WO2021065792A1 - 固体冷却モジュール - Google Patents

固体冷却モジュール Download PDF

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Publication number
WO2021065792A1
WO2021065792A1 PCT/JP2020/036608 JP2020036608W WO2021065792A1 WO 2021065792 A1 WO2021065792 A1 WO 2021065792A1 JP 2020036608 W JP2020036608 W JP 2020036608W WO 2021065792 A1 WO2021065792 A1 WO 2021065792A1
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WO
WIPO (PCT)
Prior art keywords
temperature side
high temperature
low temperature
inflow
outflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/036608
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English (en)
French (fr)
Japanese (ja)
Inventor
潤一 寺木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to CN202080068649.0A priority Critical patent/CN114502899B/zh
Priority to EP20871883.3A priority patent/EP4027078A4/en
Priority to JP2021551246A priority patent/JP7339564B2/ja
Publication of WO2021065792A1 publication Critical patent/WO2021065792A1/ja
Priority to US17/706,180 priority patent/US12196459B2/en
Anticipated expiration legal-status Critical
Priority to JP2023110198A priority patent/JP7453593B2/ja
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/002—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects
    • F25B2321/0021—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects with a static fixed magnet
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/002—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects
    • F25B2321/0023—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects with modulation, influencing or enhancing an existing magnetic field
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—Component parts or details not otherwise provided for in this subclass
    • F25B2400/21—Modules for refrigeration systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • This disclosure relates to a solid cooling module.
  • Patent Document 1 a magnetic refrigeration module having a plurality of accommodating portions for accommodating magnetic working substances has been known (for example, Patent Document 1).
  • Patent Document 1 a magnetic refrigeration module having a plurality of accommodating portions for accommodating magnetic working substances.
  • connection modes other than connecting a plurality of accommodating portions in parallel with each other have not been studied in detail so far.
  • the purpose of this disclosure is to provide a new type of solid cooling module, especially a magnetic refrigeration module.
  • a first aspect of the present disclosure is solid cooling, each comprising a plurality of accommodating portions (22) accommodating a solid refrigerant substance (23) and heating or cooling a heat medium flowing through the plurality of accommodating portions (22).
  • Target module (20) At least a portion of the plurality of accommodating portions (22) are connected in series with each other with respect to the flow of the heat medium.
  • the heat medium supplied to the solid cooling module (20) sequentially flows through a plurality of accommodating portions (22) connected in series with each other.
  • Such a new type of solid cooling module (20) can be provided.
  • the second aspect of the present disclosure is characterized in that, in the first aspect, a backflow prevention unit (201,202,203,204,205,206) is provided at least a part of the series connection portions of the plurality of accommodating units (22).
  • the flow paths (25 to 28) of each accommodating portion (22) since the direction in which the heat medium flows can be defined in the flow paths (25 to 28) of each accommodating portion (22), the flow paths (25 to 28) become dead volumes and the performance deteriorates. Can be suppressed.
  • a third aspect of the present disclosure is characterized in that, in the first or second aspect, the plurality of accommodating portions (22) extend in a predetermined direction and are arranged in a direction intersecting the predetermined direction. To do.
  • the plurality of accommodating portions (22) spread in both a predetermined direction and a direction intersecting the predetermined direction as a whole. Therefore, it is possible to easily apply a force field such as a magnetic field to the solid refrigerant substance (23).
  • each of the accommodating portions (22) is a flow path extending in the predetermined direction for allowing the heat medium to enter and exit the solid refrigerant substance (23). (25 to 28), the flow path (25 to 28) is aligned with the solid refrigerant substance (23) in a direction intersecting both the direction in which the plurality of accommodating portions (22) are lined up and the predetermined direction. It is characterized by being.
  • a plurality of accommodating portions (22) can be arranged close to each other. Therefore, it is possible to further easily apply a force field such as a magnetic field to the plurality of accommodating portions (22).
  • a fifth aspect of the present disclosure is, in any one of the first to fourth aspects, at least one between the accommodating portions (22) connected in series among the plurality of accommodating portions (22). It is characterized in that a heat insulating layer (211,212,213) is provided in the portion.
  • a sixth aspect of the present disclosure is, in the fifth aspect, the heat flowing in each of the plurality of accommodating portions (22) adjacent to each other with the heat insulating layer (211,212,213) in between.
  • the temperature of the medium is different.
  • At least a part of the plurality of accommodating portions (22) is connected in parallel with each other with respect to the flow of the heat medium. It is characterized by being done.
  • the heat medium supplied to the solid cooling module (20) flows all at once through the plurality of accommodating portions (22) connected in parallel with each other.
  • An eighth aspect of the present disclosure comprises a plurality of parallel blocks (29a, 29b) each composed of a plurality of the above-mentioned accommodating portions (22) connected in parallel to each other in the above-mentioned seventh aspect.
  • the parallel blocks (29a, 29b) are characterized in that they are connected in series with each other with respect to the flow of the heat medium.
  • the heat medium supplied to the solid cooling module (20) sequentially flows through a plurality of parallel blocks (29a, 29b) connected in series with each other.
  • the heat medium flows all at once through a plurality of accommodating portions (22) connected in parallel to each other.
  • each of the accommodating portions (22) has a low temperature side inflow port (25a), a low temperature side outflow port (26a), and a high temperature side. It has a side inflow port (27a) and a high temperature side outflow port (28a), and in each of the above accommodating portions (22), the above high temperature from the low temperature side inflow port (25a) via the solid refrigerant substance (23).
  • the heat medium flows to the side outflow port (28a), or the heat medium flows from the high temperature side inflow port (27a) to the low temperature side outflow port (26a) via the solid refrigerant substance (23). It is characterized by.
  • the solid cooling module (20) is combined with two flow paths of the heat medium and application and removal of a force field such as a magnetic field to the solid refrigerant substance (23). ) Can generate hot or cold heat.
  • a tenth aspect of the present disclosure is, in the ninth aspect, the low temperature side inflow port (25a), the low temperature side outflow port (26a), the high temperature side inflow port (27a), and the high temperature side outflow port (the high temperature side outflow port).
  • a backflow prevention unit (201,202,203,204,205,206) is connected to at least one of 28a).
  • the "port" and the "backflow prevention unit” are connected not only when they are directly connected, but also when they are connected via, for example, a header structure for parallel connection. It shall also include the case where it is done.
  • the backflow prevention unit (201,202,203,204,205,206) of the low temperature side inflow passage (25), the low temperature side outflow passage (26), the high temperature side inflow passage (27), and the high temperature side outflow passage (28) is connected.
  • the direction in which the heat medium flows in the flow path can be defined, and it is possible to prevent the flow path from becoming a dead volume and deteriorating the performance.
  • the eleventh aspect of the present disclosure is, in the ninth or tenth aspect, the cold side inflow port (25a) and the cold side outflow port (26a) of each of the accommodating portions (22) arranged closest to the low temperature. And the high temperature side inflow port (27a) and the high temperature side outflow port (28a) of each of the above accommodating portions (22) arranged closest to the high temperature are arranged on one side in the solid cooling module (20). It is characterized by being.
  • the four ports (25a to 28a) are on one side of the solid cooling module (20), it is possible to easily install a pipe or the like connected to each of the four ports (25a to 28a). it can.
  • a twelfth aspect of the present disclosure is, in the ninth or tenth aspect, the cold side inflow port (25a) and the cold side outflow port (26a) of each of the accommodating portions (22) arranged closest to the low temperature. And the high temperature side inflow port (27a) and the high temperature side outflow port (28a) of each of the above accommodating portions (22) arranged closest to the high temperature are arranged opposite to each other in the solid cooling module (20). It is characterized by being done.
  • the thirteenth aspect of the present disclosure communicates with the low temperature side inflow port (25a) of each of the accommodating portions (22) arranged at the lowest temperature in any one of the ninth to twelfth aspects.
  • the high temperature end inflow port (71) communicating with the high temperature side inflow port (27a) of each of the above accommodating portions (22) and the high temperature side outflow port of each of the above accommodating portions (22) arranged at the highest temperature. It is characterized by having a high temperature end outflow port (72) communicating with 28a).
  • the heat medium flows in from the low temperature end inflow port (73), passes through the low temperature side inflow port (25a), and exchanges heat with the solid refrigerant substance (23) in the plurality of accommodating portions (22). Then, it flows out from the high temperature end outflow port (72) via the high temperature side outflow port (28a).
  • the heat medium flows in from the high temperature end inflow port (71), passes through the high temperature side inflow port (27a), exchanges heat with the solid refrigerant substance (23) at the plurality of accommodating portions (22), and then exchanges heat with the solid refrigerant substance (23). It flows out from the low temperature end outflow port (74) via the low temperature side outflow port (26a).
  • the fourteenth aspect of the present disclosure has a low temperature internal inflow passage (87), a low temperature internal outflow passage (88), a high temperature internal inflow passage (85), and a high temperature internal outflow passage (86) in the thirteenth aspect.
  • the low temperature internal inflow passage (87) having a header structure (32,42,52,62) is the low temperature side inflow port (25a) and the low temperature side inflow port (25a) of each of the accommodating portions (22) arranged closest to the low temperature.
  • the low temperature internal outflow passage (88) communicates with the end inflow port (73), and the low temperature internal outflow port (88) is the low temperature side outflow port (26a) and the low temperature end outflow port of each of the accommodating portions (22) arranged closest to the low temperature.
  • the high temperature internal outflow passage (86) communicates with the high temperature side outflow port (28a) and the high temperature end outflow port (72) of each of the accommodating portions (22) arranged at the highest temperature. It is characterized by letting it.
  • the heat medium flows in from the low temperature end inflow port (73), passes through the low temperature internal inflow path (87) and the low temperature side inflow port (25a), and is solid in the plurality of accommodating portions (22). It exchanges heat with the refrigerant substance (23) and flows out from the high temperature end outflow port (72) via the high temperature side outflow port (28a) and the high temperature internal outflow path (86).
  • the heat medium flows in from the high temperature end inflow port (71), passes through the high temperature internal inflow path (85) and the high temperature side inflow port (27a), and is a solid refrigerant substance (23) in a plurality of accommodating portions (22). ), And flows out from the cold end outflow port (74) via the cold side outflow port (26a) and the cold internal outflow channel (88).
  • the header structure (32,42,52,62) is the first series internal flow path (91,93,95,97) and the second series internal. It further has a flow path (92,94,96,98), and the first series internal flow path (91,93,95,97) is connected to the low temperature side outflow port (26a) of the accommodating portion (22).
  • the high temperature side inflow port (27a) of the other accommodating portion (22) in series with respect to the flow of the heat medium, the high temperature end inflow port via the plurality of accommodating portions (22).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) are connected in series between the plurality of accommodating portions (22). Is realized.
  • the heat medium flows in from the low temperature end inflow port (73), sequentially flows through the plurality of accommodating portions (22), and flows out from the high temperature end outflow port (72).
  • the heat medium flows in from the hot end inflow port (71), sequentially flows through the plurality of accommodating portions (22), and flows out from the cold end outflow port (74).
  • the header structure (32,42,52,62) has a low temperature internal inflow path (87) and a low temperature internal outflow path (88).
  • a side header (42) and a high temperature side header (32) having the high temperature internal inflow path (85) and the high temperature internal outflow path (86) are provided, or the low temperature internal inflow path (87), the low temperature.
  • the heat medium flows from the low temperature side header (42) through the plurality of accommodating parts (22) to the high temperature side header (32) and vice versa, or from the common header (52). It flows to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • a seventeenth aspect of the present disclosure is, in the sixteenth aspect, the low temperature internal inflow passage (87), the low temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86).
  • the first series internal flow path (91,93,95,97), and the second series internal flow path (92,94,96,98) are the low temperature side header (42) or the high temperature side header. (32), or a single-layer structure or a multi-layer structure provided in the common header (52) or the connection header (62).
  • a low temperature internal inflow passage (87), a low temperature internal outflow passage (88), a high temperature internal inflow passage (85), a high temperature internal outflow passage (86), and a first series internal flow path (91,93,95). , 97), and the second series internal flow path (92,94,96,98) can be easily manufactured by configuring the second series internal flow path (92,94,96,98) in a single layer structure, while each header (32,42,52,62) can be easily manufactured.
  • Each header (32, 42, 52, 62) can be miniaturized by configuring it in a layered structure.
  • the header structure (32,42,52,62) includes the low temperature side header (42) and the high temperature side header (32).
  • the low-temperature internal inflow path (87) and the low-temperature internal outflow path (88) are composed of a single-layer structure or a multi-layer structure provided in the low-temperature side header (42), and the high-temperature internal inflow path (85) and the high-temperature internal outflow path (85)
  • the high-temperature internal outflow passage (86) is characterized by having a single-layer structure or a multi-layer structure provided in the high-temperature side header (32).
  • the heat medium flows from the low temperature side header (42) to the high temperature side header (32) via the plurality of accommodating portions (22), or vice versa.
  • the low temperature side header (42) or high temperature by forming the low temperature internal inflow path (87) and the low temperature internal outflow path (88), or the high temperature internal inflow path (85) and the high temperature internal outflow path (86) in a single layer structure.
  • the side header (32) can be easily manufactured.
  • the low temperature side header (42) or the high temperature side header (32) can be miniaturized by configuring them in a multi-layer structure.
  • each of the low temperature side header (42) and the high temperature side header (32) faces the first surface (34a, 34a, 44a) and the second surface (35a, 45a) on the back side of the first surface (34a, 44a), and the single-layer structure of the low-temperature internal inflow path (87) and the low-temperature internal outflow path (88).
  • the low temperature internal outflow path (88) is formed by grooves (87,88) formed in at least one of the first surface (44a) side and the second surface (45a) side inside the low temperature side header (42).
  • the high-temperature internal inflow path (85) and the high-temperature internal outflow path (86) having a single-layer structure are formed in a groove (34a) side formed on the first surface (34a) side inside the high-temperature side header (32).
  • the high-temperature internal inflow path (85) and the high-temperature internal outflow path (86) having a multi-layer structure are composed of the above-mentioned first surface (34a) inside the above-mentioned high-temperature side header (32). It is characterized by being composed of grooves (85,86) formed on at least one of the side and the second surface (35a) side.
  • the low temperature internal inflow passage (87), the low temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86) of the single-layer structure or the multi-layer structure are placed on the low temperature side. It can be realized by a simple configuration of a groove (85 to 88) formed inside the header (42) or the high temperature side header (32).
  • the header structure (32,42,52,62) includes the common header (52) and the connection header (62), and the low temperature.
  • the internal inflow passage (87), the low temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86) have a single-layer structure or a single-layer structure provided in the common header (52). It is composed of a multi-layer structure, and the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) are provided in the connection header (62). It is characterized in that it is composed of a single-layer structure or a multi-layer structure.
  • the heat medium flows from the common header (52) to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • second series internal flow path (92,94,96,98) By configuring the second series internal flow path (92,94,96,98) with a single layer structure, a common header (52) or a connection header (62) can be easily manufactured.
  • the common header (52) or the connection header (62) can be miniaturized by configuring them in a multi-layer structure.
  • each of the common header (52) and the connection header (62) faces the first surface (54a, 64a) facing the accommodating portion (22).
  • the high-temperature internal inflow path (85) and the high-temperature internal outflow path (86) are composed of grooves (85 to 88) formed on the first surface (54a) side inside the common header (52).
  • the low-temperature internal inflow passage (87), the low-temperature internal outflow passage (88), the high-temperature internal inflow passage (85), and the high-temperature internal outflow passage (86) having a multi-layer structure have the common header (52).
  • the first series internal flow path (91) having a single-layer structure is composed of grooves (85 to 88) formed on at least one of the first surface (54a) side and the second surface (55a) side.
  • 93,95,97) and the second series internal flow path (92,94,96,98) are grooves (91) formed on the first surface (64a) side inside the connection header (62).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) having a multi-layer structure are connected to each other. It is characterized in that it is composed of grooves (91 to 98) formed in at least one of the first surface (64a) side and the second surface (63b) side inside the header (62).
  • a single-layer structure or a multi-layer structure low temperature internal inflow passage (87), low temperature internal outflow passage (88), high temperature internal inflow passage (85), high temperature internal outflow passage (86), first series inside.
  • the plurality of accommodating portions (22) are integrated with each other by the header structure (32,42,52,62). It is characterized by being done.
  • the header structure (32,42,52,62) and the plurality of accommodating portions (22) integrated with each other can be treated as one unit.
  • At least a part of the header structure (32,42,52,62) has a thermal conductivity of 10 W / mK or less. It is characterized by being composed of the following materials.
  • the solid cooling module (20) and its outside are connected to the header structure (32,42,52,62) via the header structure (32,42,52,62). It is possible to prevent unnecessary heat transfer between the two.
  • the solid refrigerant substance (23) is a magnetic working substance (23), and the solid cooling module (20) is , It is a magnetic refrigeration module (20).
  • the heat medium supplied to the magnetic refrigeration module (20) sequentially flows through a plurality of accommodating portions (22) connected in series with each other.
  • Such a new type of magnetic refrigeration module (20) can be provided.
  • the 25th aspect of the present disclosure is characterized in that, in the 24th aspect, at least a part of the header structure (32,42,52,62) is made of a non-magnetic material.
  • the magnetic refrigeration module (20) when configured as the solid cooling module (20), the magnetic flux does not easily flow through the header structure (32,42,52,62), so that the plurality of accommodating portions (22) are accommodated. A magnetic field can be applied efficiently.
  • FIG. 1 is a circuit diagram showing the configuration of the air conditioning system of the first embodiment.
  • FIG. 2 is a four-view view showing the configuration of the magnetic refrigeration module of the first embodiment.
  • FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
  • FIG. 4 is a diagram showing each component of the magnetic refrigeration module of the first embodiment.
  • FIG. 5 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 6 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the second operation.
  • FIG. 7 is a four-view view showing the configuration of the magnetic refrigeration module of the modified example of the first embodiment.
  • FIG. 8 is a diagram showing each component of the magnetic refrigeration module of the modified example of the first embodiment.
  • FIG. 9 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 10 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the second operation.
  • FIG. 11 is a four-view view showing the configuration of the magnetic refrigeration module of the second embodiment.
  • FIG. 12 is a diagram showing each component of the magnetic refrigeration module of the second embodiment.
  • FIG. 13 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 14 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the second operation.
  • FIG. 9 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 10 is a diagram for explaining the flow of the heat medium in
  • FIG. 15 is a four-view view showing the configuration of the magnetic refrigeration module of the modified example of the second embodiment.
  • FIG. 16 is a diagram showing each component of the magnetic refrigeration module of the modified example of the second embodiment.
  • FIG. 17 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 18 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the second operation.
  • FIG. 19 is a four-view view showing the configuration of the magnetic refrigeration module of the third embodiment.
  • FIG. 20 is a diagram showing each component of the magnetic refrigeration module of the third embodiment.
  • FIG. 21 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 22 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the second operation.
  • FIG. 23 is a four-view view showing the configuration of the magnetic refrigeration module of the modified example of the third embodiment.
  • FIG. 24 is a diagram showing each component of the magnetic refrigeration module of the modified example of the third embodiment.
  • FIG. 25 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 26 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the second operation.
  • FIG. 27 is a four-view view showing the configuration of the magnetic refrigeration module of the fourth embodiment.
  • FIG. 28 is a diagram showing each component of the magnetic refrigeration module of the fourth embodiment.
  • FIG. 29 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the first operation.
  • FIG. 30 is a diagram for explaining the flow of the heat medium in the magnetic refrigeration module when the heat medium pump performs the second operation.
  • FIG. 31 is a diagram showing a state in which a backflow prevention unit and a heat insulating layer are further provided on the magnetic refrigeration module shown in FIG.
  • FIG. 32 is a four-view view showing an example of the configuration of the magnetic refrigeration module provided with the backflow prevention portion shown in FIG. 31.
  • FIG. 33 is a diagram showing an example of the header structure of the magnetic refrigeration module shown in FIG. 32.
  • FIG. 34 is a diagram showing a state in which a backflow prevention unit and a heat insulating layer are further provided on the magnetic refrigeration module shown in FIG.
  • FIG. 35 is a diagram showing a state in which a backflow prevention unit and a heat insulating layer are further provided on the magnetic refrigeration module shown in FIG.
  • FIG. 36 is a diagram showing a state in which a backflow prevention unit and a heat insulating layer are further provided on the magnetic refrigeration module shown in FIG.
  • FIG. 37 is a diagram showing a state in which a backflow prevention unit and a heat insulating layer are further provided on the magnetic refrigeration module shown in FIG. FIG.
  • FIG. 38 is a diagram showing a state in which a backflow prevention unit and a heat insulating layer are further provided on the magnetic refrigeration module shown in FIG. 24.
  • FIG. 39 is a diagram showing an example of how the magnetic refrigeration module shown in FIG. 28 is further provided with a backflow prevention unit and a heat insulating layer.
  • FIG. 40 is a diagram showing another example in which a backflow prevention unit and a heat insulating layer are further provided on the magnetic refrigeration module shown in FIG. 28.
  • the magnetic refrigeration module (20) of the present embodiment adjusts the temperature of the heat medium (fluid in the present embodiment) by utilizing the magnetic heat quantity effect, and is, for example, an air conditioning system (10) configured as a cold-only chiller. ).
  • the magnetic refrigeration module (20) is a solid cooling module that regulates the temperature of the heat medium by utilizing the calorific value effect.
  • the application of the magnetic refrigeration module (20) is not limited to this.
  • the magnetic refrigeration module (20) may be provided in the air conditioner.
  • the air conditioning system (10) includes a magnetic refrigeration module (20), a low temperature side heat exchanger (110), a high temperature side heat exchanger (120), and a heat medium pump (130).
  • the heat medium circuit (11) provided is provided. Each component of the heat medium circuit (11) is connected to each other via a heat medium pipe.
  • the magnetic refrigeration module (20) includes a magnetic working substance (23) as a solid refrigerant substance.
  • the magnetic refrigeration module (20) is a device that creates a magnetic calorific value effect by applying or removing a magnetic field to a magnetic working substance (23), thereby heating or cooling a heat medium flowing inside.
  • the magnetic refrigeration module (20) has a low temperature end inflow port (73), a low temperature end outflow port (74), a high temperature end inflow port (71), and a high temperature end outflow port (72).
  • the low temperature end inflow port (73) and the high temperature end inflow port (71), and the low temperature end outflow port (74) and the high temperature end outflow port (72) are contained inside the magnetic refrigeration module (20). (See FIGS. 2 and 3).
  • the heat medium flowing in from the low temperature end inflow port (73) flows in the accommodating portion (22) and flows out from the high temperature end outflow port (72).
  • the heat medium flowing in from the high temperature end inflow port (71) flows in the accommodating portion (22) and flows out from the low temperature end outflow port (74).
  • the low temperature side heat exchanger (110) exchanges heat between the heat medium cooled by the magnetic refrigeration module (20) and the secondary refrigerant flowing through a utilization unit (for example, an air handling unit) (not shown).
  • the low temperature side heat exchanger (110) has a first inflow portion (111) connected to the low temperature end outflow port (74) of the magnetic refrigeration module (20) and a low temperature end inflow port (73) of the magnetic refrigeration module (20). ), A third inflow section (113) and a third outflow section (114) connected to the utilization unit.
  • the heat medium piping between the low temperature end outflow port (74) and the first inflow portion (111) allows the flow of the heat medium from the former to the latter, while prohibiting the flow of the heat medium in the opposite direction.
  • a check valve (141) is provided.
  • the heat medium piping between the low temperature end inflow port (73) and the first outflow part (112) allows the flow of the heat medium from the latter to the former, while prohibiting the reverse flow of the heat medium.
  • a check valve (142) is provided.
  • the high temperature side heat exchanger (120) exchanges heat between the heat medium heated by the magnetic refrigeration module (20) and the secondary refrigerant flowing through a heat source unit (for example, a cooling tower) (not shown).
  • the high temperature side heat exchanger (120) has a second inflow portion (121) connected to the high temperature end outflow port (72) of the magnetic refrigeration module (20) and a high temperature end inflow port (71) of the magnetic refrigeration module (20). ), A fourth inflow portion (123) and a fourth outflow portion (124) connected to the heat source unit.
  • the heat medium piping between the high temperature end outflow port (72) and the second inflow part (121) allows the flow of heat medium from the former to the latter, while prohibiting the flow of heat medium in the opposite direction.
  • a check valve (143) is provided.
  • the heat medium piping between the high temperature end inflow port (71) and the second outflow part (122) allows the flow of heat medium from the latter to the former, while prohibiting the flow of heat medium in the opposite direction.
  • a check valve (144) is provided.
  • the heat medium pump (130) allows the heat medium to flow between the magnetic refrigeration module (20) and the low temperature side heat exchanger (110) and the high temperature side heat exchanger (120).
  • the heat carrier pump (130) is configured as a piston pump in this example.
  • the heat carrier pump (130) has a cylinder (131) and a piston (134) disposed therein.
  • the cylinder (131) is divided into a first chamber (132) and a second chamber (133) by a piston (134).
  • the first chamber (132) communicates with the heat medium piping between the low temperature side heat exchanger (110) and the second check valve (142).
  • the second chamber (133) communicates with the heat medium piping between the high temperature side heat exchanger (120) and the fourth check valve (144).
  • the piston (134) reciprocates in the cylinder (131) to discharge the heat medium from the first chamber (132) and suck the heat medium into the second chamber (133).
  • the first operation of the operation and the second operation of discharging the heat medium from the second chamber (133) and sucking the heat medium into the first chamber (132) are performed.
  • the magnetic refrigeration module (20) has a housing portion case (21), a high temperature side header case (31), and a low temperature side header case (41), each of which is formed in a rectangular parallelepiped shape. ) And.
  • a high temperature side header case (31) is integrally attached to one side surface (left side surface of FIG. 2) of the accommodating portion case (21).
  • a low temperature side header case (41) is integrally attached to another side surface (right side surface of FIG. 2) of the accommodating portion case (21).
  • FIG. 4 (A) is a view of a plurality of accommodating portions (22), which will be described later, viewed from the left side of FIG.
  • the symbols in each flow path (25 to 28) indicate the direction in which the heat medium flows in the flow path (25 to 28).
  • the hatches attached to the flow paths (25 to 28) indicate that the front side in FIG. 4 (A) is blocked.
  • the non-hatched flow paths (25 to 28) are closed on the back side in FIG. 4 (A).
  • FIG. 4B is a view of the second high temperature side packing (35) described later as viewed from the left side of FIG.
  • FIG. 4C is a view of the first high temperature side packing (34) described later as viewed from the right side of FIG.
  • FIG. 4D is a view of the high temperature side header body (33) described later as viewed from the left side of FIG.
  • FIG. 4 (E) is a view of the high temperature side header body (33) viewed from the front side of FIG.
  • FIG. 4F is a view of the high temperature side header body (33) viewed from the right side of FIG.
  • FIG. 4 (G) is a view of the first low temperature side packing (44) described later as viewed from the left side of FIG.
  • FIG. 4H is a view of the second low temperature side packing (45), which will be described later, viewed from the right side of FIG.
  • FIG. 4 (I) is a view of the low temperature side header body (43) described later as viewed from the left side of FIG.
  • FIG. 4 (J) is a view of the low temperature side header body (43) viewed from the front side of FIG.
  • FIG. 4 (K) is a view of the low temperature side header body (43) viewed from the right side of FIG.
  • ⁇ Accommodation case> A plurality of (two in this example) accommodating portions (22) are accommodated in the accommodating portion case (21).
  • a plurality of (two in this example) through holes (21a) are formed in the accommodating portion case (21), and one accommodating portion (22) is accommodated in each through hole (21a).
  • the two accommodating portions (22) of the present embodiment may be referred to as a first accommodating portion (22a) and a second accommodating portion (22b) in order from left to right in FIG.
  • the first accommodating portion (22a) constitutes an accommodating portion arranged at the highest temperature.
  • the second accommodating portion (22b) constitutes an accommodating portion arranged at the lowest temperature.
  • the plurality of accommodating parts (22) each accommodate a plurality of magnetic working substances (23).
  • the plurality of magnetic working substances (23) are arranged along the direction in which the heat medium flows (vertical direction in FIG. 3).
  • the plurality of accommodating portions (22) extend in a predetermined direction (direction orthogonal to the paper surface in FIG. 3) and are arranged in a direction intersecting the predetermined direction (left-right direction in FIG. 3). In this example, the plurality of accommodating portions (22) are arranged in a direction orthogonal to the predetermined direction.
  • Each accommodating portion (22) includes a plurality of (four in this example) flow path forming members (24).
  • Each flow path forming member (24) extends in the same direction as the accommodating portion (22) extends.
  • Each flow path forming member (24) is made of a magnetic material (for example, iron).
  • each flow path forming member (24) Two of each flow path forming member (24) are paired, and one pair is arranged above the magnetic working substance (23) and the other pair is arranged below the magnetic working substance (23).
  • Each flow path forming member (24) has a substantially C-shaped cross-sectional shape, and each pair of flow path forming members (24) are arranged so that the opening sides face each other in opposite directions.
  • the openings of the flow path forming members (24) form a plurality of flow paths (25 to 28) extending in the predetermined direction for allowing the heat medium to enter and exit the magnetic working substance (23).
  • the flow paths (25 to 28) are aligned with the magnetic working substance (23) in a direction (vertical direction in FIG.
  • the flow path (25 to 28) is aligned with the magnetic working substance (23) in a direction orthogonal to both the direction in which the plurality of accommodating portions (22) are arranged and the predetermined direction.
  • These plurality of flow paths (25 to 28) are specifically referred to as a low temperature side inflow path (25), a low temperature side outflow path (26), a high temperature side inflow path (27), and a high temperature side outflow path (28). is there.
  • the low temperature side inflow path (25) and the high temperature side outflow path (28) are arranged in pairs along one diagonal line of the accommodating portion (22).
  • the high temperature side inflow path (27) and the low temperature side outflow path (26) are arranged in pairs along the other diagonal line of the accommodating portion (22).
  • the heat medium flowing in from the low temperature side inflow path (25) flows out from the high temperature side outflow path (28) after flowing through the magnetic working substance (23).
  • the heat medium flowing in from the high temperature side inflow path (27) flows out from the low temperature side outflow path (26) after flowing through the magnetic working substance (23).
  • the high temperature side header case (31) houses the high temperature side header (32).
  • the high temperature side header case (31) includes a high temperature end inflow port (71) and a high temperature end outflow port (72).
  • the high temperature end inflow port (71) guides the heat medium flowing from the high temperature side heat exchanger (120) into the magnetic refrigeration module (20) when the heat medium pump (130) performs the second operation.
  • the high temperature end outflow port (72) guides the heat medium in the magnetic refrigeration module (20) to the high temperature side heat exchanger (120) when the heat medium pump (130) performs the first operation.
  • the high temperature side header (32) is arranged so as to be in contact with each accommodating portion (22) in the high temperature side header case (31).
  • the high temperature side header (32) includes a high temperature side header main body (33), a first high temperature side packing (34), and a second high temperature side packing (35).
  • the high temperature side header (32) constitutes a header structure.
  • the high temperature side header body (33) is formed in a slightly flat rectangular parallelepiped shape.
  • the high temperature side header body (33) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the high temperature side header body (33) has a front surface (33a) in contact with the first high temperature side packing (34) and a back surface (33b) in contact with the second high temperature side packing (35).
  • the high temperature side header body (33) is formed with a high temperature side inflow hole (81) and a high temperature side outflow hole (82), each of which penetrates the high temperature side header body (33) in the thickness direction (left-right direction in FIG. 2). Will be done.
  • the first series connection groove (91), and the second series connection groove (92) are formed by a single layer structure.
  • the single-layer structure means that only one of the front surface (33a, 43a, 53a, 63a) and the back surface (33b, 43b, 53b, 63b) of each header body (33,43,53,63) is a heat medium. It is a structure in which a flow path (for example, each groove (85 to 88, 91 to 98)) through which the water flows is formed.
  • the high temperature internal inflow groove (85) is formed by the high temperature side inflow hole (81) and the high temperature side inflow port (27a) (specifically, the first accommodating portion (22a)) via the first high temperature side packing (34). , The entrance of the high temperature side inflow path (27) of the first accommodating portion (22a)).
  • the high temperature internal inflow groove (85) is formed in a substantially L shape on the surface (33a) of the high temperature side header body (33).
  • the high temperature internal inflow groove (85) constitutes a high temperature internal inflow path.
  • the high temperature internal outflow groove (86) is formed through the first high temperature side packing (34), the high temperature side outflow hole (82), and the high temperature side outflow port (28a) (specifically, the first accommodating portion (22a)). , The exit of the high temperature side outflow passage (28) of the first accommodating portion (22a)).
  • the high temperature internal outflow groove (86) is formed in a substantially C shape that opens upward on the surface (33a) of the high temperature side header body (33).
  • the high temperature internal outflow groove (86) constitutes a high temperature internal outflow path.
  • the first series connection groove (91) is connected to the low temperature side outflow port (26a) of the first accommodating portion (22a) via the first accommodating portion (34) (specifically, the first accommodating portion (22a)). (Outlet of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the second accommodating portion (22b) (specifically, the high temperature side inflow passage (27) of the second accommodating portion (22b) The entrance) is connected in series.
  • the first series connection groove (91) is formed in a rectangular shape on the surface (33a) of the high temperature side header body (33).
  • the first series connection groove (91) constitutes the first series internal flow path.
  • the second series connection groove (92) is connected to the low temperature side inflow port (25a) of the first accommodating portion (22a) via the first accommodating portion (34) (specifically, the first accommodating portion (22a)). (Inlet of the low temperature side inflow passage (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b) (specifically, the high temperature side outflow passage (28) of the second accommodating portion (22b). The outlet) is connected in series.
  • the second series connection groove (92) is formed in a substantially C shape that opens downward on the surface (33a) of the high temperature side header body (33).
  • the second series connection groove (92) constitutes the second series internal flow path.
  • the first high temperature side packing (34) is a rectangular plate-shaped resin member.
  • the resin constituting the first high temperature side packing (34) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the first high temperature side packing (34) is attached to the surface (33a) of the high temperature side header body (33).
  • the other side surface (34a) of the first high temperature side packing (34) is attached to each accommodating portion (22).
  • the first high temperature side packing (34) more broadly the high temperature side header (32), integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (34a) of the first high temperature side packing (34) constitutes the first surface of the high temperature side header (32) facing each accommodating portion (22).
  • the first to sixth packing holes (H1 to H6) are formed in the first high temperature side packing (34).
  • the first to sixth packing holes (H1 to H6) penetrate the first high temperature side packing (34) in the thickness direction.
  • the first packing hole (H1) communicates the high temperature side outflow port (28a) of the second accommodating portion (22b) with the second series connection groove (92) of the high temperature side header body (33).
  • the second packing hole (H2) communicates the high temperature side inflow port (27a) of the second accommodating portion (22b) with the first series connection groove (91) of the high temperature side header body (33).
  • the third packing hole (H3) communicates the low temperature side outflow port (26a) of the first accommodating portion (22a) with the first series connection groove (91) of the high temperature side header body (33).
  • the fourth packing hole (H4) communicates the low temperature side inflow port (25a) of the first accommodating portion (22a) with the second series connection groove (92) of the high temperature side header body (33).
  • the fifth packing hole (H5) communicates the high temperature side outflow port (28a) of the first accommodating portion (22a) with the high temperature internal outflow groove (86) of the high temperature side header body (33).
  • the sixth packing hole (H6) communicates the high temperature side inflow port (27a) of the first accommodating portion (22a) with the high temperature internal inflow groove (85) of the high temperature side header body (33).
  • the low temperature side outflow path (26) of the first accommodating portion (22a) and the high temperature side inflow path (27) of the second accommodating portion (22b) form a first series connection groove (91). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the first accommodating portion (22a) and the high temperature side outflow path (28) of the second accommodating portion (22b) are connected in series with each other via the second series connecting groove (92). Will be done.
  • the first accommodating portion (22a) and the second accommodating portion (22b) are connected in series with each other.
  • the second high temperature side packing (35) is a rectangular plate-shaped resin member.
  • the resin constituting the second high temperature side packing (35) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the second high temperature side packing (35) is attached to the back surface (33b) of the high temperature side header body (33).
  • the other side surface (35a) of the second high temperature side packing (35) constitutes the second surface on the back side of the first surface of the high temperature side header (32).
  • the second high temperature side packing (35) is formed with a high temperature side outflow packing hole (101) and a high temperature side inflow packing hole (102), each of which is formed in a circular shape.
  • the high temperature side outflow packing hole (101) and the high temperature side inflow packing hole (102) penetrate the second high temperature side packing (35) in the thickness direction.
  • the high temperature side outflow packing hole (101) communicates the high temperature end outflow port (72) with the high temperature side outflow hole (82) of the high temperature side header body (33).
  • the high temperature side inflow packing hole (102) communicates the high temperature end inflow port (71) with the high temperature side inflow hole (81) of the high temperature side header body (33).
  • the low temperature side header case (41) accommodates the low temperature side header (42).
  • the low temperature side header case (41) includes a low temperature end inflow port (73) and a low temperature end outflow port (74).
  • the low temperature end inflow port (73) guides the heat medium flowing from the low temperature side heat exchanger (110) into the magnetic refrigeration module (20) when the heat medium pump (130) performs the first operation.
  • the low temperature end outflow port (74) guides the heat medium in the magnetic refrigeration module (20) to the low temperature side heat exchanger (110) when the heat medium pump (130) performs the second operation.
  • the low temperature side header (42) is arranged so as to be in contact with each accommodating portion (22) in the low temperature side header case (41).
  • the low temperature side header (42) includes a low temperature side header main body (43), a first low temperature side packing (44), and a second low temperature side packing (45).
  • the low temperature side header (42) constitutes a header structure.
  • the low temperature side header body (43) is formed in a slightly flat rectangular parallelepiped shape.
  • the low temperature side header body (43) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the low temperature side header body (43) has a front surface (43a) in contact with the first low temperature side packing (44) and a back surface (43b) in contact with the second low temperature side packing (45).
  • the low temperature side header body (43) is formed with a low temperature side inflow hole (83) and a low temperature side outflow hole (84), each of which penetrates the low temperature side header body (43) in the thickness direction (left-right direction in FIG. 2). Will be done.
  • the low temperature internal inflow groove (87) and the low temperature internal outflow groove (88). Is formed by a single layer structure.
  • the low temperature internal inflow groove (87) is formed through the first low temperature side packing (44), the low temperature side inflow hole (83), and the low temperature side inflow port (25a) (specifically, the second accommodating portion (22b)). , The entrance of the low temperature side inflow path (25) of the second accommodating portion (22b)).
  • the low temperature internal inflow groove (87) is formed in a substantially C shape that opens upward on the surface (43a) of the low temperature side header body (43).
  • the low temperature internal inflow groove (87) constitutes a low temperature internal inflow path.
  • the low temperature internal outflow groove (88) is formed through the first low temperature side packing (44), the low temperature side outflow hole (84), and the low temperature side outflow port (26a) (specifically, the second accommodating portion (22b)). , The exit of the low temperature side outflow passage (26) of the second accommodating portion (22b)).
  • the low temperature internal outflow groove (88) is formed in a substantially L shape on the surface (43a) of the low temperature side header body (43).
  • the low temperature internal outflow groove (88) constitutes a low temperature internal outflow channel.
  • the first low temperature side packing (44) is a rectangular plate-shaped resin member.
  • the resin constituting the first low temperature side packing (44) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the first low temperature side packing (44) is attached to the surface (43a) of the low temperature side header body (43).
  • the other side surface (44a) of the first low temperature side packing (44) is attached to each accommodating portion (22).
  • the first low temperature side packing (44) more broadly the low temperature side header (42), integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (44a) of the first low temperature side packing (44) constitutes the first surface of the low temperature side header (42) facing each accommodating portion (22).
  • the first low temperature side packing (44) is formed with seventh and eighth packing holes (H7, H8), each of which is formed in a vertically long rectangular shape.
  • the seventh and eighth packing holes (H7, H8) penetrate the first low temperature side packing (44) in the thickness direction.
  • the seventh packing hole (H7) communicates the low temperature side inflow port (25a) of the second accommodating portion (22b) with the low temperature internal inflow groove (87) of the low temperature side header body (43).
  • the eighth packing hole (H8) communicates the low temperature side outflow port (26a) of the second accommodating portion (22b) with the low temperature internal outflow groove (88) of the low temperature side header body (43).
  • the second low temperature side packing (45) is a rectangular plate-shaped resin member.
  • the resin constituting the second low temperature side packing (45) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the second low temperature side packing (45) is attached to the back surface (43b) of the low temperature side header body (43).
  • the other side surface (45a) of the second low temperature side packing (45) constitutes the second surface on the back side of the first surface of the low temperature side header (42).
  • the second low temperature side packing (45) is formed with a low temperature side outflow packing hole (103) and a low temperature side inflow packing hole (104), each of which is formed in a circular shape.
  • the low temperature side outflow packing hole (103) and the low temperature side inflow packing hole (104) penetrate the second low temperature side packing (45) in the thickness direction.
  • the low temperature side outflow packing hole (103) communicates the low temperature end outflow port (74) with the low temperature side outflow hole (84) of the low temperature side header body (43).
  • the low temperature side inflow packing hole (104) communicates the low temperature end inflow port (73) with the low temperature side inflow hole (83) of the low temperature side header body (43).
  • the heat medium pump (130) is made to perform the first operation and the second operation alternately, and a magnetic field is applied to each accommodating portion (22) of the magnetic refrigeration module (20) corresponding to both operations. Cool heat is supplied to the utilization unit by applying or removing it.
  • each accommodating portion (22) of the magnetic refrigeration module (20) With the flow of the heat medium stopped.
  • the magnetic working substance (23) in each accommodating portion (22) generates heat.
  • the piston (134) moves to the left in FIG. 1, and the heat medium is discharged from the first chamber (132).
  • the heat medium discharged from the first chamber (132) passes through the second check valve (142) and flows into the accommodating portion (22), where it exchanges heat with the heat-generating magnetic working substance (23). It is heated.
  • the heated heat medium passes through the third check valve (143) and flows into the high temperature side heat exchanger (120), where it dissipates heat to the secondary refrigerant of the heat source unit.
  • the heat medium flowing out of the high temperature side heat exchanger (120) is sucked into the second chamber (133) of the heat medium pump (130).
  • each accommodating part (22) of the magnetic refrigeration module (20) absorbs heat.
  • the piston (134) moves to the right in FIG. 1, and the heat medium is discharged from the second chamber (133).
  • the heat medium discharged from the second chamber (133) passes through the fourth check valve (144) and flows into the accommodating portion (22), where it exchanges heat with the endothermic magnetic working substance (23).
  • the cooled heat medium passes through the first check valve (141) and flows into the low temperature side heat exchanger (110), where the secondary refrigerant of the utilization unit is cooled.
  • the heat medium flowing out of the low temperature side heat exchanger (110) is sucked into the first chamber (132) of the heat medium pump (130).
  • cold heat can be supplied to the low temperature side heat exchanger (110) and hot heat can be supplied to the high temperature side heat exchanger (120), whereby the utilization unit can cool the target space. It can be carried out.
  • the low temperature side heat exchanger (110) and the high temperature side heat exchanger (120) are maintained at substantially constant temperatures according to the magnetic working substance (23) in the accommodating portion (22).
  • the magnetic working material (23) is maintained so that the temperature of the low temperature side heat exchanger (110) is lower than the temperature of the target space and the temperature of the air around the accommodating portion (22). ) Is selected.
  • the heat medium pump (130) performs the first operation, the heat medium flows from the low temperature side to the high temperature side in the magnetic refrigeration module (20). Specifically, in the magnetic refrigeration module (20), the heat medium flowing in from the low temperature end inflow port (73) flows into the low temperature side inflow hole (83) of the low temperature side header main body (43). The heat medium flowing out from the low temperature side inflow hole (83) of the low temperature side header main body (43) passes through the low temperature internal inflow groove (87) of the low temperature side header main body (43) to the second accommodating portion (22b). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the high temperature of the second accommodating portion (22b). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the second accommodating portion (22b) passes through the second series connection groove (92) of the high temperature side header main body (33) and is passed through the first accommodating portion (22a). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the high temperature of the first accommodating portion (22a). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow passage (28) of the first accommodating portion (22a) passes through the high temperature internal outflow groove (86) of the high temperature side header main body (33) to the high temperature side header main body (33). It flows into the high temperature side outflow hole (82).
  • the heat medium flowing out from the high temperature side outflow hole (82) of the high temperature side header body (33) flows out to the outside of the magnetic refrigeration module (20) through the high temperature end outflow port (72).
  • the heat medium pump (130) performs the second operation, the heat medium flows from the high temperature side to the low temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the high temperature end inflow port (71) flows into the high temperature side inflow hole (81) of the high temperature side header main body (33).
  • the heat medium flowing out from the high temperature side inflow hole (81) of the high temperature side header body (33) passes through the high temperature internal inflow groove (85) of the high temperature side header body (33) and is of the first accommodating portion (22a). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the inflow path (27) on the high temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the low temperature of the first accommodating portion (22a). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the first accommodating portion (22a) passes through the first series connection groove (91) of the high temperature side header main body (33) and is passed through the second accommodating portion (22b). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the low temperature of the second accommodating portion (22b). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the second accommodating portion (22b) passes through the low temperature internal outflow groove (88) of the low temperature side header main body (43) to the low temperature side header main body (43). It flows into the low temperature side outflow hole (84).
  • the heat medium flowing out from the low temperature side outflow hole (84) of the low temperature side header body (43) flows out to the outside of the magnetic refrigeration module (20) through the low temperature end outflow port
  • the magnetic refrigeration module (20) of the present embodiment includes a plurality of accommodating portions (22) each accommodating a magnetic working substance (23), and at least a part of the plurality of accommodating portions (22) is in series with each other. It is connected. According to this configuration, the heat medium supplied to the magnetic refrigeration module (20) sequentially flows through a plurality of accommodating portions (22) connected in series with each other. Such a new type of magnetic refrigeration module (20) can be provided.
  • a direction in which the plurality of accommodating portions (22) extend in a predetermined direction and intersect with the predetermined direction (in this example, a direction orthogonal to the predetermined direction). Lined up in.
  • the plurality of accommodating portions (22) as a whole extend in both a predetermined direction and a direction intersecting the predetermined direction. Therefore, it is possible to easily apply a magnetic field to the magnetic working substance (23).
  • the flow path (25) extending in the predetermined direction for each of the accommodating portions (22) to allow the heat medium to enter and exit the magnetic working substance (23). ⁇ 28), and the flow path (25 to 28) is lined up with the magnetic working substance (23) in a direction intersecting both the direction in which the plurality of accommodating portions (22) are lined up and the predetermined direction. ..
  • a plurality of accommodating portions (22) can be arranged close to each other. Therefore, it is possible to make it easier to apply a magnetic field to the plurality of accommodating portions (22).
  • each of the above-mentioned accommodating portions (22) has a low temperature side inflow port (25a), a low temperature side outflow port (26a), a high temperature side inflow port (27a), and a high temperature side.
  • Each of the accommodating portions (22) has an outflow port (28a), and a heat medium is transferred from the low temperature side inflow port (25a) to the high temperature side outflow port (28a) via the magnetic working material (23).
  • the heat medium flows or flows from the high temperature side inflow port (27a) to the low temperature side outflow port (26a) via the magnetic working material (23).
  • the magnetic refrigeration module (20) heats or cools by combining the two flow paths of the heat medium with the application and removal of a magnetic field to the magnetic working material (23). Can be generated.
  • the magnetic refrigeration module (20) of the present embodiment has the highest temperature of the lower temperature side inflow port (25a) and the lower temperature side outflow port (26a) of each of the above-mentioned accommodating portions (22) arranged at the lowest temperature.
  • the high temperature side inflow port (27a) and the high temperature side outflow port (28a) of each of the accommodating portions (22) arranged closer to each other are arranged opposite to each other in the magnetic refrigeration module (20). According to this configuration, the heat medium flowing through the low temperature side inflow port (25a) or the low temperature side outflow port (26a) and the heat medium flowing through the high temperature side inflow port (27a) or the high temperature side outflow port (28a). It is possible to prevent unnecessary heat transport between the two.
  • the magnetic refrigeration module (20) of the present embodiment has a low temperature end inflow port (73) communicating with the low temperature side inflow port (25a) of each of the above accommodating portions (22) arranged at the lowest temperature.
  • the low temperature end outflow port (74) communicating with the low temperature side outflow port (26a) of each of the above accommodating portions (22) arranged near the low temperature, and the above of each of the above accommodating portions (22) arranged closest to the high temperature.
  • the heat medium flows in from the low temperature end inflow port (73), passes through the low temperature side inflow port (25a), and exchanges heat with the magnetic working substance (23) in a plurality of accommodating portions (22). Then, it flows out from the high temperature end outflow port (72) via the high temperature side outflow port (28a).
  • the heat medium flows in from the high temperature end inflow port (71), passes through the high temperature side inflow port (27a), exchanges heat with the magnetic working substance (23) at a plurality of accommodating portions (22), and then exchanges heat with the magnetic working material (23). It flows out from the low temperature end outflow port (74) via the low temperature side outflow port (26a).
  • the magnetic refrigeration module (20) of the present embodiment has a header structure having a low temperature internal inflow passage (87), a low temperature internal outflow passage (88), a high temperature internal inflow passage (85), and a high temperature internal outflow passage (86).
  • the low temperature internal outflow port (88) communicates with the port (73), and the low temperature side outflow port (26a) and the low temperature end outflow port (74) of each of the accommodating portions (22) arranged at the lowest temperature.
  • the high-temperature internal inflow path (85) connects the high-temperature side inflow port (27a) and the high-temperature end inflow port (71) of each of the above-mentioned accommodating portions (22) arranged at the highest temperature.
  • the high temperature internal outflow passage (86) communicates with the high temperature side outflow port (28a) and the high temperature end outflow port (72) of each of the accommodating portions (22) arranged at the highest temperature. According to this configuration, the heat medium flows in from the low temperature end inflow port (73), passes through the low temperature internal inflow path (87) and the low temperature side inflow port (25a), and magnetically works in a plurality of accommodating portions (22).
  • the heat medium flows in from the high temperature end inflow port (71), passes through the high temperature internal inflow path (85) and the high temperature side inflow port (27a), and is a magnetic working substance (23) in a plurality of accommodating portions (22). ), And flows out from the cold end outflow port (74) via the cold side outflow port (26a) and the cold internal outflow channel (88).
  • the header structure (32,42,52,62) has the first series internal flow path (91,93,95,97) and the second series internal flow path. Further having (92,94,96,98), the first series internal flow path (91,93,95,97) is the cold side outflow port (26a) of the accommodating portion (22) and others.
  • the second series internal flow path (92,94,96,98) communicates with 74), and the second series internal flow path (92,94,96,98) is connected to the high temperature side outflow port (28a) of the accommodating portion (22) and the other accommodating portion (22).
  • the low temperature side inflow port (25a) By connecting the low temperature side inflow port (25a) in series, the low temperature end inflow port (73) is communicated with the high temperature end outflow port (72) via the plurality of accommodating portions (22).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) provide a series connection between a plurality of accommodating portions (22). It will be realized.
  • the heat medium flows in from the low temperature end inflow port (73), sequentially flows through the plurality of accommodating portions (22), and flows out from the high temperature end outflow port (72).
  • the heat medium flows in from the hot end inflow port (71), sequentially flows through the plurality of accommodating portions (22), and flows out from the cold end outflow port (74).
  • the header structure (32,42,52,62) is a low temperature side header having the low temperature internal inflow path (87) and the low temperature internal outflow path (88). (42) and a high temperature side header (32) having the high temperature internal inflow path (85) and the high temperature internal outflow path (86). According to this configuration, the heat medium flows from the low temperature side header (42) to the high temperature side header (32) via the plurality of accommodating portions (22), and vice versa.
  • the magnetic refrigeration module (20) of the present embodiment includes the low temperature internal inflow path (87), the low temperature internal outflow path (88), the high temperature internal inflow path (85), the high temperature internal outflow path (86), and the like.
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) are the low temperature side header (42) or the high temperature side header (32). ) Is composed of a single layer structure.
  • low temperature internal inflow passage (87), low temperature internal outflow passage (88), high temperature internal inflow passage (85), high temperature internal outflow passage (86), first series internal flow path (91,93,95, 97) and the second series internal flow path (92,94,96,98) are configured with a single layer structure, so that each header (32,42,52,62) can be easily manufactured.
  • the header structure (32,42,52,62) includes the low temperature side header (42) and the high temperature side header (32), and the low temperature side header (32) is provided.
  • the internal inflow passage (87) and the low temperature internal outflow passage (88) are configured by a single-layer structure provided in the low temperature side header (42), and the high temperature internal inflow passage (85) and the high temperature internal outflow passage (85).
  • 86) is composed of a single layer structure provided on the high temperature side header (32). According to this configuration, the heat medium flows from the low temperature side header (42) to the high temperature side header (32) via the plurality of accommodating portions (22), and vice versa.
  • the low temperature side header (42) or high temperature by forming the low temperature internal inflow path (87) and the low temperature internal outflow path (88), or the high temperature internal inflow path (85) and the high temperature internal outflow path (86) in a single layer structure.
  • the side header (32) can be easily manufactured.
  • each of the low temperature side header (42) and the high temperature side header (32) faces the first surface (34a, 44a) of the accommodating portion (22). And the second surface (35a, 45a) on the back side of the first surface (34a, 44a), the low temperature internal inflow path (87) and the low temperature internal outflow path (88) having a single layer structure.
  • the high-temperature internal inflow path (85) and the high-temperature internal outflow path having a single-layer structure are formed by grooves (87,88) formed on the first surface (44a) side inside the low-temperature side header (42).
  • (86) is composed of grooves (85,86) formed on the first surface (34a) side inside the high temperature side header (32).
  • the low temperature internal inflow passage (87), the low temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86) of the single layer structure are formed on the low temperature side header (42) or It can be realized by a simple configuration of grooves (85 to 88) formed inside the high temperature side header (32).
  • the plurality of the accommodating portions (22) are integrated with each other by the header structure (32,42,52,62).
  • the header structure (32,42,52,62) and the plurality of accommodating portions (22) integrated with each other can be treated as one unit.
  • the pressure in the magnetic refrigeration module (20) is increased. Loss can be suppressed.
  • the header structure (32,42,52,62) is made of a material having a thermal conductivity of 10 W / mK or less. According to this configuration, since the thermal conductivity of the header structure (32,42,52,62) is low, the magnetic refrigeration module (20) and its outside are connected to each other via the header structure (32,42,52,62). It is possible to prevent unnecessary heat transfer between them.
  • the header structure (32,42,52,62) is made of a non-magnetic material. According to this configuration, since magnetic flux does not easily flow through the header structure (32,42,52,62), a magnetic field can be efficiently applied to a plurality of accommodating portions (22).
  • a check flow prevention unit (201,202) composed of, for example, a check valve may be provided at the series connection locations (two locations) between the accommodating portions (22).
  • a check flow prevention unit (201,202) composed of, for example, a check valve may be provided at the series connection locations (two locations) between the accommodating portions (22).
  • the same components as those in the first embodiment shown in FIG. 4 are designated by the same reference numerals.
  • the low temperature side inflow port (25a) of the first accommodating portion (22a) (the inlet of the low temperature side inflow passage (25)) and the high temperature side outflow port (28a) (high temperature) of the second accommodating portion (22b).
  • the first backflow prevention unit (201) may be arranged at a position where the outlet of the side outflow passage (28) is connected in series.
  • the low temperature side outflow port (26a) (outlet of the low temperature side outflow path (26)) of the first accommodating portion (22a) and the high temperature side inflow port (27a) (high temperature side inflow path) of the second accommodating portion (22b).
  • the second backflow prevention unit (202) may be arranged at a position where the inlet (27) is connected in series.
  • the direction in which the heat medium flows can be defined in the flow paths (25 to 28) of each accommodating portion (22), so that it is possible to prevent the flow paths (25 to 28) from becoming dead volumes and deteriorating the performance.
  • backflow prevention units (201,202) are provided at all series connection points between the accommodating units (22), but instead of this, the first backflow prevention unit (201) or the second backflow prevention unit (201) or the second backflow Only one of the prevention portions (202) may be provided. Also in this case, the performance deterioration due to the dead volume can be suppressed as compared with the case where the backflow prevention unit (201,202) is not provided.
  • the low temperature side inflow port (25a) of the first accommodating portion (22a) (the inlet of the low temperature side inflow path (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b).
  • the outlet of the high temperature side outflow passage (28)) may be connected to the first backflow prevention unit (201).
  • the low temperature side outflow port (26a) of the first accommodating portion (22a) (exit of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the second accommodating portion (22b) (high temperature side inflow passage (high temperature side inflow passage)).
  • a second backflow prevention unit (202) may be connected to at least one of the inlets of 27).
  • the structure for series connection inside the header structure (32, 42) (high temperature side header body (33) of the first embodiment shown in FIG. 2) It is possible to install a backflow prevention unit (201,202) in the front stage.
  • FIG. 32 is a four-view view showing an example of the configuration of the magnetic refrigeration module (20) provided with the backflow prevention unit (201,202) shown in FIG. 31.
  • the same components as those in the first embodiment shown in FIG. 2 are designated by the same reference numerals.
  • the backflow prevention structure (backflow prevention structure) between the high temperature side header main body (33) and the first high temperature side packing (34) is compared with the configuration shown in FIG. 36) is further provided. Further, a third high temperature side packing (37) is further provided between the high temperature side header main body (33) and the backflow prevention structure (36).
  • FIG. 33 is a diagram showing an example of the header structure of the magnetic refrigeration module (20) shown in FIG. 32 (specifically, the newly added backflow prevention structure (36) and the third high temperature side packing (37)). .. Specifically, FIG. 33 (A) is a view of the backflow prevention structure (36) viewed from the right side of FIG. 32 (first high temperature side packing (34) side), and FIG. 33 (B) is a view of backflow prevention. The structure (36) is viewed from the front side of FIG. 32, and FIG. 33 (C) shows the third high temperature side packing (37) from the right side of FIG. 32 (the first high temperature side packing (34) side). It is a view.
  • the backflow prevention structure (36) is formed in a slightly flat rectangular parallelepiped shape.
  • the backflow prevention structure (36)) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the backflow prevention structure (36) has a front surface (36a) in contact with the first high temperature side packing (34) and a back surface in contact with the third high temperature side packing (37).
  • the backflow prevention structure (36) has a first check valve (first check valve) so as to communicate with the first and third packing holes (H1, H3) of the first high temperature side packing (34), respectively. 201) and a second check valve (second check valve) (202) are formed.
  • first to fourth connection holes are provided so as to communicate with the second and fourth to sixth packing holes (H2, H4 to 6) of the first high temperature side packing (34), respectively. (221-224) are formed.
  • the backflow prevention portion (201,202) and the connection holes (221 to 224) each penetrate the backflow prevention structure (36) in the thickness direction (left-right direction in FIG. 32).
  • the third high temperature side packing (37) is a rectangular plate-shaped resin member.
  • the resin constituting the third high temperature side packing (37) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the third high temperature side packing (37) is attached to the surface (33a) of the high temperature side header body (33).
  • the other side surface (37a) of the third high temperature side packing (37) is attached to the backflow prevention structure (36).
  • the third high temperature side packing (37) has first to sixth packing holes (H1) each having a vertically long rectangular shape. ⁇ H6) is formed. The first to sixth packing holes (H1 to H6) penetrate the third high temperature side packing (37) in the thickness direction.
  • the first packing hole (H1) is formed by the first backflow prevention portion (201) of the backflow prevention structure (36) and the second series of the high temperature side header main body (33) (see FIGS. 4 (D) to (F)). Communicate with the connection groove (92).
  • the second packing hole (H2) communicates the first connection hole (221) of the backflow prevention structure (36) with the first series connection groove (91) of the high temperature side header body (33).
  • the third packing hole (H3) includes a second check valve (second check valve) (202) of the backflow prevention structure (36) and a first series connection groove (91) of the high temperature side header body (33). To communicate with.
  • the fourth packing hole (H4) communicates the second connection hole (222) of the backflow prevention structure (36) with the second series connection groove (92) of the high temperature side header body (33).
  • the fifth packing hole (H5) communicates the third connection hole (223) of the backflow prevention structure (36) with the high temperature internal outflow groove (86) of the high temperature side header body (33).
  • the sixth packing hole (H6) communicates the fourth connection hole (224) of the backflow prevention structure (36) with the high temperature internal inflow groove (85) of the high temperature side header body (33).
  • the first packing holes (H1) of the first high temperature side packing (34) and the third high temperature side packing (37) and the first backflow prevention portion (201) of the backflow prevention structure (36) are It communicates with the high temperature side outflow port (28a) of the second accommodating part (22b).
  • the second packing holes (H2) of the first high temperature side packing (34) and the third high temperature side packing (37) and the first connection hole (221) of the backflow prevention structure (36) are the second accommodating portion (22b). ) Connects to the high temperature side inflow port (27a).
  • the third packing holes (H3) of the first high temperature side packing (34) and the third high temperature side packing (37) and the second backflow prevention part (202) of the backflow prevention structure (36) are the first accommodating parts ( It communicates with the low temperature side outflow port (26a) of 22a).
  • the fourth packing holes (H4) of the first high temperature side packing (34) and the third high temperature side packing (37) and the second connection hole (222) of the backflow prevention structure (36) are formed in the first accommodating portion (22a).
  • the fifth packing holes (H5) of the first high temperature side packing (34) and the third high temperature side packing (37) and the third connection hole (223) of the backflow prevention structure (36) are formed in the first accommodating portion (22a).
  • the sixth packing holes (H6) of the first high temperature side packing (34) and the third high temperature side packing (37) and the fourth connection hole (224) of the backflow prevention structure (36) are formed in the first accommodating portion (22a). ) Connects to the high temperature side inflow port (27a).
  • the low temperature side outflow path (26) of the first accommodating portion (22a) and the high temperature side inflow path (27) of the second accommodating portion (22b) are in series with each other via the first series connecting groove (91).
  • the second backflow prevention unit (202) is connected to the low temperature side outflow port (26a) of the first accommodating unit (22a).
  • the low temperature side inflow path (25) of the first accommodating portion (22a) and the high temperature side outflow path (28) of the second accommodating portion (22b) are in series with each other via the second series connecting groove (92).
  • the first backflow prevention unit (201) is connected to the high temperature side outflow port (28a) of the second accommodating unit (22b). This makes it possible to install a backflow prevention unit (201,202) in front of the high temperature side header body (33) inside the header structure (32,42).
  • a heat insulating layer (first heat insulating layer) (211) may be provided between the accommodating portions (22) connected in series.
  • the heat insulating layer (211) may be made of a heat insulating material, slits, or the like. Further, a part of the accommodating portion (22) may be composed of a heat insulating member serving as a heat insulating layer (211).
  • the heat insulating layer (211) may be provided as a whole between the accommodating portions (22) connected in series, or may be provided as a part between the accommodating portions (22) connected in series. Good. In the configuration shown in FIG.
  • a heat insulating layer (211) is provided between the high temperature side outflow passage (28) of the first accommodating portion (22a) through which the heat medium flows at temperature and the low temperature side inflow passage (25) of the second accommodating portion (22b). ing.
  • Embodiment 1 A modified example of the first embodiment will be described.
  • the magnetic refrigeration module (20) of this modification is different from the first embodiment in that it includes a common header (52) and a connection header (62).
  • the differences from the first embodiment will be mainly described.
  • the magnetic refrigeration module (20) includes a housing portion case (21), a common header case (51), and a connection header case (61), each of which is formed in a rectangular parallelepiped shape. Be prepared.
  • a common header case (51) is integrally attached to one side surface (left side surface of FIG. 7) of the accommodating portion case (21).
  • the connection header case (61) is integrally attached to another side surface (right side surface of FIG. 7) of the accommodating portion case (21).
  • the common header case (51) houses the common header (52).
  • the common header case (51) includes a hot end inflow port (71), a hot end outflow port (72), a cold end inflow port (73), and a cold end outflow port (74).
  • the common header (52) is arranged so as to be in contact with each accommodating portion (22) in the common header case (51).
  • the common header (52) includes a common header main body (53), a first common packing (54), and a second common packing (55).
  • the common header (52) constitutes a header structure.
  • the common header body (53) is formed in a slightly flat rectangular parallelepiped shape.
  • the common header body (53) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the common header body (53) has a front surface (53a) in contact with the first common packing (54) and a back surface (53b) in contact with the second common packing (55).
  • the common header body (53) has a high temperature side inflow hole (81), a high temperature side outflow hole (82), and a low temperature side inflow, each of which penetrates the common header body (53) in the thickness direction (left-right direction in FIG. 7).
  • a hole (83) and a low temperature side outflow hole (84) are formed.
  • the internal inflow groove (87) and the low temperature internal outflow groove (88) are formed by a single-layer structure.
  • the high temperature internal inflow groove (85) is formed by the high temperature side inflow hole (81) and the high temperature side inflow port (27a) (specifically, the first accommodating portion (22a)) via the first common packing (54). It communicates with the high temperature side inflow path (27) of the first accommodating portion (22a)).
  • the high temperature internal inflow groove (85) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the high temperature internal inflow groove (85) constitutes a high temperature internal inflow path.
  • the high temperature internal outflow groove (86) is formed through the first common packing (54), the high temperature side outflow hole (82), and the high temperature side outflow port (28a) (specifically, the first accommodating portion (22a)). It communicates with the outlet of the high temperature side outflow passage (28) of the first accommodating portion (22a).
  • the high temperature internal outflow groove (86) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the high temperature internal outflow groove (86) constitutes a high temperature internal outflow path.
  • the low temperature internal inflow groove (87) is formed through the first common packing (54), the low temperature side inflow hole (83), and the low temperature side inflow port (25a) (specifically, the second accommodating portion (22b)). It communicates with the low temperature side inflow passage (25) of the second accommodating portion (22b)).
  • the low temperature internal inflow groove (87) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the low temperature internal inflow groove (87) constitutes a low temperature internal inflow path.
  • the low temperature internal outflow groove (88) is formed through the first common packing (54), the low temperature side outflow hole (84), and the low temperature side outflow port (26a) (specifically, the second accommodating portion (22b)). It communicates with the outlet of the low temperature side outflow passage (26) of the second accommodating portion (22b).
  • the low temperature internal outflow groove (88) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the low temperature internal outflow groove (88) constitutes a low temperature internal outflow channel.
  • the first common packing (54) is a rectangular plate-shaped resin member.
  • the resin constituting the first common packing (54) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the first common packing (54) is attached to the surface (53a) of the common header body (53).
  • the other side surface (54a) of the first common packing (54) is attached to each accommodating portion (22).
  • the first common packing (54) more broadly the common header (52), integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (54a) of the first common packing (54) constitutes the first side surface of the common header (52) facing each accommodating portion (22).
  • the first common packing (54) is formed with first to fourth packing holes (H1 to H4), each of which is formed in a vertically long rectangular shape.
  • the first to fourth packing holes (H1 to H4) penetrate the first common packing (54) in the thickness direction.
  • the first packing hole (H1) communicates the low temperature side outflow port (26a) of the second accommodating portion (22b) with the low temperature internal outflow groove (88) of the common header body (53).
  • the second packing hole (H2) communicates the low temperature side inflow port (25a) of the second accommodating portion (22b) with the low temperature internal inflow groove (87) of the common header body (53).
  • the third packing hole (H3) communicates the high temperature side outflow port (28a) of the first accommodating portion (22a) with the high temperature internal outflow groove (86) of the common header body (53).
  • the fourth packing hole (H4) communicates the high temperature side inflow port (27a) of the first accommodating portion (22a) with the high temperature internal inflow groove (85) of the common header body (53).
  • the second common packing (55) is a rectangular plate-shaped resin member.
  • the resin constituting the second common packing (55) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the second common packing (55) is attached to the back surface (53b) of the common header body (53).
  • the other side surface (55a) of the second common packing (55) constitutes the second surface on the back side of the first surface of the common header (52).
  • the second common packing (55) includes a high temperature side outflow packing hole (101), a high temperature side inflow packing hole (102), a low temperature side outflow packing hole (103), and a low temperature side inflow packing, each of which is formed in a circular shape.
  • a hole (104) is formed.
  • the high temperature side outflow packing hole (101), the high temperature side inflow packing hole (102), the low temperature side outflow packing hole (103), and the low temperature side inflow packing hole (104) have the second common packing (55) in the thickness direction. Penetrate.
  • the high temperature side outflow packing hole (101) communicates the high temperature end outflow port (72) with the high temperature side outflow hole (82) of the common header body (53).
  • the high temperature side inflow packing hole (102) communicates the high temperature end inflow port (71) with the high temperature side inflow hole (81) of the common header body (53).
  • the low temperature side outflow packing hole (103) communicates the low temperature end outflow port (74) with the low temperature side outflow hole (84) of the common header body (53).
  • the low temperature side inflow packing hole (104) communicates the low temperature end inflow port (73) with the low temperature side inflow hole (83) of the common header body (53).
  • connection header case (61) houses the connection header (62).
  • the connection header (62) is arranged so as to be in contact with each accommodating portion (22) inside the connection header case (61).
  • the connection header (62) includes a connection header main body (63) and a connection packing (64).
  • the connection header (62) constitutes a header structure.
  • connection header body (63) is formed in a slightly flat rectangular parallelepiped shape.
  • the connection header body (63) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the connection header body (63) has a front surface (63a) in contact with the connection packing (64) and a back surface (63b) on the back side thereof.
  • a first series connection groove (91) and a second series connection groove (92). Is formed by a single layer structure.
  • the back surface of the connection header body (63) constitutes the second surface of the connection header (62).
  • the first series connecting groove (91) is connected to the low temperature side outflow port (26a) of the first accommodating portion (22a) (specifically, the low temperature side of the first accommodating portion (22a)) via the connecting packing (64).
  • Outflow path (26) outlet) and high temperature side inflow port (27a) of the second accommodating section (22b) (specifically, the inlet of the high temperature side inflow path (27) of the second accommodating section (22b)) Are communicated in series.
  • the first series connection groove (91) is formed in a rectangular shape on the surface (63a) of the connection header body (63).
  • the first series connection groove (91) constitutes the first series internal flow path.
  • the second series connecting groove (92) is connected to the low temperature side inflow port (25a) of the first accommodating portion (22a) (specifically, the low temperature side of the first accommodating portion (22a)) via the connecting packing (64).
  • the inlet of the inflow passage (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b) (specifically, the exit of the high temperature side outflow passage (28) of the second accommodating portion (22b)). Are communicated in series.
  • the second series connection groove (92) is formed in a substantially C shape that opens downward on the surface (63a) of the connection header body (63).
  • the second series connection groove (92) constitutes the second series internal flow path.
  • connection packing (64) is a rectangular plate-shaped resin member.
  • the resin constituting the connection packing (64) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side of the connection packing (64) is attached to the surface (63a) of the connection header body (63).
  • the other side (64a) of the connecting packing (64) is attached to each housing (22).
  • the connection packing (64), or more broadly the connection header (62) integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (64a) of the connection packing (64) constitutes the first surface of the connection header (62) facing each accommodating portion (22).
  • connection packings (64) are formed with fifth to eighth packing holes (H5 to H8), each of which is formed in a vertically long rectangular shape.
  • the fifth to eighth packing holes (H5 to H8) penetrate the connecting packing (64) in the thickness direction.
  • the fifth packing hole (H5) communicates the low temperature side inflow port (25a) of the first accommodating portion (22a) with the second series connection groove (92) of the connection header body (63).
  • the sixth packing hole (H6) communicates the low temperature side outflow port (26a) of the first accommodating portion (22a) with the first series connection groove (91) of the connection header body (63).
  • the seventh packing hole (H7) communicates the high temperature side inflow port (27a) of the second accommodating portion (22b) with the first series connection groove (91) of the connection header body (63).
  • the eighth packing hole (H8) communicates the high temperature side outflow port (28a) of the second accommodating portion (22b) with the second series connection groove (92) of the connection header body (63).
  • the low temperature side outflow path (26) of the first accommodating portion (22a) and the high temperature side inflow path (27) of the second accommodating portion (22b) form a first series connection groove (91). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the first accommodating portion (22a) and the high temperature side outflow path (28) of the second accommodating portion (22b) are connected in series with each other via the second series connecting groove (92). Will be done.
  • the first accommodating portion (22a) and the second accommodating portion (22b) are connected in series with each other.
  • the heat medium pump (130) performs the first operation, the heat medium flows from the low temperature side to the high temperature side in the magnetic refrigeration module (20). Specifically, in the magnetic refrigeration module (20), the heat medium flowing in from the low temperature end inflow port (73) flows into the low temperature side inflow hole (83) of the common header main body (53). The heat medium flowing out from the low temperature side inflow hole (83) of the common header body (53) passes through the low temperature internal inflow groove (87) of the common header body (53) to the low temperature side of the second accommodating portion (22b). It flows into the inflow path (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the high temperature of the second accommodating portion (22b). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the second accommodating portion (22b) passes through the second series connecting groove (92) of the connection header main body (63) to the first accommodating portion (22a). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the high temperature of the first accommodating portion (22a). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the first accommodating portion (22a) passes through the high temperature internal outflow groove (86) of the common header main body (53) to the high temperature side of the common header main body (53). It flows into the outflow hole (82).
  • the heat medium flowing out from the high temperature side outflow hole (82) of the common header body (53) flows out to the outside of the magnetic refrigeration module (20) through the high temperature end outflow port (72).
  • the heat medium pump (130) performs the second operation
  • the heat medium flows from the high temperature side to the low temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the high temperature end inflow port (71) flows into the high temperature side inflow hole (81) of the common header main body (53).
  • the heat medium flowing out from the high temperature side inflow hole (81) of the common header body (53) passes through the high temperature internal inflow groove (85) of the common header body (53) and passes through the high temperature side of the first accommodating portion (22a). It flows into the inflow path (27).
  • the heat medium flowing out from the inflow path (27) on the high temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the low temperature of the first accommodating portion (22a). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the first accommodating portion (22a) passes through the first series connection groove (91) of the connection header main body (63) to the second accommodating portion (22b). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the low temperature of the second accommodating portion (22b). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the second accommodating portion (22b) passes through the low temperature internal outflow groove (88) of the common header main body (53) to the low temperature side of the common header main body (53). It flows into the outflow hole (84).
  • the heat medium flowing out from the low temperature side outflow hole (84) of the common header body (53) flows out to the outside of the magnetic refrigeration module (20) through the low temperature end outflow port (74).
  • the magnetic refrigeration module (20) of the present modification has the highest temperature, the lower temperature side inflow port (25a) and the lower temperature side outflow port (26a) of each of the above accommodating portions (22) arranged closer to the lowest temperature.
  • the high temperature side inflow port (27a) and the high temperature side outflow port (28a) of each of the accommodating portions (22) arranged closer to each other are arranged on one side in the magnetic refrigeration module (20). According to this configuration, since the four ports (25a to 28a) are on one side of the magnetic refrigeration module (20), it is possible to easily install a pipe or the like connected to each of the four ports (25a to 28a). ..
  • the header structure (32,42,52,62) has the low temperature internal inflow path (87), the low temperature internal outflow path (88), and the high temperature internal inflow.
  • the heat medium flows from the common header (52) to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • the header structure (32,42,52,62) includes the common header (52) and the connection header (62), and the low temperature internal inflow.
  • the high temperature internal outflow passage (87), the high temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86) are configured by a single layer structure provided in the common header (52).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) have a single-layer structure provided in the connection header (62). It is composed. According to this configuration, the heat medium flows from the common header (52) to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • each of the common header (52) and the connection header (62) has a first surface (54a, 64a) facing the accommodating portion (22). It has a second surface (55a, 63b) on the back side of the first surface (54a, 64a), and has a single-layer structure, the low temperature internal inflow path (87), the low temperature internal outflow path (88), and the high temperature internal.
  • the inflow path (85) and the high temperature internal outflow path (86) are composed of grooves (85 to 88) formed on the first surface (54a) side inside the common header (52), and are a single layer.
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) of the structure are the first surface inside the connection header (62). It is composed of grooves (91 to 98) formed on the (64a) side.
  • a single-layer structure low-temperature internal inflow passage (87), low-temperature internal outflow passage (88), high-temperature internal inflow passage (85), high-temperature internal outflow passage (86), and first series internal flow path (91, 93,95,97) and the second series internal flow path (92,94,96,98) are grooved (85-88,91-) formed inside the common header (52) or the connection header (62). It can be realized with a simple configuration of 98).
  • a check flow prevention unit (201,202) composed of, for example, a check valve may be provided at the series connection locations (two locations) between the accommodating portions (22).
  • a check flow prevention unit composed of, for example, a check valve
  • FIG. 34 the same components as those of the modification of the first embodiment shown in FIG. 8 are designated by the same reference numerals.
  • the low temperature side outflow port (25b) of the first accommodating portion (22a) (the outlet of the low temperature side inflow path (25)) and the high temperature side inflow port (28b) (high temperature) of the second accommodating portion (22b).
  • the first backflow prevention unit (201) may be arranged at a position where the side outflow path (28) is connected in series.
  • the low temperature side inflow port (26b) of the first accommodating portion (22a) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the second accommodating portion (22b) (high temperature side inflow passage).
  • the second backflow prevention unit (202) may be arranged at a position where the outlet (outlet) of (27) is connected in series.
  • the direction in which the heat medium flows can be defined in the flow paths (25 to 28) of each accommodating portion (22), so that it is possible to prevent the flow paths (25 to 28) from becoming dead volumes and deteriorating the performance.
  • the backflow prevention section (201,202) is provided at all the series connection points between the accommodating sections (22), but instead of this, the first backflow prevention section (201) or the second backflow prevention section (201) is provided. Only one of the prevention portions (202) may be provided. Also in this case, the performance deterioration due to the dead volume can be suppressed as compared with the case where the backflow prevention unit (201,202) is not provided.
  • the low temperature side outflow port (25b) of the first accommodating portion (22a) (exit of the low temperature side inflow path (25)) and the high temperature side inflow port (28b) of the second accommodating portion (22b). ) (The inlet of the high temperature side outflow passage (28)) may be connected to the first backflow prevention unit (201).
  • the low temperature side inflow port (26b) of the first accommodating portion (22a) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the second accommodating portion (22b) (high temperature side inflow passage (high temperature side inflow passage)
  • a second backflow prevention unit (202) may be connected to at least one of the outlets of 27).
  • the backflow prevention unit (201,202) is installed in the header structure (52,62) in front of the structure for series connection. It becomes possible.
  • a heat insulating layer (first heat insulating layer) (211) may be provided between the accommodating portions (22) connected in series.
  • the heat insulating layer (211) may be made of a heat insulating material, slits, or the like. Further, a part of the accommodating portion (22) may be composed of a heat insulating member serving as a heat insulating layer (211).
  • the heat insulating layer (211) may be provided as a whole between the accommodating portions (22) connected in series, or may be provided as a part between the accommodating portions (22) connected in series. Good. In the configuration shown in FIG.
  • a heat insulating layer (211) is provided between the high temperature side outflow passage (28) of the first accommodating portion (22a) through which the heat medium flows at temperature and the low temperature side inflow passage (25) of the second accommodating portion (22b). ing.
  • Embodiment 2 The second embodiment will be described.
  • the magnetic refrigeration module (20) of the present embodiment has a different number of accommodating portions (22) from the above-described first embodiment. Hereinafter, the differences from the first embodiment will be mainly described.
  • ⁇ Accommodation case> As shown in FIGS. 11 to 14, three housing units (22) are housed in the housing unit case (21). Three through holes (21a) are formed in the accommodating portion case (21), and one accommodating portion (22) is accommodated in each through hole (21a).
  • the three accommodating portions (22) of the present embodiment are sequentially arranged from the left to the right in FIG. 12 (A) by the first accommodating portion (22a), the second accommodating portion (22b), and the third accommodating portion (22b).
  • first accommodating portion (22a) constitutes an accommodating portion arranged at the highest temperature.
  • the third accommodating portion (22c) constitutes an accommodating portion arranged at the lowest temperature.
  • High temperature side header In the high temperature side header (32), the configurations of the high temperature side header main body (33) and the first high temperature side packing (34) are different from those in the first embodiment.
  • the configuration of the second high temperature side packing (35) is the same as that of the first embodiment.
  • the high temperature internal inflow groove (85) is formed by the high temperature side inflow hole (81) and the high temperature side inflow port (27a) (specifically, the first accommodating portion (22a)) via the first high temperature side packing (34). , The entrance of the high temperature side inflow path (27) of the first accommodating portion (22a)).
  • the high temperature internal inflow groove (85) is formed in a substantially L shape on the surface (33a) of the high temperature side header body (33).
  • the high temperature internal inflow groove (85) constitutes a high temperature internal inflow path.
  • the high temperature internal outflow groove (86) is formed through the first high temperature side packing (34), the high temperature side outflow hole (82), and the high temperature side outflow port (28a) (specifically, the first accommodating portion (22a)). , The exit of the high temperature side outflow passage (28) of the first accommodating portion (22a)).
  • the high temperature internal outflow groove (86) is formed in a substantially C shape that opens downward on the surface (33a) of the high temperature side header body (33).
  • the high temperature internal outflow groove (86) constitutes a high temperature internal outflow path.
  • the first series connection groove (91) passes through the first high temperature side packing (34) to the low temperature side outflow port (26a) of the second accommodating portion (22b) (specifically, the second accommodating portion (22b)). (Outlet of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the third accommodating portion (22c) (specifically, the high temperature side inflow passage (27) of the third accommodating portion (22c). The entrance) is connected in series.
  • the first series connection groove (91) is formed in a rectangular shape on the surface (33a) of the high temperature side header body (33).
  • the first series connection groove (91) constitutes the first series internal flow path.
  • the second series connection groove (92) passes through the first high temperature side packing (34) to the low temperature side inflow port (25a) of the second accommodating portion (22b) (specifically, the second accommodating portion (22b)). (Inlet of the low temperature side inflow path (25)) and the high temperature side outflow port (28a) of the third accommodating portion (22c) (specifically, the high temperature side outflow path (28) of the third accommodating portion (22c). The outlet) is connected in series.
  • the second series connection groove (92) is formed in a substantially C shape that opens downward on the surface (33a) of the high temperature side header body (33).
  • the second series connection groove (92) constitutes the second series internal flow path.
  • the first to sixth packing holes (H1 to H6) are formed in the first high temperature side packing (34).
  • the first to sixth packing holes (H1 to H6) penetrate the first high temperature side packing (34) in the thickness direction.
  • the first packing hole (H1) communicates the high temperature side outflow port (28a) of the third accommodating portion (22c) with the second series connection groove (92) of the high temperature side header body (33).
  • the second packing hole (H2) communicates the high temperature side inflow port (27a) of the third accommodating portion (22c) with the first series connection groove (91) of the high temperature side header body (33).
  • the third packing hole (H3) communicates the low temperature side outflow port (26a) of the second accommodating portion (22b) with the first series connection groove (91) of the high temperature side header body (33).
  • the fourth packing hole (H4) communicates the low temperature side inflow port (25a) of the second accommodating portion (22b) with the second series connection groove (92) of the high temperature side header body (33).
  • the fifth packing hole (H5) communicates the high temperature side outflow port (28a) of the first accommodating portion (22a) with the high temperature internal outflow groove (86) of the high temperature side header body (33).
  • the sixth packing hole (H6) communicates the high temperature side inflow port (27a) of the first accommodating portion (22a) with the high temperature internal inflow groove (85) of the high temperature side header body (33).
  • the low temperature side outflow passage (26) of the second accommodating portion (22b) and the high temperature side inflow passage (27) of the third accommodating portion (22c) form a first series connecting groove (91). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the second accommodating portion (22b) and the high temperature side outflow path (28) of the third accommodating portion (22c) are connected in series with each other via the second series connecting groove (92). Will be done.
  • the second accommodating portion (22b) and the third accommodating portion (22c) are connected in series with each other.
  • ⁇ Low temperature side header> In the low temperature side header (42), the configurations of the low temperature side header main body (43) and the first low temperature side packing (44) are different from those in the first embodiment.
  • the configuration of the second low temperature side packing (45) is the same as that of the first embodiment.
  • the low temperature internal inflow groove (87) is formed through the first low temperature side packing (44), the low temperature side inflow hole (83), and the low temperature side inflow port (25a) (specifically, the third accommodating portion (22c)). , The entrance of the low temperature side inflow path (25) of the third accommodating portion (22c)).
  • the low temperature internal inflow groove (87) is formed in a substantially C shape that opens upward on the surface (43a) of the low temperature side header body (43).
  • the low temperature internal inflow groove (87) constitutes a low temperature internal inflow path.
  • the low temperature internal outflow groove (88) is formed through the first low temperature side packing (44), the low temperature side outflow hole (84), and the low temperature side outflow port (26a) (specifically, the third accommodating portion (22c)). , The exit of the low temperature side outflow passage (26) of the third accommodating portion (22c)).
  • the low temperature internal outflow groove (88) is formed in a substantially L shape on the surface (43a) of the low temperature side header body (43).
  • the low temperature internal outflow groove (88) constitutes a low temperature internal outflow channel.
  • the third series connection groove (93) is connected to the low temperature side outflow port (26a) of the first accommodating portion (22a) via the first accommodating portion (44) (specifically, the first accommodating portion (22a)). (Outlet of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the second accommodating portion (22b) (specifically, the high temperature side inflow passage (27) of the second accommodating portion (22b) The entrance) is connected in series.
  • the third series connection groove (93) is formed in a rectangular shape on the surface (43a) of the low temperature side header body (43).
  • the third series connection groove (93) constitutes the first series internal flow path.
  • the fourth series connection groove (94) is connected to the low temperature side inflow port (25a) of the first accommodating portion (22a) via the first accommodating portion (44) (specifically, the first accommodating portion (22a)). (Inlet of the low temperature side inflow path (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b) (specifically, the high temperature side outflow path (28) of the second accommodating portion (22b). The outlet) is connected in series.
  • the fourth series connection groove (94) is formed in a substantially C shape that opens upward on the surface (43a) of the low temperature side header body (43).
  • the fourth series connection groove (94) constitutes the second series internal flow path.
  • the first low temperature side packing (44) is formed with seventh to twelfth packing holes (H7 to H12), each of which is formed in a vertically long rectangular shape.
  • the seventh to twelfth packing holes (H7 to H12) penetrate the first low temperature side packing (44) in the thickness direction.
  • the 7th packing hole (H7) communicates the low temperature side inflow port (25a) of the 1st accommodating portion (22a) with the 4th series connection groove (94) of the low temperature side header body (43).
  • the eighth packing hole (H8) communicates the low temperature side outflow port (26a) of the first accommodating portion (22a) with the third series connection groove (93) of the low temperature side header body (43).
  • the ninth packing hole (H9) communicates the high temperature side inflow port (27a) of the second accommodating portion (22b) with the third series connection groove (93) of the low temperature side header body (43).
  • the tenth packing hole (H10) communicates the high temperature side outflow port (28a) of the second accommodating portion (22b) with the fourth series connection groove (94) of the low temperature side header body (43).
  • the eleventh packing hole (H11) communicates the low temperature side inflow port (25a) of the third accommodating portion (22c) with the low temperature internal inflow groove (87) of the low temperature side header body (43).
  • the twelfth packing hole (H12) communicates the low temperature side outflow port (26a) of the third accommodating portion (22c) with the low temperature internal outflow groove (88) of the low temperature side header body (43).
  • the low temperature side outflow path (26) of the first accommodating portion (22a) and the high temperature side inflow path (27) of the second accommodating portion (22b) form a third series connection groove (93). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the first accommodating portion (22a) and the high temperature side outflow path (28) of the second accommodating portion (22b) are connected in series with each other via the fourth series connecting groove (94). Will be done.
  • the first accommodating portion (22a) and the second accommodating portion (22b) are connected in series with each other.
  • the heat medium pump (130) performs the first operation, the heat medium flows from the low temperature side to the high temperature side in the magnetic refrigeration module (20). Specifically, in the magnetic refrigeration module (20), the heat medium flowing in from the low temperature end inflow port (73) flows into the low temperature side inflow hole (83) of the low temperature side header main body (43). The heat medium flowing out from the low temperature side inflow hole (83) of the low temperature side header main body (43) passes through the low temperature internal inflow groove (87) of the low temperature side header main body (43) to the third accommodating portion (22c). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the high temperature of the third accommodation section (22c). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the third accommodating portion (22c) passes through the second series connection groove (92) of the high temperature side header main body (33) and is passed through the second accommodating portion (22b). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the high temperature of the second accommodating portion (22b). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow passage (28) of the second accommodating portion (22b) passes through the fourth series connecting groove (94) of the low temperature side header main body (43) and is passed through the first accommodating portion (22a). Inflow into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the high temperature of the first accommodating portion (22a). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow passage (28) of the first accommodating portion (22a) passes through the high temperature internal outflow groove (86) of the high temperature side header main body (33) to the high temperature side header main body (33). It flows into the high temperature side outflow hole (82).
  • the heat medium flowing out from the high temperature side outflow hole (82) of the high temperature side header body (33) flows out to the outside of the magnetic refrigeration module (20) through the high temperature end outflow port (72).
  • the heat medium pump (130) performs the second operation, the heat medium flows from the high temperature side to the low temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the high temperature end inflow port (71) flows into the high temperature side inflow hole (81) of the high temperature side header main body (33).
  • the heat medium flowing out from the high temperature side inflow hole (81) of the high temperature side header body (33) passes through the high temperature internal inflow groove (85) of the high temperature side header body (33) and is of the first accommodating portion (22a). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the inflow path (27) on the high temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the low temperature of the first accommodating portion (22a). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the first accommodating portion (22a) passes through the third series connecting groove (93) of the low temperature side header main body (43) and is passed through the second accommodating portion (22b). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the low temperature of the second accommodating portion (22b). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the second accommodating portion (22b) passes through the first series connection groove (91) of the high temperature side header main body (33) and is passed through the third accommodating portion (22c). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the low temperature of the third accommodation section (22c). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the third accommodating portion (22c) passes through the low temperature internal outflow groove (88) of the low temperature side header main body (43) to the low temperature side header main body (43). It flows into the low temperature side outflow hole (84).
  • the heat medium flowing out from the low temperature side outflow hole (84) of the low temperature side header body (43) flows out to the outside of the magnetic refrigeration module (20) through the low temperature end outflow port
  • the magnetic refrigeration module (20) of the present embodiment also has the same effect as that of the first embodiment.
  • Embodiment 2- ⁇ Backflow prevention unit>
  • the flow path for connecting the accommodating portions (22) in series is separated by the outward path and the return path, but in reality, the heat medium is in either direction. Can flow, so that the flow path becomes a dead volume and the performance deteriorates.
  • a check flow prevention unit (201,202,203,204) composed of, for example, a check valve may be provided at the series connection locations (4 locations) between the accommodating portions (22).
  • a check flow prevention unit (201,202,203,204) composed of, for example, a check valve
  • FIG. 35 the same components as those in the second embodiment shown in FIG. 12 are designated by the same reference numerals.
  • the low temperature side outflow port (25b) of the first accommodating portion (22a) (the outlet of the low temperature side inflow path (25)) and the high temperature side inflow port (28b) (high temperature) of the second accommodating portion (22b).
  • the first backflow prevention unit (201) may be arranged at a position where the side outflow path (28) is connected in series.
  • the low temperature side inflow port (26b) of the first accommodating portion (22a) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the second accommodating portion (22b) (high temperature side inflow passage).
  • the second backflow prevention unit (202) may be arranged at a position where the outlet (outlet) of (27) is connected in series.
  • a third backflow prevention unit (203) may be arranged at a location where the outlet (28) is connected in series. Further, the low temperature side outflow port (26a) (low temperature side outflow passage (26) outlet) of the second accommodating portion (22b) and the high temperature side inflow port (27a) (high temperature side inflow passage) of the third accommodating portion (22c). The fourth backflow prevention unit (204) may be arranged at a position where the inlet (27) is connected in series.
  • the direction in which the heat medium flows can be defined in the flow paths (25 to 28) of each accommodating portion (22), so that it is possible to prevent the flow paths (25 to 28) from becoming dead volumes and deteriorating the performance.
  • the backflow prevention unit (201,202,203,204) is provided at all the series connection points between the accommodating units (22), but at least one of the backflow prevention units (201,202,203,204) may be provided.
  • the backflow prevention unit (201,202,203,204) it is not necessary to provide a backflow prevention portion (201,202,203,204) between some of the accommodating portions (22) in the series connection structure of the three accommodating portions (22). Also in this case, the performance deterioration due to the dead volume can be suppressed as compared with the case where the backflow prevention unit (201,202,203,204) is not provided at all.
  • the low temperature side outflow port (25b) of the first accommodating portion (22a) (exit of the low temperature side inflow path (25)) and the high temperature side inflow port (28b) of the second accommodating portion (22b). ) (The inlet of the high temperature side outflow passage (28)) may be connected to the first backflow prevention unit (201).
  • the low temperature side inflow port (26b) of the first accommodating portion (22a) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the second accommodating portion (22b) (high temperature side inflow passage (high temperature side inflow passage)
  • a second backflow prevention unit (202) may be connected to at least one of the outlets of 27).
  • a third backflow prevention unit (203) may be connected to at least one of the outlets of 28).
  • the low temperature side outflow port (26a) of the second accommodating portion (22b) (exit of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the third accommodating portion (22c) (high temperature side inflow passage (high temperature side inflow passage)).
  • a fourth backflow prevention unit (204) may be connected to at least one of the inlets of 27). In this way, as described in the first embodiment (see FIGS. 32 and 33), a backflow prevention unit (201,202,203,204) is installed in the header structure (32,42) in front of the structure for series connection. It becomes possible.
  • a heat insulating layer (211,212) may be provided between the accommodating portions (22) connected in series.
  • the heat insulating layer (211,212) may be composed of a heat insulating material, slits, or the like. Further, a part of the accommodating portion (22) may be composed of a heat insulating member serving as a heat insulating layer (211,212).
  • the heat insulating layer (211,212) may be provided as a whole between the accommodating portions (22) connected in series, or may be provided as a part between the accommodating portions (22) connected in series. Good. In the configuration shown in FIG.
  • a first heat insulating layer (211) is provided between the high temperature side outflow passage (28) of the first accommodating portion (22a) through which the heat medium flows at temperature and the low temperature side inflow passage (25) of the second accommodating portion (22b). It is provided. Further, the heat medium flows between the magnetic working substance (23) in the second accommodating portion (22b) and the magnetic working substance (23) in the third accommodating portion (22c), through which the heat medium flows at different temperatures, and at different temperatures.
  • a second heat insulating layer (212) is provided between the high temperature side outflow passage (28) of the second accommodating portion (22b) and the low temperature side inflow passage (25) of the third accommodating portion (22c).
  • Embodiment 2 A modified example of the second embodiment will be described.
  • the magnetic refrigeration module (20) of this modification is different from the second embodiment in that it includes a common header (52) and a connection header (62).
  • the points different from the second embodiment will be mainly described.
  • the magnetic refrigeration module (20) includes a housing portion case (21), a common header case (51), and a connection header case (61), each of which is formed in a rectangular parallelepiped shape. Be prepared.
  • a common header case (51) is integrally attached to one side surface (left side surface of FIG. 15) of the accommodating portion case (21).
  • a connection header case (61) is integrally attached to another side surface (right side surface of FIG. 15) of the housing case (21).
  • the common header case (51) houses the common header (52).
  • the common header case (51) includes a hot end inflow port (71), a hot end outflow port (72), a cold end inflow port (73), and a cold end outflow port (74).
  • the common header (52) is arranged so as to be in contact with each accommodating portion (22) in the common header case (51).
  • the common header (52) includes a common header main body (53), a first common packing (54), and a second common packing (55).
  • the common header (52) constitutes a header structure.
  • the common header body (53) is formed in a slightly flat rectangular parallelepiped shape.
  • the common header body (53) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the common header body (53) has a front surface (53a) in contact with the first common packing (54) and a back surface (53b) in contact with the second common packing (55).
  • the common header body (53) has a high temperature side inflow hole (81), a high temperature side outflow hole (82), and a low temperature side inflow, each of which penetrates the common header body (53) in the thickness direction (left-right direction in FIG. 15).
  • a hole (83) and a low temperature side outflow hole (84) are formed.
  • the internal inflow groove (87), the low temperature internal outflow groove (88), the first series connection groove (91), and the second series connection groove (92) are formed by a single layer structure.
  • the high temperature internal inflow groove (85) is formed by the high temperature side inflow hole (81) and the high temperature side inflow port (27a) (specifically, the first accommodating portion (22a)) via the first common packing (54). It communicates with the high temperature side inflow path (27) of the first accommodating portion (22a)).
  • the high temperature internal inflow groove (85) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the high temperature internal inflow groove (85) constitutes a high temperature internal inflow path.
  • the high temperature internal outflow groove (86) is formed through the first common packing (54), the high temperature side outflow hole (82), and the high temperature side outflow port (28a) (specifically, the first accommodating portion (22a)). It communicates with the outlet of the high temperature side outflow passage (28) of the first accommodating portion (22a).
  • the high temperature internal outflow groove (86) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the high temperature internal outflow groove (86) constitutes a high temperature internal outflow path.
  • the low temperature internal inflow groove (87) is formed through the first common packing (54), the low temperature side inflow hole (83), and the low temperature side inflow port (25a) of the third accommodating portion (22c) (specifically, It communicates with the low temperature side inflow path (25) of the third accommodating portion (22c)).
  • the low temperature internal inflow groove (87) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the low temperature internal inflow groove (87) constitutes a low temperature internal inflow path.
  • the low temperature internal outflow groove (88) is formed through the first common packing (54), the low temperature side outflow hole (84), and the low temperature side outflow port (26a) (specifically, the third accommodating portion (22c)). It communicates with the outlet of the low temperature side outflow passage (26) of the third accommodating portion (22c).
  • the low temperature internal outflow groove (88) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the low temperature internal outflow groove (88) constitutes a low temperature internal outflow channel.
  • the first series connection groove (91) is connected to the low temperature side outflow port (26a) of the first accommodating portion (22a) (specifically, the first accommodating portion (22a)) via the first common packing (54).
  • the outlet of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the second accommodating portion (22b) (specifically, the inlet of the high temperature side inflow passage (27) of the second accommodating portion (22b)). ) Is connected in series.
  • the first series connection groove (91) is formed in a rectangular shape on the surface (53a) of the common header body (53).
  • the first series connection groove (91) constitutes the first series internal flow path.
  • the second series connection groove (92) is connected to the low temperature side inflow port (25a) of the first accommodating portion (22a) (specifically, the first accommodating portion (22a)) via the first common packing (54).
  • the second series connection groove (92) is formed in a substantially C shape that opens downward on the surface (53a) of the common header body (53).
  • the second series connection groove (92) constitutes the second series internal flow path.
  • the first common packing (54) is a rectangular plate-shaped resin member.
  • the resin constituting the first common packing (54) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the first common packing (54) is attached to the surface (53a) of the common header body (53).
  • the other side surface (54a) of the first common packing (54) is attached to each accommodating portion (22).
  • the first common packing (54) more broadly the common header (52), integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (54a) of the first common packing (54) constitutes the first side surface of the common header (52) facing each accommodating portion (22).
  • the first common packing (54) is formed with first to eighth packing holes (H1 to H8), each of which is formed in a vertically long rectangular shape.
  • the first to eighth packing holes (H1 to H8) penetrate the first common packing (54) in the thickness direction.
  • the first packing hole (H1) communicates the high temperature side outflow port (28a) of the first accommodating portion (22a) with the high temperature internal outflow groove (86) of the common header body (53).
  • the second packing hole (H2) communicates the high temperature side inflow port (27a) of the first accommodating portion (22a) with the high temperature internal inflow groove (85) of the common header body (53).
  • the third packing hole (H3) communicates the low temperature side outflow port (26a) of the third accommodating portion (22c) with the low temperature internal outflow groove (88) of the common header body (53).
  • the fourth packing hole (H4) communicates the low temperature side inflow port (25a) of the third accommodating portion (22c) with the low temperature internal inflow groove (87) of the common header body (53).
  • the fifth packing hole (H5) communicates the high temperature side outflow port (28a) of the second accommodating portion (22b) with the second series connecting groove (92) of the common header body (53).
  • the sixth packing hole (H6) communicates the high temperature side inflow port (27a) of the second accommodating portion (22b) with the first series connecting groove (91) of the common header body (53).
  • the seventh packing hole (H7) communicates the low temperature side outflow port (26a) of the first accommodating portion (22a) with the first series connection groove (91) of the common header body (53).
  • the eighth packing hole (H8) communicates the low temperature side inflow port (25a) of the first accommodating portion (22a) with the second series connecting groove (92) of the common header body (53).
  • the low temperature side outflow path (26) of the first accommodating portion (22a) and the high temperature side inflow path (27) of the second accommodating portion (22b) form a first series connection groove (91). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the first accommodating portion (22a) and the high temperature side outflow path (28) of the second accommodating portion (22b) are connected in series with each other via the second series connecting groove (92). Will be done.
  • the first accommodating portion (22a) and the second accommodating portion (22b) are connected in series with each other.
  • the second common packing (55) is a rectangular plate-shaped resin member.
  • the resin constituting the second common packing (55) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the second common packing (55) is attached to the back surface (53b) of the common header body (53).
  • the other side surface (55a) of the second common packing (55) constitutes the second surface on the back side of the first surface of the common header (52).
  • the second common packing (55) includes a high temperature side outflow packing hole (101), a high temperature side inflow packing hole (102), a low temperature side outflow packing hole (103), and a low temperature side inflow packing, each of which is formed in a circular shape.
  • a hole (104) is formed.
  • the high temperature side outflow packing hole (101), the high temperature side inflow packing hole (102), the low temperature side outflow packing hole (103), and the low temperature side inflow packing hole (104) have the second common packing (55) in the thickness direction. Penetrate.
  • the high temperature side outflow packing hole (101) communicates the high temperature end outflow port (72) with the high temperature side outflow hole (82) of the common header body (53).
  • the high temperature side inflow packing hole (102) communicates the high temperature end inflow port (71) with the high temperature side inflow hole (81) of the common header body (53).
  • the low temperature side outflow packing hole (103) communicates the low temperature end outflow port (74) with the low temperature side outflow hole (84) of the common header body (53).
  • the low temperature side inflow packing hole (104) communicates the low temperature end inflow port (73) with the low temperature side inflow hole (83) of the common header body (53).
  • connection header case (61) houses the connection header (62).
  • connection header (62) is arranged so as to be in contact with each accommodating portion (22) inside the connection header case (61).
  • connection header (62) includes a connection header main body (63) and a connection packing (64).
  • the connection header (62) constitutes a header structure.
  • connection header body (63) is formed in a slightly flat rectangular parallelepiped shape.
  • the connection header body (63) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the connection header body (63) has a front surface (63a) in contact with the connection packing (64) and a back surface (63b) on the back side thereof.
  • On the surface (63a) of the connection header body (63) (in other words, on the first surface side inside the connection header (62)), a third series connection groove (93) and a fourth series connection groove (94). Is formed by a single layer structure.
  • the back surface of the connection header body (63) constitutes the second surface of the connection header (62).
  • the third series connection groove (93) is connected to the low temperature side outflow port (26a) of the second accommodating portion (22b) (specifically, the low temperature side of the second accommodating portion (22b)) via the connection packing (64).
  • Outflow path (26) outlet) and high temperature side inflow port (27a) of the third accommodation section (22c) (specifically, the entrance of the high temperature side inflow path (27) of the third accommodation section (22c)) Are communicated in series.
  • the third series connection groove (93) is formed in a rectangular shape on the surface (63a) of the connection header body (63).
  • the third series connection groove (93) constitutes the first series internal flow path.
  • the fourth series connecting groove (94) is connected to the low temperature side inflow port (25a) of the second accommodating portion (22b) (specifically, the low temperature side of the second accommodating portion (22b)) via the connecting packing (64).
  • the inlet of the inflow passage (25)) and the high temperature side outflow port (28a) of the third accommodating portion (22c) (specifically, the exit of the high temperature side outflow passage (28) of the third accommodating portion (22c)). Are communicated in series.
  • the fourth series connection groove (94) is formed in a substantially C shape that opens downward on the surface (63a) of the connection header body (63).
  • the fourth series connection groove (94) constitutes the second series internal flow path.
  • connection packing (64) is a rectangular plate-shaped resin member.
  • the resin constituting the connection packing (64) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side of the connection packing (64) is attached to the surface (63a) of the connection header body (63).
  • the other side (64a) of the connecting packing (64) is attached to each housing (22).
  • the connection packing (64), or more broadly the connection header (62) integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (64a) of the connection packing (64) constitutes the first surface of the connection header (62) facing each accommodating portion (22).
  • connection packings (64) are formed with ninth to twelfth packing holes (H9 to H12), each of which is formed in a vertically long rectangular shape.
  • the ninth to twelfth packing holes (H9 to H12) penetrate the connecting packing (64) in the thickness direction.
  • the ninth packing hole (H9) communicates the low temperature side inflow port (25a) of the second accommodating portion (22b) with the fourth series connection groove (94) of the connection header body (63).
  • the tenth packing hole (H10) communicates the low temperature side outflow port (26a) of the second accommodating portion (22b) with the third series connection groove (93) of the connection header body (63).
  • the eleventh packing hole (H11) communicates the high temperature side inflow port (27a) of the third accommodating portion (22c) with the third series connection groove (93) of the connection header body (63).
  • the twelfth packing hole (H12) communicates the high temperature side outflow port (28a) of the third accommodating portion (22c) with the fourth series connection groove (94) of the connection header body (63).
  • the low temperature side outflow passage (26) of the second accommodating portion (22b) and the high temperature side inflow passage (27) of the third accommodating portion (22c) form a third series connection groove (93). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the second accommodating portion (22b) and the high temperature side outflow path (28) of the third accommodating portion (22c) are connected in series with each other via the fourth series connecting groove (94). Will be done.
  • the second accommodating portion (22b) and the third accommodating portion (22c) are connected in series with each other.
  • the heat medium pump (130) performs the first operation, the heat medium flows from the low temperature side to the high temperature side in the magnetic refrigeration module (20). Specifically, in the magnetic refrigeration module (20), the heat medium flowing in from the low temperature end inflow port (73) flows into the low temperature side inflow hole (83) of the common header main body (53). The heat medium flowing out from the low temperature side inflow hole (83) of the common header body (53) passes through the low temperature internal inflow groove (87) of the common header body (53) to the low temperature side of the third accommodating portion (22c). It flows into the inflow path (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the high temperature of the third accommodation section (22c). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the third accommodating portion (22c) passes through the fourth series connecting groove (94) of the connection header main body (63) to the second accommodating portion (22b). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the high temperature of the second accommodating portion (22b). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow passage (28) of the second accommodating portion (22b) passes through the second series connecting groove (92) of the common header main body (53) to the first accommodating portion (22a). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the high temperature of the first accommodating portion (22a). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the first accommodating portion (22a) passes through the high temperature internal outflow groove (86) of the common header main body (53) to the high temperature side of the common header main body (53). It flows into the outflow hole (82).
  • the heat medium flowing out from the high temperature side outflow hole (82) of the common header body (53) flows out to the outside of the magnetic refrigeration module (20) through the high temperature end outflow port (72).
  • the heat medium pump (130) performs the second operation, the heat medium flows from the high temperature side to the low temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the high temperature end inflow port (71) flows into the high temperature side inflow hole (81) of the common header main body (53).
  • the heat medium flowing out from the high temperature side inflow hole (81) of the common header body (53) passes through the high temperature internal inflow groove (85) of the common header body (53) and passes through the high temperature side of the first accommodating portion (22a). It flows into the inflow path (27).
  • the heat medium flowing out from the inflow path (27) on the high temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the low temperature of the first accommodating portion (22a). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the first accommodating portion (22a) passes through the first series connecting groove (91) of the common header main body (53) to the second accommodating portion (22b). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the low temperature of the second accommodating portion (22b). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the second accommodating portion (22b) passes through the third series connecting groove (93) of the connection header main body (63) to the third accommodating portion (22c). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the low temperature of the third accommodation section (22c). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the third accommodating portion (22c) passes through the low temperature internal outflow groove (88) of the common header main body (53) to the low temperature side of the common header main body (53). It flows into the outflow hole (84).
  • the heat medium flowing out from the low temperature side outflow hole (84) of the common header body (53) flows out to the outside of the magnetic refrigeration module (20) through the low temperature end outflow port (74).
  • the magnetic refrigeration module (20) of the present modification has the highest temperature, the lower temperature side inflow port (25a) and the lower temperature side outflow port (26a) of each of the above accommodating portions (22) arranged closer to the lowest temperature.
  • the high temperature side inflow port (27a) and the high temperature side outflow port (28a) of each of the accommodating portions (22) arranged closer to each other are arranged on one side in the magnetic refrigeration module (20). According to this configuration, since the four ports (25a to 28a) are on one side of the magnetic refrigeration module (20), it is possible to easily install a pipe or the like connected to each of the four ports (25a to 28a). ..
  • the header structure (32,42,52,62) has the low temperature internal inflow path (87), the low temperature internal outflow path (88), and the high temperature internal inflow.
  • the heat medium flows from the common header (52) to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • the header structure (32,42,52,62) includes the common header (52) and the connection header (62), and the low temperature internal inflow.
  • the high temperature internal outflow passage (87), the high temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86) are configured by a single layer structure provided in the common header (52).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) have a single-layer structure provided in the connection header (62). It is composed. According to this configuration, the heat medium flows from the common header (52) to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • each of the common header (52) and the connection header (62) has a first surface (54a, 64a) facing the accommodating portion (22). It has a second surface (55a, 63b) on the back side of the first surface (54a, 64a), and has a single-layer structure, the low temperature internal inflow path (87), the low temperature internal outflow path (88), and the high temperature internal.
  • the inflow path (85) and the high temperature internal outflow path (86) are composed of grooves (85 to 88) formed on the first surface (54a) side inside the common header (52), and are a single layer.
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) of the structure are the first surface inside the connection header (62). It is composed of grooves (91 to 98) formed on the (64a) side.
  • a single-layer structure low-temperature internal inflow passage (87), low-temperature internal outflow passage (88), high-temperature internal inflow passage (85), high-temperature internal outflow passage (86), and first series internal flow path (91, 93,95,97) and the second series internal flow path (92,94,96,98) are grooved (85-88,91-) formed inside the common header (52) or the connection header (62). It can be realized with a simple configuration of 98).
  • a check flow prevention unit (201,202,203,204) composed of, for example, a check valve may be provided at the series connection locations (4 locations) between the accommodating portions (22).
  • a check flow prevention unit (201,202,203,204) composed of, for example, a check valve
  • FIG. 36 the same components as those of the modification of the second embodiment shown in FIG. 16 are designated by the same reference numerals.
  • the low temperature side inflow port (25a) of the first accommodating portion (22a) (the inlet of the low temperature side inflow passage (25)) and the high temperature side outflow port (28a) (high temperature) of the second accommodating portion (22b).
  • the first backflow prevention unit (201) may be arranged at a position where the outlet of the side outflow passage (28) is connected in series.
  • the low temperature side outflow port (26a) (outlet of the low temperature side outflow path (26)) of the first accommodating portion (22a) and the high temperature side inflow port (27a) (high temperature side inflow path) of the second accommodating portion (22b).
  • the second backflow prevention unit (202) may be arranged at a position where the inlet (27) is connected in series.
  • a third backflow prevention unit (203) may be arranged at a position where the inlet (28) is connected in series. Further, the low temperature side inflow port (26b) of the second accommodating portion (22b) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the third accommodating portion (22c) (high temperature side inflow passage). The fourth backflow prevention unit (204) may be arranged at a position where the outlet (outlet) of (27) is connected in series.
  • the direction in which the heat medium flows can be defined in the flow paths (25 to 28) of each accommodating portion (22), so that it is possible to prevent the flow paths (25 to 28) from becoming dead volumes and deteriorating the performance.
  • the backflow prevention unit (201,202,203,204) is provided at all the series connection points between the accommodating units (22), but instead, at least one of the backflow prevention units (201,202,203,204) is provided. You may. Also in this case, the performance deterioration due to the dead volume can be suppressed as compared with the case where the backflow prevention unit (201,202,203,204) is not provided at all.
  • the low temperature side inflow port (25a) of the first accommodating portion (22a) (the inlet of the low temperature side inflow path (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b).
  • the outlet of the high temperature side outflow passage (28)) may be connected to the first backflow prevention unit (201).
  • the low temperature side outflow port (26a) of the first accommodating portion (22a) (exit of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the second accommodating portion (22b) (high temperature side inflow passage (high temperature side inflow passage)).
  • a second backflow prevention unit (202) may be connected to at least one of the inlets of 27).
  • a third backflow prevention unit (203) may be connected to at least one of the inlets of 28).
  • the low temperature side inflow port (26b) of the second accommodating portion (22b) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the third accommodating portion (22c) (high temperature side inflow passage (high temperature side inflow passage)
  • a fourth backflow prevention unit (204) may be connected to at least one of the outlets of 27).
  • a backflow prevention unit (201,202,203,204) is installed in the header structure (52,62) in front of the structure for series connection. It becomes possible.
  • a heat insulating layer (211,212) may be provided between the accommodating portions (22) connected in series.
  • the heat insulating layer (211,212) may be composed of a heat insulating material, slits, or the like. Further, a part of the accommodating portion (22) may be composed of a heat insulating member serving as a heat insulating layer (211,212).
  • the heat insulating layer (211,212) may be provided as a whole between the accommodating portions (22) connected in series, or may be provided as a part between the accommodating portions (22) connected in series. Good. In the configuration shown in FIG.
  • a first heat insulating layer (211) is provided between the high temperature side outflow passage (28) of the first accommodating portion (22a) through which the heat medium flows at temperature and the low temperature side inflow passage (25) of the second accommodating portion (22b). It is provided. Further, the heat medium flows between the magnetic working substance (23) in the second accommodating portion (22b) and the magnetic working substance (23) in the third accommodating portion (22c), through which the heat medium flows at different temperatures, and at different temperatures.
  • a second heat insulating layer (212) is provided between the high temperature side outflow passage (28) of the second accommodating portion (22b) and the low temperature side inflow passage (25) of the third accommodating portion (22c).
  • Embodiment 3 The third embodiment will be described.
  • the magnetic refrigeration module (20) of the present embodiment has a different number of accommodating portions (22) from the above-described first embodiment. Hereinafter, the differences from the first embodiment will be mainly described.
  • ⁇ Accommodation case> As shown in FIGS. 19 to 22, four accommodating portions (22) are accommodated in the accommodating portion case (21). Four through holes (21a) are formed in the accommodating portion case (21), and one accommodating portion (22) is accommodated in each through hole (21a).
  • the four accommodating portions (22) of the present embodiment are, in order from left to right in FIG. 20 (A), the first accommodating portion (22a), the second accommodating portion (22b), and the third accommodating portion. It may also be referred to as (22c) and the fourth containment section (22d).
  • the first accommodating portion (22a) constitutes an accommodating portion arranged at the highest temperature.
  • the fourth accommodating portion (22d) constitutes an accommodating portion arranged at the lowest temperature.
  • High temperature side header In the high temperature side header (32), the configurations of the high temperature side header main body (33) and the first high temperature side packing (34) are different from those in the first embodiment.
  • the configuration of the second high temperature side packing (35) is the same as that of the first embodiment.
  • the first series connection groove (91), the second series connection groove (92), the third series connection groove (93), and the fourth series connection groove (94) are formed by a single layer structure.
  • the high temperature internal inflow groove (85) is formed by the high temperature side inflow hole (81) and the high temperature side inflow port (27a) (specifically, the first accommodating portion (22a)) via the first high temperature side packing (34). , The entrance of the high temperature side inflow path (27) of the first accommodating portion (22a)).
  • the high temperature internal inflow groove (85) is formed in a substantially C shape that opens upward on the surface (33a) of the high temperature side header body (33).
  • the high temperature internal inflow groove (85) constitutes a high temperature internal inflow path.
  • the high temperature internal outflow groove (86) is formed through the first high temperature side packing (34), the high temperature side outflow hole (82), and the high temperature side outflow port (28a) (specifically, the first accommodating portion (22a)). , The exit of the high temperature side outflow passage (28) of the first accommodating portion (22a)).
  • the high temperature internal outflow groove (86) is formed in a substantially L shape on the surface (33a) of the high temperature side header body (33).
  • the high temperature internal outflow groove (86) constitutes a high temperature internal outflow path.
  • the first series connection groove (91) is connected to the low temperature side outflow port (26a) of the third accommodating portion (22c) via the first high temperature side packing (34) (specifically, the third accommodating portion (22c)). (Outlet of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the fourth accommodating portion (22d) (specifically, the high temperature side inflow passage (27) of the fourth accommodating portion (22d). The entrance) is connected in series.
  • the first series connection groove (91) is formed in a rectangular shape on the surface (33a) of the high temperature side header body (33).
  • the first series connection groove (91) constitutes the first series internal flow path.
  • the second series connection groove (92) passes through the first high temperature side packing (34) to the low temperature side inflow port (25a) of the third accommodating portion (22c) (specifically, the third accommodating portion (22c)). (Inlet of the low temperature side inflow path (25)) and the high temperature side outflow port (28a) of the fourth accommodating part (22d) (specifically, the high temperature side outflow path (28) of the fourth accommodating part (22d). The outlet) is connected in series.
  • the second series connection groove (92) is formed in a substantially C shape that opens downward on the surface (33a) of the high temperature side header body (33).
  • the second series connection groove (92) constitutes the second series internal flow path.
  • the third series connection groove (93) is connected to the low temperature side outflow port (26a) of the first accommodating portion (22a) via the first accommodating portion (34) (specifically, the first accommodating portion (22a)). (Outlet of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the second accommodating portion (22b) (specifically, the high temperature side inflow passage (27) of the second accommodating portion (22b) The entrance) is connected in series.
  • the third series connection groove (93) is formed in a rectangular shape on the surface (33a) of the high temperature side header body (33).
  • the third series connection groove (93) constitutes the first series internal flow path.
  • the fourth series connection groove (94) is connected to the low temperature side inflow port (25a) of the first accommodating portion (22a) via the first accommodating portion (34) (specifically, the first accommodating portion (22a)). (Inlet of the low temperature side inflow passage (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b) (specifically, the high temperature side outflow passage (28) of the second accommodating portion (22b). The outlet) is connected in series.
  • the fourth series connection groove (94) is formed in a substantially C shape that opens downward on the surface (33a) of the high temperature side header body (33).
  • the fourth series connection groove (94) constitutes the second series internal flow path.
  • the first to tenth packing holes (H1 to H10) are formed in the first high temperature side packing (34).
  • the first to tenth packing holes (H1 to H10) penetrate the first high temperature side packing (34) in the thickness direction.
  • the first packing hole (H1) communicates the high temperature side outflow port (28a) of the fourth accommodating portion (22d) with the second series connection groove (92) of the high temperature side header body (33).
  • the second packing hole (H2) communicates the high temperature side inflow port (27a) of the fourth accommodating portion (22d) with the first series connection groove (91) of the high temperature side header body (33).
  • the third packing hole (H3) communicates the low temperature side outflow port (26a) of the third accommodating portion (22c) with the first series connection groove (91) of the high temperature side header body (33).
  • the fourth packing hole (H4) communicates the low temperature side inflow port (25a) of the third accommodating portion (22c) with the second series connection groove (92) of the high temperature side header body (33).
  • the low temperature side outflow passage (26) of the third accommodating portion (22c) and the high temperature side inflow passage (27) of the fourth accommodating portion (22d) form a first series connecting groove (91). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the third accommodating portion (22c) and the high temperature side outflow path (28) of the fourth accommodating portion (22d) are connected in series with each other via the second series connecting groove (92). Will be done.
  • the third accommodating portion (22c) and the fourth accommodating portion (22d) are connected in series with each other.
  • the fifth packing hole (H5) communicates the high temperature side outflow port (28a) of the second accommodating portion (22b) with the fourth series connection groove (94) of the high temperature side header body (33).
  • the sixth packing hole (H6) communicates the high temperature side inflow port (27a) of the second accommodating portion (22b) with the third series connection groove (93) of the high temperature side header body (33).
  • the seventh packing hole (H7) communicates the low temperature side outflow port (26a) of the first accommodating portion (22a) with the third series connection groove (93) of the high temperature side header body (33).
  • the eighth packing hole (H8) communicates the low temperature side inflow port (25a) of the first accommodating portion (22a) with the fourth series connection groove (94) of the high temperature side header body (33).
  • the ninth packing hole (H9) communicates the high temperature side outflow port (28a) of the first accommodating portion (22a) with the high temperature internal outflow groove (86) of the high temperature side header body (33).
  • the tenth packing hole (H10) communicates the high temperature side inflow port (27a) of the first accommodating portion (22a) with the high temperature internal inflow groove (85) of the high temperature side header body (33).
  • the low temperature side outflow path (26) of the first accommodating portion (22a) and the high temperature side inflow path (27) of the second accommodating portion (22b) form a third series connection groove (93). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the first accommodating portion (22a) and the high temperature side outflow path (28) of the second accommodating portion (22b) are connected in series with each other via the fourth series connecting groove (94). Will be done.
  • the first accommodating portion (22a) and the second accommodating portion (22b) are connected in series with each other.
  • ⁇ Low temperature side header> In the low temperature side header (42), the configurations of the low temperature side header main body (43) and the first low temperature side packing (44) are different from those in the first embodiment.
  • the configuration of the second low temperature side packing (45) is the same as that of the first embodiment.
  • the low temperature internal inflow groove (87) is formed through the first low temperature side packing (44), the low temperature side inflow hole (83), and the low temperature side inflow port (25a) (specifically, the fourth accommodating portion (22d)). , The entrance of the low temperature side inflow path (25) of the fourth accommodating portion (22d)).
  • the low temperature internal inflow groove (87) is formed in a substantially L shape on the surface (43a) of the low temperature side header body (43).
  • the low temperature internal inflow groove (87) constitutes a low temperature internal inflow path.
  • the low temperature internal outflow groove (88) is formed through the first low temperature side packing (44), the low temperature side outflow hole (84), and the low temperature side outflow port (26a) (specifically, the fourth accommodating portion (22d)). , The exit of the low temperature side outflow passage (26) of the fourth accommodating portion (22d)).
  • the low temperature internal outflow groove (88) is formed in a substantially J shape on the surface (43a) of the low temperature side header body (43).
  • the low temperature internal outflow groove (88) constitutes a low temperature internal outflow channel.
  • the fifth series connection groove (95) passes through the first low temperature side packing (44) to the low temperature side outflow port (26a) of the second accommodating portion (22b) (specifically, the second accommodating portion (22b)). (Outlet of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the third accommodating portion (22c) (specifically, the high temperature side inflow passage (27) of the third accommodating portion (22c). The entrance) is connected in series.
  • the fifth series connection groove (95) is formed in a rectangular shape on the surface (43a) of the low temperature side header body (43).
  • the fifth series connection groove (95) constitutes the first series internal flow path.
  • the sixth series connection groove (96) is provided through the first low temperature side packing (44) to the low temperature side inflow port (25a) of the second accommodating portion (22b) (specifically, the second accommodating portion (22b)). (Inlet of the low temperature side inflow path (25)) and the high temperature side outflow port (28a) of the third accommodating portion (22c) (specifically, the high temperature side outflow path (28) of the third accommodating portion (22c). The outlet) is connected in series.
  • the sixth series connection groove (96) is formed in a substantially C shape that opens upward on the surface (43a) of the low temperature side header body (43).
  • the sixth series connection groove (96) constitutes the second series internal flow path.
  • the thirteenth packing hole (H13) communicates the high temperature side inflow port (27a) of the third accommodating portion (22c) with the fifth series connection groove (95) of the low temperature side header body (43).
  • the 14th packing hole (H14) communicates the high temperature side outflow port (28a) of the third accommodating portion (22c) with the 6th series connection groove (96) of the low temperature side header body (43).
  • the fifteenth packing hole (H15) communicates the low temperature side inflow port (25a) of the fourth accommodating portion (22d) with the low temperature internal inflow groove (87) of the low temperature side header body (43).
  • the 16th packing hole (H16) communicates the low temperature side outflow port (26a) of the 4th accommodating portion (22d) with the low temperature internal outflow groove (88) of the low temperature side header body (43).
  • the low temperature side outflow passage (26) of the second accommodating portion (22b) and the high temperature side inflow passage (27) of the third accommodating portion (22c) form a fifth series connecting groove (95). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the second accommodating portion (22b) and the high temperature side outflow path (28) of the third accommodating portion (22c) are connected in series with each other via the sixth series connecting groove (96). Will be done.
  • the second accommodating portion (22b) and the third accommodating portion (22c) are connected in series with each other.
  • the heat medium pump (130) performs the first operation, the heat medium flows from the low temperature side to the high temperature side in the magnetic refrigeration module (20). Specifically, in the magnetic refrigeration module (20), the heat medium flowing in from the low temperature end inflow port (73) flows into the low temperature side inflow hole (83) of the low temperature side header main body (43). The heat medium flowing out from the low temperature side inflow hole (83) of the low temperature side header main body (43) passes through the low temperature internal inflow groove (87) of the low temperature side header main body (43) to the fourth accommodating portion (22d). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the 4th housing (22d) flows through the magnetic working substance (23) of the 4th housing (22d), and then the high temperature of the 4th housing (22d). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow passage (28) of the fourth accommodating portion (22d) passes through the second series connection groove (92) of the high temperature side header main body (33) and is passed through the third accommodating portion (22c). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the high temperature of the third accommodation section (22c). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow passage (28) of the third accommodating portion (22c) passes through the sixth series connecting groove (96) of the low temperature side header main body (43) to the second accommodating portion (22b). Inflow into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the high temperature of the second accommodating portion (22b). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the second accommodating portion (22b) passes through the fourth series connecting groove (94) of the high temperature side header main body (33) and is passed through the first accommodating portion (22a). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the high temperature of the first accommodating portion (22a). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow passage (28) of the first accommodating portion (22a) passes through the high temperature internal outflow groove (86) of the high temperature side header main body (33) to the high temperature side header main body (33). It flows into the high temperature side outflow hole (82).
  • the heat medium flowing out from the high temperature side outflow hole (82) of the high temperature side header body (33) flows out to the outside of the magnetic refrigeration module (20) through the high temperature end outflow port (72).
  • the heat medium pump (130) performs the second operation, the heat medium flows from the high temperature side to the low temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the high temperature end inflow port (71) flows into the high temperature side inflow hole (81) of the high temperature side header main body (33).
  • the heat medium flowing out from the high temperature side inflow hole (81) of the high temperature side header body (33) passes through the high temperature internal inflow groove (85) of the high temperature side header body (33) and is of the first accommodating portion (22a). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the inflow path (27) on the high temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the low temperature of the first accommodating portion (22a). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the first accommodating portion (22a) passes through the third series connection groove (93) of the high temperature side header main body (33) and is passed through the second accommodating portion (22b). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the low temperature of the second accommodating portion (22b). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the second accommodating portion (22b) passes through the fifth series connecting groove (95) of the low temperature side header main body (43) and is passed through the third accommodating portion (22c). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the low temperature of the third accommodation section (22c). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the third accommodating portion (22c) passes through the first series connection groove (91) of the high temperature side header main body (33) and is passed through the fourth accommodating portion (22d). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the 4th housing (22d) flows through the magnetic working substance (23) of the 4th housing (22d), and then the low temperature of the 4th housing (22d). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the fourth accommodating portion (22d) passes through the low temperature internal outflow groove (88) of the low temperature side header main body (43) to the low temperature side header main body (43). It flows into the low temperature side outflow hole (84).
  • the heat medium flowing out from the low temperature side outflow hole (84) of the low temperature side header body (43) flows out to the outside of the magnetic refrigeration module (20) through the low temperature end outflow port
  • the magnetic refrigeration module (20) of the present embodiment also has the same effect as that of the first embodiment.
  • the flow path for connecting the accommodating portions (22) in series is separated by the outward path and the return path, but in reality, the heat medium is in either direction. Can flow, so that the flow path becomes a dead volume and the performance deteriorates.
  • a check flow prevention unit (201,202,203,204,205,206) composed of, for example, a check valve may be provided at the series connection locations (6 locations) between the accommodating portions (22).
  • a check flow prevention unit (201,202,203,204,205,206) composed of, for example, a check valve may be provided at the series connection locations (6 locations) between the accommodating portions (22).
  • the low temperature side inflow port (25a) of the first accommodating portion (22a) (the inlet of the low temperature side inflow passage (25)) and the high temperature side outflow port (28a) (high temperature) of the second accommodating portion (22b).
  • the first backflow prevention unit (201) may be arranged at a position where the outlet of the side outflow passage (28) is connected in series.
  • the low temperature side outflow port (26a) (outlet of the low temperature side outflow path (26)) of the first accommodating portion (22a) and the high temperature side inflow port (27a) (high temperature side inflow path) of the second accommodating portion (22b).
  • the second backflow prevention unit (202) may be arranged at a position where the inlet (27) is connected in series.
  • a third backflow prevention unit (203) may be arranged at a position where the inlet (28) is connected in series. Further, the low temperature side inflow port (26b) of the second accommodating portion (22b) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the third accommodating portion (22c) (high temperature side inflow passage). The fourth backflow prevention unit (204) may be arranged at a position where the outlet (outlet) of (27) is connected in series.
  • the fifth backflow prevention unit (205) may be arranged at a position where the outlet (28) is connected in series.
  • the sixth backflow prevention unit (206) may be arranged at a position where the inlet (27) is connected in series.
  • the direction in which the heat medium flows can be defined in the flow paths (25 to 28) of each accommodating portion (22), so that it is possible to prevent the flow paths (25 to 28) from becoming dead volumes and deteriorating the performance.
  • the backflow prevention unit (201,202,203,204,205,206) is provided at all the series connection points between the accommodating units (22), but instead, at least one of the backflow prevention units (201,202,203,204,205,206) is provided. You may. Also in this case, the performance deterioration due to the dead volume can be suppressed as compared with the case where the backflow prevention unit (201,202,203,204,205,206) is not provided at all.
  • the low temperature side inflow port (25a) of the first accommodating portion (22a) (the inlet of the low temperature side inflow path (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b).
  • the outlet of the high temperature side outflow passage (28)) may be connected to the first backflow prevention unit (201).
  • the low temperature side outflow port (26a) of the first accommodating portion (22a) (exit of the low temperature side outflow passage (26)) and the high temperature side inflow port (27a) of the second accommodating portion (22b) (high temperature side inflow passage (high temperature side inflow passage)).
  • a second backflow prevention unit (202) may be connected to at least one of the inlets of 27).
  • the low temperature side outflow port (25b) of the second accommodating portion (22b) exit of the low temperature side inflow passage (25)
  • the high temperature side inflow port (28b) of the third accommodating portion (22c) high temperature side outflow passage (high temperature side outflow passage)
  • a third backflow prevention unit (203) may be connected to at least one of the inlets of 28).
  • the low temperature side inflow port (26b) of the second accommodating portion (22b) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the third accommodating portion (22c) (high temperature side inflow passage (high temperature side inflow passage)
  • a fourth backflow prevention unit (204) may be connected to at least one of the outlets of 27).
  • a fifth backflow prevention unit (205) may be connected to at least one of the outlets of 28).
  • the low temperature side outflow port (26a) of the third accommodating portion (22c) exit of the low temperature side outflow passage (26)
  • the high temperature side inflow port (27a) of the fourth accommodating portion (22d) high temperature side inflow passage (high temperature side inflow passage)
  • the sixth backflow prevention unit (206) may be connected to at least one of the inlets of 27). In this way, as described in the first embodiment (see FIGS. 32 and 33), a backflow prevention unit (201,202,203,204,205,206) is installed in the header structure (32,42) in front of the structure for series connection. It becomes possible.
  • a heat insulating layer (211,212,213) may be provided between the accommodating portions (22) connected in series.
  • the heat insulating layer (211,212,213) may be composed of a heat insulating material, slits, or the like.
  • a part of the accommodating portion (22) may be composed of a heat insulating member serving as a heat insulating layer (211,212,213).
  • the heat insulating layer (211,212,213) may be provided as a whole between the accommodating portions (22) connected in series, or may be provided as a part between the accommodating portions (22) connected in series. Good. In the configuration shown in FIG.
  • a first heat insulating layer (211) is provided between the high temperature side outflow passage (28) of the first accommodating portion (22a) through which the heat medium flows at temperature and the low temperature side inflow passage (25) of the second accommodating portion (22b). It is provided. Further, the heat medium flows between the magnetic working substance (23) in the second accommodating portion (22b) and the magnetic working substance (23) in the third accommodating portion (22c), through which the heat medium flows at different temperatures, and at different temperatures.
  • a second heat insulating layer (212) is provided between the high temperature side outflow passage (28) of the second accommodating portion (22b) and the low temperature side inflow passage (25) of the third accommodating portion (22c). Further, the heat medium flows between the magnetic working substance (23) in the third accommodating portion (22c) and the magnetic working substance (23) in the fourth accommodating portion (22d), through which the heat medium flows at different temperatures, and at different temperatures.
  • a third heat insulating layer (213) is provided between the high temperature side outflow passage (28) of the third accommodating portion (22c) and the low temperature side inflow passage (25) of the fourth accommodating portion (22d).
  • Embodiment 3 A modified example of the third embodiment will be described.
  • the magnetic refrigeration module (20) of this modification is different from the third embodiment in that it includes a common header (52) and a connection header (62).
  • the differences from the third embodiment will be mainly described.
  • the magnetic refrigeration module (20) includes a housing portion case (21), a common header case (51), and a connection header case (61), each of which is formed in a rectangular parallelepiped shape. Be prepared.
  • a common header case (51) is integrally attached to one side surface (left side surface of FIG. 23) of the accommodating portion case (21).
  • a connection header case (61) is integrally attached to another side surface (right side surface of FIG. 23) of the accommodating portion case (21).
  • the common header case (51) houses the common header (52).
  • the common header case (51) includes a hot end inflow port (71), a hot end outflow port (72), a cold end inflow port (73), and a cold end outflow port (74).
  • the common header (52) is arranged so as to be in contact with each accommodating portion (22) in the common header case (51).
  • the common header (52) includes a common header main body (53), a first common packing (54), and a second common packing (55).
  • the common header (52) constitutes a header structure.
  • the common header body (53) is formed in a slightly flat rectangular parallelepiped shape.
  • the common header body (53) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the common header body (53) has a front surface (53a) in contact with the first common packing (54) and a back surface (53b) in contact with the second common packing (55).
  • the common header body (53) is formed with a high temperature side inflow hole (81) and a high temperature side outflow hole (82), each of which penetrates the common header body (53) in the thickness direction (left-right direction in FIG. 23). ..
  • a low temperature side inflow hole (83) and a low temperature side outflow hole (84) are formed in the common header body (53).
  • a high temperature internal inflow groove (85), high temperature internal outflow groove (86), low temperature internal inflow groove (87), low temperature internal outflow groove (88), first series connection groove (91), and second series connection groove (92) have a multi-layer structure. Is formed by.
  • the multi-layer structure refers to both the front surface (33a, 43a, 53a, 63a) and the back surface (33b, 43b, 53b, 63b) of each header body (33,43,53,63), or in addition to it.
  • This is a structure in which a flow path through which a heat medium flows (for example, each groove (85 to 88, 91 to 98)) is formed inside each header body (33,43,53,63).
  • the high temperature internal inflow groove (85) is formed by the high temperature side inflow hole (81) and the high temperature side inflow port (27a) (specifically, the first accommodating portion (22a)) via the first common packing (54). It communicates with the high temperature side inflow path (27) of the first accommodating portion (22a)).
  • the high temperature internal inflow groove (85) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the high temperature internal inflow groove (85) constitutes a high temperature internal inflow path.
  • the high temperature internal outflow groove (86) is formed through the first common packing (54), the high temperature side outflow hole (82), and the high temperature side outflow port (28a) (specifically, the first accommodating portion (22a)). It communicates with the outlet of the high temperature side outflow passage (28) of the first accommodating portion (22a).
  • the high temperature internal outflow groove (86) is formed in a substantially L shape on the surface (53a) of the common header body (53).
  • the high temperature internal outflow groove (86) constitutes a high temperature internal outflow path.
  • the low temperature internal inflow groove (87) is formed through the through hole (87a) formed at the bottom thereof and the first common packing (54), and the low temperature side inflow port (25a) (specifically) of the fourth accommodating portion (22d). (The entrance of the low temperature side inflow path (25) of the fourth accommodating portion (22d)).
  • the low temperature internal inflow groove (87) is formed in a substantially L shape on the back surface (53b) of the common header body (53).
  • the low temperature internal inflow groove (87) constitutes a low temperature internal inflow path.
  • the low temperature internal outflow groove (88) is formed through the through hole (88a) formed at the bottom thereof and the first common packing (54), and the low temperature side outflow port (26a) (specifically) of the fourth accommodating portion (22d). Is connected to the exit of the low temperature side outflow channel (26) of the fourth accommodating portion (22d).
  • the low temperature internal outflow groove (88) is formed in a substantially rectangular shape on the back surface (53b) of the common header body (53).
  • the low temperature internal outflow groove (88) constitutes a low temperature internal outflow channel.
  • the first series connection groove (91) is connected to the low temperature side outflow port (26a) of the second accommodating portion (22b) (specifically, the second accommodating portion (22b)) via the first common packing (54).
  • the first series connection groove (91) is formed in a rectangular shape on the surface (53a) of the common header body (53).
  • the first series connection groove (91) constitutes the first series internal flow path.
  • the second series connection groove (92) is connected to the low temperature side inflow port (25a) of the second accommodating portion (22b) (specifically, the first accommodating portion (22a)) via the first common packing (54).
  • the second series connection groove (92) is formed in a substantially C shape that opens upward on the surface (53a) of the common header body (53).
  • the second series connection groove (92) constitutes the second series internal flow path.
  • the first common packing (54) is a rectangular plate-shaped resin member.
  • the resin constituting the first common packing (54) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the first common packing (54) is attached to the surface (53a) of the common header body (53).
  • the other side surface (54a) of the first common packing (54) is attached to each accommodating portion (22).
  • the first common packing (54) more broadly the common header (52), integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (54a) of the first common packing (54) constitutes the first side surface of the common header (52) facing each accommodating portion (22).
  • the first common packing (54) is formed with first to eighth packing holes (H1 to H8), each of which is formed in a vertically long rectangular shape.
  • the first to eighth packing holes (H1 to H8) penetrate the first common packing (54) in the thickness direction.
  • the first packing hole (H1) communicates the low temperature side outflow port (26a) of the fourth accommodating portion (22d) with the low temperature internal outflow groove (88) of the common header body (53).
  • the second packing hole (H2) communicates the low temperature side inflow port (25a) of the fourth accommodating portion (22d) with the low temperature internal inflow groove (87) of the common header body (53).
  • the third packing hole (H3) communicates the high temperature side outflow port (28a) of the third accommodating portion (22c) with the second series connecting groove (92) of the common header body (53).
  • the fourth packing hole (H4) communicates the high temperature side inflow port (27a) of the third accommodating portion (22c) with the first series connecting groove (91) of the common header body (53).
  • the fifth packing hole (H5) communicates the low temperature side outflow port (26a) of the second accommodating portion (22b) with the first series connecting groove (91) of the common header body (53).
  • the sixth packing hole (H6) communicates the low temperature side inflow port (25a) of the second accommodating portion (22b) with the second series connecting groove (92) of the common header body (53).
  • the seventh packing hole (H7) communicates the high temperature side outflow port (28a) of the first accommodating portion (22a) with the high temperature internal outflow groove (86) of the common header body (53).
  • the eighth packing hole (H8) communicates the high temperature side inflow port (27a) of the first accommodating portion (22a) with the high temperature internal inflow groove (85) of the common header body (53).
  • the low temperature side outflow passage (26) of the second accommodating portion (22b) and the high temperature side inflow passage (27) of the third accommodating portion (22c) form a first series connecting groove (91). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the second accommodating portion (22b) and the high temperature side outflow path (28) of the third accommodating portion (22c) are connected in series with each other via the second series connecting groove (92). Will be done.
  • the second accommodating portion (22b) and the third accommodating portion (22c) are connected in series with each other.
  • the second common packing (55) is a rectangular plate-shaped resin member.
  • the resin constituting the second common packing (55) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side surface of the second common packing (55) is attached to the back surface (53b) of the common header body (53).
  • the other side surface (55a) of the second common packing (55) constitutes the second surface on the back side of the first surface of the common header (52).
  • the second common packing (55) includes a high temperature side outflow packing hole (101), a high temperature side inflow packing hole (102), a low temperature side outflow packing hole (103), and a low temperature side inflow packing, each of which is formed in a circular shape.
  • a hole (104) is formed.
  • the high temperature side outflow packing hole (101), the high temperature side inflow packing hole (102), the low temperature side outflow packing hole (103), and the low temperature side inflow packing hole (104) have the second common packing (55) in the thickness direction. Penetrate.
  • the high temperature side outflow packing hole (101) communicates the high temperature end outflow port (72) with the high temperature side outflow hole (82) of the common header body (53).
  • the high temperature side inflow packing hole (102) communicates the high temperature end inflow port (71) with the high temperature side inflow hole (81) of the common header body (53).
  • the low temperature side outflow packing hole (103) communicates the low temperature end outflow port (74) with the low temperature internal outflow groove (88) of the common header body (53).
  • the low temperature side inflow packing hole (104) communicates the low temperature end inflow port (73) with the low temperature internal inflow groove (87) of the common header body (53).
  • connection header case (61) houses the connection header (62).
  • the connection header (62) is arranged so as to be in contact with each accommodating portion (22) inside the connection header case (61).
  • the connection header (62) includes a connection header main body (63) and a connection packing (64).
  • the connection header (62) constitutes a header structure.
  • connection header body (63) is formed in a slightly flat rectangular parallelepiped shape.
  • the connection header body (63) is made of a non-magnetic material (for example, resin) having a thermal conductivity of 10 W / m or less.
  • the connection header body (63) has a front surface (63a) in contact with the connection packing (64) and a back surface (63b) on the back side thereof.
  • On the surface (63a) of the connection header body (63) (in other words, on the first surface side inside the connection header (62)), the third series connection groove (93), the fourth series connection groove (94).
  • the fifth series connection groove (95), and the sixth series connection groove (96) are formed by a single layer structure.
  • the back surface of the connection header body (63) constitutes the second surface of the connection header (62).
  • the third series connection groove (93) is connected to the low temperature side outflow port (26a) of the first accommodating portion (22a) (specifically, the low temperature side of the first accommodating portion (22a)) via the connection packing (64). Outflow path (26) outlet) and high temperature side inflow port (27a) of the second accommodating section (22b) (specifically, the inlet of the high temperature side inflow path (27) of the second accommodating section (22b)) To communicate.
  • the third series connection groove (93) is formed in a rectangular shape on the surface (63a) of the connection header body (63).
  • the third series connection groove (93) constitutes the first series internal flow path.
  • the fourth series connecting groove (94) is connected to the low temperature side inflow port (25a) of the first accommodating portion (22a) (specifically, the low temperature side of the first accommodating portion (22a)) via the connecting packing (64).
  • the inlet of the inflow passage (25)) and the high temperature side outflow port (28a) of the second accommodating portion (22b) (specifically, the exit of the high temperature side outflow passage (28) of the second accommodating portion (22b)).
  • the fourth series connection groove (94) is formed in a substantially C shape that opens downward on the surface (63a) of the connection header body (63).
  • the fourth series connection groove (94) constitutes the second series internal flow path.
  • the fifth series connection groove (95) is connected to the low temperature side outflow port (26a) of the third accommodating portion (22c) (specifically, the low temperature side of the third accommodating portion (22c)) via the connection packing (64).
  • the fifth series connection groove (95) is formed in a rectangular shape on the surface (63a) of the connection header body (63).
  • the fifth series connection groove (95) constitutes the first series internal flow path.
  • the sixth series connecting groove (96) is connected to the low temperature side inflow port (25a) of the third accommodating portion (22c) (specifically, the low temperature side of the third accommodating portion (22c)) via the connecting packing (64).
  • the inlet of the inflow passage (25)) and the high temperature side outflow port (28a) of the fourth accommodating portion (22d) (specifically, the exit of the high temperature side outflow passage (28) of the fourth accommodating portion (22d)).
  • the sixth series connection groove (96) is formed in a substantially C shape that opens downward on the surface (63a) of the connection header body (63).
  • the sixth series connection groove (96) constitutes the second series internal flow path.
  • connection packing (64) is a rectangular plate-shaped resin member.
  • the resin constituting the connection packing (64) is a non-magnetic material having a thermal conductivity of 10 W / m or less.
  • One side of the connection packing (64) is attached to the surface (63a) of the connection header body (63).
  • the other side (64a) of the connecting packing (64) is attached to each housing (22).
  • the connection packing (64), or more broadly the connection header (62) integrates the plurality of accommodating portions (22) with each other.
  • the other side surface (64a) of the connection packing (64) constitutes the first surface of the connection header (62) facing each accommodating portion (22).
  • connection packings (64) are formed with 9th to 16th packing holes (H9 to H16), each of which is formed in a vertically long rectangular shape.
  • the 9th to 16th packing holes (H9 to H16) penetrate the connecting packing (64) in the thickness direction.
  • the ninth packing hole (H9) communicates the low temperature side inflow port (25a) of the first accommodating portion (22a) with the fourth series connection groove (94) of the connection header body (63).
  • the tenth packing hole (H10) communicates the low temperature side outflow port (26a) of the first accommodating portion (22a) with the third series connection groove (93) of the connection header body (63).
  • the eleventh packing hole (H11) communicates the high temperature side inflow port (27a) of the second accommodating portion (22b) with the third series connection groove (93) of the connection header body (63).
  • the twelfth packing hole (H12) communicates the high temperature side outflow port (28a) of the second accommodating portion (22b) with the fourth series connection groove (94) of the connection header body (63).
  • the low temperature side outflow path (26) of the first accommodating portion (22a) and the high temperature side inflow path (27) of the second accommodating portion (22b) form a third series connection groove (93). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the first accommodating portion (22a) and the high temperature side outflow path (28) of the second accommodating portion (22b) are connected in series with each other via the fourth series connecting groove (94). Will be done.
  • the first accommodating portion (22a) and the second accommodating portion (22b) are connected in series with each other.
  • the 13th packing hole (H13) communicates the low temperature side inflow port (25a) of the 3rd accommodating portion (22c) with the 6th series connection groove (96) of the connection header body (63).
  • the 14th packing hole (H14) communicates the low temperature side outflow port (26a) of the 3rd accommodating portion (22c) with the 5th series connection groove (95) of the connection header body (63).
  • the fifteenth packing hole (H15) communicates the high temperature side inflow port (27a) of the fourth accommodating portion (22d) with the fifth series connection groove (95) of the connection header body (63).
  • the 16th packing hole (H16) communicates the high temperature side outflow port (28a) of the 4th accommodating portion (22d) with the 6th series connection groove (96) of the connection header body (63).
  • the low temperature side outflow passage (26) of the third accommodating portion (22c) and the high temperature side inflow passage (27) of the fourth accommodating portion (22d) form a fifth series connecting groove (95). They are connected in series with each other via.
  • the low temperature side inflow path (25) of the third accommodating portion (22c) and the high temperature side outflow path (28) of the fourth accommodating portion (22d) are connected in series with each other via the sixth series connecting groove (96). Will be done.
  • the third accommodating portion (22c) and the fourth accommodating portion (22d) are connected in series with each other.
  • the heat medium pump (130) performs the first operation, the heat medium flows from the low temperature side to the high temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the low temperature end inflow port (73) flows into the low temperature internal inflow groove (87) of the common header main body (53).
  • the heat medium flowing out from the low temperature internal inflow groove (87) flows into the low temperature side inflow path (25) of the fourth accommodating portion (22d).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the 4th housing (22d) flows through the magnetic working substance (23) of the 4th housing (22d), and then the high temperature of the 4th housing (22d). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the fourth accommodating portion (22d) passes through the sixth series connecting groove (96) of the connection header main body (63) to the third accommodating portion (22c). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the high temperature of the third accommodation section (22c). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the third accommodating portion (22c) passes through the second series connecting groove (92) of the common header main body (53) to the second accommodating portion (22b). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the high temperature of the second accommodating portion (22b). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the second accommodating portion (22b) passes through the fourth series connecting groove (94) of the connection header main body (63) to the first accommodating portion (22a). It flows into the low temperature side inflow channel (25).
  • the heat medium flowing out from the inflow path (25) on the low temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the high temperature of the first accommodating portion (22a). It flows into the side outflow channel (28).
  • the heat medium flowing out from the high temperature side outflow path (28) of the first accommodating portion (22a) passes through the high temperature internal outflow groove (86) of the common header main body (53) to the high temperature side of the common header main body (53). It flows into the outflow hole (82).
  • the heat medium flowing out from the high temperature side outflow hole (82) of the common header body (53) flows out to the outside of the magnetic refrigeration module (20) through the high temperature end outflow port (72).
  • the heat medium pump (130) performs the second operation, the heat medium flows from the high temperature side to the low temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the high temperature end inflow port (71) flows into the high temperature side inflow hole (81) of the common header main body (53).
  • the heat medium flowing out from the high temperature side inflow hole (81) of the common header body (53) passes through the high temperature internal inflow groove (85) of the common header body (53) and passes through the high temperature side of the first accommodating portion (22a). It flows into the inflow path (27).
  • the heat medium flowing out from the inflow path (27) on the high temperature side of the first accommodating portion (22a) flows through the magnetic working substance (23) of the first accommodating portion (22a), and then the low temperature of the first accommodating portion (22a). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the first accommodating portion (22a) passes through the third series connecting groove (93) of the connection header main body (63) to the second accommodating portion (22b). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the second accommodating portion (22b) flows through the magnetic working substance (23) of the second accommodating portion (22b), and then the low temperature of the second accommodating portion (22b). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the second accommodating portion (22b) passes through the first series connecting groove (91) of the common header main body (53) to the third accommodating portion (22c). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the third accommodation section (22c) flows through the magnetic working substance (23) of the third accommodation section (22c), and then the low temperature of the third accommodation section (22c). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow path (26) of the third accommodating portion (22c) passes through the fifth series connecting groove (95) of the connection header main body (63) to the fourth accommodating portion (22d). It flows into the high temperature side inflow channel (27).
  • the heat medium flowing out from the high temperature side inflow path (27) of the 4th housing (22d) flows through the magnetic working substance (23) of the 4th housing (22d), and then the low temperature of the 4th housing (22d). It flows into the side outflow channel (26).
  • the heat medium flowing out from the low temperature side outflow passage (26) of the fourth accommodating portion (22d) passes through the low temperature internal outflow groove (88) of the low temperature side header body (43) and then passes through the low temperature end outflow port (74). It flows out to the outside of the magnetic refrigeration module (20) through.
  • the magnetic refrigeration module (20) of the present modification also has the same effect as that of the third embodiment.
  • the magnetic refrigeration module (20) of the present modification has the highest temperature, the lower temperature side inflow port (25a) and the lower temperature side outflow port (26a) of each of the above accommodating portions (22) arranged closer to the lowest temperature.
  • the high temperature side inflow port (27a) and the high temperature side outflow port (28a) of each of the accommodating portions (22) arranged closer to each other are arranged on one side in the magnetic refrigeration module (20). According to this configuration, since the four ports (25a to 28a) are on one side of the magnetic refrigeration module (20), it is possible to easily install a pipe or the like connected to each of the four ports (25a to 28a). ..
  • the header structure (32,42,52,62) has the low temperature internal inflow path (87), the low temperature internal outflow path (88), and the high temperature internal inflow.
  • the heat medium flows from the common header (52) to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • the magnetic refrigeration module (20) of the present modification includes the low temperature internal inflow path (87), the low temperature internal outflow path (88), the high temperature internal inflow path (85), and the high temperature internal outflow path (86).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) are attached to the common header (52) or the connection header (62). It is composed of a single-layer structure or a multi-layer structure provided.
  • low temperature internal inflow passage (87), low temperature internal outflow passage (88), high temperature internal inflow passage (85), high temperature internal outflow passage (86), first series internal flow path (91,93,95, 97) and the second series internal flow path (92,94,96,98) are configured with a single layer structure so that each header (32,42,52,62) can be easily manufactured, while they are multi-layered.
  • Each header (32, 42, 52, 62) can be miniaturized by constructing the structure.
  • the header structure (32,42,52,62) includes the common header (52) and the connection header (62), and the low temperature internal inflow.
  • the high temperature internal outflow passage (87), the high temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86) are configured by a multi-layer structure provided in the common header (52).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) have a single-layer structure provided in the connection header (62). It is composed. According to this configuration, the heat medium flows from the common header (52) to the common header (52) via the plurality of accommodating portions (22) and the connection header (62).
  • the common header (52) can be easily manufactured by forming the second series internal flow path (92,94,96,98) with a single-layer structure.
  • the connection header (62) can be miniaturized by configuring them in a multi-layer structure.
  • each of the common header (52) and the connection header (62) has a first surface (54a, 64a) facing the accommodating portion (22). It has a second surface (55a, 63b) on the back side of the first surface (54a, 64a), and has a multi-layer structure, the low temperature internal inflow path (87), the low temperature internal outflow path (88), and the high temperature internal.
  • the inflow path (85) and the high temperature internal outflow path (86) are formed on at least one of the first surface (54a) side and the second surface (55a) side inside the common header (52).
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) having a single-layer structure composed of grooves (85 to 88) are described above.
  • 97) and the second series internal flow path (92,94,96,98) are formed on the first surface (64a) side or the second surface (63b) side inside the connection header (62). It is composed of grooves (91-98).
  • a single-layer structure or a multi-layer structure a low-temperature internal inflow channel (87), a low-temperature internal outflow channel (88), a high-temperature internal inflow path (85), a high-temperature internal outflow channel (86), and a first series internal flow.
  • the road (91,93,95,97) and the second series internal flow path (92,94,96,98) are grooved (85-) formed inside the common header (52) or the connection header (62). It can be realized with a simple configuration of 88,91 to 98).
  • the flow path for connecting the accommodating portions (22) in series is separated by the outward path and the return path, but in reality, which direction is used.
  • the flow path becomes a dead volume and the performance deteriorates.
  • a check flow prevention unit (201,202,203,204,205,206) composed of, for example, a check valve may be provided at the series connection locations (6 locations) between the accommodating portions (22).
  • a check flow prevention unit (201,202,203,204,205,206) composed of, for example, a check valve may be provided at the series connection locations (6 locations) between the accommodating portions (22).
  • the low temperature side outflow port (25b) of the first accommodating portion (22a) (the outlet of the low temperature side inflow path (25)) and the high temperature side inflow port (28b) (high temperature) of the second accommodating portion (22b).
  • the first backflow prevention unit (201) may be arranged at a position where the side outflow path (28) is connected in series.
  • the low temperature side inflow port (26b) of the first accommodating portion (22a) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the second accommodating portion (22b) (high temperature side inflow passage).
  • the second backflow prevention unit (202) may be arranged at a position where the outlet (outlet) of (27) is connected in series.
  • a third backflow prevention unit (203) may be arranged at a location where the outlet (28) is connected in series. Further, the low temperature side outflow port (26a) (low temperature side outflow passage (26) outlet) of the second accommodating portion (22b) and the high temperature side inflow port (27a) (high temperature side inflow passage) of the third accommodating portion (22c). The fourth backflow prevention unit (204) may be arranged at a position where the inlet (27) is connected in series.
  • the fifth backflow prevention unit (205) may be arranged at a position where the inlet (28) is connected in series.
  • the low temperature side inflow port (26b) (low temperature side outflow passage (26) inlet) of the third accommodating portion (22c) and the high temperature side outflow port (27b) (high temperature side inflow passage) of the fourth accommodating portion (22d).
  • the sixth backflow prevention unit (206) may be arranged at a position where the outlet of (27) is connected in series.
  • the direction in which the heat medium flows can be defined in the flow paths (25 to 28) of each accommodating portion (22), so that it is possible to prevent the flow paths (25 to 28) from becoming dead volumes and deteriorating the performance.
  • the backflow prevention section (201,202,203,204,205,206) is provided at all the series connection points between the accommodating sections (22), but instead, at least one of the backflow prevention section (201,202,203,204,205,206) is provided. You may. Also in this case, the performance deterioration due to the dead volume can be suppressed as compared with the case where the backflow prevention unit (201,202,203,204,205,206) is not provided at all.
  • the low temperature side outflow port (25b) of the first accommodating portion (22a) (exit of the low temperature side inflow path (25)) and the high temperature side inflow port (28b) of the second accommodating portion (22b). ) (The inlet of the high temperature side outflow passage (28)) may be connected to the first backflow prevention unit (201).
  • the low temperature side inflow port (26b) of the first accommodating portion (22a) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the second accommodating portion (22b) (high temperature side inflow passage (high temperature side inflow passage)
  • a second backflow prevention unit (202) may be connected to at least one of the outlets of 27).
  • the low temperature side inflow port (25a) of the second accommodating portion (22b) (the inlet of the low temperature side inflow passage (25)) and the high temperature side outflow port (28a) of the third accommodating portion (22c) (high temperature side outflow passage (high temperature side outflow passage)).
  • a third backflow prevention unit (203) may be connected to at least one of the outlets of 28).
  • the low temperature side outflow port (26a) of the second accommodating portion (22b) exit of the low temperature side outflow passage (26)
  • the high temperature side inflow port (27a) of the third accommodating portion (22c) (high temperature side inflow passage (high temperature side inflow passage)
  • a fourth backflow prevention unit (204) may be connected to at least one of the inlets of 27).
  • a fifth backflow prevention unit (205) may be connected to at least one of the inlets of 28).
  • the low temperature side inflow port (26b) of the third accommodating portion (22c) (the inlet of the low temperature side outflow passage (26)) and the high temperature side outflow port (27b) of the fourth accommodating portion (22d) (high temperature side inflow passage (high temperature side inflow passage)
  • the sixth backflow prevention unit (206) may be connected to at least one of the outlets of 27).
  • a heat insulating layer (211,212,213) may be provided between the accommodating portions (22) connected in series.
  • the heat insulating layer (211,212,213) may be composed of a heat insulating material, slits, or the like.
  • a part of the accommodating portion (22) may be composed of a heat insulating member serving as a heat insulating layer (211,212,213).
  • the heat insulating layer (211,212,213) may be provided as a whole between the accommodating portions (22) connected in series, or may be provided as a part between the accommodating portions (22) connected in series. Good. In the configuration shown in FIG.
  • a first heat insulating layer (211) is provided between the high temperature side outflow passage (28) of the first accommodating portion (22a) through which the heat medium flows at temperature and the low temperature side inflow passage (25) of the second accommodating portion (22b). It is provided. Further, the heat medium flows between the magnetic working substance (23) in the second accommodating portion (22b) and the magnetic working substance (23) in the third accommodating portion (22c), through which the heat medium flows at different temperatures, and at different temperatures.
  • a second heat insulating layer (212) is provided between the high temperature side outflow passage (28) of the second accommodating portion (22b) and the low temperature side inflow passage (25) of the third accommodating portion (22c). Further, the heat medium flows between the magnetic working substance (23) in the third accommodating portion (22c) and the magnetic working substance (23) in the fourth accommodating portion (22d), through which the heat medium flows at different temperatures, and at different temperatures.
  • a third heat insulating layer (213) is provided between the high temperature side outflow passage (28) of the third accommodating portion (22c) and the low temperature side inflow passage (25) of the fourth accommodating portion (22d).
  • Embodiment 4 The fourth embodiment will be described.
  • the magnetic refrigeration module (20) of the present embodiment is different from the first embodiment in that it particularly includes a plurality of parallel blocks (29a, 29b).
  • the differences from the first embodiment will be mainly described.
  • ⁇ Accommodation case> As shown in FIGS. 27 to 30, six accommodating portions (22) are accommodated in the accommodating portion case (21). Six through holes (21a) are formed in the accommodating portion case (21), and one accommodating portion (22) is accommodated in each through hole (21a).
  • the six accommodating portions (22) of the present embodiment are, in order from left to right in FIG. 28 (A), the first accommodating portion (22a), the second accommodating portion (22b), and the third accommodating portion. (22c), 4th accommodation (22d), 5th accommodation (22e), and 6th accommodation (22f).
  • Each of the first to third accommodating portions (22a to 22c) constitutes an accommodating portion arranged at the highest temperature.
  • Each of the 4th to 6th accommodating portions (22d to 22f) constitutes an accommodating portion arranged at the lowest temperature.
  • High temperature side header In the high temperature side header (32), the configurations of the high temperature side header main body (33) and the first high temperature side packing (34) are different from those in the first embodiment.
  • the configuration of the second high temperature side packing (35) is the same as that of the first embodiment.
  • High temperature side header body On the front surface (33a) or back surface (33b) of the high temperature side header body (33) (in other words, at least one of the first surface side and the second surface side inside the high temperature side header body (33)), the high temperature
  • the internal inflow groove (85), the high temperature internal outflow groove (86), the first series-parallel connection groove (97), and the second series-parallel connection groove (98) are formed by a multi-layer structure.
  • the high temperature internal inflow groove (85) is formed on the high temperature side of each of the first to third accommodating portions (22a to 22c) through the through hole (85a) formed at the bottom thereof and the first high temperature side packing (34). It communicates with the inflow port (27a) (specifically, the inlet of each high temperature side inflow path (27) of the first to third accommodating portions (22a to 22c)).
  • the high temperature internal inflow groove (85) communicates with the high temperature end inflow port (71) via the second high temperature side packing (35).
  • the high temperature internal inflow groove (85) communicates with each other via the first high temperature side packing (34) by connecting the high temperature side inflow ports (27a) of the first to third accommodating portions (22a to 22c) in parallel. ..
  • the high temperature internal inflow groove (85) is formed in a substantially L shape on the back surface (33b) of the high temperature side header body (33).
  • the high temperature internal inflow groove (85) constitutes a high temperature internal inflow path.
  • the high temperature internal inflow groove (85) constitutes a parallel internal flow path.
  • the high temperature internal outflow groove (86) is formed through the first high temperature side packing (34), the high temperature side outflow hole (82), and the high temperature side outflow ports (22a to 22c) of the first to third accommodating portions (22a to 22c). 28a) (Specifically, the outlets of the high temperature side outflow passages (28) of the first to third accommodating portions (22a to 22c)) are communicated with each other.
  • the high temperature internal outflow groove (86) communicates with each other via the first high temperature side packing (34) by connecting the high temperature side outflow ports (28a) of the first to third accommodating portions (22a to 22c) in parallel. ..
  • the high temperature internal outflow groove (86) is formed in a substantially C shape that opens upward on the surface (33a) of the high temperature side header body (33).
  • the high temperature internal outflow groove (86) constitutes a high temperature internal outflow path.
  • the high temperature internal outflow groove (86) constitutes a parallel internal flow path.
  • the first series-parallel connection groove (97) is provided through the first high temperature side packing (34) to each low temperature side outflow port (26a) (specifically, the first to third accommodating portions (22a to 22c)). , The outlets of the respective low temperature side outflow passages (26) of the first to third accommodating portions (22a to 22c)) are communicated with each other by a parallel connection.
  • the first series-parallel connection groove (97) is a high-temperature side inflow port (27a) of each of the fourth to sixth accommodating portions (22d to 22f) (specifically, the fourth to sixth accommodating portions (specifically, the fourth to sixth accommodating portions).
  • the inlets of the high temperature side inflow passages (27) of 22d to 22f) are communicated with each other by a parallel connection.
  • the first series-parallel connection groove (97) includes the respective low temperature side outflow ports (26a) of the first to third accommodating portions (22a to 22c) and the fourth to sixth accommodating portions (22d to 22f).
  • Each of the high temperature side inflow ports (27a) of the above is communicated with each other by a series connection.
  • the first series-parallel connection groove (97) is formed in a substantially E shape on the surface (33a) of the high temperature side header body (33).
  • the first series-parallel connection groove (97) constitutes the first series internal flow path.
  • the first series-parallel connection groove (97) constitutes a parallel internal flow path.
  • the second series-parallel connection groove (98) is formed in the through hole (98a) formed at the bottom thereof and the first to third accommodating portions (22a to 22c) via the first high temperature side packing (34).
  • the low temperature side inflow port (25a) (specifically, the inlet of each low temperature side inflow path (25) of the first to third accommodating portions (22a to 22c)) is communicated with each other by a parallel connection.
  • the second series-parallel connection groove (98) is a high-temperature side outflow port (28a) of each of the fourth to sixth accommodating portions (22d to 22f) (specifically, the fourth to sixth accommodating portions (specifically, the fourth to sixth accommodating portions).
  • the outlets of the high temperature side outflow passages (28) of 22d to 22f) are communicated with each other by a parallel connection.
  • the second series-parallel connection groove (98) includes the respective low temperature side inflow ports (25a) of the first to third accommodating portions (22a to 22c) and the fourth to sixth accommodating portions (22d to 22f). Each of the high temperature side outflow ports (28a) of the above is communicated with each other by a series connection.
  • the second series-parallel connection groove (98) is formed in a substantially I shape on the back surface (33b) of the high temperature side header body (33).
  • the second series-parallel connection groove (98) constitutes the second series internal flow path.
  • the second series-parallel connection groove (98) constitutes a parallel internal flow path.
  • the first to eighteenth packing holes (H1 to H18) penetrate the first high temperature side packing (34) in the thickness direction.
  • the first packing hole (H1) communicates the high temperature side outflow port (28a) of the sixth accommodating portion (22f) with the second series-parallel connection groove (98) of the high temperature side header body (33).
  • the second packing hole (H2) communicates the high temperature side inflow port (27a) of the sixth accommodating portion (22f) with the first series-parallel connection groove (97) of the high temperature side header body (33).
  • the third packing hole (H3) communicates the high temperature side inflow port (27a) of the fifth accommodating portion (22e) with the first series-parallel connection groove (97) of the high temperature side header body (33).
  • the fourth packing hole (H4) communicates the high temperature side outflow port (28a) of the fifth accommodating portion (22e) with the second series-parallel connection groove (98) of the high temperature side header body (33).
  • the fifth packing hole (H5) communicates the high temperature side outflow port (28a) of the fourth accommodating portion (22d) with the second series-parallel connection groove (98) of the high temperature side header body (33).
  • the sixth packing hole (H6) communicates the high temperature side inflow port (27a) of the fourth accommodating portion (22d) with the first series-parallel connection groove (97) of the high temperature side header body (33).
  • the high temperature side outflow passages (28) of the 4th to 6th accommodating portions (22d to 22f) are connected in parallel to each other via the second series-parallel connection groove (98).
  • the high temperature side inflow paths (27) of the fourth to sixth accommodating portions (22d to 22f) are connected in parallel to each other via the first series-parallel connection groove (97).
  • the low temperature side outflow passages (26) of the 4th to 6th accommodating portions (22d to 22f) are connected in parallel with each other, and each of the 4th to 6th accommodating portions (22d to 22f) is connected.
  • the cold side inflow passages (25) are connected in parallel with each other. In other words, the 4th to 6th accommodating portions (22d to 22f) are connected in parallel with each other, thereby forming the second parallel block (29b).
  • the 7th packing hole (H7) communicates the low temperature side outflow port (26a) of the 3rd accommodating portion (22c) with the 1st series / parallel connection groove (97) of the high temperature side header body (33).
  • the eighth packing hole (H8) communicates the low temperature side inflow port (25a) of the third accommodating portion (22c) with the second series-parallel connection groove (98) of the high temperature side header body (33).
  • the ninth packing hole (H9) communicates the low temperature side inflow port (25a) of the second accommodating portion (22b) with the second series-parallel connection groove (98) of the high temperature side header body (33).
  • the tenth packing hole (H10) communicates the low temperature side outflow port (26a) of the second accommodating portion (22b) with the first series-parallel connection groove (97) of the high temperature side header body (33).
  • the eleventh packing hole (H11) communicates the low temperature side outflow port (26a) of the first accommodating portion (22a) with the first series-parallel connection groove (97) of the high temperature side header body (33).
  • the twelfth packing hole (H12) communicates the low temperature side inflow port (25a) of the first accommodating portion (22a) with the second series-parallel connection groove (98) of the high temperature side header body (33).
  • the thirteenth packing hole (H13) communicates the high temperature side outflow port (28a) of the third accommodating portion (22c) with the high temperature internal outflow groove (86) of the high temperature side header body (33).
  • the 14th packing hole (H14) communicates the high temperature side inflow port (27a) of the third accommodating portion (22c) with the high temperature internal inflow groove (85) of the high temperature side header body (33).
  • the fifteenth packing hole (H15) communicates the high temperature side inflow port (27a) of the second accommodating portion (22b) with the high temperature internal inflow groove (85) of the high temperature side header body (33).
  • the 16th packing hole (H16) communicates the high temperature side outflow port (28a) of the second accommodating portion (22b) with the high temperature internal outflow groove (86) of the high temperature side header body (33).
  • the 17th packing hole (H17) communicates the high temperature side outflow port (28a) of the first accommodating portion (22a) with the high temperature internal outflow groove (86) of the high temperature side header body (33).
  • the 18th packing hole (H18) communicates the high temperature side inflow port (27a) of the first accommodating portion (22a) with the high temperature internal inflow groove (85) of the high temperature side header body (33).
  • the low temperature side outflow passages (26) of the first to third accommodating portions (22a to 22c) are connected in parallel to each other via the first series-parallel connection groove (97).
  • the low temperature side inflow paths (25) of the first to third accommodating portions (22a to 22c) are connected in parallel to each other via the second series-parallel connection groove (98).
  • the high temperature side outflow passages (28) of the first to third accommodating portions (22a to 22c) are connected in parallel to each other via the high temperature internal outflow groove (86).
  • the high temperature side inflow passages (27) of the first to third accommodating portions (22a to 22c) are connected in parallel to each other via the high temperature internal inflow groove (85). In other words, the first to third accommodating portions (22a to 22c) are connected in parallel with each other, thereby forming the first parallel block (29a).
  • each of the low temperature side outflow passages (26) of the first to third accommodating portions (22a to 22c) and each of the high temperature side inflow passages (27d to 22f) of the fourth to sixth accommodating portions (22d to 22f). ) are connected in series with each other via the first series-parallel connection groove (97).
  • Each of the low temperature side inflow passages (25) of the first to third accommodating portions (22a to 22c) and each of the high temperature side outflow passages (28) of the fourth to sixth accommodating portions (22d to 22f) are the first. They are connected in series with each other via a two series-parallel connection groove (98). In other words, the first parallel block (29a) and the second parallel block (29b) are connected in series with each other.
  • ⁇ Low temperature side header> In the low temperature side header (42), the configurations of the low temperature side header main body (43) and the first low temperature side packing (44) are different from those in the first embodiment.
  • the configuration of the second low temperature side packing (45) is the same as that of the first embodiment.
  • Low temperature side header body On the front surface (43a) or back surface (43b) of the low temperature side header body (43) (in other words, at least one of the first surface side and the second surface side inside the low temperature side header (42)), the low temperature inside.
  • the inflow groove (87) and the low temperature internal outflow groove (88) are formed by a multi-layer structure.
  • the low temperature internal inflow groove (87) is provided through the first low temperature side packing (44), the low temperature side inflow hole (83), and the respective low temperature side inflow ports (22d to 22f) of the fourth to sixth accommodating portions (22d to 22f). 25a) (Specifically, the inlet of each low temperature side inflow path (25) of the 4th to 6th accommodating portions (22d to 22f)) is communicated with.
  • the low temperature internal inflow groove (87) communicates with each other via the first low temperature side packing (44) by connecting the low temperature side inflow ports (25a) of the fourth to sixth accommodating portions (22d to 22f) in parallel. ..
  • the low temperature internal inflow groove (87) is formed in a substantially C shape that opens upward on the surface (43a) of the low temperature side header body (43).
  • the low temperature internal inflow groove (87) constitutes a low temperature internal inflow path.
  • the low temperature internal inflow groove (87) constitutes a parallel internal flow path.
  • the low temperature internal outflow groove (88) is formed through the through hole (88a) formed at the bottom thereof and the first low temperature side packing (44), and the low temperature side outflow port of the fourth to sixth accommodating portions (22d to 22f) is provided. (26a) (Specifically, it communicates with the exit of the low temperature side outflow passage (26) of the 4th to 6th accommodating portions (22d to 22f)).
  • the low temperature internal outflow groove (88) communicates with the low temperature end outflow port (74) via the second low temperature side packing (45).
  • the low temperature internal outflow groove (88) communicates with each other via the first low temperature side packing (44) by connecting the low temperature side outflow ports (26a) of the fourth to sixth accommodating portions (22d to 22f) in parallel. ..
  • the low temperature internal outflow groove (88) is formed in a substantially L shape on the back surface (43b) of the low temperature side header body (43).
  • the low temperature internal outflow groove (88) constitutes a low temperature internal outflow channel.
  • the low temperature internal outflow groove (88) constitutes a parallel internal flow path.
  • the 19th to 24th packing holes (H19 to H24) penetrate the first low temperature side packing (44) in the thickness direction.
  • the 19th packing hole (H19) communicates the low temperature side inflow port (25a) of the 4th accommodating portion (22d) with the low temperature internal inflow groove (87) of the low temperature side header body (43).
  • the 20th packing hole (H20) communicates the low temperature side outflow port (26a) of the 4th accommodating portion (22d) with the low temperature internal outflow groove (88) of the low temperature side header body (43).
  • the 21st packing hole (H21) communicates the low temperature side outflow port (26a) of the 5th accommodating portion (22e) with the low temperature internal outflow groove (88) of the low temperature side header body (43).
  • the 22nd packing hole (H22) communicates the low temperature side inflow port (25a) of the 5th accommodating portion (22e) with the low temperature internal inflow groove (87) of the low temperature side header body (43).
  • the 23rd packing hole (H23) communicates the low temperature side inflow port (25a) of the 6th accommodating portion (22f) with the low temperature internal inflow groove (87) of the low temperature side header body (43).
  • the 24th packing hole (H24) communicates the low temperature side outflow port (26a) of the 6th accommodating portion (22f) with the low temperature internal outflow groove (88) of the low temperature side header body (43).
  • the low temperature side outflow passages (26) of the 4th to 6th accommodating portions (22d to 22f) are connected in parallel to each other via the low temperature internal outflow groove (88).
  • the low temperature side inflow passages (25) of the fourth to sixth accommodating portions (22d to 22f) are connected in parallel to each other via the low temperature internal inflow groove (87).
  • the heat medium pump (130) performs the first operation, the heat medium flows from the low temperature side to the high temperature side in the magnetic refrigeration module (20). Specifically, in the magnetic refrigeration module (20), the heat medium flowing in from the low temperature end inflow port (73) flows into the low temperature side inflow hole (83) of the low temperature side header main body (43). The heat medium flowing out from the low temperature side inflow hole (83) of the low temperature side header main body (43) passes through the low temperature internal inflow groove (87) of the low temperature side header main body (43) to the fourth to sixth accommodating portions ( It flows into each low temperature side inflow path (25) of 22d to 22f).
  • the heat medium flowing out from each low temperature side inflow path (25) of the 4th to 6th accommodations (22d to 22f) is a magnetic working substance (23) of each of the 4th to 6th accommodations (22d to 22f). Then, it flows into each of the high temperature side outflow passages (28) of the 4th to 6th accommodating portions (22d to 22f).
  • the heat medium flowing out from each of the high temperature side outflow passages (28) of the 4th to 6th accommodating portions (22d to 22f) passes through the second series-parallel connection groove (98) of the high temperature side header body (33). , It flows into each of the low temperature side inflow passages (25) of the first to third accommodating portions (22a to 22c).
  • the heat medium flowing out from each of the low temperature side inflow passages (25) of the first to third accommodating portions (22a to 22c) is the magnetic working substance (23) of each of the first to third accommodating portions (22a to 22c). Then, it flows into each of the high temperature side outflow passages (28) of the first to third accommodating portions (22a to 22c).
  • the heat medium flowing out from each of the high temperature side outflow passages (28) of the first to third accommodating portions (22a to 22c) passes through the high temperature internal outflow groove (86) of the high temperature side header body (33) and has a high temperature. It flows into the high temperature side outflow hole (82) of the side header body (33). The heat medium flowing out from the high temperature side outflow hole (82) of the high temperature side header body (33) flows out to the outside of the magnetic refrigeration module (20) through the high temperature end outflow port (72).
  • the heat medium pump (130) performs the second operation, the heat medium flows from the high temperature side to the low temperature side in the magnetic refrigeration module (20).
  • the heat medium flowing in from the high temperature end inflow port (71) passes through the high temperature internal inflow groove (85) of the high temperature side header body (33) and is first to first. 3 It flows into each of the high temperature side inflow passages (27) of the accommodating portions (22a to 22c).
  • the heat medium flowing out from each of the high temperature side inflow passages (27) of the first to third accommodating portions (22a to 22c) is the magnetic working substance (23) of each of the first to third accommodating portions (22a to 22c). Then, it flows into each of the low temperature side outflow passages (26) of the first to third accommodating portions (22a to 22c).
  • the heat medium flowing out from each of the low temperature side outflow passages (26) of the first to third accommodating portions (22a to 22c) passes through the first series-parallel connection groove (97) of the high temperature side header body (33). , It flows into each of the high temperature side inflow passages (27) of the 4th to 6th accommodating portions (22d to 22f).
  • the heat medium flowing out from each high temperature side inflow path (27) of the 4th to 6th accommodations (22d to 22f) is a magnetic working substance (23) of each of the 4th to 6th accommodations (22d to 22f). Then, it flows into each of the low temperature side outflow passages (26) of the 4th to 6th accommodating portions (22d to 22f).
  • the heat medium flowing out from each of the low temperature side outflow passages (26) of the 4th to 6th accommodating portions (22d to 22f) passes through the low temperature internal outflow groove (88) of the low temperature side header body (43) and then has a low temperature. It flows out of the magnetic refrigeration module (20) through the end outflow port (74).
  • the magnetic refrigeration module (20) of the present embodiment also has the same effect as that of the first embodiment.
  • the magnetic refrigeration module (20) of the present embodiment at least a part of the plurality of accommodating portions (22) is connected in parallel with each other. According to this configuration, the heat medium supplied to the magnetic refrigeration module (20) flows all at once through a plurality of accommodating portions (22) connected in parallel with each other.
  • the magnetic refrigeration module (20) of the present embodiment includes a plurality of parallel blocks (29a, 29b) each composed of a plurality of the above-mentioned accommodating portions (22) connected in parallel with each other, and the plurality of the above-mentioned parallel blocks. (29a, 29b) are connected in series with each other. According to this configuration, the heat medium supplied to the magnetic refrigeration module (20) sequentially flows through a plurality of parallel blocks (29a, 29b) connected in series with each other. In each parallel block (29a, 29b), the heat medium flows all at once through a plurality of accommodating portions (22) connected in parallel to each other.
  • the magnetic refrigeration module (20) of the present embodiment includes the low temperature internal inflow path (87), the low temperature internal outflow path (88), the high temperature internal inflow path (85), the high temperature internal outflow path (86), and the like.
  • the first series internal flow path (91,93,95,97) and the second series internal flow path (92,94,96,98) are the low temperature side header (42) or the high temperature side header (32). ) Is composed of a multi-layer structure provided.
  • each header 32,42,52,62
  • each header 32,42,52,62
  • the header structure (32,42,52,62) includes the low temperature side header (42) and the high temperature side header (32), and the low temperature side header (32) is provided.
  • the internal inflow passage (87) and the low temperature internal outflow passage (88) are configured by a multi-layer structure provided in the low temperature side header (42), and the high temperature internal inflow passage (85) and the high temperature internal outflow passage (85).
  • 86) is composed of a multi-layer structure provided in the high temperature side header (32). According to this configuration, the heat medium flows from the low temperature side header (42) to the high temperature side header (32) via the plurality of accommodating portions (22), and vice versa.
  • the low temperature side header (42) or high temperature by forming the low temperature internal inflow path (87) and the low temperature internal outflow path (88), or the high temperature internal inflow path (85) and the high temperature internal outflow path (86) in a multi-layer structure.
  • the side header (32) can be miniaturized.
  • each of the low temperature side header (42) and the high temperature side header (32) faces the first surface (34a, 44a) facing the accommodating portion (22).
  • the high temperature of the multi-layer structure is composed of grooves (87,88) formed on at least one of the first surface (44a) side and the second surface (45a) side inside the low temperature side header (42).
  • the internal inflow path (85) and the high temperature internal outflow path (86) are formed on at least one of the first surface (34a) side and the second surface (35a) side inside the high temperature side header (32). It is composed of headers (85,86). According to this configuration, the low temperature internal inflow passage (87), the low temperature internal outflow passage (88), the high temperature internal inflow passage (85), and the high temperature internal outflow passage (86) of the multi-layer structure are formed on the low temperature side header (42) or It can be realized by a simple configuration of grooves (85 to 88) formed inside the high temperature side header (32).
  • the flow path for connecting the second parallel block (29b) in which the accommodating part (22d to 22f) is connected in parallel to each other in series is separated by the outward path and the return path, but in reality, the heat medium is in either direction. Since it can flow, the flow path becomes a dead volume and the performance deteriorates.
  • a backflow prevention unit (201,202) is provided after the parallel connection of the accommodating portion (22).
  • a backflow prevention unit (201,202,203,204,205,206) may be provided before the parallel connection of the accommodating unit (22).
  • the low temperature side outflow ports (26a) (outlets of the low temperature side outflow passages (26)) of the first to third accommodating portions (22a to 22c) constituting the first parallel block (29a).
  • High-temperature side inflow ports (27a) (high-temperature side inflows) of the fourth to sixth accommodating portions (22d to 22f) constituting the second parallel block (29b) and the points where the respective flow paths communicating with the above are connected in parallel.
  • the first backflow prevention unit (201) may be arranged between the entrance of the road (27) and the location where the flow paths communicating with each other are connected in parallel.
  • a second backflow prevention unit (202) may be arranged between the outlet) and the location where the flow paths communicating with each other are connected in parallel.
  • a first backflow prevention unit (201) may be connected to at least one of the high temperature side inflow ports (27a) via a structure for parallel connection. Further, the low temperature side inflow port (25a) side of the first to third accommodating portions (22a to 22c) and the high temperature side outflow port (28a) of each of the fourth to sixth accommodating portions (22d to 22f).
  • a second backflow prevention unit (202) may be connected to at least one of the sides via a structure for parallel connection. In this way, as described in the first embodiment (see FIGS. 32 and 33), the backflow prevention unit (201,202) is installed in the header structure (32,42) in front of the structure for series connection. It becomes possible.
  • the number of backflow prevention units (201,202) arranged is smaller than that shown in FIG. 40.
  • the header structure (32,42) in front of the backflow prevention structure (see the backflow prevention structure (36) of the first embodiment shown in FIGS. 32 and 33) constituting the backflow prevention unit (201,202). More structures need to be added for parallel connections. In other words, a three-layer header structure is required.
  • the low temperature side outflow ports (26a) (outlets of the low temperature side outflow passages (26)) of the first to third accommodating portions (22a to 22c) constituting the first parallel block (29a).
  • the first to third backflow prevention portions (201,202,203) may be arranged between the low temperature side outflow port (26a) and the location where the respective flow paths communicating with each other are connected in parallel.
  • the high temperature side outflow ports (28a) (outlets of the high temperature side outflow passages (28)) of the fourth to sixth accommodating portions (22d to 22f) constituting the second parallel block (29b) and their high temperatures.
  • the fourth to sixth backflow prevention portions (204,205,206) may be arranged between the side outflow port (28a) and the location where the respective flow paths communicating with each other are connected in parallel.
  • the first to third backflow prevention portions (201,202,203) may be connected to the respective low temperature side outflow ports (26a) of the first to third accommodating portions (22a to 22c).
  • the fourth to sixth backflow prevention portions (204,205,206) may be connected to the respective high temperature side outflow ports (28a) of the fourth to sixth accommodating portions (22d to 22f).
  • a backflow prevention unit (201,202,203,204,205,206) is installed in the header structure (32,42) in front of the structure for series connection. It becomes possible.
  • the number of backflow prevention units (201 to 206) arranged is larger than that shown in FIG. 39.
  • the header body (high temperature side header of the first embodiment shown in FIGS. 32 and 33) is arranged after the backflow prevention structure constituting the backflow prevention unit (201 to 206).
  • a heat insulating layer (first heat insulating layer) (211) is provided between the first parallel block (29a) and the second parallel block (29b) connected in series. May be good.
  • the heat insulating layer (211) may be made of a heat insulating material, slits, or the like.
  • a part of the accommodating portion (22) may be composed of a heat insulating member serving as a heat insulating layer (211).
  • the heat insulating layer (211) may be provided as a whole between the first parallel block (29a) and the second parallel block (29b) connected in series, or the first parallel block connected in series. It may be provided in a part between (29a) and the second parallel block (29b). It is not necessary to provide a heat insulating layer between the accommodating portions (22) connected in parallel inside the first parallel block (29a) and the second parallel block (29b).
  • a heat insulating layer (211) is provided between the inflow path (25) on the low temperature side of the above.
  • the above embodiment may have the following configuration.
  • the number of accommodating portions (22) is not limited to those shown in the above embodiments, and if some of the plurality of accommodating portions (22) are connected in series with each other, the plurality of accommodating portions (22) may be connected. How to connect can be set arbitrarily. As an example, it is conceivable to connect two of the six accommodating portions (22) in parallel to form three parallel blocks, and to connect the three parallel blocks in series to each other.
  • header structure may be made of a non-magnetic material having a thermal conductivity of 10 W / mK or less.
  • the header structure may be made of a material having a thermal conductivity of 10 W / mK or less, or may be made of a non-magnetic material.
  • the solid cooling module may be a method other than the magnetic refrigerating module that induces a magnetic calorific value effect on the magnetic working substance (23) as the solid refrigerant substance.
  • the solid refrigerant substance referred to here also includes substances having properties intermediate between liquid and solid such as flexible crystals.
  • Other solid cooling modules include a method of inducing a calorific value effect by applying a force field (electric field, etc.) other than a magnetic field, for example, 1) a method of inducing an electric calorific value effect in a solid refrigerant substance, and 2) a solid refrigerant substance. 3) A method of inducing an elastic calorific value effect on a solid refrigerant substance can be mentioned.
  • the solid cooling module of the method 1) when an electric field fluctuation is applied to a solid refrigerant substance composed of a dielectric material, the solid refrigerant substance undergoes a phase transition from a strong dielectric material to an ordinary dielectric material, and the solid refrigerant substance generates heat or absorbs heat. To do.
  • the solid cooling module of the method 2 when a pressure fluctuation is applied to the solid refrigerant substance, the solid refrigerant substance undergoes a phase transition and generates heat or endothermic.
  • the solid refrigerant substance when stress fluctuation is applied to the solid refrigerant substance, the solid refrigerant substance undergoes a phase transition and generates heat or endothermic.
  • the present disclosure is useful for solid cooling modules, especially magnetic refrigeration modules.
  • Magnetic refrigeration module (solid cooling module) 23 Magnetic work substance (solid refrigerant substance) 22a-22f 1st to 6th accommodations (accommodation) 25 Low temperature side inflow path (flow path) 25a Cold side inflow port 26 Cold side outflow channel (flow path) 26a Low temperature side outflow port 27 High temperature side inflow path (flow path) 27a High temperature side inflow port 28 High temperature side outflow path (flow path) 28a High temperature side outflow port 29a 1st parallel block (parallel block) 29b Second parallel block (parallel block) 32 High temperature side header (header structure) 34a 1st surface 35a 2nd surface 42 Low temperature side header (header structure) 44a First side 45a Second side 52 Common header (header structure) 54a First side 55a Second side 62 Connection header (header structure) 63b 2nd surface 64a 1st surface 71 High temperature end inflow port 72 High temperature end outflow port 73 Low temperature end inflow port 74 Low temperature end outflow port 85 High temperature internal inflow groove (high temperature internal in

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PCT/JP2020/036608 2019-09-30 2020-09-28 固体冷却モジュール Ceased WO2021065792A1 (ja)

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CN202080068649.0A CN114502899B (zh) 2019-09-30 2020-09-28 固体冷却模块
EP20871883.3A EP4027078A4 (en) 2019-09-30 2020-09-28 SOLID STATE COOLING MODULE
JP2021551246A JP7339564B2 (ja) 2019-09-30 2020-09-28 固体冷却モジュール
US17/706,180 US12196459B2 (en) 2019-09-30 2022-03-28 Solid-state cooling module
JP2023110198A JP7453593B2 (ja) 2019-09-30 2023-07-04 固体冷却モジュール

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