WO2021077241A1 - 一种折弯性能优异的铜合金及其制备方法和应用 - Google Patents

一种折弯性能优异的铜合金及其制备方法和应用 Download PDF

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WO2021077241A1
WO2021077241A1 PCT/CN2019/000210 CN2019000210W WO2021077241A1 WO 2021077241 A1 WO2021077241 A1 WO 2021077241A1 CN 2019000210 W CN2019000210 W CN 2019000210W WO 2021077241 A1 WO2021077241 A1 WO 2021077241A1
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copper alloy
bending performance
cold rolling
excellent bending
rolling
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PCT/CN2019/000210
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English (en)
French (fr)
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姚懂
谢东
易志勇
何晓明
臧俊杰
胡仁昌
钟磊
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宁波博威合金材料股份有限公司
宁波博威合金板带有限公司
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Publication of WO2021077241A1 publication Critical patent/WO2021077241A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the invention relates to a copper alloy, in particular to a copper alloy with excellent bending performance and a preparation method and application thereof.
  • the copper alloy can be applied to connectors, bus bars, relay shrapnels and heat dissipation systems.
  • the thickness of the copper alloy strips used has become thinner and the current carrying
  • the increase in flow makes copper alloy strips require higher mechanical properties, electrical conductivity and stress relaxation resistance, so as to ensure the reliability and durability of electronic products.
  • the yield strength of copper alloy strips is required to be 550-700MPa and the electrical conductivity is 60-70. %IACS, 120°C, 150°C for 1000h, the residual stress of the strip reaches more than 70% of the initial loading stress, and no cracks are allowed on the curved surface of the strip during bending.
  • beryllium copper alloys represented by C17410, C17460 and other grades can meet the above performance requirements, but the cost and the production of highly toxic substances in the processing of beryllium-containing materials limit the problem The use of these materials.
  • beryllium copper there are C18665 and C64800 materials that can meet the above performance requirements, but these two materials contain higher contents of Mg and Co elements, respectively. The leftovers generated in the processing of these materials in the downstream industry are not easy to digest, resulting in Waste of social resources.
  • Copper-nickel-phosphorus alloy is a typical precipitation-strengthened alloy, which is environmentally friendly, and the leftovers produced during processing are easy to digest.
  • alloy materials are required to have excellent stress relaxation resistance and bending performance while having high-strength and high-conductivity characteristics.
  • the existing copper-nickel-phosphorus alloys cannot have the above-mentioned properties at the same time, so the development of a copper-nickel-phosphorus alloy with the above-mentioned properties has become an urgent need.
  • the present invention proposes a copper alloy with excellent bending performance and a preparation method and application thereof.
  • the technical problem to be solved by the present invention is to provide a copper alloy with excellent bending performance and a preparation method and application thereof in view of the deficiencies of the prior art.
  • the copper alloy of the present invention has a precipitation strengthening effect.
  • the yield strength of the copper alloy strip is 550-700 MPa
  • the electrical conductivity is 60-70% IACS, and excellent bending performance and resistance are obtained. Stress relaxation performance.
  • the invention adds 0.51 to 2.00wt% of Ni, which can form a nano-scale precipitation phase after being added with P at the same time, which helps to improve the mechanical properties and electrical conductivity of the alloy.
  • the added Ni content is less than 0.50wt%, although the alloy has a higher electrical conductivity, the ideal mechanical properties cannot be obtained, which limits the application of the alloy.
  • the added Ni content exceeds 2.00wt%, part of the Ni can not form compounds and precipitate during the aging process of the alloy, but remains in the copper matrix, which will lead to a decrease in the conductivity of the alloy. Therefore, in the copper alloy of the present invention, the Ni content is controlled at 0.51 to 2.00 wt%, preferably 0.60 to 1.90 wt%.
  • the present invention adds P with a weight percentage of 0.10 to 0.35 wt%.
  • P allows Ni to form a precipitated phase, which improves the strength and conductivity of the alloy.
  • the P content is less than 0.10 wt%, the amount of precipitated phases is too small, and ideal mechanical properties cannot be obtained.
  • the added P content exceeds 0.35wt%, the number of precipitated phases is too large, and even the excess P will form a phosphor-copper compound with Cu, which will significantly reduce the conductivity of the alloy. Although it can improve the mechanical properties of the alloy, it will also cause Difficulty in subsequent processing. Therefore, in the copper alloy of the present invention, the P content is controlled at 0.10 to 0.35 wt%, preferably 0.15 to 0.30 wt%.
  • the ratio of Ni and P weight percentage content Ni/P is 2.4-5.7. Within this range, Ni and P atoms can be desolubilized. While achieving aging strengthening, it can minimize Ni, P The residue of P atoms in the matrix minimizes the influence of added elements on the conductivity of the alloy. However, when Ni/P is less than 2.4, ideal electrical conductivity cannot be obtained, and when it exceeds 5.7, ideal mechanical properties cannot be obtained. Therefore, the present invention controls Ni/P at 2.4 to 5.7 to ensure the electrical conductivity and mechanical properties of the alloy.
  • Copper alloy strips must first be processed into parts before they can be used.
  • the main methods of processing into parts are stamping and bending, among which the bending performance of the strip has a great influence on the bending process. If the bending performance of the copper alloy strip is poor, the bending part is prone to cracking during stamping and bending.
  • the stamping and bending process of alloy strip is a plastic deformation process.
  • the most common way of plastic deformation is slip, that is, a part of the crystal slips relative to another part along a certain crystal plane and crystal direction. The accumulation of a large amount of slip constitutes a macroscopic plastic deformation.
  • Copper alloy strip is polycrystalline.
  • the plastic deformation of different crystals (grains) inside the copper alloy strip constitutes the plastic deformation of the copper alloy strip, and the area ratio of the copper alloy rolling surface with different orientations It has an important influence on the improvement of the alloy's plastic deformation ability.
  • the present invention controls the area ratio of the rolling surface of the alloy strip with different orientations, so that the crystal orientation of the copper alloy strip meets within the deviation angle of less than 15°: Brass orientation ⁇ 011 ⁇
  • the area ratio of ⁇ 211> is 15.0-30.0%
  • the area ratio of S orientation ⁇ 123 ⁇ 634> is 7.0-28.0%
  • the area ratio of Copper orientation ⁇ 112 ⁇ 111> is 6.5-20.0%
  • the area ratio of ⁇ 211> is 6.0 to 16.0%.
  • the inventor found through a large number of experiments that when the area ratios of the different orientations of the rolling surface meet the above requirements, the plastic deformation ability of the alloy is improved, and the cracking problem is greatly reduced during the alloy stamping and bending process, which satisfies the stamping and bending process. Claim. Through the above-mentioned texture control, the alloy can further improve its bending performance while satisfying its strength, electrical conductivity, and stress relaxation resistance.
  • the Schmidt factor is the ratio of the shear stress on the sliding surface of the crystal to the applied stress when the crystal is subjected to external stress, which can be used To calculate, where Is the angle between the applied stress direction and the normal of the slip surface, and ⁇ is the angle between the applied stress direction and the slip direction.
  • the Schmidt factor is also called the orientation factor. The greater the value, the greater the shear stress acting on the sliding surface, and the easier the crystal will deform. due to It can be seen that there is a maximum value of 0.5 for the Schmidt factor.
  • the copper alloy strip is polycrystalline.
  • the present invention further controls the Schmitt factor on the rolled surface of the copper alloy strip.
  • the rolled surface of the copper alloy strip accounts for the Schmidt factor ⁇ 0.3, each orientation area When it is 98-100% and the proportion of each orientation area with Schmidt factor ⁇ 0.4 is 60-85%, the bending performance of the alloy is further improved.
  • the weight percentage content of the control impurity element Si in the copper alloy is less than 0.10 wt%.
  • a small amount of Si like P, can form nano-scale precipitates with Ni, thereby further improving the mechanical properties of the alloy.
  • Si needs to be controlled as an impurity, because when its content exceeds 0.10wt%, the conductivity of the alloy will be significantly reduced, causing the alloy to fail to reach the conductivity of 60 to 70% IACS. At the same time, too much Si will affect the stamping of the alloy. Processing, because Si is prone to form a harder Si oxide during the heat treatment process, the stamping die will be damaged during subsequent stamping processing. Therefore, in the present invention, Si is controlled as an impurity, and its content is controlled below 0.10 wt%.
  • the weight percentage composition of the copper alloy further includes 0.01 to 0.50 wt% of Zn.
  • Zn mainly plays a solid solution strengthening effect in the copper alloy, which can further improve the mechanical properties of the alloy. In the process of solution treatment, Zn can also inhibit the growth of crystal grains and achieve the effect of improving the bending performance of the alloy.
  • the addition of 0.01 to 0.50wt% of Zn has little effect on the electrical conductivity of the alloy. If the added Zn content exceeds 0.50wt%, the electrical conductivity of the alloy will be significantly reduced, and when the added Zn content is less than 0.01wt% , The beneficial effects of Zn cannot be achieved. Therefore, the Zn content of the alloy of the present invention is controlled to be 0.01 to 0.50 wt%, preferably 0.01 to 0.40 wt%.
  • the weight percentage composition of the copper alloy also includes a total of 0.01 to 0.40 wt% of one selected from the group consisting of Co, Fe, Cr, Sn, Mg, Mn, Ti, Ag, Zr, single rare earth and mixed rare earth Or multiple.
  • Co, Fe, Cr, Mg, Ti, Ag, Zr and P form a precipitation phase, which can improve the conductivity, stress relaxation resistance and high temperature softening resistance of the alloy strip, but excessive addition of these elements will reduce
  • the number of nickel-phosphorus precipitation phases reduces the mechanical properties of the alloy.
  • Sn and Mn can be dissolved in copper to improve the mechanical properties of the alloy. Both single rare earth and mixed rare earth have the effect of grain refinement and deoxidation.
  • the invention controls the total amount of one or more selected from Co, Fe, Cr, Sn, Mg, Mn, Ti, Ag, Zr, single rare earth and mixed rare earth to 0.01-0.40 wt%.
  • the yield strength of the copper alloy strip is 550-700 MPa
  • the electrical conductivity is 60-70% IACS
  • the bending radius parallel to the rolling direction and the strip thickness ratio r 1 / t ⁇ 1.0, perpendicular to the rolling The ratio of the bending radius in the manufacturing direction to the thickness of the strip r 2 /t ⁇ 2.0.
  • a method for preparing the above-mentioned copper alloy with excellent bending performance includes the following steps:
  • Hot rolling hot rolling the ingot at a temperature of 700-980°C, and controlling the cross-sectional area reduction rate of the hot rolling of the ingot to be not less than 75%, more preferably not less than 90%, to obtain a hot-rolled plate;
  • First cold rolling After the hot-rolled sheet is cooled to room temperature, perform the first cold rolling, and control the cross-sectional area reduction rate of the first cold rolling to be not less than 70%, and more preferably not less than 80%;
  • Solution treatment the first cold-rolled sheet is subjected to solution treatment, the specific process is: heating the sheet at a temperature of 700 ⁇ 900°C for not less than 30s, and then conduct water cooling or air cooling treatment for 30s ⁇ After cooling to room temperature within 1h, after solution treatment, the average grain size of the recrystallized grains of the plate is ⁇ 25 ⁇ m;
  • the third cold rolling reduces the cross-sectional area of the plate by 20-70%.
  • the method further includes the following step: after the third cold rolling in step 7), annealing the sheet at a temperature of 200-550° C. and a holding time of 1 min-10h. This step can be added as needed to stabilize the performance of the finished product.
  • step 5) and step 6) are used as a step unit, and the step unit is repeated several times.
  • the above-mentioned copper alloys with excellent bending properties are used in connectors, bus bars, relay shrapnel and heat dissipation systems.
  • the copper alloy of the present invention has a precipitation strengthening effect.
  • the yield strength of the copper alloy strip is 550-700MPa
  • the electrical conductivity is 60-70% IACS, and excellent bending is obtained. Performance and resistance to stress relaxation.
  • the present invention controls the area ratios of different orientations of the rolling surface of the alloy strip through the preparation process, so that the crystal orientation of the copper alloy strip meets the requirements within the deviation angle of less than 15° :
  • the area ratio of Brass orientation ⁇ 011 ⁇ 211> is 15.0-30.0%
  • the area ratio of S orientation ⁇ 123 ⁇ 634> is 7.0-28.0%
  • the area ratio of Copper orientation ⁇ 112 ⁇ 111> is 6.5-20.0 %
  • the area ratio of R orientation ⁇ 124 ⁇ 211> is 6.0 ⁇ 16.0%, realizing the simultaneous improvement of alloy strength, electrical conductivity, stress relaxation resistance and bending performance.
  • the present invention further controls the Schmidt factor on the rolling surface of the copper alloy strip.
  • the Schmidt factor on the rolling surface of the copper alloy strip is ⁇ 0.3 in each orientation area
  • the proportion is 98-100% and the proportion of each orientation area with Schmidt factor ⁇ 0.4 is 60-85%, the bending performance of the alloy is further improved.
  • the copper alloy strip of the present invention can realize the ratio of the bending radius parallel to the rolling direction (ie the good direction) to the strip thickness r 1 /t ⁇ 1.0, and the bending radius perpendicular to the rolling direction (ie the bad direction)
  • the ratio of the thickness to the strip is r 2 / t ⁇ 2.0.
  • the copper alloy strip of the present invention can meet the following stress relaxation resistance: when the initial stress is 80% of the yield strength, the residual stress of the strip after aging treatment at 120°C for 1000 h reaches 85-92% of the initial stress; When the initial stress is 80% of the yield strength, the residual stress of the strip reaches 75-83% of the initial stress after the aging treatment at 150° C. and 1000 h.
  • the copper alloy of the present invention is particularly suitable for connectors, bus bars, relay shrapnel and heat dissipation systems, such as: male and female terminals in connectors, bus bars and pin headers for automobile fuse boxes, relay springs, and mobile phones , Notebook, Tablet PC cooling system.
  • Figure 1 is an EBSD photo of Example 4.
  • Figure 2 is the EBSD texture detection result of Example 4.
  • the copper alloy strip of this example has ⁇ 011 ⁇ 211> grain orientation area accounting for 16.0% on rolling surface and ⁇ 123 ⁇ 634> grain orientation area accounting for Texture with a ratio of 18.4%, ⁇ 112 ⁇ 111> grain orientation area accounting for 16.4%, ⁇ 124 ⁇ 211> grain orientation area accounting for 13.0%;
  • Figure 3 is a diagram of the Schmidt factor ratio of Example 13.
  • the area of each grain orientation with Schmidt factor ⁇ 0.3 accounts for 99.0%, and each of the areas with Schmidt factor ⁇ 0.4
  • the grain orientation area accounts for 80.0%;
  • Figure 4 is the stress relaxation resistance test curve of Example 10.
  • the initial stress is 80% yield strength, and the residual stress of the strip reaches 91.1% of the initial stress after aging at 120°C for 1000h;
  • Figure 5 is the stress relaxation resistance test curve of Example 10.
  • the initial stress is 80% yield strength, and the residual stress of the strip reaches 80.0% of the initial stress after aging at 150°C for 1000h;
  • Figure 6 is the high temperature softening resistance test curve of Example 7.
  • the hardness of the strip after the aging treatment at 400° C. for 30 min is 93.9% of the initial hardness.
  • the cross-sectional area is reduced by 20-70% by cold rolling to make a finished product. If necessary, an annealing treatment at a temperature of 200-550°C and a holding time of 1 minute to 10 hours can be carried out to stabilize the performance. Subsequently, the mechanical properties, electrical conductivity, stress relaxation resistance, high temperature softening resistance, bending properties, texture distribution on the rolling surface and Schmidt factor of the material were tested.
  • the room temperature tensile test is carried out on the electronic universal testing machine in accordance with "GB/T228.1-2010 Metallic Material Tensile Test Part 1: Room Temperature Test Method".
  • the sample adopts a rectangular cross-section proportional sample with a proportionality factor of 5.65. .
  • the conductivity test is in accordance with "GB/T3048-2007 Test Methods for Electrical Properties of Wires and Cables Part 2: Resistivity Test of Metallic Materials", expressed in %IACS.
  • the stress relaxation resistance is measured by the following method: take a sample of the copper alloy strip along the rolling direction. The sample is a 10mm wide strip. Then one end of the strip is fixed on the test fixture, and a stress is applied to the other end to make the strip Like bending to form a cantilever beam, the stress on the cantilever beam can be calculated by the following formula: 6Et ⁇ /L 2 , where E is the Young’s modulus of the copper alloy strip, t is the thickness of the strip, ⁇ is the deflection, and L is the cantilever The length of the beam can be changed by changing the deflection and fixing other parameters to change the stress value of the load. The commonly used test stress is 80% yield strength.
  • the loaded stress After being kept in an oven at 120°C and 150°C for 1000 hours, the loaded stress is removed. At this time, the cantilever beam will be permanently bent.
  • the bending height divided by the initial deflection is the stress relaxation rate, which is expressed as a percentage.
  • Said. (100%-stress relaxation rate) is the stress relaxation resistance rate of the material, expressed in percentage.
  • the stress relaxation resistance test curve of Example 10 is shown in Fig. 4 and Fig. 5.
  • the high-temperature softening resistance is measured by the following method: the copper alloy strip is annealed at 400°C for 30 minutes, and the hardness value after annealing is measured. The ratio of the annealed hardness to the initial hardness is the high-temperature softening resistance.
  • the high temperature softening resistance test curve of Example 7 is shown in Fig. 6.
  • the bending performance is measured by the following method: take a long strip of the copper alloy strip along the rolling direction (ie good direction), and take a long strip perpendicular to the rolling direction (ie bad direction). The width of the sample is 10mm, and then used The 90° V-shaped punch with different radii at the tip bends the long strip, and then uses a stereo microscope to observe the outer surface of the bend, which is expressed by the minimum bending radius/plate thickness that does not produce cracks on the surface.
  • the texture and Schmidt factor of the strip are measured by EBSD, the test deflection angle is 15°, and the percentage of crystal area occupied by different textures and the proportion of Schmidt factor crystal area of different sizes are calculated.
  • the EBSD photos and texture detection results of Example 4 are shown in Figure 1 and Figure 2 respectively.
  • the Schmidt factor scale diagram of Example 13 is shown in Figure 3.
  • the copper alloys in the embodiments of the present invention have achieved yield strength ⁇ 550 MPa, electrical conductivity ⁇ 60% IACS, and the alloy has excellent bending performance, that is, the bending radius is parallel to the rolling direction (that is, the good direction) is higher than that of the belt.
  • the copper alloy of the present invention can satisfy the following stress relaxation resistance performance: the initial stress is 80% of the yield strength, and the residual stress of the strip reaches 85-92% of the initial stress after the aging treatment at 120° C.
  • the initial stress is 80% yield strength, and the residual stress of the strip reaches 75-83% of the initial stress after the aging treatment at 150°C and 1000h.
  • the reasonable addition of Si, Zn, Co, Fe, Cr, Sn, Mg, Mn, Ti, Ag, Zr, single rare earth, mixed rare earth and other elements has an effect on yield strength, conductivity and resistance.
  • the stress relaxation performance has been improved to varying degrees.
  • Comparative Examples 1 to 6 it can be seen from Comparative Examples 1 to 6 that when the content of Ni and P does not meet the control requirements, or the ratio of Ni to P weight percentage does not meet 2.4 to 5.7, the performance of the material that meets our needs cannot be obtained. It can be seen from Comparative Examples 7 to 8 that when the alloy orientation and Schmidt factor do not meet the control requirements, although the strength and electrical conductivity of the alloy meet the requirements, the alloy material with the bending performance meeting the requirements cannot be obtained. It can be seen from Comparative Example 9 that when the Si content in the alloy is greater than 0.1 wt%, the electrical conductivity of the alloy is significantly reduced, and an alloy that meets our performance requirements cannot be obtained.

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Abstract

一种折弯性能优异的铜合金，其重量百分比组成包括：0.51～2.00wt％的Ni，0.10～0.35wt％的P，余量为Cu和不可避免的杂质，其中Ni、P的重量百分比含量之比Ni/P＝2.4～5.7。该铜合金的制备方法包括熔铸、热轧、第一次冷轧、固溶处理、第二次冷轧、时效和第三次冷轧等步骤。该铜合金具有沉淀强化效果，通过控制Ni、P的成分配比，使铜合金带材的屈服强度为550～700MPa，导电率为60～70％IACS，并获得优异的折弯性能和耐应力松弛性能。尤其适用于连接器、汇流排、继电器弹片和散热系统，例如：连接器中的公端子及母端子、汽车保险盒用汇流排及排针、继电器动簧片以及手机、笔记本、平板电脑散热系统。

Description

一种折弯性能优异的铜合金及其制备方法和应用 技术领域
本发明涉及一种铜合金，具体涉及一种折弯性能优异的铜合金及其制备方法和应用，该铜合金能够应用于连接器、汇流排、继电器弹片和散热系统。
背景技术
随着新能源汽车、新一代USB数据传输技术、5G手机及笔记本电脑等电子产品的发展，这些产品的零部件也往小型化、轻量化发展，使用的铜合金带材厚度变薄、电流载流量增加，使得铜合金带材要求有更高的力学性能、导电性能及耐应力松弛性能，从而保证电子产品使用的可靠性及耐久性。另外，随着电子元件的高密度安装应用和更精细的加工，有必要提高材料的可加工性，特别是折弯性能，要求铜合金带材屈服强度在550～700MPa、导电率在60～70％IACS、120℃、150℃保温1000h后带材的剩余应力达到初始加载应力的70％以上，带材在弯曲加工时弯曲表面不允许有裂纹。
在现有铜合金体系中，以C17410、C17460等牌号为代表的高强度、高传导铍铜合金能够满足上述性能要求，但因成本及含铍材料在加工过程中产生剧毒物质的问题限制了这些材料的使用。除了铍铜外还有C18665、C64800材料能够满足上述性能要求，但这两种材料分别含有较高含量的Mg、Co元素，下游行业在加工这些材料的过程中产生的边角料不易消化处理，从而造成社会资源浪费。
铜镍磷合金是一种典型的沉淀强化型合金，该系合金对环境友好，加工过程中产生的边角料易消化。但随着零部件小型化、轻量化发展，要求合金材料在具有高强高导特性的同时，具备优秀的耐应力松弛性能及折弯性能。而现有的铜镍磷合金无法同时具有上述性能，因此开发一款兼具上述性能的铜镍磷合 金成了当前的迫切的需求。鉴于此，本发明提出一种折弯性能优异的铜合金及其制备方法和应用。
发明内容
本发明所要解决的技术问题是，针对现有技术的不足，提供一种折弯性能优异的铜合金及其制备方法和应用。
本发明解决上述技术问题所采用的技术方案为：一种折弯性能优异的铜合金，该铜合金的重量百分比组成包括：0.51～2.00wt％的Ni，0.10～0.35wt％的P，余量为Cu和不可避免的杂质，其中Ni、P的重量百分比含量之比Ni/P＝2.4～5.7。
本发明铜合金具有沉淀强化效果，通过控制Ni、P的成分配比，使铜合金带材的屈服强度为550～700MPa，导电率为60～70％IACS，并获得优异的折弯性能和耐应力松弛性能。
本发明添加重量百分比为0.51～2.00wt％的Ni，其与P同时添加后可形成纳米级的沉淀相，有助于提高合金的力学性能及导电性能。当添加的Ni含量小于0.50wt％时，合金虽然具有较高的导电率，但得不到理想的力学性能，限制了合金的应用。当添加的Ni含量超过2.00wt％时，合金在时效过程中有部分Ni不能形成化合物析出，仍残余在铜基体中，这会导致合金的导电性能降低。因此本发明铜合金将Ni含量控制在0.51～2.00wt％，优选为0.60～1.90wt％。
本发明添加重量百分比为0.10～0.35wt％的P。加入P使得Ni能形成沉淀相析出，提高合金的强度及导电率。P含量小于0.10wt％时，析出的沉淀相数量偏少，得不到理想的力学性能。当添加的P含量超过0.35wt％时，析出的沉淀相数量偏多，甚至多余的P会与Cu形成磷铜化合物，使合金导电率显著降低，虽然能提高合金的力学性能，但也会造成后续加工困难。因此本发明铜合金将P 含量控制在0.10～0.35wt％，优选为0.15～0.30wt％。
本发明铜合金中的Ni、P的重量百分比含量之比Ni/P为2.4～5.7，在此范围内可以实现Ni、P原子的脱溶，在达到时效强化的同时，能够最大程度减少Ni、P原子在基体中的残留，尽可能降低添加元素对合金导电率的影响。但Ni/P小于2.4时得不到理想的导电性能，超过5.7时得不到理想的力学性能，因此本发明将Ni/P控制在2.4～5.7，以保证合金的导电性能和力学性能。
铜合金带材首先要被加工成零部件才能被使用，加工成零部件的主要方式为冲压、折弯等，其中带材的折弯性能对折弯加工影响非常大。若铜合金带材的折弯性能差，在冲压折弯时，其折弯部位容易出现开裂。合金带材的冲压折弯加工过程是一种塑性变形过程。塑性变形最常见的方式为滑移，即晶体的一部分沿一定的晶面和晶向相对于另一部分产生滑移，大量滑移的积累就构成了宏观的塑性变形。铜合金带材属于多晶体，在外加应力作用下，铜合金带材内部的不同晶体(粒)的塑性变形叠加即构成铜合金带材的塑性变形，而铜合金轧制面不同取向的面积率对合金塑性变形能力的提高具有重要影响。为了进一步提升合金的折弯性能，本发明对合金带材轧制面不同取向的面积率进行控制，使该铜合金的带材的晶体取向在偏离角度小于15°内满足：Brass取向{011}<211>的面积率为15.0～30.0％，S取向{123}<634>的面积率为7.0～28.0％，Copper取向{112}<111>的面积率为6.5～20.0％，R取向{124}<211>的面积率为6.0～16.0％。本发明人通过大量试验发现，当轧制面不同取向的面积率符合上述要求时，合金的塑性变形能力得到提升，在合金冲压折弯过程中，开裂问题得到大幅减少，满足冲压和折弯加工要求。通过上述织构控制，使合金在满足强度、导电性能、耐应力松弛性能的同时，折弯性能得到进一步提升。
同时，本发明人通过试验进一步发现，合金的塑性变形能力也与其施密特因子有关，且当在各取向的施密特因子越靠近其最大值时，其折弯性能越好。施密特因子是晶体受到外加应力作用，晶体上滑移面的剪切应力与外加应力之比，可以用
Figure PCTCN2019000210-appb-000001
来计算，其中
Figure PCTCN2019000210-appb-000002
为外加应力方向与滑移面法线的夹角，λ为外加应力方向与滑移方向的夹角。施密特因子也称为取向因子，该值越大则作用在滑移面上的剪切应力越大，该晶体的变形就越容易。由于
Figure PCTCN2019000210-appb-000003
由此可知施密特因子存在一个最大值0.5。铜合金带材为多晶体，由于加工方式的原因，在铜合金带材中会存在很多不同取向的晶体(粒)，通过工艺手段可以提高铜合金带材内部的不同晶体的施密特因子数值，使其接近最大值从而达到改善材料的折弯性能的目的。因此为了实现更好的折弯性能，本发明进一步对铜合金的带材轧面上施密特因子进行控制，当铜合金的带材轧面上施密特因子≥0.3的各取向面积占比为98～100％、施密特因子≥0.4的各取向面积占比为60～85％时，合金的折弯性能进一步得到提升。
作为对于杂质元素的控制，该铜合金中控制杂质元素Si的重量百分比含量低于0.10wt％。在该合金中，少量Si与P一样，可以与Ni形成纳米级的沉淀物析出，从而进一步提升合金的力学性能。但Si需作为杂质予以控制，因其含量超过0.10wt％时，会使合金的导电率明显降低，导致合金无法达到60～70％IACS的导电率，同时，过多的Si会影响合金的冲压加工，因Si在热处理过程易形成硬度较大的Si的氧化物，后续冲压加工时会损伤冲压模具。因此本发明将Si作为杂质进行控制，将其含量控制在0.10wt％以下。
作为优选，该铜合金的重量百分比组成中还包括0.01～0.50wt％的Zn。Zn在该铜合金中主要起固溶强化作用，可以进一步提升合金的力学性能。在固溶 处理过程中，Zn还可以抑制晶粒长大，达到改善合金折弯性能的作用。并且，添加0.01～0.50wt％的Zn对合金导电性能的影响很小，若添加的Zn含量超过0.50wt％，则会使合金的导电性能明显降低，而添加的Zn含量低于0.01wt％时，无法实现Zn的有益作用。因此本发明合金控制Zn含量为0.01～0.50wt％，优选为0.01～0.40wt％。
作为优选，该铜合金的重量百分比组成中还包括总量0.01～0.40wt％的选自Co、Fe、Cr、Sn、Mg、Mn、Ti、Ag、Zr、单一稀土和混合稀土中的一种或多种。其中Co、Fe、Cr、Mg、Ti、Ag、Zr与P形成沉淀相后，可以提高合金带材的导电性能、耐应力松弛性能及耐高温软化性能，但这些元素的添加量过高会降低镍磷沉淀相的数量，从而降低合金的力学性能。Sn、Mn能够固溶在铜中，改善合金的力学性能。单一稀土和混合稀土均具有细化晶粒和除氧作用。本发明控制选自Co、Fe、Cr、Sn、Mg、Mn、Ti、Ag、Zr、单一稀土和混合稀土中的一种或多种的总量为0.01～0.40wt％。
作为优选，该铜合金的带材的屈服强度为550～700MPa，导电率为60～70％IACS，平行于轧制方向的弯曲半径与带材的厚度比r 1/t≤1.0，垂直于轧制方向的弯曲半径与带材的厚度比r 2/t≤2.0。
一种上述折弯性能优异的铜合金的制备方法，包括以下步骤：
1)熔铸：采用常规的铜合金熔炼方法，在1100～1300℃将铜合金原料熔化，并通过铁模铸造、水平连续铸造或垂直半连续铸造出铸锭；
2)热轧：对铸锭在700～980℃温度下进行热轧，控制铸锭热轧的横断面面积缩减率不低于75％，进一步优选不低于90％，得到热轧板；
3)第一次冷轧：热轧板冷却到室温后进行第一次冷轧，控制第一次冷轧的 横断面面积缩减率不低于70％，进一步优选不低于80％；
4)固溶处理：对第一次冷轧后的板材进行固溶处理，具体过程为：在700～900℃温度下对板材加热不低于30s时间，随后进行水冷或气冷处理，在30s～1h时间内冷却至室温，固溶处理后，板材的再结晶晶粒平均晶粒尺寸≤25μm；
5)第二次冷轧：通过第二次冷轧将固溶处理后的板材的横断面面积缩减0～90％；
6)时效：将板材在350～450℃的温度范围内退火0.5～12h，使得沉淀相析出；
7)第三次冷轧：通过第三次冷轧将板材的横断面面积缩减20～70％。
作为优选，还包括如下步骤：在步骤7)的第三次冷轧后对板材进行温度为200～550℃、保温时间为1min～10h的退火处理。该步骤可根据需要进行增加，使成品性能稳定。
作为优选，以步骤5)和步骤6)为一个步骤单元，重复实施该步骤单元多次。
上述折弯性能优异的铜合金在连接器、汇流排、继电器弹片和散热系统应用。例如：连接器中的公端子及母端子、汽车保险盒用汇流排及排针、继电器动簧片以及手机、笔记本、平板电脑散热系统。
与现有技术相比，本发明的优点在于：
(1)本发明铜合金具有沉淀强化效果，通过控制Ni、P的成分配比，使铜合金带材的屈服强度为550～700MPa，导电率为60～70％IACS，并获得优异的折弯性能和耐应力松弛性能。
(2)为了进一步提升合金的折弯性能，本发明通过制备工艺对合金带材轧 制面不同取向的面积率进行控制，使该铜合金的带材的晶体取向在偏离角度小于15°内满足：Brass取向{011}<211>的面积率为15.0～30.0％，S取向{123}<634>的面积率为7.0～28.0％，Copper取向{112}<111>的面积率为6.5～20.0％，R取向{124}<211>的面积率为6.0～16.0％，实现合金强度、导电性能、耐应力松弛性能和折弯性能的同步提升。
(3)为了实现更好的折弯性能，本发明进一步对铜合金的带材轧面上施密特因子进行控制，当铜合金的带材轧面上施密特因子≥0.3的各取向面积占比为98～100％、施密特因子≥0.4的各取向面积占比为60～85％时，合金的折弯性能进一步得到提升。
(4)本发明铜合金带材可以实现平行于轧制方向(即好方向)的弯曲半径与带材的厚度比r 1/t≤1.0，垂直于轧制方向(即坏方向)的弯曲半径与带材的厚度比r 2/t≤2.0。
(5)本发明铜合金带材可以满足如下的耐应力松弛性能：初始应力为屈服强度的80％时，经过120℃、1000h老化处理后带材的残余应力达到初始应力的85～92％；初始应力为屈服强度的80％时，经过150℃、1000h老化处理后带材的残余应力达到初始应力的75～83％。
(6)本发明铜合金尤其适用于连接器、汇流排、继电器弹片和散热系统，例如：连接器中的公端子及母端子、汽车保险盒用汇流排及排针、继电器动簧片以及手机、笔记本、平板电脑散热系统。
附图说明
图1为实施例4的EBSD照片；
图2为实施例4的EBSD织构检测结果，该实施例铜合金带材具有轧面上 {011}<211>晶粒取向面积占比16.0％、{123}<634>晶粒取向面积占比18.4％、{112}<111>晶粒取向面积占比16.4％、{124}<211>晶粒取向面积占比13.0％的织构；
图3为实施例13的施密特因子比例图，在该实施例铜合金带材轧面上施密特因子≥0.3的各晶粒取向面积占比99.0％，施密特因子≥0.4的各晶粒取向面积占比80.0％；
图4为实施例10的耐应力松弛性能检测曲线，初始应力为80％屈服强度，经过120℃、1000h老化处理后带材的残余应力达到初始应力的91.1％；
图5为实施例10的耐应力松弛性能检测曲线，初始应力为80％屈服强度，经过150℃、1000h老化处理后带材的残余应力达到初始应力的80.0％；
图6为实施例7的耐高温软化性能检测曲线，带材经过400℃、30min老化处理后带材的硬度为初始硬度的93.9％。
具体实施方式
以下结合附图实施例对本发明作进一步详细描述。
选取30个实施例合金，所有添加元素根据添加量的要求添加到熔炼炉中，通过垂直半连续铸造法铸造出矩形铸锭。700～980℃下加热1～5h，随后开始热轧，横断面面积至少缩减90％。热轧板冷却到室温后进行冷轧，横断面面积缩减不低于80％，轧到所需尺寸后在700～900℃的温度范围内进行固溶处理，加热时间不低于30秒，随后进行水冷或气冷处理，在30秒到1小时的时间内冷却到室温，固溶处理后的再结晶晶粒平均晶粒尺寸≤25μm。对经过固溶处理的坯料酸洗后进行冷轧，横断面面积缩减0～90％。在350～450℃的温度范围内进行时效，时效时间为0.5～12小时，使沉淀相析出。时效完毕后再进行冷轧，横断 面面积缩减20～70％。冷轧完毕后在350～450℃的温度范围内进行时效，时效时间为0.5～12小时，进一步时效析出沉淀相。时效完毕后通过冷轧将横断面面积缩减20～70％制成成品，根据需要可以进行温度为200～550℃、保温时间为1分钟～10小时的退火处理，使得性能稳定。随后测试材料的力学性能、导电性能、耐应力松弛性能、耐高温软化性能、折弯性能、轧面上织构分布及施密特因子。
室温拉伸试验按照《《GB/T228.1-2010金属材料拉伸试验第1部分：室温试验方法》在电子万能力学性能试验机上进行，试样采用比例系数为5.65的矩形横截面比例试样。
导电率测试按照《GB/T3048-2007电线电缆电性能试验方法第2部分：金属材料电阻率试验》，用％IACS表示。
耐应力松弛性能采用如下方法测定：将铜合金带材沿轧制方向取样，样品为10mm宽的长条样，随后将长条样一端固定在试验夹具上，在另一端施加一个应力使长条样弯曲形成悬臂梁，悬臂梁上的应力可以采用如下公式计算：6Etδ/L 2，其中E为铜合金带材的杨氏弹性模量，t为带材的厚度，δ为挠度，L为悬臂梁长度，可以通过改变挠度、固定其它参数来改变加载的应力值大小。常用的测试应力为80％屈服强度，在120℃、150℃的烘箱中保温1000h后撤除加载的应力，此时悬臂梁会发生永久弯曲，弯曲的高度除以初始挠度为应力松弛率，用百分比表示。(100％-应力松弛率)即为材料的耐应力松弛率，用百分比表示。实施例10的耐应力松弛性能检测曲线见图4和图5。
耐高温软化性能采用如下方法测定：将铜合金带材进行400℃、保温30min的退火，测定退火后的硬度值，退火后的硬度与初始硬度的比值为耐高温软化 性能。实施例7的耐高温软化性能检测曲线见图6。
折弯性能采用如下方法测定：将铜合金带材沿轧制方向(即好方向)取长条样、垂直于轧制方向(即坏方向)取长条样，试样宽度为10mm，随后采用90°、尖端具有不同半径的V形冲头对长条样进行折弯，然后采用体视显微镜观测折弯处外表面，以表面不产生裂纹的最小弯曲半径/板厚来表示。
带材的织构及施密特因子采用EBSD进行测定，测试偏转角度为15°，统计出不同织构占有的晶体面积百分比及不同大小的施密特因子晶体面积占比。实施例4的EBSD照片及织构检测结果分别见图1和图2。实施例13的施密特因子比例图见图3。
根据实施例可以发现，本发明实施例铜合金均实现了屈服强度≥550MPa，导电率≥60％IACS的性能，同时合金弯曲加工性能优异即平行于轧制方向(即好方向)弯曲半径比带材厚度比(r 1/t)≤1.0，垂直于轧制方向(即坏方向)弯曲半径比带材厚度比(r 2/t)≤2.0。本发明铜合金可以满足如下的耐应力松弛性能：初始应力为80％屈服强度，经过120℃、1000h老化处理后带材的残余应力达到初始应力的85～92％。初始应力为80％屈服强度，经过150℃、1000h老化处理后带材的残余应力达到初始应力的75～83％。同时通过对比实施例21～30可以发现，合理添加Si、Zn、Co、Fe、Cr、Sn、Mg、Mn、Ti、Ag、Zr、单一稀土、混合稀土等元素对于屈服强度、导电率及耐应力松弛性能都起到了不同程度的改善。
通过对比例1～6可知，当Ni、P含量不满足控制要求，或者Ni与P重量百分比之比不满足2.4～5.7时，无法获得满足我们所需求材料的性能。通过对比例7～8可知，当合金取向及施密特因子不满足控制要求时，虽然合金的强度 及导电符合要求，但无法获得折弯性能满足需求的合金材料。通过对比例9可知，当合金中Si含量大于0.1wt％时，合金导电性能明显下降，无法获得满足我们性能需要的合金。
实施例的成分及性能测试结果见表1、表2。
表1：实施例及对比例成分
Figure PCTCN2019000210-appb-000004
Figure PCTCN2019000210-appb-000005
Figure PCTCN2019000210-appb-000006

Claims (11)

  1. 一种折弯性能优异的铜合金，其特征在于，该铜合金的重量百分比组成包括：0.51～2.00wt％的Ni，0.10～0.35wt％的P，余量为Cu和不可避免的杂质，其中Ni、P的重量百分比含量之比Ni/P＝2.4～5.7。
  2. 根据权利要求1所述的一种折弯性能优异的铜合金，其特征在于，该铜合金的带材的晶体取向在偏离角度小于15°内满足：Brass取向{011}<211>的面积率为15.0～30.0％，S取向{123}<634>的面积率为7.0～28.0％，Copper取向{112}<111>的面积率为6.5～20.0％，R取向{124}<211>的面积率为6.0～16.0％。
  3. 根据权利要求2所述的一种折弯性能优异的铜合金，其特征在于，该铜合金的带材轧面上施密特因子≥0.3的各取向面积占比为98～100％，施密特因子≥0.4的各取向面积占比为60～85％。
  4. 根据权利要求1所述的一种折弯性能优异的铜合金，其特征在于，该铜合金中控制杂质元素Si的重量百分比含量低于0.10wt％。
  5. 根据权利要求1所述的一种折弯性能优异的铜合金，其特征在于，该铜合金的重量百分比组成中还包括0.01～0.50wt％的Zn。
  6. 根据权利要求1所述的一种折弯性能优异的铜合金，其特征在于，该铜合金的重量百分比组成中还包括总量0.01～0.40wt％的选自Co、Fe、Cr、Sn、Mg、Mn、Ti、Ag、Zr、单一稀土和混合稀土中的一种或多种。
  7. 根据权利要求1～6中任一项所述的一种折弯性能优异的铜合金，其特征在于，该铜合金的带材的屈服强度为550～700MPa，导电率为60～70％IACS，平行于轧制方向的弯曲半径与带材的厚度比r 1/t≤1.0，垂直于轧制方向的弯曲半径与带材的厚度比r 2/t≤2.0。
  8. 一种权利要求1～7中任一项所述的一种折弯性能优异的铜合金的制备方法，其特征在于，包括以下步骤：
    1)熔铸：采用常规的铜合金熔炼方法，在1100～1300℃将铜合金原料熔化，并通过铁模铸造、水平连续铸造或垂直半连续铸造出铸锭；
    2)热轧：对铸锭在700～980℃温度下进行热轧，控制铸锭热轧的横断面面积缩减率不低于75％，得到热轧板；
    3)第一次冷轧：热轧板冷却到室温后进行第一次冷轧，控制第一次冷轧的横断面面积缩减率不低于70％；
    4)固溶处理：对第一次冷轧后的板材进行固溶处理，具体过程为：在700～900℃温度下对板材加热不低于30s时间，随后进行水冷或气冷处理，在30s～1h时间内冷却至室温；
    5)第二次冷轧：通过第二次冷轧将固溶处理后的板材的横断面面积缩减0～90％；
    6)时效：将板材在350～450℃的温度范围内退火0.5～12h；
    7)第三次冷轧：通过第三次冷轧将板材的横断面面积缩减20～70％。
  9. 根据权利要求8所述的一种折弯性能优异的铜合金的制备方法，其特征在于，还包括如下步骤：在步骤7)的第三次冷轧后对板材进行温度为200～550℃、保温时间为1min～10h的退火处理。
  10. 根据权利要求8或9所述的一种折弯性能优异的铜合金的制备方法，其特征在于，以步骤5)和步骤6)为一个步骤单元，重复实施该步骤单元多次。
  11. 权利要求1～7中任一项所述的一种折弯性能优异的铜合金在连接器、汇流排、继电器弹片和散热系统应用。
PCT/CN2019/000210 2019-10-24 2019-11-08 一种折弯性能优异的铜合金及其制备方法和应用 WO2021077241A1 (zh)

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