CN110143755A - It is cut by laser the method for film covered glass, the shell and electronic equipment of electronic equipment - Google Patents
It is cut by laser the method for film covered glass, the shell and electronic equipment of electronic equipment Download PDFInfo
- Publication number
- CN110143755A CN110143755A CN201910570142.4A CN201910570142A CN110143755A CN 110143755 A CN110143755 A CN 110143755A CN 201910570142 A CN201910570142 A CN 201910570142A CN 110143755 A CN110143755 A CN 110143755A
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- China
- Prior art keywords
- glass
- laser
- film covered
- electronic equipment
- shell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
Present applicant proposes the methods of laser cutting film covered glass, the shell and electronic equipment of electronic equipment.The method of the laser cutting film covered glass includes: that diaphragm is fitted in the surface of glass, to obtain film covered glass；Film covered glass is cut by ultraviolet pulse laser, and ultraviolet pulse laser does not damage glass.The laser cutting method that the application is proposed, using the ultraviolet laser of pulse, diffusion or intensification of the energy to glass micro-crack of high frequency light radiation can be efficiently controlled, to reduce the risk of the film covered glass strength damage after laser cutting, and then improves the yields of laser cutting film covered glass.
Description
Technical field
This application involves laser cutting technique fields, specifically, this application involves the methods of laser cutting film covered glass, electricity
The shell and electronic equipment of sub- equipment.
Background technique
At this stage, for plane (2D) glass, the general first large area on transparent membrane (generally using PET hard substrate)
Ground typesetting forms each film layer, then after large stretch of transparent membrane is cut into designed small pieces, finally fits to flat glass
Inner surface on, the coating technique of a handset shell can be completed.But for by soft membrane material (such as TPU), need to first by
Soft membrane material high pressure fits to interior surfaces of glass, then is cut by laser to the waste material at glass edge and hole location, so first pastes
The method cut again is closed, laser cutting is made to be very easy to be damaged to the strength character of glass.
Summary of the invention
One purpose of the embodiment of the present application be to propose a kind of laser cutting film covered glass and do not damage glass method,
The shell for the electronic equipment produced by the laser cutting method and the electronic equipment for applying the shell, it is existing at least to solve
There is one of above problem present in technology, the risk of the film covered glass strength damage after reducing laser cutting.
In the embodiment of the present application in a first aspect, proposing a kind of method for being cut by laser film covered glass.
According to an embodiment of the present application, which comprises diaphragm is fitted in the surface of glass, to obtain overlay film glass
Glass；The film covered glass is cut by ultraviolet pulse laser, and the ultraviolet pulse laser does not damage the glass.
The laser cutting method of the embodiment of the present application can efficiently control high frequency light radiation using the ultraviolet laser of pulse
Diffusion or intensification of the energy to glass micro-crack, to reduce the risk of the film covered glass strength damage after laser cutting, into
And improve the yields of laser cutting film covered glass.
In the second aspect of the application, the shell of a kind of electronic equipment is proposed.
According to an embodiment of the present application, at least part of shell is formed by film covered glass, and the film covered glass is by upper
The method processing stated obtains.
The shell of the electronic equipment of the embodiment of the present application, the film covered glass of part are cut by ultraviolet pulse laser
Film layer, to make that the loss of strength of the shell is smaller and yields is higher, and then it is better to have the shell of the electronic equipment
Mechanical property.It will be appreciated to those of skill in the art that above for spy described in the method for being cut by laser film covered glass
It seeks peace advantage, is still applied to the shell of the electronic equipment, details are not described herein.
In the third aspect of the application, a kind of electronic equipment is proposed.
According to an embodiment of the present application, the electronic equipment includes: above-mentioned shell；Display device, the display device
It is connected with the shell.
The mechanical property of the electronic equipment of the embodiment of the present application, shell is more preferable and yields is higher, to make the electronics
The cost of manufacture of equipment is lower, and then keeps the market competitiveness of the electronic equipment higher.Skilled artisans appreciate that
It is that feature and advantage described in the shell above for electronic equipment are still applied to the electronic equipment, and details are not described herein.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the method flow diagram of the laser cutting film covered glass of the application one embodiment；
Fig. 2 is the specific cross section structure schematic diagram of the film covered glass of the application one embodiment；
Fig. 3 is the ultraviolet laser of the application one embodiment and the energy contrast schematic diagram of ultraviolet pulse laser；
Fig. 4 is the Tool path design schematic diagram of the laser cutting of the application one embodiment；
Fig. 5 is the cross section structure schematic diagram of the shell of the electronic equipment of the application one embodiment；
Fig. 6 is the outside drawing of the electronic equipment of the application one embodiment；
Fig. 7 is the falling sphere test result statistical chart of the application one embodiment.
Appended drawing reference
100 glass
210 diaphragms
220 texture layers
230 film plating layers
240 ink layers
250 glue-lines
10 shells
20 display devices
1 electronic equipment
Specific embodiment
Embodiments herein is described below in detail, those skilled in the art is it will be appreciated that following example is intended for solving
The application is released, and is not construed as the limitation to the application.Unless stated otherwise, it is not expressly recited in embodiment below specific
Technology or conditions, those skilled in the art can be according to common technology or conditions in the art or according to product description
It carries out.
In the one aspect of the embodiment of the present application, a kind of method for being cut by laser film covered glass is proposed.According to the application
Embodiment, with reference to Fig. 1, which includes:
Diaphragm: being fitted in the surface of glass by S100, to obtain film covered glass.
In this step, diaphragm 210 is fitted in the surface of glass 100, to obtain film covered glass.According to the reality of the application
Example is applied, the concrete technology mode of fitting is not particularly limited, and specifically such as vacuum suction, high temperature and pressure attach or heat is adsorbed
Etc. modes, those skilled in the art can correspondingly be selected according to the specific material of diaphragm 210 and thickness, it is no longer superfluous herein
It states.
In some embodiments of the present application, the material for forming diaphragm 210 may include thermoplastic polyurethane (TPU), in this way,
Using the soft diaphragm of TPU with good tensile property, diaphragm can be bonded in the complicated inner surface of three-dimensional (3D) bend glass
210.In some embodiments of the present application, the material for forming diaphragm 210 also may not include polyethylene terephthalate
(PET), it in this way, not using the PET hard diaphragm of tensile properties difference, can be easier to be bonded diaphragm in the inner surface of bend glass
210。
In some embodiments of the present application, the thickness of diaphragm 210 can be 0.05~0.3mm, in this way, in glass 100
Surface attach the diaphragm 210 of above-mentioned thickness, can make other film layers of surface of the diaphragm 210 far from glass 100 that can also attach together
To the surface of glass 100, to make the film covered glass that there is better appearance.
In certain embodiments, with reference to Fig. 2, diaphragm 210 may also be formed with each film far from the upper surface of glass 100
Layer, specifically such as texture layer 220, film plating layer 230 or ink layer 240, alternatively, can also be formed between diaphragm 210 and glass 100
There is glue-line 250, in this way, the diaphragm 210 that surface is formed with each film layer to be attached to the upper surface of glass 100, to can get
Surface has the film covered glass of compound film material.
In certain embodiments, the overall thickness of other film layers of diaphragm 210 and its upper surface can be 0.2mm, such as
This, the integral thickness of the film covered glass after attaching the film layer 210 will not obviously increase, and set to be conducive to the lightening of the shell
Meter.
S200: film covered glass is cut by ultraviolet pulse laser.
In this step, film covered glass is cut by the ultraviolet pulse laser of wavelength 355nm, in this way, for glass
High molecular material in glass surface recombination membrane material, relative to carbon dioxide (CO2) or infrared laser, ultraviolet laser can generate
Bigger heat makes high molecular material gasification separation, to can cut away the waste material of glass frontside edge with reference to Fig. 2, also, purple
Outer pulse laser will not also be damaged to glass.It should be noted that " damage " is specifically that surface roughness is instigated to be less than herein
The micro-crack depth of the glass surface of 150nm is at 1 micron or more.
Present inventor has found in the course of the research, directlys adopt continuous ultraviolet laser cutting film covered glass, by
In the Light energy characteristic of ultraviolet laser be high frequency light radiation, and glass material exist in the electromagnetic property of ultraviolet band it is high
Volume absorptivity, therefore, the excessive power of ultraviolet laser are very easy to cause the diffusion and intensification of glass surface micro-crack, thus
Increasing laser cutting reduces the risk of strength of glass.It specifically refers to (a) of Fig. 3, the single-impact energy of continuous ultraviolet laser
(b) larger, and that refer to Fig. 3 is measured, the Single-impact Energy of the ultraviolet laser of pulse is smaller.So inventor's strobe pulse
Ultraviolet laser is cut by laser film covered glass, can efficiently control diffusion of the energy to glass micro-crack of high frequency light radiation
Or deepen, to keep the surface roughness of glass after laser cutting micro- no more than 1 less than the depth of 150nm and crizzle
Rice.
In some embodiments of the present application, the peak power of ultraviolet pulse laser can be 650~850W, in this way, adopting
Single-impact Energy with the ultraviolet pulse laser of above-mentioned peak power range is smaller, to make to be cut by laser to strength of glass
Damage is smaller, and the shock resistance of the film covered glass after can specifically making laser cutting is more preferable.In some specific examples of the application
In, the power of ultraviolet pulse laser is 0.1~4W, and frequency is 200~500kHz, and pulsewidth is 5~15ns, and peak power Pp=
Mean power Pa/ pulsewidth t=power P/(frequency f* pulsewidth t), in this way, using the purple of above-mentioned power, frequency and pulse duration range
Outer pulse laser, peak power range can enable the single-impact energy of ultraviolet laser smaller, so as to make laser cutting pair
The damage of strength of glass is smaller, and the falling sphere performance of the film covered glass after can specifically making laser cutting is more preferable.
In some embodiments of the present application, the cycle-index of cutting can be for 30~50 times and the cutting that recycles every time is deep
Degree can be 2~10 microns, in this way, the compound film material of circulation laser cutting 0.1~0.3mm thickness, can further decrease laser and cut
The risk of film covered glass strength damage after cutting.In some specific examples, the cycle-index of cutting can be for 40~45 times and every
The depth of cut of secondary circulation can be 5 microns, in this way, 0.2 micron of thick compound film material can be cut well, and can further drop
The risk of film covered glass strength damage after low laser cutting.
In some embodiments of the present application, with reference to Fig. 4, the cutter track (from left to right) of cutting can first go out along straight cuts
4 straight flanges, the profile for being cut into 4 circular arcs again and then being cut into the through-holes such as camera hole, finally positioning refine product.In this way, adopting
With above-mentioned cutting road step, it can produce that straightness is more preferable, radian is more preferable and the higher electronic equipment of through-hole precision
Shell (as shown in the rightmost side in Fig. 4).
In conclusion according to an embodiment of the present application, proposing a kind of laser cutting method, ultraviolet using pulse swashs
Light, can efficiently control diffusion or intensification of the energy to glass micro-crack of high frequency light radiation, thus after reducing laser cutting
The risk of film covered glass strength damage, and then improve the yields of laser cutting film covered glass.
In the other side of the embodiment of the present application, the shell of a kind of electronic equipment is proposed.
According to an embodiment of the present application, with reference to Fig. 5, at least part of shell 10 is formed by film covered glass, film covered glass by
Above-mentioned method, which is handled, to be obtained, in this way, the surface of glass 100, which may be provided with, is pasted with diaphragm 210, and diaphragm 210 is in glass 100
On orthographic projection and the surface of glass 100 be completely coincident, also, the shock resistance of shell 10 is more preferable.
In some embodiments of the present application, shell 10 may include flat glass or bend glass, and specifically such as 3D is bent
The enclosure body of surface glass, in this way, the appearance of shell 10 can be made more preferably and good by first attaching the technique being cut by laser afterwards
Product rate is higher.
In conclusion according to an embodiment of the present application, proposing the shell of a kind of electronic equipment, the film covered glass of part
It is the film layer cut by ultraviolet pulse laser, to make that the loss of strength of the shell is smaller and yields is higher, and then makes this
The shell of electronic equipment has better mechanical property.It will be appreciated to those of skill in the art that above for laser cutting
Feature and advantage described in the method for film covered glass are still applied to the shell of the electronic equipment, and details are not described herein.
In the other side of the embodiment of the present application, a kind of electronic equipment is proposed.
According to an embodiment of the present application, with reference to Fig. 6, electronic equipment 1 includes above-mentioned shell 10 and display device 20, display
Device 20 is connected with shell 10.
According to an embodiment of the present application, the concrete type of the electronic equipment is not particularly limited, specifically such as mobile phone, flat
Plate computer, smartwatch etc., those skilled in the art can correspondingly be selected according to the particular use of the electronic equipment, herein
It repeats no more.It should be noted that the electronic equipment is other than including above-mentioned shell and display device, it further include that other must
The component and structure wanted, take the mobile phone as an example, specifically such as processor, memory, battery, circuit board, camera, etc., ability
Field technique personnel correspondingly can be designed and be supplemented according to the specific type of the electronic equipment, and details are not described herein.
In conclusion according to an embodiment of the present application, propose a kind of electronic equipment, the mechanical property of shell it is more preferable and
Yields is higher, to keep the cost of manufacture of the electronic equipment lower, and then keeps the market competitiveness of the electronic equipment higher.This
Field technical staff is still applied to this, it is understood that feature and advantage described in shell above for electronic equipment
Electronic equipment, details are not described herein.
Below with reference to specific embodiment, the application is described, it should be noted that these embodiments are only descriptive
, without limiting the application in any way.
Comparative example 1
In the comparative example, after the surface that the TPU membrane piece of 0.2mm thickness is fitted in glass is formed film covered glass, using even
Continuous ultraviolet laser cuts away the waste material of glass edge and is cut into camera hole.Wherein, the wavelength of ultraviolet laser is 355nm, function
Rate is 3.15W and movement speed is 500mm/s.
The depth of glass edge after comparative example laser cutting and the face crack near camera hole is extended to 2 microns,
Illustrate that the energy of continuous ultraviolet laser is excessively high and can be damaged to strength of glass.
Embodiment 1
In this embodiment, Direct Laser glass-cutting and the glass after being cut.Wherein, the wavelength of ultraviolet laser is
355nm, power 3.05W, frequency 200kHz, movement speed 500mm/s, pulsewidth 10ns, cutting times are 45 times and peak
Value power is 1525W.
Embodiment 2
In this embodiment, according to method and condition substantially the same manner as Example 1, Direct Laser glass-cutting and obtain
Glass after cutting.Difference is that in this embodiment, the power of ultraviolet laser is 3.15W, frequency is 400kHz and peak work
Rate is 787.5W.
Embodiment 3
In this embodiment, it is cut by laser film covered glass.Specific method is that surface is sequentially formed with texture layer, plating
The TPU membrane piece of film layer and ink layer by glue thermal-adhering to glass surface, then uses the ultraviolet laser of pulse to cut away glass edge
The waste material of edge and it is cut into camera hole.Wherein, the wavelength of ultraviolet laser is 355nm, power 3.05W, frequency 200kHz, moves
Dynamic speed is 500mm/s, pulsewidth 10ns, cutting times are 45 times and peak power is 1525W, also, glass surface is compound
The overall thickness of membrane material is 0.2mm.
Embodiment 4
In this embodiment, according to method and condition substantially the same manner as Example 3, it is cut by laser film covered glass.Difference
It is, in this embodiment, the power of ultraviolet laser is 3.15W, frequency is 400kHz and peak power is 787.5W.
Embodiment 5
In this embodiment, to the cutting of glass, embodiment 3 and 4 after the cutting of uncut glass, Examples 1 and 2
Film covered glass afterwards carries out impact property test respectively.Specifically, impact property test selection falling sphere method of testing, by 110g's
Bead falls from predetermined altitude and pounds on the different location of sample, and every kind of sample is repeated 6 times, and the falling sphere that can get sample is high
Degree and rupture number, then count average test result.
The falling sphere results of property of the embodiment, as shown in table 1 and Fig. 7.It can be seen that from table 1 and Fig. 7, according to embodiment 1
Ultraviolet pulse laser parameter, embodiment 3 be cut by laser after film covered glass intensity relative to uncut strength of glass slightly under
Drop, still, after the parameter of ultraviolet pulse laser is tuned into embodiment 2, embodiment 4 cut after film covered glass intensity drop relative to
It makes moderate progress than embodiment 3.So illustrating under identical power level, caused by the ultraviolet pulse laser cutting of high frequency
Peak power is lower, to effectively reduce damage of the single optical radiation energy to glass material.
The shock resistance test result of the different samples of table 1
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example
Property, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of method for being cut by laser film covered glass characterized by comprising
Diaphragm is fitted in the surface of glass, to obtain film covered glass；
The film covered glass is cut by ultraviolet pulse laser, and the ultraviolet pulse laser does not damage the glass.
2. the method according to claim 1, wherein the material for forming the diaphragm includes thermoplastic polyurethane.
3. the method according to claim 1, wherein the material for forming the diaphragm does not include poly terephthalic acid
Second diester.
4. the method according to claim 1, wherein the diaphragm with a thickness of 0.05~0.3mm.
5. the method according to claim 1, wherein the peak power of the ultraviolet pulse laser be 650~
850W。
6. the method according to claim 1, wherein the power of the ultraviolet pulse laser is 0.1~4W, frequency
For 200~500kHz, pulsewidth is 5~15ns.
7. the method according to claim 1, wherein the cycle-index of the cutting is 30~50 times and follows every time
The depth of cut of ring is 2~10 microns.
8. the shell of a kind of electronic equipment, which is characterized in that at least part of shell is formed by film covered glass, the overlay film
Glass is handled by method according to any one of claims 1 to 7 and is obtained.
9. shell according to claim 8, which is characterized in that the shell includes flat glass or bend glass.
10. a kind of electronic equipment characterized by comprising
Shell described in any one of claim 8~9；
Display device, the display device are connected with the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910570142.4A CN110143755A (en) | 2019-06-27 | 2019-06-27 | It is cut by laser the method for film covered glass, the shell and electronic equipment of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910570142.4A CN110143755A (en) | 2019-06-27 | 2019-06-27 | It is cut by laser the method for film covered glass, the shell and electronic equipment of electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN110143755A true CN110143755A (en) | 2019-08-20 |
Family
ID=67596746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910570142.4A Pending CN110143755A (en) | 2019-06-27 | 2019-06-27 | It is cut by laser the method for film covered glass, the shell and electronic equipment of electronic equipment |
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| Country | Link |
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| CN (1) | CN110143755A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112846534A (en) * | 2020-12-30 | 2021-05-28 | 武汉理工氢电科技有限公司 | 3CCM cutting method |
| CN113371989A (en) * | 2021-05-26 | 2021-09-10 | 苏州镭明激光科技有限公司 | Splitting method and splitting device for semiconductor chip |
| CN114466538A (en) * | 2020-11-09 | 2022-05-10 | Oppo广东移动通信有限公司 | Shell, manufacturing method thereof and electronic equipment |
| CN114505597A (en) * | 2022-03-17 | 2022-05-17 | 新代科技(苏州)有限公司 | Laser metal plate cutting processing method supporting various film cutting processes |
| CN117139870A (en) * | 2023-10-23 | 2023-12-01 | 深圳铭创智能装备有限公司 | MiniLED shading film laser trimming method |
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| US20070090100A1 (en) * | 2004-04-27 | 2007-04-26 | Toshifumi Yonai | Glass cutting method and apparatus therefor |
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| CN102898013A (en) * | 2012-09-07 | 2013-01-30 | 东莞光谷茂和激光技术有限公司 | Method for cutting glass substrate by using ultraviolet laser |
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| CN109702356A (en) * | 2019-01-09 | 2019-05-03 | 蓝思智能机器人(长沙)有限公司 | A method of laser cutting covering protection film glass |
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| US20070090100A1 (en) * | 2004-04-27 | 2007-04-26 | Toshifumi Yonai | Glass cutting method and apparatus therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114466538A (en) * | 2020-11-09 | 2022-05-10 | Oppo广东移动通信有限公司 | Shell, manufacturing method thereof and electronic equipment |
| CN112846534A (en) * | 2020-12-30 | 2021-05-28 | 武汉理工氢电科技有限公司 | 3CCM cutting method |
| CN113371989A (en) * | 2021-05-26 | 2021-09-10 | 苏州镭明激光科技有限公司 | Splitting method and splitting device for semiconductor chip |
| CN114505597A (en) * | 2022-03-17 | 2022-05-17 | 新代科技(苏州)有限公司 | Laser metal plate cutting processing method supporting various film cutting processes |
| CN117139870A (en) * | 2023-10-23 | 2023-12-01 | 深圳铭创智能装备有限公司 | MiniLED shading film laser trimming method |
| CN117139870B (en) * | 2023-10-23 | 2024-06-21 | 深圳铭创智能装备有限公司 | MiniLED shading film laser trimming method |
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Application publication date: 20190820 |