WO2021082060A1

WO2021082060A1 - Display panel and preparation method therefor

Info

Publication number: WO2021082060A1
Application number: PCT/CN2019/116727
Authority: WO
Inventors: 杨中国
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2019-10-30
Filing date: 2019-11-08
Publication date: 2021-05-06
Also published as: CN110854291A

Abstract

Provided are a display panel and a preparation method therefor. The display panel comprises a display region and a non-display region surrounding the display region; an array substrate and a color film substrate that are arranged opposite one another; an encapsulation structure, the encapsulation structure comprising a first adhesive layer that is arranged on a face of the array substrate facing the color film substrate and extends from the display region to the non-display region; a second adhesive layer that is arranged on a face of the color film substrate facing the array substrate and extends from the display region to the non-display region, with the first adhesive layer and the second adhesive layer being adhered to each other; and a water absorption layer arranged between the first adhesive layer and the second adhesive layer, with the water absorption layer being located in the non-display region and surrounding the display region.

Description

Display panel and preparation method thereof

Technical field

The invention relates to the technical field of display panels, in particular to a display panel and a preparation method thereof.

Background technique

Quantum dot (QD) is an inorganic nano-scale semiconductor material. By applying a certain light pressure and electric field to it, it will emit light of a specific frequency, and the frequency of the emitted light will change with the size of the quantum dot. Therefore, by precisely controlling the size of quantum dots, very pure RGB primary colors can be emitted, thereby significantly improving the color gamut. OLED has the characteristics of self-luminescence, ultra-light and thin, fast response speed, and wide viewing angle. Blue OLED devices are ideal light sources for excitation of quantum dots. Therefore, the combination of quantum dots and blue OLED (QD-BOLED) panels will have the advantages of both quantum dots and OLEDs, thereby improving product performance. However, both quantum dots and OLEDs are easily affected by water vapor and must be packaged. New packaging methods and structures need to be developed to package QD-BOLED display panels.

At present, the main packaging methods for bottom-emitting large-size OLED display panels mainly include surface bonding packaging, frame glue, moisture absorbent, and filling glue packaging. For the existing surface-laminated encapsulant material for bottom light emission, its structure is divided into two layers. The first layer is a water-absorbing layer, which contains metal oxide particles as a water-absorbing desiccant, and its particle size is 1- Around 6um, the second layer is a buffer layer, which is mainly used to bond the substrate and absorb impact to protect the OLED light-emitting layer. Obviously, the existing surface-laminated encapsulant materials cannot be used in top-emitting OLEDs, because the water-absorbing layer contains desiccant particles, and the transmittance is less than 5%, which cannot meet the top-emitting requirements for a transmittance greater than 98%. The current solution is to replace the micron-sized desiccant particles with nano-sized desiccant particles, or replace the opaque desiccant with light-transmitting desiccant particles, although the transmittance of these two methods can meet the requirements , But the life of the encapsulation layer cannot reach the mass production level.

Therefore, it is indeed necessary to develop a new type of display panel packaging method to overcome the defects of the prior art.

technical problem

An object of the present invention is to provide a display panel, which can solve the problem that the surface-laminated encapsulant material cannot be used for top-emitting OLEDs in the prior art.

Technical solutions

In order to achieve the above object, the present invention also provides a display panel, including a display area and a non-display area surrounding the display area; and an array substrate and a color filter substrate, which are arranged opposite to each other; an encapsulation structure, the encapsulation structure including a first resistor A water layer is provided on the side of the array substrate facing the color filter substrate and extends from the display area to the non-display area; the first adhesive layer is provided on the first water blocking layer; The second water blocking layer is disposed on the side of the color filter substrate facing the array substrate and extending from the display area to the non-display area; the second adhesive layer is disposed on the second water blocking layer , The first adhesive layer and the second adhesive layer are bonded to each other; a water-absorbing layer is provided between the first adhesive layer and the second adhesive layer, and the water-absorbing layer is located on the The non-display area surrounds the display area.

Further, in other embodiments, the edge of the water-absorbing layer close to the non-display area is flush with the edges of the first adhesive layer and the second adhesive layer.

Further, in other embodiments, the edge of the water-absorbing layer facing the non-display area is located inside the edges of the first adhesive layer and the second adhesive layer.

Further, in other embodiments, the water-absorbing layer is made of a pressure-sensitive or heat-sensitive adhesive.

Further, in other embodiments, wherein the thickness of the water-absorbing layer is 10-30um, the thickness of the first adhesive layer and the second adhesive layer are both 10-50um, and the thickness of the water-absorbing layer is less than the thickness of the water-absorbing layer. Half of the total thickness of the first adhesive layer and the second adhesive layer.

Further, in other embodiments, wherein a plurality of desiccant particles are dispersed in the water-absorbing layer, the desiccant particles adopt one of metal oxide or water-absorbing molecular sieve, and the particle size of the desiccant particles is less than 6um.

Further, in other embodiments, the light transmittance of the first adhesive layer and the second adhesive layer is greater than 98%.

Further, in other embodiments, the array substrate includes a thin film transistor structure layer;

The blue OLED device layer is arranged on the thin film transistor structure layer and is located in the display area; wherein the first water blocking layer completely covers the blue OLED device layer, and the edge of the first water blocking layer is located at the edge of the blue OLED device layer. The inner side of the edge of the first adhesive layer.

Further, in other embodiments, the color filter substrate includes a cover plate; an RGB color resist and a black photoresist layer are provided on the cover plate and are located in the display area; and the barrier layer covers the RGB color resist and black photoresist layer; a pixel definition layer, arranged on the barrier layer, in the display area, the pixel definition layer has a number of openings; a quantum dot layer, arranged in the openings; The second water blocking layer completely covers the quantum dot layer, the pixel definition layer, and the RGB color resist and black photoresist layer; wherein the edge of the second inorganic water blocking layer is located on the second adhesive layer The inside of the edge.

The present invention also provides a preparation method for preparing the display panel of the present invention, including a display area and a non-display area surrounding the display area. The preparation method includes the following steps: providing a color film substrate;

Prepare a second water blocking layer on the color filter substrate; provide an encapsulation layer, and attach the encapsulation layer to the color filter substrate; the encapsulation layer includes a second adhesive layer; On the first adhesive layer in the non-display area; a first adhesive layer is provided on the first adhesive layer and the water-absorbing layer in the non-display area; wherein the second adhesive layer is pasted On the second water blocking layer; providing an array substrate; preparing a first water blocking layer on the array substrate; sticking the first adhesive layer on the first water blocking layer; curing the Encapsulation layer.

Beneficial effect

Compared with the prior art, the beneficial effects of the present invention are: the present invention provides a display panel and a preparation method thereof. A water-absorbing layer is arranged between two adhesive layers in a non-display area, and the outer edge of the water-absorbing layer is connected to the adhesive layer. The outer edge of the adhesive layer is flush or inside the outer edge of the adhesive layer. The average transmittance of the adhesive layer in the full band (380-780nm) is greater than 98%, so as to meet the top emission requirements for transmittance while improving the package The life of the layer.

Description of the drawings

In order to explain the technical solutions in the embodiments of the present invention more clearly, the following will briefly introduce the drawings needed in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

2 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

3 is a schematic diagram of the structure in step S11 of the method for manufacturing a display panel according to an embodiment of the present invention;

4 is a schematic structural diagram of the method for manufacturing a display panel provided by an embodiment of the present invention in step S12;

5 is a schematic diagram of the structure in step S13 of the manufacturing method of the display panel provided by the embodiment of the present invention;

6 is a schematic structural diagram of the method for manufacturing a display panel provided by an embodiment of the present invention in step S14;

FIG. 7 is a schematic diagram of the structure in step S2 of the manufacturing method of the display panel provided by the embodiment of the present invention; FIG.

8 is a schematic diagram of the structure in step S3 of the manufacturing method of the display panel provided by the embodiment of the present invention;

FIG. 9 is a schematic diagram of the structure in step S41 of the method for manufacturing a display panel according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of the structure in step S42 of the method for manufacturing a display panel according to an embodiment of the present invention;

11 is a schematic diagram of the structure in step S5 of the method for manufacturing a display panel provided by an embodiment of the present invention;

FIG. 12 is a schematic diagram of the structure in step S6 of the method for manufacturing a display panel according to an embodiment of the present invention.

Reference signs in the detailed description:

Display panel-100; Array substrate-10;

Package structure-20; color film substrate-30;

Encapsulation layer-40;

The first water blocking layer-21; the first adhesive layer-22;

The second water blocking layer -23; the second adhesive layer -24;

Water-absorbing layer 25;

Thin film transistor structure layer-11; blue OLED device layer-12;

Cover-31; RGB color resistance -32;

Black photoresist layer-33; barrier layer-34;

Pixel definition layer-35; quantum dot layer-36.

The best mode of the present invention

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

The specific structure and functional details disclosed herein are only representative, and are used for the purpose of describing exemplary embodiments of the present invention. However, the present invention can be embodied in many alternative forms, and should not be construed as being limited only to the embodiments set forth herein.

Please refer to FIG. 1, which is a schematic structural diagram of a display panel 100 provided by the present invention, including a display area and a non-display area surrounding the display area; and an array substrate 10, a color filter substrate 30 and a packaging structure 20.

The array substrate 10 and the color filter substrate 30 are disposed opposite to each other, and the packaging structure 20 is disposed between the array substrate 10 and the color filter substrate 30.

The array substrate 10 includes a thin film transistor structure layer 11 and a blue OLED device layer 12 disposed on the thin film transistor structure layer 11, and the blue OLED device layer 12 is located in the display area. Specifically, the thin film transistor structure 11 includes a base substrate, a buffer layer provided on the base substrate, an active layer provided on the buffer layer, a gate planarization layer provided on the active layer, and a gate planarization layer provided on the active layer. The gate layer on the planarization layer, the source and drain layer provided on the gate layer, the protective layer provided on the source and drain layer, the pixel electrode layer provided on the protective layer, the thin film transistor structure 11 has several arrays Arranged sub-pixels, each sub-pixel includes the active layer, the gate planarization layer, the gate layer, and the source drain layer. The main design point of this case is the package structure 20, so the specific structure of the thin film transistor structure 11 will not be repeated one by one.

The color filter substrate 30 includes a cover plate 31, an RGB color resist 32, a black photoresist layer 33, a barrier layer 34, a pixel definition layer 35, and a quantum dot layer-36. The RGB color resist 32 and the black photoresist layer 33 are arranged on the cover plate 31 at intervals and are located in the display area; the blocking layer 34 is arranged on the RGB color resist 32 and the black photoresist layer 33 and covers the RGB color resist 32 And the black photoresist layer 33; the pixel definition layer 35 is provided on the barrier layer 34 in the display area; the pixel definition layer 35 has a number of openings, and the quantum dot layer 36 is provided in the openings.

The packaging structure 20 includes a first water blocking layer 21, a first adhesive layer 22, a second water blocking layer 23, a second adhesive layer 24 and a water absorption layer 25. The first water blocking layer 21 is provided on the side of the array substrate 10 facing the color filter substrate 30 and extends from the display area to the non-display area; wherein the first water blocking layer 21 completely covers the blue OLED device layer 12; An adhesive layer 22 is provided on the first water-blocking layer 21 and completely covers the first water-blocking layer 21 to further improve the packaging effect of the display panel.

The second water blocking layer 23 is provided on the side of the color filter substrate 30 facing the array substrate 10 and extends from the display area to the non-display area; the second water blocking layer 23 completely covers the quantum dot layer 36 and the pixel definition layer 35, the RGB color resist 32 and the black photoresist layer 33; the second adhesive layer 24 is disposed on the second water blocking layer 23 and completely covers the second water blocking layer 23.

The first adhesive layer 22 and the second adhesive layer 24 are bonded to each other; the water-absorbent layer 25 is provided between the first adhesive layer 22 and the second adhesive layer 24, and the water-absorbent layer 25 is located in the non-display area and surrounds the述display area. In this embodiment, the edge of the water absorbing layer 25 facing the non-display area is located inside the edges of the first adhesive layer 22 and the second adhesive layer 24.

In other embodiments, the edge of the water-absorbing layer 25 near the non-display area is flush with the edges of the first adhesive layer 22 and the second adhesive layer.

In this embodiment, the water-absorbing layer 25 adopts a pressure-sensitive or heat-sensitive adhesive.

The thickness of the water-absorbing layer 25 is 10-30um, the thickness of the first adhesive layer 22 and the second adhesive layer 24 are both 10-50um, and the thickness of the water-absorbing layer 25 is smaller than that of the first adhesive layer 22 and the second adhesive layer. The thickness of 24 is half the sum of the thickness. The light transmittance of the first adhesive layer 22 and the second adhesive layer 24 is greater than 98%, which satisfies the transmittance requirements of the top luminescence and improves the service life of the encapsulation layer.

Several desiccant particles are dispersed in the water-absorbing layer 25, and the desiccant particles are one of metal oxide or water-absorbing molecular sieve, and the particle size of the desiccant particles is less than 6um.

The present invention also provides a manufacturing method for manufacturing the display panel 100 of the present invention, including a display area and a non-display area surrounding the display area. The manufacturing method includes the following steps S1-S6. Please refer to FIG. 2, which is a flowchart of a manufacturing method of the display panel 100 according to an embodiment of the present invention.

Step S1: Provide a color filter substrate 30; Step S1 includes steps S11-S14.

Step S11: Provide a cover plate 31; please refer to FIG. 3, which is a schematic structural diagram of the method for manufacturing a display panel according to an embodiment of the present invention in step S11.

Step S12: preparing the RGB color resists 32 and the black photoresist layer 33; please refer to FIG. 4, which is a schematic diagram of the structure in step S12 of the manufacturing method of the display panel provided by the embodiment of the present invention.

Step S13: Prepare the barrier layer 34 on the RGB color resist 32 and the black photoresist layer 33, and prepare the pixel definition layer 35 on the barrier layer 34; please refer to FIG. 5, which is a view of the display panel provided by an embodiment of the present invention. Schematic diagram of the structure in step S13 of the preparation method.

The pixel definition layer 35 has several openings.

Step S14: Fill the quantum dot layer 36 in the opening of the pixel definition layer 35; please refer to FIG. 6, which is a schematic diagram of the structure in step S14 of the method for manufacturing a display panel according to an embodiment of the present invention.

Step S2: preparing a second water blocking layer 23 on the color filter substrate 30; please refer to FIG. 7, which is a schematic diagram of the structure in step S2 of the method for preparing a display panel according to an embodiment of the present invention.

The second water blocking layer 23 completely covers the quantum dot layer 36, the pixel definition layer 35, the RGB color resist 32 and the black photo resist layer 33.

Step S3: Provide an encapsulation layer 40, and attach the encapsulation layer 40 to the color filter substrate 30; please refer to FIG. 8, which is a schematic diagram of the structure in step S3 of the method for manufacturing a display panel according to an embodiment of the present invention.

The packaging layer 40 includes a first adhesive layer 22, a second adhesive layer 24 and a water-absorbing layer 25. The first adhesive layer 22 and the second adhesive layer 24 are bonded to each other; the water-absorbent layer 25 is provided between the first adhesive layer 22 and the second adhesive layer 24, and the water-absorbent layer 25 is located in the non-display area and surrounds the述display area. In this embodiment, the edge of the water absorbing layer 25 facing the non-display area is located inside the edges of the first adhesive layer 22 and the second adhesive layer 24.

The second adhesive layer 24 is adhered to the second water blocking layer 23, and the second adhesive layer 24 completely covers the second water blocking layer 23.

Step S4: Provide an array substrate 10; Step S4 includes steps S41-S42. Step S41: Provide a thin film transistor structure layer 11, please refer to FIG. 9 which is a schematic diagram of the structure in step S41 of the method for manufacturing a display panel according to an embodiment of the present invention.

Step S42: preparing a blue light blue OLED device layer 12 on the thin film transistor structure layer 11, please refer to FIG. 10, which is a schematic diagram of the structure of the display panel manufacturing method step S42 according to an embodiment of the present invention.

The blue OLED device layer 12 is located in the display area.

Step S5: preparing a first water blocking layer 21 on the array substrate 10; please refer to FIG. 11, which is a schematic diagram of the structure in step S5 of the method for preparing a display panel according to an embodiment of the present invention.

The first water blocking layer 21 is located on the blue OLED device layer 12 and completely covers the blue OLED device layer 12.

Step S6: Paste the first adhesive layer 22 on the first water blocking layer 21 to cure the encapsulation layer 40; please refer to FIG. 12, which is a method for preparing a display panel according to an embodiment of the present invention during step S5 Schematic diagram of the structure.

The first adhesive layer 22 completely covers the first water blocking layer 21.

The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be considered This is the protection scope of the present invention.

Claims

A display panel, which includes a display area and a non-display area surrounding the display area; and an array substrate and a color filter substrate, which are arranged opposite to each other; an encapsulation structure, the encapsulation structure includes:

The first water blocking layer is provided on the side of the array substrate facing the color filter substrate, and extends from the display area to the non-display area;

The first adhesive layer is arranged on the first water blocking layer;

The second water blocking layer is provided on the side of the color filter substrate facing the array substrate and extends from the display area to the non-display area;

The second adhesive layer is arranged on the second water blocking layer, and the first adhesive layer and the second adhesive layer are bonded to each other;

The water-absorbing layer is arranged between the first adhesive layer and the second adhesive layer, and the water-absorbing layer is located in the non-display area and surrounds the display area.
The display panel of claim 1, wherein the edge of the water-absorbing layer near the non-display area is flush with the edges of the first adhesive layer and the second adhesive layer.
The display panel according to claim 1, wherein the edge of the water-absorbing layer facing the non-display area is located inside the edges of the first adhesive layer and the second adhesive layer.
The display panel according to claim 1, wherein the water-absorbing layer is made of a pressure-sensitive or heat-sensitive adhesive.
The display panel according to claim 1, wherein the thickness of the water-absorbing layer is 10-30um, the thickness of the first adhesive layer and the second adhesive layer are both 10-50um, and the thickness of the water-absorbing layer It is less than half of the total thickness of the first adhesive layer and the second adhesive layer.
The display panel according to claim 1, wherein a plurality of desiccant particles are dispersed in the water-absorbing layer, and the desiccant particles are one of metal oxide or water-absorbing molecular sieve, and the size of the desiccant particles is less than 6um.
The display panel of claim 1, wherein the light transmittance of the first adhesive layer and the second adhesive layer is greater than 98%.
The display panel of claim 1, wherein the array substrate comprises:

Thin film transistor structure layer;

The blue OLED device layer is arranged on the thin film transistor structure layer and is located in the display area;

The first water blocking layer completely covers the blue OLED device layer, and the first adhesive layer completely covers the first water blocking layer.
The display panel of claim 1, wherein the color filter substrate comprises:

Cover

The RGB color resist and the black photoresist layer are arranged on the cover plate and located in the display area;

A barrier layer, covering the RGB color resist and black photoresist layer;

A pixel definition layer, arranged on the barrier layer, and in the display area, the pixel definition layer has a number of openings;

The quantum dot layer is arranged in the opening; the second water blocking layer completely covers the quantum dot layer, the pixel definition layer, and the RGB color resist and black photoresist layer; wherein the second adhesive The bonding layer completely covers the second inorganic water blocking layer.
A preparation method for preparing the display panel according to claim 1, comprising a display area and a non-display area surrounding the display area, wherein the method comprises the following steps:

Provide a color film substrate;

Preparing a second water blocking layer on the color filter substrate;

An encapsulation layer is provided, and the encapsulation layer is attached to the color filter substrate; the encapsulation layer includes

Second adhesive layer;

The water-absorbing layer is arranged on the first adhesive layer in the non-display area;

The first adhesive layer is provided on the first adhesive layer and the water-absorbing layer of the non-display area;

Wherein the second adhesive layer is pasted on the second water blocking layer;

Provide an array substrate;

Preparing a first water blocking layer on the array substrate;

Sticking the first adhesive layer on the first water blocking layer;

Curing the encapsulation layer.
10. The preparation method according to claim 10, wherein the edge of the water-absorbing layer near the non-display area is flush with the edges of the first adhesive layer and the second adhesive layer.
10. The preparation method according to claim 10, wherein the edge of the water-absorbing layer facing the non-display area is located inside the edges of the first adhesive layer and the second adhesive layer.
The preparation method according to claim 10, wherein the water-absorbing layer is made of a pressure-sensitive or heat-sensitive adhesive.
The preparation method according to claim 10, wherein the thickness of the water-absorbing layer is 10-30um, the thickness of the first adhesive layer and the second adhesive layer are both 10-50um, and the thickness of the water-absorbing layer It is less than half of the total thickness of the first adhesive layer and the second adhesive layer.
The preparation method according to claim 10, wherein a plurality of desiccant particles are dispersed in the water-absorbing layer, and the desiccant particles are one of metal oxide or water-absorbing molecular sieve, and the size of the desiccant particles is less than 6um.
The preparation method according to claim 10, wherein the light transmittance of the first adhesive layer and the second adhesive layer is greater than 98%.
The manufacturing method according to claim 10, wherein the array substrate comprises:

Thin film transistor structure layer;

The blue OLED device layer is arranged on the thin film transistor structure layer and is located in the display area;

The first water blocking layer completely covers the blue OLED device layer, and the first adhesive layer completely covers the first water blocking layer.
The preparation method according to claim 10, wherein the color filter substrate comprises:

Cover

The RGB color resist and the black photoresist layer are arranged on the cover plate and located in the display area;

A barrier layer, covering the RGB color resist and black photoresist layer;

A pixel definition layer, arranged on the barrier layer, and in the display area, the pixel definition layer has a number of openings;

The quantum dot layer is arranged in the opening; the second water blocking layer completely covers the quantum dot layer, the pixel definition layer, and the RGB color resist and black photoresist layer; wherein the second adhesive The bonding layer completely covers the second inorganic water blocking layer.