CN212085044U - Display device - Google Patents
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- CN212085044U CN212085044U CN202020874278.2U CN202020874278U CN212085044U CN 212085044 U CN212085044 U CN 212085044U CN 202020874278 U CN202020874278 U CN 202020874278U CN 212085044 U CN212085044 U CN 212085044U
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- array substrate
- cover plate
- emitting diode
- organic light
- display area
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Abstract
The utility model discloses a display device, include: the array substrate, the organic light emitting diode device that is located on the array substrate, the passivation layer that covers the organic light emitting diode device, the apron that is located one side that the organic light emitting diode device deviates from the array substrate to and be full of the encapsulation glue film between array substrate and the apron. The surface of the cover plate facing to one side of the organic light-emitting diode device is provided with the first protruding portions, the set positions of the first protruding portions are parallel to the cross-sectional area of the cover plate and have the trend of increasing along the direction away from the cover plate, so that the first protruding portions are of an inward concave structure, when the packaging adhesive layer covers the surface of the cover plate, even if bending, turning and the like occur, the first protruding portions on the surface of the cover plate and the packaging adhesive layer form an interlocking effect, therefore, the attaching degree between the cover plate and the packaging adhesive layer is increased, and the phenomena of peeling, warping and the like of the panel are favorably eliminated.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a display device.
Background
Organic Light Emitting Diode (OLED) display panels have the characteristics of fast response speed and being Light and thin, and are currently applied to the fields of mobile display devices, television devices and the like.
The service life of the OLED device is an important factor that restricts the development of the OLED industry. The factors influencing the service life of the OLED device are many, and the OLED device has physical factors such as a device structure, a circuit driving mode and the like; there are also chemical factors such as oxidation of the metal cathode, crystallization and aging of the organic material, etc. There have been many studies that have shown that the presence of moisture inside an OLED device is a major factor affecting the lifetime of the OLED.
With the development of flexible OLED panels, dynamic bending has become a research hotspot. However, as the number of times of bending the panel between the encapsulating cover plate and the encapsulating film layer increases, peeling occurs at the interface of the film layer easily, so that external water and oxygen invade into the OLED device, and the luminous efficiency and the service life of the OLED device are affected.
SUMMERY OF THE UTILITY MODEL
The utility model discloses in some embodiments, the surface of apron towards organic light emitting diode device one side has a plurality of first bellyings, the setting for position of first bellyings has the trend along the direction increase of keeping away from the apron that is on a parallel with the cross sectional area of apron, make like this that first bellyings has inside sunken structure, the encapsulation glue film covers when the surface of apron, even take place crooked and turn over the operation such as book, the first bellyings on apron surface form the effect of interlocking with the encapsulation glue film, the laminating degree between apron and the encapsulation glue film has been increased from this, be favorable to avoiding the panel to produce and peel off, phenomenons such as warpage.
In some embodiments, the cross-sectional area of the first protrusion parallel to the cover plate increases gradually along the direction away from the cover plate. The shape of the first bulge can adopt a prismoid or a circular truncated cone.
In some embodiments, the cross-sectional area of the first protrusion parallel to the cover plate increases and decreases along the direction away from the cover plate. The first convex part is spherical or ellipsoidal.
The utility model discloses in some embodiments, the apron surface sets up the first bellying of multilayer, piles up the setting at the first bellying in the same position, strengthens the interlocking of apron and encapsulation glue film from this, avoids apron and encapsulation glue film to take place to peel off and warping problem.
The utility model discloses in some embodiments, the organic light emitting diode device is top emission type device, and the apron all sets up first bellying at display area and non-display area, can make apron and encapsulation glue film all have the interlocking in any position, and when the panel was buckled, the interlocking of apron and encapsulation glue film can avoid the encapsulation glue film to take place to peel off or warping problem. Meanwhile, the first protruding part positioned in the display area can increase the light-emitting surface of the cover plate in the display area and has a scattering effect on light, so that the total reflection effect of the light emitted by the organic light-emitting diode device when the light enters the cover plate can be destroyed, more light can be emitted from the cover plate, and the light extraction efficiency of the panel is improved.
In some embodiments, the size of the first protruding portion located in the non-display area is larger than the size of the first protruding portion located in the display area. The first bulge part positioned in the non-display area mainly plays a role in enhancing the joint degree of the cover plate and the packaging adhesive layer; the first protruding portion located in the display area not only has the effect of enhancing the attaching degree of the cover plate and the packaging glue layer, but also plays a role in scattering light. The size of the first protruding parts in the display area is reduced, and the number of the first protruding parts is increased, so that the scattering effect of the first protruding parts on light is enhanced.
In some embodiments of the present invention, the first protruding portion located in the non-display region has a size of 0.5 μm to 50 μm; the first protrusions located in the display region have a size of 0.1 μm to 30 μm.
In some embodiments, the organic light emitting diode device is a bottom emission type device, and the array substrate in the display area is provided with a plurality of third protrusions facing the surface of one side of the organic light emitting diode device. The third protruding part can increase the light-emitting surface of the array substrate in the display area and has a scattering effect on light, so that the total reflection effect of the light emitted by the organic light-emitting diode device when the light enters the array substrate can be destroyed, more light can be emitted from the array substrate, and the light extraction efficiency of the panel is improved.
In some embodiments, the cross-sectional area of the third protrusion parallel to the array substrate has a tendency of gradually decreasing along the direction away from the array substrate, the third protrusion is close to the width broad on one side of the array substrate, and the width away from one side of the array substrate is narrower, so that the surface of the third protrusion is a tapered smooth structure. It is easier to fabricate the anode of the organic light emitting diode device on top of such a structure.
In some embodiments, the size of the second protruding portion located in the non-display area is larger than the size of the third protruding portion located in the display area. The third convex part in the display area mainly plays a role of scattering light. Therefore, the finer the third protrusions in the position display region are provided, the better the scattering effect thereof. The embodiment of the utility model provides an in, can reduce the size of the interior third bellying of display area, and increase the quantity of third bellying, strengthen its scattering effect to the light from this.
In some embodiments of the present invention, the second protruding portion located in the non-display region has a size of 0.5 μm to 50 μm; the size of the third convex portion located in the display region is 0.1 μm to 30 μm.
In some embodiments, the plurality of second protrusions are disposed on the surface of the array substrate facing the organic light emitting diode device side in the non-display area, and the cross-sectional area of the second protrusions, which is parallel to the array substrate, tends to increase in the direction away from the array substrate. The second protruding part is provided with an inward concave structure at a position close to the array substrate, and when the second protruding part is mutually attached to the packaging adhesive layer, an interlocking effect can be generated, so that the attaching degree between the array substrate and the packaging adhesive layer is increased, and the phenomena of peeling, warping and the like of the panel are favorably eliminated.
The utility model discloses in some embodiments, set up the second bellying on the array substrate under the passivation layer to the position that the second bellying is close to array substrate has inside sunken structure, when laminating each other with the passivation layer, can produce the effect of interlocking, has increased the laminating degree between array substrate and the passivation layer from this, is favorable to eliminating the panel and produces phenomenons such as peeling off, warpage.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a display device according to an embodiment of the present invention;
FIG. 2 is a bottom view of the cover plate of FIG. 1;
fig. 3 is a second schematic cross-sectional view of a display device according to an embodiment of the present invention;
FIG. 4 is a bottom view of the cover plate of FIG. 3;
fig. 5 is a third schematic cross-sectional view of a display device according to an embodiment of the present invention;
fig. 6 is a fourth schematic cross-sectional view of a display device according to an embodiment of the present invention;
fig. 7 is a fifth schematic cross-sectional view of a display device according to an embodiment of the present invention;
fig. 8 is a sixth schematic cross-sectional view of a display device according to an embodiment of the present invention;
fig. 9 is a seventh schematic cross-sectional view of a display device according to an embodiment of the present invention.
The LED packaging structure comprises an array substrate 11, an organic light emitting diode device 12, a passivation layer 13, a cover plate 14, an encapsulation glue layer 15, a first protruding portion t1, a second protruding portion t2 and a third protruding portion t 3.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described with reference to the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words for expressing the position and direction described in the present invention are all the explanations given by taking the drawings as examples, but can be changed according to the needs, and the changes are all included in the protection scope of the present invention. The drawings of the present invention are only for illustrating the relative positional relationship and do not represent true proportions.
The OLED display device has the advantages of being light and thin, high in brightness, low in power consumption, fast in response, high in definition, good in flexibility, high in luminous efficiency and the like, and occupies an increasingly important position in the display field.
The OLED display device comprises an array substrate and an encapsulation cover plate.
The array substrate comprises a substrate and a Thin Film Transistor (TFT) driving circuit formed on the substrate, wherein the OLED device is formed on the TFT driving circuit and is electrically connected with the TFT circuit.
The packaging cover plate is arranged opposite to the array substrate and used for packaging the OLED device.
The OLED device includes an anode, a light emitting layer, and a cathode. The anode, the light-emitting layer and the cathode form a sandwich structure, after an electric field is generated between the anode and the cathode, electrons and holes can move to the light-emitting layer and are combined into excitons in the light-emitting layer, and the excitons excite light-emitting molecules to finally generate visible light.
Fig. 1 is a schematic cross-sectional view of a display device according to an embodiment of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a display device including: the array substrate 11, the organic light emitting diode device 12, the passivation layer 13, the cover plate 14 and the encapsulation glue layer 15.
The array substrate 11 is generally located at the bottom of the display device, and is electrically connected to the organic light emitting diode device 12 for driving the organic light emitting diode device 12 to perform image display.
The array substrate 11 includes: the circuit board comprises a substrate, a driving circuit formed on the substrate and a flat layer covering the driving circuit. The flat layer has a via hole through which an electrode of the organic light emitting diode is electrically connected to the driving line.
The substrate base plate is generally located at the bottom of the display device for supporting and carrying all the elements in the display device. The shape of the substrate base plate is adapted to the shape of a display device, and the display devices applied to the fields of televisions, mobile terminals and the like are all rectangular at present, so the substrate base plate can also be set to be rectangular; in addition, if the display device is applied to a special-shaped display device such as a smart watch, the substrate base plate can be correspondingly set to be in a shape of a circle or the like, which is not limited herein.
The display device may be a rigid display device or a flexible display device. A flexible material such as Polyimide (PI) can be used as the substrate of the flexible display device.
Before the OLED is fabricated on the substrate, the driving circuit needs to be fabricated on the substrate, and a thin film transistor array may be formed on the substrate by using a thin film fabrication process.
After the driving circuit is formed, a flat layer covers the driving circuit to protect the driving circuit and has an insulation effect. The flat layer is made of an organic material such as resin.
After the driving circuit is electrically connected with the OLED, the OLED can be subjected to light emitting control. In the embodiment of the present invention, the OLED can be driven by a passive driving method or an active driving method.
The organic light emitting diode device 12 is positioned on the array substrate 11. The organic light emitting diode device 12 includes at least an anode, a light emitting layer, and a cathode layer.
The anode of the OLED is formed on the array substrate 11 and electrically connected to the driving line in the array substrate.
The sub-pixels in the display panel are OLEDs, and the area of each anode defines a light emitting area of the OLED, i.e., an open area of the sub-pixel. The size of the anode may be determined according to the design and resolution of the display device, and is not limited herein. The anode may be generally rectangular in shape. The anode is made of Indium Tin Oxide (ITO) or the like.
The cathode is located on a side of the anode facing away from the array substrate 11, and the cathode and the anode are arranged opposite to each other, and an electric field is generated between the cathode and the anode when an electric signal is applied.
The cathode can be generally arranged on the whole surface, and each sub-pixel does not need to be distinguished to be arranged independently. The shape of the cathode is adapted to the shape of the array substrate 11, and may be generally rectangular. The size of the cathode is determined by the footprint of all the OLEDs, the cathode overlying all the OLEDs. The cathode is made of silver Ag or aluminum Al and the like.
When an electric signal is applied to the anode and the cathode to form an electric field between the anode and the cathode, electrons and holes move to the light-emitting layer and are combined into excitation in the light-emitting layer, so that the light-emitting material is excited to emit light.
The material adopted by the light-emitting layer is organic light-emitting material, and the materials adopted by the light-emitting layers of the OLEDs with different colors are different.
The passivation layer 13 covers the surface of the organic light emitting diode device 12 on the side away from the array substrate 11, and the passivation layer 13 also covers the side of the organic light emitting diode device 12.
After the OLED device is formed on the array substrate 11, a passivation layer 13 is formed on the surface of the OLED device to protect the OLED device 12, and then packaging or the like is performed.
The passivation Layer 13 is formed on the surface of the organic light emitting diode device 12 by using processes such as, but not limited to, vacuum evaporation, Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), Plasma Enhanced Atomic Layer Deposition (PEALD), inkjet printing, etc., and has a dense structure and a certain blocking effect.
The material of the passivation layer 13 may be an inorganic material and/or an organic material. Wherein, the inorganic material can be selected from but not limited to silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, zirconium oxide, zinc oxide, titanium dioxide, magnesium oxide, lithium fluoride, magnesium fluoride, chalcogenide glass, zinc sulfide, silicon oxycarbide; the organic material can be selected from, but not limited to, polyparaxylylene, chloro-p-xylene, polyethylene, polystyrene, polypropylene, polyethylene terephthalate, polytetrafluoroethylene, soluble polytetrafluoroethylene, polyesters, polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyvinyl acetate, polyether sulfone resin, polyimide, polydimethylsiloxane, and epoxy resin.
The cover plate 14 is located on a side of the organic light emitting diode device 12 facing away from the array substrate 11. The cover plate 14 is arranged opposite to the array substrate 11, and the shape of the cover plate 14 is matched with that of the substrate. And may be generally rectangular.
The material of the cover plate 14 may be glass, metal, or polymer film, and is selected according to different applications, and is not limited herein.
The cover plate 14 can play a role in protecting the panel, and the cover plate 14 can be matched with packaging glue to seal the OLED device so as to prevent external water vapor from entering the panel to prevent the OLED device from being corroded by water oxygen.
The encapsulation glue layer 15 is located on a side of the cover plate 14 facing the organic light emitting diode device 12, and the encapsulation glue layer 15 is filled between the array substrate 11 and the cover plate 14.
The encapsulating adhesive layer 15 is used for sealing the OLED device, thereby ensuring that the OLED device is not corroded by water vapor. The encapsulation glue layer 15 is made of a colloid material, and in the embodiment of the present invention, the encapsulation glue layer 15 is made of one of epoxy resin, acrylic resin or silicone resin.
The embodiment of the utility model provides an in, display panel can adopt the mode of face encapsulation to encapsulate. The surface package is a packaging mode applied to a large-size panel, and has the characteristics of simple structure, simple process and suitability for large-scale production.
The surface package has no limitation on the choice of the substrate, and the substrate may be made of glass, metal, or a polymer film. The glass panel is suitable for various panels such as glass hard screens, flexible screens, bent screens and curled screens.
For the requirement of adaptation face encapsulation, the embodiment of the utility model provides an in 15 adoption solid-state films of encapsulation glue film, solid-state films keep in the semi-solid state in the packaging process, and the shrinkage factor is low in the hardening process, but minimizing panel warpage. In addition, the solid film is not easy to break, and the thickness and the uniformity are easy to adjust. The method is suitable for roll-to-roll process, can effectively improve the packaging efficiency, and is suitable for large-scale production.
The embodiment of the utility model provides an in display device can be flexible display device, the OLED panel can be crooked or turn over the operation such as book along the fixed axle. Because the cover plate 14 and the encapsulation adhesive layer 15 are connected by printing or attaching, the encapsulation adhesive layer 15 is easy to peel off, warp and the like during the bending process of the OLED panel.
In view of this, referring to fig. 1, in the embodiment of the invention, the surface of the cover plate 14 facing the organic light emitting diode device 12 has a plurality of first protrusions t1, and the cross-sectional area of the first protrusions t1 set parallel to the cover plate tends to increase in a direction away from the cover plate.
The first protrusions t1 are a part of the cap plate 14, and the surface of the cap plate 14 facing the organic light emitting diode device 12 may be formed with a plurality of first protrusions t1 by etching or the like. The set position of the first protruding portion t1 is parallel to the cross-sectional area of the cover plate 14, and has a tendency of increasing along the direction away from the cover plate 14, so that the first protruding portion t1 has an inward concave structure, when the packaging adhesive layer 15 covers the surface of the cover plate 14, even if bending, folding and other operations occur, the first protruding portion t1 on the surface of the cover plate 14 and the packaging adhesive layer 15 form an interlocking effect, thereby increasing the attaching degree between the cover plate 14 and the packaging adhesive layer 15, and being beneficial to eliminating the phenomena of peeling, warping and the like of the panel.
The first protrusion t1 may have various existing forms, and referring to fig. 1, the cross-sectional area of the first protrusion t1 parallel to the cover plate 14 is gradually increased in a direction away from the cover plate 14. The side surfaces of the first protrusions t1 are inclined surfaces, which makes the cross section of the first protrusions t1 have a trapezoidal structure, the upper base of the trapezoid is close to the cover plate 14, and the lower base of the trapezoid is far away from the cover plate 14.
When the sectional area of the first protrusion t1 parallel to the cover plate 14 is gradually increased in a direction away from the cover plate 14, the first protrusion t1 may be shaped as a truncated cone or a truncated pyramid.
Fig. 2 is a bottom view of the cover plate of fig. 1. Referring to fig. 2, when the first protrusion t1 is shaped like a truncated pyramid, its bottom view may be square as shown in fig. 2; when the first projecting portion t1 is shaped like a circular truncated cone, its bottom view is circular.
The first protruding portion t1 adopts the above structure, and an inward concave structure is formed at a position where the first protruding portion t1 is close to the cover plate 14, so that when the first protruding portion t1 is attached to the packaging adhesive layer 15, an interlocking effect can be generated, and therefore, the attaching degree between the cover plate 14 and the packaging adhesive layer 15 is increased, and the phenomena of peeling, warping and the like of the panel are eliminated.
Fig. 3 is a second schematic cross-sectional view of a display device according to an embodiment of the present invention.
Referring to fig. 3, the cross-sectional area of the first protrusion t1 parallel to the cover plate 14 increases and then decreases in a direction away from the cover plate. The side surface of the first protrusion t1 is convex outward and then contracted inward, and the width of the first protrusion t1 near the cover plate 14 is narrower, and the width of the first protrusion at the middle position is the largest, i.e. the cross-sectional area of the first protrusion t1 near the upper half of the cover plate 14 increases in a direction away from the cover plate, parallel to the direction of the cover plate 14.
When the cross-sectional area of the first protrusion t1 parallel to the cover plate 14 increases and then decreases in a direction away from the cover plate, the shape of the first protrusion t1 is spherical or ellipsoidal.
Fig. 4 is a bottom view of the cover plate of fig. 3. Referring to fig. 4, when the first protrusion t1 has a spherical shape, its bottom view is circular as shown in fig. 4; when the first projecting portion t1 has an ellipsoidal shape, its bottom view may be circular.
The first protruding portion t1 adopts the above structure, and an inward concave structure is formed at a position where the first protruding portion t1 is close to the cover plate 14, so that when the first protruding portion t1 is attached to the packaging adhesive layer 15, an interlocking effect can be generated, and therefore, the attaching degree between the cover plate 14 and the packaging adhesive layer 15 is increased, and the phenomena of peeling, warping and the like of the panel are eliminated.
In the embodiment of the present invention, the surface of the cover plate 14 can be provided with a plurality of layers of first protrusions t1, and the first protrusions t1 are stacked in the same position, i.e. the first protrusions t1 with one or more same structures are stacked on the first protrusions t1 shown in fig. 1 and 3, so that the interlocking effect of the cover plate 14 and the encapsulating adhesive layer 15 can be enhanced, and the problem of peeling and warping of the cover plate 14 and the encapsulating adhesive layer 15 is avoided.
The embodiment of the utility model provides an in first bellying t1 can adopt etching methods such as photoetching, X ray etching, electron beam etching, ion beam etching or ion bombardment, chemical reaction to make, do not do the injecing here.
The embodiment of the utility model provides an among the above-mentioned display device that provides, the organic light emitting diode device can be top emission type device, also can be bottom emission type device.
When the oled device 12 is a top emission type device, the light emitted from the oled device 12 finally exits from one side of the cover plate 14.
Fig. 5 is a third schematic cross-sectional view of a display device according to an embodiment of the present invention.
Referring to fig. 5, the cover plate 14 has first protrusions t1 in both the display area AA and the non-display area VA. The cover plate 14 is provided with the first protruding portion t1 in both the display area AA and the non-display area VA, so that the cover plate 14 and the encapsulating adhesive layer 15 have an interlocking function at any position, and when the panel is bent, the problem of peeling or warping of the encapsulating adhesive layer 15 can be avoided due to the interlocking function of the cover plate 14 and the encapsulating adhesive layer 15. Meanwhile, the first protruding portion t1 located in the display area AA can increase the light exit surface of the cover plate 14 in the display area AA and has a scattering effect on light, so that the total reflection effect of light emitted from the organic light emitting diode device 12 when entering the cover plate 14 can be destroyed, more light can be emitted from the cover plate 14, and the light extraction efficiency of the panel is improved.
Referring to fig. 5, the size of the first protrusion t1 positioned in the non-display area VA is greater than the size of the first protrusion t1 positioned in the display area AA.
The first protruding portions t1 located in the non-display area VA mainly play a role in enhancing the fit degree of the cover plate 14 and the encapsulating adhesive layer 15; the first protruding portion t1 in the display area AA not only has the function of enhancing the fit between the cover plate 14 and the encapsulant layer 15, but also plays a role of scattering light. Therefore, the finer the first projecting portion t1 in the position display area AA is provided, the better the scattering effect thereof is. In the embodiment of the present invention, the size of the first protruding portion t1 in the display area AA can be reduced, and the number of the first protruding portions t1 is increased, thereby enhancing the scattering effect on light.
In the embodiment of the present invention, the size of the first protruding portion t1 located in the non-display area VA is 0.5 μm to 50 μm; the size of the first protrusion t1 located within the display area AA is 0.1 μm to 30 μm.
Fig. 6 is a fourth schematic cross-sectional view of a display device according to an embodiment of the present invention.
Referring to fig. 6, the embodiment of the invention has a plurality of second protrusions t2 on the surface of the array substrate 11 facing the organic light emitting diode device 12 in the non-display area VA, and the cross-sectional area of the second protrusions t2 at a position parallel to the array substrate 11 tends to increase in a direction away from the array substrate 11.
The second protrusion t2 and the first protrusion t1 have the same structure, the second protrusion t2 is disposed in the non-display area VA of the array substrate 11, and the second protrusion t2 has an inward-recessed structure at a position close to the array substrate 11, so that when the second protrusion t2 and the package adhesive layer 15 are attached to each other, an interlocking effect can be generated, thereby increasing the attachment degree between the array substrate 11 and the package adhesive layer 15, and being beneficial to eliminating the phenomena of peeling, warping and the like of the panel.
The shape and size of the second protrusion t2 and the first protrusion t1 may be the same, and the shape of the second protrusion t2 may be a truncated pyramid or a circular truncated cone, or may be a spherical shape or an ellipsoidal shape, which is not limited herein.
The second protrusion t2 is a part of the uppermost film layer of the array substrate 11. The uppermost film layer of the array substrate 11 is a flat layer, and the flat layer generally has a larger thickness, so that the flat layer can be etched to form the second protrusions t2 on the surface thereof.
The second protruding portion t2 can be formed by photolithography, X-ray etching, electron beam etching, ion bombardment, chemical reaction, or other etching methods, which are not limited herein.
In the embodiment of the present invention, the second protruding portion t2 located in the non-display area VA has a size of 0.5 μm to 50 μm.
Fig. 7 is a fifth schematic cross-sectional view of a display device according to an embodiment of the present invention.
Referring to fig. 7, the embodiment of the present invention also provides a plurality of second protrusions t2 on the array substrate 11 under the passivation layer 13, so that the orthographic projection of the passivation layer 13 on the array substrate 11 has an overlapping region with the orthographic projection of the second protrusions t2 on the array substrate 11.
The second protrusion t2 is disposed on the array substrate 11 under the passivation layer 13, and the position of the second protrusion t2 close to the array substrate 11 has an inward concave structure, so that when the second protrusion is attached to the passivation layer 13, an interlocking effect can be generated, thereby increasing the attachment degree between the array substrate 11 and the passivation layer 13, and being beneficial to eliminating the phenomena of peeling, warping and the like of the panel.
When the organic light emitting diode device 12 is a bottom emission type device, the light emitted from the organic light emitting diode device 12 is finally emitted from one side of the array substrate 11.
Fig. 8 is a sixth schematic cross-sectional view of a display device according to an embodiment of the present invention.
Referring to fig. 8, the cover plate 14 has first protrusions t1 in both the display area AA and the non-display area VA. The cover plate 14 is provided with the first protruding portion t1 in both the display area AA and the non-display area VA, so that the cover plate 14 and the encapsulating adhesive layer 15 have an interlocking function at any position, and when the panel is bent, the problem of peeling or warping of the encapsulating adhesive layer 15 can be avoided due to the interlocking function of the cover plate 14 and the encapsulating adhesive layer 15.
In an embodiment of the present invention, the first protrusion has a size of 0.5 μm to 50 μm.
Referring to fig. 8, the embodiment of the invention has a plurality of second protrusions t2 on the surface of the array substrate 11 facing the organic light emitting diode device 12 in the non-display area VA, and the cross-sectional area of the second protrusions t2 at a position parallel to the array substrate 11 tends to increase in a direction away from the array substrate 11.
The second protrusion t2 and the first protrusion t1 have the same structure, the second protrusion t2 is disposed in the non-display area VA of the array substrate 11, and the second protrusion t2 has an inward-recessed structure at a position close to the array substrate 11, so that when the second protrusion t2 and the package adhesive layer 15 are attached to each other, an interlocking effect can be generated, thereby increasing the attachment degree between the array substrate 11 and the package adhesive layer 15, and being beneficial to eliminating the phenomena of peeling, warping and the like of the panel.
Referring to fig. 8, the embodiment of the invention has a plurality of third protrusions t3 on the surface of the array substrate 11 facing the organic light emitting diode device 12 in the display area AA, and the cross-sectional area of the third protrusions t3 parallel to the array substrate 11 has a tendency to decrease gradually along the direction away from the array substrate 11.
The emergent light of the organic light emitting diode device of end emission type can see through the positive pole and to substrate base plate one side outgoing, the embodiment of the utility model provides a set up third bellying t3 in array substrate 11's display area, make the positive pole form on third bellying t3, can increase the play plain noodles of light like this, and third bellying t3 has the scattering effect, can destroy the total reflection effect that the light of organic light emitting diode device 12 outgoing takes place when incidenting into array substrate 11, make more light can be by the outgoing in the array substrate 11, improve the light of panel and take out efficiency.
In the embodiment of the present invention, the cross-sectional area of the third protrusion t3 parallel to the array substrate 11 has a tendency of gradually decreasing along the direction away from the array substrate 11, the side of the third protrusion t3 is the inclined surface, and the third protrusion t3 is close to the width broad on one side of the array substrate 11, and the width away from one side of the array substrate 11 is narrow, so that the surface of the third protrusion t3 is a tapered smooth structure. It is easier to fabricate the anode of the organic light emitting diode device 12 on top of such a structure.
In the embodiment of the present invention, the third protruding portion t3 may have a hemispherical shape or the like.
Referring to fig. 8, the size of the second protrusion t2 positioned in the non-display area VA is greater than the size of the third protrusion t3 positioned in the display area AA.
The second protruding portion t2 located in the non-display area VA mainly plays a role in enhancing the fit degree of the array substrate 11 and the encapsulation adhesive layer 15; and the third protruding portion t3 located in the display area AA mainly plays a role of scattering light. Therefore, the finer the third projecting portion t3 in the position display area AA is provided, the better the scattering effect is. In the embodiment of the present invention, the size of the third protruding portion t3 in the display area AA can be reduced, and the number of the third protruding portions t3 is increased, thereby enhancing the scattering effect on the light.
In the embodiment of the present invention, the size of the second protruding portion t2 located in the non-display area VA is 0.5 μm to 50 μm; the size of the third protrusions t3 located within the display area AA is 0.1 μm to 30 μm.
Fig. 9 is a seventh schematic cross-sectional view of a display device according to an embodiment of the present invention.
Referring to fig. 9, the embodiment of the present invention also provides a plurality of second protrusions t2 on the array substrate 11 under the passivation layer 13, so that the orthographic projection of the passivation layer 13 on the array substrate 11 has an overlapping region with the orthographic projection of the second protrusions t2 on the array substrate 11.
The second protrusion t2 is disposed on the array substrate 11 under the passivation layer 13, and the position of the second protrusion t2 close to the array substrate 11 has an inward concave structure, so that when the second protrusion is attached to the passivation layer 13, an interlocking effect can be generated, thereby increasing the attachment degree between the array substrate 11 and the passivation layer 13, and being beneficial to eliminating the phenomena of peeling, warping and the like of the panel.
According to the first utility model discloses think about, the apron has a plurality of first bellyings towards the surface of organic light emitting diode device one side, the setting for position of first bellyings has the trend along the direction increase of keeping away from the apron, make first bellyings have inside sunken structure like this, the encapsulation glue film covers in the surface of apron, even take place crooked and turn over the operation such as book, the effect of interlocking is formed with the encapsulation glue film to the first bellyings on apron surface, the laminating degree between apron and the encapsulation glue film has been increased from this, be favorable to avoiding the panel to produce and peel off, phenomenons such as warpage.
According to a second embodiment, the cross-sectional area of the first projection parallel to the cover plate increases gradually in the direction away from the cover plate. The shape of the first bulge can adopt a prismoid or a circular truncated cone. The position that first bellying is close to the apron forms inside sunken structure, when laminating each other with the encapsulation glue film, can produce the effect of interlocking, has increased the laminating degree between apron and the encapsulation glue film from this, is favorable to eliminating the panel and produces phenomenons such as peeling off, warpage.
According to the third utility model, the cross-sectional area that the first boss is parallel to the apron increases earlier then reduces along the direction of keeping away from the apron. The first convex part is spherical or ellipsoidal. The position that first bellying is close to the apron forms inside sunken structure, when laminating each other with the encapsulation glue film, can produce the effect of interlocking, has increased the laminating degree between apron and the encapsulation glue film from this, is favorable to eliminating the panel and produces phenomenons such as peeling off, warpage.
According to the fourth utility model concept, the apron surface sets up the first bellying of multilayer, piles up the setting at the first bellying in the same position, strengthens the interlocking of apron and encapsulation glue film from this, avoids apron and encapsulation glue film to take place to peel off and warping problem.
According to the fifth novel concept, the organic light emitting diode device is a top emission type device, the cover plate is provided with the first protruding portions in the display area and the non-display area, the cover plate and the packaging adhesive layer can have an interlocking effect at any position, and when the panel is bent, the interlocking effect of the cover plate and the packaging adhesive layer can avoid the problem that the packaging adhesive layer is peeled or warped. Meanwhile, the first protruding part positioned in the display area can increase the light-emitting surface of the cover plate in the display area and has a scattering effect on light, so that the total reflection effect of the light emitted by the organic light-emitting diode device when the light enters the cover plate can be destroyed, more light can be emitted from the cover plate, and the light extraction efficiency of the panel is improved.
According to a sixth aspect of the present invention, the size of the first protruding portion located in the non-display region is larger than the size of the first protruding portion located in the display region. The first bulge part positioned in the non-display area mainly plays a role in enhancing the joint degree of the cover plate and the packaging adhesive layer; the first protruding portion located in the display area not only has the effect of enhancing the attaching degree of the cover plate and the packaging glue layer, but also plays a role in scattering light. The size of the first protruding parts in the display area is reduced, and the number of the first protruding parts is increased, so that the scattering effect of the first protruding parts on light is enhanced.
According to a seventh aspect of the present invention, the organic light emitting diode device is a bottom emission type device, and the plurality of third protrusions are provided on a surface of the array substrate of the display region facing the organic light emitting diode device. The third protruding part can increase the light-emitting surface of the array substrate in the display area and has a scattering effect on light, so that the total reflection effect of the light emitted by the organic light-emitting diode device when the light enters the array substrate can be destroyed, more light can be emitted from the array substrate, and the light extraction efficiency of the panel is improved.
According to the eighth utility model, the cross-sectional area that the third boss is parallel to the array substrate has a trend that gradually decreases along the direction of keeping away from the array substrate, and the width that the third boss is close to array substrate one side is broad, and the width of keeping away from array substrate one side is narrower for the surface of third boss is the smooth structure of convergent. It is easier to fabricate the anode of the organic light emitting diode device on top of such a structure.
According to the ninth utility model, the third boss that is located the display area mainly plays the effect of scattering light. Therefore, the finer the third protrusions in the position display region are provided, the better the scattering effect thereof. The embodiment of the utility model provides an in, can reduce the size of the interior third bellying of display area, and increase the quantity of third bellying, strengthen its scattering effect to the light from this.
According to the tenth utility model discloses think, the organic light emitting diode device is the bottom emission type device, and the apron all sets up first bellying at display area and non-display area, can make apron and encapsulation glue film all have the interlocking in any position, and when the panel was buckled, the interlocking of apron and encapsulation glue film can avoid the encapsulation glue film to take place to peel off or warping problem.
According to the eleventh aspect of the invention, a plurality of second protrusions are provided on a surface of the array substrate facing the organic light emitting diode device in the non-display region, and a cross-sectional area of the second protrusions, which is parallel to the array substrate, tends to increase in a direction away from the array substrate. The second protruding part is provided with an inward concave structure at a position close to the array substrate, and when the second protruding part is mutually attached to the packaging adhesive layer, an interlocking effect can be generated, so that the attaching degree between the array substrate and the packaging adhesive layer is increased, and the phenomena of peeling, warping and the like of the panel are favorably eliminated.
According to the twelfth utility model discloses think, set up the second bellying on the array substrate under the passivation layer to the position that the second bellying is close to array substrate has inside sunken structure, when laminating each other with the passivation layer, can produce the effect of interlocking, has increased the laminating degree between array substrate and the passivation layer from this, is favorable to eliminating the panel and produces phenomenons such as peeling off, warpage.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A display device, comprising:
the array substrate is used for providing a driving signal;
the organic light emitting diode device is positioned on the array substrate and used for displaying images;
the passivation layer covers the surface of one side, away from the array substrate, of the organic light-emitting diode device and is used for protecting the organic light-emitting diode device;
the cover plate is positioned on one side, away from the array substrate, of the organic light-emitting diode device; the surface of the cover plate facing the organic light-emitting diode device is provided with a plurality of first protruding parts, and the setting positions of the first protruding parts are parallel to the cross-sectional area of the cover plate and have a trend of increasing along the direction away from the cover plate;
and the packaging adhesive layer is positioned on the surface of one side of the cover plate facing the organic light-emitting diode device and filled between the array substrate and the cover plate.
2. The display device according to claim 1, wherein a sectional area of the first convex portion parallel to the cover plate is gradually increased in a direction away from the cover plate.
3. The display device according to claim 1, wherein a cross-sectional area of the first convex portion parallel to the cover plate increases and then decreases in a direction away from the cover plate.
4. The display device according to claim 3, wherein the first convex portion is spherical in shape.
5. The display device of claim 1, wherein the organic light emitting diode device is a top emission type device;
the cover plate is provided with the first bulge parts in a display area and a non-display area;
the surface of the array substrate facing the organic light-emitting diode device side in the non-display area is provided with a plurality of second protruding parts, and the setting positions of the second protruding parts are parallel to the cross-sectional area of the array substrate and have a trend of increasing along the direction away from the array substrate.
6. The display device according to claim 5, wherein a size of the first convex portion located in the non-display area is larger than a size of the first convex portion located in the display area;
the size of the first protruding part in the non-display area is 0.5-50 μm;
the size of the first protruding part in the display area is 0.1-30 μm;
the second protrusions located in the non-display region have a size of 0.5 μm to 50 μm.
7. The display device of claim 1, wherein the organic light emitting diode device is a bottom emission type device;
the cover plate is provided with the first bulge parts in a display area and a non-display area;
the surface of the array substrate facing one side of the organic light-emitting diode device in the non-display area is provided with a plurality of second protruding parts, and the set positions of the second protruding parts are parallel to the cross-sectional area of the array substrate and have a trend of increasing along the direction away from the array substrate;
the surface of the array substrate facing the organic light-emitting diode device side in the display area is provided with a plurality of third protruding parts, and the cross section area of the third protruding parts parallel to the array substrate has a trend of gradually decreasing along the direction away from the array substrate.
8. The display device according to claim 7, wherein the third convex portion is hemispherical in shape.
9. The display device according to claim 7, wherein a size of the second convex portion located in the non-display region is larger than a size of the third convex portion located in the display region;
the size of the first bulge is 0.5-50 μm;
the size of the second protruding part in the non-display area is 0.5-50 μm;
the size of the third protruding part located in the display area is 0.1-30 μm.
10. The display device according to claim 5 or 7, wherein an orthogonal projection of the passivation layer on the array substrate has an overlapping region with an orthogonal projection of the second protrusion on the array substrate.
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| CN202020874278.2U CN212085044U (en) | 2020-05-22 | 2020-05-22 | Display device |
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| CN202020874278.2U CN212085044U (en) | 2020-05-22 | 2020-05-22 | Display device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786802A (en) * | 2020-12-23 | 2021-05-11 | 乐金显示光电科技(中国)有限公司 | Display device packaging structure and manufacturing method of packaging plate |
| CN112885244A (en) * | 2021-03-09 | 2021-06-01 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
| CN113421987A (en) * | 2021-06-03 | 2021-09-21 | 武汉华星光电技术有限公司 | Cover plate and display device |
-
2020
- 2020-05-22 CN CN202020874278.2U patent/CN212085044U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786802A (en) * | 2020-12-23 | 2021-05-11 | 乐金显示光电科技(中国)有限公司 | Display device packaging structure and manufacturing method of packaging plate |
| CN112885244A (en) * | 2021-03-09 | 2021-06-01 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
| CN112885244B (en) * | 2021-03-09 | 2022-05-17 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
| CN113421987A (en) * | 2021-06-03 | 2021-09-21 | 武汉华星光电技术有限公司 | Cover plate and display device |
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