CN110931651A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN110931651A CN110931651A CN201911159440.0A CN201911159440A CN110931651A CN 110931651 A CN110931651 A CN 110931651A CN 201911159440 A CN201911159440 A CN 201911159440A CN 110931651 A CN110931651 A CN 110931651A
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- layer
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- water
- display panel
- array substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a display panel and a preparation method thereof, wherein the display panel comprises a display area and a non-display area surrounding the display area; the array substrate and the packaging substrate are oppositely arranged; the packaging structure comprises a water-resistant layer, is arranged on one surface of the array substrate, which faces the packaging substrate, and extends from the display area to the non-display area; the bonding layer is arranged on one surface, facing the array substrate, of the packaging substrate and extends from the display area to the non-display area; and the water absorption layer is arranged between the water resistance layer and the bonding layer, and is positioned in the non-display area and surrounds the display area. The invention provides a display panel and a preparation method thereof.A water absorption layer surrounding a display area is arranged in a non-display area, so that the water vapor barrier capacity of an effective packaging area is improved; in addition, the average transmittance of the adhesive layer in the whole wave band (380-780nm) is more than 98%, so that the requirement of top emission on the transmittance is met, and the service life of the packaging layer is prolonged.
Description
Technical Field
The invention relates to the technical field of display panels, in particular to a display panel and a preparation method thereof.
Background
At present, the main packaging methods of the bottom-emitting large-size OLED display panel mainly include surface mount packaging, frame glue, moisture absorbent and filling glue packaging. For the existing surface-mounted packaging adhesive material for bottom light emission, the structure of the adhesive material is divided into two layers, wherein the first layer is a water absorption layer, metal oxide particles are contained in the water absorption layer and serve as a water absorption drying agent, the particle size of the drying agent is about 1-6 microns, and the second layer is a buffer layer and mainly plays a role in adhering a substrate and absorbing impact to protect an OLED light emitting layer. Obviously, the existing surface-mount packaging adhesive material cannot be used in top-emitting OLEDs because the water-absorbing layer contains desiccant particles and has a transmittance of less than 5%, and the requirement of top-emitting on a transmittance of more than 98% cannot be met. The current solution is to replace the micron-level desiccant particles with nano-level desiccant particles or replace the opaque desiccant particles with transparent desiccant particles, although the transmittance of both methods can meet the requirement, the lifetime of the encapsulation layer cannot reach the level of mass production.
For a non-flexible top-emitting OLED, the active area of the package is outside the light-emitting area, and only the desiccant in this area absorbs water, while the desiccant in the light-emitting area does not absorb water. Therefore, for the non-flexible top-emitting OLED, in order to meet the requirements of the package on the service life and the transmittance of top emission, the water-blocking capability outside the light-emitting region is only required to be enhanced.
Therefore, there is a need to develop a new packaging method for a display panel to overcome the drawbacks of the prior art.
Disclosure of Invention
An object of the present invention is to provide a display panel, which can solve the problem that the surface mount package adhesive material in the prior art cannot be used in a top-emitting OLED.
In order to achieve the above object, the present invention also provides a display panel including a display area and a non-display area surrounding the display area; the array substrate and the packaging substrate are oppositely arranged; the packaging structure comprises a water-resistant layer, is arranged on one surface of the array substrate, which faces the packaging substrate, and extends from the display area to the non-display area; the bonding layer is arranged on one surface, facing the array substrate, of the packaging substrate and extends from the display area to the non-display area; and the water absorption layer is arranged between the water resistance layer and the bonding layer, and is positioned in the non-display area and surrounds the display area.
Further, in other embodiments, the material of the water blocking layer is at least one of silicon nitride, silicon oxide and aluminum oxide.
Further, in other embodiments, wherein the water-absorbing layer employs a metal oxide or water-absorbing molecular sieve with a particle size <6 um.
Further, in other embodiments, wherein the water-absorbing layer has a width of 1 to 3 mm.
Further, in other embodiments, wherein the water-absorbent layer is 1-3mm from the edge of the adhesive layer.
Further, in other embodiments, the light transmittance of the adhesive layer is greater than 98%.
Further, in other embodiments, the adhesive layer is a transparent layer.
Further, in other embodiments, the array substrate includes a thin film transistor structure layer; the OLED device layer is arranged on the thin film transistor structure layer and is positioned in the display area; wherein the water-blocking layer completely covers the OLED device layer.
Further, in other embodiments, wherein the package substrate comprises a lid plate; the RGB color resistance and black light resistance layer is arranged on the cover plate and is positioned in the display area; wherein the bonding layer completely covers the RGB color resists and the black photoresist layer.
The invention also provides a preparation method for preparing the display panel, which comprises a display area and a non-display area surrounding the display area, and comprises the following steps: providing an array substrate; preparing a water-resistant layer on the array substrate; preparing a water absorption layer on the array substrate, wherein the water absorption layer surrounds the water resistance layer; providing a packaging substrate; providing an adhesive layer, and attaching the adhesive layer to the packaging substrate; and aligning and vacuum-bonding the packaging substrate and the array substrate, and thermally curing the bonding layer.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a display panel and a preparation method thereof.A water absorption layer surrounding a display area is arranged in a non-display area, and the outer edge of the water absorption layer is positioned at the inner side of the outer edge of an adhesive layer, so that the water vapor barrier capacity of an effective packaging area is improved; in addition, the average transmittance of the bonding layer in the whole wave band (380-780nm) is more than 98%, so that the requirement of top emission on the transmittance is met, the service life of the packaging layer is prolonged, and the structure is simple and easy to realize.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of step S11 of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of step S12 of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of step S2 of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of step S3 of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of step S41 of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of step S42 of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of step S5 of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of step S6 of the method for manufacturing a display panel according to the embodiment of the present invention.
Reference numerals in the detailed description:
a display panel-100; an array substrate-10;
a package structure-20; a package substrate-30;
a water resistant layer-21; adhesive layer-22;
a water-absorbing layer 25;
a thin film transistor structure layer-11; OLED device layer-12;
a cover plate-31; RGB color resistance-32;
a black photoresist layer-33.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present invention. The present invention may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel 100 provided by the present invention, which includes a display area and a non-display area surrounding the display area; and an array substrate 10, a package substrate 30, and a package structure 20.
The array substrate 10 and the package substrate 30 are disposed opposite to each other, and the package structure 20 is disposed between the array substrate 10 and the package substrate 30.
The array substrate 10 includes a thin film transistor structure layer 11 and an OLED device layer 12 disposed on the thin film transistor structure layer 11, and the OLED device layer 12 is located in the display region. Specifically, the thin film transistor structure 11 includes a substrate, a buffer layer disposed on the substrate, an active layer disposed on the buffer layer, a gate planarization layer disposed on the active layer, a gate layer disposed on the gate planarization layer, a source drain layer disposed on the gate layer, a protection layer disposed on the source drain layer, and a pixel electrode layer disposed on the protection layer, wherein the thin film transistor structure 11 has a plurality of sub-pixels arranged in an array, and each sub-pixel includes the active layer, the gate planarization layer, the gate layer, and the source drain layer. The design point of the present invention is the package structure 20, and thus the detailed structure of the thin film transistor structure 11 is not described in detail.
The package substrate 30 includes a cover plate 31, an RGB color resist 32, and a black resist layer 33. The RGB color resists 32 and the black resist layer 33 are disposed on the cover plate 31 at intervals and in the display area.
The encapsulation structure 20 includes a water-blocking layer 21, an adhesive layer 22, and a water-absorbing layer 25. The waterproof layer 21 is arranged on one surface of the array substrate 10 facing the package substrate 30 and extends from the display area to the non-display area; wherein, the water-resistant layer 21 completely covers the OLED device layer 12, and further improves the packaging effect of the display panel.
The adhesive layer 22 is disposed on a surface of the package substrate 30 facing the array substrate 10 and extends from the display region to the non-display region, the water absorption layer 25 is disposed between the water blocking layer 21 and the adhesive layer 22, and the water absorption layer 25 is disposed in the non-display region and surrounds the display region.
In this embodiment, the material of the water-blocking layer 21 is at least one of silicon nitride, silicon oxide and aluminum oxide, and the water-absorbing layer 25 is a metal oxide or water-absorbing molecular sieve with a particle size of less than 6 um.
Wherein the width of the water absorption layer 25 is 1-3mm, and the distance between the water absorption layer 25 and the edge of the bonding layer 22 is 1-3 mm. The light transmittance of the bonding layer 22 is larger than 98%, so that the requirement of top light emission on transmittance is met, and the service life of the packaging layer is prolonged.
In other embodiments, the adhesive layer 22 is a transparent layer.
The present invention also provides a manufacturing method for manufacturing the display panel 100 according to the present invention, which includes a display region and a non-display region surrounding the display region, the manufacturing method including the following steps S1-S6. Referring to fig. 2, fig. 2 is a flowchart illustrating a method for manufacturing a display panel 100 according to an embodiment of the invention.
Step S1: providing an array substrate 10; step S1 includes steps S11-S12. Step S11: referring to fig. 3, a thin film transistor structure layer 11 is provided, and fig. 3 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present invention in step S11.
Step S12: referring to fig. 4, an OLED device layer 12 is prepared on the thin film transistor structure layer 11, and fig. 4 is a schematic structural view of the display panel according to step S12 of the preparation method of the display panel provided by the embodiment of the present invention.
Wherein the OLED device layer 12 is located in the display area, the OLED device layer 12 is prepared by evaporation or inkjet printing.
Step S2: preparing a water-resistant layer 21 on the array substrate 10; referring to fig. 5, fig. 5 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present invention in step S2.
Wherein the water-blocking layer 21 is located on the OLED device layer 12 and completely covers the OLED device layer 12.
Step S3: preparing a water absorption layer 25 on the water resistance layer 21, wherein the water absorption layer 25 surrounds the water resistance layer 21; referring to fig. 6, fig. 6 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present invention in step S3.
Step S4: providing a package substrate 30; step S1 includes steps S41-S42.
Step S41: providing a cover plate 31; referring to fig. 7, fig. 7 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present invention in step S41.
Step S42: preparing an RGB color resist 32 and a black photoresist layer 33; referring to fig. 8, fig. 8 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present invention in step S42.
Step S5: providing an adhesive layer 22, and attaching the adhesive layer 22 to the package substrate 30; referring to fig. 9, fig. 9 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present invention in step S5.
Step S6: aligning and vacuum-bonding the package substrate 30 and the array substrate 10, and thermally curing the adhesive layer 22; referring to fig. 10, fig. 10 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present invention in step S6.
In which the adhesive layer 22 is cured by light or heat under heat and pressure.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a display panel and a preparation method thereof.A water absorption layer surrounding a display area is arranged in a non-display area, and the outer edge of the water absorption layer is positioned at the inner side of the outer edge of an adhesive layer, so that the water vapor barrier capacity of an effective packaging area is improved; in addition, the average transmittance of the bonding layer in the whole wave band (380-780nm) is more than 98%, so that the requirement of top emission on the transmittance is met, the service life of the packaging layer is prolonged, and the structure is simple and easy to realize.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A display panel characterized by comprising a display area and a non-display area surrounding the display area; and
the array substrate and the packaging substrate are oppositely arranged; a package structure including
The waterproof layer is arranged on one surface, facing the packaging substrate, of the array substrate and extends from the display area to the non-display area;
the bonding layer is arranged on one surface, facing the array substrate, of the packaging substrate and extends from the display area to the non-display area;
and the water absorption layer is arranged between the water resistance layer and the bonding layer, and is positioned in the non-display area and surrounds the display area.
2. The display panel according to claim 1, wherein the water blocking layer is made of at least one of silicon nitride, silicon oxide, and aluminum oxide.
3. The display panel of claim 1, wherein the water-absorbing layer is made of metal oxide or water-absorbing molecular sieve with a particle size of <6 um.
4. The display panel of claim 1, wherein the water-absorbing layer has a width of 1-3 mm.
5. The display panel of claim 1, wherein the water-absorbing layer is 1-3mm from the edge of the adhesive layer.
6. The display panel according to claim 1, wherein the adhesive layer has a light transmittance of more than 98%.
7. The display panel according to claim 1, wherein the adhesive layer is a transparent layer.
8. The display panel of claim 1, wherein the array substrate comprises
A thin film transistor structure layer;
the OLED device layer is arranged on the thin film transistor structure layer and is positioned in the display area;
wherein the water-blocking layer completely covers the OLED device layer.
9. The display panel of claim 1, wherein the package substrate comprises
A cover plate;
the RGB color resistance and black light resistance layer is arranged on the cover plate and is positioned in the display area;
wherein the bonding layer completely covers the RGB color resists and the black photoresist layer.
10. A manufacturing method for manufacturing a display panel according to any one of claims 1 to 9, including a display area and a non-display area surrounding the display area, comprising the steps of:
providing an array substrate;
preparing a water-resistant layer on the array substrate;
preparing a water absorption layer on the array substrate, wherein the water absorption layer surrounds the water resistance layer;
providing a packaging substrate;
providing an adhesive layer, and attaching the adhesive layer to the packaging substrate;
and aligning and vacuum-bonding the packaging substrate and the array substrate, and thermally curing the bonding layer.
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| CN201911159440.0A CN110931651A (en) | 2019-11-22 | 2019-11-22 | Display panel and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584744A (en) * | 2020-05-13 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN112310311A (en) * | 2020-10-23 | 2021-02-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN113781914A (en) * | 2020-11-20 | 2021-12-10 | 青岛海信商用显示股份有限公司 | Display device and method for attaching substrate and display panel |
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