WO2021059525A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2021059525A1
WO2021059525A1 PCT/JP2019/038336 JP2019038336W WO2021059525A1 WO 2021059525 A1 WO2021059525 A1 WO 2021059525A1 JP 2019038336 W JP2019038336 W JP 2019038336W WO 2021059525 A1 WO2021059525 A1 WO 2021059525A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
connection
electrode
connection plate
semiconductor chip
Prior art date
Application number
PCT/JP2019/038336
Other languages
English (en)
Japanese (ja)
Inventor
匠 平澤
聡司 柳田
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP2020545808A priority Critical patent/JP7005781B2/ja
Priority to PCT/JP2019/038336 priority patent/WO2021059525A1/fr
Publication of WO2021059525A1 publication Critical patent/WO2021059525A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
    • H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
    • H02M7/12—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/145—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means
    • H02M7/155—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only

Definitions

  • the present invention relates to an electronic device.
  • the regulator device described in Patent Document 1 has a heat-dissipating substrate formed by laminating an insulating layer and three band-shaped metal layers on a metal plate, and three band-shaped metal layers arranged on the three band-shaped metal layers.
  • lead wires are provided on each of the three first diode chips arranged on the three strip-shaped metal pieces, and a first connection piece for connecting the lead wires in common is provided. Has been done.
  • the first connection piece and the circuit board are electrically connected by the first connection line (hereinafter, appropriately referred to as "electrical connection” in the following description).
  • the three second diode chips and the three thyristor chips are also provided with lead wires, and a second connection piece for connecting the lead wires in common is provided.
  • the second connection piece and the circuit board are electrically connected by the second connection line.
  • each of the three thyristor chips is provided with a gate lead wire, and each of the gate lead wires is electrically connected to the circuit board.
  • an object of the present invention is to provide an electronic device capable of simplifying the electrical connection configuration between the semiconductor chip and the wiring board.
  • the electronic device is conductive with a wiring substrate provided with wiring, at least one semiconductor chip having a first electrode and a second electrode on one surface and a third electrode on the other surface.
  • the first electrode and the second electrode of the semiconductor chip are joined to the wiring substrate, the third electrode is joined to the connection plate, and the connection plate is the connection plate. It is characterized in that it is connected to a wiring board and is arranged in the order of the wiring board, the semiconductor chip, and the connection plate.
  • the area of the first electrode of the semiconductor chip is smaller than the area of the second electrode, and the first connecting portion and the first connecting portion connected to the wiring board are connected to both ends of the connecting plate. It may have two connecting portions, and the first electrode may be arranged on a connecting straight line connecting the first connecting portion and the second connecting portion.
  • connection straight line passes through the center of the first connection portion and the second connection portion in a direction orthogonal to the connection straight line on the surface of the connection plate to which the semiconductor chip is bonded. You may be.
  • the first connection portion and the second connection portion connected to the wiring board are provided at both ends of the connection plate, and the first connection portion and the second connection portion are described. It may be connected while being inserted into the wiring board.
  • the wiring board, the semiconductor chip, and the connection plate may be joined by using a conductive bonding material, respectively.
  • the semiconductor chip may have a rectangular shape, and the first electrode may be provided at a position near a corner portion on one surface of the semiconductor chip.
  • connection plate may be provided with a chip mounting portion for aligning and joining the semiconductor chips at predetermined positions.
  • the chip mounting portion may have a convex shape.
  • the electronic device having the above configuration may include a case having heat-dissipating fins and accommodating the wiring board, the semiconductor chip, and the connection plate, and the heat-dissipating fins may be arranged on the connection plate side.
  • the wiring board, the semiconductor chip, and the conductive connection plate are directly bonded, the electrical connection configuration between the semiconductor chip and the wiring board can be simplified.
  • FIG. 1 It is an exploded perspective view which shows the structure of the regulator apparatus which concerns on this embodiment. It is a perspective view of the connection plate and the thyristor which constitute the circuit board in the said regulator device. It is a perspective view which shows the state which the said connection board and a thyristor are attached to a wiring board. It is sectional drawing at the position along line IV-IV in the state which the regulator apparatus shown in FIG. 1 is assembled. It is an enlarged view of the region V shown by the alternate long and short dash line in FIG. It is a circuit diagram which shows the circuit structure of the said regulator device. It is sectional drawing at the position of arrow VII-VII in FIG. It is an enlarged view of the region VIII shown by the alternate long and short dash line in FIG. 7. It is a top view when the arrangement direction of a thyristor with respect to the said connection plate is changed.
  • the directions indicated by the up / down, left / right, and front / back arrows shown in FIG. 1 and the like are referred to as the up / down direction, the left / right direction, and the front / back direction.
  • a regulator device mounted on a vehicle such as an automobile or a motorcycle and rectifying and voltage-controlling the electric power generated by the generator when the vehicle is running and supplying the battery to the battery will be described. ..
  • the regulator device 1 includes a circuit board 50 on which a plurality of electronic components are mounted, a case 10 for accommodating the circuit board 50 inside, and a connector 20 attached to the case 10. Be prepared.
  • the case 10 is formed in a rectangular box shape that opens upward, and the circuit board 50 is inserted through the upper opening 11 so that the circuit board 50 can be housed inside.
  • a substrate accommodating portion 12 board accommodating space
  • the rear wall portion of the case 10 is provided with a rear opening portion 13 that penetrates in the front-rear direction and communicates with the substrate accommodating portion 12 and also opens upward.
  • the left and right wall portions of the case 10 are provided with plate-shaped flange portions 14 extending outward from the upper ends of the left and right wall portions. Screw insertion holes 15 penetrating in the vertical direction are formed in the left and right flange portions 14, respectively.
  • the case 10 is fixed to the vehicle by screws inserted into the left and right screw insertion holes 15.
  • a plurality of plate-shaped heat radiating fins 16 extending in the left-right direction are integrally molded with the case 10.
  • the plurality of heat radiation fins 16 are arranged side by side on the lower surface of the case 10 at predetermined intervals in the front-rear direction.
  • the connector 20 is a male connector having a rectangular box-shaped housing 21 opened rearward and five connection terminals 25 provided in the housing 21.
  • a female connector provided on a cable connected to a generator, a battery, or the like mounted on a vehicle is fitted into the connector 20.
  • the housing 21 is formed of an insulating material such as resin and has a connection opening 22 that opens rearward.
  • Mounting grooves 23 having a U-shaped cross section are formed at the left and right end portions and the lower end portions of the front surface of the housing 21 so as to extend in the vertical direction or the horizontal direction, respectively.
  • the connector 20 is attached to the case 10 by inserting the connector 20 into the rear opening 13 from above so that the rear wall portion forming the rear opening 13 of the case 10 is inserted into the left and right mounting grooves 23.
  • Each of the five connection terminals 25 is formed in a plate shape using a conductive material such as metal, and is provided in the housing 21 in a state of penetrating the front wall portion of the housing 21 and extending in the front-rear direction.
  • the rear end of each connection terminal 25 extends into the housing 21 to the vicinity of the connection opening 22.
  • the front end side of each connection terminal 25 has an L shape that is bent upward after penetrating the front wall portion of the housing 21 (see FIG. 4).
  • the front end side of each connection terminal 25 is fixed by a conductive bonding material such as a solder material in a state of being inserted into each of the five terminal insertion holes 63 formed in the circuit board 50. When fixed in this way, each connection terminal 25 is electrically connected to the terminal connection wiring provided on the circuit board 50.
  • the circuit board 50 includes a wiring board 60 provided with a plurality of wirings, six thyristors 70 mounted on the wiring board 60, and four connection boards for electrically connecting the six thyristors 70 to the wiring board 60, respectively. Equipped with 80.
  • the wiring board 60 is a printed circuit board in which a plurality of wirings are formed on the lower surface of a rectangular board.
  • a control circuit 90 (see FIG. 6) that controls six thyristors 70 is mounted on the wiring board 60 as a packaged electronic component.
  • a plurality of mounting holes 65 for mounting each connection plate 80 are formed in the wiring board 60 so as to penetrate in the vertical direction.
  • each of the six thylisters 70 has a gate electrode G (gate terminal) and a cathode electrode C (cathode terminal) on the upper surface of the rectangular semiconductor chip T, and an anode electrode on the lower surface, respectively. It is a three-terminal semiconductor element (bare chip) having A (anode terminal) and capable of conducting conduction between the anode electrode A and the cathode electrode C by passing a gate current from the gate electrode G to the cathode electrode C.
  • Each thyristor 70 is provided with a gate electrode G at a position near one corner on the upper surface of the rectangular semiconductor chip. In each thyristor 70, the surface area of the gate electrode G (gate electrode area) is smaller than the surface area of the cathode electrode C (cathode electrode area).
  • Each of the four connecting plates 80 is formed in a rectangular flat plate shape using a metal material (conductive material) such as copper. At both ends of each connection plate 80 in the longitudinal direction, a substrate connection portion 81 integrally formed by bending the end portion side upward is provided.
  • the four connecting plates 80 have the same configuration except that the length in the longitudinal direction (the number of thyristors 70 that can be mounted) is different. Therefore, the configuration of the connection plate 80 other than the above will be described with reference to the connection plate 80 shown in FIG.
  • the width W1 in the front-rear direction of the left and right board connection portions 81 is smaller than the width W in the lateral direction (front-rear direction) of the connection plate 80, respectively.
  • the left and right substrate connecting portions 81 are arranged at the left and right both ends of the connecting plate 80 so as to overlap with each other in a plan view.
  • the left and right board connecting portions 81 are provided at the center positions of the connecting plate 80 in the lateral direction (front-rear direction).
  • three square convex chip mounting portions 82 corresponding to the chip shape of the thyristor 70 are provided side by side in the longitudinal direction of the connection plate 80.
  • Each of the three chip mounting portions 82 is provided on the upper surface of the connecting plate 80 at a position and angle at which one diagonal line of each chip mounting portion 82 overlaps the straight line L1 in a plan view.
  • the straight line L1 is an example of the "connecting straight line" described in the claims.
  • the lower surface of the thyristor 70 and the anode electrodes A provided on the lower surface are bonded to the upper surfaces of the three chip mounting portions 82 of the connection plate 80, respectively, via a conductive bonding material.
  • the gate electrode G provided on the upper surface of the thyristor 70 is arranged so as to overlap in a plan view on the straight line L1 (a straight line connecting the center positions of the front-rear width W1 of the left and right substrate connecting portions 81 in the connecting plate 80). Will be done.
  • the conductive bonding material is a conductive bonding material that is cured by heating. For example, a solder paste, a silver paste, a conductive adhesive in which conductive nanoparticles are dispersed in an adhesive, a solder material, or the like. Is. The same applies to the conductive bonding materials described below.
  • the left and right board connection portions 81 are inserted into the mounting holes 65 from the lower surface side of the wiring board 60 and project to the upper surface side. In the inserted state, it is fixed to the wiring board 60 by the conductive bonding material. When fixed in this way, the left and right board connection portions 81 are electrically connected to the anode connection wiring provided on the lower surface of the wiring board 60. Then, the anode electrodes A provided on the lower surfaces of the three thyristors 70 are electrically connected to the anode connection wiring of the wiring board 60 via the connection plate 80, respectively.
  • each thyristor 70 is electrically connected in a laminated state sandwiched between the lower surface of the wiring board 60 and the upper surface of the connection plate 80 (see also FIGS. 4 and 5).
  • the circuit board 50 configured in this way has a case 10 on the lower surface side of the circuit board 50 provided with each thyristor 70 with respect to the case 10 to which the connector 20 is attached as described above.
  • the circuit board 50 is inserted into the substrate accommodating portion 12 through the upper opening 11 of the case 10 and the circuit board 50 is accommodated in the substrate accommodating portion 12.
  • the end portions of the connection terminals 25 of the connector 20 are inserted into the terminal insertion holes 63 formed in the wiring board 60 from the lower surface side of the wiring board 60 and protrude toward the upper surface side. It becomes.
  • each connection terminal 25 is fixed to the wiring board 60 with a conductive bonding material, and each connection terminal 25 and each wiring provided on the lower surface of the wiring board 60 are electrically connected.
  • a sealing resin 30 such as a hard epoxy resin is injected into the substrate accommodating portion 12 accommodating the circuit board 50 in this way from the upper opening 11, and the circuit board 50 is sealed in the substrate accommodating portion 12.
  • the lower surface side (the surface on which the thyristor 70 is placed) of the connection plate 80 fixed to the wiring board 60 is placed.
  • the opposite side) is arranged so as to be close to the inner surface of the lower wall portion of the case 10 forming the substrate accommodating portion 12.
  • the plurality of heat radiation fins 16 described above are provided on the outer surface of the lower wall portion of the case 10, and the connection plate 80 and the plurality of heat radiation fins 16 are arranged close to each other.
  • the female connector of the cable connected to the generator ACG (alternator), the battery B, and the load LOAD (electrical components) mounted on the vehicle is fitted to the connector 20.
  • the three connection terminals 25 in the connector 20 are electrically connected to the generator ACG via the female connector and the cable, and the remaining two connection terminals 25 are connected. It is electrically connected to the battery B and the load LOAD via the female connector and the cable.
  • the control circuit 90 provided on the wiring board 60 outputs gate currents to the gate electrodes G of the six thyristors 70, respectively, and controls the operation (on / off control) of each thyristor 70 to control the vehicle. It is configured to supply the DC Vout obtained by rectifying and voltage-controlling the three-phase alternating current generated by the generator ACG during traveling to the battery B and the load LOAD.
  • connection plate 80 on which the thyristor 70 is mounted is fixed to the wiring board 60, so that the anode electrode A of the thyristor 70 is joined to the connection plate 80 to connect the connection plate 80.
  • the gate electrode G and the cathode electrode C are electrically connected to the wiring board 60 via the wiring board 60, and are electrically connected to the wiring board 60, and are arranged in a laminated state with the thyristor 70 sandwiched between the wiring board 60 and the connection board 80. It has become like.
  • the thyristor 70 and the wiring board are compared with the conventional configuration having a plurality of lead wires and connecting members.
  • the electrical connection configuration with the 60 can be simplified.
  • the regulator device 1 when fixing the connection plate 80 to the wiring board 60, it is ideal that the lower surface of the wiring board 60 and the upper surface of the connection plate 80 are fixed in parallel as shown in FIG. .. However, when the connection plate 80 is fixed to the wiring board 60 in a state where the upper surface of the connection plate 80 is inclined with respect to the lower surface of the wiring board 60 as shown in FIG. 7 due to various factors in the assembly manufacturing process. There is. Therefore, in the regulator device 1, the gate electrode G of the thyristor 70 mounted on the connection plate 80 overlaps in a plan view on a straight line L1 connecting the center positions of the front-rear width W1 of the left and right substrate connection portions 81 on the connection plate 80. It is designed to be arranged like this.
  • connection plate 80 is fixed to the wiring board 60 in an inclined state as described above, since the gate electrode G of the thyristor 70 is arranged on the straight line L1, it is more than the cathode electrode C. It is possible to secure a state in which the gate electrode G having a small surface area is joined to the wiring board 60 (see FIGS. 7 and 8). Thereby, the connection reliability between the thyristor 70 and the wiring board 60 can be improved.
  • connection plate 80 is fixed to the wiring board 60 in an inserted state in which the left and right board connection portions 81 are inserted from the lower surface side of the wiring board 60 and protrudes to the upper surface side. Since the connection plate 80 is fixed in this way, the connection plate 80 can be easily aligned (positioned) with respect to the wiring board 60. Further, even when wiring is formed on the upper surface or inside of the wiring board 60, the connection plate 80 can be electrically connected to the wiring as well.
  • a convex chip mounting portion 82 corresponding to the chip shape of the thyristor 70 is provided on the upper surface of the connection plate 80, and the thyristor 70 is mounted and joined to the chip mounting portion 82. It has become. Since the chip mounting portion 82 is provided in this way, the thyristor 70 can be easily aligned with the connection plate 80.
  • the chip mounting portion 82 does not have the convex shape as described above, and may be formed in a concave shape corresponding to the chip shape of the thyristor 70.
  • the embodiment according to the present invention has been described so far, the above embodiment is an example, and the present invention is not limited to the above embodiment.
  • the present invention can be omitted, replaced, or modified in various ways without departing from the gist of the invention.
  • the gate electrode G of the thyristor 70 overlaps in a plan view on a straight line L1 connecting the center positions of the front-rear width W1 of the left and right substrate connection portions 81 of the connection plate 80.
  • the thyristor 70 is mounted on the connecting plate 80.
  • the thyristor 70 may be placed on the connecting plate 80 at a position and angle at which the gate electrode G does not overlap on the straight line L1 in a plan view.
  • the connection plate 80 is fixed in an inclined state with respect to the wiring board 60 as described above, the gate electrode G may not be joined to the wiring board 60. Therefore, it is preferable to use the arrangement configuration of the thyristor 70 in the above embodiment.
  • the left and right board connecting portions 81 of the connecting plate 80 may be divided into a plurality of parts in the lateral direction.
  • the thyristor 70 is connected to the connecting plate so that the gate electrode G of the thyristor 70 overlaps in a plan view on a straight line passing through the center position in the lateral direction of the entire board connecting portion divided into a plurality of parts. If it is mounted on the 80, the connection reliability between the thyristor 70 and the wiring board 60 can be improved as in the above embodiment.
  • the configuration in which the thyristor 70 is mounted on the connection plate 80 has been described, but instead of the thyristor, other three-terminal semiconductor elements such as MOSFETs and IGBTs may be used.
  • the regulator device has been described as an example of the electronic device according to the present invention, but the present invention can be applied to at least other electronic devices including a wiring board and a semiconductor chip.

Abstract

L'invention concerne un dispositif électronique qui comprend : une carte de câblage ayant un câblage ; au moins une puce semi-conductrice ayant une première électrode et une deuxième électrode sur une surface de celle-ci, et une troisième électrode sur une autre surface de celle-ci ; et une plaque de connexion plane électriquement conductrice. La première électrode et la deuxième électrode de la puce semi-conductrice sont reliées à la carte de câblage, la troisième électrode est jointe à la plaque de connexion, et la plaque de connexion est connectée à la carte de câblage. La carte de câblage, la puce semi-conductrice et la plaque de connexion sont agencées dans cet ordre.
PCT/JP2019/038336 2019-09-27 2019-09-27 Dispositif électronique WO2021059525A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020545808A JP7005781B2 (ja) 2019-09-27 2019-09-27 電子装置
PCT/JP2019/038336 WO2021059525A1 (fr) 2019-09-27 2019-09-27 Dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/038336 WO2021059525A1 (fr) 2019-09-27 2019-09-27 Dispositif électronique

Publications (1)

Publication Number Publication Date
WO2021059525A1 true WO2021059525A1 (fr) 2021-04-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/038336 WO2021059525A1 (fr) 2019-09-27 2019-09-27 Dispositif électronique

Country Status (2)

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JP (1) JP7005781B2 (fr)
WO (1) WO2021059525A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338577A (ja) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd 回路基板装置
JP2006073664A (ja) * 2004-08-31 2006-03-16 Toshiba Corp 半導体モジュール
JP2009152505A (ja) * 2007-12-24 2009-07-09 Denso Corp 半導体モジュールの実装構造
WO2017203559A1 (fr) * 2016-05-23 2017-11-30 新電元工業株式会社 Procédé d'assemblage de cartes de circuit imprimé, dispositif électronique et son procédé de production

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338577A (ja) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd 回路基板装置
JP2006073664A (ja) * 2004-08-31 2006-03-16 Toshiba Corp 半導体モジュール
JP2009152505A (ja) * 2007-12-24 2009-07-09 Denso Corp 半導体モジュールの実装構造
WO2017203559A1 (fr) * 2016-05-23 2017-11-30 新電元工業株式会社 Procédé d'assemblage de cartes de circuit imprimé, dispositif électronique et son procédé de production

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JP7005781B2 (ja) 2022-01-24

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