WO2021073236A1 - Ruban lumineux à led revêtu de résine pvc et son procédé de fabrication - Google Patents

Ruban lumineux à led revêtu de résine pvc et son procédé de fabrication Download PDF

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Publication number
WO2021073236A1
WO2021073236A1 PCT/CN2020/109002 CN2020109002W WO2021073236A1 WO 2021073236 A1 WO2021073236 A1 WO 2021073236A1 CN 2020109002 W CN2020109002 W CN 2020109002W WO 2021073236 A1 WO2021073236 A1 WO 2021073236A1
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WO
WIPO (PCT)
Prior art keywords
pvc
circuit board
light strip
bare
resin
Prior art date
Application number
PCT/CN2020/109002
Other languages
English (en)
Chinese (zh)
Inventor
王定锋
徐文红
冉崇友
徐磊
琚生涛
Original Assignee
王定锋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 王定锋 filed Critical 王定锋
Publication of WO2021073236A1 publication Critical patent/WO2021073236A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B29C48/154—Coating solid articles, i.e. non-hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements

Definitions

  • the invention relates to the field of LED light strips, in particular to an LED light strip outsourcing PVC resin and a manufacturing method.
  • the way of fixing the circuit board with PVC resin is that the PVC clamps the two sides of the light strip circuit board without components to form a fixation.
  • the circuit board must be designed and manufactured on both sides. There is a board edge without soldering components, which makes the circuit cost high, and the outsourcing PVC resin must be designed and made to clamp the circuit board inside, which increases the amount of outsourcing PVC resin and increases the cost of PVC.
  • the present invention pastes a layer of PVC film with glue on the back of the bare circuit board light strips of soldered components, and then uses an extruder to cover the PVC resin.
  • the extruder heats the outer PVC resin. Melt, and then squeeze it on the bare circuit board light strip.
  • the hot-melted PVC resin will form a fusion bond with the PVC film on the back of the circuit board. Because they are all PVC resin materials, a hot-melt bond is naturally formed at the interface. , Fix the light strip in this way, the circuit board of the light strip does not need to be designed to make the board edge of the welding component, and the circuit board can be made narrower and low in cost.
  • the outsourcing of PVC does not need to be designed as a crimp on both sides of the circuit board.
  • the structure greatly reduces the amount of outsourcing PVC resin and lowers the cost.
  • the invention relates to an LED light strip with PVC resin outsourcing and a manufacturing method. Specifically, after a circuit board is pasted with components, a layer of PVC film with glue is pasted on the back of the circuit board to make a bare light strip with a PVC film on the back , And then use an extruder to melt the PVC, and then extrude and wrap it on the bare light strip. When the PVC surface on the back of the bare light strip contacts the hot melted PVC during extrusion, the surface of the PVC film will be heated and become The PVC rubber material forms a hot-melt fusion bond, so that the bare light strip and the outsourcing PVC glue can be bonded together as a whole.
  • a method for manufacturing LED light strips outsourcing PVC resin Specifically, a circuit board with bare wires on the back is pasted with components containing LEDs to make a bare light strip, or an insulating layer is provided on the back.
  • the circuit board is pasted with components containing LED lights to make a bare light strip, and then a layer of PVC film with glue is attached to the back of the bare light strip to make a bare light strip with a PVC film on the back, and then use an extruder to
  • the PVC resin is heated and melted and extruded, so that the bag is placed on the bare light strip with PVC film on the back.
  • an LED light strip with PVC resin outsourcing comprising: a PVC film with glue on the back of the circuit board; a circuit board; components containing LEDs; an outsourcing PVC resin; characterized in that the circuit board is flexible Circuit board, the back of the circuit board is the bare metal circuit and the PVC film with adhesive glued together, or there is a layer of insulating resin on the back of the circuit board, the insulating resin and the PVC film with glue are glued together, and the PVC film and the outsourcing PVC resin form a fusion Bonding makes the light strip and the outsourcing PVC resin bonded together.
  • the circuit board is a single-layer circuit board, or a double-layer circuit board, or a three-layer circuit board, and the LED components are soldered On the front of the circuit board.
  • Figure 1 is a schematic cross-sectional view of a bare light strip with a circuit board with bare wires on the back or a circuit board with an insulating layer on the back after pasting electronic components.
  • Figure 2 is a schematic cross-sectional view of a bare light strip with a PVC film on the back.
  • Figure 3 is a schematic cross-sectional view of the LED light strip with the circuit board and the outer PVC resin firmly bonded together.
  • Fig. 4 is a schematic cross-sectional view of a circuit board with bare wires on the back or a circuit board with an insulating layer on the back after pasting electronic components.
  • Fig. 5 is a schematic cross-sectional view of a Siamese bare light strip with a PVC film on the back.
  • Fig. 6 is a front view of a connected bare light strip with electronic components attached to a circuit board with bare wires on the back or a circuit board with an insulating layer on the back.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un ruban lumineux à LED revêtu d'une résine PVC et son procédé de fabrication. En particulier, ledit procédé comprend les étapes consistant à : une fois que les éléments sont fixés à un circuit imprimé, fixer une couche d'un film PVC revêtu d'adhésif sur la face arrière du circuit imprimé afin de préparer un ruban lumineux nu comportant le film PVC sur sa face arrière, puis utiliser une extrudeuse pour faire fondre le PVC et extruder le PVC fondu de manière à en revêtir le ruban lumineux nu ; pendant l'extrusion, lorsque la surface PVC sur la face arrière du ruban lumineux nu est en contact avec du PVC thermofusible, la surface du film PVC est chauffée et forme une liaison par fusion à chaud et par co-fusion avec l'adhésif PVC thermofusible, de telle sorte que le ruban lumineux nu et la colle PVC le recouvrant sont liés pour former un tout.
PCT/CN2020/109002 2019-10-16 2020-08-13 Ruban lumineux à led revêtu de résine pvc et son procédé de fabrication WO2021073236A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911004273.2 2019-10-16
CN201911004273.2A CN112664853A (zh) 2019-10-16 2019-10-16 一种外包pvc树脂的led灯带及制作方法

Publications (1)

Publication Number Publication Date
WO2021073236A1 true WO2021073236A1 (fr) 2021-04-22

Family

ID=75400418

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/109002 WO2021073236A1 (fr) 2019-10-16 2020-08-13 Ruban lumineux à led revêtu de résine pvc et son procédé de fabrication

Country Status (2)

Country Link
CN (1) CN112664853A (fr)
WO (1) WO2021073236A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003293336A (ja) * 2002-04-05 2003-10-15 Three M Innovative Properties Co 視線誘導照明装置
EP2151621A1 (fr) * 2008-08-05 2010-02-10 Augux Co., Ltd. Ensemble d'éclairage à diode électroluminescente
CN204066871U (zh) * 2014-08-27 2014-12-31 浙江盛洋科技股份有限公司 一种新型屏蔽cat6/ftp数据缆
CN204513066U (zh) * 2015-02-05 2015-07-29 陈德开 一次双色挤出软灯带
CN207584444U (zh) * 2017-11-21 2018-07-06 王定锋 一种led灯带
CN109812721A (zh) * 2017-11-21 2019-05-28 王定锋 一种led灯带及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096901A (ja) * 2009-10-30 2011-05-12 Kitagawa Ind Co Ltd フレキシブルｌｅｄモジュール及び単体ｌｅｄモジュール
CN203868788U (zh) * 2013-12-07 2014-10-08 张�林 高散热高防水的led柔性灯带
CN204213708U (zh) * 2014-09-28 2015-03-18 王定锋 一种9vled灯珠110v高压无电阻led灯带
CN207316563U (zh) * 2017-06-11 2018-05-04 王定锋 一种led灯带

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003293336A (ja) * 2002-04-05 2003-10-15 Three M Innovative Properties Co 視線誘導照明装置
EP2151621A1 (fr) * 2008-08-05 2010-02-10 Augux Co., Ltd. Ensemble d'éclairage à diode électroluminescente
CN204066871U (zh) * 2014-08-27 2014-12-31 浙江盛洋科技股份有限公司 一种新型屏蔽cat6/ftp数据缆
CN204513066U (zh) * 2015-02-05 2015-07-29 陈德开 一次双色挤出软灯带
CN207584444U (zh) * 2017-11-21 2018-07-06 王定锋 一种led灯带
CN109812721A (zh) * 2017-11-21 2019-05-28 王定锋 一种led灯带及其制作方法

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