CN111584760B - Display panel, preparation method of display panel and display device - Google Patents
Display panel, preparation method of display panel and display device Download PDFInfo
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- CN111584760B CN111584760B CN202010467119.5A CN202010467119A CN111584760B CN 111584760 B CN111584760 B CN 111584760B CN 202010467119 A CN202010467119 A CN 202010467119A CN 111584760 B CN111584760 B CN 111584760B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention relates to the field of display, and discloses a display panel, a preparation method of the display panel and a display device, wherein the display panel comprises: the array substrate and the packaging layer are arranged opposite to the array substrate; be equipped with first encapsulation frame glue and second encapsulation frame glue between array substrate and the packaging layer, and array substrate is equipped with light emitting structure layer towards the surface of packaging layer, wherein: the first packaging frame glue and the second packaging frame glue are positioned at the edge part of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, the first packaging frame glue and the light-emitting structure layer are positioned in a space surrounded by the second packaging frame glue, and the projection of the light-emitting structure layer on the array substrate at least covers the projection of the first packaging frame glue on the array substrate; filling glue in a region enclosed by the first packaging frame glue and the second packaging frame glue; the insulating layer is used for isolating external water oxygen and prolonging the service life of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
The organic light emitting display device has the advantages of being light and thin, actively emitting light, wide in visual angle, fast in response, low in energy consumption, excellent in low temperature and shock resistance, capable of realizing flexible display and the like. The material in the light-emitting structure layer of the organic light-emitting device (OLED) in the organic light-emitting display device usually adopts a metal material with relatively active chemical properties, and the metal material is easy to react with water and oxygen, so that the photoelectric characteristics of the material are changed, and the OLED device is caused to lose efficacy because the water and oxygen are easy to react with the metal.
Disclosure of Invention
The invention discloses a display panel, a preparation method of the display panel and a display device, which are used for isolating external water and oxygen and prolonging the service life of the display panel.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, the present invention provides a display panel comprising: the array substrate and the packaging layer are arranged opposite to the array substrate;
a first packaging frame adhesive and a second packaging frame adhesive are arranged between the array substrate and the packaging layer, and a light-emitting structure layer is arranged on the surface of the array substrate facing the packaging layer, wherein:
the first packaging frame glue and the second packaging frame glue are positioned at the edge part of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, the first packaging frame glue and the light-emitting structure layer are positioned in a space surrounded by the second packaging frame glue, and the projection of the light-emitting structure layer on the array substrate at least covers the projection of the first packaging frame glue on the array substrate;
and filling glue is filled in a region enclosed by the first packaging frame glue and the second packaging frame glue.
The first packaging frame glue and the second packaging frame glue are arranged between the array substrate and the packaging layer, the connection between the packaging layer and the array substrate is strengthened, a good blocking effect is achieved by arranging a plurality of packaging frame glue, the surface of the array substrate facing the packaging layer is provided with the light-emitting structure layer, the first packaging frame glue and the second packaging frame glue are located at the edge of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, filling glue is filled in a surrounded space, and the effects of supporting and slowing down the permeation of water and oxygen into the light-emitting structure layer are achieved; however, too much sealant occupies extra width, increasing the frame width, i.e. increasing the distance from the edge of the encapsulation layer to the edge of the light emitting structure layer, and in order to ensure that the water and oxygen permeation is slowed down and the frame width is not increased, the projection of the light emitting structure layer on the array substrate at least covers the projection of the first sealant on the array substrate.
Further, the first sealant includes: the first sub-packaging frame glue is arranged on the surface of one side, facing the packaging layer, of the array substrate;
the second sub-packaging frame glue is arranged on the surface of one side, facing the array substrate, of the packaging layer;
the edge of the light emitting structure layer covers the surface of the first sub-packaging frame glue facing the second sub-packaging frame glue.
Further, one side of the array substrate facing the packaging layer is provided with at least two protruding structures, wherein:
the protruding structure is positioned in an area surrounded by the first packaging frame glue;
and the other protruding structure is positioned between the first packaging frame glue and the second packaging frame glue.
Further, the light emitting structure layer comprises an organic electroluminescent device layer and a passivation layer positioned on one side, facing the encapsulation layer, of the organic electroluminescent device layer, and the organic electroluminescent device layer comprises a cathode, an electroluminescent layer positioned on one side, facing away from the array substrate, of the cathode, and an anode positioned on one side, facing away from the cathode, of the electroluminescent layer;
the electroluminescent layer and the cathode layer are disconnected at the raised structures.
Further, the convex structure is in an inverted trapezoid shape or a rectangular shape.
Further, the material of the protruding structure is one or more of an inorganic material, a titanium-aluminum alloy and a photosensitive resin.
Further, the light emitting structure layer comprises an organic electroluminescent device layer and a passivation layer positioned on one side of the organic electroluminescent device layer facing the packaging layer;
the passivation layer extends to a position between the first packaging frame glue and the second packaging frame glue, and the organic electroluminescent device layer is located in a region surrounded by the first packaging frame glue.
Further, the passivation layer and the organic electroluminescent device layer both extend between the first sealant and the second sealant.
Further, the first encapsulation frame glue and the second encapsulation frame glue are made of the following materials: polyimide or acrylic acid.
In a second aspect, the present invention provides a display device, comprising: the display panel of any one of the first aspect.
In a third aspect, the present invention provides a method for manufacturing a display panel, including: the array substrate and the packaging layer are arranged opposite to the array substrate;
a first packaging frame glue and a second packaging frame glue are formed between the array substrate and the packaging layer, and a light emitting structure layer is formed on the surface of the array substrate facing the packaging layer, wherein:
the first packaging frame glue and the second packaging frame glue are positioned at the edge part of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, the first packaging frame glue and the light-emitting structure layer are positioned in a space surrounded by the second packaging frame glue, and the projection of the light-emitting structure layer on the array substrate at least covers the projection of the first packaging frame glue on the array substrate;
and filling glue is filled in a region enclosed by the first packaging frame glue and the second packaging frame glue.
The technical effects brought by the second aspect and the third aspect may refer to the corresponding technical effects in the first aspect, and are not described herein again.
Drawings
Fig. 1 is a schematic structural view of a light emitting structure layer provided in an embodiment of the present invention, which does not pass through a sealant;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another display panel according to an embodiment of the disclosure;
fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention.
Icon: 100-an array substrate; 200-an encapsulation layer; 300-first packaging frame glue; 310-first sub-encapsulation frame glue; 320-second sub-packaging frame glue; 400-second packaging frame glue; 500-a light emitting structure layer; 510-an organic electroluminescent device layer; 520-a passivation layer; 600-filling glue; 700-raised structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The encapsulating sealant, such as the first encapsulating sealant 300 and the second encapsulating sealant 400 in fig. 1, occupies an extra width by too much, and increases the frame width a, i.e., increases the distance from the edge of the encapsulating layer 200 to the edge of the light emitting structure layer 500, so as to ensure that the effect of slowing down the permeation of water and oxygen and not increasing the frame width at the same time, the projection of the light emitting structure layer 500 on the array substrate 100 at least covers the projection of the first encapsulating sealant 300 on the light emitting structure layer 500.
As shown in fig. 2, in a first aspect, an embodiment of the present invention provides a display panel, including: an array substrate 100 and an encapsulation layer 200 disposed opposite to the array substrate 100;
a first sealant 300 and a second sealant 400 are disposed between the array substrate 100 and the encapsulation layer 200, and a light emitting structure layer 500 is disposed on the surface of the array substrate 100 facing the encapsulation layer 200, wherein:
the first sealing frame glue 300 and the second sealing frame glue 400 are positioned at the edge part of the array substrate 100, the first sealing frame glue 300 and the second sealing frame glue 400 both have a closed ring structure, the first sealing frame glue 300 and the light emitting structure layer 500 are positioned in the space enclosed by the second sealing frame glue 400, and the projection of the light emitting structure layer 500 on the array substrate 100 at least covers the projection of the first sealing frame glue 300 on the array substrate 100; the region enclosed by the first sealant 300 and the second sealant 400 is filled with the filling adhesive 600.
It should be noted that, by providing the first sealant 300 and the second sealant 400 between the array substrate 100 and the encapsulation layer 200, the connection between the encapsulation layer 200 and the array substrate 100 is strengthened, and a good blocking effect is achieved by providing a plurality of sealant frames, the surface of the array substrate 100 facing the encapsulation layer 200 is provided with the light emitting structure layer 500, and the first sealant 300 and the second sealant 400 are located at the edge of the array substrate 100, where the first sealant 300 and the second sealant 400 both have a closed ring structure, and the enclosed space is filled with the filling sealant 600, so as to achieve the effect of supporting and slowing down the penetration of water and oxygen into the light emitting structure layer 500.
Specifically, the first sealant 300 includes: a first sub-encapsulation sealant 310 disposed on a surface of the array substrate 100 facing the encapsulation layer 200;
the second sub-encapsulation sealant 320 is disposed on the surface of the encapsulation layer 200 facing the array substrate 100;
the edge of the light emitting structure layer 500 covers the surface of the first sub-encapsulation sealant 310 facing the second sub-encapsulation sealant 320.
By the method of arranging the frame sealant from top to bottom, the first frame sealant 300 is formed by the first sub-frame sealant 310 and the second sub-frame sealant 320, so that the light emitting structure layer 500 can be overlapped with the first frame sealant 300 to form the effect that the light emitting structure layer 500 penetrates through the frame sealant, and the inward permeation of water and oxygen is slowed down, thereby enhancing the blocking effect of the package and not obviously increasing the frame.
As shown in fig. 3, at least two protrusion structures 700 are disposed on a side of the array substrate 100 facing the package layer 200, wherein: a protrusion structure 700 is located in the region surrounded by the first sealant 300;
the other protrusion structure 700 is located between the first sealant 300 and the second sealant 400.
There are various options for the protrusion structure 700:
in a first embodiment, the protrusion structure 700 is an inverted trapezoid.
By arranging a plurality of circles of protruding structures 700 in the region surrounded by the first sealant 300 and outside the region surrounded by the first sealant 300, and arranging a plurality of circles of sealant between the inverted trapezoid structures, especially arranging the first sub-sealant 310 and the second sub-sealant 320 which clamp the light emitting structure layer 500 from top to bottom, water and oxygen are further prevented from passing through the region with the inverted trapezoid structures.
In the fabrication of the OLED light emitting structure layer 500, the light emitting structure layer 500 is located on one side of the second sealant 400 facing the array substrate 100, and a rectangular film layer is fabricated on the array substrate 100 by using a regular rectangular opening mask and a simple control process without considering the shape of the display screen.
In the edge encapsulation region, when the OLED light emitting structure layer 500 is manufactured, the light emitting structure layer 500 is located on one side of the second encapsulation frame glue 400 facing the array substrate 100, and the first encapsulation frame glue 300 is provided with the first sub-encapsulation frame glue 310 and the second sub-encapsulation frame glue 320 which clamp the light emitting structure layer 500 from top to bottom, because the protrusion structure 700 is in an inverted trapezoid shape, the OLED light emitting structure layer 500 is disconnected at the top and the bottom of the inverted trapezoid protrusion structure due to the height difference, and in the region surrounded by the inverted trapezoid structure, a display region is formed, and the path of inward permeation of water and oxygen along the light emitting structure layer 500 is isolated.
As shown in fig. 4, a specific light emitting structure layer 500 includes an organic electroluminescent device layer 510 and a passivation layer 520 located on a side of the organic electroluminescent device layer 510 facing the encapsulation layer 200, and the passivation layer 520 is disposed on the organic electroluminescent device layer 510 to better isolate the permeation of water and oxygen to the organic electroluminescent device layer 510; the organic electroluminescent device layer 510 includes a cathode, an electroluminescent layer on a side of the cathode facing away from the array substrate 100, and an anode on a side of the electroluminescent layer facing away from the cathode; the electroluminescent layer and the cathode layer are disconnected at the raised structures 700.
In a second manner, the protrusion structure 700 is rectangular.
By arranging a plurality of circles of the protruding structures 700 in the region surrounded by the first sealant 300 and outside the region surrounded by the first sealant 300, and further arranging a plurality of circles of sealant between the plurality of circles of the rectangular structures, particularly the first sub-sealant 310 and the second sub-sealant 320 sandwiching the light emitting structure layer 500 from top to bottom are arranged, the water oxygen is further prevented from passing through the region with the rectangular structures.
In the fabrication of the OLED light emitting structure layer 500, the light emitting structure layer is located on one side of the second sealant facing the array substrate, and a rectangular pattern film layer is fabricated on the array substrate 100 by using a regular rectangular opening mask and a simple control process without considering the shape of the display screen.
In the edge encapsulation region, when the OLED light emitting structure layer 500 is manufactured, the light emitting structure layer 500 is located on one side of the second encapsulant facing the array substrate 100, and the first encapsulant is provided with the first sub-encapsulant 310 and the second sub-encapsulant 320 that sandwich the light emitting structure layer 500 from top to bottom, because the protrusion structure 700 is rectangular, the OLED light emitting structure layer 500 is disconnected at the top and bottom of the rectangular protrusion structure due to a height difference, in the region enclosed by the rectangular structure, a display region is formed, and a path for water and oxygen to permeate inwards along the light emitting structure layer 500 is isolated.
As shown in fig. 4, a specific light emitting structure layer 500 includes an organic electroluminescent device layer 510 and a passivation layer 520 located on a side of the organic electroluminescent device layer 510 facing the encapsulation layer 200, and the passivation layer 520 is disposed on the organic electroluminescent device layer 510 to better isolate permeation of water and oxygen into the organic electroluminescent device layer 510; the organic electroluminescent device layer 510 includes a cathode, an electroluminescent layer on a side of the cathode facing away from the array substrate 100, and an anode on a side of the electroluminescent layer facing away from the cathode; the electroluminescent layer and the cathode layer are disconnected at the bump structure 700.
Specifically, the material of the protrusion structure 700 is an inorganic material such as silicon nitride and silicon oxide, or a multilayer metal such as titanium-aluminum alloy, and is formed by wet etching and dry etching after chemical and physical deposition.
In addition, the material of the inverted trapezoidal structure may be a photosensitive resin, and is developed and cured by one or more exposures.
As shown in fig. 5, an array substrate 100 and an encapsulation layer 200 disposed opposite to the array substrate 100; the first sealant 300 and the second sealant 400 are disposed between the array substrate 100 and the encapsulation layer 200, and the surface of the array substrate 100 facing the encapsulation layer 200 is disposed with a light emitting structure layer 500, the light emitting structure layer 500 divides the first sealant 300 into a first sealant sub-layer 310 and a second sealant sub-layer 320, and the light emitting structure layer 500 specifically includes an organic electroluminescent device layer 510 and a passivation layer 520 disposed on a side of the organic electroluminescent device layer 510 facing the encapsulation layer 200.
The passivation layer 520 is made of silicon nitride or metal oxide by a chemical or physical deposition process, and has a film formation region corresponding to the organic electroluminescent device layer 510 to share a mask.
The passivation layer 520 extends between the first sealant 300 and the second sealant 400, and the organic electroluminescent device layer 510 is located in the region surrounded by the first sealant 400.
As shown in fig. 6, an array substrate 100 and an encapsulation layer 200 disposed opposite to the array substrate 100; the first sealant 300 and the second sealant 400 are disposed between the array substrate 100 and the encapsulation layer 200, and the surface of the array substrate 100 facing the encapsulation layer 200 is disposed with a light emitting structure layer 500, the light emitting structure layer 500 divides the first sealant 300 into a first sealant sub-layer 310 and a second sealant sub-layer 320, and the light emitting structure layer 500 includes an organic electroluminescent device layer 510 and a passivation layer 520 disposed on one side of the organic electroluminescent device layer 510 facing the encapsulation layer 200.
The projections of the passivation layer 520 and the organic electroluminescent device layer 510 on the array substrate 100 at least cover the projection of the first sealant 300 on the array substrate 100, the organic electroluminescent device layer 510 is located in the region enclosed by the first sealant 300 and between the first sealant sub-frame 310 and the second sealant sub-320, and the passivation layer 520 covers the organic electroluminescent device layer 510 and extends between the first sealant 300 and the second sealant 400.
In addition, the materials of the first sealing frame glue 300 and the second sealing frame glue 400 are ultraviolet curing or thermosetting, acrylic, polyimide organic materials; and curing and forming after coating at the corresponding position by processes such as needle coating, printing and the like.
The first sub-sealing frame sealant 310 in the first sealing frame sealant 300 may also be silicon nitride, silicon oxide, or a relatively inactive metal, such as molybdenum, titanium, etc., and a desired pattern may be formed in a corresponding area of the edge of the array substrate 100 by chemical and physical deposition and dry or wet etching.
The first sub-sealing sealant 310 and the second sub-sealing sealant 320 may be organic materials such as acrylic acid added with water-absorbing materials such as calcium oxide, and further slow down the inward permeation of water vapor by the water absorption.
In a second aspect, an embodiment of the present invention provides a display device, including: the display panel of any one of the first aspect.
In a third aspect, a method for manufacturing a display panel provided in an embodiment of the present invention includes: an array substrate 100 and an encapsulation layer 200 disposed opposite to the array substrate 100;
a first sealant 300 and a second sealant 400 are formed between the array substrate 100 and the encapsulation layer 200, and a light emitting structure layer 500 is formed on the surface of the array substrate 100 facing the encapsulation layer 200, wherein:
the first sealing frame glue 300 and the second sealing frame glue 400 are positioned at the edge part of the array substrate 100, the first sealing frame glue 300 and the second sealing frame glue 400 both have a closed ring structure, the first sealing frame glue 300 and the light emitting structure layer 500 are positioned in the space enclosed by the second sealing frame glue 400, and the projection of the light emitting structure layer 500 on the array substrate 100 at least covers the projection of the first sealing frame glue 300 on the array substrate 100;
the region enclosed by the first sealant 300 and the second sealant 400 is filled with the filling adhesive 600.
As shown in fig. 5 and 6, the manufacturing process of the display panel has the following two ways:
in the first mode, the array substrate 100 and the encapsulation layer 200 are arranged oppositely, a protrusion structure 700 is formed on one side of the array substrate 100 facing the encapsulation layer 200, a first sub-encapsulation sealant 310 in the first encapsulation sealant 300 is formed between the array substrate 100 and the encapsulation layer 200, an organic electroluminescent device layer 510 in the luminescent structure layer 500 is formed on the surface of the array substrate 100 facing the encapsulation layer 200, a passivation layer 520 is formed on one side of the organic electroluminescent device layer 510 facing the encapsulation layer 200, a second sub-encapsulation sealant 320 is formed on one side of the passivation layer 520 facing the encapsulation layer 200, so that the second sub-encapsulation sealant 320 is attached to the encapsulation layer 200, a second encapsulation sealant 400 is formed at the edge of the array substrate 100, and then the filling sealant 600 is filled in an area enclosed by the first encapsulation sealant 300 and the second encapsulation sealant 400, so that the encapsulation layer 200 is attached to the array substrate 100; here, starting from the first sub-sealing frame sealant 310 in the first sealing frame sealant 300 manufactured between the array substrate 100 and the encapsulation layer 200, the manufacturing of the following other steps is performed in a process environment of dry air, vacuum or anhydrous oxygen atmosphere.
In a second mode, the array substrate 100 and the encapsulation layer 200 are arranged oppositely, a protrusion structure 700 is formed on one side of the array substrate 100 facing the encapsulation layer 200, an organic electroluminescent device layer 510 in the luminescent structure layer 500 is formed between the array substrate 100 and the encapsulation layer 200, then a first sub-encapsulation frame glue 310 in the first encapsulation frame glue 300 is formed on the organic electroluminescent device layer 510, then a passivation layer 520 is formed on one side of the organic electroluminescent device layer 510 facing the encapsulation layer 200, a second sub-encapsulation frame glue 320 is formed on one side of the passivation layer 520 facing the encapsulation layer 200, so that the second sub-encapsulation frame glue 320 is attached to the encapsulation layer 200, a second encapsulation frame glue 400 is formed at the edge of the array substrate 100, and then a filling glue 600 is filled in an area surrounded by the first encapsulation frame glue 300 and the second encapsulation frame glue 400, so that the encapsulation layer 200 is attached to the array substrate 100; here, the first sub-sealing frame sealant 310 in the first sealing frame sealant 300 is manufactured between the array substrate 100 and the sealing layer 200, and the manufacturing is performed in a process environment of dry air, vacuum or anhydrous oxygen atmosphere.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A display panel, comprising: the array substrate and the packaging layer are arranged opposite to the array substrate;
a first packaging frame adhesive and a second packaging frame adhesive are arranged between the array substrate and the packaging layer, and a light-emitting structure layer is arranged on the surface of the array substrate facing the packaging layer, wherein:
the first packaging frame glue and the second packaging frame glue are positioned at the edge part of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, the first packaging frame glue and the light emitting structure layer are positioned in a space surrounded by the second packaging frame glue, and the projection of the light emitting structure layer on the array substrate at least covers the projection of the first packaging frame glue on the array substrate;
filling glue is filled in an area enclosed by the first packaging frame glue and the second packaging frame glue;
the first sealant includes: the first sub-packaging frame glue is arranged on the surface of one side, facing the packaging layer, of the array substrate;
the second sub-packaging frame glue is arranged on the surface of one side, facing the array substrate, of the packaging layer;
the edge of the light emitting structure layer covers the surface of the first sub-packaging frame glue facing the second sub-packaging frame glue.
2. The display panel of claim 1, wherein a side of the array substrate facing the encapsulation layer is provided with at least two protruding structures, wherein:
the protruding structure is positioned in an area surrounded by the first packaging frame glue;
the other protruding structure is located between the first packaging frame glue and the second packaging frame glue.
3. The display panel according to claim 2, wherein the light emitting structure layer comprises an organic electroluminescent device layer and a passivation layer on a side of the organic electroluminescent device layer facing the encapsulation layer, the organic electroluminescent device layer comprises a cathode, an electroluminescent layer on a side of the cathode facing away from the array substrate, and an anode on a side of the electroluminescent layer facing away from the cathode;
the electroluminescent layer and the cathode layer are disconnected at the raised structures.
4. The display panel according to claim 2 or 3, wherein the convex structure is an inverted trapezoid or a rectangle.
5. The display panel according to claim 2 or 3, wherein the material of the convex structure is one or more of an inorganic material, a titanium-aluminum alloy, and a photosensitive resin.
6. The display panel according to claim 1, wherein the light emitting structure layer comprises an organic electroluminescent device layer and a passivation layer on a side of the organic electroluminescent device layer facing the encapsulation layer;
the passivation layer extends to a position between the first packaging frame glue and the second packaging frame glue, and the organic electroluminescent device layer is located in a region surrounded by the first packaging frame glue.
7. The display panel of claim 6, wherein the projections of the passivation layer and the organic electroluminescent device layer on the array substrate at least cover the projection of the first sealant on the array substrate.
8. The display panel according to claim 1, wherein the first sealant and the second sealant are made of: polyimide or acrylic acid.
9. A display device, comprising: the display panel of any one of claims 1-8.
10. A method for manufacturing a display panel, comprising: the array substrate and the packaging layer are arranged opposite to the array substrate;
a first packaging frame glue and a second packaging frame glue are formed between the array substrate and the packaging layer, and a light emitting structure layer is formed on the surface of the array substrate facing the packaging layer, wherein:
the first packaging frame glue and the second packaging frame glue are positioned at the edge part of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, the first packaging frame glue and the light emitting structure layer are positioned in a space surrounded by the second packaging frame glue, and the projection of the light emitting structure layer on the array substrate at least covers the projection of the first packaging frame glue on the array substrate;
filling glue in a region enclosed by the first packaging frame glue and the second packaging frame glue;
the first sealant includes: the first sub-packaging frame glue is arranged on the surface of one side, facing the packaging layer, of the array substrate;
the second sub-packaging frame glue is arranged on the surface of one side, facing the array substrate, of the packaging layer;
the edge of the light emitting structure layer covers the surface of the first sub-packaging frame glue facing the second sub-packaging frame glue.
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