WO2021042628A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2021042628A1
WO2021042628A1 PCT/CN2019/126661 CN2019126661W WO2021042628A1 WO 2021042628 A1 WO2021042628 A1 WO 2021042628A1 CN 2019126661 W CN2019126661 W CN 2019126661W WO 2021042628 A1 WO2021042628 A1 WO 2021042628A1
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WO
WIPO (PCT)
Prior art keywords
light
layer
emitting
filter
display panel
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PCT/CN2019/126661
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English (en)
French (fr)
Inventor
李远航
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武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/645,504 priority Critical patent/US20210408139A1/en
Publication of WO2021042628A1 publication Critical patent/WO2021042628A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • This application relates to the field of electronic display, and in particular to a display panel and a manufacturing method thereof.
  • the touch structure is usually directly integrated above the display panel through DOT (direct on touch) technology.
  • DOT direct on touch
  • the DOT structure is lighter and thinner and has higher transmittance, and can be applied to a flexible display panel.
  • the DOT structure is integrated above the polarizing layer of the display panel.
  • the polarizing layer is composed of a polarizer and is used to reduce the reflectivity of the display panel under strong light.
  • the thickness of the polarizer is about 100 microns, which is not conducive to the thinning of the display panel.
  • the polarizer severely reduces the light output rate of the display panel, which affects the display effect of the display panel and accelerates the aging of the display panel.
  • the present application provides a display panel and a manufacturing method thereof to increase the light transmittance of the display panel and reduce the thickness of the display panel at the same time.
  • the present application provides a display panel including a light-emitting layer and a touch layer located above the light-emitting layer;
  • the light-emitting layer includes a plurality of light-emitting units
  • the touch control layer includes:
  • a touch wiring layer includes a plurality of gaps, and the plurality of gaps are arranged corresponding to the plurality of light-emitting units;
  • a filter structure the filter structure includes a plurality of filters, the plurality of filters are arranged in a plurality of gaps of the touch wiring layer, the plurality of filters and the plurality of Corresponding to the light-emitting unit, the projection of each filter on the light-emitting layer covers the light-emitting unit corresponding to the filter;
  • the touch wiring layer includes a first metal layer, a light-shielding layer, and a second metal layer, the light-shielding layer covers the first metal layer, and the second metal layer is located on the light-shielding layer and passes through The through hole is electrically connected to the first metal layer.
  • the display panel further includes an isolation layer, the isolation layer is located between the light-emitting layer and the touch layer, and the first metal layer is disposed on the isolation layer.
  • the plurality of filters correspond to the plurality of light-emitting units, and the color of light retained by any one filter is the same as the color of light emitted by the light-emitting unit corresponding to the filter ,
  • the edge of any filter covers the edge of the light shielding layer adjacent to the filter.
  • the sum of the areas of the plurality of gaps is greater than the sum of the areas of the plurality of light-emitting units.
  • the touch control wiring layer further includes a planarization layer covering the light shielding layer and the filter structure, and the second metal layer is located on the planarization layer And electrically connected to the first metal layer through the via pattern.
  • the present application also provides a method for manufacturing a display panel with light transmittance, and the method includes the following steps:
  • the touch wiring layer Forming a touch wiring layer above the light-emitting layer, the touch wiring layer including a plurality of gaps, and the plurality of gaps are arranged corresponding to the plurality of light-emitting units;
  • a filter structure is formed, the filter structure includes a plurality of filters, the plurality of filters are arranged in a plurality of gaps of the touch wiring layer, and the plurality of filters are connected to the plurality of filters. Corresponding to each light-emitting unit, and the projection of each filter on the light-emitting layer covers the light-emitting unit corresponding to the filter;
  • the method for forming the touch wiring layer includes the following steps:
  • a second metal layer is formed, and the second metal layer is located on the light shielding layer and is electrically connected to the first metal layer through the through hole.
  • An isolation layer is formed, and the isolation layer is located on the light-emitting layer.
  • the method of forming the first metal layer and the light shielding layer includes:
  • the metal thin film is patterned to form the first metal layer.
  • the plurality of filters correspond to the plurality of light-emitting units, and the color of light retained by any one filter is the same as the color of light emitted by the light-emitting unit corresponding to the filter ,
  • the edge of any filter covers the edge of the light shielding layer adjacent to the filter.
  • the following steps are further included:
  • a planarization layer is formed, and the planarization layer covers the light shielding layer and the filter structure.
  • This application uses a filter integrated in the touch structure to replace the polarizer in the prior art, which effectively reduces the thickness of the display panel.
  • the light transmittance of the filter is much higher than that of the polarizer.
  • This application effectively improves the light transmittance of the display panel, and enhances the display effect and the service life of the display panel.
  • the black shading matrix between the filters is used as a mask to pattern the metal layer in the touch structure, which reduces the mask used for patterning the metal layer, which simplifies the production process and saves production. cost.
  • FIG. 1 is a schematic structural diagram of a display panel in a specific embodiment of the application
  • FIG. 2 is a top view of the display panel in FIG. 1;
  • FIG. 3 is a partial enlarged view of the display panel in FIG. 1.
  • the present application provides a display panel and a manufacturing method thereof to increase the light transmittance of the display panel and reduce the thickness of the display panel at the same time.
  • FIG. 1 is a schematic structural diagram of a display panel in a specific embodiment of the application
  • FIG. 2 is a top view of the display panel in FIG. 1
  • FIG. 3 is a partial enlarged view of the display panel in FIG. .
  • the display panel includes a substrate 10, a thin film transistor layer 20, a light-emitting layer 30, and a touch layer located above the light-emitting layer 30.
  • the display panel further includes an isolation layer 40, and the isolation layer 40 is located between the light-emitting layer 30 and the touch layer.
  • the light-emitting layer 30 includes a plurality of light-emitting units.
  • the plurality of light emitting units includes a red light emitting unit 31, a blue light emitting unit 32, and a green light emitting unit 33.
  • the plurality of light-emitting units are isolated by a pixel definition layer.
  • the touch control layer includes a touch control wiring layer 60 and a filter structure 50.
  • the touch wiring layer 60 includes a plurality of gaps, and the plurality of gaps are arranged corresponding to the plurality of light-emitting units.
  • the filter structure 50 includes a plurality of filters, and the plurality of filters are arranged in a plurality of gaps of the touch wiring layer 60.
  • the touch wiring layer 60 includes a first metal layer 61, a light-shielding layer 62, and a second metal layer 63.
  • the light-shielding layer 62 covers the first metal layer 61, and the second metal layer 63 is located on the light-shielding layer.
  • the plurality of filters correspond to the plurality of light-emitting units, and the color of light retained by any one filter is the same as the color of light emitted by the light-emitting unit corresponding to the filter.
  • the filter provided corresponding to the red light-emitting unit 31 is a red light filter 51
  • the filter provided corresponding to the blue light-emitting unit 32 is a blue filter 52
  • the filter set corresponding to 33 is the green filter 53.
  • the touch wiring layer 60 further includes a planarization layer 70, the planarization layer 70 covers the light shielding layer 62 and the filter structure 50, and the second metal layer 63 is located on the planarization layer.
  • the first metal layer 61 is electrically connected to the first metal layer 61 through the via pattern.
  • the light shielding layer 62 covers the first metal layer 61.
  • the plurality of gaps are used for arranging a plurality of optical filters.
  • the projection of each gap on the light-emitting layer covers the light-emitting unit corresponding to the gap, and the area of each gap is larger than the area of the light-emitting unit corresponding to the gap. This arrangement can ensure that the light emitted by the light-emitting unit completely enters the filter and avoid light loss.
  • the edge of any one filter covers the light-shielding layer 62 adjacent to the filter.
  • a "horn"-shaped structure is formed to avoid light leakage gaps between the filter and the light shielding layer 62.
  • the edge of the red light filter 51 covers the edge of the light shielding layer 62 adjacent thereto, so that the red light filter 51 and the light shielding layer 62 are closely attached to each other. , Eliminates possible light leakage gaps.
  • FIG. 2 is a top view of the display panel in FIG. 1.
  • the light shielding layer 54 serves as a black matrix, and a plurality of filters form a filter structure, which can eliminate the contrast of the display panel under strong light. The reflection, instead of polarizer.
  • the filter structure is integrated in the touch layer 40, and the light shielding layer 54 can be used as a mask to pattern the touch wiring layer. This design effectively reduces the thickness of the display panel on the one hand, and reduces the mask used for patterning the metal layer on the other hand, which simplifies the manufacturing process and saves the manufacturing cost.
  • the edge of any filter covers the edge of the light shielding layer 54 adjacent to the filter, as shown in FIGS. 1 and 3.
  • the area of the light-shielding layer 54 is larger than the area of the second metal layer 43, and the light-shielding layer 54 is in the light-emitting layer 30.
  • the projection above covers the projection of the second metal layer 43 on the light-emitting layer 30.
  • the present application also provides a method for manufacturing a display panel with light transmittance.
  • the method includes the following steps.
  • the light-emitting layer 30 is formed.
  • the light-emitting layer 30 includes a plurality of light-emitting units.
  • the plurality of light emitting units includes a red light emitting unit 31, a blue light emitting unit 32, and a green light emitting unit 33.
  • the plurality of light-emitting units are isolated by a pixel definition layer.
  • a touch wiring layer 60 and a filter structure 50 are formed above the light-emitting layer 30.
  • the touch wiring layer 60 includes a plurality of gaps, and the plurality of gaps are arranged corresponding to the plurality of light-emitting units.
  • the filter structure 50 includes a plurality of filters, and the plurality of filters are arranged in a plurality of gaps of the touch wiring layer 60.
  • the plurality of filters correspond to the plurality of light-emitting units, and the color of light retained by any one filter is the same as the color of light emitted by the light-emitting unit corresponding to the filter.
  • the filter provided corresponding to the red light-emitting unit 31 is a red light filter 51
  • the filter provided corresponding to the blue light-emitting unit 32 is a blue filter 52
  • the filter set corresponding to 33 is the green filter 53.
  • planarization layer 70 is formed, and the planarization layer 70 covers the light shielding layer 62 and the filter structure 50.
  • the following steps are further included: forming an isolation layer 40, the isolation layer 40 being located on the light-emitting layer 30.
  • the isolation layer 40 is used to protect the packaging structure on the surface of the light-emitting layer 30 to prevent subsequent processes from damaging the packaging film and damaging the sealing structure of the light-emitting layer 30.
  • the method for forming the touch wiring layer 60 includes the following steps: forming a first metal layer 61.
  • a light-shielding layer 62 is formed, and the light-shielding layer 62 covers the first metal layer 61.
  • a second metal layer 63 is formed.
  • the second metal layer 63 is located on the light shielding layer 62 and is electrically connected to the first metal layer 61 through a through hole.
  • the projections of the plurality of gaps on the light-emitting surface of the display panel and the projections of the first metal layer 61 and the second metal layer 63 on the light-emitting layer 30 do not overlap.
  • the method of forming the first metal layer 61 and the light shielding layer 62 includes: forming a metal thin film, the metal thin film covering the isolation layer. A black photoresist is formed, and the black photoresist covers the metal thin film. The black photoresist is patterned to form the light shielding layer 62. Using the black metal as a mask, the metal thin film is patterned to form the first metal layer 61.
  • the light shielding layer 62 is used as a black matrix, and a plurality of filters form a filter structure, which can eliminate the reflection of light on the display panel under strong light, instead of a polarizer.
  • the filter structure is integrated in the touch layer, and the light shielding layer 62 can be used as a mask to pattern the touch wiring layer.
  • the light shielding layer 62 covers the first metal layer 61.
  • the plurality of gaps are used for arranging a plurality of optical filters. Referring to FIG. 3, according to a preferred embodiment of the present application, in order to ensure that the multiple filters are located above the corresponding light emitting structure, that is, the edge of any filter covers the light shielding layer 62 adjacent to the filter. And the sum of the areas of the plurality of gaps is greater than the sum of the areas of the plurality of light-emitting units.
  • This application uses a filter integrated in the touch structure to replace the polarizer in the prior art, which effectively reduces the thickness of the display panel.
  • the light transmittance of the filter is much higher than that of the polarizer.
  • This application effectively improves the light transmittance of the display panel, and enhances the display effect and the service life of the display panel.
  • the black shading matrix between the filters is used as a mask to pattern the metal layer in the touch structure, which reduces the mask used for patterning the metal layer, which simplifies the production process and saves production. cost.

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Abstract

一种显示面板及其制作方法。所述显示面板包括发光层和位于所述发光层上方的触控层。所述发光层包括多个发光单元。所述触控层包括：触控走线层和滤光结构。所述滤光结构包括多个滤光片，所述多个滤光片设置在所述触控走线层的多个间隙中，所述多个滤光片与所述多个发光单元对应，每一个滤光片在所述发光层上的投影覆盖与该滤光片对应的发光单元。

Description

显示面板及其制作方法 技术领域
本申请涉及电子显示领域，尤其涉及一种显示面板及其制作方法。
 背景技术
为了减小具有触控功能的电子设备的厚度，现有技术中，通常通过DOT(direct on touch)技术将触控结构直接集成在显示面板上方。相比于外挂式的触控结构，DOT结构更加轻薄且透过率更高，且能够应用在柔性显示面板上。
 技术问题
现有技术中，DOT结构集成在显示面板的偏光层上方。偏光层由偏光片构成，用于降低强光下显示面板的反射率。通常，偏光片的厚度在100微米左右，不利于显示面板的轻薄化。同时，偏光片使得显示面板的出光率严重降低，影响了显示面板的显示效果，同时加速了显示面板的老化。
 技术解决方案
本申请提供了一种显示面板及其制作方法，以提高显示面板的透光率，同时减小显示面板的厚度。
本申请提供了一种显示面板，所述显示面板包括发光层和位于所述发光层上方的触控层；
其中，所述发光层包括多个发光单元；
其中，所述触控层包括：
触控走线层，所述触控走线层包括多个间隙，所述多个间隙与所述多个发光单元对应设置；
滤光结构，所述滤光结构包括多个滤光片，所述多个滤光片设置在所述触控走线层的多个间隙中，所述多个滤光片与所述多个发光单元对应，每一个滤光片在所述发光层上的投影覆盖与该滤光片对应的发光单元；
其中，所述触控走线层包括第一金属层、遮光层和第二金属层，所述遮光层覆盖所述第一金属层，所述第二金属层位于所述遮光层上，并通过通孔与所述第一金属层电连接。
根据本申请的其中一个方面，所述显示面板还包括隔离层，所述隔离层位于所述发光层和所述触控层之间，所述第一金属层设置在所述隔离层上。
根据本申请的其中一个方面，所述多个滤光片和所述多个发光单元对应，任意一个滤光片所保留的光线颜色和与所述滤光片对应的发光单元发出的光线颜色相同，任意一个滤光片的边缘覆盖于所述滤光片相邻的遮光层的边缘。
根据本申请的其中一个方面，所述多个间隙的面积之和大于所述多个发光单元的面积之和。
根据本申请的其中一个方面，所述触控走线层还包括平坦化层，所述平坦化层覆盖所述遮光层和所述滤光结构，所述第二金属层位于所述平坦化层上，并通过通孔图所述第一金属层电连接。
相应的，本申请还透光率一种显示面板的制作方法，该方法包括以下步骤：
形成发光层，所述发光层包括多个发光单元；
在所述发光层上方形成触控走线层，所述触控走线层包括多个间隙，所述多个间隙与所述多个发光单元对应设置；
形成滤光结构，所述滤光结构包括多个滤光片，所述多个滤光片设置在所述触控走线层的多个间隙中，所述多个滤光片与所述多个发光单元对应，每一个滤光片在所述发光层上的投影覆盖与该滤光片对应的发光单元；
其中，形成所述触控走线层的方法包括以下步骤：
形成第一金属层；
形成遮光层，所述遮光层覆盖所述第一金属层；
形成第二金属层，所述第二金属层位于所述遮光层上，并通过通孔与所述第一金属层电连接。
根据本申请的其中一个方面，形成发光层之后还包括以下步骤：
形成隔离层，所述隔离层位于所述发光层上。
根据本申请的其中一个方面，形成所述第一金属层和所述遮光层的方法包括：
形成金属薄膜，所述金属薄膜覆盖所述隔离层；
形成黑色光阻，所述黑色光阻覆盖所述金属薄膜；
图形化所述黑色光阻，形成所述遮光层；
以所述黑色金属为掩膜，将所述金属薄膜图形化，形成所述第一金属层。
根据本申请的其中一个方面，所述多个滤光片和所述多个发光单元对应，任意一个滤光片所保留的光线颜色和与所述滤光片对应的发光单元发出的光线颜色相同，任意一个滤光片的边缘覆盖于所述滤光片相邻的遮光层的边缘。
根据本申请的其中一个方面，形成所述遮光层之后还包括以下步骤：
形成平坦化层，所述平坦化层覆盖所述遮光层和所述滤光结构。
 有益效果
本申请采用集成在触控结构中的滤光片代替现有技术中的偏光片，有效的减小了显示面板的厚度，同时由于滤光片对光线的透过率远高于偏光片对光线的透过率，本申请有效的提高了显示面板的透光率，增强了显示效果和显示面板的使用寿命。同时，采用滤光片之间的黑色遮光矩阵作为掩膜版将触控结构中的金属层图形化，减少了用于图形化金属层的掩膜版，在简化了制作工艺的同时节约了制作成本。
 附图说明
图1为本申请的一个具体实施例中的显示面板的结构示意图；
图2为图1中的显示面板的俯视图；
图3为图1中的显示面板的局部放大图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请提供了一种显示面板及其制作方法，以提高显示面板的透光率，同时减小显示面板的厚度。
参见图1至图3，图1为本申请的一个具体实施例中的显示面板的结构示意图，图2为图1中的显示面板的俯视图，图3为图1中的显示面板的局部放大图。所述显示面板包括基板10、薄膜晶体管层20、发光层30、和位于所述发光层30上方的触控层。本实施例中，所述显示面板还包括隔离层40，所述隔离层40位于所述发光层30和所述触控层之间。
所述发光层30包括多个发光单元。所述多个发光单元包括红色发光单元31、蓝色发光单元32和绿色发光单元33。所述多个发光单元被像素定义层隔离。
本申请中，所述触控层包括触控走线层60和滤光结构50。
所述触控走线层60包括多个间隙，所述多个间隙与所述多个发光单元对应设置。所述滤光结构50包括多个滤光片，所述多个滤光片设置在所述触控走线层60的多个间隙中。所述触控走线层60包括第一金属层61、遮光层62和第二金属层63，所述遮光层62覆盖所述第一金属层61，所述第二金属层63位于所述遮光层62上，并通过通孔与所述第一金属层61电连接。其中，所述多个间隙在所述显示面板的出光面上的投影与所述第一金属层61和第二金属层63在所述发光层30上的投影不重叠。
所述多个滤光片和所述多个发光单元对应，任意一个滤光片所保留的光线颜色和与所述滤光片对应的发光单元发出的光线颜色相同。例如，本实施例中，与红色发光单元31对应设置的滤光片为红光滤光片51，与蓝色发光单元32对应设置的滤光片为蓝色滤光片52，与绿色发光单元33对应设置的滤光片为绿色滤光片53。
本申请中，所述触控走线层60还包括平坦化层70，所述平坦化层70覆盖所述遮光层62和所述滤光结构50，所述第二金属层63位于所述平坦化层70上，并通过通孔图所述第一金属层61电连接。
本申请中，所述遮光层62覆盖所述第一金属层61。所述多个间隙用于设置多个滤光片。本实施例中，每一个间隙在所述发光层上的投影覆盖与该间隙对应的发光单元，且每一个间隙的面积大于与该间隙对应的发光单元的面积。这样设置能够确保所发光单元发出的光线完全进入滤光片中，避免光线损失。
参见图3，根据本申请的一个优选实施例，为了保证所述多个滤光片位于对应的发光结构上方，任意一个滤光片的边缘覆盖于所述滤光片相邻的遮光层62的边缘，形成“牛角”形结构，避免滤光片和遮光层62之间产生漏光缝隙。图3中，以红光滤光片51为例，所述红光滤光片51的边缘覆盖与之相邻的遮光层62的边缘，使得红光滤光片51与遮光层62紧密贴合，消除了可能产生的漏光缝隙。
参见图2，图2为图1中的显示面板的俯视图，本申请中，所述遮光层54作为黑色矩阵，和多个滤光片构成滤光结构，能够消除强光下显示面板的对光线的反射，代替偏光片。同时，所述滤光结构集成在所述触控层40中，所述遮光层54能够作为掩膜版将所述触控走线层图形化。这样设计一方面有效的减小了显示面板的厚度，另一方面减少了用于图形化金属层的掩膜版，在简化了制作工艺的同时节约了制作成本。
同样的，为了保证滤光结构的滤光效果，任意一个滤光片的边缘覆盖于所述滤光片相邻的遮光层54的边缘，如图1和图3所示。
本实施例中，为了消除所述遮光层54侧边对光线的反射作用，所述遮光层54的面积大于所述第二金属层43的面积，且所述遮光层54在所述发光层30上的投影覆盖所述第二金属层43在所述发光层30上的投影。
相应的，本申请还透光率一种显示面板的制作方法，该方法包括以下步骤。
首先，形成发光层30。本实施例中，所述发光层30包括多个发光单元。所述多个发光单元包括红色发光单元31、蓝色发光单元32和绿色发光单元33。所述多个发光单元被像素定义层隔离。
之后，在所述发光层30上方形成触控走线层60和滤光结构50，所述触控走线层60包括多个间隙，所述多个间隙与所述多个发光单元对应设置。所述滤光结构50包括多个滤光片，所述多个滤光片设置在所述触控走线层60的多个间隙中。所述多个滤光片和所述多个发光单元对应，任意一个滤光片所保留的光线颜色和与所述滤光片对应的发光单元发出的光线颜色相同。例如，本实施例中，与红色发光单元31对应设置的滤光片为红光滤光片51，与蓝色发光单元32对应设置的滤光片为蓝色滤光片52，与绿色发光单元33对应设置的滤光片为绿色滤光片53。
最后，形成平坦化层70，所述平坦化层70覆盖所述遮光层62和所述滤光结构50。
本申请中，形成发光层30之后还包括以下步骤：形成隔离层40，所述隔离层40位于所述发光层30上。所述隔离层40用于保护所述发光层30表面的封装结构，避免后续工艺损坏封装薄膜，破坏发光层30的密封结构。
本申请中，形成所述触控走线层60的方法包括以下步骤：形成第一金属层61。形成遮光层62，所述遮光层62覆盖所述第一金属层61。形成第二金属层63，所述第二金属层63位于所述遮光层62上，并通过通孔与所述第一金属层61电连接。所述多个间隙在所述显示面板的出光面上的投影与所述第一金属层61和第二金属层63在所述发光层30上的投影不重叠。
本申请中，形成所述第一金属层61和所述遮光层62的方法包括：形成金属薄膜，所述金属薄膜覆盖所述隔离层。形成黑色光阻，所述黑色光阻覆盖所述金属薄膜。图形化所述黑色光阻，形成所述遮光层62。以所述黑色金属为掩膜，将所述金属薄膜图形化，形成所述第一金属层61。
本申请中，所述遮光层62作为黑色矩阵，和多个滤光片构成滤光结构，能够消除强光下显示面板的对光线的反射，代替偏光片。同时，所述滤光结构集成在所述触控层中，所述遮光层62能够作为掩膜版将所述触控走线层图形化。这样设计一方面有效的减小了显示面板的厚度，另一方面减少了用于图形化金属层的掩膜版，在简化了制作工艺的同时节约了制作成本。
本申请中，所述遮光层62覆盖所述第一金属层61。所述多个间隙用于设置多个滤光片。参见图3，根据本申请的一个优选实施例，为了保证所述多个滤光片位于对应的发光结构上方，即任意一个滤光片的边缘覆盖于所述滤光片相邻的遮光层62的边缘，且所述多个间隙的面积之和大于所述多个发光单元的面积之和。
本申请采用集成在触控结构中的滤光片代替现有技术中的偏光片，有效的减小了显示面板的厚度，同时由于滤光片对光线的透过率远高于偏光片对光线的透过率，本申请有效的提高了显示面板的透光率，增强了显示效果和显示面板的使用寿命。同时，采用滤光片之间的黑色遮光矩阵作为掩膜版将触控结构中的金属层图形化，减少了用于图形化金属层的掩膜版，在简化了制作工艺的同时节约了制作成本。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (10)

  1. 一种显示面板，其中，所述显示面板包括发光层和位于所述发光层上方的触控层；
    其中，所述发光层包括多个发光单元；
    其中，所述触控层包括：
    触控走线层，所述触控走线层包括多个间隙，所述多个间隙与所述多个发光单元对应设置；
    滤光结构，所述滤光结构包括多个滤光片，所述多个滤光片设置在所述触控走线层的多个间隙中，所述多个滤光片与所述多个发光单元对应，每一个滤光片在所述发光层上的投影覆盖与该滤光片对应的发光单元；
    其中，所述触控走线层包括第一金属层、遮光层和第二金属层，所述遮光层覆盖所述第一金属层，所述第二金属层位于所述遮光层上，并通过通孔与所述第一金属层电连接。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板还包括隔离层，所述隔离层位于所述发光层和所述触控层之间，所述第一金属层设置在所述隔离层上。
  3. 根据权利要求1所述的显示面板，其中，任意一个滤光片所保留的光线颜色和与所述滤光片对应的发光单元发出的光线颜色相同，任意一个滤光片的边缘覆盖于所述滤光片相邻的遮光层的边缘。
  4. 根据权利要求3所述的显示面板，其中，所述多个间隙的面积之和大于所述多个发光单元的面积之和。
  5. 根据权利要求3所述的显示面板，其中，所述触控走线层还包括平坦化层，所述平坦化层覆盖所述遮光层和所述滤光结构，所述第二金属层位于所述平坦化层上，并通过通孔与所述第一金属层电连接。
  6. 一种显示面板的制作方法，其中，该方法包括以下步骤：
    形成发光层，所述发光层包括多个发光单元；
    在所述发光层上方形成触控走线层，所述触控走线层包括多个间隙，所述多个间隙与所述多个发光单元对应设置；
    形成滤光结构，所述滤光结构包括多个滤光片，所述多个滤光片设置在所述触控走线层的多个间隙中，所述多个滤光片与所述多个发光单元对应，每一个滤光片在所述发光层上的投影覆盖与该滤光片对应的发光单元；
    其中，形成所述触控走线层的方法包括以下步骤：
    形成第一金属层；
    形成遮光层，所述遮光层覆盖所述第一金属层；
    形成第二金属层，所述第二金属层位于所述遮光层上，并通过通孔与所述第一金属层电连接。
  7. 根据权利要求6所述的显示面板的制作方法，其中，形成发光层之后还包括以下步骤：
    形成隔离层，所述隔离层位于所述发光层上。
  8. 根据权利要求7所述的显示面板的制作方法，其中，形成所述第一金属层和所述遮光层的方法包括：
    形成金属薄膜，所述金属薄膜覆盖所述隔离层；
    形成黑色光阻，所述黑色光阻覆盖所述金属薄膜；
    图形化所述黑色光阻，形成所述遮光层；
    以所述黑色光阻为掩膜，将所述金属薄膜图形化，形成所述第一金属层。
  9. 根据权利要求7所述的显示面板的制作方法，其中，所述多个滤光片和所述多个发光单元对应，任意一个滤光片所保留的光线颜色和与所述滤光片对应的发光单元发出的光线颜色相同，任意一个滤光片的边缘覆盖于所述滤光片相邻的遮光层的边缘。
  10. 根据权利要求7所述的显示面板的制作方法，其中，形成所述遮光层之后还包括以下步骤：
    形成平坦化层，所述平坦化层覆盖所述遮光层和所述滤光结构。
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