WO2021037019A1 - Processing system, processing method and application method for copper mesh for battery piece without main grid - Google Patents
Processing system, processing method and application method for copper mesh for battery piece without main grid Download PDFInfo
- Publication number
- WO2021037019A1 WO2021037019A1 PCT/CN2020/111035 CN2020111035W WO2021037019A1 WO 2021037019 A1 WO2021037019 A1 WO 2021037019A1 CN 2020111035 W CN2020111035 W CN 2020111035W WO 2021037019 A1 WO2021037019 A1 WO 2021037019A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- battery
- busbar
- wire
- copper mesh
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 261
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 159
- 239000010949 copper Substances 0.000 title claims abstract description 159
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000012545 processing Methods 0.000 title claims abstract description 49
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 77
- 238000003466 welding Methods 0.000 claims abstract description 57
- 238000005491 wire drawing Methods 0.000 claims abstract description 42
- 230000008569 process Effects 0.000 claims description 25
- 230000004907 flux Effects 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 230000007306 turnover Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000013082 photovoltaic technology Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/02—Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
- B21C1/04—Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums with two or more dies operating in series
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C3/00—Profiling tools for metal drawing; Combinations of dies and mandrels
- B21C3/02—Dies; Selection of material therefor; Cleaning thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F27/00—Making wire network, i.e. wire nets
- B21F27/08—Making wire network, i.e. wire nets with additional connecting elements or material at crossings
- B21F27/10—Making wire network, i.e. wire nets with additional connecting elements or material at crossings with soldered or welded crossings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- This application relates to the field of photovoltaic technology, in particular to a processing system, processing method and application method of copper mesh for busbar-less cells.
- the crystalline silicon cells currently on the market use multiple main grids to be electrically connected by ribbon welding.
- the current on the cell is collected to the main grid line through the thin grid line, and then flows out through the ribbon on the main grid line.
- the multi-bus grid corresponding to the welding ribbon adopts a round structure, which requires high positioning structure during the welding process, and the actual operating position is often shifted.
- the appearance is poor and the phenomenon of whitening is serious, and the size of the pad on the corresponding cell is also large.
- Waste positive silver material and increase the shielding area.
- some battery manufacturers have designed a battery plate without busbar to match the tinned copper wire group or copper wire mesh welding process.
- the conventional tinned copper wire group or copper wire mesh welding process uses copper wires whose base material is copper to weld the battery cells.
- the bottom is covered with a film layer as a backing to prevent the position of the copper wires from shifting Or deformation, the processing technology is complicated, and the copper wire is easily deformed during the packaging and handling process, which cannot be welded with the battery sheet or easily leads to poor welding with the battery sheet.
- the film layer cannot withstand high temperatures, it becomes a molten state during the lamination process. It is easy to fill between the battery sheet and the copper mesh, and isolate the battery sheet from the copper mesh, resulting in poor welding. Therefore, the material requirements for the film layer are The operation process is relatively high, which increases the difficulty of the process, and it is more challenging for conventional cells that require a high temperature of 183 degrees or more.
- the bottom of the existing tinned copper wire group or copper wire mesh is covered with a film layer as a backing to prevent the position of the copper wire from shifting or deforming.
- the processing technology is complicated, and the copper wire is easily deformed during packaging and handling. Welding with the cell or easily leads to poor welding with the cell.
- the film layer cannot withstand high temperatures, it will easily become a molten state during the lamination process and fill between the cell and the copper mesh to isolate the cell from the copper mesh. , Resulting in poor welding and increasing the difficulty of the process.
- a processing system for a copper mesh for a busbar-less battery cell includes a compression welding die, a feeding device, a first wire drawing module and a second wire drawing module;
- the compression welding die includes a vertical direction oppositely arranged The upper mold and the lower mold, the upper mold is provided with a raised pressing pin on the side facing the lower mold, and the lower mold is provided with a copper wire guide groove on the side facing the upper mold, and the upper mold and the lower mold face each other in the vertical direction Or move opposite to each other;
- the feeding device provides copper wire for the first wire drawing module and the second wire drawing module;
- the first drawing module includes a pair of first pressing plates arranged along the first direction in the horizontal direction, and at least two pressing heads are respectively provided at the end of each first pressing plate; the pressing heads of the two first pressing plates are arranged oppositely, The two first pressing plates move between the upper mold and the lower mold in the first direction or move away from each other to the two sides of the pressure welding mold.
- the first wire drawing module feeds materials through the opposite movement of the two first pressing plates.
- the copper wire provided by the device is drawn to form N copper wires located between the upper mold and the lower mold along the first direction;
- the second drawing module includes a pair of second pressing plates arranged along the second direction in the horizontal direction, and at least two pressing heads are respectively provided at the end of each second pressing plate; the pressing heads of the two second pressing plates are arranged opposite to each other, The two second pressing plates move in the second direction between the upper mold and the lower mold toward or away from each other to the two sides of the pressure welding mold.
- the second wire drawing module feeds materials through the opposite movement of the two second pressing plates.
- the copper wire drawn by the device forms M copper wires along the second direction between the upper die and the lower die.
- the M copper wires along the second direction are different from the N copper wires along the first direction.
- the copper wire interweaving structure that matches the busbar-less cell structure is formed.
- N copper wires along the first direction and M copper wires along the second direction are directly directed to the copper wires on the lower mold.
- the junction points of the N copper wires along the first direction and the M copper wires along the second direction are directly opposite to the pressure pins on the upper mold.
- each indenter is elastically connected to the corresponding pressure plate, and the pulling force on the copper wire is controlled by elastic force.
- a further technical solution is that the upper mold is provided with cutting knives around the side facing the lower mold.
- a further technical solution is that the processing system further includes a flux module, and the flux module is arranged between the feeding device and the first wire drawing module and the second wire drawing module.
- the upper mold is also provided with a pressure pin at the copper wire facing the predetermined area of the copper wire interlaced structure, wherein the predetermined area is a copper mesh formed by processing and laying on the busbarless battery sheet corresponding to each upper and lower phases. The area adjacent to the overlap between two rows of busbar-free cells.
- a method for processing a copper mesh for a busbarless battery is applied to the copper mesh processing system for a busbarless battery disclosed in the present application, and the method includes:
- the first wire drawing module moves the two first pressure plates against each other, and uses the pressure heads on the two first pressure plates to draw the copper wires to form N copper wires located between the upper mold and the lower mold along the first direction;
- the second wire drawing module moves the two second pressure plates against each other, and uses the pressure heads on the two second pressure plates to draw the copper wires to form M copper wires located between the upper mold and the lower mold along the second direction.
- the M copper wires along the second direction and the N copper wires along the first direction are on different levels and form an interwoven structure of copper wires that matches the structure of the busbar-less cell;
- the upper mold and the lower mold press the copper wire interlaced structure into the respective copper wire guide grooves of the card access to the lower mold, and the upper mold presses and welds each junction point of the copper wire interlaced structure to form copper for busbar-less battery cells. network.
- a further technical solution is that the method further includes: cutting the copper wire interwoven structure through the surrounding cutters during the pressing process of the upper mold.
- a further technical solution is that the upper mold is also provided with a pressing needle at the copper wire facing the predetermined area of the copper wire interlaced structure, and the method further includes:
- the upper mold is pressed against the predetermined area of the copper wire interlaced structure by pressing at the predetermined area to form a concave structure.
- the predetermined area is a copper mesh formed by processing and laying on the busbar-less battery sheet, corresponding to each two adjacent rows of the busbar-free battery. The area of overlap between slices.
- a further technical solution is that the method further includes: using a thinning die to thin a predetermined area of the copper wire interlaced structure to form an inner concave structure, and the predetermined area is a copper mesh formed by processing and laying on the busbar-less battery. The area of the overlap between two adjacent rows without busbar cells.
- the transfer method includes: the busbarless battery is clamped and transferred with the copper mesh, or clamped
- the busbarless solar cells are transferred by dragging and transferring on one side of the copper mesh, or the busbarless solar cells are transferred by the copper mesh through the transfer assembly.
- An application method of a copper mesh for a busbar-free cell including:
- busbarless battery sheet processed by the processing method according to any one of claims 6-10 with a copper mesh on the busbarless battery sheet, and one row of the two rows of busbarless battery sheets to be connected passes through the front of the battery sheet It is in contact with the copper mesh for the busbarless battery, and the other row is in contact with the copper mesh for the busbarless battery through the back of the battery slice; each row of busbarless battery includes multiple battery slices, one for busbarless battery slice Copper mesh covers multiple rows of cells;
- the busbar-less battery is welded with a copper mesh and the contacted busbar-free battery to form a photovoltaic cell module battery layer.
- a low-temperature welding process is adopted to weld the busbar-less battery sheet with copper mesh and the contacted busbar-free battery sheet during the lamination and heating process.
- the copper mesh for busbar-less cells has a recessed structure at a predetermined area, and the recessed structure of the copper mesh is located in the area of the overlap between two adjacent rows of busbar-free cells.
- This application discloses a copper mesh processing system for busbar-free cells, a processing method for processing copper mesh using the processing system, and an application method of the processed copper mesh.
- the processing copper mesh in this application does not require a backing and is implanted In the string welding machine, while being suitable for the low cost and high efficiency of the final product, it avoids the problems of high processing difficulty and poor welding caused by the bottom lining, which can save the supplier's processing and transportation costs, improve production efficiency, and reduce the bottom lining material cost.
- this application considers the stress of copper wire welding. The tension of the copper wire is controlled by the height of the pressing plate and the elasticity of the indenter and the pressing plate to ensure that the copper mesh will not be deformed after welding.
- Fig. 1 is a schematic diagram of the processing system disclosed in the present application.
- Fig. 2 is a top view of the lower mold and two drawing modules in the processing system of the present application.
- Fig. 3 is a flowchart of the copper mesh processing method and application method disclosed in the present application.
- Fig. 4 is a schematic diagram of the application of the copper mesh processed by the copper mesh processing method disclosed in the present application.
- FIG. 5 is a schematic diagram of the application of another structure of the copper mesh processed by the copper mesh processing method disclosed in the present application.
- Fig. 6 is a schematic diagram of laying between the copper mesh and the battery sheet obtained by the processing of this application.
- the processing system includes a press-welding die.
- the press-welding die includes an upper die 1 that is opposed to each other in the vertical direction.
- the lower mold 2 the upper mold 1 is provided with a raised pressing pin 3 on the side facing the lower mold 2
- the lower mold 2 is provided with a copper wire guide groove 4 on the side facing the upper mold 1, and a copper wire guide groove 4
- the opening structure is opened according to the structure of the copper mesh that needs to be processed. For example, in this application, as shown in FIG.
- the multi-row and multi-column copper wire guide troughs 4 are interwoven, and each row/column of the copper wire guide 4 adopts an interval opening structure, which reduces the cost of slotting on the basis of meeting the needs of use.
- the upper mold 1 and the lower mold 2 can run opposite to each other in a vertical direction to realize pressing or moving against each other to separate.
- the upper mold 1 is provided with a cutter 5 on the periphery of the side facing the lower mold 2.
- the processing system also includes a feeding device 6 in which a copper wire coil is installed.
- the feeding device 6 can be implemented as a wire wheel support, and the copper wire coil 7 is installed on the wire wheel support and the wire
- the rotating shaft on the wheel bracket is fixed, and the copper wire coil 7 rotates with the wire wheel bracket to realize feeding.
- Each copper wire coil 7 is wound with a copper wire.
- the copper wire is the raw material for making the copper mesh in this application.
- the copper wire in this application is a copper wire with a coating on the surface of the copper substrate.
- the surface of the copper wire is electroplated or coated. Coated tin-lead, tin-bismuth, etc., based on different coatings of copper wires can achieve different temperature welding processes, and conventional tin-lead coatings can achieve soldering temperatures above 183 degrees.
- the feeding device 6 provides copper wires for the first wire drawing module and the second wire drawing module.
- the processing system is also provided with a flux module 8 at the discharge port of the feeding device 6, that is, a flux module 8 Set between the feeding device 6 and the first wire drawing module and the second wire drawing module, the copper wire is outputted from the feeding device 6 to the first wire drawing module and the second wire drawing module through the flux module 8 to achieve copper The wire flux is applied.
- the cross-sectional view shown in FIG. 1 shows the first wire drawing module.
- the first wire drawing module includes a pair of first pressing plates 9 and 10 arranged in the horizontal direction along the first direction, and the ends of each first pressing plate are respectively provided with At least two indenters 11.
- the respective indenters 11 on the two first pressure plates 9 and 10 are arranged in one-to-one correspondence and opposite to each other.
- the two first pressure plates 9 and 11 can move toward each other between the upper mold 1 and the lower mold 2 along the first direction or Move back to the two sides of the pressure welding mold, as shown in FIG. 1 taking the state where the two first pressure plates 9 and 11 move to the two sides of the pressure welding mold as an example.
- the second wire drawing module includes a pair of second pressing plates 12 and 13 arranged in the horizontal direction along the second direction, and the ends of each second pressing plate are respectively At least two indenters 14 are provided.
- the pressure heads 14 on the two second pressure plates 12 and 13 are respectively arranged in one-to-one correspondence and opposite to each other.
- the two second pressure plates 12 and 13 move or oppose each other between the upper mold 1 and the lower mold 2 along the second direction. Back movement to both sides of the press welding mold.
- the first direction and the second direction are usually two vertical directions in the horizontal direction.
- each pressure head and the corresponding pressure plate are respectively elastically connected by an elastic component 15.
- the copper wire output from the feeding device 6 is sent to the respective pressure heads of the first wire drawing module and the second wire drawing module through the guide wheels for drawing.
- this application also discloses a method for processing a copper mesh for a busbar-less battery. Please refer to Fig. 3.
- the method includes the following steps:
- the copper wire provided by the feeding device 6 for the first wire drawing module is sent to each indenter through the guide wheel and fixed on each indenter 11 of one of the first pressing plates 9.
- the feeding device 6 is the first
- the copper wire provided by the second wire drawing module is sent to each indenter through a guide wheel and fixed on each indenter 11 of one of the second pressure plates 12.
- the copper wire Before the copper wire is fed to the first wire drawing module and the second wire drawing module, the copper wire passes through the flux module 8, and the flux module 8 applies flux to the surface of the copper wire to facilitate subsequent welding.
- the other first pressing plate 10 in the first drawing module moves to the first pressing plate 9 along the first direction, and each pressing head 11 on the first pressing plate 10 respectively grabs the copper wire at each pressing head of the first pressing plate 9 , And then the first pressing plate 10 moves away from the first pressing plate 9 in the first direction to the other side of the pressing and welding mold, and the first drawing module realizes the drawing through the opposite movement of the two first pressing plates to form the upper mold 1.
- the other second pressing plate 13 in the second drawing module moves along the second direction to the second pressing plate 12, and each pressing head 11 on the second pressing plate 13 respectively grabs the copper at each pressing head of the second pressing plate 12. Then the second pressing plate 13 moves away from the second pressing plate 12 in the second direction to the other side of the pressing and welding mold, and the second drawing module realizes the drawing through the opposite movement of the two second pressing plates to form the upper mold
- copper wires can be fixed at each indenter of each drawing module for drawing, or copper wires can be fixed only at part of the indenters to draw different numbers of copper wires with different pitches as needed.
- the width of the copper mesh required for the head and tail of the battery is relatively small, so it is necessary to adjust the width of the copper mesh and the spacing between the wires.
- the width of the battery is set to 26mm, and the width of the network between two solar cells is 45mm. ⁇ 55mm, the net width of the outermost battery string is between 30mm ⁇ 35mm. This is just an example, and the size is not limited.
- the M copper wires along the second direction and the N copper wires along the first direction are at different levels, and form a copper wire interwoven structure that matches the busbar-less cell structure.
- the copper wire interwoven structure is located on the upper mold 1. Between the copper wire interlaced structure and the lower mold 2, the copper wires in the copper wire interlaced structure are respectively facing the copper wire guide grooves 4 on the lower mold 2, and the junction points in the copper wire interlaced structure are respectively facing the pressure pins on the upper mold 1. 3.
- the relative movement of the upper mold 1 and the lower mold 2 presses the copper wire interlaced structure.
- the copper wire interlaced structure is inserted into the copper wire guide grooves of the lower mold 2 during the pressing process to prevent the occurrence of copper wires. Dislocation or relative movement.
- the horizontal and vertical copper wires are inserted into the copper wire guide groove 4 respectively.
- the upper mold 1 performs pressure welding on each junction point in the copper wire interlaced structure through the pressure needle 3 during the pressing process.
- the pressure welding step has different realizations. the way:
- the copper mesh that needs to be processed is a flat structure, then the upper mold 1 pressure-welds each junction point in the copper wire interweaving structure to form a flat net structure, then the specific: the upper mold 1 passes the pressure needle 3 to the copper Each junction point in the silk interlaced structure is flattened, and the copper wire in the first direction and the copper wire in the second direction are flattened to a plane.
- the upper mold 1 is provided with a lower limit. When the upper mold 1 reaches the lower limit, the Each junction point in the copper wire interwoven structure is pressed into a plane with the copper wire. Then the upper die 1 welds the junction points in the copper wire interwoven structure through the press needle 3.
- this application also includes the step of thinning the predetermined area of the copper wire interlaced structure, where the copper mesh is laid on When on a busbar-less cell, it corresponds to the area of the overlap between two adjacent rows of busbar-free cells, so that the thickness of the processed copper mesh at the predetermined area is smaller than other areas, thereby forming a concave structure to reduce the cell. Damage received in this overlapped part.
- the step of thinning can be performed between the steps of flattening each junction point and welding each junction point, or after flattening and welding each junction point, or it can be performed at the same time as the step of flattening each junction point.
- the step of thinning can be performed by the upper mold 1.
- the upper mold 1 is also provided with a pressure needle at the copper wire facing the predetermined area of the copper wire interlaced structure, and the upper mold is directed to the predetermined copper wire interlaced structure by pressing at the predetermined area.
- the area is thinned to form a concave structure.
- This thinning step can also be performed by a separate thinning die.
- each junction point in the copper wire interwoven structure may be short of tin and expose the bare copper. At this time, it is necessary to spray anti-rust materials at the junction point.
- the tensile force of the copper wire can be controlled by the elastic force to ensure that the copper wire interwoven structure will not be deformed due to stress after welding.
- step 5 Cut off the excess copper wires around the copper wire interweaving structure completed by pressing and welding to form the final finished copper mesh for the busbar-free battery.
- step 4 that is, the upper mold 1 simultaneously cuts the copper wire interwoven structure through the peripheral cutting knives during the pressing process.
- a schematic diagram of the cutting position 16 of the cutter 5 is shown in FIG. 2.
- multiple copper meshes can be cut at one time. That is, a large copper mesh is made, and the position of the cutter is adjusted during the pressing and welding process, and the large copper mesh can be pressed into multiple copper meshes at a time. Or transfer the large copper net and then cut it.
- Transfer the processed copper mesh transfer the copper mesh for the busbarless battery to the turnover tray or directly lay it on the busbarless battery in a special welding machine.
- the transfer method includes: use copper for the busbarless battery. The net is clamped and transferred, or, the side of the copper mesh for the busbarless battery is dragged and transferred, or the busbarless battery is transferred by the copper mesh through the transfer assembly. When multiple copper meshes are produced in step 5, alternate transfer is adopted to increase the overall processing speed.
- the copper mesh is used to connect the busbar-less cells to form a photovoltaic cell module, which also includes the following steps:
- An independent copper mesh is set between the two rows of busbarless cells to be connected. As shown in Figure 4-6, one side of the copper mesh A falls on the front of one row of cell B, and the other side falls on the other. The back of the row of cells B, that is, one of the two rows of busbarless cells to be connected is in contact with the copper mesh A through the front of the cell, and the other row is in contact with the copper mesh A through the back of the cell. And an independent copper mesh can cover and connect multiple rows of solar cells at one time, that is, each row of solar cells includes multiple solar cells.
- the copper mesh A has a flat structure as an example. As shown in Figure 5, the copper mesh A has a concave structure C at a predetermined area. As shown in Figure 5, it can be clearly seen that two adjacent rows of cells without busbars The area of the overlap between B is located at the concave structure C of the copper mesh A.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Wire Processing (AREA)
Abstract
Description
Claims (13)
- 一种无主栅电池片用铜网的加工系统,其特征在于,所述加工系统包括压合焊接模具、上料装置、第一拉丝模块和第二拉丝模块;所述压合焊接模具包括在竖直方向对向设置的上模具和下模具,所述上模具在朝向所述下模具的一侧设置有凸起的压针,所述下模具在朝向所述上模具的一侧开设有铜丝导向槽,所述上模具和下模具沿着竖直方向相向或相背运动;所述上料装置为所述第一拉丝模块和第二拉丝模块提供铜丝; A processing system for a copper mesh for a busbar-less battery cell, characterized in that the processing system includes a compression welding die, a feeding device, a first wire drawing module and a second wire drawing module; the compression welding die includes An upper mold and a lower mold are arranged opposite to each other in a vertical direction, the upper mold is provided with a convex pressing pin on the side facing the lower mold, and the lower mold is provided with copper on the side facing the upper mold Wire guide groove, the upper die and the lower die move toward or away from each other along the vertical direction; the feeding device provides copper wires for the first wire drawing module and the second wire drawing module;所述第一拉丝模块包括一对在水平方向沿着第一方向设置的第一压板,每个所述第一压板的端部分别设置有至少两个压头;两个所述第一压板的压头对向设置,两个所述第一压板沿着所述第一方向在所述上模具和下模具之间相向运动或相背运动至所述压合焊接模具的两侧,所述第一拉丝模块通过两个所述第一压板的相背运动对所述上料装置提供的铜丝拉丝形成位于所述上模具和下模具之间的N根沿着第一方向的铜丝;The first drawing module includes a pair of first pressing plates arranged along a first direction in a horizontal direction, and at least two pressing heads are respectively provided at the end of each first pressing plate; The pressure heads are arranged oppositely, and the two first pressure plates move toward or away from each other between the upper mold and the lower mold along the first direction to the two sides of the pressure welding mold. A wire drawing module draws the copper wires provided by the feeding device through the opposite movement of the two first pressing plates to form N copper wires located between the upper die and the lower die along the first direction;所述第二拉丝模块包括一对在水平方向沿着第二方向设置的第二压板,每个所述第二压板的端部分别设置有至少两个压头;两个所述第二压板的压头对向设置,两个所述第二压板沿着所述第二方向在所述上模具和下模具之间相向运动或相背运动至所述压合焊接模具的两侧,所述第二拉丝模块通过两个所述第二压板的相背运动对所述上料装置提供的铜丝拉丝形成位于所述上模具和下模具之间的M根沿着第二方向的铜丝,所述M根沿着第二方向的铜丝与所述N根沿着第一方向的铜丝处于不同的水平面并形成与无主栅电池片结构匹配的铜丝交织结构,所述N根沿着第一方向的铜丝和所述M根沿着第二方向的铜丝分别正对所述下模具上的各个铜丝导向槽,所述N根沿着第一方向的铜丝和所述M根沿着第二方向的铜丝的各个交界点分别正对所述上模具上的各个压针。The second drawing module includes a pair of second pressing plates arranged along a second direction in the horizontal direction, and at least two pressing heads are respectively provided at the end of each second pressing plate; The pressure heads are arranged oppositely, and the two second pressure plates move toward or away from each other between the upper mold and the lower mold along the second direction to the two sides of the pressure welding mold. The second wire drawing module draws the copper wires provided by the feeding device through the opposite movement of the two second pressing plates to form M copper wires located between the upper mold and the lower mold along the second direction, so The M copper wires along the second direction and the N copper wires along the first direction are on different levels and form an interwoven structure of copper wires that matches the busbar-less cell structure, and the N wires are along The copper wires in the first direction and the M copper wires along the second direction respectively face each copper wire guide groove on the lower mold, and the N copper wires along the first direction and the M Each junction point of the copper wire along the second direction is directly opposite to each pressing pin on the upper mold.
- 根据权利要求1所述的加工系统,其特征在于,每个压头和对应的压板之间弹性连接,对所述铜丝的拉力通过弹力控制。 The processing system according to claim 1, wherein each pressure head is elastically connected to the corresponding pressure plate, and the pulling force on the copper wire is controlled by elastic force.
- 根据权利要求1所述的加工系统,其特征在于,所述上模具在朝向所述下模具的一侧的四周设置有切刀。 The processing system according to claim 1, wherein the upper mold is provided with a cutter around a side facing the lower mold.
- 根据权利要求1-3任一所述的加工系统,其特征在于,所述加工系统还包括助焊剂模组,所述助焊剂模组设置在所述上料装置和所述第一拉丝模块与第二拉丝模块之间。 The processing system according to any one of claims 1-3, wherein the processing system further comprises a flux module, and the flux module is arranged on the loading device and the first wire drawing module and Between the second drawing module.
- 根据权利要求1所述的加工系统,其特征在于,所述上模具在朝向所述铜丝交织结构的预定区域的铜丝处也设置有压针,其中,所述预定区域是加工形成的铜网敷设在无主栅电池片上时对应每上下相邻两排无主栅电池片之间的重叠部分的区域。 The processing system according to claim 1, wherein the upper mold is also provided with a pressure pin at the copper wire facing the predetermined area of the copper wire interweaving structure, wherein the predetermined area is formed by processing the copper wire. When the net is laid on the busbarless battery slice, the area corresponding to the overlap between two adjacent rows of the busbarless battery slice.
- 在此处键入权利要求项6一种无主栅电池片用铜网的加工方法,应用在如权利要求1-5任一所述的加工系统中,其特征在于,所述方法包括: Type here claim 6 a method for processing a copper mesh for busbar-less cells, which is applied to the processing system according to any one of claims 1-5, characterized in that the method comprises:将铜丝卷安装在所述上料装置中,所述上料装置为所述第一拉丝模块和所述第二拉丝模块提供铜丝;Installing a copper wire coil in the feeding device, which provides copper wires for the first wire drawing module and the second wire drawing module;所述第一拉丝模块通过两个所述第一压板的相背运动,利用两个所述第一压板上的压头对铜丝拉丝形成位于所述上模具和下模具之间的N根沿着第一方向的铜丝;所述第二拉丝模块通过两个所述第二压板的相背运动,利用两个所述第二压板上的压头对铜丝拉丝形成位于所述上模具和下模具之间的M根沿着第二方向的铜丝,所述M根沿着第二方向的铜丝与所述N根沿着第一方向的铜丝处于不同的水平面并形成与无主栅电池片结构匹配的铜丝交织结构;The first wire drawing module moves the two first pressure plates against each other, and uses the pressure heads on the two first pressure plates to draw the copper wire to form N edges between the upper die and the lower die. The copper wire in the first direction; the second wire drawing module through the movement of the two second pressing plates against each other, using the indenters on the two second pressing plates to draw the copper wire to form the upper die and The M copper wires along the second direction between the lower molds, the M copper wires along the second direction and the N copper wires along the first direction are in different horizontal planes and form a different level. Copper wire interwoven structure matched with grid cell structure;所述上模具和所述下模具将所述铜丝交织结构压合至卡接入所述下模具的各个铜丝导向槽中,所述上模具通过压针对所述铜丝交织结构的各个交界点进行压焊形成无主栅电池片用铜网。The upper mold and the lower mold press the copper wire interlaced structure into each copper wire guide groove that is inserted into the lower mold, and the upper mold presses against each boundary of the copper wire interlaced structure. Spots are pressure-welded to form a copper mesh for busbar-less cells.
- 根据权利要求6所述的加工方法,其特征在于,所述方法还包括:所述上模具在压合过程中通过四周的切刀对所述铜丝交织结构进行裁切。 The processing method according to claim 6, characterized in that, the method further comprises: cutting the copper wire interwoven structure by the peripheral cutters during the pressing process of the upper mold.
- 根据权利要求6所述的加工方法,其特征在于,所述上模具在朝向所述铜丝交织结构的预定区域的铜丝处也设置有压针,则所述方法还包括: The processing method according to claim 6, wherein the upper mold is also provided with a pressing needle at the copper wire facing the predetermined area of the copper wire interlaced structure, and the method further comprises:所述上模具通过预定区域处的压针对所述铜丝交织结构的预定区域压薄形成内凹结构,所述预定区域是加工形成的铜网敷设在无主栅电池片上时对应每上下相邻两排无主栅电池片之间的重叠部分的区域。The upper mold is thinned by pressing at a predetermined area against a predetermined area of the copper wire interlaced structure to form a concave structure. The predetermined area is a copper mesh formed by processing and laying on a busbar-less battery sheet corresponding to each upper and lower adjacent The area of the overlap between two rows of busbar-free cells.
- 根据权利要求6所述的加工方法,其特征在于,所述方法还包括:通过压薄模具对所述铜丝交织结构的预定区域压薄形成内凹结构,所述预定区域是加工形成的铜网敷设在无主栅电池片上时对应每上下相邻两排无主栅电池片之间的重叠部分的区域。 The processing method according to claim 6, characterized in that the method further comprises: using a thinning die to thin a predetermined area of the copper wire interlaced structure to form a concave structure, and the predetermined area is formed by processing copper. When the net is laid on the busbarless battery slice, the area corresponding to the overlap between two adjacent rows of the busbarless battery slice.
- 根据权利要求6-9任一所述的加工方法,其特征在于,所述方法还包括: The processing method according to any one of claims 6-9, wherein the method further comprises:将所述无主栅电池片用铜网转移至周转盘中或直接铺设于串焊机中的无主栅电池片上,转移方法包括:将所述无主栅电池片用铜网夹起转移,或者,夹住所述无主栅电池片用铜网的一侧拖动转移,或者,通过传送组件对所述无主栅电池片用铜网传送转移。The copper mesh for the busbar-free battery is transferred to the turnover tray or directly laid on the busbarless battery in the stringer. The transfer method includes: the busbar-free battery is clamped and transferred by the copper mesh, Alternatively, one side of the copper mesh for the busbarless battery is clamped and transferred, or the copper mesh for the busbarless battery is transported and transferred by a transfer assembly.
- 一种无主栅电池片用铜网的应用方法,其特征在于,所述应用方法包括: An application method of a copper mesh for a busbar-less battery, characterized in that the application method includes:将采用如权利要求6-10任一所述的加工方法加工得到的无主栅电池片用铜网铺设在无主栅电池片上,待连接的两排无主栅电池片中的一排通过电池片正面与所述无主栅电池片用铜网接触、另一排通过电池片背面与所述无主栅电池片用铜网接触;每排无主栅电池片包括多个电池片,一张所述无主栅电池片用铜网覆盖多列电池片;Lay the busbarless battery slices processed by the processing method according to any one of claims 6-10 with copper mesh on the busbarless battery slices, and one row of the two rows of busbarless battery slices to be connected passes through the battery The front side of the sheet is in contact with the copper mesh for the busbar-free battery, and the other row is in contact with the copper mesh for the busbar-free battery through the back of the battery sheet; each row of busbar-less battery sheet includes a plurality of battery sheets, one The busbar-free battery is covered with copper mesh in multiple rows of battery;将所述无主栅电池片用铜网与所接触的无主栅电池片焊接在一起形成光伏电池组件电池片层。The busbar-free battery is welded with a copper mesh and the contacted busbar-free battery to form a photovoltaic cell module battery sheet layer.
- 根据权利要求11所述的应用方法,其特征在于,所述将所述无主栅电池片用铜网与所接触的无主栅电池片焊接在一起形成光伏电池组件电池片层,包括: The application method according to claim 11, characterized in that said welding the copper mesh for the busbarless cell and the contacted busbarless cell together to form a photovoltaic cell module cell layer comprises:采用加热焊接工艺将所述无主栅电池片用铜网与所接触的无主栅电池片焊接在一起;Using a heating welding process to weld the copper mesh for the busbarless battery and the contacted busbarless battery;或者,采用低温焊接工艺、在层压加温过程中将所述无主栅电池片用铜网与所接触的无主栅电池片焊接在一起。Alternatively, a low-temperature welding process is used to weld the busbar-free battery sheet with the contacted busbar-free battery sheet with a copper mesh during the lamination and heating process.
- 根据权利要求11所述的应用方法,其特征在于,所述无主栅电池片用铜网在预定区域处呈内凹结构,所述铜网的内凹结构位于相邻两排无主栅电池片之间的重叠部分的区域。 The application method according to claim 11, wherein the copper mesh for the busbar-less battery has a concave structure at a predetermined area, and the concave structure of the copper mesh is located in two adjacent rows of the busbar-free battery. The area of overlap between slices.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910813539.1 | 2019-08-30 | ||
CN201910813539.1A CN110534593B (en) | 2019-08-30 | 2019-08-30 | Processing system, processing method and application method of copper mesh for non-main-grid battery plate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021037019A1 true WO2021037019A1 (en) | 2021-03-04 |
Family
ID=68665396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/111035 WO2021037019A1 (en) | 2019-08-30 | 2020-08-25 | Processing system, processing method and application method for copper mesh for battery piece without main grid |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN110534593B (en) |
WO (1) | WO2021037019A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110534593B (en) * | 2019-08-30 | 2020-12-29 | 无锡携创新能源科技有限公司 | Processing system, processing method and application method of copper mesh for non-main-grid battery plate |
CN113299794B (en) * | 2021-05-21 | 2023-04-21 | 无锡鼎森茂科技有限公司 | Continuous manufacturing system of conductive connecting layer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106847557A (en) * | 2015-12-05 | 2017-06-13 | 佛山市欣源电子股份有限公司 | The metal grill hot pressing shaping process of capacitor core |
CN108326207A (en) * | 2018-01-25 | 2018-07-27 | 河北骄阳丝网设备有限责任公司 | Fine groove steel wire welding production line |
CN109192815A (en) * | 2018-08-31 | 2019-01-11 | 杭州瞩日能源科技有限公司 | Pressing component and laminating mechanism |
CN110534593A (en) * | 2019-08-30 | 2019-12-03 | 无锡携创新能源科技有限公司 | System of processing, processing method and the application method of dereliction grid cell piece copper mesh |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT280019B (en) * | 1967-06-16 | 1970-03-25 | Evg Entwicklung Verwert Ges | Device for shooting in the cross wires in a mesh welding machine |
US4021634A (en) * | 1975-04-02 | 1977-05-03 | Firma Evg Entwicklungs-U Verwertungsgesellschaft | Mesh welding machine |
AT402033B (en) * | 1992-02-20 | 1997-01-27 | Evg Entwicklung Verwert Ges | METHOD AND SYSTEM FOR PRODUCING REINFORCEMENT GRIDS |
JP2003069055A (en) * | 2001-06-13 | 2003-03-07 | Sharp Corp | Solar battery cell and method for manufacturing the same |
ITUD20030072A1 (en) * | 2003-03-28 | 2004-09-29 | Piegatrici Macch Elettr | MACHINE FOR REALIZING METAL NETWORKS AND RELATED METHOD OF REALIZATION. |
KR100557349B1 (en) * | 2003-10-08 | 2006-03-06 | 유재순 | Method for Manufacturing for mash with iron wire and there's Apparatus for Manutacturing |
CN204621341U (en) * | 2015-04-28 | 2015-09-09 | 芜湖市四捍钢丝网罩有限公司 | A kind of steel mesh automatic spot-welding device |
CN105171263B (en) * | 2015-10-29 | 2017-10-03 | 佛山市华德涞机器人智能科技有限公司 | A kind of automatic row's net welding equipment |
CN109604484A (en) * | 2017-10-05 | 2019-04-12 | 柳德清 | Horizontal, vertical steel wire shaping production equipment and its working method |
CN208408862U (en) * | 2018-05-17 | 2019-01-22 | 厦门帅峻智能科技有限公司 | A kind of bimodulus rotation iron wire mesh sheet automatic welding device |
CN109332401A (en) * | 2018-11-26 | 2019-02-15 | 十堰市神针工贸有限公司 | A kind of welding wire production wire-drawing frame |
-
2019
- 2019-08-30 CN CN201910813539.1A patent/CN110534593B/en active Active
-
2020
- 2020-08-25 WO PCT/CN2020/111035 patent/WO2021037019A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106847557A (en) * | 2015-12-05 | 2017-06-13 | 佛山市欣源电子股份有限公司 | The metal grill hot pressing shaping process of capacitor core |
CN108326207A (en) * | 2018-01-25 | 2018-07-27 | 河北骄阳丝网设备有限责任公司 | Fine groove steel wire welding production line |
CN109192815A (en) * | 2018-08-31 | 2019-01-11 | 杭州瞩日能源科技有限公司 | Pressing component and laminating mechanism |
CN110534593A (en) * | 2019-08-30 | 2019-12-03 | 无锡携创新能源科技有限公司 | System of processing, processing method and the application method of dereliction grid cell piece copper mesh |
Also Published As
Publication number | Publication date |
---|---|
CN110534593B (en) | 2020-12-29 |
CN110534593A (en) | 2019-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106920854B (en) | A kind of densely arranged solar cell string and preparation method and its component, system | |
US10593822B2 (en) | Main-gate-free and high-efficiency back-contact solar cell module, main-gate-free and high-efficiency back-contact solar cell assembly, and preparation process thereof | |
JP5861044B2 (en) | Solar cell module | |
WO2021037019A1 (en) | Processing system, processing method and application method for copper mesh for battery piece without main grid | |
KR102015591B1 (en) | Active backplane for thin silicon solar cells | |
JP2010225777A (en) | Method of manufacturing solar cell module | |
US20230275172A1 (en) | Manufacturing method and manufacturing apparatus for interconnection member | |
CN112404779A (en) | Solar cell string welding method, cell module and welding device | |
CN107799615B (en) | Solar cell unit, photovoltaic cell module and preparation process thereof | |
WO2021037020A1 (en) | Main-gate-free solar cell and main-gate-free solar photovoltaic module | |
CN110783429B (en) | Efficient seamless solar cell module series welding method | |
CN112786727B (en) | Composite membrane for mutual combination of main-grid-free heterojunction solar cell modules and preparation method thereof | |
JP5089456B2 (en) | Crimping apparatus and solar cell module manufacturing method | |
CN108428760B (en) | Efficient photovoltaic solder strip and manufacturing method thereof | |
WO2023016582A1 (en) | Photovoltaic cell string and manufacturing method therefor, string soldering device, and photovoltaic assembly | |
CN103066151B (en) | A kind of manufacture method of back contact solar cell string | |
CN211578765U (en) | Shingle assembly | |
WO2023103260A1 (en) | Photovoltaic cell assembly and manufacturing method therefor | |
CN114744079B (en) | Photovoltaic module manufacturing method and photovoltaic module | |
CN216958062U (en) | Back contact solar cell string, cell module and photovoltaic system | |
CA2749423C (en) | Connector for pv cells and method for its production | |
CN211125669U (en) | High-reliability crystalline silicon solar cell packaging assembly | |
EP3051595A1 (en) | Method and device for making an interconnector for solar cells and such interconnector | |
CN115763329A (en) | Battery string production equipment and production method | |
CN113921640A (en) | Series welding process for interconnection material and battery string |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20858483 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20858483 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 03/08/2022) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20858483 Country of ref document: EP Kind code of ref document: A1 |