents of the description and drawings of the present invention, or direct/indirect use All other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. A method for manufacturing a dust-proof structure. The dust-proof structure is used to prevent dust from a sensor. The sensor includes a housing and a sensing unit arranged in the housing. The housing is provided with a communicating hole, and the communicating hole The sensing unit is connected to the external environment, and the dust-proof part of the dust-proof structure covers the communicating hole, characterized in that the manufacturing method of the dust-proof structure includes the following steps:

   Provide a substrate, and set a release film on one surface of the substrate;

   Depositing and forming a metal layer on the surface of the release film;

   Laser drilling is used to make the metal layer form a plurality of dust-proof mesh holes, wherein the plurality of dust-proof mesh holes jointly form a dust-proof part;

   Separate the metal layer forming the dust-proof part and the release film from each other.
2. 3. The method of manufacturing a dust-proof structure according to claim 1, wherein the step of forming a plurality of dust-proof meshes on the metal layer by laser drilling comprises:

   Preset the processing path of the laser to the metal layer;

   Start the laser at the first power to form the first laser beam;

   Focusing the laser focus of the first laser beam on the surface of the metal layer away from the release film;

   Scan the metal layer through a galvanometer, and use a first laser beam to ablate the metal layer according to the processing path to form the dust-proof mesh.
3. 3. The method of manufacturing a dust-proof structure according to claim 2, wherein the step of presetting the processing path of the metal layer by the laser comprises:

   Obtain image information of at least three marking points on the surface to be processed;

   Confirming the offset of the marking point according to the image information of at least three of the marking points and the image information of the preset marking point;

   Adjusting the initial processing position of the laser according to the offset of the marking point;

   The laser processes the metal layer along a preset processing path according to the adjusted initial processing position.
4. The method of manufacturing a dust-proof structure according to claim 2, wherein the metal layer is scanned by a galvanometer, and a first laser beam is used to ablate the metal layer to form the dust-proof mesh After the steps, it also includes:

   Obtain the image of the hole of the dust-proof mesh of the dust-proof part after processing;

   Detecting whether the orifice of the dust-proof mesh has burrs according to the image;

   If so, remove the burrs.
5. The method of manufacturing a dust-proof structure according to claim 1, wherein the step of forming a plurality of dust-proof mesh holes in the metal layer by laser drilling, wherein the plurality of dust-proof mesh holes together form a dust-proof part After that, before the step of separating the metal layer forming the dust-proof part and the release film from each other, the method further includes:

   Form the first slit in the metal layer around the dustproof part;

   Set a support material layer on the metal layer and process it to form a support part;

   A mounting board is arranged on the side of the support part away from the metal layer.
6. 7. The method of manufacturing a dust-proof structure according to claim 5, wherein the step of disposing a support material layer on the metal layer and processing to form the support portion comprises:

   Coating supporting material on the surface of the metal layer and forming a supporting material layer;

   Start the laser at the second power to form a second laser beam;

   Focusing the laser focus of the second laser beam on the surface of the support material layer away from the metal layer;

   Scan the support material layer through a galvanometer, and use a second laser beam to ablate the support material layer, so that the support material layer forms an opening that exposes the dust-proof part, and forms a second slit that exposes the first slit ,Get the support part.
7. 7. The method for manufacturing a dust-proof structure according to any one of claims 1 to 6, wherein the step of separating the metal layer forming the dust-proof part and the release film from each other comprises:

   Processing the surface where the release film and the metal layer are bonded to each other to remove viscosity;

   Control the separation of the metal layer forming the dust-proof part from the release film that has lost its adhesion.
8. 7. The method of manufacturing a dust-proof structure according to claim 7, wherein after the step of controlling the separation of the metal layer forming the dust-proof part from the release film that loses its viscosity, the method further comprises:

   When the metal layer is provided with a first slit, the supporting part is provided with a second slit, and the dust-proof structure is provided with a mounting plate, the cutting device is controlled to cut along the extension path of the first slit and the second slit The placement board.
9. 8. The manufacturing method of the dust-proof structure according to claim 8, wherein the thickness of the metal layer is less than 2um;

   And/or, the hole diameter of the dust-proof mesh is less than 3um;

   And/or, the distance between two adjacent dust-proof mesh holes is less than 1um.
10. A dust-proof structure, characterized in that the dust-proof structure is manufactured by the method for manufacturing the dust-proof structure according to any one of claims 1 to 9.

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