CN202038984U - Micropore processing device of patch clamp chip - Google Patents
Micropore processing device of patch clamp chip Download PDFInfo
- Publication number
- CN202038984U CN202038984U CN2011200347358U CN201120034735U CN202038984U CN 202038984 U CN202038984 U CN 202038984U CN 2011200347358 U CN2011200347358 U CN 2011200347358U CN 201120034735 U CN201120034735 U CN 201120034735U CN 202038984 U CN202038984 U CN 202038984U
- Authority
- CN
- China
- Prior art keywords
- patch clamp
- laser
- processing device
- micropore processing
- micropore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 48
- 239000012528 membrane Substances 0.000 claims description 21
- 210000000080 chela (arthropods) Anatomy 0.000 claims description 18
- 239000000463 material Substances 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 12
- 230000003287 optical effect Effects 0.000 abstract description 9
- 230000001105 regulatory effect Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 108090000862 Ion Channels Proteins 0.000 description 2
- 102000004310 Ion Channels Human genes 0.000 description 2
- 239000006285 cell suspension Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000007876 drug discovery Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001053 micromoulding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012402 patch clamp technique Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model discloses a micropore processing device of a patch clamp chip, which comprises an ultraviolet laser, a beam expander, an adjusting diaphragm, a focusing mirror and a glass patch clamp chip fixture. The beam expander is arranged on an output optical path of the ultraviolet laser, the adjusting diaphragm is arranged on an output optical path of the beam expander, the focusing mirror is arranged on an output optical path of the adjusting diaphragm, and the glass patch clamp chip fixture is arranged on an output path of the focusing mirror. The micropore processing device for the patch clamp chip enables the high energy of the focused ultraviolet laser to damage the molecular structure of glass materials on the patch clamp chip in a very short time and form even holes on the glass materials. Furthermore, the micropore processing device of the patch clamp clip controls the ultraviolet laser and a motion control platform through a computer numerical control system, and realizes automation of the whole process flow.
Description
Technical field
The utility model relates to a kind of laser micropore processor, relates in particular to a kind of patch clamp chips micropore processing device.
Technical background
Patch clamp technique is the important technology in the ionic channel research.The advantage that information content is big, resolving power is high though classical patch clamp possesses skills, drawbacks limit such as flux is low, operation is loaded down with trivial details, requirement for experiment condition height its application in researchs such as cell physiological and drug discovery.Therefore the patch clamp chips technology is arisen at the historic moment.The patch clamp chips technology can carry out high-throughout electrophysiologicalmeasurements measurements, form the high resistance sealing-in automatically, and can combine with the opticmeasurement means, and it has promoted the research of ionic channel and high-flux medicaments sifting.The patch clamp chips technology adopts the two dimensional structure that has the micron order hole to replace glass microelectrode (as shown in Figure 1) and cell to form sealing-in, only need cell suspension is dropped on the hole, apply a negative pressure or an electrostatic field, cell is directed on the hole, applies a negative pressure again and can make cell and chip chamber form the high resistance sealing-in.More convenient to operate like this, quick.And can be that electrod-array carries out record simultaneously to a plurality of cells with chip manufacturing.The micropore of above-mentioned diaphragm embedding chip is leak shape (as shown in Figure 2), and the inlet aperture of micropore is greater than the outlet aperture, and the scope of micropore inlet aperture is 2～10 μ m, and the scope of micropore outlet aperture is 1～2 μ m, and this structure helps the perfusion of cell suspension.
The material of the making patch clamp chips that has adopted at present, has silicon, quartz crystal or glass and organic polymer body.There is a series of problem based on the patch clamp chips of silicon materials substrate fabrication in employing in the punching experiment, be difficult to form above-mentioned leak shape micropore; The patch clamp chips of utilizing quartz crystal good insulation performance character to make, can use the plane processing technology of standard, obtain the hole of micron to submicron order, the performance perameter of finding this patch clamp chips in the experiment is fine, but the shape of the hole of getting is trilateral always, makes cell and chip chamber be difficult to form the sealing-in of high resistance; Glass and organic polymer body be good insulating material also, but also have transparent, the convenient advantage of observing and can combine with other optical detection means such as detection technique of fluorescence, glass membrane pincers chip and cell can form the high resistance sealing-in preferably.In addition, glass has good electricity and mechanical properties, surperficial possess hydrophilic property, is more satisfactory diaphragm embedding chip material.
Method at processing micropore on glass adopts single ion to follow the trail of lithographic technique usually at present, and the hole diameter of processing on chip can reach 1 μ m, even littler, and hole is mellow and full, smooth.But this method efficiency ratio is lower, and it is bigger to promote difficulty.Therefore how be the key of large-scale application patch clamp chips technology at the leak shape micropore that processes 1～10 μ m aperture on glass.
As everyone knows, laser boring processing is the important component part of laser processing technology, and laser boring is compared with other drilling methods, and maximum difference is the characteristics that it has high speed, high precision and high-adaptability.In addition, it also has, and punching is even, the heat affected zone is little, add the noiseless in man-hour, joint-cutting edge-perpendicular degree is good, it is smooth to cut edge, the course of processing realizes advantages such as automatization control easily, but the aperture of present laser drilling minimum process and is difficult to get leak shape micropore about 100 μ m.In addition, traditional YAG laser and CO
2Laser is difficult to act on glass material, the weak effect of processing, and also the glass of being processed is easy to crack and collapse the limit, can not satisfy the requirement of diaphragm embedding chip manufacture.Therefore how the processing that laser drilling is applied to diaphragm embedding chip is the key issue that we will solve.
Summary of the invention
The purpose of this utility model provides a kind of patch clamp chips micropore processing device that can be implemented in processing micron order hole on glass.
For realizing this purpose, a kind of patch clamp chips micropore processing device that the utility model is designed, it is characterized in that: it comprises ultraviolet laser, beam expanding lens, adjusting aperture, condensing lens and glass membrane pincers chip fixture, wherein, on the output light path of described ultraviolet laser beam expanding lens is set, the adjusting aperture is set on the output light path of beam expanding lens, on the output light path of adjusting aperture condensing lens is set, glass membrane pincers chip fixture is set on the output light path of condensing lens.
It also comprises speculum, on the output light path of adjusting aperture speculum is set, and on the reflection output light path of speculum condensing lens is set.
It also comprises Computerized digital control system and motion control platform, wherein, the laser control signal output terminal of described Computerized digital control system connects the control interface of ultraviolet laser, the position control signal output terminal of Computerized digital control system connects the control interface of motion control platform, and described glass membrane pincers chip fixture places on the motion control platform.
The laser beam expanding multiple of described beam expanding lens is 8～10 times.
The diaphragm diameter variable range of described adjusting aperture is 1.2mm～1.8mm.
Described condensing lens is a telecentric lens, and the focused radius minimum of condensing lens is 0.7 μ m.
The wavelength region of the ultraviolet Gaussian laser beam that described ultraviolet laser sends is 266～355nm.
The range of frequency of the ultraviolet Gaussian laser beam that described ultraviolet laser sends is 10～100KHz, and the pulsewidth scope is 15～50ns, and power is 1～7 watt.
Introduce laser micropore process principle of the present invention below.
1) interaction mechanism of Ultra-Violet Laser and glass inorganic materials:
According to the different qualities of machined material and to the degree of absorption difference of different wavelength of laser, often select the laser of a certain specific wavelength that material is processed, in the laser micropore processing in the hope of reaching best processing effect.Consider the characteristic of glass material, it is that the ultraviolet laser of 266nm～355nm comes the micropore of glass membrane pincers chip is processed that the applicant selects the output wavelength scope.The laser of this wavelength is very suitable for inorganic materials.Because the diffraction phenomena of light beam is the principal element of restriction processing component minimum size, the minimum light spot diameter of the accessible focus point of laser is linear increasing along with the increase of wavelength, so the laser of shorter wavelength can process littler parts.In addition, the little treating processes of Ultra-Violet Laser is not " heat " treating processes from essence, the high-octane photon of Ultra-Violet Laser can directly destroy the chemical bond of glass material, this course of processing is called " photetching " effect, Ultra-Violet Laser processing is to come down to cold-treating process, heat affecting is very little, and high-octane UV-light is directly destroyed the chemical bond of glass material, and the aperture diameter that makes this " cold " process is controlled and have a smooth uniform edge.
2) micro molding mechanism:
Be Gaussian beam on the theory of laser that laser apparatus sends, the ideal Gaussian beam helps the moulding of leak shape micropore shown in Figure 2, but in fact laser can not reach this perfect condition.In order to make laser as much as possible near desirable Gaussian beam pattern, the present invention combines beam expanding lens and plays the effect (as shown in Figure 3) of screening light beam with the adjusting aperture.At first, the ultraviolet gauss laser that ultraviolet laser sends expands through beam expanding lens to be restrainted, and the optical beam ratio that beam expanding lens expands behind the bundle is thicker, and this light beam has only the optical axis middle portion can pass through to regulate aperture after arriving and regulating aperture.As shown in Figure 4, size by regulating and controlling aperture center-hole diameter can play the effect of selecting light beam, the aperture center-hole diameter is more little to see through the laser go more near Gaussian beam, also guaranteed to obtain littler focal beam spot, the laser beam that comes out from the adjusting aperture also is a Gaussian distribution through the laser power density distribution that telecentric lens focuses on back focus, laser near ultraviolet Gaussian laser beam optical axis is higher through focusing on the back power density, the molecular structure that destroys glass material in the extremely short time forms micropore, laser power density away from ultraviolet Gaussian laser beam optical axis is much smaller, so be difficult to penetrate glass material at short notice, make the conical surface that on glass membrane pincers chip, forms micropore away from the laser of ultraviolet Gaussian laser beam optical axis.By the central diameter of regulating and controlling aperture, can make on the glass membrane pincers chip and form the funnel-form micropore.
The utility model device sets gradually the corresponding mutually beam expanding lens in position, adjusting aperture, speculum, condensing lens and glass membrane pincers chip fixture by the laser outgoing side at ultraviolet laser, make the high-energy of the Ultra-Violet Laser after focusing in the extreme time, can destroy the molecular structure of glass membrane pincers chip fixture upper glass material, and on glass material, form uniform hole; In addition, the significant feature of regulating aperture is the laser facula size after bundle is expanded in control, can regulate the diameter of micropore on the glass material by the size of control hot spot; And the utility model also by Computerized digital control system control ultraviolet laser and motion control platform, has been realized the automatization of whole work flow.
Description of drawings
Fig. 1 is the fundamental diagram of single patch clamp chips;
Fig. 2 is the structural representation of patch clamp chips micropore;
Fig. 3 is the structural representation of patch clamp chips micropore processing device of the present utility model;
The schematic diagram that Fig. 4 regulates for Gaussian beam;
Wherein, 1-ultraviolet laser, 2-beam expanding lens, 3-regulate aperture, 4-speculum, 5-condensing lens, 6-patch clamp chips anchor clamps, 7-motion control platform, 8-Computerized digital control system.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples:
A kind of patch clamp chips micropore processing device as shown in Figure 1, it comprises ultraviolet laser 1, beam expanding lens 2, regulate aperture 3, speculum 4, condensing lens 5, glass membrane pincers chip fixture 6, Computerized digital control system 8 and motion control platform 7, wherein, beam expanding lens 2 is set on the output light path of ultraviolet laser 1, be provided with on the output light path of beam expanding lens 2 and regulate aperture 3, on the output light path of adjusting aperture 3 speculum 4 is set, on the reflection output light path of speculum 4 condensing lens 5 is set, glass membrane pincers chip fixture 6 is set on the output light path of condensing lens 5, the laser control signal output terminal of aforementioned calculation machine digital control system 8 connects the control interface of ultraviolet laser 1, the position control signal output terminal of Computerized digital control system 8 connects the control interface of motion control platform 7, and glass membrane pincers chip fixture 6 places on the motion control platform 7.
In the technique scheme, the laser beam expanding multiple of beam expanding lens 2 is preferably 8～10 times.The diaphragm diameter variable range of regulating aperture 3 is preferably 1.2mm～1.8mm.Condensing lens 5 is a telecentric lens, and the focused radius minimum of condensing lens 5 is 0.7 μ m.The wavelength region of the ultraviolet Gaussian laser beam that ultraviolet laser sends is 266～355nm, and range of frequency is 10～100KHz, and the pulsewidth scope is 15～50ns, and power is 1～7 watt.
Working process of the present utility model is: glass membrane embedding chip to be processed is placed on the motion control platform, find the position in first hole to be processed by the ruddiness indication, open ultraviolet laser 1, ultraviolet laser 1 corresponding work parameter (comprising that electric current 20A, frequency are 15-20KHz) is set, make laser works under rated current and temperature, the pattern of ultraviolet laser 1 is set to MODE_1 (first pulse suppression mode), makes the laser energy of output be in more stable state.It is the center spot of the ultraviolet Gaussian laser beam of 1.2～1.8mm by regulating aperture 3 taking-up pore diameter ranges that the ultraviolet Gaussian laser beam expands Shu Houzai by beam expanding lens 2, change the angle of ultraviolet Gaussian laser beam then by speculum 4, focus on by 5 pairs of Ultra-Violet Lasers of condensing lens at last, luminous power on the glass material that arrival glass membrane pincers pincers chip fixture 6 is clamped after focusing on is between 1～2W, and on glass material, get out the micropore hole, regulate condensing lens 5 and will make the focus of ultraviolet Gaussian laser beam just drop on the upper surface of glass membrane embedding chip to be processed.By the central diameter of regulating and controlling aperture, making and forming the inlet aperture scope on the glass membrane pincers chip is 2～10 μ m, and micropore outlet aperture scope is the funnel-form micropore of 1～2 μ m, and in the use, glass membrane pincers chip thickness is 0.1mm～0.12mm.In addition, by Computerized digital control system 8 control ultraviolet laser 1 and motion control platforms 7, realized the automatization of whole work flow.
In addition, when present method was specifically implemented, regulating diaphragm diameter size was 1.5mm, opened laser and after 1 second of delaying time, and took off glass membrane and clamped chip fixture 6 measure pore size under opticmicroscope; If glass material is not punched, then can't measure its size, show that laser energy is not enough, the laser energy appropriateness need be transferred greatly till can just punching, otherwise, if the light hole aperture then needs the laser energy appropriateness is turned down till meeting the demands greater than 2 μ m; To regulate the diameter of aperture if the incidence hole aperture is bigger than normal and turn down, vice versa.Adjusting test by repeatedly guarantees that finally the aperture that processes reaches till the desired value.According to the machined parameters in first hole, finish batch machining by numerical control software.
The utility model adopts the patch clamp chips of Ultra-Violet Laser processed glass material, the Ultra-Violet Laser of high-peak power destroys material at the utmost point in the short period of time microtexture forms evenly hole of size, on glass process micron-sized hole and make chip carry out scale operation opened up a new way.
The content that is not described in detail in this specification sheets belongs to this area professional and technical personnel's known prior art.
Claims (8)
1. patch clamp chips micropore processing device, it is characterized in that: it comprises ultraviolet laser (1), beam expanding lens (2), adjusting aperture (3), condensing lens (5) and glass membrane pincers chip fixture (6), wherein, beam expanding lens (2) is set on the output light path of described ultraviolet laser (1), be provided with on the output light path of beam expanding lens (2) and regulate aperture (3), on the output light path of adjusting aperture (3) condensing lens (5) is set, glass membrane pincers chip fixture (6) is set on the output light path of condensing lens (5).
2. patch clamp chips micropore processing device according to claim 1 is characterized in that: it also comprises speculum (4), on the output light path of adjusting aperture (3) speculum (4) is set, and condensing lens (5) is set on the reflection output light path of speculum (4).
3. patch clamp chips micropore processing device according to claim 1 and 2, it is characterized in that: it also comprises Computerized digital control system (8) and motion control platform (7), wherein, the laser control signal output terminal of described Computerized digital control system (8) connects the control interface of ultraviolet laser (1), the position control signal output terminal of Computerized digital control system (8) connects the control interface of motion control platform (7), and described glass membrane pincers chip fixtures (6) place on the motion control platform (7).
4. patch clamp chips micropore processing device according to claim 1 and 2 is characterized in that: the laser beam expanding multiple of described beam expanding lens (2) is 8～10 times.
5. patch clamp chips micropore processing device according to claim 1 and 2 is characterized in that: the diaphragm diameter variable range of described adjusting aperture (3) is 1.2mm～1.8mm.
6. patch clamp chips micropore processing device according to claim 1 and 2 is characterized in that: described condensing lens (5) is a telecentric lens, and the focused radius minimum of condensing lens (5) is 0.7 μ m.
7. patch clamp chips micropore processing device according to claim 1 and 2 is characterized in that: the wavelength region of the ultraviolet Gaussian laser beam that described ultraviolet laser (1) sends is 266～355nm.
8. patch clamp chips micropore processing device according to claim 1 and 2 is characterized in that: the range of frequency of the ultraviolet Gaussian laser beam that described ultraviolet laser (1) sends is 10～100KHz, and the pulsewidth scope is 15～50ns, and power is 1～7 watt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200347358U CN202038984U (en) | 2011-01-31 | 2011-01-31 | Micropore processing device of patch clamp chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200347358U CN202038984U (en) | 2011-01-31 | 2011-01-31 | Micropore processing device of patch clamp chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202038984U true CN202038984U (en) | 2011-11-16 |
Family
ID=44966439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200347358U Expired - Fee Related CN202038984U (en) | 2011-01-31 | 2011-01-31 | Micropore processing device of patch clamp chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202038984U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103183470A (en) * | 2013-04-07 | 2013-07-03 | 北京工业大学 | Light-saw glass laser cutting system and method |
| CN108795751A (en) * | 2017-04-28 | 2018-11-13 | 中国科学院大连化学物理研究所 | One kind " funnel " sample three-dimensional cell aggregation culture chip and preparation method thereof |
| CN110143755A (en) * | 2019-06-27 | 2019-08-20 | Oppo广东移动通信有限公司 | It is cut by laser the method for film covered glass, the shell and electronic equipment of electronic equipment |
| CN115362281A (en) * | 2020-04-09 | 2022-11-18 | 马克思-普朗克科学促进协会 | Thermal laser evaporation system and method of providing a thermal laser beam at a source |
-
2011
- 2011-01-31 CN CN2011200347358U patent/CN202038984U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103183470A (en) * | 2013-04-07 | 2013-07-03 | 北京工业大学 | Light-saw glass laser cutting system and method |
| CN108795751A (en) * | 2017-04-28 | 2018-11-13 | 中国科学院大连化学物理研究所 | One kind " funnel " sample three-dimensional cell aggregation culture chip and preparation method thereof |
| CN110143755A (en) * | 2019-06-27 | 2019-08-20 | Oppo广东移动通信有限公司 | It is cut by laser the method for film covered glass, the shell and electronic equipment of electronic equipment |
| CN115362281A (en) * | 2020-04-09 | 2022-11-18 | 马克思-普朗克科学促进协会 | Thermal laser evaporation system and method of providing a thermal laser beam at a source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102151997A (en) | Method for processing micropore of patch clamp chip | |
| CN202038984U (en) | Micropore processing device of patch clamp chip | |
| TWI655986B (en) | Laser processing method | |
| US20170266757A1 (en) | Transparent material cutting with ultrafast laser and beam optics | |
| TWI584906B (en) | Method and apparatus for non-abaltive, photoaccoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses | |
| WO2017210899A1 (en) | Method and device for cutting sapphire | |
| CN108015410A (en) | One kind is based on femtosecond laser induction amorphous gemSbnTekThe method of film preparation crystalline state nanostructured | |
| US9575021B2 (en) | Piezoelectric substrate for the study of biomolecules | |
| TW200417096A (en) | System and method for cutting using a variable astigmatic focal beam spot | |
| CN105458529A (en) | Method for efficiently making large-depth-diameter-ratio micropore arrays | |
| TW201528474A (en) | Electro/mechanical microchips and method of making with burst ultrafast laser pulses | |
| EP2376263B1 (en) | A method of introducing a structure in a substrate | |
| Zalloum et al. | On femtosecond micromachining of HPHT single-crystal diamond with direct laser writing using tight focusing | |
| CN102307699A (en) | Workpiece cutting method | |
| US20100038825A1 (en) | Methods of forming microchannels by ultrafast pulsed laser direct-write processing | |
| CN206105146U (en) | Laser precision finishing light path | |
| CN112453730A (en) | Laser processing system and processing method for micropores with high depth-diameter ratio | |
| CN109352184A (en) | The beam splitting laser cutting method of silicon-based wafer | |
| CN109604838A (en) | Semiconductor laser processing unit (plant) | |
| CN102717193B (en) | Device and method for manufacturing silicon solar cell electrode printing screen through laser | |
| Vogel et al. | A support structure for biomimetic applications | |
| CN110142510A (en) | Laser soldering device and its method for metal nano element | |
| CN201154415Y (en) | Ultraviolet laser machining system of diaphragm for scanning electron microscope | |
| CN110508932B (en) | Method for processing microstructure array on gallium nitride surface by femtosecond laser wet etching | |
| CN206169491U (en) | System for laser scribing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WUHAN TOPWIN OPTOELECTRONICS TECHNOLOGY CO.,LTD. Free format text: FORMER OWNER: HUAZHONG SCINECE AND TECHNOLOGY UNIV Effective date: 20130201 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430074 WUHAN, HUBEI PROVINCE TO: 430205 WUHAN, HUBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130201 Address after: 430205, Wen Xin building, 111 Optics Valley Road, Wuhan Road, East Lake Development Zone, Hubei, Optics Valley, 205 Patentee after: Wuhan Topwin Optoelectronics Technology Co., Ltd. Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Huazhong University of Science and Technology College of Optoelectronic Science and Engineering Patentee before: Huazhong University of Science and Technology |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20180131 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |