WO2021059525A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2021059525A1
WO2021059525A1 PCT/JP2019/038336 JP2019038336W WO2021059525A1 WO 2021059525 A1 WO2021059525 A1 WO 2021059525A1 JP 2019038336 W JP2019038336 W JP 2019038336W WO 2021059525 A1 WO2021059525 A1 WO 2021059525A1
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WO
WIPO (PCT)
Prior art keywords
wiring board
connection
electrode
connection plate
semiconductor chip
Prior art date
Application number
PCT/JP2019/038336
Other languages
French (fr)
Japanese (ja)
Inventor
匠 平澤
聡司 柳田
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP2020545808A priority Critical patent/JP7005781B2/en
Priority to PCT/JP2019/038336 priority patent/WO2021059525A1/en
Publication of WO2021059525A1 publication Critical patent/WO2021059525A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
    • H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
    • H02M7/12—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/145—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means
    • H02M7/155—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only

Definitions

  • the present invention relates to an electronic device.
  • the regulator device described in Patent Document 1 has a heat-dissipating substrate formed by laminating an insulating layer and three band-shaped metal layers on a metal plate, and three band-shaped metal layers arranged on the three band-shaped metal layers.
  • lead wires are provided on each of the three first diode chips arranged on the three strip-shaped metal pieces, and a first connection piece for connecting the lead wires in common is provided. Has been done.
  • the first connection piece and the circuit board are electrically connected by the first connection line (hereinafter, appropriately referred to as "electrical connection” in the following description).
  • the three second diode chips and the three thyristor chips are also provided with lead wires, and a second connection piece for connecting the lead wires in common is provided.
  • the second connection piece and the circuit board are electrically connected by the second connection line.
  • each of the three thyristor chips is provided with a gate lead wire, and each of the gate lead wires is electrically connected to the circuit board.
  • an object of the present invention is to provide an electronic device capable of simplifying the electrical connection configuration between the semiconductor chip and the wiring board.
  • the electronic device is conductive with a wiring substrate provided with wiring, at least one semiconductor chip having a first electrode and a second electrode on one surface and a third electrode on the other surface.
  • the first electrode and the second electrode of the semiconductor chip are joined to the wiring substrate, the third electrode is joined to the connection plate, and the connection plate is the connection plate. It is characterized in that it is connected to a wiring board and is arranged in the order of the wiring board, the semiconductor chip, and the connection plate.
  • the area of the first electrode of the semiconductor chip is smaller than the area of the second electrode, and the first connecting portion and the first connecting portion connected to the wiring board are connected to both ends of the connecting plate. It may have two connecting portions, and the first electrode may be arranged on a connecting straight line connecting the first connecting portion and the second connecting portion.
  • connection straight line passes through the center of the first connection portion and the second connection portion in a direction orthogonal to the connection straight line on the surface of the connection plate to which the semiconductor chip is bonded. You may be.
  • the first connection portion and the second connection portion connected to the wiring board are provided at both ends of the connection plate, and the first connection portion and the second connection portion are described. It may be connected while being inserted into the wiring board.
  • the wiring board, the semiconductor chip, and the connection plate may be joined by using a conductive bonding material, respectively.
  • the semiconductor chip may have a rectangular shape, and the first electrode may be provided at a position near a corner portion on one surface of the semiconductor chip.
  • connection plate may be provided with a chip mounting portion for aligning and joining the semiconductor chips at predetermined positions.
  • the chip mounting portion may have a convex shape.
  • the electronic device having the above configuration may include a case having heat-dissipating fins and accommodating the wiring board, the semiconductor chip, and the connection plate, and the heat-dissipating fins may be arranged on the connection plate side.
  • the wiring board, the semiconductor chip, and the conductive connection plate are directly bonded, the electrical connection configuration between the semiconductor chip and the wiring board can be simplified.
  • FIG. 1 It is an exploded perspective view which shows the structure of the regulator apparatus which concerns on this embodiment. It is a perspective view of the connection plate and the thyristor which constitute the circuit board in the said regulator device. It is a perspective view which shows the state which the said connection board and a thyristor are attached to a wiring board. It is sectional drawing at the position along line IV-IV in the state which the regulator apparatus shown in FIG. 1 is assembled. It is an enlarged view of the region V shown by the alternate long and short dash line in FIG. It is a circuit diagram which shows the circuit structure of the said regulator device. It is sectional drawing at the position of arrow VII-VII in FIG. It is an enlarged view of the region VIII shown by the alternate long and short dash line in FIG. 7. It is a top view when the arrangement direction of a thyristor with respect to the said connection plate is changed.
  • the directions indicated by the up / down, left / right, and front / back arrows shown in FIG. 1 and the like are referred to as the up / down direction, the left / right direction, and the front / back direction.
  • a regulator device mounted on a vehicle such as an automobile or a motorcycle and rectifying and voltage-controlling the electric power generated by the generator when the vehicle is running and supplying the battery to the battery will be described. ..
  • the regulator device 1 includes a circuit board 50 on which a plurality of electronic components are mounted, a case 10 for accommodating the circuit board 50 inside, and a connector 20 attached to the case 10. Be prepared.
  • the case 10 is formed in a rectangular box shape that opens upward, and the circuit board 50 is inserted through the upper opening 11 so that the circuit board 50 can be housed inside.
  • a substrate accommodating portion 12 board accommodating space
  • the rear wall portion of the case 10 is provided with a rear opening portion 13 that penetrates in the front-rear direction and communicates with the substrate accommodating portion 12 and also opens upward.
  • the left and right wall portions of the case 10 are provided with plate-shaped flange portions 14 extending outward from the upper ends of the left and right wall portions. Screw insertion holes 15 penetrating in the vertical direction are formed in the left and right flange portions 14, respectively.
  • the case 10 is fixed to the vehicle by screws inserted into the left and right screw insertion holes 15.
  • a plurality of plate-shaped heat radiating fins 16 extending in the left-right direction are integrally molded with the case 10.
  • the plurality of heat radiation fins 16 are arranged side by side on the lower surface of the case 10 at predetermined intervals in the front-rear direction.
  • the connector 20 is a male connector having a rectangular box-shaped housing 21 opened rearward and five connection terminals 25 provided in the housing 21.
  • a female connector provided on a cable connected to a generator, a battery, or the like mounted on a vehicle is fitted into the connector 20.
  • the housing 21 is formed of an insulating material such as resin and has a connection opening 22 that opens rearward.
  • Mounting grooves 23 having a U-shaped cross section are formed at the left and right end portions and the lower end portions of the front surface of the housing 21 so as to extend in the vertical direction or the horizontal direction, respectively.
  • the connector 20 is attached to the case 10 by inserting the connector 20 into the rear opening 13 from above so that the rear wall portion forming the rear opening 13 of the case 10 is inserted into the left and right mounting grooves 23.
  • Each of the five connection terminals 25 is formed in a plate shape using a conductive material such as metal, and is provided in the housing 21 in a state of penetrating the front wall portion of the housing 21 and extending in the front-rear direction.
  • the rear end of each connection terminal 25 extends into the housing 21 to the vicinity of the connection opening 22.
  • the front end side of each connection terminal 25 has an L shape that is bent upward after penetrating the front wall portion of the housing 21 (see FIG. 4).
  • the front end side of each connection terminal 25 is fixed by a conductive bonding material such as a solder material in a state of being inserted into each of the five terminal insertion holes 63 formed in the circuit board 50. When fixed in this way, each connection terminal 25 is electrically connected to the terminal connection wiring provided on the circuit board 50.
  • the circuit board 50 includes a wiring board 60 provided with a plurality of wirings, six thyristors 70 mounted on the wiring board 60, and four connection boards for electrically connecting the six thyristors 70 to the wiring board 60, respectively. Equipped with 80.
  • the wiring board 60 is a printed circuit board in which a plurality of wirings are formed on the lower surface of a rectangular board.
  • a control circuit 90 (see FIG. 6) that controls six thyristors 70 is mounted on the wiring board 60 as a packaged electronic component.
  • a plurality of mounting holes 65 for mounting each connection plate 80 are formed in the wiring board 60 so as to penetrate in the vertical direction.
  • each of the six thylisters 70 has a gate electrode G (gate terminal) and a cathode electrode C (cathode terminal) on the upper surface of the rectangular semiconductor chip T, and an anode electrode on the lower surface, respectively. It is a three-terminal semiconductor element (bare chip) having A (anode terminal) and capable of conducting conduction between the anode electrode A and the cathode electrode C by passing a gate current from the gate electrode G to the cathode electrode C.
  • Each thyristor 70 is provided with a gate electrode G at a position near one corner on the upper surface of the rectangular semiconductor chip. In each thyristor 70, the surface area of the gate electrode G (gate electrode area) is smaller than the surface area of the cathode electrode C (cathode electrode area).
  • Each of the four connecting plates 80 is formed in a rectangular flat plate shape using a metal material (conductive material) such as copper. At both ends of each connection plate 80 in the longitudinal direction, a substrate connection portion 81 integrally formed by bending the end portion side upward is provided.
  • the four connecting plates 80 have the same configuration except that the length in the longitudinal direction (the number of thyristors 70 that can be mounted) is different. Therefore, the configuration of the connection plate 80 other than the above will be described with reference to the connection plate 80 shown in FIG.
  • the width W1 in the front-rear direction of the left and right board connection portions 81 is smaller than the width W in the lateral direction (front-rear direction) of the connection plate 80, respectively.
  • the left and right substrate connecting portions 81 are arranged at the left and right both ends of the connecting plate 80 so as to overlap with each other in a plan view.
  • the left and right board connecting portions 81 are provided at the center positions of the connecting plate 80 in the lateral direction (front-rear direction).
  • three square convex chip mounting portions 82 corresponding to the chip shape of the thyristor 70 are provided side by side in the longitudinal direction of the connection plate 80.
  • Each of the three chip mounting portions 82 is provided on the upper surface of the connecting plate 80 at a position and angle at which one diagonal line of each chip mounting portion 82 overlaps the straight line L1 in a plan view.
  • the straight line L1 is an example of the "connecting straight line" described in the claims.
  • the lower surface of the thyristor 70 and the anode electrodes A provided on the lower surface are bonded to the upper surfaces of the three chip mounting portions 82 of the connection plate 80, respectively, via a conductive bonding material.
  • the gate electrode G provided on the upper surface of the thyristor 70 is arranged so as to overlap in a plan view on the straight line L1 (a straight line connecting the center positions of the front-rear width W1 of the left and right substrate connecting portions 81 in the connecting plate 80). Will be done.
  • the conductive bonding material is a conductive bonding material that is cured by heating. For example, a solder paste, a silver paste, a conductive adhesive in which conductive nanoparticles are dispersed in an adhesive, a solder material, or the like. Is. The same applies to the conductive bonding materials described below.
  • the left and right board connection portions 81 are inserted into the mounting holes 65 from the lower surface side of the wiring board 60 and project to the upper surface side. In the inserted state, it is fixed to the wiring board 60 by the conductive bonding material. When fixed in this way, the left and right board connection portions 81 are electrically connected to the anode connection wiring provided on the lower surface of the wiring board 60. Then, the anode electrodes A provided on the lower surfaces of the three thyristors 70 are electrically connected to the anode connection wiring of the wiring board 60 via the connection plate 80, respectively.
  • each thyristor 70 is electrically connected in a laminated state sandwiched between the lower surface of the wiring board 60 and the upper surface of the connection plate 80 (see also FIGS. 4 and 5).
  • the circuit board 50 configured in this way has a case 10 on the lower surface side of the circuit board 50 provided with each thyristor 70 with respect to the case 10 to which the connector 20 is attached as described above.
  • the circuit board 50 is inserted into the substrate accommodating portion 12 through the upper opening 11 of the case 10 and the circuit board 50 is accommodated in the substrate accommodating portion 12.
  • the end portions of the connection terminals 25 of the connector 20 are inserted into the terminal insertion holes 63 formed in the wiring board 60 from the lower surface side of the wiring board 60 and protrude toward the upper surface side. It becomes.
  • each connection terminal 25 is fixed to the wiring board 60 with a conductive bonding material, and each connection terminal 25 and each wiring provided on the lower surface of the wiring board 60 are electrically connected.
  • a sealing resin 30 such as a hard epoxy resin is injected into the substrate accommodating portion 12 accommodating the circuit board 50 in this way from the upper opening 11, and the circuit board 50 is sealed in the substrate accommodating portion 12.
  • the lower surface side (the surface on which the thyristor 70 is placed) of the connection plate 80 fixed to the wiring board 60 is placed.
  • the opposite side) is arranged so as to be close to the inner surface of the lower wall portion of the case 10 forming the substrate accommodating portion 12.
  • the plurality of heat radiation fins 16 described above are provided on the outer surface of the lower wall portion of the case 10, and the connection plate 80 and the plurality of heat radiation fins 16 are arranged close to each other.
  • the female connector of the cable connected to the generator ACG (alternator), the battery B, and the load LOAD (electrical components) mounted on the vehicle is fitted to the connector 20.
  • the three connection terminals 25 in the connector 20 are electrically connected to the generator ACG via the female connector and the cable, and the remaining two connection terminals 25 are connected. It is electrically connected to the battery B and the load LOAD via the female connector and the cable.
  • the control circuit 90 provided on the wiring board 60 outputs gate currents to the gate electrodes G of the six thyristors 70, respectively, and controls the operation (on / off control) of each thyristor 70 to control the vehicle. It is configured to supply the DC Vout obtained by rectifying and voltage-controlling the three-phase alternating current generated by the generator ACG during traveling to the battery B and the load LOAD.
  • connection plate 80 on which the thyristor 70 is mounted is fixed to the wiring board 60, so that the anode electrode A of the thyristor 70 is joined to the connection plate 80 to connect the connection plate 80.
  • the gate electrode G and the cathode electrode C are electrically connected to the wiring board 60 via the wiring board 60, and are electrically connected to the wiring board 60, and are arranged in a laminated state with the thyristor 70 sandwiched between the wiring board 60 and the connection board 80. It has become like.
  • the thyristor 70 and the wiring board are compared with the conventional configuration having a plurality of lead wires and connecting members.
  • the electrical connection configuration with the 60 can be simplified.
  • the regulator device 1 when fixing the connection plate 80 to the wiring board 60, it is ideal that the lower surface of the wiring board 60 and the upper surface of the connection plate 80 are fixed in parallel as shown in FIG. .. However, when the connection plate 80 is fixed to the wiring board 60 in a state where the upper surface of the connection plate 80 is inclined with respect to the lower surface of the wiring board 60 as shown in FIG. 7 due to various factors in the assembly manufacturing process. There is. Therefore, in the regulator device 1, the gate electrode G of the thyristor 70 mounted on the connection plate 80 overlaps in a plan view on a straight line L1 connecting the center positions of the front-rear width W1 of the left and right substrate connection portions 81 on the connection plate 80. It is designed to be arranged like this.
  • connection plate 80 is fixed to the wiring board 60 in an inclined state as described above, since the gate electrode G of the thyristor 70 is arranged on the straight line L1, it is more than the cathode electrode C. It is possible to secure a state in which the gate electrode G having a small surface area is joined to the wiring board 60 (see FIGS. 7 and 8). Thereby, the connection reliability between the thyristor 70 and the wiring board 60 can be improved.
  • connection plate 80 is fixed to the wiring board 60 in an inserted state in which the left and right board connection portions 81 are inserted from the lower surface side of the wiring board 60 and protrudes to the upper surface side. Since the connection plate 80 is fixed in this way, the connection plate 80 can be easily aligned (positioned) with respect to the wiring board 60. Further, even when wiring is formed on the upper surface or inside of the wiring board 60, the connection plate 80 can be electrically connected to the wiring as well.
  • a convex chip mounting portion 82 corresponding to the chip shape of the thyristor 70 is provided on the upper surface of the connection plate 80, and the thyristor 70 is mounted and joined to the chip mounting portion 82. It has become. Since the chip mounting portion 82 is provided in this way, the thyristor 70 can be easily aligned with the connection plate 80.
  • the chip mounting portion 82 does not have the convex shape as described above, and may be formed in a concave shape corresponding to the chip shape of the thyristor 70.
  • the embodiment according to the present invention has been described so far, the above embodiment is an example, and the present invention is not limited to the above embodiment.
  • the present invention can be omitted, replaced, or modified in various ways without departing from the gist of the invention.
  • the gate electrode G of the thyristor 70 overlaps in a plan view on a straight line L1 connecting the center positions of the front-rear width W1 of the left and right substrate connection portions 81 of the connection plate 80.
  • the thyristor 70 is mounted on the connecting plate 80.
  • the thyristor 70 may be placed on the connecting plate 80 at a position and angle at which the gate electrode G does not overlap on the straight line L1 in a plan view.
  • the connection plate 80 is fixed in an inclined state with respect to the wiring board 60 as described above, the gate electrode G may not be joined to the wiring board 60. Therefore, it is preferable to use the arrangement configuration of the thyristor 70 in the above embodiment.
  • the left and right board connecting portions 81 of the connecting plate 80 may be divided into a plurality of parts in the lateral direction.
  • the thyristor 70 is connected to the connecting plate so that the gate electrode G of the thyristor 70 overlaps in a plan view on a straight line passing through the center position in the lateral direction of the entire board connecting portion divided into a plurality of parts. If it is mounted on the 80, the connection reliability between the thyristor 70 and the wiring board 60 can be improved as in the above embodiment.
  • the configuration in which the thyristor 70 is mounted on the connection plate 80 has been described, but instead of the thyristor, other three-terminal semiconductor elements such as MOSFETs and IGBTs may be used.
  • the regulator device has been described as an example of the electronic device according to the present invention, but the present invention can be applied to at least other electronic devices including a wiring board and a semiconductor chip.

Abstract

This electronic device is provided with: a wiring board having wiring; at least one semiconductor chip having a first electrode and a second electrode on one surface thereof, and a third electrode on another surface thereof; and an electrically conductive planar connecting plate. The first electrode and the second electrode of the semiconductor chip are joined to the wiring board, the third electrode is joined to the connecting plate, and the connecting plate is connected to the wiring board. The wiring board, the semiconductor chip, and the connecting plate are arranged in this order.

Description

電子装置Electronic device
　本発明は、電子装置に関する。 The present invention relates to an electronic device.
　配線基板及び半導体チップを備える電子装置の一例として、車両に搭載されて交流発電機の出力を整流するレギュレータ装置がある（例えば、特許文献１参照）。特許文献１に記載のレギュレータ装置は、金属板上に絶縁層及び３個の帯状金属層が積層されて構成された放熱基板と、３個の帯状金属層上に配設された３個の帯状金属片と、これらの帯状金属片上にそれぞれ設けられた第１ダイオードチップ、第２ダイオードチップ及びサイリスタチップと、第２ダイオードチップ及びサイリスタチップの上方に所定の間隔をあけて配置された回路基板と、を備えている。 As an example of an electronic device including a wiring board and a semiconductor chip, there is a regulator device mounted on a vehicle to rectify the output of an AC generator (see, for example, Patent Document 1). The regulator device described in Patent Document 1 has a heat-dissipating substrate formed by laminating an insulating layer and three band-shaped metal layers on a metal plate, and three band-shaped metal layers arranged on the three band-shaped metal layers. A metal piece, a first diode chip, a second diode chip and a psyllista chip provided on each of these strip-shaped metal pieces, and a circuit board arranged above the second diode chip and the psyllista chip at predetermined intervals. , Is equipped.
　特許文献１に記載のレギュレータ装置では、３個の帯状金属片上に配設された３個の第１ダイオードチップにそれぞれリード線が設けられ、それらのリード線を共通接続する第１接続片が設けられている。この第１接続片と回路基板とが第１接続線により電気的に接続（以降の説明で「電気接続」と適宜称する）されている。また、３個の第２ダイオードチップ及び３個のサイリスタチップにもそれぞれリード線が設けられ、それらのリード線を共通接続する第２接続片が設けられている。この第２接続片と回路基板とが第２接続線により電気接続されている。さらに、３個のサイリスタチップにはそれぞれゲートリード線が設けられ、それらのゲートリード線がそれぞれ回路基板に電気接続されている。 In the regulator device described in Patent Document 1, lead wires are provided on each of the three first diode chips arranged on the three strip-shaped metal pieces, and a first connection piece for connecting the lead wires in common is provided. Has been done. The first connection piece and the circuit board are electrically connected by the first connection line (hereinafter, appropriately referred to as "electrical connection" in the following description). Further, the three second diode chips and the three thyristor chips are also provided with lead wires, and a second connection piece for connecting the lead wires in common is provided. The second connection piece and the circuit board are electrically connected by the second connection line. Further, each of the three thyristor chips is provided with a gate lead wire, and each of the gate lead wires is electrically connected to the circuit board.
実公平３‐２３８２８号公報Jitsufuku No. 3-23828
　上述のように、特許文献１のレギュレータ装置では、複数の第１及び第２ダイオードチップ並びに複数のサイリスタチップと、回路基板とを電気接続するために、各チップに配設された複数のリード線、第１及び第２接続片、第１及び第２接続線、並びにゲートリード線、と多数の接続部材を有している。このように多数の接続部材を有しており、更にそれらを半田で接合する作業も必要であり、各チップと回路基板との電気接続構成が複雑であった。 As described above, in the regulator device of Patent Document 1, a plurality of lead wires arranged on each chip in order to electrically connect the plurality of first and second diode chips, the plurality of thyristor chips, and the circuit board. , 1st and 2nd connecting pieces, 1st and 2nd connecting wires, and gate lead wires, and a large number of connecting members. As described above, it has a large number of connecting members, and further, it is necessary to join them with solder, and the electrical connection configuration between each chip and the circuit board is complicated.
　そこで、本発明は、半導体チップと配線基板との電気接続構成を簡素化することができる電子装置を提供することを目的とする。 Therefore, an object of the present invention is to provide an electronic device capable of simplifying the electrical connection configuration between the semiconductor chip and the wiring board.
　本発明に係る電子装置は、配線が設けられた配線基板と、一方の面に第１電極及び第２電極を有し、他方の面に第３電極を有する少なくとも１つの半導体チップと、導電性を有する板状の接続板と、を備え、前記半導体チップの前記第１電極及び前記第２電極が前記配線基板に接合され、前記第３電極が前記接続板に接合され、前記接続板が前記配線基板に接続され、前記配線基板、前記半導体チップ、前記接続板の順に配置されていることを特徴とする。 The electronic device according to the present invention is conductive with a wiring substrate provided with wiring, at least one semiconductor chip having a first electrode and a second electrode on one surface and a third electrode on the other surface. The first electrode and the second electrode of the semiconductor chip are joined to the wiring substrate, the third electrode is joined to the connection plate, and the connection plate is the connection plate. It is characterized in that it is connected to a wiring board and is arranged in the order of the wiring board, the semiconductor chip, and the connection plate.
　上記構成の電子装置において、前記半導体チップの前記第１電極の面積は、前記第２電極の面積よりも小さく、前記接続板の両端部に、前記配線基板に接続される第１接続部及び第２接続部を有し、前記第１電極が前記第１接続部及び前記第２接続部を結ぶ接続直線上に配置されていてもよい。 In the electronic device having the above configuration, the area of the first electrode of the semiconductor chip is smaller than the area of the second electrode, and the first connecting portion and the first connecting portion connected to the wiring board are connected to both ends of the connecting plate. It may have two connecting portions, and the first electrode may be arranged on a connecting straight line connecting the first connecting portion and the second connecting portion.
　また、上記構成の電子装置において、前記接続直線は、前記半導体チップが接合される前記接続板の面で前記接続直線と直交する方向における前記第１接続部及び前記第２接続部の中心を通っていてもよい。 Further, in the electronic device having the above configuration, the connection straight line passes through the center of the first connection portion and the second connection portion in a direction orthogonal to the connection straight line on the surface of the connection plate to which the semiconductor chip is bonded. You may be.
　また、上記構成の電子装置において、前記接続板の両端部に、前記配線基板に接続される第１接続部及び第２接続部を有し、前記第１接続部及び前記第２接続部が前記配線基板に挿入された状態で接続されていてもよい。 Further, in the electronic device having the above configuration, the first connection portion and the second connection portion connected to the wiring board are provided at both ends of the connection plate, and the first connection portion and the second connection portion are described. It may be connected while being inserted into the wiring board.
　また、上記構成の電子装置において、前記配線基板、前記半導体チップ及び前記接続板はそれぞれ導電性接合材を用いて接合されていてもよい。 Further, in the electronic device having the above configuration, the wiring board, the semiconductor chip, and the connection plate may be joined by using a conductive bonding material, respectively.
　また、上記構成の電子装置において、前記半導体チップは四角形状であり、前記半導体チップの一方の面における角部の近傍の位置に前記第１電極が設けられていてもよい。 Further, in the electronic device having the above configuration, the semiconductor chip may have a rectangular shape, and the first electrode may be provided at a position near a corner portion on one surface of the semiconductor chip.
　また、上記構成の電子装置において、前記接続板には、前記半導体チップを所定の位置に位置合わせして接合させるためのチップ載置部が設けられていてもよい。 Further, in the electronic device having the above configuration, the connection plate may be provided with a chip mounting portion for aligning and joining the semiconductor chips at predetermined positions.
　また、上記構成の電子装置において、前記チップ載置部は、凸形状であってもよい。 Further, in the electronic device having the above configuration, the chip mounting portion may have a convex shape.
　また、上記構成の電子装置において、放熱フィンを有し、前記配線基板、前記半導体チップ及び前記接続板を収容するケースを備え、前記接続板側に前記放熱フィンが配置されていてもよい。 Further, the electronic device having the above configuration may include a case having heat-dissipating fins and accommodating the wiring board, the semiconductor chip, and the connection plate, and the heat-dissipating fins may be arranged on the connection plate side.
　本発明に係る電子装置によれば、配線基板、半導体チップ及び導電性を有する接続板が直接接合される構成であるため、半導体チップと配線基板との電気接続構成を簡素化することができる。 According to the electronic device according to the present invention, since the wiring board, the semiconductor chip, and the conductive connection plate are directly bonded, the electrical connection configuration between the semiconductor chip and the wiring board can be simplified.
本実施形態に係るレギュレータ装置の構成を示す分解斜視図である。It is an exploded perspective view which shows the structure of the regulator apparatus which concerns on this embodiment. 上記レギュレータ装置における回路基板を構成する接続板及びサイリスタの斜視図である。It is a perspective view of the connection plate and the thyristor which constitute the circuit board in the said regulator device. 上記接続板及びサイリスタが配線基板に取り付けられた状態を示す斜視図である。It is a perspective view which shows the state which the said connection board and a thyristor are attached to a wiring board. 図１に示すレギュレータ装置を組付けた状態において、IV‐IV線に沿った位置での断面図である。It is sectional drawing at the position along line IV-IV in the state which the regulator apparatus shown in FIG. 1 is assembled. 図４において一点鎖線で示す領域Ｖの拡大図である。It is an enlarged view of the region V shown by the alternate long and short dash line in FIG. 上記レギュレータ装置の回路構成を示す回路図である。It is a circuit diagram which shows the circuit structure of the said regulator device. 図３における矢印VII‐VIIの位置での断面図である。It is sectional drawing at the position of arrow VII-VII in FIG. 図７において一点鎖線で示す領域VIIIの拡大図である。It is an enlarged view of the region VIII shown by the alternate long and short dash line in FIG. 7. 上記接続板に対するサイリスタの配置方向を変更した場合の平面図である。It is a top view when the arrangement direction of a thyristor with respect to the said connection plate is changed.
　以下、本発明の実施形態について、図面を参照して説明する。なお、本実施形態の説明において用いる、形状や幾何学的条件並びにそれらの程度を特定する、例えば、「平行」や「直交」等の用語や長さや角度の値等については、厳密な意味に縛られることなく、同様の機能を期待し得る程度の範囲を含めて解釈することとする。また、本実施形態で参照する図面において、同一部分または同様な機能を有する部分には同一の符号または類似の符号を付し、その繰り返しの説明は省略する場合がある。また、図面の寸法比率は説明の都合上実際の比率とは異なる場合や、構成の一部が図面から省略される場合がある。なお、本実施形態では、説明の便宜上、図１等に示す上下、左右及び前後の矢印に示す方向を、上下方向、左右方向及び前後方向と称して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that the terms such as "parallel" and "orthogonal" and the values of length and angle used in the description of the present embodiment to specify the shape and geometric conditions and their degrees are strictly defined. It shall be interpreted including the range in which similar functions can be expected without being bound. Further, in the drawings referred to in the present embodiment, the same parts or parts having similar functions are designated by the same reference numerals or similar reference numerals, and the repeated description thereof may be omitted. In addition, the dimensional ratio of the drawing may differ from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing. In this embodiment, for convenience of explanation, the directions indicated by the up / down, left / right, and front / back arrows shown in FIG. 1 and the like are referred to as the up / down direction, the left / right direction, and the front / back direction.
　本実施形態では、本発明に係る電子装置の一例として、自動車やオートバイ等の車両に搭載されて車両走行時にジェネレータで発電された電力を整流及び電圧制御してバッテリに供給するレギュレータ装置について説明する。 In the present embodiment, as an example of the electronic device according to the present invention, a regulator device mounted on a vehicle such as an automobile or a motorcycle and rectifying and voltage-controlling the electric power generated by the generator when the vehicle is running and supplying the battery to the battery will be described. ..
　本実施形態に係るレギュレータ装置１は、図１に示すように、複数の電子部品を実装した回路基板５０と、回路基板５０を内部に収容するケース１０と、ケース１０に取り付けられるコネクタ２０とを備える。 As shown in FIG. 1, the regulator device 1 according to the present embodiment includes a circuit board 50 on which a plurality of electronic components are mounted, a case 10 for accommodating the circuit board 50 inside, and a connector 20 attached to the case 10. Be prepared.
　［ケース］
　ケース１０は、上方に開口した矩形箱状に形成され、上方開口部１１から回路基板５０を挿入して当該回路基板５０を内部に収容可能に構成されている。ケース１０の内部には、回路基板５０を収容するための基板収容部１２（基板収容空間）が設けられている。ケース１０の後壁部には、前後方向に貫通して基板収容部１２と連通するとともに上方にも開口した後方開口部１３が設けられている。ケース１０の左右壁部には、左右壁部の上端からそれぞれ外方に延びる板状のフランジ部１４が設けられている。左右のフランジ部１４にはそれぞれ、上下方向に貫通したネジ挿通孔１５が形成されている。ケース１０は、左右のネジ挿通孔１５に挿通されるネジによって車両に固定される。ケース１０の下面には、左右方向に延びる板状の複数の放熱フィン１６がケース１０と一体成形されて設けられている。複数の放熱フィン１６は、ケース１０の下面において前後方向に所定の間隔をあけて並んで配設されている。 [Case]
The case 10 is formed in a rectangular box shape that opens upward, and the circuit board 50 is inserted through the upper opening 11 so that the circuit board 50 can be housed inside. Inside the case 10, a substrate accommodating portion 12 (board accommodating space) for accommodating the circuit board 50 is provided. The rear wall portion of the case 10 is provided with a rear opening portion 13 that penetrates in the front-rear direction and communicates with the substrate accommodating portion 12 and also opens upward. The left and right wall portions of the case 10 are provided with plate-shaped flange portions 14 extending outward from the upper ends of the left and right wall portions. Screw insertion holes 15 penetrating in the vertical direction are formed in the left and right flange portions 14, respectively. The case 10 is fixed to the vehicle by screws inserted into the left and right screw insertion holes 15. On the lower surface of the case 10, a plurality of plate-shaped heat radiating fins 16 extending in the left-right direction are integrally molded with the case 10. The plurality of heat radiation fins 16 are arranged side by side on the lower surface of the case 10 at predetermined intervals in the front-rear direction.
　［コネクタ］
　コネクタ２０は、後方に開口した矩形箱状のハウジング２１と、ハウジング２１内に設けられる５個の接続端子２５とを備える雄型のコネクタである。コネクタ２０には、車両に搭載されたジェネレータやバッテリ等とつながるケーブルに設けられた雌型コネクタが嵌合される。ハウジング２１は、樹脂等の絶縁材料を用いて形成され、後方に開口した接続開口部２２を有している。ハウジング２１の前面の左右端部及び下端部にはそれぞれ、断面コ字状の取付溝部２３が上下方向もしくは左右方向に延びて形成されている。コネクタ２０は、左右の取付溝部２３にケース１０の後方開口部１３を形成する後方壁部を挿入させるように、コネクタ２０を後方開口部１３に上方から挿着することでケース１０に取り付けられる。 [connector]
The connector 20 is a male connector having a rectangular box-shaped housing 21 opened rearward and five connection terminals 25 provided in the housing 21. A female connector provided on a cable connected to a generator, a battery, or the like mounted on a vehicle is fitted into the connector 20. The housing 21 is formed of an insulating material such as resin and has a connection opening 22 that opens rearward. Mounting grooves 23 having a U-shaped cross section are formed at the left and right end portions and the lower end portions of the front surface of the housing 21 so as to extend in the vertical direction or the horizontal direction, respectively. The connector 20 is attached to the case 10 by inserting the connector 20 into the rear opening 13 from above so that the rear wall portion forming the rear opening 13 of the case 10 is inserted into the left and right mounting grooves 23.
　５個の接続端子２５はそれぞれ、金属等の導電性材料を用いて板状に形成され、ハウジング２１の前壁部を貫通して前後方向に延びた状態でハウジング２１に設けられている。各接続端子２５の後端部は、ハウジング２１内において接続開口部２２の近傍まで延びている。各接続端子２５の前端部側は、ハウジング２１の前壁部を貫通した後に上方に屈曲されたＬ字状になっている（図４参照）。各接続端子２５の前端部側は、回路基板５０に形成された５個の端子挿通孔６３にそれぞれ挿通された状態で、はんだ材等の導電性接合材により固定される。このように固定されると、各接続端子２５は、回路基板５０に設けられた端子接続用配線に電気接続される。 Each of the five connection terminals 25 is formed in a plate shape using a conductive material such as metal, and is provided in the housing 21 in a state of penetrating the front wall portion of the housing 21 and extending in the front-rear direction. The rear end of each connection terminal 25 extends into the housing 21 to the vicinity of the connection opening 22. The front end side of each connection terminal 25 has an L shape that is bent upward after penetrating the front wall portion of the housing 21 (see FIG. 4). The front end side of each connection terminal 25 is fixed by a conductive bonding material such as a solder material in a state of being inserted into each of the five terminal insertion holes 63 formed in the circuit board 50. When fixed in this way, each connection terminal 25 is electrically connected to the terminal connection wiring provided on the circuit board 50.
　［回路基板］
　回路基板５０は、複数の配線が設けられた配線基板６０と、配線基板６０に実装される６個のサイリスタ７０と、６個のサイリスタ７０をそれぞれ配線基板６０に電気接続させる４個の接続板８０とを備える。配線基板６０は、矩形状の基板の下面に複数の配線が形成されたプリント基板である。図１には図示していないが、配線基板６０には、６個のサイリスタ７０を制御する制御回路９０（図６を参照）がパッケージ化された電子部品として実装されている。配線基板６０には、各接続板８０を取り付けるための複数の取付孔６５（図３を参照）が上下方向に貫通して形成されている。 [Circuit board]
The circuit board 50 includes a wiring board 60 provided with a plurality of wirings, six thyristors 70 mounted on the wiring board 60, and four connection boards for electrically connecting the six thyristors 70 to the wiring board 60, respectively. Equipped with 80. The wiring board 60 is a printed circuit board in which a plurality of wirings are formed on the lower surface of a rectangular board. Although not shown in FIG. 1, a control circuit 90 (see FIG. 6) that controls six thyristors 70 is mounted on the wiring board 60 as a packaged electronic component. A plurality of mounting holes 65 (see FIG. 3) for mounting each connection plate 80 are formed in the wiring board 60 so as to penetrate in the vertical direction.
　図１及び図２に示すように、６個のサイリスタ７０はそれぞれ、四角形状の半導体チップＴの上面にゲート電極Ｇ（ゲート端子）及びカソード電極Ｃ（カソード端子）を有するとともに、下面にアノード電極Ａ（アノード端子）を有し、ゲート電極Ｇからカソード電極Ｃにゲート電流を流すことによりアノード電極Ａとカソード電極Ｃとの間を導通させることができる３端子の半導体素子（ベアチップ）である。各サイリスタ７０は、四角形状の半導体チップの上面において、一つの角部の近傍の位置にゲート電極Ｇが設けられている。各サイリスタ７０では、ゲート電極Ｇの表面積（ゲート電極面積）がカソード電極Ｃの表面積（カソード電極面積）よりも小さくなっている。 As shown in FIGS. 1 and 2, each of the six thylisters 70 has a gate electrode G (gate terminal) and a cathode electrode C (cathode terminal) on the upper surface of the rectangular semiconductor chip T, and an anode electrode on the lower surface, respectively. It is a three-terminal semiconductor element (bare chip) having A (anode terminal) and capable of conducting conduction between the anode electrode A and the cathode electrode C by passing a gate current from the gate electrode G to the cathode electrode C. Each thyristor 70 is provided with a gate electrode G at a position near one corner on the upper surface of the rectangular semiconductor chip. In each thyristor 70, the surface area of the gate electrode G (gate electrode area) is smaller than the surface area of the cathode electrode C (cathode electrode area).
　４個の接続板８０はそれぞれ、銅等の金属材料（導電性材料）を用いて矩形平板状に形成されている。各接続板８０の長手方向の両端部にはそれぞれ、当該端部側を上方に折り曲げて一体に形成された基板接続部８１が設けられている。４個の接続板８０は、長手方向の長さ（載置可能なサイリスタ７０の数）が異なるだけで、それ以外は同一構成である。そのため、図２に示す接続板８０を参照して上記以外の接続板８０の構成について説明する。 Each of the four connecting plates 80 is formed in a rectangular flat plate shape using a metal material (conductive material) such as copper. At both ends of each connection plate 80 in the longitudinal direction, a substrate connection portion 81 integrally formed by bending the end portion side upward is provided. The four connecting plates 80 have the same configuration except that the length in the longitudinal direction (the number of thyristors 70 that can be mounted) is different. Therefore, the configuration of the connection plate 80 other than the above will be described with reference to the connection plate 80 shown in FIG.
　図２に示すように、接続板８０では、左右の基板接続部８１の前後方向の幅Ｗ１がそれぞれ、接続板８０の短手方向（前後方向）の幅Ｗよりも小さくなっている。接続板８０では、左右の基板接続部８１の前後方向の中心位置（前後幅Ｗ１の中心位置）を結ぶ直線Ｌ１と、接続板８０の短手方向の中心軸線（幅Ｗの中心位置を通る直線）とが平面視において重なるように、左右の基板接続部８１が接続板８０の左右両端部に配設されている。すなわち、左右の基板接続部８１は、接続板８０の短手方向（前後方向）の中心位置に設けられている。接続板８０の上面には、サイリスタ７０のチップ形状に対応した四角凸形状３個のチップ載置部８２が、接続板８０の長手方向に並んで設けられている。３個のチップ載置部８２はそれぞれ、各チップ載置部８２の一方の対角線が上記直線Ｌ１と平面視において重なる位置及び角度で接続板８０の上面に設けられている。なお、上記直線Ｌ１は、特許請求の範囲に記載の「接続直線」の一例である。 As shown in FIG. 2, in the connection plate 80, the width W1 in the front-rear direction of the left and right board connection portions 81 is smaller than the width W in the lateral direction (front-rear direction) of the connection plate 80, respectively. In the connection plate 80, the straight line L1 connecting the center positions of the left and right board connection portions 81 in the front-rear direction (the center position of the front-rear width W1) and the center axis line in the lateral direction of the connection plate 80 (the straight line passing through the center position of the width W) ) And the left and right substrate connecting portions 81 are arranged at the left and right both ends of the connecting plate 80 so as to overlap with each other in a plan view. That is, the left and right board connecting portions 81 are provided at the center positions of the connecting plate 80 in the lateral direction (front-rear direction). On the upper surface of the connection plate 80, three square convex chip mounting portions 82 corresponding to the chip shape of the thyristor 70 are provided side by side in the longitudinal direction of the connection plate 80. Each of the three chip mounting portions 82 is provided on the upper surface of the connecting plate 80 at a position and angle at which one diagonal line of each chip mounting portion 82 overlaps the straight line L1 in a plan view. The straight line L1 is an example of the "connecting straight line" described in the claims.
　回路基板５０では、接続板８０の３個のチップ載置部８２の上面にそれぞれ、導電性接合材を介してサイリスタ７０の下面及び当該下面に設けられたアノード電極Ａが接合される。このとき、サイリスタ７０の上面に設けられたゲート電極Ｇが、上記直線Ｌ１（接続板８０における左右の基板接続部８１の前後幅Ｗ１の中心位置を結ぶ直線）上に平面視において重なるように配置される。なお、上記導電性接合材は、加熱により硬化する導電性の接合材であり、例えば、はんだペーストや銀ペースト、導電性のナノ粒子を接着剤中に分散させた導電性接着剤、はんだ材等である。以下に記載する導電性接合材も同様である。 In the circuit board 50, the lower surface of the thyristor 70 and the anode electrodes A provided on the lower surface are bonded to the upper surfaces of the three chip mounting portions 82 of the connection plate 80, respectively, via a conductive bonding material. At this time, the gate electrode G provided on the upper surface of the thyristor 70 is arranged so as to overlap in a plan view on the straight line L1 (a straight line connecting the center positions of the front-rear width W1 of the left and right substrate connecting portions 81 in the connecting plate 80). Will be done. The conductive bonding material is a conductive bonding material that is cured by heating. For example, a solder paste, a silver paste, a conductive adhesive in which conductive nanoparticles are dispersed in an adhesive, a solder material, or the like. Is. The same applies to the conductive bonding materials described below.
　このように３個のサイリスタ７０が接合された接続板８０は、図３に示すように、左右の基板接続部８１が、配線基板６０の下面側から取付孔６５に挿入されて上面側に突出した挿通状態で、導電性接合材により配線基板６０に固定される。このように固定されると、左右の基板接続部８１は、配線基板６０の下面に設けられたアノード接続用配線に電気接続される。そして、３個のサイリスタ７０の下面に設けられたアノード電極Ａがそれぞれ、接続板８０を介して配線基板６０のアノード接続用配線に電気接続される。また、３個のサイリスタ７０の上面に設けられたゲート電極Ｇがそれぞれ、配線基板６０の下面に設けられたゲート接続用配線に導電性接合材を介して接合されて電気接続される。さらに、３個のサイリスタ７０の上面に設けられたカソード電極Ｃがそれぞれ、配線基板６０の下面に設けられたカソード接続用配線に導電性接合材を介して接合されて電気接続される。なお、他の接続板８０についても上記同様に配線基板６０に固定され、当該接続板８０に載置されたサイリスタ７０の各電極も上記同様に配線基板６０の各配線に電気接続される。このように回路基板５０では、各サイリスタ７０を配線基板６０の下面と接続板８０の上面との間に挟んだ積層状態で電気接続される（図４及び図５も参照）。 In the connection plate 80 to which the three thyristors 70 are joined in this way, as shown in FIG. 3, the left and right board connection portions 81 are inserted into the mounting holes 65 from the lower surface side of the wiring board 60 and project to the upper surface side. In the inserted state, it is fixed to the wiring board 60 by the conductive bonding material. When fixed in this way, the left and right board connection portions 81 are electrically connected to the anode connection wiring provided on the lower surface of the wiring board 60. Then, the anode electrodes A provided on the lower surfaces of the three thyristors 70 are electrically connected to the anode connection wiring of the wiring board 60 via the connection plate 80, respectively. Further, the gate electrodes G provided on the upper surfaces of the three thyristors 70 are respectively joined to the gate connecting wiring provided on the lower surface of the wiring board 60 via a conductive bonding material to be electrically connected. Further, the cathode electrodes C provided on the upper surfaces of the three thyristors 70 are respectively joined to the cathode connecting wiring provided on the lower surface of the wiring board 60 via a conductive bonding material to be electrically connected. The other connection plate 80 is also fixed to the wiring board 60 in the same manner as described above, and each electrode of the thyristor 70 mounted on the connection plate 80 is also electrically connected to each wiring of the wiring board 60 in the same manner as described above. In this way, in the circuit board 50, each thyristor 70 is electrically connected in a laminated state sandwiched between the lower surface of the wiring board 60 and the upper surface of the connection plate 80 (see also FIGS. 4 and 5).
　このように構成される回路基板５０は、図４に示すように、上述のようにコネクタ２０が取り付けられたケース１０に対して、各サイリスタ７０が設けられた回路基板５０の下面側をケース１０に対向させた姿勢で、ケース１０の上方開口部１１から基板収容部１２内に挿入され、回路基板５０が基板収容部１２内に収容される。このように収容されると、コネクタ２０の各接続端子２５の端部が、配線基板６０の下面側から配線基板６０に形成された各端子挿通孔６３に挿入されて上面側に突出した挿通状態となる。そして、各接続端子２５の端部側を導電性接合材により配線基板６０に固定され、各接続端子２５と配線基板６０の下面に設けられた各配線とが電気接続される。このように回路基板５０を収容した基板収容部１２には、硬質エポキシ樹脂等の封止樹脂３０が上方開口部１１から注入され、回路基板５０が基板収容部１２内に封止される。 As shown in FIG. 4, the circuit board 50 configured in this way has a case 10 on the lower surface side of the circuit board 50 provided with each thyristor 70 with respect to the case 10 to which the connector 20 is attached as described above. The circuit board 50 is inserted into the substrate accommodating portion 12 through the upper opening 11 of the case 10 and the circuit board 50 is accommodated in the substrate accommodating portion 12. When accommodated in this way, the end portions of the connection terminals 25 of the connector 20 are inserted into the terminal insertion holes 63 formed in the wiring board 60 from the lower surface side of the wiring board 60 and protrude toward the upper surface side. It becomes. Then, the end side of each connection terminal 25 is fixed to the wiring board 60 with a conductive bonding material, and each connection terminal 25 and each wiring provided on the lower surface of the wiring board 60 are electrically connected. A sealing resin 30 such as a hard epoxy resin is injected into the substrate accommodating portion 12 accommodating the circuit board 50 in this way from the upper opening 11, and the circuit board 50 is sealed in the substrate accommodating portion 12.
　このようにケース１０内に収容及び封止された回路基板５０では、図４及び図５に示すように、配線基板６０に固定された接続板８０の下面側（サイリスタ７０が載置された面の反対側）が、基板収容部１２を形成するケース１０の下壁部の内面に近接対向して配置される。ケース１０の下壁部の外面には、上述した複数の放熱フィン１６が設けられており、接続板８０と複数の放熱フィン１６とが近い配置構成となっている。 In the circuit board 50 housed and sealed in the case 10 in this way, as shown in FIGS. 4 and 5, the lower surface side (the surface on which the thyristor 70 is placed) of the connection plate 80 fixed to the wiring board 60 is placed. The opposite side) is arranged so as to be close to the inner surface of the lower wall portion of the case 10 forming the substrate accommodating portion 12. The plurality of heat radiation fins 16 described above are provided on the outer surface of the lower wall portion of the case 10, and the connection plate 80 and the plurality of heat radiation fins 16 are arranged close to each other.
　以上のように構成されるレギュレータ装置１では、車両に搭載されたジェネレータＡＣＧ（交流発電機）、バッテリＢ及び負荷ＬＯＡＤ（電装品）とつながるケーブルの雌型コネクタがコネクタ２０に嵌合される。このように嵌合されると、図６に示すように、コネクタ２０における３個の接続端子２５が上記雌型コネクタ及びケーブルを介してジェネレータＡＣＧに電気接続され、残り２個の接続端子２５が上記雌型コネクタ及びケーブルを介してバッテリＢ及び負荷ＬＯＡＤに電気接続される。レギュレータ装置１では、配線基板６０に設けられた制御回路９０から６個のサイリスタ７０のゲート電極Ｇにそれぞれゲート電流を出力して、各サイリスタ７０の動作制御（オンオフ制御）を行うことにより、車両走行時にジェネレータＡＣＧで発電された三相交流を整流及び電圧制御して得られた直流ＶｏｕｔをバッテリＢ及び負荷ＬＯＡＤに供給するように構成されている。 In the regulator device 1 configured as described above, the female connector of the cable connected to the generator ACG (alternator), the battery B, and the load LOAD (electrical components) mounted on the vehicle is fitted to the connector 20. When fitted in this way, as shown in FIG. 6, the three connection terminals 25 in the connector 20 are electrically connected to the generator ACG via the female connector and the cable, and the remaining two connection terminals 25 are connected. It is electrically connected to the battery B and the load LOAD via the female connector and the cable. In the regulator device 1, the control circuit 90 provided on the wiring board 60 outputs gate currents to the gate electrodes G of the six thyristors 70, respectively, and controls the operation (on / off control) of each thyristor 70 to control the vehicle. It is configured to supply the DC Vout obtained by rectifying and voltage-controlling the three-phase alternating current generated by the generator ACG during traveling to the battery B and the load LOAD.
　以上のようにレギュレータ装置１では、サイリスタ７０が載置された接続板８０が配線基板６０に固定されることで、当該サイリスタ７０のアノード電極Ａが接続板８０に接合されて当該接続板８０を介して配線基板６０に電気接続され、ゲート電極Ｇ及びカソード電極Ｃが配線基板６０に接合されて電気接続され、配線基板６０と接続板８０の間にサイリスタ７０を挟んだ積層状態に配置されるようになっている。このように配線基板６０、サイリスタ７０及び接続板８０が直接接合されて電気接続される構成であるため、従来の複数のリード線や接続部材を有した構成と比較して、サイリスタ７０と配線基板６０との電気接続構成を簡素化することができる。 As described above, in the regulator device 1, the connection plate 80 on which the thyristor 70 is mounted is fixed to the wiring board 60, so that the anode electrode A of the thyristor 70 is joined to the connection plate 80 to connect the connection plate 80. The gate electrode G and the cathode electrode C are electrically connected to the wiring board 60 via the wiring board 60, and are electrically connected to the wiring board 60, and are arranged in a laminated state with the thyristor 70 sandwiched between the wiring board 60 and the connection board 80. It has become like. Since the wiring board 60, the thyristor 70, and the connection plate 80 are directly joined and electrically connected in this way, the thyristor 70 and the wiring board are compared with the conventional configuration having a plurality of lead wires and connecting members. The electrical connection configuration with the 60 can be simplified.
　レギュレータ装置１では、配線基板６０に接続板８０を固定する際、図５に示すように、配線基板６０の下面と接続板８０の上面とが平行な状態で固定されることが理想的である。しかしながら、組立製造工程での様々な要因によって、図７に示すように、配線基板６０の下面に対して接続板８０の上面が傾斜した状態で、接続板８０が配線基板６０に固定される場合がある。そこで、レギュレータ装置１では、接続板８０に載置されたサイリスタ７０のゲート電極Ｇが、接続板８０における左右の基板接続部８１の前後幅Ｗ１の中心位置を結ぶ直線Ｌ１上に平面視において重なるように配置されるようになっている。従って、上記のように接続板８０が傾斜した状態で配線基板６０に固定された場合であっても、サイリスタ７０のゲート電極Ｇが上記直線Ｌ１上に配置されているため、カソード電極Ｃよりも表面積が小さいゲート電極Ｇが配線基板６０に接合された状態を確保することができる（図７及び図８を参照）。これにより、サイリスタ７０と配線基板６０との接続信頼性を向上させることができる。 In the regulator device 1, when fixing the connection plate 80 to the wiring board 60, it is ideal that the lower surface of the wiring board 60 and the upper surface of the connection plate 80 are fixed in parallel as shown in FIG. .. However, when the connection plate 80 is fixed to the wiring board 60 in a state where the upper surface of the connection plate 80 is inclined with respect to the lower surface of the wiring board 60 as shown in FIG. 7 due to various factors in the assembly manufacturing process. There is. Therefore, in the regulator device 1, the gate electrode G of the thyristor 70 mounted on the connection plate 80 overlaps in a plan view on a straight line L1 connecting the center positions of the front-rear width W1 of the left and right substrate connection portions 81 on the connection plate 80. It is designed to be arranged like this. Therefore, even when the connection plate 80 is fixed to the wiring board 60 in an inclined state as described above, since the gate electrode G of the thyristor 70 is arranged on the straight line L1, it is more than the cathode electrode C. It is possible to secure a state in which the gate electrode G having a small surface area is joined to the wiring board 60 (see FIGS. 7 and 8). Thereby, the connection reliability between the thyristor 70 and the wiring board 60 can be improved.
　レギュレータ装置１では、接続板８０が、左右の基板接続部８１を配線基板６０の下面側から挿入して上面側に突出した挿通状態で、配線基板６０に固定されるようになっている。このように接続板８０が固定されているため、配線基板６０に対する接続板８０の位置合わせ（位置決め）が容易である。また、配線基板６０の上面や内部に配線が形成された場合であっても、当該配線に対しても接続板８０を電気接続させることができる。 In the regulator device 1, the connection plate 80 is fixed to the wiring board 60 in an inserted state in which the left and right board connection portions 81 are inserted from the lower surface side of the wiring board 60 and protrudes to the upper surface side. Since the connection plate 80 is fixed in this way, the connection plate 80 can be easily aligned (positioned) with respect to the wiring board 60. Further, even when wiring is formed on the upper surface or inside of the wiring board 60, the connection plate 80 can be electrically connected to the wiring as well.
　レギュレータ装置１では、接続板８０の上面に、サイリスタ７０のチップ形状に対応した凸形状チップ載置部８２が設けられ、そのチップ載置部８２にサイリスタ７０が載置されて接合されるようになっている。このようにチップ載置部８２が設けられているため、接続板８０に対するサイリスタ７０の位置合わせが容易である。なお、チップ載置部８２は、上記のような凸形状はなく、サイリスタ７０のチップ形状に対応した凹状に形成されても良い。 In the regulator device 1, a convex chip mounting portion 82 corresponding to the chip shape of the thyristor 70 is provided on the upper surface of the connection plate 80, and the thyristor 70 is mounted and joined to the chip mounting portion 82. It has become. Since the chip mounting portion 82 is provided in this way, the thyristor 70 can be easily aligned with the connection plate 80. The chip mounting portion 82 does not have the convex shape as described above, and may be formed in a concave shape corresponding to the chip shape of the thyristor 70.
　レギュレータ装置１では、回路基板５０がケース１０内に収容されると、複数の放熱フィン１６が設けられたケース１０の下壁部の内面と、配線基板６０に固定された接続板８０の下面側（サイリスタ７０が載置された面の反対側）とが近接対向して配置されるようになっている。このように複数の放熱フィン１６と接続板８０とが近い配置構成となっているため、接続板８０に接合されたサイリスタ７０で発生した熱を効率良く放熱させることができる。 In the regulator device 1, when the circuit board 50 is housed in the case 10, the inner surface of the lower wall portion of the case 10 provided with the plurality of heat radiation fins 16 and the lower surface side of the connection plate 80 fixed to the wiring board 60. (The side opposite to the surface on which the thyristor 70 is placed) is arranged so as to face each other in close proximity to each other. Since the plurality of heat radiating fins 16 and the connecting plate 80 are arranged close to each other in this way, the heat generated by the thyristor 70 joined to the connecting plate 80 can be efficiently dissipated.
　ここまで本発明に係る実施形態について説明したが、上記実施形態は一例であって、本発明は上記実施形態に限定されるものではない。本発明は、上記実施形態において、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。例えば、上記実施形態では、接続板８０において、サイリスタ７０のゲート電極Ｇが、接続板８０における左右の基板接続部８１の前後幅Ｗ１の中心位置を結ぶ直線Ｌ１上に平面視において重なるように、サイリスタ７０が接続板８０上に載置される構成である。しかしながら、図９に示すように、ゲート電極Ｇが上記直線Ｌ１上に平面視において重ならない位置及び角度で、サイリスタ７０が接続板８０上に載置される構成であっても良い。但し、このような構成の場合には、上述のように配線基板６０に対して接続板８０が傾斜した状態で固定されると、ゲート電極Ｇが配線基板６０に接合されない状態となる場合があるため、上記実施形態におけるサイリスタ７０の配置構成とする方が好ましい。 Although the embodiment according to the present invention has been described so far, the above embodiment is an example, and the present invention is not limited to the above embodiment. In the above embodiment, the present invention can be omitted, replaced, or modified in various ways without departing from the gist of the invention. For example, in the above embodiment, in the connection plate 80, the gate electrode G of the thyristor 70 overlaps in a plan view on a straight line L1 connecting the center positions of the front-rear width W1 of the left and right substrate connection portions 81 of the connection plate 80. The thyristor 70 is mounted on the connecting plate 80. However, as shown in FIG. 9, the thyristor 70 may be placed on the connecting plate 80 at a position and angle at which the gate electrode G does not overlap on the straight line L1 in a plan view. However, in the case of such a configuration, if the connection plate 80 is fixed in an inclined state with respect to the wiring board 60 as described above, the gate electrode G may not be joined to the wiring board 60. Therefore, it is preferable to use the arrangement configuration of the thyristor 70 in the above embodiment.
　また、上記実施形態において、接続板８０における左右の基板接続部８１が、短手方向において複数に分割された構成であっても良い。そのような構成の場合には、複数に分割された基板接続部全体の短手方向の中心位置を通る直線上に、サイリスタ７０のゲート電極Ｇが平面視において重なるように、サイリスタ７０を接続板８０上に載置する構成とすれば、上記実施形態と同様に、サイリスタ７０と配線基板６０との接続信頼性を向上させることができる。 Further, in the above embodiment, the left and right board connecting portions 81 of the connecting plate 80 may be divided into a plurality of parts in the lateral direction. In such a configuration, the thyristor 70 is connected to the connecting plate so that the gate electrode G of the thyristor 70 overlaps in a plan view on a straight line passing through the center position in the lateral direction of the entire board connecting portion divided into a plurality of parts. If it is mounted on the 80, the connection reliability between the thyristor 70 and the wiring board 60 can be improved as in the above embodiment.
　上記実施形態においては、サイリスタ７０が接続板８０に載置される構成について説明したが、サイリスタではなく、ＭＯＳＦＥＴやＩＧＢＴ等、他の３端子の半導体素子であっても良い。また、上記実施形態では、本発明に係る電子装置の一例としてレギュレータ装置について説明したが、本発明は、少なくとも配線基板及び半導体チップを備えた他の電子装置にも適用可能である。 In the above embodiment, the configuration in which the thyristor 70 is mounted on the connection plate 80 has been described, but instead of the thyristor, other three-terminal semiconductor elements such as MOSFETs and IGBTs may be used. Further, in the above embodiment, the regulator device has been described as an example of the electronic device according to the present invention, but the present invention can be applied to at least other electronic devices including a wiring board and a semiconductor chip.
１　　レギュレータ装置
１０　ケース
１６　放熱フィン
５０　回路基板
６０　配線基板
７０　サイリスタ（半導体チップ）
８０　接続板
８１　基板接続部（第１接続部、第２接続部）
８２　チップ載置部 1 Regulator device 10 Case 16 Heat dissipation fins 50 Circuit board 60 Wiring board 70 Thyristor (semiconductor chip)
80 Connection plate 81 Board connection (first connection, second connection)
82 Chip mounting part

Claims (9)

  1. 　配線が設けられた配線基板と、
    　一方の面に第１電極及び第２電極を有し、他方の面に第３電極を有する少なくとも１つの半導体チップと、
    　導電性を有する板状の接続板と、を備え、
    　前記半導体チップの前記第１電極及び前記第２電極が前記配線基板に接合され、前記第３電極が前記接続板に接合され、前記接続板が前記配線基板に接続され、前記配線基板、前記半導体チップ、前記接続板の順に配置されていることを特徴とする電子装置。     A wiring board with wiring and
    A semiconductor chip having a first electrode and a second electrode on one surface and a third electrode on the other surface.
    With a plate-shaped connecting plate having conductivity,
    The first electrode and the second electrode of the semiconductor chip are bonded to the wiring board, the third electrode is bonded to the connection plate, the connection plate is connected to the wiring board, and the wiring board and the semiconductor are connected. An electronic device characterized in that the chips and the connection plates are arranged in this order.
  2. 　前記半導体チップの前記第１電極の面積は、前記第２電極の面積よりも小さく、
    　前記接続板の両端部に、前記配線基板に接続される第１接続部及び第２接続部を有し、
    　前記第１電極が前記第１接続部及び前記第２接続部を結ぶ接続直線上に配置されていることを特徴とする請求項１に記載の電子装置。     The area of the first electrode of the semiconductor chip is smaller than the area of the second electrode.
    A first connection portion and a second connection portion connected to the wiring board are provided at both ends of the connection plate.
    The electronic device according to claim 1, wherein the first electrode is arranged on a connecting straight line connecting the first connecting portion and the second connecting portion.
  3. 　前記接続直線は、前記半導体チップが接合される前記接続板の面で前記接続直線と直交する方向における前記第１接続部及び前記第２接続部の中心を通ることを特徴とする請求項２に記載の電子装置。 The second aspect of the present invention is characterized in that the connecting straight line passes through the center of the first connecting portion and the second connecting portion in a direction orthogonal to the connecting straight line on the surface of the connecting plate to which the semiconductor chip is joined. The electronic device described.
  4. 　前記接続板の両端部に、前記配線基板に接続される第１接続部及び第２接続部を有し、
    　前記第１接続部及び前記第２接続部が前記配線基板に挿入された状態で接続されていることを特徴とする請求項１～３のいずれかに記載の電子装置。     A first connection portion and a second connection portion connected to the wiring board are provided at both ends of the connection plate.
    The electronic device according to any one of claims 1 to 3, wherein the first connecting portion and the second connecting portion are connected in a state of being inserted into the wiring board.
  5. 　前記配線基板、前記半導体チップ及び前記接続板はそれぞれ導電性接合材を用いて接合されていることを特徴とする請求項１～４のいずれかに記載の電子装置。 The electronic device according to any one of claims 1 to 4, wherein the wiring board, the semiconductor chip, and the connection plate are each joined by using a conductive bonding material.
  6. 　前記半導体チップは四角形状であり、前記半導体チップの一方の面における角部の近傍の位置に前記第１電極が設けられていることを特徴とする請求項１～５のいずれかに記載の電子装置。 The electron according to any one of claims 1 to 5, wherein the semiconductor chip has a quadrangular shape, and the first electrode is provided at a position near a corner portion on one surface of the semiconductor chip. apparatus.
  7. 　前記接続板には、前記半導体チップを所定の位置に位置合わせして接合させるためのチップ載置部が設けられていることを特徴とする請求項１～６のいずれかに記載の電子装置。 The electronic device according to any one of claims 1 to 6, wherein the connection plate is provided with a chip mounting portion for aligning and joining the semiconductor chip at a predetermined position.
  8. 　前記チップ載置部は、凸形状であることを特徴とする請求項７に記載の電子装置。 The electronic device according to claim 7, wherein the chip mounting portion has a convex shape.
  9. 　放熱フィンを有し、前記配線基板、前記半導体チップ及び前記接続板を収容するケースを備え、
    　前記接続板側に前記放熱フィンが配置されていることを特徴とする請求項１～８のいずれかに記載の電子装置。     It has heat dissipation fins, and includes a case for accommodating the wiring board, the semiconductor chip, and the connection plate.
    The electronic device according to any one of claims 1 to 8, wherein the heat radiation fins are arranged on the connection plate side.
PCT/JP2019/038336 2019-09-27 2019-09-27 Electronic device WO2021059525A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338577A (en) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd Circuit board device
JP2006073664A (en) * 2004-08-31 2006-03-16 Toshiba Corp Semiconductor module
JP2009152505A (en) * 2007-12-24 2009-07-09 Denso Corp Semiconductor module mounting structure
WO2017203559A1 (en) * 2016-05-23 2017-11-30 新電元工業株式会社 Printed circuit board joining method, electronic device, and method for producing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338577A (en) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd Circuit board device
JP2006073664A (en) * 2004-08-31 2006-03-16 Toshiba Corp Semiconductor module
JP2009152505A (en) * 2007-12-24 2009-07-09 Denso Corp Semiconductor module mounting structure
WO2017203559A1 (en) * 2016-05-23 2017-11-30 新電元工業株式会社 Printed circuit board joining method, electronic device, and method for producing same

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