WO2021051683A1 - 一种集成封装的光引擎及其信号发射、接收方法 - Google Patents

一种集成封装的光引擎及其信号发射、接收方法 Download PDF

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Publication number
WO2021051683A1
WO2021051683A1 PCT/CN2019/126034 CN2019126034W WO2021051683A1 WO 2021051683 A1 WO2021051683 A1 WO 2021051683A1 CN 2019126034 W CN2019126034 W CN 2019126034W WO 2021051683 A1 WO2021051683 A1 WO 2021051683A1
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Prior art keywords
optical
chip
optical fiber
signal
light engine
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PCT/CN2019/126034
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English (en)
French (fr)
Inventor
王灏
王东
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杭州耀芯科技有限公司
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Publication of WO2021051683A1 publication Critical patent/WO2021051683A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Definitions

  • the invention relates to the field of information transmission, in particular to an integrated packaged light engine and a signal transmitting and receiving method thereof.
  • the light engine is the main component of the optical transceiver module.
  • the light engine in the prior art purchases electrical interfaces, drive controllers, laser chips, photodiode chips, receiving chips, entire lens modules, and optical fiber arrays according to application requirements. , And then place each device on a PCB board; in this way, for different application requirements, all PCB boards, circuits and optical paths need to be redesigned and developed, which has problems such as long development time and high cost.
  • the purpose of the present invention is to solve the above-mentioned problems and provide an integrated packaged light engine with simple assembly and improved efficiency and a signal transmitting and receiving method thereof.
  • the light engine includes a molded interconnection device, a ceramic substrate, a laser chip, a photodiode chip, an optical drive chip, a transimpedance amplifier chip, an array lens module, an optical fiber interface, and a molded interconnection
  • the device is fixedly connected to the PCB board, and the molded interconnection device is embedded with a ceramic substrate.
  • the ceramic substrate is provided with a laser chip, a photodiode chip, an optical drive chip, a transimpedance amplifier chip, an array lens module, and an optical fiber interface;
  • the surface of the molded interconnection device is provided with a power supply circuit and a signal circuit, the surface of the ceramic substrate is provided with a connection circuit, and the metal pins of the optical drive chip and the metal pins of the transimpedance amplifier chip are respectively connected with the connection circuits on the surface of the ceramic substrate; laser The chip is electrically connected with the optical drive chip, the photodiode is electrically connected with the transimpedance amplifier chip, and the metal pins of the optical drive chip and the connection circuit on the surface of the ceramic substrate are all connected with the power supply circuit and the signal circuit on the surface of the molded interconnection device.
  • the optical fiber interface adopts an optical fiber interface in the form of an optical fiber array, which is used to connect a single-mode optical fiber, a multi-mode optical fiber, or a plastic optical fiber.
  • optical fiber array is integrated on the array lens module.
  • both the array lens module and the optical fiber interface can transmit optical signals in both directions.
  • high-precision holes are provided on the molded interconnection device (high-precision includes hole spacing and hole diameter, and the tolerance is preferably less than 5um, and 15um is also acceptable);
  • the array lens module is provided with two high-precision PIN columns (high-precision includes PIN column spacing and PIN column diameter, preferably the tolerance is less than 5um, 15um is acceptable);
  • the two high-precision PIN columns of the array lens module and the two holes of the molded interconnection device are aligned to achieve passive coupling.
  • the array lens module includes a lens body (at least one or more than one), a 45-degree reflecting surface is provided on the lens body, and several optical fiber interfaces (at least one) are arranged side by side on the side of the lens body , Each optical fiber interface is provided with a first lens, and the bottom end of the lens body is provided with a second lens side by side. The first lens and the second lens correspond to each other and the light signal entering from the first lens is reflected from the second lens after being reflected by the reflective surface. Projected.
  • the optical fiber uses a blade or a laser cutting machine to cut the optical fiber.
  • a signal transmission method of a light engine includes the following steps:
  • the external power supply supplies power to the optical drive chip through the power supply circuit on the surface of the molded interconnection device and the connection circuit on the surface of the ceramic substrate;
  • the external signal transmits the signal to the light drive chip through the signal circuit on the surface of the molded interconnection device and the connection circuit on the surface of the ceramic substrate, and the light drive chip drives the laser chip to emit light signals;
  • the array lens module collimates, totally reflects, and converges the optical signal emitted by the laser chip, and then transmits it through the optical fiber interface and the optical fiber connected to the optical fiber interface to complete the signal transmission operation of the optical engine.
  • a signal receiving method of an optical engine includes the following steps:
  • the optical signal enters the optical fiber interface connected with the optical fiber through the optical fiber;
  • the optical signal enters the array lens module after coming out of the optical fiber interface
  • the array lens module collimates, totally reflects, and converges the optical signal to send the optical signal to the photodiode chip;
  • the external power supply supplies power to the transimpedance amplifier chip through the power supply circuit on the surface of the molded interconnection device and the connection circuit on the surface of the ceramic substrate;
  • the photodiode chip converts the optical signal into an electrical signal and transmits it to the transimpedance amplifier chip.
  • the transimpedance amplifier chip transmits the electrical signal to the external circuit through the power supply circuit on the surface of the molded interconnection device and the connection circuit on the surface of the ceramic substrate. The signal receiving operation of the light engine.
  • the optical engine of the present invention integrates the devices used for optical signal transmission and reception, which can realize the standardization of the optical engine, simplify the design, and meet different application requirements; when using, directly connect the optical engine of the present application to the external circuit. Realize the transmission and reception of optical signals, which effectively shortens the development time of the optical engine and reduces the research and development costs.
  • the optical fiber interface in the present invention adopts the optical fiber interface in the form of an optical fiber array, which can increase the density of electrical interconnection and optical interconnection, thereby improving the overall bandwidth capability and communication capability, and effectively improving the working efficiency of the optical engine.
  • Figure 1 is a diagram of the assembly structure of the light engine
  • Figure 2 is a connection structure diagram of a molded interconnection device and a ceramic substrate
  • FIG. 3 is a schematic diagram of the structure of the array lens module
  • Figure 4 is a schematic diagram of the reflection of the array lens module.
  • the light engine in the present invention includes a molded interconnect device (MID) 2, a ceramic substrate 3 embedded in the molded interconnect device 2, and a laser disposed on the ceramic substrate 3.
  • the surface of the molded interconnection device 2 has a circuit manufactured by laser direct structuring (LDS) technology; there is a printed circuit on the ceramic substrate 3; the laser chip 9 and the photodiode 8 are fixed on the ceramic substrate 3 by diebond technology; wirebond is used
  • the technology connects the laser chip 9 and the light driver chip 4 (Driver) through a gold wire; uses wirebond technology to connect the photodiode chip 8 and the transimpedance amplifier chip (TIA) 7 through gold wire; uses wirebond technology to connect the light driver chip (Driver) 4 and the metal pins of the transimpedance amplifier chip (TIA) 7 are connected to the circuit on the surface of the ceramic substrate 3; the circuit on the surface of the ceramic substrate 3 and the circuit on the surface of the molded interconnect device 2 are connected by gold wires, the ceramic substrate
  • the circuits on the 3 surface and the circuits on the surface of the molded interconnection device 2 are common circuits on the market.
  • the molded interconnection device 2 is provided with two high-precision holes 201 (high-precision includes hole spacing and hole diameter, the tolerance is preferably less than 5um, 15um is acceptable); the array lens module 5 is provided with two high-precision holes 201 High-precision PIN column 501 (high-precision includes PIN column spacing and PIN column diameter, the tolerance is preferably less than 5um, 15um is also acceptable); the two high-precision PIN columns 501 of the array lens module 5 and the molded interconnection device The two holes 201 of 2 are aligned to realize passive coupling.
  • the molded interconnect device (MID) 2 is mounted on the PCB board 1, and the molded interconnect device (MID) 2 is directly formed by laser (LDS), which can integrate high frequency, mechanical and electrical functions into a 3D component .
  • LDS laser
  • the optical fiber interface 506 adopts the form of an optical fiber array, which is used to connect a single-mode optical fiber or a multi-mode optical fiber; the optical fiber of the optical fiber array is used to transmit optical signals.
  • the array lens module 5 and the optical fiber array can transmit signals in both directions.
  • the array lens module includes a lens body 504 (at least one, there can be multiple), the lens body 504 is provided with a 45-degree reflecting surface 502, and the side of the lens body 504 is provided with several optical fiber interfaces 506 (at least A), the optical fiber 6 is inserted into the optical fiber interface, each optical fiber interface 506 is provided with a first lens 505, and the bottom end of the lens body 504 is provided with a second lens 503 side by side.
  • the first lens 505 and the second lens 503 correspond to each other and The light signal entering from the first lens 505 is reflected by the reflective surface and then exits from the second lens 503.
  • the array lens module 5 is an array lens optical fiber module, that is, an optical fiber array is integrated on the array lens module 5; the array lens optical fiber module integrates a lens and an optical fiber array, and the optical fiber is directly inserted into the corresponding hole of the lens, which reduces Fiber array: According to different fiber types, such as 125um outer diameter glass fiber, 250um outer-coated glass fiber, 250um plastic fiber, etc. different types of fibers, make array lens fiber modules with different apertures to suit Different fiber types.
  • the external power supply supplies power to the optical drive chip 4 through the power supply circuit on the surface of the molded interconnection device 2 and the connection circuit on the surface of the ceramic substrate 3;
  • the external signal transmits the signal to the optical drive chip 4 through the signal circuit on the surface of the molded interconnection device 2 and the connection circuit on the surface of the ceramic substrate 3, and the optical drive chip 4 drives the laser chip 9 to emit optical signals;
  • the array lens module 5 collimates, totally reflects, and converges the optical signal emitted by the laser chip 9 and transmits it through the optical fiber interface and the optical fiber 6 connected to the optical fiber interface to complete the signal transmission operation of the optical engine.
  • the light engine When the light engine performs signal receiving operation, it includes the following steps:
  • the optical signal enters the optical fiber interface connected with the optical fiber through the optical fiber 6;
  • the optical signal enters the array lens module 5 after coming out of the optical fiber interface
  • the array lens module 5 performs collimation, total reflection, and reconvergence on the optical signal and sends the optical signal to the photodiode chip 8;
  • the external power supply supplies power to the transimpedance amplifier chip 7 through the power supply circuit on the surface of the molded interconnection device 2 and the connection circuit on the surface of the ceramic substrate 3;
  • the photodiode chip 8 converts the optical signal into an electrical signal and transmits it to the transimpedance amplifier chip 7.
  • the transimpedance amplifier chip 7 transmits the electrical signal through the power supply circuit on the surface of the molded interconnection device 2 and the connection circuit on the surface of the ceramic substrate 3 To the external circuit, complete the signal receiving operation of the light engine.
  • the optical engine of the present invention integrates the devices used for optical signal transmission and reception, which can realize the standardization of the optical engine, simplify the design, and meet different application requirements; when using, directly connect the optical engine of the present application to the external circuit. Realize the transmission and reception of optical signals, which effectively shortens the development time of the optical engine and reduces the research and development costs.
  • the optical fiber interface in the present invention adopts the optical fiber interface in the form of an optical fiber array, which can increase the density of electrical interconnection and optical interconnection, thereby improving the overall bandwidth capability and communication capability, and effectively improving the working efficiency of the optical engine.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一种集成封装的光引擎及信号发射、接收方法。光引擎包括模塑互连器件（2）、嵌接在模塑互连器件（2）内的陶瓷基板（3）、设置在陶瓷基板（3）上的激光芯片（9）、光电二极管芯片（8）、光驱动芯片（4）、互阻放大器芯片（7）、阵列透镜模组（5）及光纤接口（506）。光引擎的信号发射方法为：S1、外部电源为光驱动芯片（4）供电；S2、外部信号传递给光驱动芯片（4），从而令激光芯片（9）发出光信号；S3、阵列透镜模组（5）对光信号进行全反射后传输出去。光引擎的信号接收方法为：S1、光信号进入光纤接口（506）；S2、光信号进入阵列透镜模组（5）；S3、阵列透镜模组（5）将光信号送入光电二极管芯片（8）；S4、光电二极管芯片（8）将光信号转换成电信号后送入互阻放大器芯片（7）；S5、互阻放大器芯片（7）将电信号传递给外部电路。

Description

一种集成封装的光引擎及其信号发射、接收方法 技术领域
本发明涉及信息传输领域，尤其涉及一种集成封装的光引擎及其信号发射、接收方法。
背景技术
随着通讯领域传输容量的日益增长，传统的传输技术已很难满足传输容量及传输速度的要求。目前，电子产品对带宽的要求越来越高，而且应用多样化。光引擎是光收发机模块的主要组件，现有技术中的光引擎根据应用需求先分别采购电接口、驱动控制器、激光芯片、光电二极管芯片、接收芯片、整列透镜模组和光纤阵列等器件，再将各器件安置在一个PCB板上；这种方式针对不同的应用需求，都需要全部重新设计开发PCB板、电路和光路，这就存在开发时间长，成本高等问题。
发明内容
本发明目的是针对上述问题，提供一种装配简单、提高效率的集成封装的光引擎及其信号发射、接收方法。
为了实现上述目的，本发明的技术方案是：
一种集成封装的光引擎，所述光引擎包括模塑互连器件、陶瓷基板、激光芯片、光电二极管芯片、光驱动芯片、互阻放大器芯片、阵列透镜模组、光纤接口，模塑互连器件固定连接在PCB板上，模塑互连器件内嵌接有陶瓷基板，陶瓷基板上设置有激光芯片、光电二极管芯片、光驱动芯片、互阻放大器芯片、阵列透镜模组、光纤接口；所述模塑互连器件表面设置有供电电路和信号电路，陶瓷基板表面设置有连接电路，光驱动芯片的金属引脚、互阻放大器芯片的金属引脚分别与陶瓷基板表面的连接电路连接；激光芯片与光驱动芯片电性连 接，光电二极管与互阻放大器芯片电性连接，光驱动芯片的金属引脚、陶瓷基板表面的连接电路均与模塑互连器件表面的供电电路、信号电路连接。
进一步的，所述光纤接口采用光纤阵列形式的光纤接口，其用于连接单模光纤、多模光纤或塑料光纤。
进一步的，所述阵列透镜模组上集成有光纤阵列。
进一步的，所述阵列透镜模组和光纤接口均可以双向传输光信号。
进一步的，模塑互连器件上设置有两个高精度的孔洞(高精度包括洞间距和洞直径，最好公差最好小于5um，15um也可以接受)；
进一步的，所述阵列透镜模组上设置有两个高精度的PIN柱(高精度包括PIN柱间距和PIN柱直径，最好公差最好小于5um，15um可以接受)；
进一步的，所述阵列透镜模组的两个高精度PIN柱与模塑互连器件的两个孔洞，进行对准，实现被动耦合。
进一步的，所述阵列透镜模组包括透镜本体(至少有一个，可以有多个)，透镜本体上设置有一个45度的反射面，透镜本体侧面并排设置有若干个光纤接口(至少有一个)，每个光纤接口内设置有第一透镜，透镜本体底端并排设置有第二透镜，第一透镜与第二透镜相互对应且从第一透镜进入的光信号经过反射面反射后从第二透镜射出。
进行安装时，先把陶瓷基板放入模塑互连器件内，使用胶水固定好。使用模塑互连器件边缘的两个洞，建立坐标系，之后在该坐标系下，通过diebond的方式，把激光芯片、光电二极管芯片、光驱动芯片、互阻放大器芯片放置在指定的位置上，通过银胶固定在陶瓷基板上。通过wire bond的方式，连接各部分。
光纤使用刀片或者激光切割机，把光纤切断。对应插入阵列透镜模组内，使用胶水固定在阵列透镜模组里面。
一种光引擎的信号发射方法，包括以下步骤：
S1、外部电源通过模塑互连器件表面的供电电路和陶瓷基板表面的连接电路为光驱动芯片供电；
S2、外部信号通过模塑互连器件表面的信号电路和陶瓷基板表面的连接电路将信号传递给光驱动芯片，光驱动芯片驱动激光芯片发出光信号；
S3、阵列透镜模组对激光芯片发出的光信号进行准直、全反射、再汇聚后通过光纤接口以及与光纤接口连接的光纤传输出去，完成光引擎的信号发射操作。
一种光引擎的信号接收方法，包括以下步骤：
S1、光信号通过光纤进入与光纤连接的光纤接口；
S2、光信号从光纤接口出来后进入阵列透镜模组；
S3、阵列透镜模组对光信号进行准直、全反射、再汇聚后将光信号送入光电二极管芯片；
S4、外部电源通过模塑互连器件表面的供电电路和陶瓷基板表面的连接电路为互阻放大器芯片供电；
S5、光电二极管芯片将光信号转换成电信号后传输到互阻放大器芯片，互阻放大器芯片通过模塑互连器件表面的供电电路和陶瓷基板表面的连接电路将电信号传递给外部电路，完成光引擎的信号接收操作。
与现有技术相比，本发明具有的优点和积极效果是：
本发明中光引擎将用于光信号发送和接收的器件集成在一起，能够实现光引擎的标准化，简化设计，满足不同的应用需求；使用时，直接将本申请光引擎与外部电路连接即可实现光信号的发射、接收工作，有效缩短了光引擎的开发时间，降低了研发成本。另一方面，本发明中的光纤接口采用光纤阵列形式 的光纤接口，能够提高电互联和光互联的密度，从而能够整体提升带宽能力和通信能力，有效提高了光引擎的工作效率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为光引擎的装配结构图；
图2为模塑互连器件与陶瓷基板的连接结构图；
图3为阵列透镜模组的结构示意图；
图4为阵列透镜模组的反射原理图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
如图1至图4所示，本发明中的光引擎包括模塑互连器件(MID)2、内嵌在模塑互连器件2里面的陶瓷基板3、以及设置在陶瓷基板3上的激光芯片(LD)9、光电二极管芯片(PD)8、光驱动芯片(Driver)4、互阻放大器芯片(TIA)7、阵列透镜模组(ArrayLens)5和光纤接口506。模塑互连器件2表面有利用激光直接成型(LDS)技术制造出来的电路；陶瓷基板3上有印刷好的电路；激光芯片9和光电二极管8通过diebond技术固定在陶瓷基板3上；利用wirebond 技术把激光芯片9与光驱动芯片4(Driver)通过金线连接；利用wirebond技术把光电二极管芯片8与互阻放大器芯片(TIA)7通过金线连接；利用wirebond技术把光驱动芯片(Driver)4和互阻放大器芯片(TIA)7的金属引脚与陶瓷基板3表面的电路连接；利用wirebond技术把陶瓷基板3表面的电路与模塑互连器件2表面的电路通过金线连接，陶瓷基板3表面的电路、模塑互连器件2表面的电路均为市面上的常用电路。
模塑互连器件2上设置有两个高精度的孔洞201(高精度包括洞间距和洞直径，公差最好小于5um，15um可以接受)；所述阵列透镜模组5上设置有两个高精度的PIN柱501(高精度包括PIN柱间距和PIN柱直径，公差最好小于5um，15um也可以接受)；所述阵列透镜模组5的两个高精度PIN柱501与模塑互连器件2的两个孔洞201进行对准，实现被动耦合。
所述模塑互连器件(MID)2安装在PCB板1上，模塑互连器件(MID)2由激光直接成型(LDS)，能够将高频、机械和电气功能集成到一个3D组件中。
所述光纤接口506采用光纤阵列形式，其用于连接单模光纤或多模光纤；光纤阵列的光纤用于传输光信号。
所述阵列透镜模组5和光纤阵列能够双向传输信号。
所述阵列透镜模组包括透镜本体504(至少有一个，可以有多个)，透镜本体504上设置有一个45度的反射面502，透镜本体504侧面并排设置有若干个光纤接口506(至少有一个)，光纤接口内插接有光纤6，每个光纤接口506内设置有第一透镜505，透镜本体504底端并排设置有第二透镜503，第一透镜505与第二透镜503相互对应且从第一透镜505进入的光信号经过反射面反射后从第二透镜503射出。
所述阵列透镜模组5为阵列透镜光纤模组，即在阵列透镜模组5上集成光 纤阵列；阵列透镜光纤模组，集成了透镜和光纤整列，光纤直接插入透镜对应的孔内，减少了光纤阵列；根据不同的光纤类型，比如125um外径的玻璃光纤，250um带外涂敷的玻璃光纤，250um的塑料光纤等等不同类型的光纤，制作孔径不一样的阵列透镜光纤模组，以适应不同的光纤类型。
光引擎进行信号发射操作时，包括以下步骤：
S1、外部电源通过模塑互连器件2表面的供电电路和陶瓷基板3表面的连接电路为光驱动芯片4供电；
S2、外部信号通过模塑互连器件2表面的信号电路和陶瓷基板3表面的连接电路将信号传递给光驱动芯片4，光驱动芯片4驱动激光芯片9发出光信号；
S3、阵列透镜模组5对激光芯片9发出的光信号进行准直、全反射、再汇聚后通过光纤接口以及与光纤接口连接的光纤6传输出去，完成光引擎的信号发射操作。
光引擎进行信号接收操作时，包括以下步骤：
S1、光信号通过光纤6进入与光纤连接的光纤接口；
S2、光信号从光纤接口出来后进入阵列透镜模组5；
S3、阵列透镜模组5对光信号进行准直、全反射、再汇聚后将光信号送入光电二极管芯片8；
S4、外部电源通过模塑互连器件2表面的供电电路和陶瓷基板3表面的连接电路为互阻放大器芯片7供电；
S5、光电二极管芯片8将光信号转换成电信号后传输到互阻放大器芯片7，互阻放大器芯片7通过模塑互连器件2表面的供电电路和陶瓷基板3表面的连接电路将电信号传递给外部电路，完成光引擎的信号接收操作。
本发明中光引擎将用于光信号发送和接收的器件集成在一起，能够实现光 引擎的标准化，简化设计，满足不同的应用需求；使用时，直接将本申请光引擎与外部电路连接即可实现光信号的发射、接收工作，有效缩短了光引擎的开发时间，降低了研发成本。另一方面，本发明中的光纤接口采用光纤阵列形式的光纤接口，能够提高电互联和光互联的密度，从而能够整体提升带宽能力和通信能力，有效提高了光引擎的工作效率。

Claims (10)

  1. 一种集成封装的光引擎，其特征在于：所述光引擎包括模塑互连器件、陶瓷基板、激光芯片、光电二极管芯片、光驱动芯片、互阻放大器芯片、阵列透镜模组、光纤接口，模塑互连器件固定连接在PCB板上，模塑互连器件内嵌接有陶瓷基板，陶瓷基板上设置有激光芯片、光电二极管芯片、光驱动芯片、互阻放大器芯片、阵列透镜模组、光纤接口；所述模塑互连器件表面设置有供电电路和信号电路，陶瓷基板表面设置有连接电路，光驱动芯片的金属引脚、互阻放大器芯片的金属引脚分别与陶瓷基板表面的连接电路连接；激光芯片与光驱动芯片电性连接，光电二极管与互阻放大器芯片电性连接，光驱动芯片的金属引脚、陶瓷基板表面的连接电路均与模塑互连器件表面的供电电路、信号电路连接。
  2. 如权利要求1所述的集成封装的光引擎，其特征在于：所述光纤接口采用光纤阵列形式的光纤接口，其用于连接单模光纤、多模光纤或塑料光纤。
  3. 如权利要求1所述的集成封装的光引擎，其特征在于：所述阵列透镜模组上集成有光纤阵列。
  4. 如权利要求1所述的集成封装的光引擎，其特征在于：所述阵列透镜模组和光纤接口均可以双向传输光信号。
  5. 如权利要求1所述的集成封装的光引擎，其特征在于：模塑互连器件上设置有两个高精度的孔洞。
  6. 如权利要求5所述的集成封装的光引擎，其特征在于：所述阵列透镜模组上设置有两个高精度的PIN柱。
  7. 如权利要求6所述的集成封装的光引擎，其特征在于：所述阵列透镜模组的两个高精度PIN柱与模塑互连器件的两个孔洞相对应。
  8. 如权利要求6所述的集成封装的光引擎，其特征在于：所述阵列透镜 模组包括透镜本体，透镜本体上设置有一个45度的反射面，透镜本体侧面并排设置有若干个光纤接口，每个光纤接口内设置有第一透镜，透镜本体底端并排设置有第二透镜，第一透镜与第二透镜相互对应且从第一透镜进入的光信号经过反射面反射后从第二透镜射出。
  9. 一种光引擎的信号发射方法，所述光引擎为权利要求1所述的光引擎，其特征在于：包括以下步骤：
    S1、外部电源通过模塑互连器件表面的供电电路和陶瓷基板表面的连接电路为光驱动芯片供电；
    S2、外部信号通过模塑互连器件表面的信号电路和陶瓷基板表面的连接电路将信号传递给光驱动芯片，光驱动芯片驱动激光芯片发出光信号；
    S3、阵列透镜模组对激光芯片发出的光信号进行准直、全反射、再汇聚后通过光纤接口以及与光纤接口连接的光纤传输出去，完成光引擎的信号发射操作。
  10. 一种光引擎的信号接收方法，所述光引擎为权利要求1所述的光引擎，其特征在于：包括以下步骤：
    S1、光信号通过光纤进入与光纤连接的光纤接口；
    S2、光信号从光纤接口出来后进入阵列透镜模组；
    S3、阵列透镜模组对光信号进行准直、全反射、再汇聚后将光信号送入光电二极管芯片；
    S4、外部电源通过模塑互连器件表面的供电电路和陶瓷基板表面的连接电路为互阻放大器芯片供电；
    S5、光电二极管芯片将光信号转换成电信号后传输到互阻放大器芯片，互阻放大器芯片通过模塑互连器件表面的供电电路和陶瓷基板表面的连接电路 将电信号传递给外部电路，完成光引擎的信号接收操作。
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