WO2021052043A1 - 一种散热装置及终端设备 - Google Patents

一种散热装置及终端设备 Download PDF

Info

Publication number
WO2021052043A1
WO2021052043A1 PCT/CN2020/106630 CN2020106630W WO2021052043A1 WO 2021052043 A1 WO2021052043 A1 WO 2021052043A1 CN 2020106630 W CN2020106630 W CN 2020106630W WO 2021052043 A1 WO2021052043 A1 WO 2021052043A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
dissipation device
area
layer
adhesive
Prior art date
Application number
PCT/CN2020/106630
Other languages
English (en)
French (fr)
Inventor
肖永旺
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP20864562.2A priority Critical patent/EP4025023A4/en
Priority to CN202080015366.XA priority patent/CN113491178B/zh
Publication of WO2021052043A1 publication Critical patent/WO2021052043A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Definitions

  • This application relates to the technical field of heat dissipation equipment, and in particular to a heat dissipation device and terminal equipment.
  • the graphite film is a composite film composed of a polymer film layer, a graphite layer or a graphene layer, and an adhesive layer, wherein at least one side of the graphite film is partially or entirely provided with an adhesive layer to facilitate its adhesion. Connected and fixed to the part to be radiated inside the terminal device.
  • the technical solution of the present application provides a heat dissipation device and terminal equipment to improve the convenience of disassembly of the heat dissipation device.
  • the technical solution of the present application provides a graphite film for dissipating heat from the internal structure.
  • the graphite film includes a glue-back zone and a local glue-free zone, wherein the glue-back zone can be bonded to the internal structure, and there is no adhesion relationship between the local glue-free zone and the internal structure.
  • the local adhesive-free area is set at at least one vertex of the graphite film.
  • the technical solution of the present application also provides a terminal device, which includes a display screen, a middle frame, a rear case, a printed circuit board, and the graphite film of the first aspect.
  • the middle frame can be used to carry the printed circuit board and the display screen.
  • the display screen and the printed circuit board are located on both sides of the middle frame.
  • the rear shell is located on the side of the printed circuit board far away from the display screen.
  • the heating components can be arranged on the side of the printed circuit board close to the middle frame, or on the side of the printed circuit board close to the rear shell, or on both sides of the printed circuit board at the same time.
  • the graphite film Cover the area of the heat-generating parts to realize the heat dissipation of the heat-generating parts.
  • the top corners of the graphite film are provided with a local glue-free area, so when the graphite film needs to be disassembled during the mass production of the terminal equipment, the graphite film can be inserted into the graphite film with a disassembly tool such as tweezers or a hand.
  • a disassembly tool such as tweezers or a hand.
  • the local glue-free area at the top corner of the film to lift the part of the graphite film; then, the graphite film is torn by hand or with a removal tool to enlarge the non-adhesive area between it and the internal structure of the terminal device, and even Remove the graphite film completely.
  • the graphite film is easy to disassemble, and its disassembly efficiency is high, so that the rework and maintenance efficiency of the terminal equipment is improved.
  • the disassembled graphite film can still be used, which is beneficial to increase the reuse ratio of the graphite film and reduce the production cost.
  • FIG. 1 is a schematic structural diagram of a terminal device provided by an embodiment of this application.
  • FIG. 2 is a schematic diagram of a structure of a graphite film provided in an embodiment of the prior art
  • FIG. 3 is a schematic diagram of the structure of a graphite film provided in another embodiment of the prior art
  • FIG. 4 is a schematic structural diagram of a heat dissipation device provided by an embodiment of the application.
  • FIG. 5 is a cross-sectional view of the heat dissipation device A-A in Figure 4;
  • FIG. 6 is a cross-sectional view of the heat dissipation device A-A in Figure 4;
  • FIG. 7 is a cross-sectional view of the heat dissipation device A-A in Figure 4.
  • FIG. 8 is a schematic structural diagram of a heat sink provided by another embodiment of this application.
  • FIG. 9 is a schematic structural diagram of a heat dissipation device provided by another embodiment of the application.
  • FIG. 10 is a schematic structural diagram of a heat sink provided by another embodiment of this application.
  • FIG. 11 is a schematic structural diagram of a heat sink provided by another embodiment of this application.
  • FIG. 12 is a schematic structural diagram of a heat sink provided by another embodiment of the application.
  • 8-Battery compartment 9-Adhesive area; 10A, 10B, 10C-partially non-adhesive area;
  • the heat dissipation device can be installed in terminals such as mobile phones, tablet computers, and personal digital assistants (PDAs).
  • terminals such as mobile phones, tablet computers, and personal digital assistants (PDAs).
  • PDAs personal digital assistants
  • heat-generating components such as chips in the terminal equipment can be dissipated.
  • heating components include, but are not limited to, central processing unit (CPU), artificial intelligence (AI) processor, system on chip (SoC), power management unit, or other components that require heat dissipation. Device.
  • CPU central processing unit
  • AI artificial intelligence
  • SoC system on chip
  • power management unit or other components that require heat dissipation.
  • the specific arrangement of the heat dissipation device in the terminal device will be described in detail below in conjunction with the accompanying drawings, so as to facilitate understanding of the process of heat conduction by the heat dissipation device to the heating component.
  • the terminal device may include a display screen 1, a middle frame 2, a rear case 3, a printed circuit board (PCB 4), and a heat dissipation device 5.
  • the middle frame 2 can be used to carry the PCB 4 and the display screen 1
  • the display screen 1 and the PCB 4 are located on both sides of the middle frame 2
  • the rear case 3 is located on the side of the PCB 4 away from the display screen 1.
  • the heating component 6 is arranged on the PCB 4, and may be located on both sides of the PCB 4.
  • the terminal device may also include a bracket 7 fixed to the middle frame 2.
  • the bracket 7 may extend to the side of the PCB 4 close to the rear case 3, and may be used to press the PCB 4 to the middle frame or to fix the PCB 4 on the middle frame. The device is compressed and fixed to effectively improve the structural stability of the PCB 4.
  • the heat dissipating device 5 can be arranged between the bracket 7 and the rear shell 3 and fixed to the side of the bracket 7 close to the rear shell; in addition, when the heat-generating component 6 on the PCB 4 is covered with a shielding cover, the heat dissipating device 5 can also be It is adhered to the shielding cover, or to the side of the bracket 7 close to the shielding cover; in addition, the heat sink 5 can also be directly adhered to the rear shell 3.
  • the heat sink 5 When the heat sink 5 is used to dissipate heat from the CPU and other heat-generating components 6, first, the heat generated by the heat-generating component 6 can be conducted to the heat sink 5; then, the heat is dissipated through the heat sink 5; finally, the heat is passed through the convection of the heat sink 5 The radiation is conducted to the rear case 3 and dispersed to the outside of the terminal device through the rear case 3.
  • the heat sink 5 can also be placed between the display screen 1 and the middle frame 2.
  • the heat sink 5 can be fixed to the middle frame 2. It can be seen from FIG. 1 that some heating components 6 on the PCB 4 are arranged close to the middle frame 2, and in addition, a battery compartment 8 for accommodating batteries is also arranged in the middle frame 2. In this way, the heat generated by the above-mentioned heating components 6 can be conducted to the middle frame 2 and the battery compartment 8 and then dispersed, and then conducted to the heat sink 5 through the middle frame 2.
  • the heat dissipation device 5 dissipates the heat and conducts it to the display screen 1 under the action of convective radiation, and finally dissipates it to the outside of the terminal device through the display screen 1, so that the heat dissipation device 5 realizes the heat dissipation of the terminal device. It is understandable that while the heat dissipation device 5 is disposed between the PCB 4 and the rear case 3, the heat dissipation device 5 can also be disposed between the middle frame 2 and the display screen 1 at the same time to improve the heat dissipation efficiency of the terminal equipment. In addition, the heat dissipating device 5 is not limited to being provided at the above-mentioned position of the terminal device, as long as it can realize the heat dissipation of the heat generating component 6 of the terminal device.
  • the graphite film 14 is a commonly used heat dissipation device in terminal equipment.
  • the graphite film 14 is a composite film composed of a polymer film layer, a graphite layer or a graphene layer, and a glue layer.
  • the graphite film 14 can be made to have an entire back adhesive area 9, or referring to Fig. 3, the graphite film 14 can be made to have a partial adhesive back area 9, wherein the adhesive layer is arranged in The adhesive zone 9.
  • the corners of the graphite film 14 are filled with adhesive to avoid the process of removing the protective film on the surface of the graphite film 14 when the graphite film 14 is attached to the terminal device. , Bring up the graphite film 14 to improve the adhesion of the graphite film 14. In this way, when disassembling the graphite film 14 adhered in the terminal device, it is necessary to lift a corner of the graphite film 14 with the tip of tweezers; then, after the area of the lifted graphite film 14 is enlarged, the graphite film 14 can be torn off by hand.
  • the graphite film 14 is easily damaged during the disassembly process of the graphite film 14.
  • the corners of the graphite film 14 are filled with adhesive, this will make the disassembly of the graphite film 14 more difficult. Difficulty and low operating efficiency.
  • the materials of the torn graphite film 14 and the reworked graphite film 14 cannot be reused, and the graphite film 14 may be torn to the parts assembled on the graphite film 14 (such as NFC coils, wireless charging coils, iron Oxygen, etc.) are scrapped together, resulting in waste of resources and higher production costs.
  • an embodiment of the present application provides a heat dissipation device 5, the heat dissipation device 5 has a glue-back area 9 and a partial glue-free area 10A, wherein the glue-back area 9 can be bonded to the internal structure , There is no adhesion relationship between the local glue-free area 10A and the internal structure.
  • the local glue-free area 10A is arranged at at least one vertex of the heat sink 5, where the vertex of the heat sink 5 refers to the outer profile of the heat sink 5 The raised part. When the heat sink 5 is in use, it can be adhered to the internal structure through the adhesive area 9.
  • the heat sink 5 When the heat sink 5 needs to be disassembled, only the partial adhesive-free area 10A at the top corner of the heat sink 5 needs to be lifted by hand, and then The heat dissipation device 5 is slowly torn to expand the non-adhesive area between the heat dissipation device 5 and the internal structure, so that the heat dissipation device 5 is completely peeled off.
  • the heat dissipation device 5 of the embodiment of the present application by providing a local glue-free area 10A at the top corners, the disassembly of the heat dissipation device 5 can be facilitated, and the disassembly efficiency of the heat dissipation device 5 can be improved.
  • the adhesive area 9 can be provided at two opposite ends of the heat dissipation device 5, and extend to the edge of the heat dissipation device 5, so that the heat dissipation device 5 and the internal structure The bonding between the two is relatively reliable.
  • the middle area of the heat dissipating device 5 can also be set as a local glue-free area 10B, so that when the heat dissipating device 5 is bonded to the internal structure, the vulnerable components can be avoided, so as to avoid the disassembly of the heat dissipating device 5, Cause damage to other devices.
  • the local glue-free area 10A at the top corner of the heat sink 5 can be made to fall within a rectangular interval with an area of 15mm ⁇ 15mm, so that the area of the local glue-free area 10A does not affect While the adhesive area 9 fixes the heat dissipation device 5, it is easy to lift a corner of the heat dissipation device 5 so as to facilitate the disassembly of the heat dissipation device 5.
  • the surface of the heat sink 5 is further provided with a protective film (not shown in the figure). When the heat sink 5 is adhered to the internal structure, the protective film on the surface of the heat sink 5 needs to be torn off. Therefore, when setting the area of the local adhesive-free area 10A at the top corner of the heat sink 5, it is necessary to ensure the reliability of the adhesion between the heat sink 5 and the bonding part during the process of tearing off the protective film.
  • FIG. 5 is a cross-sectional view of the heat dissipation device 5 in FIG. 4 taken along the line A-A.
  • the heat dissipation device 5 of the embodiment of the present application is arranged in a laminated structure, and includes a polymer film layer 11A, a heat dissipation material layer 12A, a polymer film layer 11B, and an adhesive layer 13A.
  • the material film layer 11A can also be a metal foil layer (for example, copper foil or aluminum foil), and the adhesive layer 13A is disposed in the adhesive area of the heat dissipation device 5.
  • the heat dissipation material layer 12A can be, but is not limited to, a graphite layer or a graphene layer,
  • the heat dissipation device 5 is a graphite heat dissipation film;
  • the heat dissipation device 5 is a graphene heat dissipation film.
  • Both the graphite heat dissipation film and the graphene heat dissipation film can be referred to as Graphite film.
  • the heat dissipation device 5 can be bonded and fixed to the internal structure through the adhesive layer 13A. Since the top corner of the heat dissipation device 5 is provided with a local glue-free area 10A, the local glue-free area 10A is connected to the inner structure. There is no bonding relationship between the structures. In this way, you can directly reach into the local glue-free area 10A, and sandwich the film structure composed of the polymer film layer 11A, the heat dissipation material layer 12A and the polymer film layer 11B.
  • the above-mentioned film structure is slowly lifted up so that the adhesive layer 13A loses the adhesion relationship with the internal structure, and then the entire heat dissipation device 5 is peeled off, which is beneficial to reduce the probability of damage to the heat dissipation device 5.
  • the heat dissipation device may further include a polymer film layer 11C, a heat dissipation material layer 12B, an adhesive layer 13B, and a polymer film layer 11D that are stacked.
  • the polymer film layer 11C can also be a metal foil layer (such as copper foil or aluminum foil)
  • the adhesive layer 13B is provided on the entire surface of the heat dissipation device 5
  • the polymer film layer 11D is provided corresponding to the local adhesive-free area of the heat dissipation device 5.
  • the heat dissipation material layer 12B may be, but is not limited to, a graphite layer or a graphene layer.
  • the heat dissipation device 5 can be bonded and fixed to the internal structure through the adhesive layer located in the adhesive-backed area 9. Since there is a local glue-free area at the top corner of the heat sink 5, the glue-free area There is no bonding relationship with the internal structure. In this way, the corner of the heat sink 5 corresponding to the local glue-free area can be lifted, and then the film structure of the corner can be clamped and slowly torn, so as to completely dissipate heat. Device 5 is removed.
  • the use of the heat dissipation device 5 of the present technical solution can improve the disassembly convenience of the heat dissipation device 5, and is beneficial to reduce the probability of the heat dissipation device 5 being damaged.
  • the heat dissipation device 5 may further include a polymer film layer 11E, a heat dissipation material layer 12C, and an adhesive layer 13C that are stacked.
  • the polymer film layer 11E can also be a metal foil layer (such as copper foil or aluminum foil), and the adhesive layer 13C is disposed in the adhesive area of the heat dissipation device 5.
  • the heat dissipation material layer 12C can be, but is not limited to, a graphite layer or graphene. Floor.
  • the film structure of the heat dissipation device 5 of this embodiment is less, and when it is applied to a terminal device, it is beneficial to realize a thinner design of the terminal device.
  • the heat dissipation device 5 can be bonded and fixed to the internal structure through the adhesive layer 13C. Since the top corner of the heat dissipation device 5 is provided with a local glue-free area 10A, the local glue-free area 10A is connected to the internal structure. There is no bonding relationship between the structures. In this way, the local glue-free area 10A can be directly lifted by hand, and the film structure formed by the polymer film layer 11E and the heat dissipation material layer 12C can be clamped, and then the film structure Lift up slowly so that the adhesive layer 13C loses the adhesion relationship with the internal structure, and then the entire heat sink 5 is peeled off. This facilitates the disassembly of the heat sink 5 and effectively prevents the heat sink 5 from being damaged.
  • the shape of the glue-free area may be, but not limited to, a triangle (as shown in FIG. 4), a rectangle as shown in FIG. 8, or as shown in FIG. The trapezoid shown.
  • the middle area of the heat sink 5 is a local adhesive-free area 10B.
  • the local glue-free area 10A of the corner is connected with the local glue-free area 10B of the middle area, which facilitates the removal of waste through the connected local glue-free area 10A and the local glue-free area 10B during production.
  • the local glue-free area 10A can be arranged only at one vertex corner of the heat sink 5, or as shown in FIGS. 8 to 10, set at two vertex corners on the same side of the heat sink 5, or as shown in FIG. As shown, each top corner of the heat sink 5 is provided with a local glue-free area 10A, wherein the local glue-free area 10A can be but not limited to a triangle, and can pass through a strip-shaped partial glue-free area 10C, The local glue-free area 10A is connected to the local glue-free area 10B. It is worth noting that no matter how the local adhesive-free area 10A is set, it must be easy to realize the disassembly of the heat dissipation device 5 without affecting the bonding reliability of the heat dissipation device 5.
  • the structural stability of the internal structure is relatively strong, so that the area ratio of the adhesive area of the heat dissipation device 5 can be increased, so as to achieve the adhesion between the heat dissipation device 5 and the internal structure.
  • a partial adhesive-free area 10A may be provided at at least one top corner of the heat dissipation device 5, and the other parts are all provided as adhesive-backed areas 9.
  • a heat dissipation device for dissipating heat for an internal structure characterized in that the heat dissipation device includes a glue-back area and a glue-free area, wherein the glue-back area is bonded to the internal structure, and the glue-free area The zone is set at least at the top corner of the heat dissipation device.
  • the heat dissipation device further comprises a first polymer film layer, a heat dissipation material layer, a second polymer film layer, and a glue layer that are stacked in sequence. Layer, wherein the adhesive layer is disposed in the adhesive area of the heat dissipation device.
  • thermoelectric device according to any one of embodiments 1 to 6, wherein the heat dissipation device further includes a third polymer film layer, a heat dissipation material layer, an adhesive layer, and a fourth polymer film stacked in sequence.
  • the adhesive layer is arranged on the entire surface of the heat dissipation device, and the fourth polymer film layer is arranged corresponding to the glue-free area of the heat dissipation device.
  • thermoelectric device according to any one of embodiments 1 to 6, wherein the heat dissipation device further includes a fifth polymer film layer, a heat dissipation material layer, and an adhesive layer stacked in sequence, wherein the adhesive The layer is arranged in the adhesive back area of the heat dissipation device.
  • thermoelectric material layer is a graphite layer or a graphene layer.
  • a terminal device characterized by comprising a display screen, a middle frame, a rear case, a printed circuit board, and the heat dissipation device according to any one of embodiments 1 to 12, wherein:
  • the middle frame is used to carry the printed circuit board and the display screen, the display screen and the printed circuit board are located on both sides of the middle frame, and the rear shell is located on the printed circuit The side of the board away from the display screen;
  • the printed circuit board is provided with a heating component, and the heat sink covers an area of the heating component.
  • terminal device of embodiment 13 wherein the terminal device further includes a bracket fixed to the middle frame, and the bracket is used to press the printed circuit board to the middle frame. .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请提供了一种散热装置及终端设备。涉及散热领域。该散热装置具有背胶区以及局部无胶区，其中，背胶区可与内部结构进行粘接，局部无胶区与内部结构之间没有粘连关系，另外，局部无胶区至少设置于散热装置的顶角处。在对该散热装置进行拆卸的过程中，可直接将散热装置的对应顶角处的局部无胶区的部分掀起，然后对散热装置进行撕扯，以将散热装置完整揭下。采用本申请的散热装置，其拆卸效率较高，且可有效的避免散热装置被损坏，从而使被拆卸下来的散热装置仍能够被使用，有利于降低生产成本。

Description

一种散热装置及终端设备
相关申请的交叉引用
本申请要求在2019年09月17日提交中国专利局、申请号为201910875354.3、申请名称为“一种散热装置及终端设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到散热设备技术领域，尤其涉及到一种散热装置及终端设备。
背景技术
目前，手机、平板电脑、笔记本电脑以及掌上电脑(personal digital assistant，PDA)等终端设备常用石墨散热膜或者石墨烯散热膜(后面简称石墨膜)作为散热装置。通常情况下，石墨膜是由聚合物膜层、石墨层或石墨烯层，以及胶层复合而成的复合膜，其中，石墨膜的至少一面的局部或全部具有胶层，以便于将其粘接固定于终端设备内部的待散热部位。
在终端设备量产时，会有大量返工的情况，有时候需要拆卸石墨膜，石墨膜在拆卸的过程中很容易被损坏，而被损坏的石墨膜不能再利用。另外，石墨膜还会与NFC天线、无线充电线圈铁氧体等器件通过粘接的方式组合成一个组件，由于该组件的各部件不可拆卸，这样，石墨膜拆坏很可能会导致附属部件连带报废，从而造成资源的浪费。
发明内容
本申请技术方案提供了一种散热装置及终端设备，以提高散热装置的拆卸便利性。
第一方面，本申请技术方案提供了一种石墨膜，用于为内部结构散热。该石墨膜包括背胶区和局部无胶区，其中，背胶区可与内部结构粘接，而局部无胶区与内部结构之间没有粘连关系。另外，在本申请中，局部无胶区设置于石墨膜的至少一个顶角处，这样，在对通过背胶区粘接于内部结构的石墨膜进行拆卸时，可先通过镊子等拆卸工具或者通过手伸入至石墨膜的顶角处的无胶区，以将该部分石墨膜掀起；然后，用手或者用拆卸工具撕扯石墨膜，以使其与内部结构之间的未粘连区域扩大，以至将石墨膜完整揭下。本申请实施例的石墨膜，通过在顶角处设置局部无胶区，可便于对石墨膜进行拆卸，并且有利于提高石墨膜的拆卸效率。另外，在对石墨膜进行拆卸的过程中，可有效的避免石墨膜被损坏，从而使被拆卸下来的石墨膜仍能够被使用，以有利于提高石墨膜的复用比例，降低生产成本。
第二方面，本申请技术方案还提供了一种终端设备，该终端设备包括显示屏、中框、后壳，印制电路板以及第一方面的石墨膜。其中，中框可以用来承载印制电路板和显示屏，显示屏和印制电路板位于中框的两侧，后壳位于印制电路板的远离显示屏的一侧，在印制电路板上设置有发热部件，发热部件可设置于印制电路板靠近中框的一侧，或者设置于印制电路板靠近后壳的一侧，或者同时设置于印制电路板的两侧，石墨膜覆盖发热部件区域， 以实现对发热部件的散热。
由于在第一方面中，石墨膜的顶角处设置有局部无胶区，这样在终端设备量产过程中，需要对石墨膜进行拆卸时，可先通过镊子等拆卸工具或者手伸入至石墨膜的顶角处的局部无胶区，以将该部分石墨膜掀起；然后，用手或者用拆卸工具撕扯石墨膜，以使其与终端设备中的内部结构之间的未粘连区域扩大，以至将石墨膜完整揭下。在本申请实施例中，石墨膜便于拆卸，其拆卸效率较高，从而使终端设备的返工维修效率得到提高。另外，由于在拆卸石墨膜的过程中，可避免石墨膜被损坏，从而使被拆卸下来的石墨膜仍能够被使用，以有利于石墨膜复用比例的提高，及生产成本的降低。
附图说明
图1为本申请一实施例提供的终端设备的结构示意图；
图2为现有技术的一实施例提供石墨膜的结构示意图；
图3为现有技术的另一实施例提供石墨膜的结构示意图；
图4为本申请一实施例提供散热装置的结构示意图；
图5为图4中散热装置的A-A剖视图；
图6为图4中散热装置的A-A剖视图；
图7为图4中散热装置的A-A剖视图；
图8为本申请另一实施例提供散热装置的结构示意图；
图9为本申请另一实施例提供散热装置的结构示意图；
图10为本申请另一实施例提供散热装置的结构示意图；
图11为本申请另一实施例提供散热装置的结构示意图；
图12为本申请另一实施例提供散热装置的结构示意图。
附图标记：
1-显示屏；2-中框；3-后壳；4-PCB；5-散热装置；6-发热部件；7-支架；
8-电池仓；9-背胶区；10A，10B，10C-局部无胶区；
11A，11B，11C，11D，11E-聚合物膜层；12A，12B，12C-散热材料层；
13A，13B，13C-胶层；14-石墨膜。
具体实施方式
为了方便理解本申请实施例提供的散热装置，下面首先说明一下本申请实施例提供的散热装置的应用场景，该散热装置可设置于手机、平板电脑、掌上电脑(personal digital assistant,PDA)等终端设备中，并可对终端设备中的芯片等发热部件进行散热。其中，发热部件包括但不限于为中央处理器(central processing unit，CPU)、人工智能(artificial intelligence，AI)处理器、片上系统(system on chip，SoC)、电源管理单元，或其它需要散热的器件。下面结合附图对该散热装置在终端设备中的具体设置方式进行详细的说明，以便于对该散热装置对发热部件进行导热的过程进行理解。
参考图1，在本申请一个实施例中，终端设备可以包括显示屏1、中框2、后壳3，印制电路板(printed circuit board，PCB 4)以及散热装置5。其中，中框2可以用来承载PCB 4和显示屏1，显示屏1和PCB 4位于中框2的两侧，后壳3位于PCB 4的远离显示屏1 的一侧，发热部件6(为便于描述，以下以发热部件6为CPU为例进行说明)设置于PCB 4，且可以位于PCB 4的两侧。
另外，终端设备还可以包括固定于中框2的支架7，该支架7可延伸至PCB 4靠近后壳3的一侧，且可用于将PCB 4压紧于中框，或者对PCB 4上的器件进行压紧固定，以有效的提高PCB 4的结构稳定性。散热装置5可设置于支架7与后壳3之间，并固定于支架7靠近后壳的一侧；另外，在PCB 4上的发热部件6罩设有屏蔽罩时，还可以将散热装置5粘接于屏蔽罩，或者粘接于支架7靠近屏蔽罩的一侧；此外，还可以直接将散热装置5粘接于后壳3。在利用该散热装置5对CPU等发热部件6进行散热时，首先，发热部件6产生的热量可传导至散热装置5；然后，热量通过散热装置5散开；最后，热量通过散热装置5的对流辐射传导至后壳3，并经后壳3散到终端设备的外部。
除了可将散热装置5靠近后壳3设置外，还可以将散热装置5设置于显示屏1与中框2之间，另外，可将散热装置5固定于中框2。从图1可以看出，PCB 4上的一些发热部件6靠近中框2设置，另外，用于容置电池的电池仓8也设置于中框2。这样，上述各个发热部件6产生的热量可传导至中框2以及电池仓8后被散开，并经中框2传导至散热装置5。散热装置5将热量散开，并在对流辐射的作用下传导至显示屏1，最后经显示屏1散到终端设备的外部，从而通过散热装置5实现对终端设备的散热。可以理解的是，在将散热装置5设置于PCB 4与后壳3之间的同时，还可以同时在中框2与显示屏1之间设置散热装置5，以提高终端设备的散热效率。另外，散热装置5不限于设置于终端设备的上述位置，只要能够实现对终端设备的发热部件6的散热即可。
目前，石墨膜14是终端设备中常用的散热装置，通常情况下，石墨膜14是由聚合物膜层、石墨层或石墨烯层，以及胶层复合而成的复合膜。在具体设置该石墨膜14时，参照图2，可使石墨膜14具有整面的背胶区9，或者参照图3，使石墨膜14具有局部的背胶区9，其中，胶层布置于该背胶区9。从图2和图3中可以看出，该石墨膜14的角落处填满背胶，以避免在将该石墨膜14贴附于终端设备时，揭掉石墨膜14表面的保护膜的过程中，带起石墨膜14，以提高石墨膜14的粘接牢靠性。这样，在拆卸粘接于终端设备内的石墨膜14时，需要先用镊子尖掀起石墨膜14的一角；然后在被提起的石墨膜14的面积扩大后用手撕下石墨膜14即可。但是，由于镊子太尖，在上述石墨膜14拆卸的过程中，很容易造成石墨膜14的破损，另外，由于石墨膜14的角落处均填有背胶，这样会使石墨膜14的拆卸较为困难、操作效率较低。此外，撕坏的石墨膜14、返工的石墨膜14的物料不能重复利用，而且石墨膜14在被撕坏的同时可能会使组装在石墨膜14上的部件(如NFC线圈、无线充电线圈铁氧体等)连带报废，从而造成资源的浪费，生产成本较高。
为了解决上述问题，参照图4，本申请实施例提供了一种散热装置5，该散热装置5具有背胶区9以及局部无胶区10A，其中，背胶区9可与内部结构进行粘接，局部无胶区10A与内部结构之间没有粘连关系，另外，局部无胶区10A设置于散热装置5的至少一个顶角处，其中，散热装置5的顶角是指散热装置5的外廓凸起的部分。该散热装置5在使用时，可通过背胶区9粘接于内部结构，在需要对散热装置5进行拆卸时，只需要用手掀起散热装置5的顶角处的局部无胶区10A，然后慢慢撕扯散热装置5，以使散热装置5与内部结构之间的未粘连区域扩大，以至将散热装置5完整揭下。本申请实施例的散热装置5，通过在顶角处设置局部无胶区10A，可便于实现对散热装置5的拆卸，并且有利于提高散热装置5的拆卸效率。另外，在对散热装置5拆卸的过程中，可有效的避免其被损坏， 从而使被拆卸下来的散热装置5仍能够被复用，另外，还能够有效的避免设置于散热装置5上的其它部件(如NFC线圈、无线充电线圈铁氧体等)被损坏，以有利于提高散热装置5，及设置于散热装置5上的各部件的复用比例，降低生产成本。
在具体设置背胶区9时，参照图4，背胶区9可设置于散热装置5的两个相对的端部，且延伸至散热装置5的边缘处，从而使散热装置5与内部结构之间的粘接较为可靠。另外，还可以将散热装置5的中间区域设置为局部无胶区10B，以在将散热装置5粘接于内部结构时，能够避让开易损坏器件，从而避免在对散热装置5进行拆卸时，造成对其它器件的损坏。
另外，在本申请实施例中，可使散热装置5的顶角处的局部无胶区10A落在面积为15mm×15mm的矩形区间内，从而使该局部无胶区10A的面积大小在不影响背胶区9对于散热装置5的固定的同时，又容易使散热装置5的一角被掀起，以便于实现散热装置5的拆卸。在一些实施例中，散热装置5表面还设置有保护膜(图中未示出)，在散热装置5粘接于内部结构时，需要将散热装置5表面的保护膜撕掉。因此，在对散热装置5的顶角处的局部无胶区10A的面积进行设置时，还要使其能够保证在撕保护膜的过程中，散热装置5与粘接部位的粘接可靠性。
为了更加清楚的了解本申请实施例的散热装置5的结构，可参照图5，图5为图4中散热装置5的A-A剖视图。从图5中可以看出，本申请实施例的散热装置5呈层叠结构设置，包括叠置的聚合物膜层11A、散热材料层12A、聚合物膜层11B，以及胶层13A，其中，聚合物膜层11A还可以为金属箔层(例如铜箔或铝箔)，胶层13A设置于散热装置5的背胶区，另外，散热材料层12A可以为但不限于为石墨层或者石墨烯层，当散热材料层12A为石墨层时，散热装置5为石墨散热膜；当散热材料层12A为石墨烯层时，散热装置5为石墨烯散热膜，石墨散热膜和石墨烯散热膜均可简称为石墨膜。通过在散热材料层12A的两侧分别设置聚合物膜层11A和聚合物膜层11B，以使其复合形成一膜层结构，这样有利于增加散热装置5的结构强度，从而使散热装置5在拆卸的过程中不易被损坏。
另外，从图5中可以看出，散热装置5可通过胶层13A与内部结构粘接固定，由于在散热装置5的顶角处设置有局部无胶区10A，该局部无胶区10A与内部结构之间没有粘接关系，这样，可以直接将手伸入至该局部无胶区10A，并将由聚合物膜层11A，散热材料层12A以及聚合物膜层11B复合而成的膜层结构夹紧，然后将上述膜层结构慢慢掀起，以使胶层13A与内部结构失去粘连关系，进而将整个散热装置5揭下，这样有利于降低散热装置5被损坏的几率。
在一些实施例中，参照图6，散热装置还可以包括层叠设置的聚合物膜层11C、散热材料层12B、胶层13B以及聚合物膜层11D。其中，聚合物膜层11C还可以为金属箔层(例如铜箔或铝箔)，胶层13B设置于散热装置5的整面上，聚合物膜层11D对应散热装置5的局部无胶区设置，通过在胶层13B的对应局部无胶区的位置设置聚合物膜层11D，可以使贴附有聚合物膜层11D的部分不具有粘接力。另外，散热材料层12B可以但不限于为石墨层或者石墨烯层。通过在散热材料层12B的两侧分别设置聚合物膜层11C和整面的胶层13B，有利于增加散热装置5的结构强度，从而使散热装置5在拆卸的过程中不易被损坏。
另外，从图6中可以看出，散热装置5可通过位于背胶区9的胶层与内部结构粘接固定，由于在散热装置5的顶角处设置有局部无胶区，该无胶区与内部结构之间没有粘接关系，这样，可以先将散热装置5的对应局部无胶区的角部掀起，然后可夹紧该角部的膜层 结构并慢慢撕开，以至完全将散热装置5揭下。采用本技术方案的散热装置5，可以提高该散热装置5的拆卸便利性，并且有利于降低散热装置5被损坏的几率。
在另外一些实施例中，参照图7，散热装置5还可以包括层叠设置的聚合物膜层11E、散热材料层12C以及胶层13C。其中，聚合物膜层11E还可以为金属箔层(例如铜箔或铝箔)，胶层13C设置于散热装置5的背胶区，另外，散热材料层12C可以但不限于为石墨层或者石墨烯层。该实施例的散热装置5的膜层结构较少，当其应用于终端设备时，有利于实现终端设备的薄型化设计。
另外，从图7中可以看出，散热装置5可通过胶层13C与内部结构粘接固定，由于在散热装置5的顶角处设置有局部无胶区10A，该局部无胶区10A与内部结构之间没有粘接关系，这样，可以直接用手掀起该局部无胶区10A，并将由聚合物膜层11E及散热材料层12C复合而成的膜层结构夹紧，然后将上述膜层结构慢慢揭起，以使胶层13C与内部结构失去粘连关系，进而将整个散热装置5揭下，这样可以便于散热装置5的拆卸，并可有效的避免散热装置5被损坏。
在本申请各实施例中，具体设置无胶区时，无胶区的形状可以但不限于为三角形(如图4所示)，或者为如图8所示的矩形，又或者如图9所示的梯形。另外，当背胶区只设置于散热装置5的两个相对的端部时，散热装置5的中间区域为局部无胶区10B，此时，可参照图10，使设置于散热装置5的顶角的局部无胶区10A与中间区域的局部无胶区10B相连，这样可方便生产时通过相连接的局部无胶区10A和局部无胶区10B进行废料的排除。采用本申请的设计方案，其加工工艺简单，并且不会增加物料成本。
另外，局部无胶区10A可以只设置于散热装置5的一个顶角处，或者如图8至图10所示，设置于散热装置5的同一侧的两个顶角处，又或者如图11所示，在散热装置5的每个顶角处各设置一个局部无胶区10A，其中，局部无胶区10A可以但不限于为三角形，且可通过一个条形的局部无胶区10C，将局部无胶区10A和局部无胶区10B相连。值得注意的是，无论局部无胶区10A如何设置，都要使其在便于实现散热装置5的拆卸的基础上，不影响散热装置5的粘接可靠性。
在本申请一些实施例中，内部结构的结构稳定性较强，这样可增加散热装置5的背胶区的面积占比，从而实现散热装置5与内部结构之间的粘接牢靠性。例如，参照图12，可以只在散热装置5的至少一个顶角处设置局部无胶区10A，其它部分均设置为背胶区9。
【实施例】
1、一种散热装置，用于为内部结构散热，其特征在于，所述散热装置包括背胶区和无胶区，其中，所述背胶区与所述内部结构粘接，所述无胶区至少设置于所述散热装置的顶角处。
2、如实施例1所述的散热装置，其特征在于，所述背胶区设置于所述散热装置的两个相对的端部。
3、如实施例1或2所述的散热装置，其特征在于，所述背胶区延伸至所述散热装置的边缘处。
4、如实施例1～3任一项所述的散热装置，其特征在于，所述无胶区还设置于所述散热装置的中间区域。
5、如实施例4所述的散热装置，其特征在于，设置于所述散热装置的顶角处的无胶区，与设置于所述散热装置的中间区域的无胶区相连。
6、如实施例1～5任一项所述的散热装置，其特征在于，设置于所述散热装置的顶角处的所述无胶区落在面积为10mm×10mm的矩形区间内。
7、如实施例1～6任一项所述的散热装置，其特征在于，所述散热装置还包括依次层叠设置的第一聚合物膜层、散热材料层、第二聚合物膜层以及胶层，其中，所述胶层设置于所述散热装置的背胶区。
8、如实施例1～6任一项所述的散热装置，其特征在于，所述散热装置还包括依次层叠设置的第三聚合物膜层、散热材料层、胶层以及第四聚合物膜层，其中，所述胶层设置于所述散热装置的整面，所述第四聚合物膜层对应所述散热装置的无胶区设置。
9、如实施例1～6任一项所述的散热装置，其特征在于，所述散热装置还包括依次层叠设置的第五聚合物膜层、散热材料层以及胶层，其中，所述胶层设置于所述散热装置的背胶区。
10、如实施例7～9任一项所述的散热装置，其特征在于，所述散热材料层为石墨层或者石墨烯层。
11、如实施例1～9任一项所述的散热装置，其特征在于，设置于所述散热装置的顶角处的所述无胶区的形状为三角形、矩形或者梯形。
12、如实施例1～11任一项所述的散热装置，其特征在于，所述散热装置的一个顶角处设置有无胶区，或者所述散热装置的至少两个顶角处设置有无胶区。
13、一种终端设备，其特征在于，包括显示屏、中框、后壳、印制电路板，以及如实施例1～12任一项所述的散热装置，其中：
所述中框，用来承载所述印制电路板和所述显示屏，所述显示屏和所述印制电路板位于所述中框的两侧，所述后壳位于所述印制电路板的远离所述显示屏的一侧；
所述印制电路板，设置有发热部件，所述散热装置覆盖所述发热部件区域。
14、如实施例13所述的终端设备，其特征在于，所述终端设备还包括固定于所述中框的支架，所述支架用于将所述印制电路板压紧于所述中框。
15、如实施例14所述的终端设备，其特征在于，所述散热装置设置于所述印制电路板靠近所述后壳的一侧。
16、如实施例15所述的终端设备，其特征在于，所述散热装置粘接于所述支架靠近所述后壳的一侧；或，所述散热装置粘接于所述支架靠近所述中框的一侧；或，所述散热装置粘接于所述后壳。
17、如实施例15所述的终端设备，其特征在于，所述发热部件罩设有屏蔽罩，所述散热装置粘接于所述屏蔽罩。
18、如实施例13～17任一项所述的终端设备，其特征在于，所述散热装置还设置于所述中框与所述显示屏之间，所述散热装置粘接于所述中框。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种散热装置，用于为内部结构散热，其特征在于，所述散热装置包括背胶区和局部无胶区，其中，所述背胶区与所述内部结构粘接，覆盖发热部件区域，所述局部无胶区设置于所述散热装置的至少一个顶角处。
  2. 如权利要求1所述的散热装置，其特征在于，设置于所述散热装置的顶角处的所述局部无胶区落在面积为15mm×15mm的矩形区间内。
  3. 如权利要求1或2所述的散热装置，其特征在于，所述散热装置还包括依次层叠设置的第一聚合物膜层、散热材料层、第二聚合物膜层以及胶层，其中，所述胶层设置于所述散热装置的背胶区。
  4. 如权利要求1或2所述的散热装置，其特征在于，所述散热装置还包括依次层叠设置的第三聚合物膜层、散热材料层、胶层以及第四聚合物膜层，其中，所述胶层设置于所述散热装置的整面，所述第四聚合物膜层对应所述散热装置的局部无胶区设置。
  5. 如权利要求1或2所述的散热装置，其特征在于，所述散热装置还包括依次层叠设置的第五聚合物膜层、散热材料层以及胶层，其中，所述胶层设置于所述散热装置的背胶区。
  6. 如权利要求3～5任一项所述的散热装置，其特征在于，所述散热材料层为石墨层或者石墨烯层。
  7. 如权利要求1～6任一项所述的散热装置，其特征在于，设置于所述散热装置的顶角处的所述局部无胶区的形状为三角形、矩形、扇形或者梯形。
  8. 一种终端设备，其特征在于，包括显示屏、中框、后壳、印制电路板，以及如权利要求1～7任一项所述的散热装置，其中：
    所述中框，用于承载所述印制电路板和所述显示屏，所述显示屏和所述印制电路板位于所述中框的两侧，所述后壳位于所述印制电路板的远离所述显示屏的一侧；
    所述印制电路板，设置有发热部件，所述散热装置覆盖所述发热部件区域。
  9. 如权利要求8所述的终端设备，其特征在于，所述终端设备还包括固定于所述中框的支架，所述支架用于将所述印制电路板压紧于所述中框。
  10. 如权利要求9所述的终端设备，其特征在于，所述散热装置设置于所述印制电路板靠近所述后壳的一侧，且粘接于所述支架。
PCT/CN2020/106630 2019-09-17 2020-08-03 一种散热装置及终端设备 WO2021052043A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP20864562.2A EP4025023A4 (en) 2019-09-17 2020-08-03 HEAT DISSIPATION DEVICE AND TERMINAL
CN202080015366.XA CN113491178B (zh) 2019-09-17 2020-08-03 一种散热装置及终端设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910875354.3A CN110636746B (zh) 2019-09-17 2019-09-17 一种散热装置及终端设备
CN201910875354.3 2019-09-17

Publications (1)

Publication Number Publication Date
WO2021052043A1 true WO2021052043A1 (zh) 2021-03-25

Family

ID=68971020

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/106630 WO2021052043A1 (zh) 2019-09-17 2020-08-03 一种散热装置及终端设备

Country Status (3)

Country Link
EP (1) EP4025023A4 (zh)
CN (2) CN110636746B (zh)
WO (1) WO2021052043A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110636746B (zh) * 2019-09-17 2021-02-26 华为技术有限公司 一种散热装置及终端设备
DE102020208376A1 (de) * 2020-07-03 2022-01-05 Continental Teves Ag & Co. Ohg Pumpenaggregat mit wärmeleitfähigem Material auf einer Folienschicht
CN113999621B (zh) * 2021-10-29 2023-06-23 维沃移动通信有限公司 散热膜和电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2123567A1 (en) * 2008-05-22 2009-11-25 Sacchettificio Monzese S.R.L. Envelope for laser printers and process for the manufacturing of the envelope
CN205467698U (zh) * 2016-01-18 2016-08-17 东莞市南泰高分子材料有限公司 一种遮光防辐射胶带
CN107249283A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN110636746A (zh) * 2019-09-17 2019-12-31 华为技术有限公司 一种散热装置及终端设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201101981A (en) * 2009-06-22 2011-01-01 Cetech Co Ltd Thermal conduction substrate
CN103254830B (zh) * 2013-05-13 2015-07-29 3M创新有限公司 均热胶带
JP6361022B2 (ja) * 2013-09-17 2018-07-25 パナソニックＩｐマネジメント株式会社 複合シート
CN203675427U (zh) * 2013-12-30 2014-06-25 华为终端有限公司 一种印制电路板及终端设备
KR102365738B1 (ko) * 2015-03-10 2022-02-22 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
CN206210852U (zh) * 2016-11-24 2017-05-31 东莞新能源科技有限公司 Mylar薄膜及电芯
CN206301114U (zh) * 2016-12-29 2017-07-04 苏州世沃电子科技有限公司 一种lcd导热泡棉
CN206451737U (zh) * 2017-02-27 2017-08-29 东莞市富美印刷有限公司 一种手机电池缓冲导热的油墨印刷保护膜
CN206768003U (zh) * 2017-03-13 2017-12-19 深圳市立德通讯器材有限公司 一种复合型散热导电胶布
CN207347486U (zh) * 2017-05-11 2018-05-11 东莞市圳东电子有限公司 一种易撕贴耐高温手机遮光胶带
CN206741152U (zh) * 2017-05-26 2017-12-12 深圳Tcl新技术有限公司 一种液晶模组及液晶显示装置
CN109749652A (zh) * 2017-08-21 2019-05-14 南京锦冠汽车零部件有限公司 一种开头易撕型铝箔胶带
AU2017437315B2 (en) * 2017-10-27 2021-11-18 Huawei Technologies Co., Ltd. Packaging film, battery module, and mobile terminal
CN209079392U (zh) * 2018-10-10 2019-07-09 苏州钛旺电子有限公司 一种石墨铜箔
CN111654996B (zh) * 2018-10-15 2021-12-17 华为技术有限公司 终端设备
CN209314200U (zh) * 2018-10-24 2019-08-27 士彩材料科技（苏州）有限公司 一种电磁波可穿透的导热装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2123567A1 (en) * 2008-05-22 2009-11-25 Sacchettificio Monzese S.R.L. Envelope for laser printers and process for the manufacturing of the envelope
CN205467698U (zh) * 2016-01-18 2016-08-17 东莞市南泰高分子材料有限公司 一种遮光防辐射胶带
CN107249283A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN110636746A (zh) * 2019-09-17 2019-12-31 华为技术有限公司 一种散热装置及终端设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4025023A4 *

Also Published As

Publication number Publication date
CN110636746B (zh) 2021-02-26
EP4025023A4 (en) 2022-11-02
CN113491178A (zh) 2021-10-08
CN113491178B (zh) 2022-11-22
EP4025023A1 (en) 2022-07-06
CN110636746A (zh) 2019-12-31

Similar Documents

Publication Publication Date Title
WO2021052043A1 (zh) 一种散热装置及终端设备
CN109076720B (zh) 散热板、散热装置和电子设备
WO2017047440A1 (ja) 電子機器筐体
TWI464487B (zh) 電子裝置及其保護膜的撕除方法
US20060089034A1 (en) Buckling structure
JP2007044994A (ja) グラファイト複合構造体、それを用いた放熱部材及び電子部品
KR100921799B1 (ko) 열확산시트와 그의 제조방법
WO2023072119A1 (zh) 散热膜和电子设备
TW200415535A (en) Image display apparatus
US20140160673A1 (en) Low profile heat spreader and methods
US20180170030A1 (en) Electronic apparatus and disassembling method therefor
US9537122B2 (en) Fixing sheet and electronic apparatus
CN210274985U (zh) 一种超薄型电子设备散热贴片
US9335801B2 (en) Frame and electronic device having the same
TWI455670B (zh) 軟性電路板組合及其組裝方法
CN214313424U (zh) 电池的固定结构、电池及电子设备
CN214896098U (zh) 一种显示装置
CN217426333U (zh) 显示装置及电子设备
JP6469425B2 (ja) 電子機器
CN210075910U (zh) 一种用于手机的散热铜箔
TWM644303U (zh) 具有磁性提升功能的散熱片結構
CN211879476U (zh) 一种电子设备
US8846177B2 (en) Internal component adhesive securing systems for portable computing devices
CN210075914U (zh) 一种用于手机的散热铜箔
US11084955B2 (en) Pressure sensitive adhesive with thermally conductive release tab

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20864562

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2020864562

Country of ref document: EP

Effective date: 20220330