CN112664853A - LED lamp strip wrapped with PVC resin and manufacturing method thereof - Google Patents
LED lamp strip wrapped with PVC resin and manufacturing method thereof Download PDFInfo
- Publication number
- CN112664853A CN112664853A CN201911004273.2A CN201911004273A CN112664853A CN 112664853 A CN112664853 A CN 112664853A CN 201911004273 A CN201911004273 A CN 201911004273A CN 112664853 A CN112664853 A CN 112664853A
- Authority
- CN
- China
- Prior art keywords
- pvc
- circuit board
- lamp strip
- bare
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011347 resin Substances 0.000 title claims abstract description 49
- 229920005989 resin Polymers 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- 238000001125 extrusion Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000012943 hotmelt Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 4
- 238000012946 outsourcing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
- B29C48/154—Coating solid articles, i.e. non-hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a PVC resin-coated LED lamp strip and a manufacturing method thereof, in particular to a PVC resin-coated LED lamp strip and a manufacturing method thereof, wherein after a circuit board is pasted with elements, a layer of PVC film with glue is pasted on the back surface of the circuit board to manufacture a bare lamp strip with a PVC film on the back surface, then an extruder is used for melting PVC and extruding and coating the PVC film on the bare lamp strip, when the PVC surface on the back surface of the bare lamp strip contacts hot-melt PVC during extrusion, the surface of the PVC film is heated and forms hot-melt co-melt adhesion with the hot-melt PVC glue stock, so that the bare lamp strip and the PVC resin-coated PVC glue.
Description
Technical Field
The invention relates to the field of LED lamp belts, in particular to an LED lamp belt coated with PVC resin and a manufacturing method thereof.
Background
In the LED lamp strip externally coated with PVC resin in the prior art, the PVC resin is used for fixing the circuit board in a way that PVC clamps the two sides of the circuit board of the lamp strip without components to form fixation, the circuit board is required to be designed and manufactured into plate edges without welding the components on the two sides in the way, so that the cost of the circuit is high, and the externally coated PVC resin is also required to be designed and manufactured into a clamping structure for clamping the circuit board inside, so that the using amount of the externally coated PVC resin is increased, and the cost of PVC is increased.
In order to overcome the defects and the defects, the invention pastes a layer of PVC film with glue on the back surface of the circuit board bare lamp strip with welded elements, then uses an extruder to wrap PVC resin, the extruder heats and melts the wrapped PVC resin, and then extrudes the PVC resin on the circuit board bare lamp strip, the PVC resin in a hot melting state can form fusion type bonding on the PVC film on the back surface of the circuit board, because the PVC resin materials are used, the hot melting bonding is naturally formed on the interface, the lamp strip is fixed in such a way, the circuit board of the lamp strip does not need to be designed to manufacture the edge of the welded elements, the circuit board can be manufactured to be narrower, the cost is low, and the wrapping PVC does not need to be designed to be a blank pressing structure with circuit board edges on two sides, so that the using amount of the wrapping PVC resin is greatly reduced, and.
Disclosure of Invention
The invention relates to a PVC resin-coated LED lamp strip and a manufacturing method thereof, in particular to a PVC resin-coated LED lamp strip and a manufacturing method thereof, wherein after a circuit board is pasted with elements, a layer of PVC film with glue is pasted on the back surface of the circuit board to manufacture a bare lamp strip with a PVC film on the back surface, then an extruder is used for melting PVC and extruding and coating the PVC film on the bare lamp strip, when the PVC surface on the back surface of the bare lamp strip contacts hot-melt PVC during extrusion, the surface of the PVC film is heated and forms hot-melt co-melt adhesion with the hot-melt PVC glue stock, so that the bare lamp strip and the PVC resin-coated PVC glue.
According to the invention, a circuit board with a bare wire on the back is pasted with a component containing an LED to form a bare lamp strip, or a circuit board with an insulating layer on the back is pasted with a component containing an LED lamp to form a bare lamp strip, a PVC film with glue is pasted on the back of the bare lamp strip to form the bare lamp strip with a PVC film on the back, then the PVC resin is heated, melted and extruded by an extruder to be wrapped on the bare lamp strip with the PVC film on the back, and when the PVC film on the back of the lamp strip touches the PVC resin melted at high temperature during extrusion, the PVC film is heated to be firmly fused with the PVC melted at high temperature to firmly bond the bare lamp strip and the PVC resin to form an integral structure, and then the LED lamp strip with the PVC film firmly bonded and combined with the circuit board and the outer cover is manufactured after water cooling and shaping.
According to the invention, the invention also provides a PVC resin-coated LED lamp strip, which comprises: the back of the circuit board is provided with a PVC film with glue; a circuit board; a component comprising an LED; wrapping PVC resin; the LED lamp strip is characterized in that the circuit board is a flexible circuit board, the back surface of the circuit board is formed by bonding a bare metal circuit and a PVC film with glue together, or the back surface of the circuit board is provided with a layer of insulating resin, the insulating resin and the PVC film with glue are bonded together, the PVC film and the PVC resin are fused and bonded together, so that the lamp strip and the PVC resin are bonded into a whole, the circuit board is a circuit board with a single-layer circuit, or a circuit board with a double-layer circuit, or a circuit board with a three-layer circuit, and an LED-containing element is welded on the front surface of the circuit.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic cross-sectional view of a bare wire strip after an electronic component is attached to a circuit board with a bare wire on the back side or a circuit board with an insulating layer on the back side.
Fig. 2 is a schematic cross-sectional view of a bare lamp with a PVC film on the back.
Fig. 3 is a schematic cross-sectional view of the LED strip with the circuit board and the outer layer firmly bonded with PVC resin.
Fig. 4 is a schematic cross-sectional view of the connected bare lamp strip after the circuit board with the bare wire on the back or the circuit board with the insulating layer on the back is pasted with the electronic element.
Fig. 5 is a schematic cross-sectional view of the conjoined bare lamp with the back surface provided with the PVC film.
Fig. 6 is a schematic front view of the connected bare lamp strip after the circuit board with the bare wire on the back or the circuit board with the insulating layer on the back is pasted with the electronic element.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
1, a circuit board 1.1 with a bare wire on the back is pasted and welded with an SMT machine to form a bare lamp strip by a component 1.2 comprising an LED, or the circuit board 1.1 with an insulating layer on the back is pasted with an SMT machine to form a bare lamp strip by a component 1.2 comprising an LED lamp (as shown in figure 1).
And 2, sticking a layer of PVC film 2.2 with glue 2.1 on the back of the bare lamp strip to prepare the bare lamp strip with the PVC film 2.2 on the back (as shown in figure 2).
3, heat with PVC resin 3.1 with the extruder and melt and extrude on naked lamp area, make the parcel to the naked lamp area of back area PVC membrane 2.2, when extruding, the PVC membrane 2.2 at the lamp area back touches the PVC resin 3.1 that high temperature melts, PVC membrane 2.2 is heated will self and the PVC resin 3.1 that high temperature melts fuses the jail concretion and is in the same place, make naked lamp area and outsourcing PVC resin firmly bond together, form an integral structure, then through the cooling water tank cooling design, made circuit board and the LED lamp area that the firm bonding of outsourcing PVC resin combines promptly (as shown in figure 3).
Example two
1, with the disjunctor circuit board 4.1 of the lamp area circuit board that contains many LED lamp areas of naked line of back area, with the disjunctor naked lamp area that many lamp areas were made to component 1.2 that contains LED that SMT machine pasted and welded, perhaps with the disjunctor circuit board 4.1 that contains many lamp area circuit boards of back area insulating layer, make the disjunctor naked lamp area that contains many lamp areas with component 1.2 that SMT machine pasted and contains the LED lamp (as shown in fig. 4, fig. 6).
And 2, sticking a layer of PVC film 2.2 with glue 2.1 on the back of the connected bare lamp strip to prepare the connected bare lamp strip with the PVC film 2.2 on the back (as shown in figure 5).
And 3, cutting the bare lamp strip with the back surface provided with the PVC film into single strips by using a slitting machine (as shown in figure 2).
4, heat with the extruder PVC resin 3.1 and melt and extrude on naked lamp area, make the parcel to the naked lamp area of back area PVC membrane 2.2, when extruding, the PVC membrane 2.2 at the lamp area back touches the PVC resin 3.1 that high temperature melts, PVC membrane 2.2 is heated will self and the PVC resin 3.1 that high temperature melted fuses the jail concreties together, make naked lamp area and outsourcing PVC resin firmly bond together, form into an integral structure, then through the cooling water tank cooling design, made circuit board and the LED lamp area that outsourcing PVC resin firmly bonds and combines promptly (as shown in figure 3).
The invention is described in detail with reference to the drawings by using a specific embodiment of the PVC resin coated LED strip and the manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (2)
1. A method for manufacturing an LED lamp strip wrapped with PVC resin comprises the steps of pasting a circuit board with a bare wire on the back side with an LED component to form a bare lamp strip, or pasting a circuit board with an insulating layer on the back side with an LED component to form a bare lamp strip, pasting a PVC film with glue on the back side of the bare lamp strip to form a bare lamp strip with a PVC film on the back side, heating, melting and extruding the PVC resin by an extruder to wrap the bare lamp strip with the PVC film on the back side, heating the PVC film to firmly bond the PVC film with the PVC melted at high temperature when the PVC film on the back side of the lamp strip touches the PVC resin melted at high temperature during extrusion, and firmly bonding the bare lamp strip with the PVC wrapped to form an integral structure.
2. An LED strip coated with PVC resin, comprising:
the back of the circuit board is provided with a PVC film with glue;
a circuit board;
a component comprising an LED;
wrapping PVC resin;
the LED lamp strip is characterized in that the circuit board is a flexible circuit board, the back surface of the circuit board is formed by bonding a bare metal circuit and a PVC film with glue together, or the back surface of the circuit board is provided with a layer of insulating resin, the insulating resin and the PVC film with glue are bonded together, the PVC film and the PVC resin are fused and bonded together, so that the lamp strip and the PVC resin are bonded into a whole, the circuit board is a circuit board with a single-layer circuit, or a circuit board with a double-layer circuit, or a circuit board with a three-layer circuit, and an LED-containing element is welded on the front surface of the circuit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911004273.2A CN112664853A (en) | 2019-10-16 | 2019-10-16 | LED lamp strip wrapped with PVC resin and manufacturing method thereof |
| PCT/CN2020/109002 WO2021073236A1 (en) | 2019-10-16 | 2020-08-13 | Led lamp strip coated with pvc resin and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911004273.2A CN112664853A (en) | 2019-10-16 | 2019-10-16 | LED lamp strip wrapped with PVC resin and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112664853A true CN112664853A (en) | 2021-04-16 |
Family
ID=75400418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911004273.2A Withdrawn CN112664853A (en) | 2019-10-16 | 2019-10-16 | LED lamp strip wrapped with PVC resin and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112664853A (en) |
| WO (1) | WO2021073236A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096901A (en) * | 2009-10-30 | 2011-05-12 | Kitagawa Ind Co Ltd | Flexible led module and unit led module |
| CN203868788U (en) * | 2013-12-07 | 2014-10-08 | 张�林 | High-radiating and high-waterproofness LED flexible lamp band |
| CN204213708U (en) * | 2014-09-28 | 2015-03-18 | 王定锋 | A kind of 9VLED lamp pearl 110V high pressure non-resistance LED |
| CN207316563U (en) * | 2017-06-11 | 2018-05-04 | 王定锋 | A kind of LED light strip |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3998502B2 (en) * | 2002-04-05 | 2007-10-31 | スリーエム イノベイティブ プロパティズ カンパニー | Gaze guidance lighting device |
| EP2151621A1 (en) * | 2008-08-05 | 2010-02-10 | Augux Co., Ltd. | Light emitting diode lighting set |
| CN204066871U (en) * | 2014-08-27 | 2014-12-31 | 浙江盛洋科技股份有限公司 | A kind of Novel shielding CAT6/FTP data cable |
| CN204513066U (en) * | 2015-02-05 | 2015-07-29 | 陈德开 | Once double-coloredly extrude soft light bar |
| CN109812721A (en) * | 2017-11-21 | 2019-05-28 | 王定锋 | A kind of LED light strip and preparation method thereof |
| CN207584444U (en) * | 2017-11-21 | 2018-07-06 | 王定锋 | A kind of LED light strip |
-
2019
- 2019-10-16 CN CN201911004273.2A patent/CN112664853A/en not_active Withdrawn
-
2020
- 2020-08-13 WO PCT/CN2020/109002 patent/WO2021073236A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096901A (en) * | 2009-10-30 | 2011-05-12 | Kitagawa Ind Co Ltd | Flexible led module and unit led module |
| CN203868788U (en) * | 2013-12-07 | 2014-10-08 | 张�林 | High-radiating and high-waterproofness LED flexible lamp band |
| CN204213708U (en) * | 2014-09-28 | 2015-03-18 | 王定锋 | A kind of 9VLED lamp pearl 110V high pressure non-resistance LED |
| CN207316563U (en) * | 2017-06-11 | 2018-05-04 | 王定锋 | A kind of LED light strip |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021073236A1 (en) | 2021-04-22 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210416 |