WO2021040375A1 - 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터 - Google Patents
전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터 Download PDFInfo
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- WO2021040375A1 WO2021040375A1 PCT/KR2020/011309 KR2020011309W WO2021040375A1 WO 2021040375 A1 WO2021040375 A1 WO 2021040375A1 KR 2020011309 W KR2020011309 W KR 2020011309W WO 2021040375 A1 WO2021040375 A1 WO 2021040375A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/728—Coupling devices without an insulating housing provided on the edge of the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/732—Printed circuits being in the same plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6477—Impedance matching by variation of dielectric properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
Definitions
- the present invention relates to a communication connector, and in detail, a board to board connector for high-speed data communication at a level of 10 to 25 GHz.
- a shielding structure between a finger structure of a PCB structure and a signal line of a receptacle structure of a dielectric filling structure is provided.
- the present invention relates to a connector for high-speed communication capable of improving transmission quality and controlling characteristics to facilitate impedance matching through a dielectric and signal line structure while reducing signal interference through a dielectric material and a signal line structure.
- each line gradually becomes an antenna and radiates a large amount of electromagnetic energy, and the reaction coupling phenomenon between the lines in the RF circuit greatly affects the communication performance. .
- the interference of the line-to-line signal has a large effect on the communication quality, and particularly, when a large number of signals are transmitted in parallel, the effect is more pronounced.
- serial communication serial communication
- the serial communication method which has good signal transmission characteristics and allows long-distance transmission, is used, but the hassle of converting parallel signals to serial signals and transmitting the opposite and using additional parts.
- the etc. are required.
- impedance matching of serial communication is difficult, and the use is gradually decreasing.
- High-speed signal transmission is sometimes performed by using optical communication using light for high-speed communication and supplementing the problems of the existing serial communication.
- optical communication has a problem that the size of the basic parts used is large and the price is very expensive. In the case of possible wave guides, it is not only difficult to manufacture, but also very expensive.
- the present invention was created to solve the above problems, and an object of the present invention is to improve communication efficiency through easy impedance matching while suppressing interference between signal lines in board-to-board high-speed data communication using a connector. It is to provide a connector for high-speed communication that can improve transmission quality and control characteristics.
- the present invention is a board-to-board connector for high-speed data communication, and is formed on the edge of the PCB board so that the positive and negative terminals are symmetrical on one side and the other side, respectively.
- a finger structure formed in a plurality of spaced apart from each other, wherein a shield structure made of a conductor material is disposed between the positive and negative terminals and the inside of the PCB plate at a predetermined distance between the positive and negative terminals, respectively;
- a plurality of positive and negative pins provided with an opening on one side and enclosing one side of the finger structure and the other side of the finger structure, and a plurality of positive and negative pins that are energized by contacting each of the positive and negative terminals, and between the positive and negative pins
- the dielectrics are Teflon, polyethylene, resin, Gutta-Percha, Lucite, Paraffin, Styrofoam, Vaseline, and ceramic. It is preferable to select a dielectric material such as, and it is also preferable to use a combination of two to three kinds of the dielectrics, and when the frequency is changed, an appropriate dielectric or dielectric combination can be selected in consideration of the frequency to be used.
- the positive and negative pins are each composed of a contact portion in contact with the positive terminal and the negative terminal, a straight section formed so as to form a parallel space, and an exposed portion each bent in a set direction so as to be exposed to the outside of the dielectric. desirable.
- the positive and negative pins each have a curved portion that is bent in a set direction, but an additional curved portion is formed in the curved portion of the pin that is bent from the inside among the positive and negative pins, so that the length of the positive and negative pins is It is desirable to configure the same.
- the curvature of the curved portion maintains a radius less than twice the width of the positive pin or the negative pin.
- the present invention it is possible to reduce signal interference through a shielding (shield) structure between signal lines during high-speed communication using a connector, and obtain an effect of improving impedance matching and transmission efficiency through a dielectric having a low dielectric constant.
- the type and amount of dielectrics may be selectively adjusted for impedance adjustment.
- FIG. 1 is a perspective view showing a state of a finger structure according to an embodiment of the present invention
- FIG. 2 is a front cross-sectional view showing a state of a finger structure according to an embodiment of the present invention
- FIG. 3 is a perspective view showing a state of a receptacle structure according to an embodiment of the present invention
- FIG. 4 is a side cross-sectional view showing a state of a receptacle structure according to an embodiment of the present invention
- FIG 5 and 6 are perspective views showing before and after coupling of a finger structure and a differential pin-side structure according to an embodiment of the present invention.
- the present invention is a board to board connector for high-speed data communication of 5 GHz or more (10 to 25 GHz), and such a connector includes a receptacle structure (2) that receives a pin and a finger structure (1) that is a side to insert the pin. ) Both sides are referred to at once.
- FIG. 1 is a perspective view showing a state of a finger structure according to an embodiment of the present invention
- Figure 2 is a front cross-sectional view showing the state of the finger structure according to the embodiment of the present invention
- the finger structure 1 has a PCB structure.
- the positive terminal 11 and the negative terminal 12 are symmetrically formed on one side and the other side, respectively, and are formed in plural at intervals.
- a PCB board has a plurality of layers (layers)
- terminals are formed on one side and the other side constituting the outermost side, respectively, on the upper side and the lower side as shown in the drawing.
- the positive terminal 11 on the upper side and the negative terminal 12 on the lower side are shown respectively, but it is obvious that the position may be changed as necessary.
- the positive terminal 11 and the negative terminal 12 are provided in plural, and the number can be appropriately adjusted in response to communication characteristics, but it is preferable to provide at least five pairs for smooth high-speed communication.
- the positive terminal 11 and the negative terminal 12 provided in such a manner are arranged at intervals set in the lateral direction along the surface of the PCB plate 3, preferably at the same interval, and between the positive terminals 11 And a shield structure 13 made of a conductive material formed between the cathode terminals 12 and the inside of the PCB plate 3 at a predetermined distance from the anode terminal 11 and the cathode terminal 12, respectively.
- the shield structure 13 is formed with a gap between the plurality of anode terminals 11 and the cathode terminals 12, respectively, and the shield structure 13 is formed between the anode and cathode terminals 11 and 12 as well. As a result, signal interference between each terminal and attenuation due to signal transmission can be greatly reduced.
- the gap between each terminal and the shield structure may be 0.2 mm, and the thickness of the shield structure 13 may be set to 0.2 mm. It is not limited and can be adjusted according to communication characteristics.
- the PCB board structure with 10 layers is used as an example.
- Layers 1 and 10 have positive and negative terminals, respectively, and layers 2 and 9 are each. It can be understood that it is formed in a symmetrical shape on the shield structure of the same shape, and the rest becomes a known intermediate layer constituting the PCB board.
- the height of each terminal and the shield structure 13 therebetween may be configured to have the same surface in consideration of coupling with the receptacle structure 2 to be described later.
- the shield structure 13 of the finger structure 1 can be easily fabricated using the same method as the PCB fabrication, and several intermediate layers constituting the PCB in the multilayered board can be widely configured as a shield structure. have.
- the finger structure of the existing connector basically does not have a signal separation function, but in the present invention, the shield structure 13 serving as a ground is applied to a plurality of layers of the substrate constituting the finger structure 1 to greatly increase the signal separation effect. It can be improved, and the individual connection structure of the conductor wire used in the existing high-frequency connector is difficult to manufacture because the shape of the pin on the finger side becomes complicated, and the manufacturing time is lengthened, but the present invention makes the manufacture of the finger structure 1 very easy and at a low price. It is possible to manufacture.
- Figure 3 is a perspective view showing a state of the receptacle structure according to an embodiment of the present invention
- Figure 4 is a side cross-sectional view showing the state of the receptacle structure according to the embodiment of the present invention
- Figures 5 and 6 are fingers according to the embodiment of the present invention
- the receptacle structure 2 has an opening 21 formed on one side to surround one side and the other side of the finger structure 1 and are combined Has.
- a plurality of positive pins 22 and negative pins 23 are provided inside the opening 21 to be energized by contacting the positive terminal 11 and the negative terminal 12 of the finger structure 1, respectively.
- the positive pin 22 and the negative pin 23 are formed in the same number and size at positions corresponding to the positive terminal 11 and the negative terminal 12, respectively, and between the positive pins 22 and A shield plate 24 made of a conductor material is inserted between the negative pins 23 at a predetermined distance, that is, at the same distance as the positive terminal 11 and the negative terminal 12 and the shield structure 13.
- the shield structure 13 and the shield plate 24 are configured to be in contact with each other at equal intervals.
- each shield structure (13) and the shield plate are well matched and connected, and the signal lines are electronically separated by connecting them to the reference potential to be grounded (grounded).
- the shield plate 24 has a'b' shape or a'c' shape so that it is formed in a shape that is spread between both the anode pin 22 and the cathode pin 23, and a material having good conductivity is used. do.
- the shield structure 13 and the shield plate 24 are made of a conductor material and serve as a ground, and by separating the electrodes and pins, which are signal transmission units, respectively, the interference between signal lines that are problematic in high-frequency signals is reduced, and the attenuation of signal transmission is greatly increased. It reduces and adjusts the characteristics of the connector.
- a dielectric 25 having a low dielectric constant is filled in the space between the anode pin 22 and the cathode pin 23 and the shield plate 24 except for the opening 21 to form the body of the receptacle structure 2 It is done.
- the dielectric 25 is a constituent of the receptacle structure 2 constituting the connector and serves to improve the transmission quality by adjusting the impedance, which is the main characteristic of the connector, and making it easy to match.
- the impedance matching In the low-frequency band, especially the MHz band, there is no big problem in signal transmission even if the impedance matching is not largely concerned. However, in the case of transmitting a high-frequency signal of several GHz or more, if the impedance is not matched, the reflected wave increases and the loss increases.
- the impedance fluctuates and changes according to the frequency band, and the conditions of impedance matching vary. Accordingly, it is very important to adjust the impedance for optimal transmission and impedance matching.
- the dielectric filling the receptacle structure 2 uses a dielectric having a low dielectric constant in consideration of a high frequency region of 10 GHz or more, and an adhesive or various methods are used for filling.
- the dielectric material 25 includes Teflon, polyethylene, resin, Gutta-Percha, Lucite, Paraffin, Styrofoam, and Vaseline.
- Vaseline it is preferable to use one of lamics, and also Teflon, polyethylene, resin, Gutta-Percha, Lucite, and Paraffin.
- Styrofoam, Vaseline, and ceramics it is also desirable to use a combination of 2 to 3 types, and when the frequency is changed, an appropriate dielectric or dielectric combination can be selected in consideration of the frequency used.
- the structure of the receptacle is configured as an empty space, and thus, it is difficult to match the impedance change according to the frequency band.
- the space between the positive pin 22 and the negative pin 23 and the shield plate 24 is filled with a low dielectric constant material to implement a low dielectric constant state and adjust the impedance.
- a dielectric can be filled for each pair of the positive pin 22 and the negative pin 23, which are differential lines of the receptacle structure 2, and each differential line is separated by a shield plate 24 between them. Therefore, impedance matching is possible by applying dielectrics for different frequencies or different conditions for each differential line if necessary in the method of attaching them through adhesives, and dielectrics for impedance matching can be easily applied even for single lines other than differential lines. I can.
- length matching may be achieved even in a right angle type connector.
- the positive pin 22 and the negative pin 23 of the receptacle structure 2 are parallel to each other so that the finger structure 1 is inserted therebetween, and the positive terminal 11 and the negative terminal 12, respectively.
- the positive pin 22 and the negative pin 23 are spaced apart from each other after a control part that has contact portions 221 and 231 in contact with each other, and adjusts the mutual spacing between the positive pin 22 and the negative pin 23 properly. It is composed of straight sections 222 and 232 formed in parallel, and exposed portions 223 and 233 that are bent in a set direction and exposed to the outside of the dielectric 25 to transmit signals to other boards.
- the angle of bending the positive pin 22 and the negative pin 23 toward the exposed portions 223 and 233 is not limited, but the angle of bending downward by 90 degrees corresponding to the shape of a conventional right angle type connector
- the shape is presented as an example.
- the positive pin 22 and the negative pin 23 are each provided with curved portions 224 and 234 that are bent downward by 90 degrees in a set direction, that is, in this case, compared to the positive pin 22 located on the upper side.
- the length of the cathode pin 23 located on the lower side is shortened, so that a difference in skew occurs according to the length.
- an additional curved portion 235 is formed in the curved portion of the positive pin 22 and the negative pin 23, which is bent from the inside, and as a reference of the drawing, the positive pin 22 ) And the negative pin 23 are configured to have the same length, so that matching according to the length is made, and in this case, the curve of the curved portion 235 is equal to the width of the positive pin 22 or the negative pin 23 for smooth matching. It is desirable to configure it to maintain a radius less than 2 times.
- connection between the receptacle structure 2 and the finger structure 1 is a structure in which the connection of the receptacle structure 2 and the finger structure 1 naturally continues to be combined, so that the safety of the signal connection of the connector is high.
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (5)
- 고속 데이터 통신을 위한 기판 대 기판(Board to Board) 커넥터로서,PCB판의 모서리 측에 형성되어 한쪽 면과 다른 쪽 면으로 각각 양극단자와 음극단자가 대칭을 이루며 간격을 두고 복수로 형성되되, 상기 양극단자의 사이 및 음극단자의 사이와 PCB판 내측으로 각각 양극단자 및 음극단자와 설정된 간격을 두고 형성되는 도체소재의 쉴드구조체가 배치되는 핑거구조체;한쪽으로 개구부를 구비하여 상기 핑거구조체의 한쪽 면과 다른 쪽 면을 감싸며 결합하되, 상기 양극단자 및 음극단자에 각각 접촉하여 통전되는 복수의 양극핀 및 음극핀과, 상기 양극핀 사이 및 음극핀 사이에 설정된 간격을 두고 삽입되는 도체소재의 쉴드판과, 상기 개구부를 제외하고 상기 양극핀 및 음극핀과 쉴드판 사이에 채워져 몸체를 형성하며 저유전율 특성의 유전체를 구비하는 리셉터클구조체;로 이루어지는 것을 특징으로 하는 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터.
- 제1항에 있어서,상기 유전체는 테프론(Teflon), 폴리에틸렌(Polyethylene), 레진(Resin), 구타페르카(Gutta-Percha), 루사이트(Lucite), 파라핀(Paraffin), 스티로폼(Styrofoam), 바세린(Vaseline), 세라믹 중에서 선택되는 것을 특징으로 하는 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터.
- 제1항에 있어서,상기 양극핀 및 음극핀은 각각 상기 양극단자 및 음극단자에 접촉하는 접촉부와, 상호간격이 평행을 이루도록 형성되는 직선구간과, 각각 설정된 방향으로 굽혀 유전체 외측으로 노출되도록 하는 노출부로 구성되는 것을 특징으로 하는 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터.
- 제3항에 있어서,상기 양극핀 및 음극핀은 설정된 방향으로 굽어지는 만곡부를 각각 구비하되, 상기 양극핀 및 음극핀 중 내측에서 굽혀지는 핀의 만곡부에는 추가적인 곡선부가 형성되어, 상기 양극핀 및 음극핀의 길이가 동일하도록 구성하는 것을 특징으로 하는 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터.
- 제4항에 있어서,상기 곡선부의 굴곡은 양극핀 또는 음극핀 폭의 2배 이하 반경을 유지하는 것을 특징으로 하는 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2022513618A JP7384490B2 (ja) | 2019-08-27 | 2020-08-25 | 伝送品質改善及び特性調節の可能な高速通信用コネクタ |
US17/638,729 US20220285886A1 (en) | 2019-08-27 | 2020-08-25 | High-speed communication connector capable of improving transmission quality and of controlling transmission characteristics |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190105444A KR102168399B1 (ko) | 2019-08-27 | 2019-08-27 | 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터 |
KR10-2019-0105444 | 2019-08-27 |
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WO2021040375A1 true WO2021040375A1 (ko) | 2021-03-04 |
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PCT/KR2020/011309 WO2021040375A1 (ko) | 2019-08-27 | 2020-08-25 | 전송품질 개선 및 특성조절이 가능한 고속통신용 커넥터 |
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US (1) | US20220285886A1 (ko) |
JP (1) | JP7384490B2 (ko) |
KR (1) | KR102168399B1 (ko) |
WO (1) | WO2021040375A1 (ko) |
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CN112492744B (zh) * | 2020-11-20 | 2022-02-11 | 深圳市金晟达电子技术有限公司 | 一种结构加强型可调节5g通信用线路板 |
Citations (5)
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JP2000067956A (ja) * | 1998-08-24 | 2000-03-03 | Fujitsu Takamisawa Component Ltd | プラグ、ジャック、及びコネクタ装置 |
KR20020084275A (ko) * | 2000-03-31 | 2002-11-04 | 몰렉스 인코포레이티드 | 채널 격리 실드 |
JP2006216348A (ja) * | 2005-02-03 | 2006-08-17 | Japan Aviation Electronics Industry Ltd | コンタクトユニット及びそれを備えたコネクタ |
JP4094551B2 (ja) * | 2002-01-30 | 2008-06-04 | 富士通コンポーネント株式会社 | コネクタ |
KR20170073323A (ko) * | 2015-12-18 | 2017-06-28 | 삼성전자주식회사 | 고속신호 커넥터를 구비한 인쇄회로기판 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000067955A (ja) * | 1998-08-17 | 2000-03-03 | Fujitsu Takamisawa Component Ltd | ジャック、プラグ、及びコネクタ装置 |
JP4519582B2 (ja) * | 2004-09-02 | 2010-08-04 | 富士通コンポーネント株式会社 | コネクタ部付き平衡伝送用平坦状ケーブル |
JP4917784B2 (ja) * | 2005-09-26 | 2012-04-18 | 富士通コンポーネント株式会社 | コネクタ |
JP4740760B2 (ja) * | 2006-02-10 | 2011-08-03 | スリーエム イノベイティブ プロパティズ カンパニー | 基板用コネクタ及びそれを有する回路体接続構造 |
JP5060385B2 (ja) * | 2008-05-09 | 2012-10-31 | 富士通コンポーネント株式会社 | 平衡伝送用コネクタ及び平衡伝送用ケーブルコネクタ |
TWI556521B (zh) | 2014-08-07 | 2016-11-01 | Kuang Ying Comp Equipment Co | Electrical connector |
-
2019
- 2019-08-27 KR KR1020190105444A patent/KR102168399B1/ko active IP Right Grant
-
2020
- 2020-08-25 JP JP2022513618A patent/JP7384490B2/ja active Active
- 2020-08-25 WO PCT/KR2020/011309 patent/WO2021040375A1/ko active Application Filing
- 2020-08-25 US US17/638,729 patent/US20220285886A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000067956A (ja) * | 1998-08-24 | 2000-03-03 | Fujitsu Takamisawa Component Ltd | プラグ、ジャック、及びコネクタ装置 |
KR20020084275A (ko) * | 2000-03-31 | 2002-11-04 | 몰렉스 인코포레이티드 | 채널 격리 실드 |
JP4094551B2 (ja) * | 2002-01-30 | 2008-06-04 | 富士通コンポーネント株式会社 | コネクタ |
JP2006216348A (ja) * | 2005-02-03 | 2006-08-17 | Japan Aviation Electronics Industry Ltd | コンタクトユニット及びそれを備えたコネクタ |
KR20170073323A (ko) * | 2015-12-18 | 2017-06-28 | 삼성전자주식회사 | 고속신호 커넥터를 구비한 인쇄회로기판 |
Also Published As
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JP2022546099A (ja) | 2022-11-02 |
KR102168399B1 (ko) | 2020-10-21 |
US20220285886A1 (en) | 2022-09-08 |
JP7384490B2 (ja) | 2023-11-21 |
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