JP2012199207A - Organic electroluminescent display and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a thin organic EL display capable of suppressing occurrence of deterioration phenomena in a display, such as reduction in brightness with driving time and generation/expansion of dark spots, even when laser repair is performed; and a method for manufacturing the thin organic EL display.SOLUTION: In an organic EL display, an organic EL element substrate is bonded with a counter substrate via a sealing agent laid throughout, the organic EL element substrate including: a patterned first electrode provided on a substrate; a first barrier covering an end of the first electrode; an organic light emitting medium layer provided in a region partitioned by the first barrier, on the first electrode; and a second electrode facing the first electrode while sandwiching the organic light emitting medium layer therebetween. A second barrier is further formed on the first barrier, and a filler is filled in a region partitioned by the second barrier.

Description

  The present invention relates to an organic electroluminescence display and a method of manufacturing the same, and an organic electroluminescence display capable of suppressing deterioration of the display such as a decrease in luminance and generation / expansion of dark spots with the lapse of driving time even when laser repair is performed, and the method It relates to a manufacturing method.

  In recent years, with the diversification of information equipment, there has been an increasing need for flat display elements that consume less power than commonly used CRTs (cathode ray tubes). As one of such flat display elements, organic electroluminescence (hereinafter abbreviated as “organic EL”) elements having features such as high efficiency, thinness, light weight, and low viewing angle dependence have been attracting attention. The development of the existing display is underway.

  An organic EL element is formed on a substrate provided with a thin film transistor (TFT), an organic layer such as a first electrode (anode), a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a second electrode ( A cathode in which cathodes are stacked in order is known. When a potential difference is applied between the anode and the cathode, and a drive current is passed through the organic EL element, holes injected from the anode and electrons injected from the cathode are recombined inside the light emitting layer to form a light emitting layer. Excitons are generated by exciting organic molecules. Light is emitted from the light emitting layer in the process of radiation deactivation of the excitons, and the light is emitted from the transparent anode through the transparent insulating substrate to emit light.

  The organic EL layer and the cathode are formed by a vacuum deposition method using a metal mask. In this vapor deposition step, foreign matter may adhere to the formation region of the organic EL element. For this reason, a short circuit occurs between the anode and the cathode, and there is no potential difference between the anode and the cathode. Then, the driving current does not flow through the organic EL element, and a dark spot (dark spot) is generated in the pixel region.

  Therefore, the laser repair method used in the manufacture of the liquid crystal display is also applied to the organic EL display device, and the foreign matter causing the dark spot is irradiated with laser light having a predetermined wavelength (for example, 1056 nm) to burn out the foreign matter. The pixel is caused to emit light by blowing away and destroying part of the pixel. For example, Patent Document 1 discloses that a pixel, which is a unit of light emission, is further partitioned to form a plurality of pixel elements so that peeling of electrodes and increase of non-light-emitting areas do not reach adjacent pixel elements. A technique for causing the peripheral pixel region to emit light normally is disclosed.

  However, as disclosed in Patent Documents 2 and 3, for example, a structure having a protective film such as silicon nitride on the cathode can be expected to improve the sealing performance. However, when laser repair is performed, the protective film is expected. Since it covers the cathode, it is difficult for foreign matter to scatter. If the laser intensity (energy) is forcibly increased in order to disperse foreign matter, the energy will damage the cathode layer and the like, which will break and cause pinholes in the organic EL element portion. When this pinhole is formed, moisture penetrates into the element and the element characteristics are deteriorated, resulting in a display defect called a dark spot. In addition, even if foreign matter can penetrate through the protective film layer by laser irradiation, the barrier property of the protective film is eventually lost, and there is a problem that moisture penetrates through this through-hole and enlarges the dark spot. It was.

JP 2000-195567 A JP 2005-347204 A JP 2007-184251 A

  The present invention has been made in view of the above problems, and even when laser repair is performed, a display deterioration phenomenon such as a decrease in luminance and generation / expansion of dark spots with the lapse of driving time can be suppressed, and a thin organic It is an object to provide an EL display and a manufacturing method thereof.

  According to a first aspect of the present invention, there is provided a patterned first electrode provided on a substrate, a first partition wall covering an end of the first electrode, and the first electrode. An organic EL element substrate comprising an organic light emitting medium layer provided in a region partitioned by the first partition and a second electrode facing the first electrode across the organic light emitting medium layer, In the organic EL display in which the sealing agent is bonded to the counter substrate through the entire surface, a second partition is further formed on the first partition, and a region partitioned by the second partition is filled. It is an organic EL display characterized by being filled with an agent.

  Further, the invention according to claim 2 of the present invention is characterized in that the first partition and the second partition are in a matrix form, and the number of matrices is smaller in the second partition than in the first partition. An organic EL display according to claim 1.

  Further, the invention according to claim 3 of the present invention is the organic EL display according to claim 1 or 2, wherein the filler is a member comprising at least a silicone oil containing a hygroscopic agent. is there.

  The invention according to claim 4 of the present invention is the organic EL display according to any one of claims 1 to 3, wherein the counter substrate has a flat plate shape.

  Next, an invention according to claim 5 of the present invention is a pattern-shaped first electrode provided on a substrate, a first partition that covers an end of the first electrode, and the first An organic electroluminescent element substrate comprising an organic light emitting medium layer provided in a region partitioned by a partition wall and a second electrode facing the first electrode across the organic light emitting medium layer is bonded to the counter substrate. In the method for manufacturing an organic EL display, at least a second partition forming step of forming a second partition on the first partition and a filling for injecting a filler into a region partitioned by the second partition An organic EL display manufacturing method comprising: an agent injection step; and a step of bonding the organic EL element substrate and the counter substrate through a sealing agent over the entire surface after the filler injection step. is there.

Since the organic EL display of the present invention uses silicone oil as a filler on the second electrode (cathode), it is less energetic when performing laser repair than a protective film (organic film or inorganic film). Can be burned out and blown away. Therefore, damage applied to the cathode or the like can be suppressed, and occurrence of pinholes can be reduced. In addition, when a protective film is formed on the second electrode, cracks may occur in the film due to the energy of laser irradiation. As a result, moisture penetrates from the cracks and enlarges the dark spots. By using a filler (silicone oil) on the electrode, foreign substances can be confined in the silicone oil layer. Moreover, the moisture deterioration from the through-hole of the 2nd electrode penetrated by laser irradiation can be suppressed by making a filler contain a hygroscopic agent.

  Further, in the organic EL display of the present invention, the partition walls are prepared as a first partition wall for coating the light emitting layer and a second partition wall for forming the filler so that the second partition wall is smaller than the first partition wall. By forming a matrix, the filler can be formed by a dispensing method or a nozzle method.

  Moreover, a thin display can be provided by using a flat base material for the counter substrate, forming a sealant on the entire surface, and attaching the sealant therethrough.

  As a result, according to the present invention, it is possible to suppress a display deterioration phenomenon such as a decrease in luminance with the lapse of driving time and generation / expansion of dark spots even when laser repair is performed, and a thin organic EL display is provided. I can do it.

It is a schematic diagram which shows one Example of the organic electroluminescent display of this invention in a cross section. It is a schematic diagram which shows the cross section of the other example in one Embodiment of the organic electroluminescent display of this invention. It is a perspective view of the organic EL element substrate concerning one embodiment of the organic EL display of the present invention. It is a schematic diagram which shows the example of 1 structure of the conventional organic EL display in a cross section.

  An organic EL display of the present invention will be described based on an embodiment with reference to the drawings. The drawings referred to in the following description are for explaining the configuration of the present invention, and the size, thickness, dimensions, and the like of each part shown in the drawings are different from the actual ones. The present invention is not limited to these.

  FIG. 1 is a schematic view showing an embodiment of the organic EL display of the present invention in cross section. As shown in FIG. 1, the organic EL display of the present invention includes a substrate 1, a thin film transistor (TFT) 2, a planarizing film layer 3, a first electrode 4, a first partition 5, a second partition 6, an organic EL light emitting medium layer. 7, a second electrode 8, a filler 9, a hygroscopic agent 10, a sealing agent 11, and a sealing substrate 12.

  FIG. 2 is a schematic view showing, in cross section, another example of the organic EL display of the present invention, and includes a protective film 13 in addition to the substrate shown in FIG.

  Hereinafter, the material of each part constituting the organic EL display will be described.

[substrate]
Any substrate can be used as the substrate 1 as long as it has insulating properties and excellent dimensional stability. For example, plastic films and sheets such as glass, quartz, polypropylene, polyethersulfone, polycarbonate, cycloolefin polymer, polyarylate, polyamide, polymethyl methacrylate, polyethylene terephthalate, polyethylene naphthalate, etc., or oxidation to these plastic films and sheets Metal oxides such as silicon and aluminum oxide, metal fluorides such as aluminum fluoride and magnesium fluoride, metal nitrides such as silicon nitride and aluminum nitride, metal oxynitrides such as silicon oxynitride, acrylic resins and epoxy resins Alternatively, a translucent base material in which a polymer resin film such as a silicone resin or a polyester resin is single-layered or laminated can be used. Further, a metal foil such as aluminum or stainless steel, a sheet, a plate, a non-translucent base material obtained by laminating a metal film such as aluminum, copper, nickel, stainless steel on the plastic film or sheet can be used. What is necessary is just to select the translucency of a base material according to which surface light extraction is performed from. The substrate made of these materials may have been subjected to moisture-proofing treatment or hydrophobic treatment by forming an inorganic film or applying a fluororesin in order to avoid moisture intrusion into the organic EL element. preferable. In particular, in order to avoid intrusion of moisture into the organic light emitting medium, it is preferable to reduce the moisture content and gas permeability coefficient in the substrate.

[Thin Film Transistor (TFT)]
Further, as the substrate 1, a driving substrate on which a thin film transistor (TFT) is formed may be used as necessary. In the case of an active drive type organic EL element, the planarization film layer 3 is formed on the TFT 2, and the first electrode 4 of the organic EL element is provided on the planarization film layer 3, and The TFT 2 and the first electrode 4 are preferably electrically connected via a contact hole provided in the planarizing film layer 3. By comprising in this way, the outstanding electroconductivity can be obtained between TFT and an organic EL element. As the thin film transistor provided over the substrate, a known thin film transistor can be used. Specifically, a thin film transistor mainly including an active layer in which a source / drain region and a channel region are formed, a gate insulating film, and a gate electrode can be given. The structure of the thin film transistor is not particularly limited, and examples thereof include a staggered type, an inverted staggered type, a top gate type, and a coplanar type.

[Flattening film layer]
Regarding the material of the planarizing film layer 3, inorganic materials such as SiO ₂ , spin-on glass, SiN (Si ₃ N ₄ ), TaO (Ta ₂ O ₅ ), polyimide resin, acrylic resin, photoresist material, black matrix material, etc. Organic materials or the like can be used. Spin coating, CVD, vapor deposition, etc. can be selected according to these materials. If necessary, contact holes are formed by dry etching, wet etching, etc. at a position corresponding to the thin film transistor in the lower layer by photolithography using a photosensitive resin as the planarizing film layer or once forming the planarizing film layer on the entire surface. Form. The contact hole is then filled with a conductive material to establish conduction with the pixel electrode formed in the upper layer of the planarization layer. The thickness of the planarizing layer is not limited as long as it can cover the lower TFT, capacitor, wiring, etc., and the thickness may be several μm, for example, about 3 μm.

[First electrode]
The first electrode 4 is formed on the substrate 1 and patterned as necessary. In one embodiment of the present invention, the first electrode is partitioned by a first partition, and becomes a pixel electrode corresponding to each pixel. As materials for the first electrode, metal composite oxides such as ITO (indium tin composite oxide), indium zinc composite oxide and zinc aluminum composite oxide, metal materials such as gold and platinum, these metal oxides, Either a single layer or a laminate of fine particle dispersion films in which fine particles of a metal material are dispersed in an epoxy resin or an acrylic resin can be used. When the first electrode is used as an anode, it is preferable to select a material having a high work function such as ITO. In the case of a so-called bottom emission structure in which light is extracted from below, it is necessary to select a light-transmitting material. If necessary, a metal material such as copper or aluminum may be provided as an auxiliary electrode in order to reduce the wiring resistance of the first electrode. Depending on the material, the first electrode can be formed by a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a sputtering method, a dry film forming method, a gravure printing method, or a screen printing method. A wet film forming method such as a method can be used. As a patterning method for the first electrode, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on the material and the film forming method. In the case where a substrate in which a TFT is formed in advance is used as the substrate, it is formed so that conduction can be achieved corresponding to the lower pixel.

[First partition]
Next, a partition that covers the end of the first electrode 4 is formed. The partition has a two-layer structure of a first partition 5 and a second partition 6, and the first partition 5 partitions pixels and is formed in a matrix. As the material of the first partition wall 5, a material excellent in affinity with the ink constituting the organic light emitting medium layer 7 and the second electrode 8 can be preferably used. Generally, it is a hydrophilic inorganic material. For example, inorganic oxides and inorganic nitrides. Examples of the inorganic oxide include silicon oxide and aluminum oxide. The first partition 5 is formed with an opening corresponding to the light emitting region by dry etching after forming a film (first partition formation layer) 5 on the first electrode 4. The thickness of the 1st partition 5 is 0.1 micrometer-10 micrometers, More preferably, they are 0.5 micrometer-3 micrometers. The width of the first partition wall 5 is preferably in the range of 5 μm to 100 μm.

[Second partition wall]
The second partition 6 is formed on the first partition 5 and a filler 9 is formed in the second partition 6. Examples of the material for the second partition 6 include, but are not limited to, a photosensitive material containing a monomer or oligomer and a photopolymerization initiator that polymerizes the monomer or oligomer in a resin binder. As the resin binder, a resin containing an amino group, an amide group, a carboxyl group, or a hydroxyl group can be preferably used. Specifically, a cresol-novolak resin, a polyvinylphenol resin, an acrylic resin, a methacrylic resin, and the like can be given. As the monomer or oligomer, a monomer or oligomer having a vinyl group or an allyl group, or a molecule having a vinyl group or an allyl group at the terminal or side chain can be used. Specifically, (meth) acrylic acid and salts thereof, (meth) acrylic acid esters, (meth) acrylamides, maleic anhydride, maleic acid esters, itaconic acid esters, styrenes, vinyl ethers, vinyl esters , N-vinyl heterocycles, allyl ethers, allyl esters, and derivatives thereof. Examples of suitable compounds include relatively low molecular weight polyfunctional acrylates such as pentaerythritol triacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol pentaacrylate, and hexaacrylate. be able to. Then, this photosensitive material is applied on the first partition wall 5 forming layer by a slit coating method or the like to form a film (second partition forming layer), and is exposed and developed. The thickness of the second partition wall is 0.1 μm to 10 μm, more preferably 1 μm to 5 μm. The width of the second partition wall is preferably in the range of 5 μm to 50 μm. The number of matrixes is not limited as long as it is a number that can form the filler 9 in the second partition walls 6 and is smaller than the number of matrices of the first partition walls 5.

[Organic luminescent medium layer]
Next, the organic light emitting medium layer 7 is formed. The organic light emitting medium layer 7 in the present invention can be formed of a single layer film or a multilayer film containing a light emitting substance. Examples of the configuration in the case of forming a multilayer film include a hole transport layer, an electron transporting light emitting layer or a hole transporting light emitting layer, a two-layer structure comprising an electron transport layer, a hole transport layer, a light emitting layer, and an electron transport layer. By further separating the hole (electron) injection function and the hole (electron) transport function as necessary, or by inserting a layer that blocks the transport of holes (electrons), if necessary, It is more preferable to form a multilayer. In addition, the organic light emitting layer in the present invention refers to a layer containing an organic light emitting material, and the charge transport layer refers to a layer formed to increase other light emission efficiency such as a hole transport layer.

Examples of hole transport materials include metal phthalocyanines such as copper phthalocyanine and tetra (t-butyl) copper phthalocyanine and metal-free phthalocyanines, quinacridone compounds, 1,1-bis (4-di-p-tolylaminophenyl) Cyclohexane, N, N′-diphenyl-
N, N′-bis (3-methylphenyl) -1,1′-biphenyl-4,4′-diamine, N, N′-di (1-naphthyl) -N, N′-diphenyl-1,1 ′ -Aromatic amine-based low molecular hole injection and transport materials such as biphenyl-4,4'-diamine, polyaniline, polythiophene, polyvinylcarbazole, a mixture of poly (3,4-ethylenedioxythiophene) and polystyrene sulfonic acid, etc. Polymer hole transport materials, polythiophene oligomer materials, and other existing hole transport materials.

  As organic light-emitting materials, 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, tris (8-quinolinolato) aluminum complex, tris (4-methyl-8) -Quinolinolato) aluminum complex, bis (8-quinolinolato) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolinolato) aluminum complex, tris (4-methyl-5-cyano-8-quinolinolato) aluminum complex Bis (2-methyl-5-trifluoromethyl-8-quinolinolato) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8-quinolinolato) [4- (4 -Cyanophenyl) phenolate] aluminum complex, Lis (8-quinolinolato) scandium complex, bis [8- (para-tosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, pentaphenylcyclopentadiene, poly-2,5 -Diheptyloxy-para-phenylene vinylene, coumarin phosphor, perylene phosphor, pyran phosphor, anthrone phosphor, porphyrin phosphor, quinacridone phosphor, N, N'-dialkyl-substituted quinacridone fluorescence , Naphthalimide-based phosphors, N, N′-diaryl-substituted pyrrolopyrrole-based phosphors, phosphorescent phosphors such as Ir complexes, and other low-molecular light-emitting materials, polyfluorene, polyparaphenylene vinylene, polythiophene, polyspiro High molecular materials such as, and low molecular weight materials Materials and dispersed or copolymerized, it is possible to use other existing polymer-low molecular luminescent material.

  Examples of the electron transport material include 2- (4-bifinylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole, 2,5-bis (1-naphthyl) -1, 3,4-oxadiazole, oxadiazole derivatives, bis (10-hydroxybenzo [h] quinolinolato) beryllium complexes, triazole compounds, and the like can be used. For the formation, vacuum deposition or the like can be used.

  The film thickness of the organic light-emitting medium layer 7 is 1000 nm or less, preferably 50 to 150 nm, even when formed by a single layer or a stacked layer. In particular, the hole transport material of the organic EL element has a large effect of covering the surface protrusions of the substrate and the first electrode, and it is more preferable to form a film having a thickness of about 50 to 100 nm.

  As a method for forming the organic light-emitting medium layer 7, depending on the material constituting each layer, a vacuum deposition method, a coating method such as spin coating, spray coating, flexo, gravure, micro gravure, intaglio offset, printing method or ink jet method Etc. can be used. When the material constituting the organic light emitting medium layer is made into a solution, it is preferable to control the vapor pressure, the solid content ratio, the viscosity and the like of the solvent according to the forming method. Solvents include water, xylene, anisole, cyclohexanone, mesitylene, tetralin, cyclohexylbenzene, methyl benzoate, ethyl benzoate, toluene, ethanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, methanol, isopropyl alcohol, ethyl acetate, butyl acetate, etc. These may be a single solvent or a mixed solvent. In order to improve coatability, it is more preferable to mix an appropriate amount of additives such as surfactants, antioxidants, viscosity modifiers and ultraviolet absorbers as necessary. As a method for drying the coating solution, the solvent may be removed to the extent that the light emission characteristics are not hindered, and heating, decompression, or heating / decompression may be performed.

[Second electrode]
Next, the second electrode 8 is formed. When the second electrode is used as a cathode, a material having a high electron injection efficiency into the organic light emitting medium layer 7 and a low work function is used. Specifically, a single metal such as Mg, Al, or Yb is used, or a compound such as Li, oxidized Li, or LiF is sandwiched by about 1 nm at the interface contacting the light emitting medium, and Al or Cu having high stability and conductivity is laminated. May be used. Alternatively, in order to achieve both electron injection efficiency and stability, one or more metals such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, and Yb having a low work function and stable Ag, Al An alloy system with a metal element such as Cu or Cu may be used. Specifically, alloys such as MgAg, AlLi, and CuLi can be used. In the case of a so-called top emission structure in which light is extracted from the second electrode side, it is preferable to select a light-transmitting material. As a method for forming the second electrode 8, a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method can be used depending on the material. Although there is no restriction | limiting in particular in the thickness of a 2nd electrode, About 50 nm-1000 nm are desirable.

[filler]
Next, the filler 9 is formed. Silicone oil is used as the filler 9. As the silicone oil, any known silicone oil can be used without any particular limitation. The resistance value is preferably 10 ³ Ωcm or more, more preferably 10 ⁷ Ωcm to 10 ¹⁹ Ωcm, and still more preferably 10 ¹⁰ to 10 ¹⁹ Ωcm. The viscosity is 1 × 10 ⁻⁶ m ² s ⁻¹ to 1 × 10 ⁻³ m ² s ⁻¹ , more preferably 1 × 10 ⁻⁶ m ² s ⁻¹ to 1 × 10 ⁻⁴ m ² s ⁻¹ . . Specifically, dimethyl silicone oils such as KF-96 manufactured by Shin-Etsu Chemical Co., Ltd., DOW CORNING 200 manufactured by Dow Corning Co., Ltd., and TSF451 manufactured by GE Toshiba Silicone Co., Ltd. can be used. In addition, modified silicone oil in which an organic group is introduced into a part of the methyl group of dimethylpolysiloxane (for example, KF-393, X22-3710 manufactured by Shin-Etsu Chemical Co., Ltd.) can be used. The filler 9 is preferably dehydrated after containing the moisture absorbent 10 described below, and the water content is preferably 100 ppm or less, more preferably 10 ppm or less. For forming the filler, a dispensing method, a nozzle coating method, or the like can be used.

[Hygroscopic agent]
The hygroscopic agent 10 contained in the filler 9 can remove moisture and the like, for example, inorganic compounds such as alkali metal oxides, alkaline earth metal oxides, sulfates, metal halides, perchlorates, etc. , Organic materials such as acrylic or methacrylic water-absorbing polymers, metals selected from alkali metals and alkaline earth metals or alloys thereof, general hygroscopic agents such as activated alumina, silica gel, zeolite, etc. 1 type, or 2 or more types can be used. For the removal of moisture, it is preferable to use an alkali metal oxide and / or alkaline earth metal oxide that chemically adsorbs moisture as a hygroscopic agent, rather than a general hygroscopic agent that physically adsorbs moisture. The hygroscopic agent is preferably in the range of 5 to 70% by volume, more preferably 20 to 50% by volume with respect to the filler. The shape of the hygroscopic agent is not particularly limited, but it is preferably a powder with a large surface area and as fine as possible. More preferably, the particle size is 2 μm or less.

[Sealant]
Next, the organic EL element can be sealed by adhering the sealing substrate 12 via the sealing agent 11. Examples of the sealing agent include a liquid adhesive and a sheet adhesive. Examples of the liquid adhesive include photo-curing and thermosetting sealing agents having reactive vinyl groups such as acrylic acid oligomers and methacrylic acid oligomers, moisture-curing adhesives such as 2-cyanoacrylate, epoxy-based adhesives, etc. And heat curing and chemical curing type (two-component mixing) adhesives, cationic curing type ultraviolet curing epoxy resin adhesives, and the like. When bonding a sealing member and an organic EL element using a liquid adhesive, the bonding part is bonded stability, prevention of air bubbles mixing into the bonding part, flatness of the flexible sealing member, etc. Is preferably performed under reduced pressure conditions of 10 to 1 × 10 ⁻⁵ Pa. The sheet-like adhesive refers to an adhesive that is non-flowable at room temperature (about 25 ° C.) and exhibits fluidity in the range of 50 ° C. to 100 ° C. when heated and is formed into a sheet shape. As an adhesive to be used, for example, a photocurable resin mainly composed of a compound having an ethylenic double bond at the terminal or side chain of a molecule and a photopolymerization initiator can be mentioned. In use, for example, it is preferable to use it at a normal temperature (about 25 ° C.) or less by pasting it on the sealing member side in advance.

 The application method of the sealant 11 can be, for example, a nozzle application method when using a liquid adhesive, and a laminate method when using a sheet-like adhesive. The sheet adhesive may be laminated and transferred to the sealing substrate side in advance, or may be vacuum laminated by picking and placing on the organic EL element substrate side.

[Sealing substrate]
The sealing substrate 12 needs to be a base material having low moisture and oxygen permeability. Examples of the material include ceramics such as alumina, silicon nitride, and boron nitride, glass such as non-alkali glass and alkali glass, metal foil such as quartz, aluminum, and stainless steel, and moisture resistant film. Examples of moisture-resistant films include films formed by CVD of SiOx on both sides of plastic substrates, films with low permeability and water-absorbing films, or polymer films coated with a water-absorbing agent. The water vapor transmission rate is preferably 10 ⁻⁶ g / m ² / day or less.

[Protective film]
When the sealing performance is insufficient, the sealing performance can be improved by forming a sealing agent after covering the filler layer 9 with the protective film 13 or by forming a sealing agent / protective film / sealing agent structure. . The protective film 13 can be sealed with an inorganic thin film, for example, by using a CVD method to form a silicon nitride film having a thickness of 3 μm. The thickness of the protective film 13 is preferably 500 nm to 10 μm.

  Specific examples of the present invention will be described below.

<Example 1>
A TFT and a planarization insulating layer were patterned on a glass substrate by a conventionally known method, and ITO (Al: reflective electrode) serving as a first electrode was laminated by sputtering to a thickness of 100 nm. After laminating 2 μm of SiO ₂ film on this substrate by CVD method, an opening is formed corresponding to the light emitting region by using dry etching method to form a matrix-like first partition wall (961 rows and 241 rows). did. The number of light emitting pixels is 320 × 240, and one pixel is 40 μm × 150 μm. Next, 2 μm of a photosensitive polyimide resin was laminated by a slit coating method, and a second partition was laminated on the first partition through an exposure / development process. The second partition walls were arranged in a matrix so as to be evenly arranged in 5 rows and 21 rows.

  Next, a polymer hole transport layer (film thickness after drying of 50 nm) and a polymer light emitting layer (film thickness of after drying of 80 nm) as an organic light-emitting medium layer are ink-jetted into an opening which is a region partitioned by the first partition. Formed using the method. Next, Ba (film thickness: 5 nm) and Al (film thickness: 400 nm) were formed in this order as the second electrode by vapor deposition.

  Next, methylphenyl silicone (product number SH550) manufactured by Toray Dow Corning Silicone Co., Ltd. was mixed with 35% by volume of zeolite having a particle size of 0.6 μm, and after mixing for 90 minutes with a stirrer, glove box It was dehydrated by heating at 250 ° C. for 4 hours. Then, it apply | coated to the area | region divided by the 2nd partition with the dispensing method. As described above, an organic EL element substrate was formed.

Next, flat glass was used for the counter substrate. After the ultraviolet curable sheet adhesive (film thickness 25 nm) is transferred to the flat glass, it is heated and pressurized at 85 ° C. for 5 minutes with a vacuum laminator and bonded to the organic EL element substrate, and UV irradiation is performed at 6000 mJ / cm ^2. Thus, an organic EL display of Example 1 was obtained.

<Example 2>
In Example 1, the ultraviolet curable adhesive was not transferred to the flat glass side, and the thermosetting sheet adhesive (film thickness: 10 nm) was vacuum laminated on the organic EL element substrate formed up to the silicone filling, and then the vacuum was applied. The laminate was heated and pressed at 85 ° C. for 5 minutes in a laminating apparatus. Further, after forming a SiNx film of 3 μm by CVD as a protective film, it was bonded to a flat glass to which an ultraviolet curable adhesive (film thickness 25 nm) was transferred using a vacuum laminator (85 ° C. for 5 minutes), and 6000 mJ / cm ² UV The organic EL display of Example 2 was obtained by irradiation.

<Comparative Example 1>
After forming up to the second electrode in Example 1, the SiNx film (3 μm) was laminated by the CVD method, and then bonded to the flat glass to which the ultraviolet curable adhesive (film thickness: 25 nm) was transferred with a vacuum laminator (85 ° C. 5 Min) and 6000 mJ / cm ² UV irradiation to obtain an organic EL display of Comparative Example 1.

[Evaluation]
Laser repair of the organic EL displays obtained in Examples 1 and 2 and Comparative Example 1 was performed. Laser repair was performed on the dark spot pixels having foreign matters of 5 μm or less. As a result of increasing the intensity of the laser until repair was possible, the dark spot (non-light emitting portion) size was as shown in Table 1. Further, after laser repair, the sample was left in a constant temperature and humidity chamber at 60 ° C. and 90% RH for 1500 hours to examine the degree of expansion of dark spots. The results are also shown in Table 1.

As can be seen from Table 1, in the organic EL displays of Examples 1 and 2, the dark spot size is small compared to the organic EL display of Comparative Example 1, and the dark spot size increases even if left in a constant temperature and humidity layer. Was a small result. Therefore, in Examples 1 and 2, laser repair can be performed effectively, and it can be seen that an organic EL display that can suppress the deterioration phenomenon of elements such as dark spots can be realized.

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... TFT 3 ... Planarization film layer 4 ... 1st electrode
DESCRIPTION OF SYMBOLS 5 ... 1st partition 6 ... 2nd partition 7 ... Organic luminescent medium layer 8 ... 2nd electrode 9 ... Filler 10 ... Hygroscopic agent 11 ... Sealing agent 12 ...・ Sealing substrate 13 ... Protective film

Claims (5)

A patterned first electrode provided on the substrate, a first partition covering the end of the first electrode, and the first partition on the first electrode and partitioned by the first partition An organic EL element substrate comprising an organic light emitting medium layer provided in a region and a second electrode facing the first electrode across the organic light emitting medium layer is attached to the counter substrate with a sealant over the entire surface. In the combined organic EL display,
An organic electroluminescence display, wherein a second partition is further formed on the first partition, and a region partitioned by the second partition is filled with a filler.   2. The organic electroluminescence display according to claim 1, wherein the first partition and the second partition have a matrix shape, and the number of matrixes is smaller in the second partition than in the first partition.   3. The organic electroluminescence display according to claim 1, wherein the filler is a member made of at least a silicone oil containing a hygroscopic agent. 4.   The organic electroluminescence display according to claim 1, wherein the counter substrate has a flat plate shape. A patterned first electrode provided on a substrate, a first partition covering an end of the first electrode, and an organic light emitting medium layer provided in a region partitioned by the first partition And in the manufacturing method of an organic electroluminescence display formed by laminating an organic electroluminescence element substrate composed of a second electrode facing the first electrode across the organic light emitting medium layer,
At least a second partition forming step of forming a second partition on the first partition, a filler injection step of injecting a filler into a region partitioned by the second partition, and the filler injection A method for producing an organic electroluminescence display, comprising: a step of bonding the organic electroluminescence element substrate and the counter substrate through a sealing agent over the entire surface after the step.