WO2021064828A1 - Feuille de capteur - Google Patents

Feuille de capteur Download PDF

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Publication number
WO2021064828A1
WO2021064828A1 PCT/JP2019/038630 JP2019038630W WO2021064828A1 WO 2021064828 A1 WO2021064828 A1 WO 2021064828A1 JP 2019038630 W JP2019038630 W JP 2019038630W WO 2021064828 A1 WO2021064828 A1 WO 2021064828A1
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WIPO (PCT)
Prior art keywords
dielectric layer
layer
sensor sheet
layers
dielectric
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Application number
PCT/JP2019/038630
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English (en)
Japanese (ja)
Inventor
洸 林
日比野　真吾
Original Assignee
住友理工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 住友理工株式会社 filed Critical 住友理工株式会社
Priority to PCT/JP2019/038630 priority Critical patent/WO2021064828A1/fr
Priority to JP2020500761A priority patent/JP6667058B1/ja
Publication of WO2021064828A1 publication Critical patent/WO2021064828A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes

Definitions

  • the present invention relates to a capacitance type sensor sheet.
  • the capacitance type sensor sheet of Patent Document 1 includes a plurality of strip-shaped front electrode layers, a plurality of individual piece-shaped dielectric layers, and a plurality of strip-shaped back electrode layers from the front side to the back side. ing.
  • the plurality of front electrode layers and the plurality of back electrode layers are orthogonal to each other.
  • a plurality of detection units are arranged in a portion where the front electrode layer, the dielectric layer, and the back electrode layer overlap.
  • a non-detection unit is arranged between a pair of detection units adjacent to each other in the plane direction. Space is secured in the non-detection section.
  • the non-detection portion is curved in preference to the detection portion. Therefore, it is possible to suppress the change in the capacitance of the detection unit depending on the arrangement state of the sensor sheet.
  • an object of the present invention is to provide a sensor sheet in which deformation of the dielectric layer does not easily affect the capacitance of the detection unit.
  • the sensor sheet of the present invention has a surface between the front side electrode layer, the back side electrode layer arranged on the back side of the front side electrode layer, and the front side electrode layer and the back side electrode layer. It includes a plurality of dielectric layers arranged apart from each other in the direction, and a plurality of detection units arranged at a portion where the front electrode layer, the dielectric layer, and the back electrode layer overlap when viewed from the front and back directions.
  • the outer edge of the dielectric layer is arranged outside the outer edge of the detection portion when viewed from the front and back directions, and the non-arranged dielectric layer portion in which the dielectric layer is not arranged is the dielectric layer.
  • the "no load state” means a state before the sensor sheet is placed on a predetermined arrangement surface, and a state in which no load is applied to the sensor sheet.
  • the dielectric layer non-arranged portion is more easily deformed than the dielectric layer arranged portion. Therefore, when the sensor sheet is arranged on the arrangement surface, the dielectric layer non-arrangement portion can be deformed in preference to the dielectric layer arrangement portion. Therefore, it is possible to suppress the deformation of the dielectric layer depending on the arrangement state of the sensor sheet, that is, the change in the capacitance of the detection unit.
  • the dielectric layer protrudes outward from the detection portion when viewed from the front and back directions. Therefore, when the sensor sheet is arranged on the arrangement surface, even if the dielectric layer (specifically, the portion of the dielectric layer protruding outward from the detection portion) is deformed, the detection portion is not easily affected by the deformation. .. Therefore, it is possible to suppress the change in the capacitance of the detection unit depending on the arrangement state of the sensor sheet.
  • FIG. 1 is a transparent top view of the sensor sheet of the first embodiment.
  • FIG. 2 is a sectional view taken along the line II-II of FIG.
  • FIG. 3 is a vertical sectional view of the sensor sheet in the arranged state.
  • FIG. 4 is a transparent top view of the sensor sheet of the second embodiment.
  • FIG. 5 is a cross-sectional view taken along the VV direction of FIG. 6 (A) to 6 (F) are front-back sectional views of a part of the sensor sheet of the other embodiments (No. 1 to No. 6).
  • FIG. 1 shows a transparent top view of the sensor sheet of the present embodiment.
  • FIG. 2 shows a cross-sectional view of FIG. 1 in the II-II direction (vertical direction).
  • the back side wiring layers 45a to 45d are shown by dotted lines.
  • FIG. 2 the thickness of the sensor sheet 1 in the vertical direction is emphasized (the same applies to FIGS. 3, 5, 6 (A) to 6 (F) described later).
  • FIGS. 1 and 2 show a no-load state (a state before the sensor sheet 1 is arranged on the arrangement surface 90 described later, and a state in which no load is applied to the sensor sheet 1).
  • the sensor sheet 1 has four dielectric layers 2a to 2d, a front electrode unit 3, a back electrode unit 4, and a connector (capacitance of detection units 11A to 11D described later). It is provided with a take-out unit (5) and a control unit 6 that can take out the amount of electricity related to the above. In the no-load state, the sensor sheet 1 has a flexible flat plate shape.
  • the four dielectric layers 2a to 2d are each made of urethane foam and are in the form of individual pieces.
  • the dielectric layers 2a to 2d have flexibility and insulating properties.
  • FIG. 1 when viewed from the vertical direction (front and back directions of the sensor sheet 1, laminating direction), the four dielectric layers 2a to 2d are in the horizontal direction (plane direction of the sensor sheet 1, perpendicular to the front and back directions). They are arranged at predetermined intervals in the direction in which they are formed.
  • the front electrode unit 3 is arranged on the upper side (front side, one of the stacking directions) of the four dielectric layers 2a to 2d. As shown in FIGS.
  • the front electrode unit 3 includes a front base material 30, four front first adhesive layers 31a to 31d, a front second adhesive layer 32, and a front third adhesive layer 33. It includes four front electrode layers 34a to 34d and four front wiring layers 35a to 35d.
  • the front side first adhesive layers 31a to 31d, the front side second adhesive layer 32, and the front side third adhesive layer 33 are included in the concept of the "adhesive layer" of the present invention.
  • the front base material 30 is made of elastic textile such as Lycra Taffeta manufactured by Toray Operontex Co., Ltd. (“Lycra” is a registered trademark of Invista Technologies SAR L).
  • the front base material 30 has flexibility and insulating properties.
  • the front base material 30 has a sheet shape.
  • the front third adhesive layer 33 is adhered to the lower surface (back surface) of the front base material 30.
  • the front third adhesive layer 33 is made of a thermoplastic adhesive sheet and has flexibility, insulation, and adhesiveness.
  • the front third adhesive layer 33 has a sheet shape.
  • the four front electrode layers 34a to 34d are adhered to the lower surface of the front third adhesive layer 33 at predetermined intervals in the horizontal direction. As shown in FIG. 1, the four front electrode layers 34a to 34d are arranged at positions corresponding to the four dielectric layers 2a to 2d when viewed from the vertical direction. However, the front electrode layers 34a to 34d are one size smaller than the dielectric layers 2a to 2d.
  • the front electrode layers 34a to 34d contain acrylic rubber and conductive carbon black.
  • the front electrode layers 34a to 34d are in the form of individual pieces.
  • the front electrode layers 34a to 34d have flexibility and conductivity.
  • the four front wiring layers 35a to 35d are adhered to the lower surface of the front third adhesive layer 33.
  • the front side wiring layers 35a to 35d electrically connect the front side electrode layers 34a to 34d and the connector 5 described later.
  • the front wiring layers 35a to 35d contain acrylic rubber and conductive carbon black.
  • the front wiring layers 35a to 35d have a band shape (linear shape).
  • the front wiring layers 35a to 35d have flexibility and conductivity.
  • the front side second adhesive layer 32 covers the front side third adhesive layer 33, the front side electrode layers 34a to 34d, and the front side wiring layers 35a to 35d from the lower side.
  • the front-side second adhesive layer 32 is adhered to the lower surface of the front-side third adhesive layer 33, the lower surfaces of the front-side electrode layers 34a to 34d, and the lower surfaces of the front-side wiring layers 35a to 35d.
  • the material, characteristics, and shape of the front side second adhesive layer 32 are the same as those of the front side third adhesive layer 33.
  • the four front-side first adhesive layers 31a to 31d are adhered to the lower surface of the front-side second adhesive layer 32 and the upper surfaces of the four dielectric layers 2a to 2d at predetermined intervals in the horizontal direction. As shown in FIG. 1, the four front-side first adhesive layers 31a to 31d are arranged at positions corresponding to the four dielectric layers 2a to 2d when viewed from the vertical direction.
  • the first adhesive layers 31a to 31d on the front side are double-sided tapes and are in the form of individual pieces.
  • the first adhesive layers 31a to 31d on the front side have flexibility, insulating property, and adhesiveness.
  • the back side electrode unit 4 As shown in FIG. 2, the back side electrode unit 4 is arranged below the four dielectric layers 2a to 2d.
  • the configuration of the back side electrode unit 4 is the same as the configuration of the front side electrode unit 3.
  • the back side electrode unit 4 includes a back side base material 40, four back side first adhesive layers 41a to 41d, a back side second adhesive layer 42, and a back side third adhesive layer 43. It includes four back side electrode layers 44a to 44d and four back side wiring layers 45a to 45d.
  • the back side first adhesive layer 41a to 41d, the back side second adhesive layer 42, and the back side third adhesive layer 43 are included in the concept of the "adhesive layer" of the present invention.
  • Back side base material 40 and front side base material 30 back side first adhesive layers 41a to 41d and front side first adhesive layers 31a to 31d, back side second adhesive layer 42 and front side second adhesive layer 32, back side third adhesive layer 43 and front side
  • the third adhesive layer 33, the back side electrode layers 44a to 44d and the front side electrode layers 34a to 34d, and the back side wiring layers 45a to 45d and the front side wiring layers 35a to 35d are made of the same material, respectively.
  • the laminated structure (arrangement in the vertical direction) of the back side electrode unit 4 is vertically symmetrical with the laminated structure of the front side electrode unit 3.
  • connection 5 (Connector 5, control unit 6) As shown in FIG. 1, the connector 5 is arranged on the outer edge of the sensor sheet 1 when viewed from the vertical direction.
  • the front side wiring layers 35a to 35d and the back side wiring layers 45a to 45d are electrically connected to the connector 5.
  • the front side wiring layers 35a to 35d and the back side wiring layers 45a to 45d are arranged so as not to overlap each other.
  • the control unit 6 is electrically connected (wired connection) to the connector 5.
  • a quantity of electricity (for example, voltage, current, etc.) related to capacitance is input to the control unit 6 from the detection units 11A to 11D, which will be described later.
  • the control unit 6 detects the load for each of the detection units 11A to 11D based on the amount of change in the capacitance of the detection units 11A to 11D. That is, the control unit 6 detects the load distribution (surface pressure distribution) of the sensor sheet 1.
  • Detection units 11A to 11D dielectric layer arrangement units 12A to 12D, dielectric layer non-arrangement units 13
  • the front electrode layers 34a to 34d, the dielectric layers 2a to 2d, and the back electrode layers 44a to 44d are arranged in the vertical direction.
  • solid line hatching in FIG. 1 when viewed from the vertical direction, there are four overlapping portions (front side) of the front side electrode layers 34a to 34d, the dielectric layers 2a to 2d, and the back side electrode layers 44a to 44d.
  • the detection units 11A to 11D of the electrode layers 34a to 34d, the dielectric layers 2a to 2d, and the back side electrode layers 44a to 44d) are set.
  • the detection unit 11A has a front side base material 30, a front side third adhesive layer 33, a front side electrode layer 34a, a front side second adhesive layer 32, and a front side first. It includes an adhesive layer 31a, a dielectric layer 2a, a back side first adhesive layer 41a, a back side second adhesive layer 42, a back side electrode layer 44a, a back side third adhesive layer 43, and a back side base material 40. The same applies to the configurations of the other detection units 11B to 11D.
  • the dielectric layer arranging portions 12A to 12D include the above-mentioned detection portions 11A to 11D and the annular portions 12a to 12d.
  • the annular portions 12a to 12d surround the detection portions 11A to 11D in an annular shape from the outside in the horizontal direction. As an example, as shown in FIG.
  • the annular portion 12a of the dielectric layer arrangement portion 12A has a front side base material 30, a front side third adhesive layer 33, a front side second adhesive layer 32, and a front side second from the upper side to the lower side. It includes one adhesive layer 31a, a dielectric layer 2a, a back side first adhesive layer 41a, a back side second adhesive layer 42, a back side third adhesive layer 43, and a back side base material 40.
  • a front side wiring layer 35a is interposed between the front side third adhesive layer 33 and the front side second adhesive layer 32.
  • the back side wiring layer 45a shown in FIG. 1 is interposed between the back side third adhesive layer 43 and the back side second adhesive layer 42. The same applies to the configurations of the annular portions 12b to 12d of the other dielectric layer arrangement portions 12B to 12D.
  • the dielectric layer non-arrangement portions 13 are set in the portions other than the four dielectric layer arrangement portions 12A to 12D and the connector 5.
  • the dielectric layer non-arranged portion 13 has a front side base material 30, a front side third adhesive layer 33, a front side second adhesive layer 32, a back side second adhesive layer 42, and a back side from the upper side to the lower side. It includes a third adhesive layer 43 and a back surface base material 40.
  • the front side wiring layers 35a to 35d are interposed between the front side third adhesive layer 33 and the front side second adhesive layer 32.
  • the back side wiring layers 45a to 45d shown in FIG. 1 are interposed between the back side third adhesive layer 43 and the back side second adhesive layer 42.
  • a space G is secured between the front side second adhesive layer 32 and the back side second adhesive layer 42.
  • the dielectric layer non-arranged portion 13 has a smaller number of layers than the dielectric layer arranged portions 12A to 12D. Further, the dielectric layer non-arranged portion 13 includes a space G. Therefore, the dielectric layer non-arranged portion 13 is more flexible and easily deformed than the dielectric layer arranged portions 12A to 12D. Further, the dielectric layer non-arranged portion 13 has a smaller bending stress than the dielectric layer arranged portions 12A to 12D. Therefore, the dielectric layer non-arranged portion 13 is more easily bent in the vertical direction than the dielectric layer arranged portions 12A to 12D. Further, the dielectric layer non-arranged portion 13 is more likely to expand and contract in the vertical direction and the horizontal direction than the dielectric layer arranged portions 12A to 12D.
  • FIG. 3 shows a vertical sectional view of the sensor sheet of the present embodiment in the arranged state.
  • the arrangement surface 90 of the arrangement object 9 includes a pair of left and right inclined surface portions 900 and a top surface portion 901.
  • Each of the pair of left and right inclined surface portions 900 has a flat shape having a predetermined inclination.
  • the top surface portion 901 connects the upper edges of a pair of left and right inclined surface portions 900.
  • the top surface portion 901 has a curved surface shape that protrudes upward.
  • the lower surface of the sensor sheet 1 in the no-load state (back surface; the arrangement surface on the sensor sheet 1 side that abuts on the arrangement surface 90 of the object 9 to be arranged) is entirely flat. Is presenting. Therefore, when the sensor sheet 1 is arranged on the arrangement surface 90, the sensor sheet 1 is deformed to follow the shape of the arrangement surface 90.
  • the dielectric layer non-arranged portion 13 is more flexible and easily deformed than the dielectric layer arranged portions 12A to 12D.
  • the dielectric layer non-arranged portion 13 has a smaller bending stress than the dielectric layer arranged portions 12A to 12D. Therefore, when the sensor sheet 1 is arranged on the arrangement surface 90, the dielectric layer non-arrangement portion 13 can be deformed in preference to the dielectric layer arrangement portions 12A to 12D.
  • the dielectric layers 2a to 2d are deformed depending on the arrangement state of the sensor sheet 1, that is, the distance d between the electrodes of the detection units 11A to 11D and the electrode area S (see FIGS. 2 and 3) change, and the detection unit 11A It is possible to suppress the change in the capacitance of ⁇ 11D.
  • the thickness of the detection portions 11A to 11D in the vertical direction that is, the distance between the electrodes d (FIGS. 2 and 2). 3) may become smaller.
  • the electrode areas S (see FIGS. 2 and 3) of the detection units 11A to 11D change due to the lateral extension deformation of the front electrode layers 34a to 34d and the left-right compression deformation of the back electrode layers 44a to 44d. There is a risk of That is, the capacitance of the detection units 11A to 11D may change.
  • a dielectric layer non-arranged portion 13 is arranged on the top surface portion 901.
  • the detection units 11A to 11D are not arranged in the dielectric layer non-arrangement unit 13. Further, the dielectric layer non-arranged portion 13 is more flexible and easily deformed than the dielectric layer arranged portions 12A to 12D. Therefore, the capacitance of the detection units 11A to 11D is less likely to change as compared with the case where the dielectric layer arrangement portions 12A to 12D are arranged on the top surface portion 901.
  • the dielectric layer arranging portions 12A to 12D include annular portions 12a to 12d. Therefore, as shown in FIG. 3, when the sensor sheet 1 is arranged on the arrangement surface 90, even if the annular portions 12a to 12d are deformed, the detection portions 11A to 11D are affected by the deformation of the annular portions 12a to 12d. Hard to receive. Therefore, it is possible to suppress the change in the capacitance of the detection units 11A to 11D depending on the arrangement state of the sensor sheet 1.
  • the annular portions 12a to 12d surround the detection portions 11A to 11D in an endless annular shape. Therefore, it is possible to suppress the change in the capacitance of the detection units 11A to 11D over the entire circumference.
  • the front side electrode layers 34a to 34d, the front side first adhesive layers 31a to 31d, the dielectric layers 2a to 2d, the back side first adhesive layers 41a to 41d, and the back side electrode layers 44a to 44d are 4 They are individually arranged corresponding to the detection units 11A to 11D. Therefore, when the load is detected, the adjacent detection units 11A to 11D are not easily affected by deformation. Therefore, the detection accuracy of the load distribution (for example, the detection accuracy regarding the coordinates at which the load is input, the magnitude of the load at the coordinates, the amount of change in the load, etc.) is high. Further, a flexible dielectric layer non-arranged portion 13 having a space G is interposed between the adjacent detection portions 11A to 11D. In this respect as well, when the load is detected, the adjacent detection units 11A to 11D are not easily affected by deformation. In addition, the detection accuracy of the load distribution is high.
  • the front side third adhesive layer 33 is arranged between the front side electrode layers 34a to 34d, the front side wiring layers 35a to 35d, and the front side base material 30. ing. That is, the front electrode layers 34a to 34d and the front wiring layers 35a to 35d are indirectly fixed to the front base material 30 via the front third adhesive layer 33. Further, between the dielectric layers 2a to 2d and the front electrode layers 34a to 34d, the front side first adhesive layers 31a to 31d and the front side second adhesive layer 32 are arranged. Further, between the dielectric layers 2a to 2d and the front base material 30, the front first adhesive layer 31a to 31d, the front second adhesive layer 32, and the front third adhesive layer 33 are arranged.
  • each adhesive layer front side first adhesive layer 31a to 31d, front side second adhesive layer 32, front side third adhesive layer 33.
  • the front side wiring layers 35a to 35d are covered with the front side second adhesive layer 32 having an insulating property. Therefore, it is possible to suppress the conduction between the front side wiring layers 35a to 35d and the back side wiring layers 45a to 45d at the time of deformation (see FIG. 3).
  • the back side electrode unit 4 As shown in FIG. 1, the front side wiring layers 35a to 35d and the back side wiring layers 45a to 45d are arranged so as not to overlap when viewed from the vertical direction. Also in this respect, it is possible to suppress the conduction between the front side wiring layers 35a to 35d and the back side wiring layers 45a to 45d at the time of deformation (see FIG. 3).
  • the thickness of the dielectric layers 2a to 2d in the no-load state in the vertical direction (front and back directions) is t
  • the shortest distance between a pair of dielectric layers 2a to 2d adjacent to each other in the horizontal direction (plane direction) is l.
  • the relationship of l ⁇ 2t is established. That is, the shortest distance l is set to 2t or more, which is the thickness of two dielectric layers 2a to 2d. Therefore, even when the arrangement surface 90 shown in FIG. 3 has a curved surface having a large curvature, the dielectric layer non-arrangement portion 13 can be sufficiently deformed. Further, it is possible to suppress the deformation of the dielectric layer arrangement portions 12A to 12D.
  • the object to be arranged 9 has a flat plate shape, and the arrangement surface 90 is set from the front surface to the back surface thereof.
  • the dielectric layer arranging portions 12A to 12D are arranged on both the front and back surfaces of the arrangement target object 9, and the dielectric layer non-arrangement portions 13 are arranged on the outer edge (180 ° folded portion from the front surface to the back surface) of the arrangement object 9. In this way, the dielectric layer non-arranged portion 13 can be sufficiently deformed. Further, it is possible to suppress the deformation of the dielectric layer arrangement portions 12A to 12D.
  • the dielectric layer arrangement portions 12A to 12D are deformed even when the sensor sheet 1 is curved (bent) so as to be folded by 180 ° at the time of arrangement. Can be suppressed.
  • ⁇ Second embodiment> The difference between the sensor sheet of the present embodiment and the sensor sheet of the first embodiment is that the sensor sheet is laid on the upper surface of the insole of shoes (footwear). Further, when viewed from the vertical direction, no corners are arranged on the outer edges of the dielectric layer and the electrode layer. Here, only the differences will be described.
  • FIG. 4 shows a transparent top view of the sensor sheet of this embodiment.
  • FIG. 5 shows a sectional view in the VV direction (vertical direction) of FIG.
  • the parts corresponding to those in FIGS. 1 and 2 are indicated by the same reference numerals (number parts). Further, the front side wiring layer and the back side wiring layer are omitted. Further, FIGS. 4 and 5 show a no-load state.
  • the sensor sheet 1 has the same shape (sole shape) as the insole (not shown) when viewed from above and below.
  • the sensor sheet 1 includes six dielectric layer arranging portions 12E to 12J.
  • the dielectric layer arranging portions 12E to 12J include detection portions 11E to 11J and annular portions 12e to 12j.
  • the front electrode layers 34e to 34j and the connector 5 are electrically connected to each other via a front side wiring layer (not shown).
  • the back side electrode layers 44e to 44j and the connector 5 are electrically connected via the back side wiring layer (not shown).
  • the connector 5 and the control unit 6 are electrically connected (wirelessly connected).
  • no corners are arranged on the outer edges of the dielectric layers 2e to 2j when viewed from the vertical direction.
  • the outer edges of the dielectric layers 2e and 2h have an elliptical shape
  • the outer edges of the dielectric layer 2f have an elliptical shape (a shape in which a pair of facing semicircles are connected by a pair of straight lines)
  • the dielectric layers 2g and 2i have a shape.
  • the outer edge of the dielectric layer 2j has a quadrangular shape with round chamfered portions at the four corners, and the outer edge of the dielectric layer 2j has a perfect circular shape.
  • the outer edge shapes of the front electrode layers 34e to 34j and the back electrode layers 44e to 44j are similar to the outer edge shapes of the dielectric layers 2e to 2j (one size smaller). Therefore, the outer edge shapes of the front electrode layers 34e to 34j and the back side electrode layers 44e to 44j are the same as the outer edge shapes of the dielectric layers 2e to 2j.
  • the front side second adhesive layer 32 and the back side second adhesive layer 42 are joined. That is, the outer edge of the sensor sheet 1 is sealed.
  • the dielectric layer arrangement portions 12E to 12J are thicker in the vertical direction than the dielectric layer non-arrangement portions 13. That is, the dielectric layer arranging portions 12E to 12J have a pad shape and bulge in the vertical direction with respect to the dielectric layer non-arranging portion 13.
  • the sensor sheet of the present embodiment and the sensor sheet of the first embodiment have the same effect and effect with respect to a portion having a common configuration.
  • no corners are arranged on the outer edges of the dielectric layers 2e to 2j when viewed from the vertical direction. Therefore, when the sensor sheet 1 is arranged on the upper surface of the insole, even if the sensor sheet 1 is deformed, it is difficult for the load to be locally concentrated on the dielectric layers 2e to 2j.
  • the detection units 11E to 11J are arranged in the portion of the insole where the load is likely to change. Therefore, changes in the sole load distribution of the shoe user can be reliably detected.
  • the dielectric layer arranging portions 12E to 12J have a flexible pad shape. Therefore, the tactile sensation (wearing sensation) of the sole of the user is good. Further, the connector 5 and the control unit 6 are electrically connected wirelessly. Therefore, the degree of freedom in arranging the control unit 6 is high. In addition, the weight of the shoes can be reduced. In addition, the discomfort of the user can be reduced.
  • FIGS. 6 (A) to 6 (F) show cross-sectional views of a part of the sensor sheets of the other embodiments (No. 1 to No. 6) in the front-back direction (vertical direction in FIG. 2).
  • the parts corresponding to FIG. 2 are indicated by the same reference numerals (number parts). Further, the front side wiring layer and the back side wiring layer are omitted. Further, FIGS. 6 (A) to 6 (F) show a no-load state.
  • each layer (front base material 30, front electrode layer 34k, dielectric layer 2k, back side electrode layer 44k, back side base material 40) constituting the sensor sheet 1 may be laminated by printing.
  • the front electrode layer 34 m may be directly fixed to the back surface of the front base material 30, and the back electrode layer 44 m may be directly fixed to the front surface of the back base material 40.
  • the front electrode layer 34n may be directly fixed to the front surface of the dielectric layer 2n, and the back electrode layer 44n may be directly fixed to the back surface of the dielectric layer 2n.
  • a plurality of front electrode layers 34p1 and 34p2 and a plurality of back side electrode layers 44p1 and 44p2 may be arranged on a single dielectric layer 2p. That is, a plurality of detection units 11P1 and 11P2 may be arranged on a single dielectric layer 2p.
  • a plurality of strip-shaped front electrode layers 34q1 and 34q2 and a single strip-shaped back electrode layer 44q are arranged in a grid pattern (row x column) when viewed from the front and back directions. You may. Further, a pair of dielectric layers 2q1 and 2q2 adjacent to each other in the plane direction may be connected by the connecting portion 70. In this way, the plurality of dielectric layers 2q1 and 2q2 can be handled integrally. Therefore, the positioning of the dielectric layers 2q1 and 2q2 when arranging the plurality of dielectric layers 2q1 and 2q2 on the sensor sheet 1 becomes easy.
  • the connecting portion 70 is more flexible and more easily deformed than the dielectric layers 2q1 and 2q2.
  • the connecting portion 70 should have a smaller bending stress than the dielectric layers 2q1 and 2q2.
  • the pair of dielectric layers 2q1 and 2q2 that is, the detection units 11Q1 and 11Q2 adjacent to each other in the plane direction are easily deformed independently of each other.
  • the dielectric layers 2q1 and 2q2 and the connecting portion 70 may be integrated (made of the same material) or separate bodies (made of different materials).
  • the front electrode layer 34r may be arranged on the front surface of the front base material 30, and the back electrode layer 44r may be arranged on the back surface of the back base material 40. Then, the laminated body of the front side electrode layer 34r, the front side base material 30, the dielectric layer 2r, the back side base material 40, and the back side electrode layer 44r may be housed in the bag 71.
  • the dielectric layer non-arranged portion 13 is arranged on the top surface portion 901.
  • the positions of the dielectric layer arranging portions 12A to 12D and the dielectric layer non-arranging portion 13 on the arranging surface 90 are not particularly limited.
  • at least one of the dielectric layer arrangement portions 12A to 12D may be arranged on the top surface portion 901.
  • the bending stress of the dielectric layer non-arranged portion 13 and the dielectric layer arranged portions 12A to 12R is not particularly limited.
  • the bending stress in the front-back direction of the dielectric layer non-arrangement portion 13 (for example, the direction of bending in the front-back direction as in the top surface portion 901 shown in FIG. 3) is 1, the dielectric layer arrangement portions 12A to 12R
  • the bending stress in the front and back directions is defined as the "bending stress ratio".
  • the dielectric layer arrangement portions 12A to 12R become flexible. Therefore, it is possible to improve the followability of the dielectric layer arranging portions 12A to 12R with respect to the shape of the arranging surface 90.
  • the detection units 11A to 11R become flexible, the detection units 11A to 11R are sensitively deformed even with a small load. Therefore, it is advantageous for detecting a small load.
  • the bending stress ratio is increased, the shape retention of the dielectric layer arrangement portions 12A to 12R can be improved. Therefore, damage to the detection units 11A to 11R can be suppressed. Further, even if a large load is applied, there is little possibility that the detection units 11A to 11R will be completely crushed. Therefore, it is advantageous for detecting a large load. In this way, the load detection range can be freely adjusted to the small load side or the large load side by the bending stress ratio (flexibility of the detection units 11A to 11R).
  • the bending stress ratio should be 2 or more and 20000 or less (more preferably 4 or more and 11000 or less).
  • the dielectric layer non-arrangement portion 13 can be deformed in preference to the dielectric layer arrangement portions 12A to 12R. Therefore, it is possible to suppress the change in the capacitance of the detection units 11A to 11R depending on the arrangement state of the sensor sheet 1.
  • the bending stress ratio can be calculated based on, for example, the data obtained in the bending test of JIS K7017.
  • the bending stress ratio of 2 or more is more reliably suppressed from the change in the capacitance of the detection units 11A to 11R depending on the arrangement state of the sensor sheet 1 as compared with the case of less than 2. Because it can be done.
  • the bending stress ratio is set to 20000 or less because the tactile sensation when the user touches the dielectric layer arrangement portions 12A to 12R is better than that in the case of exceeding 20000. Further, as compared with the case where the amount exceeds 20000, the shape retention of the dielectric layer non-arranged portion 13 is improved, and the handleability of the sensor sheet 1 is improved.
  • the bending stress ratio is less than 2 and exceeds 20000, it is possible to suppress the change in the capacitance of the detection units 11A to 11R depending on the arrangement state of the sensor sheet 1.
  • urethane foam may be used as the material for the dielectric layers 2a to 2r
  • a thermoplastic elastomer film may be used as the material for the front side base material 30 and the back side base material 40, respectively.
  • a thermoplastic elastomer film may be used as the material for the front side base material 30 and the back side base material 40, respectively.
  • PORON manufactured by Rogers INOAC Corporation PORON "is a registered trademark of Rogers Corporation. The same shall apply hereinafter
  • SS-10P is used as the material of the front side base material 30 and the back side base material 40.
  • “Esmer URS manufactured by Nihon Matai Co., Ltd.” may be used respectively.
  • a film-like hot melt adhesive using urethane foam as the material for the dielectric layers 2a to 2r and the thermoplastic polyurethane resin as the material for the front side base material 30 and the back side base material 40 May be used respectively.
  • urethane foam as the material for the dielectric layers 2a to 2r
  • thermoplastic polyurethane resin as the material for the front side base material 30 and the back side base material 40.
  • the shape of the sensor sheet 1 in the no-load state (FIGS. 2 and 5) and the arranged state (FIG. 3) is not particularly limited. For example, it may be in the shape of a flat plate or a curved plate.
  • the shape of the arrangement surface 90 shown in FIG. 3 is not particularly limited. It may be flat or curved.
  • the sensor sheet 1 may expand and contract in the surface direction.
  • a state of being expanded or contracted in the plane direction may be set as an arrangement state. Even in this case, it is possible to prevent the detection units 11A to 11R of the sensor sheet 1 from being deformed. Therefore, it is possible to suppress the change in the capacitance of the detection units 11A to 11R.
  • the shape of the sensor sheet 1 does not have to change at all.
  • the thickness of the sensor sheet 1 in the front and back directions in the no-load state (FIGS. 2 and 5) and the arranged state (FIG. 3) is not particularly limited. As shown in FIG. 2, the thickness of the sensor sheet 1 in the front-back direction may be constant. As shown in FIG. 5, the thickness of the sensor sheet 1 in the front-back direction may not be constant (at least one of the front surface and the back surface may have irregularities).
  • the number of detectors 11A to 11R arranged, the position in the plane direction (coordinates), the arrangement density, the shape, the size, etc. are not particularly limited.
  • the arrangement density of the detection units 11A to 11R may be constant over the entire surface of the sensor sheet 1.
  • the detection units 11A to 11R are attached to the parts having a high priority of detecting the load change (for example, the parts corresponding to the toes, forefoot, hindfoot, and outer foot of the sole shown in FIG. 4). It may be arranged "densely" and "coarsely” in a portion having a low priority of detecting a load change (for example, a portion corresponding to the arch of the foot shown in FIG. 4).
  • the number, position, shape, size, etc. of the front electrode layers 34a to 34r, the back electrode layers 44a to 44r, and the dielectric layers 2a to 2r are not particularly limited.
  • the shapes of the plurality of front electrode layers 34a to 34r may be the same or different.
  • the arrangement numbers, positions, shapes, etc. of the front side electrode layers 34a to 34r, the back side electrode layers 44a to 44r, and the dielectric layers 2a to 2r may be the same or different.
  • the number of arrangements of the front electrode layers 34a to 34r and the back side electrode layers 44a to 44r may be singular or plural, respectively.
  • the outer edge shapes of the front electrode layers 34a to 34r, the back electrode layers 44a to 44r, and the dielectric layers 2a to 2r when viewed from the front and back directions are not particularly limited.
  • the corners may or may not be arranged on the outer edge.
  • Examples of the shape in which the corners are arranged on the outer edge include a polygonal shape (triangular shape, quadrangular shape, pentagonal shape, hexagonal shape, etc.).
  • Examples of the shape in which the corner portion is not arranged on the outer edge include a polygonal shape in which a round chamfered portion is arranged instead of the corner portion, a perfect circular shape, an oval shape, and an elliptical shape.
  • the dielectric layers 2a to 2r When viewed from the front and back directions, at least a part of the dielectric layers 2a to 2r may protrude in the plane direction with respect to the detection units 11A to 11R.
  • the dielectric layers 2a to 2r protrude from the detection units 11A to 11R in an endless annular shape (over the entire circumference) in the plane direction, the amount of protrusion (the outer edge of the detection units 11A to 11R and the dielectric layers 2a to 2r) The distance from the outer edge) may be constant or different all around.
  • each of the adhesive layers front side first adhesive layers 31a to 31n, front side second adhesive layer 32, front side third adhesive layer 33 constituting the front side adhesive layer.
  • each of the adhesive layers constituting the back side adhesive layer back side first adhesive layer 41a to 41n, back side second adhesive layer 42, back side third adhesive layer 43.
  • the adhesive layer on at least one of the front electrode unit 3 and the back electrode unit 4 The same applies to the front side base material 30 and the back side base material 40.
  • the method of laminating each layer constituting the sensor sheet 1 is not particularly limited. Each layer may be laminated by adhesion or printing. Further, each layer may be laminated by utilizing the tackiness of the layer itself.
  • the connection method between the connector 5 shown in FIGS. 1 and 4 and the control unit 6 is not particularly limited. It may be a wired connection or a wireless connection.
  • each layer may be formed of a material containing an elastomer and a conductive material.
  • the materials of the front side base material 30 and the back side base material 40 are not particularly limited.
  • the front side base material 30 and the back side base material 40 may be formed of a resin film such as polyethylene terephthalate, polyethylene naphthalate, polyimide, or polyethylene, an elastomer sheet, or a textile (woven fabric, knitted fabric, or fabric).
  • the material of the dielectric layers 2a to 2r is not particularly limited. Preferably, it is better to use an elastomer or resin having a relatively high relative permittivity (including a foam). For example, one having a relative permittivity of 5 or more (measurement frequency 100 Hz) is preferable.
  • elastomers include urethane rubber, silicone rubber, nitrile rubber, hydride nitrile rubber, acrylic rubber, natural rubber, isoprene rubber, ethylene-propylene copolymerized rubber, butyl rubber, styrene-butadiene rubber, fluororubber, and epichlorohydrin rubber.
  • chloroprene rubber examples thereof include chloroprene rubber, chlorinated polyethylene and chlorosulfonated polyethylene.
  • the resin include polyethylene, polypropylene, polyurethane, polystyrene (including crosslinked expanded polystyrene), polyvinyl chloride, vinylidene chloride copolymer, ethylene-vinyl acetate copolymer, and ethylene-vinyl acetate-acrylic acid ester copolymer. And so on.
  • the adhesive layer front side first adhesive layer 31a to 31n, front side second adhesive layer 32, front side third adhesive layer 33, back side first adhesive layer 41a to 41n, back side second adhesive layer 42, back side third adhesive layer 43
  • the adhesive layer may be formed by a double-sided tape, a thermosetting adhesive sheet, a thermoplastic adhesive sheet, or the like. Further, by applying an adhesive to any layer constituting the sensor sheet 1. , An adhesive layer may be laminated on the layer.
  • the use of the sensor sheet 1 is not particularly limited.
  • the load distribution of the wound portion may be detected by winding the robot around a desired portion (arm portion or the like).
  • the load distribution on the sole of the foot may be detected by laying the sensor sheet 1 on the sole of the shoe as the insole sensor itself.
  • the sensor sheet 1 may be laid on a bed, a wheelchair, a mat or the like.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

La présente invention aborde le problème de la fourniture d'une feuille de capteur (1) rendant moins probable la déformation de couches diélectriques (2a à 2r) moins susceptibles d'affecter la capacité des unités de détection (11A à 11R). La feuille de capteur (1) comprend : des couches d'électrode côté avant (34a à 34r) ; des couches d'électrode côté arrière (44a à 44r) ; une pluralité de couches diélectriques (2a à 2r) qui sont disposées à distance les unes des autres dans une direction plane entre les couches d'électrode côté avant (34a à 34r) et les couches d'électrode côté arrière (44a à 44r) ; et une pluralité d'unités de détection (11A à 11R) qui sont disposées au niveau de parties où les couches d'électrode côté avant (34a à 34r), les couches diélectriques (2a à 2r), et les couches d'électrode côté arrière (44a à 44r) se chevauchent comme vu depuis la direction avant-arrière. Dans un état de non-charge, un bord extérieur des couches diélectriques (2a à 2r) est disposé plus à l'extérieur qu'un bord extérieur des unités de détection (11A à 11R). Une partie non disposée de couche diélectrique (13) où les couches diélectriques (2a à 2r) ne sont pas disposées se déforme plus facilement que les parties disposées de couche diélectrique (12A à 12R) où les couches diélectriques (2a à 2r) sont disposées.
PCT/JP2019/038630 2019-09-30 2019-09-30 Feuille de capteur WO2021064828A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/038630 WO2021064828A1 (fr) 2019-09-30 2019-09-30 Feuille de capteur
JP2020500761A JP6667058B1 (ja) 2019-09-30 2019-09-30 センサシート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/038630 WO2021064828A1 (fr) 2019-09-30 2019-09-30 Feuille de capteur

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WO2021064828A1 true WO2021064828A1 (fr) 2021-04-08

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PCT/JP2019/038630 WO2021064828A1 (fr) 2019-09-30 2019-09-30 Feuille de capteur

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JP (1) JP6667058B1 (fr)
WO (1) WO2021064828A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019003946A1 (fr) * 2017-06-29 2019-01-03 住友理工株式会社 Feuille de capteur, capteur capacitif et procédé de fabrication d'une feuille de capteur

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019003946A1 (fr) * 2017-06-29 2019-01-03 住友理工株式会社 Feuille de capteur, capteur capacitif et procédé de fabrication d'une feuille de capteur

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