CN103183470A - Light-saw glass laser cutting system and method - Google Patents

Abstract

A light-saw glass laser cutting system and method belong to the laser field. The light-saw glass laser cutting system is characterized by comprising a laser, a laser focus motion controller, a reflector, a two-dimensional platform and a computer, wherein the computer controls the laser, the laser focus motion controller and the two-dimensional platform; according to the shape of glass to be cut, the two-dimensional motion track of the two-dimensional platform is set; laser focuses reciprocate in the light beam direction in the glass so as to cut the glass material as a saw; the movement speed of the two-dimensional platform and the reciprocating speed and laser power of the laser focuses are set; and the laser is started to control the relative movement of a light saw and the glass so as to complete glass cutting. The light-saw glass laser cutting system and method are suitable for cutting various glass materials and glass in various thicknesses, and achieve cutting of various shapes. The light saw is fully utilized in the cutting process, the required laser power can be remarkably reduced in the cutting process, and heavy sheet glass can be cut without high power.

Description

A kind of System and method for of laser light saw formula glass-cutting

Technical field

The present invention relates to a kind of " light saw " formula glass cutting method that utilizes low-power laser, can cut thicker glass.

Background technology

Glass is used very extensive in industrial production and daily life.Utilize laser that glass is cut, more original cut mechanically method has plurality of advantages.At present, the laser that is used for carrying out glass cutting mainly is that wavelength is that YAG laser and the wavelength of 1.06 μ m is the CO of 10.6 μ m ₂Laser, principle all are to induce control glass breakage or high-energy fused cutting, and its working power is determined by the thickness of glass.Glass is more thick, and power demand is more big, and is general most more than 100W, and easily produce uncontrollable crackle when carrying out the non-conventional glass cutting, causes the fraction defective height.Owing to the high permeability of glass to laser, most of energy is not absorbed by glass, causes the energy to be wasted in a large number in addition.People are badly in need of a kind of energy-conservation, the efficient cutting method that also can finish various split requirements.

Summary of the invention

At above content, the present invention proposes a kind of low power, highly reliable, the glass cutting method that can carry out special-shaped cutting, can be used for glass to the cutting arbitrary shape, also can be on the inclined-plane that cuts out on glass.

The present invention can be that the common green laser of long pulse or the single pulse energy of 1w is 1 little Jiao's Ultra-Violet Laser with the maximum average power, realizes that thickness 20mm is with straight cuts, the abnormity cutting of interior glass.Reduce the power of laser cutting heavy sheet glass greatly, had good crackle controllability.Cut applied widely, as various glass such as simple glass, dopant ion glass, ultra-clear glasses, liquid-crystalline glasses.

The system of laser light saw formula glass-cutting is characterized in that comprising laser apparatus, laser spot motion controller, speculum, two-dimensional stage and computer, by computer controlled laser, laser spot motion controller and two-dimensional stage.

Described laser apparatus is pulse green laser or pulsed ultraviolet laser device.

The cutting method of using described system has following three steps:

(1) according to the shape of glass to be cut, the two-dimensional motion track of two-dimensional stage is set;

(2) laser spot reciprocatingly moves in glass light beam inside direction, as " saw " glass material is cut:

(3) open laser apparatus, the cutting to glass is finished in the relative movement of control " light saw " and glass.

Concrete steps are:

(1) according to shape to be cut, the movement locus (movement locus on xy plane) of two-dimensional stage is set.

(2) thus according to thickness of glass to be cut the laser spot motion controller is arranged the control focus at the range of movement of z direction.

(3) determine the laser starting position.

(4) open laser, finish cutting.

Described z direction refers to the thickness of glass direction.

Described xy plane refers to: the plane that is parallel to glass surface to be processed.

Described shape to be cut refers to: straight line, curve or closed curve etc.

Described two-dimensional stage refers to: can carry the electromigration platform combination that material to be cut moves in x and y direction.

Described laser spot motion controller refers to: be used for controlling and changing one group of lens combination of focal position, there is a slice can accurate mobile dynamic focusing mirror in the lens combinations, whenever little displacement of its generation, big displacement will take place in the position of laser spot.When the dynamic focusing mirror was done vibration at high speed, laser spot was done the high speed to-and-fro movement in the Laser Transmission direction, formed similar " saw " the same " light saw ".During cutting, the same glass-cutting material of lasing image saw blade.

Described focussing movement scope refers to: laser is in cutting process, and focus is in the z direction reciprocating scope of high speed up and down, the top and the distance between the below.Cut more thick glass, the distance that focus need be passed by in the z direction is more big.

Described laser starting position refers to: the position of laser spot when the cutting beginning, be equivalent to " going into cutter " position, and should be positioned at beyond the glass to be cut.

Principle of work of the present invention is: two-dimensional stage drives glass material and moves along default cutting path, utilizes " the light saw " of dynamic lens group control laser spot to do high speed to-and-fro movement up and down at the thickness direction of glass material simultaneously.Because focus place energy density height, at small blasting point of the inner generation of glass, these light shot points link together, and just form " saw kerf ", and saw kerf is constantly mobile with severing of glass.

Cutting speed in feet per minute will arrange according to material thickness and material type needs focusing to-and-fro movement speed and two-dimensional stage movement velocity, and focus to-and-fro movement speed and two-dimensional stage are uniform motion, should satisfy following formula when arranging:

$\frac{(D\÷d)\×h}{D\÷v_{\mathrm{xy}}}=v_z---\left(1\right)$

$R_e=\frac{v_z}{k}---\left(2\right)$

D is the total length of cutting path, and h is the cutting distance of z direction, and for guaranteeing cutting quality, h should be than the big 0.1 ~ 1mm of material thickness to be cut usually.D be focus z direction motion h apart from the time two-dimensional stage in the distance of xy planar motion.The more little cutting accuracy of d is more high, but cutting speed in feet per minute can descend, and in the straight cuts, d is 60 ~ 90 μ m, and d is 40 ~ 70 μ m in the curvilinear cut.v _XyBe the movement velocity of two-dimensional stage, be generally 300 ~ 600mm/min, v _zBe the speed that focus moves in the z direction.R _eBe the pulse-repetition of laser apparatus output laser, it arranges regular coincidence formula (2), and wherein k gets 0.15 in curvilinear cut, gets 0.2 in straight cuts.D can be eliminated in the abbreviation process in the formula (1), in order to understand conveniently, keeps herein.

The present invention can realize straight cuts, the curvilinear cut to glass and cut out circle, square, irregular closed curve etc. from glass material.

Characteristics of the present invention are:

1. compare with other laser processing means, laser spot of the present invention is moved in the z direction, and revocable.

2. compare with traditional glass cutter cutting, belong to noncontact processing, and can better control machining locus.Has higher tangent plane planeness.

3. different with the laser apparatus of other cutting glass by laser uses, what the present invention used is common pulse green (light) laser or pulsed ultraviolet laser device.

4. the method with other cutting glass by laser is different, and the CO of wavelength 10.6 μ m is used in traditional glass cutting that utilizes laser to carry out usually ₂Laser apparatus or wavelength are the YAG laser apparatus of 1.06 μ m, method is that laser shines glass according to desired trajectory, focus in the glass, glass is heated and ruptures, slight crack surface up and down extends, finish cutting, the slight crack of this extension is perpendicular to glass surface, and must arrive glass surface and just can stop.The method that the present invention adopts then is that the blasting point fracture of small scope connects.Utilize the focus place that glass is caused the damage of micron level, utilize dynamic focusing mirror group will damage in the thickness direction stack then, utilize the two-dimension translational platform that line of cut is expanded to tangent plane simultaneously, as same handle " light saw " material is cut.Because the processing of each position in the motion course of processing all is a preheating to position, mobile back glass material, thereby significantly reduced the generation of crackle.

5. compare with other laser cutting with the cutting of traditional glass cutter, principle of work of the present invention has determined it can be used for finishing the processing that any right angle, curve comprise closed curve.

Description of drawings

The structural representation of glass cutting system among Fig. 1 the present invention

Among the figure: 1, laser apparatus, 2, the laser spot motion controller, 3, speculum, 4, xy two dimension electromigration platform, 5, computer,

The circular cutting member of Fig. 2 1.1mm ultra-clear glasses.

Fig. 3 thickness is the simple glass cutting member of 9mm

Fig. 4 1mm heavy sheet glass camber line cutting member

Embodiment

Present embodiment only is used for the present invention is further specified.

Example 1

Select for use the little mean power of volume to be lower than the semiconductor pumped green (light) laser of 532nm of 1W, selecting thickness for use is that the simple glass of 1.1mm is as material to be cut; Select for use circular as cutting profile.This example belongs to the cutting of glass closed curve.

This example carries out by the following method: glass is cleaned up, place on the processing platform; The platform movement path is set to the circle of diameter 3cm, utilizes the xy difference to mend motion and realizes; Be zero position with the laser focusing point location in cutting position.By the dynamic focusing mirror focus is set at the range of movement of z direction and is 1.2mm, xy direction movement velocity is set at 500mm/min, focussing movement speed is set is 200mm/s(to get d be 50 μ m, calculate according to formula 1), repetition 1.4kHz(is calculated by formula 2).It is 500mW that laser power is set.Open laser apparatus, make laser apparatus begin cutting according to preset parameters; After finishing, cutting can obtain circular cutting member.Pictorial diagram is seen Fig. 2.

Example 2

Select for use the little mean power of volume to be lower than the semiconductor pumped green (light) laser of 532nm of 1W, selecting thickness for use is that the simple glass of 9mm is as material to be cut; Select for use square as cutting profile, this example belongs to the glass linear cutting.

This example is carried out by the following method: glass is cleaned up, place on the processing platform; The movement path of two-dimensional stage is set to the square that the length of side is 3cm; The zero position of laser is set, and setting laser device power is 600mW.By the dynamic focusing mirror focus being set at the range of movement of z direction is 9.5 mm, xy direction movement velocity is set at 400mm/min, focussing movement speed is set is 900mm/s(to get d be 70 μ m, calculate according to formula 1), repetition 4.5kHz(is calculated by formula 2).Open laser apparatus, make laser apparatus begin cutting according to preset parameters; After finishing, cutting can obtain circular cutting member.Pictorial diagram is seen Fig. 3.

Example 3

It is 1 little Jiao that the present invention selects single pulse energy for use, the 355nm ultraviolet frequency tripling laser of maximum repetition rate 10kHz, and selecting thickness for use is that the simple glass of 1mm is as material to be cut; Select for use camber line as cutting profile, this example belongs to the cutting of simple glass camber line.

This example is carried out by the following method: glass is cleaned up, place on the processing platform; The movement path of two-dimensional stage is set to one section circular arc; The zero position of laser is set.By the dynamic focusing mirror focus being set at the range of movement of z direction is 1.2 mm, xy direction movement velocity is set at 400mm/min, arrange focus z direction movement velocity be 200mm/s(to get d be 40 μ m, calculate according to formula 1), repetition 1.3kHz(is calculated by formula 2).It is 600mW that power is set.Open laser apparatus, make laser apparatus begin cutting according to preset parameters; After finishing, cutting can obtain the arc cutting member.Pictorial diagram is seen Fig. 4.

Claims (3)

1. the system of laser light saw formula glass-cutting is characterized in that comprising laser apparatus, laser spot motion controller, speculum, two-dimensional stage and computer, by computer controlled laser, laser spot motion controller and two-dimensional stage.

2. according to the system of claim 1, it is characterized in that described laser apparatus is pulse green laser or pulsed ultraviolet laser device.

3. according to the system of claim 1, cutting method has following three steps:

(1) according to the shape of glass to be cut, the two-dimensional motion track of two-dimensional stage is set;

(2) laser spot reciprocatingly moves in glass light beam inside direction, as " saw " glass material is cut: to-and-fro movement speed and laser power that two-dimensional stage movement velocity and laser spot are set; Speed is according to formula

And formula

Determine; Power is 400mw ~ 800mw; D is the total length of cutting path, and h is the cutting distance of z direction, and h should be than the big 0.1 ~ 1mm of material thickness to be cut; D be focus z direction motion h apart from the time two-dimensional stage in the distance of xy planar motion; In the straight cuts, d is 60 ~ 90 μ m, and d is 40 ~ 70 μ m in the curvilinear cut; v _XyBeing the movement velocity of two-dimensional stage, is 300 ~ 600mm/min, v _zBe the speed that focus moves in the z direction;

R _eBe the pulse-repetition of laser apparatus output laser, wherein k gets 0.15 in curvilinear cut, gets 0.2 in straight cuts;

(3) open laser apparatus, the cutting to glass is finished in the relative movement of control " light saw " and glass.

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