WO2021073236A1 - Led lamp strip coated with pvc resin and manufacturing method therefor - Google Patents

Led lamp strip coated with pvc resin and manufacturing method therefor Download PDF

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Publication number
WO2021073236A1
WO2021073236A1 PCT/CN2020/109002 CN2020109002W WO2021073236A1 WO 2021073236 A1 WO2021073236 A1 WO 2021073236A1 CN 2020109002 W CN2020109002 W CN 2020109002W WO 2021073236 A1 WO2021073236 A1 WO 2021073236A1
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WIPO (PCT)
Prior art keywords
pvc
circuit board
light strip
bare
resin
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PCT/CN2020/109002
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French (fr)
Chinese (zh)
Inventor
王定锋
徐文红
冉崇友
徐磊
琚生涛
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王定锋
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Publication of WO2021073236A1 publication Critical patent/WO2021073236A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B29C48/154—Coating solid articles, i.e. non-hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements

Definitions

  • the invention relates to the field of LED light strips, in particular to an LED light strip outsourcing PVC resin and a manufacturing method.
  • the way of fixing the circuit board with PVC resin is that the PVC clamps the two sides of the light strip circuit board without components to form a fixation.
  • the circuit board must be designed and manufactured on both sides. There is a board edge without soldering components, which makes the circuit cost high, and the outsourcing PVC resin must be designed and made to clamp the circuit board inside, which increases the amount of outsourcing PVC resin and increases the cost of PVC.
  • the present invention pastes a layer of PVC film with glue on the back of the bare circuit board light strips of soldered components, and then uses an extruder to cover the PVC resin.
  • the extruder heats the outer PVC resin. Melt, and then squeeze it on the bare circuit board light strip.
  • the hot-melted PVC resin will form a fusion bond with the PVC film on the back of the circuit board. Because they are all PVC resin materials, a hot-melt bond is naturally formed at the interface. , Fix the light strip in this way, the circuit board of the light strip does not need to be designed to make the board edge of the welding component, and the circuit board can be made narrower and low in cost.
  • the outsourcing of PVC does not need to be designed as a crimp on both sides of the circuit board.
  • the structure greatly reduces the amount of outsourcing PVC resin and lowers the cost.
  • the invention relates to an LED light strip with PVC resin outsourcing and a manufacturing method. Specifically, after a circuit board is pasted with components, a layer of PVC film with glue is pasted on the back of the circuit board to make a bare light strip with a PVC film on the back , And then use an extruder to melt the PVC, and then extrude and wrap it on the bare light strip. When the PVC surface on the back of the bare light strip contacts the hot melted PVC during extrusion, the surface of the PVC film will be heated and become The PVC rubber material forms a hot-melt fusion bond, so that the bare light strip and the outsourcing PVC glue can be bonded together as a whole.
  • a method for manufacturing LED light strips outsourcing PVC resin Specifically, a circuit board with bare wires on the back is pasted with components containing LEDs to make a bare light strip, or an insulating layer is provided on the back.
  • the circuit board is pasted with components containing LED lights to make a bare light strip, and then a layer of PVC film with glue is attached to the back of the bare light strip to make a bare light strip with a PVC film on the back, and then use an extruder to
  • the PVC resin is heated and melted and extruded, so that the bag is placed on the bare light strip with PVC film on the back.
  • an LED light strip with PVC resin outsourcing comprising: a PVC film with glue on the back of the circuit board; a circuit board; components containing LEDs; an outsourcing PVC resin; characterized in that the circuit board is flexible Circuit board, the back of the circuit board is the bare metal circuit and the PVC film with adhesive glued together, or there is a layer of insulating resin on the back of the circuit board, the insulating resin and the PVC film with glue are glued together, and the PVC film and the outsourcing PVC resin form a fusion Bonding makes the light strip and the outsourcing PVC resin bonded together.
  • the circuit board is a single-layer circuit board, or a double-layer circuit board, or a three-layer circuit board, and the LED components are soldered On the front of the circuit board.
  • Figure 1 is a schematic cross-sectional view of a bare light strip with a circuit board with bare wires on the back or a circuit board with an insulating layer on the back after pasting electronic components.
  • Figure 2 is a schematic cross-sectional view of a bare light strip with a PVC film on the back.
  • Figure 3 is a schematic cross-sectional view of the LED light strip with the circuit board and the outer PVC resin firmly bonded together.
  • Fig. 4 is a schematic cross-sectional view of a circuit board with bare wires on the back or a circuit board with an insulating layer on the back after pasting electronic components.
  • Fig. 5 is a schematic cross-sectional view of a Siamese bare light strip with a PVC film on the back.
  • Fig. 6 is a front view of a connected bare light strip with electronic components attached to a circuit board with bare wires on the back or a circuit board with an insulating layer on the back.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to an LED lamp strip coated with a PVC resin and a manufacturing method therefor. Specifically, said method comprises: after elements are attached to a circuit board, attaching a layer of adhesive-coated PVC film to the back side of the circuit board to preparing a bare lamp strip with the PVC film on the back side, and then using an extruder to melt PVC and extrude the melt PVC so as to coat same on the bare lamp strip; during extrusion, when the PVC surface on the back side of the bare lamp strip is in contact with hot melt PVC, the surface of the PVC film will be heated, and forms hot melt and co-melt bonding with the hot melt PVC adhesive, so that the bare lamp strip and the coated PVC glue are bonded into a whole.

Description

一种外包PVC树脂的LED灯带及制作方法LED light strip outsourcing PVC resin and manufacturing method 技术领域Technical field
本发明涉及LED灯带领域，具体涉及一种外包PVC树脂的LED灯带及制作方法。The invention relates to the field of LED light strips, in particular to an LED light strip outsourcing PVC resin and a manufacturing method.
背景技术Background technique
现有技术的外包PVC树脂的LED灯带，PVC树脂固定线路板的方式是，PVC将灯带线路板没有元器件的两边夹住形成固定，这种方式就必须将线路板设计制作成两边各有一没焊元器件的板边，使线路成本高，而且外包PVC树脂在里面还必须设计制作夹线路板的夹压结构，增大了外包PVC树脂的用量，增加了PVC的成本。In the prior art LED light strips outsourcing PVC resin, the way of fixing the circuit board with PVC resin is that the PVC clamps the two sides of the light strip circuit board without components to form a fixation. In this way, the circuit board must be designed and manufactured on both sides. There is a board edge without soldering components, which makes the circuit cost high, and the outsourcing PVC resin must be designed and made to clamp the circuit board inside, which increases the amount of outsourcing PVC resin and increases the cost of PVC.
为了克服以上的缺陷和不足，本发明将已焊元件的线路板裸灯带，在背面贴一层带胶的PVC膜，再用挤出机外包PVC树脂，挤出机在将外包PVC树脂加热融化，再挤在线路板裸灯带上，热融化状态的PVC树脂会将线路板背面的PVC膜形成融合式的粘接，因为都是PVC树脂材料，在界面就自然形成了热融粘接，这种方式固定灯带，灯带的线路板无需设计制作焊元件的板边，可将线路板制作更窄，成本低，同时外包PVC也不需要设计成两边有压线路板边的压边结构，使外包PVC树脂用量大大降低了，使成本更低。In order to overcome the above shortcomings and shortcomings, the present invention pastes a layer of PVC film with glue on the back of the bare circuit board light strips of soldered components, and then uses an extruder to cover the PVC resin. The extruder heats the outer PVC resin. Melt, and then squeeze it on the bare circuit board light strip. The hot-melted PVC resin will form a fusion bond with the PVC film on the back of the circuit board. Because they are all PVC resin materials, a hot-melt bond is naturally formed at the interface. , Fix the light strip in this way, the circuit board of the light strip does not need to be designed to make the board edge of the welding component, and the circuit board can be made narrower and low in cost. At the same time, the outsourcing of PVC does not need to be designed as a crimp on both sides of the circuit board. The structure greatly reduces the amount of outsourcing PVC resin and lowers the cost.
发明内容Summary of the invention
本发明涉及一种外包PVC树脂的LED灯带及制作方法，具体而言，将线路板贴元件后，在线路板背面贴一层带胶的PVC膜，制成背面带PVC膜的裸灯带，然后用挤出机将PVC熔融后，挤出包裹到裸灯带上，在挤出时裸灯带背面的PVC表面接触热融的PVC时，PVC膜表面会受热，并和已热融的PVC胶料形成热融共融粘接，使裸灯带和外包PVC胶粘接成一整体。The invention relates to an LED light strip with PVC resin outsourcing and a manufacturing method. Specifically, after a circuit board is pasted with components, a layer of PVC film with glue is pasted on the back of the circuit board to make a bare light strip with a PVC film on the back , And then use an extruder to melt the PVC, and then extrude and wrap it on the bare light strip. When the PVC surface on the back of the bare light strip contacts the hot melted PVC during extrusion, the surface of the PVC film will be heated and become The PVC rubber material forms a hot-melt fusion bond, so that the bare light strip and the outsourcing PVC glue can be bonded together as a whole.
根据本发明提供了一种外包PVC树脂的LED灯带的制作方法，具体而言， 将背面带裸线的线路板贴上包含有LED的元器件制成裸灯带、或者将背面带绝缘层的线路板贴上包含有LED灯的元器件制成裸灯带，再在裸灯带背面贴一层带胶的PVC膜，制成背面带PVC膜的裸灯带，然后用挤出机将PVC树脂加温融化挤出，使包裏到背面带PVC膜的裸灯带上，在挤出时，灯带背面的PVC膜一碰触高温融化的PVC树脂时，PVC膜受热就会自身和高温融化的PVC融合牢固结合在一起，使裸灯带和外包PVC树脂牢固粘接在一起，形成一整体结构，然后经水冷却定型，制成了线路板和外包PVC牢固粘接结合的LED灯带。According to the present invention, there is provided a method for manufacturing LED light strips outsourcing PVC resin. Specifically, a circuit board with bare wires on the back is pasted with components containing LEDs to make a bare light strip, or an insulating layer is provided on the back. The circuit board is pasted with components containing LED lights to make a bare light strip, and then a layer of PVC film with glue is attached to the back of the bare light strip to make a bare light strip with a PVC film on the back, and then use an extruder to The PVC resin is heated and melted and extruded, so that the bag is placed on the bare light strip with PVC film on the back. During extrusion, when the PVC film on the back of the light strip touches the high-temperature melted PVC resin, the PVC film will heat up with itself. The high-temperature melted PVC is fused and firmly bonded together, so that the bare light strip and the outsourcing PVC resin are firmly bonded together to form an integral structure, and then cooled and shaped by water, and the circuit board and the outsourcing PVC are firmly bonded to the LED lamp. band.
根据本发明还提供了一种外包PVC树脂的LED灯带，包括：线路板背面带胶的PVC膜；线路板；包含LED的元器件；外包PVC树脂；其特征在于，所述线路板是柔性线路板，线路板背面是裸金属线路和带胶的PVC膜粘在一起、或者线路板背面有一层绝缘树脂，绝缘树脂和带胶的PVC膜粘在一起，PVC膜和外包PVC树脂形成了融合粘接，使灯带和外包PVC树脂粘接成为一体，线路板是单层线路的线路板、或者是双层线路的线路板、或者是三层线路的线路板，包含LED的元件是已焊接在了线路板的正面。According to the present invention, there is also provided an LED light strip with PVC resin outsourcing, comprising: a PVC film with glue on the back of the circuit board; a circuit board; components containing LEDs; an outsourcing PVC resin; characterized in that the circuit board is flexible Circuit board, the back of the circuit board is the bare metal circuit and the PVC film with adhesive glued together, or there is a layer of insulating resin on the back of the circuit board, the insulating resin and the PVC film with glue are glued together, and the PVC film and the outsourcing PVC resin form a fusion Bonding makes the light strip and the outsourcing PVC resin bonded together. The circuit board is a single-layer circuit board, or a double-layer circuit board, or a three-layer circuit board, and the LED components are soldered On the front of the circuit board.
在以下对附图和具体实施方式的描述中，将阐述本发明的一个或多个实施例的细节。In the following description of the drawings and specific embodiments, details of one or more embodiments of the present invention will be explained.
附图说明Description of the drawings
通过结合以下附图阅读本说明书，本发明的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。The features, objects and advantages of the present invention will become more apparent by reading this specification in conjunction with the following drawings. A brief description of the drawings is as follows.
图1为背面带裸线的线路板或背面带绝缘层的线路板贴电子元件后的裸灯带截面示意图。Figure 1 is a schematic cross-sectional view of a bare light strip with a circuit board with bare wires on the back or a circuit board with an insulating layer on the back after pasting electronic components.
图2为背面带PVC膜的裸灯带截面示意图。Figure 2 is a schematic cross-sectional view of a bare light strip with a PVC film on the back.
图3为线路板和外包PVC树脂牢固粘接结合的LED灯带截面示意图。Figure 3 is a schematic cross-sectional view of the LED light strip with the circuit board and the outer PVC resin firmly bonded together.
图4为背面带裸线的线路板或背面带绝缘层的线路板贴电子元件后的连体裸灯带截面示意图。Fig. 4 is a schematic cross-sectional view of a circuit board with bare wires on the back or a circuit board with an insulating layer on the back after pasting electronic components.
图5为背面带PVC膜的连体裸灯带截面示意图。Fig. 5 is a schematic cross-sectional view of a Siamese bare light strip with a PVC film on the back.
图6为背面带裸线的线路板或背面带绝缘层的线路板贴电子元件后的连体裸灯带正面示意图。Fig. 6 is a front view of a connected bare light strip with electronic components attached to a circuit board with bare wires on the back or a circuit board with an insulating layer on the back.
具体实施方式Detailed ways
下面将以优选实施例为例来对本发明进行详细的描述。Hereinafter, the present invention will be described in detail by taking a preferred embodiment as an example.
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本发明的权利要求并不具有任何限制。However, those skilled in the art should understand that the following descriptions are merely examples to illustrate and describe some preferred embodiments, and do not impose any limitation on the claims of the present invention.
实施例一Example one
1，将背面带裸线的线路板1.1用SMT机贴焊上包含有LED的元器件1.2制成裸灯带，或者将背面带绝缘层的线路板1.1用SMT机贴上包含有LED灯的元器件1.2制成裸灯带(如图1所示)。1. Use the SMT machine to paste the circuit board 1.1 with bare wires on the back and solder the components containing the LED 1.2 to make a bare light strip, or use the SMT machine to paste the circuit board 1.1 with an insulating layer on the back that contains the LED lights. The component 1.2 is made into a bare light strip (as shown in Figure 1).
2，在裸灯带背面贴一层带胶2.1的PVC膜2.2，制成背面带PVC膜2.2的裸灯带(如图2所示)。2. Paste a layer of PVC film 2.2 with glue 2.1 on the back of the bare light strip to make a bare light strip with PVC film 2.2 on the back (as shown in Figure 2).
3，用挤出机将PVC树脂3.1加温融化挤出在裸灯带上，使包裏到背面带PVC膜2.2的裸灯带上，在挤出时，灯带背面的PVC膜2.2一碰触高温融化的PVC树脂3.1时，PVC膜2.2受热就会自身和高温融化的PVC树脂3.1融合牢固结合在一起，使裸灯带和外包PVC树脂牢固粘接在一起，形成一整体结构，然后经水冷却槽冷却定型，即制成了线路板和外包PVC树脂牢固粘接结合的LED灯带(如图3所示)。3. Use an extruder to heat and melt the PVC resin 3.1 and extrude it onto the bare light strip, so that the bag is placed on the bare light strip with PVC film 2.2 on the back. When extruding, the PVC film 2.2 on the back of the light strip touches When it touches the PVC resin 3.1 that melts at high temperature, the PVC film 2.2 will fuse and firmly bond with the PVC resin 3.1 that melts at high temperature when heated, so that the bare light strip and the outsourcing PVC resin are firmly bonded together to form an integral structure. The water cooling tank is cooled and shaped, and the LED light strip is made into a solid bonding combination of the circuit board and the outer PVC resin (as shown in Figure 3).
实施例二Example two
1，将背面带裸线的含多条LED灯带的灯带线路板的连体线路板4.1，用SMT机贴焊上包含有LED的元器件1.2制成多条灯带的连体裸灯带，或者将背面带绝缘层的含多条灯带线路板的连体线路板4.1，用SMT机贴上包含有LED灯的元器件1.2制成含多条灯带的连体裸灯带(如图4、图6所示)。1. Connect the connected circuit board 4.1 with multiple LED strips with bare wires on the back, and use SMT machine to paste and solder the components containing LED 1.2 to make a connected bare lamp with multiple strips Strip, or the conjoined circuit board 4.1 containing multiple light strip circuit boards with an insulating layer on the back, and use the SMT machine to paste the components containing the LED lamp 1.2 into a conjoined bare light strip containing multiple light strips ( As shown in Figure 4 and Figure 6).
2，在连体裸灯带背面贴一层带胶2.1的PVC膜2.2，制成背面带PVC膜2.2 的连体裸灯带(如图5所示)。2. Paste a layer of PVC film 2.2 with glue 2.1 on the back of the one-piece bare light strip to make a one-piece bare light strip with a PVC film 2.2 on the back (as shown in Figure 5).
3，用分条机分切成单条背面带PVC膜的裸灯带(如图2所示)。3. Use a slitting machine to cut into single strips of bare light strips with PVC film on the back (as shown in Figure 2).
4，用挤出机将PVC树脂3.1加温融化挤出在裸灯带上，使包裏到背面带PVC膜2.2的裸灯带上，在挤出时，灯带背面的PVC膜2.2一碰触高温融化的PVC树脂3.1时，PVC膜2.2受热就会自身和高温融化的PVC树脂3.1融合牢固结合在一起，使裸灯带和外包PVC树脂牢固粘接在一起，形成一整体结构，然后经水冷却槽冷却定型，即制成了线路板和外包PVC树脂牢固粘接结合的LED灯带(如图3所示)。4. Use an extruder to heat and melt the PVC resin 3.1 and extrude it onto the bare light strip, so that the bag is placed on the bare light strip with PVC film 2.2 on the back. When extruding, the PVC film 2.2 on the back of the light strip touches When it touches the PVC resin 3.1 that melts at high temperature, the PVC film 2.2 will fuse and firmly bond with the PVC resin 3.1 that melts at high temperature when heated, so that the bare light strip and the outsourcing PVC resin are firmly bonded together to form an integral structure. The water cooling tank is cooled and shaped, and the LED light strip is made into a solid bonding combination of the circuit board and the outer PVC resin (as shown in Figure 3).
以上结合附图将一种外包PVC树脂的LED灯带及制作方法的具体实施例对本发明进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本发明的范围，尤其是权利要求的范围，并不具有任何限制。In the above, the invention has been described in detail with specific embodiments of a PVC resin-wrapped LED light strip and a manufacturing method thereof with reference to the accompanying drawings. However, those skilled in the art should understand that the above descriptions are merely examples to illustrate and describe some specific embodiments, and do not impose any limitation on the scope of the present invention, especially the scope of the claims.

Claims (2)

  1. 一种外包PVC树脂的LED灯带的制作方法，具体而言，将背面带裸线的线路板贴上包含有LED的元器件制成裸灯带、或者将背面带绝缘层的线路板贴上包含有LED灯的元器件制成裸灯带，再在裸灯带背面贴一层带胶的PVC膜，制成背面带PVC膜的裸灯带，然后用挤出机将PVC树脂加温融化挤出，使包裏到背面带PVC膜的裸灯带上，在挤出时，灯带背面的PVC膜一碰触高温融化的PVC树脂时，PVC膜受热就会自身和高温融化的PVC融合牢固结合在一起，使裸灯带和外包PVC树脂牢固粘接在一起，形成一整体结构，然后经水冷却定型，制成了线路板和外包PVC牢固粘接结合的LED灯带。A method for manufacturing LED light strips with PVC resin outsourcing. Specifically, a circuit board with bare wires on the back is pasted with components containing LEDs to make a bare light strip, or a circuit board with an insulating layer on the back is pasted The components containing the LED lights are made into a bare light strip, and then a layer of PVC film with glue is attached to the back of the bare light strip to make a bare light strip with a PVC film on the back, and then the PVC resin is heated and melted with an extruder Extrusion, make the bag into the bare light strip with PVC film on the back. When extruding, when the PVC film on the back of the light strip touches the high-temperature melting PVC resin, the PVC film will fuse itself with the high-temperature melting PVC when it is heated. It is firmly combined together to make the bare light strip and the PVC resin outsourcing bond firmly together to form an integral structure, and then the LED lamp strip is made into a solid bonding combination of the circuit board and the PVC outsourcing resin by cooling and shaping by water.
  2. 一种外包PVC树脂的LED灯带，包括：A kind of LED light strip outsourcing PVC resin, including:
    线路板背面带胶的PVC膜；PVC film with glue on the back of the circuit board;
    线路板；circuit board;
    包含LED的元器件；Components containing LEDs;
    外包PVC树脂；Outsourcing PVC resin;
    其特征在于，所述线路板是柔性线路板，线路板背面是裸金属线路和带胶的PVC膜粘在一起、或者线路板背面有一层绝缘树脂，绝缘树脂和带胶的PVC膜粘在一起，PVC膜和外包PVC树脂形成了融合粘接，使灯带和外包PVC树脂粘接成为一体，线路板是单层线路的线路板、或者是双层线路的线路板、或者是三层线路的线路板，包含LED的元件是已焊接在了线路板的正面。The circuit board is characterized in that the circuit board is a flexible circuit board, and the back of the circuit board has bare metal lines and glued PVC film glued together, or the back of the circuit board has a layer of insulating resin, and the insulating resin and glued PVC film are glued together. , The PVC film and the outsourcing PVC resin form a fusion bond, so that the light strip and the outsourcing PVC resin are bonded together. The circuit board is a single-layer circuit board, or a double-layer circuit board, or a three-layer circuit The circuit board, including the LED components, has been soldered on the front side of the circuit board.
PCT/CN2020/109002 2019-10-16 2020-08-13 Led lamp strip coated with pvc resin and manufacturing method therefor WO2021073236A1 (en)

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