WO2021035866A1 - 具有接地点的微波探测器及其制造方法 - Google Patents

具有接地点的微波探测器及其制造方法 Download PDF

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Publication number
WO2021035866A1
WO2021035866A1 PCT/CN2019/108378 CN2019108378W WO2021035866A1 WO 2021035866 A1 WO2021035866 A1 WO 2021035866A1 CN 2019108378 W CN2019108378 W CN 2019108378W WO 2021035866 A1 WO2021035866 A1 WO 2021035866A1
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Prior art keywords
radiation source
point
microwave detector
ground
grounding
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PCT/CN2019/108378
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English (en)
French (fr)
Inventor
邹高迪
邹新
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深圳迈睿智能科技有限公司
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Publication of WO2021035866A1 publication Critical patent/WO2021035866A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/106—Microstrip slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • the invention relates to microwave technology, in particular to a microwave detector with a grounding point and a manufacturing method thereof.
  • a microwave detector such as a 5.8G antenna, is a detector that detects the motion of objects in the corresponding space based on microwave technology.
  • the microwave detector usually includes at least a reference ground, a radiation slot, and a radiation source.
  • the radiation slot Is arranged between the radiation source and the reference ground, wherein the microwave detector is provided with a circuit (such as a microwave excitation circuit) on the side of the reference ground opposite to the radiation gap, and the radiation source is deviated from the physical center.
  • the position is provided with a feeding point, and the feeding point of the radiation source is electrically connected to the circuit of the microwave detector, so that when the circuit of the microwave detector provides an alternating current to the feeding point of the radiation source
  • the radiation source and the reference ground can interact to send and receive microwaves, which can be used to obtain the actions of objects in the corresponding space later.
  • the physical center of the radiation source is the zero potential point of the radiation source, and one of the many straight lines passing through the physical center of the radiation source is the energy balance line of the radiation source, wherein the energy of the radiation source
  • the balance line is perpendicular to the line connecting the physical center point of the radiation source and the feeding point.
  • the energy balance line of the radiation source is parallel to the long side of the radiation source and passes through The physical center of the radiation source
  • the energy balance line of the radiation source passes through the center of the circular radiation source and is perpendicular to the line connecting the center of the circle and the feeding point .
  • An object of the present invention is to provide a microwave detector with a grounding point and a manufacturing method thereof, wherein the radiation energy of the microwave detector tends to be evenly distributed, so as to reduce the loss of the microwave detector and improve the microwave detector. Therefore, the gain of the microwave detector can be enhanced.
  • An object of the present invention is to provide a microwave detector with a grounding point and a manufacturing method thereof, wherein the scattering of the radiation energy of the microwave detector is effectively reduced, so as to help reduce the high-order harmonics of the microwave detector Weight.
  • An object of the present invention is to provide a microwave detector with a grounding point and a manufacturing method thereof, wherein the quality factor of the microwave detector can be improved to facilitate control of the bandwidth of the microwave detector, so that the microwave detector The anti-interference ability of the device can be effectively improved.
  • An object of the present invention is to provide a microwave detector with a grounding point and a manufacturing method thereof, wherein the microwave detector can effectively reduce the risk of being struck by lightning, so that the microwave detector is suitable for application in an outdoor environment.
  • An object of the present invention is to provide a microwave detector with a grounding point and a method of manufacturing the same, wherein the microwave detector provides a radiation source, a reference ground, and a space between the radiation source and the reference ground.
  • a radiation slot wherein the radiation source has a central ground point, at least one left ground point on the left side of the central ground point and at least one right ground point on the right side of the central ground point, these ground points.
  • An object of the present invention is to provide a microwave detector with a ground point and a manufacturing method thereof, wherein the left ground point, the center ground point, and the right ground point are along the energy balance line of the radiation source Distribution to effectively reduce the scattering of radiant energy and avoid the appearance of clutter.
  • the left ground point and the right ground point are symmetrical with respect to the central ground point, so that the radiation energy can tend to be evenly distributed to the radiation source, so as to effectively reduce the microwave detector The loss of the microwave detector and the improvement of the transceiver efficiency of the microwave detector.
  • An object of the present invention is to provide a microwave detector with a grounding point and a manufacturing method thereof, wherein one of the left ground points is located at the left edge of the radiation source, and one of the right ground points is located at the radiation source This is beneficial to reduce the bandwidth of the microwave detector and improve the anti-interference ability of the microwave detector.
  • the present invention provides a microwave detector with a grounding point, which includes:
  • An excitation circuit configured to provide an alternating signal
  • a radiation source wherein the radiation source is held on one side of the reference ground at intervals in a manner parallel to the reference ground, wherein the radiation gap is formed between the reference ground and the radiation source ,
  • the radiation source has a feeding point, wherein the feeding point is deviated from the physical center point of the radiation source, wherein the feeding point of the radiation source is electrically connected to the excitation circuit, wherein
  • the radiation originates from the feed point having an energy balance line under the excitation of the alternating signal of the excitation circuit, and the energy balance line translates in directions close to and away from the feed point, respectively.
  • An energy balance zone defined by the radiation source wherein the feed point is located outside the energy balance zone at the radiation source, and the energy balance line is a physical path on the radiation source that passes through the radiation source
  • the center point is perpendicular to the line connecting the physical center point of the radiation source and the feed point, wherein the energy balance belt is aligned with the physical center point of the radiation source and the feed point along the direction of the energy balance line.
  • Two ends of the energy balance belt are formed on the two sides of the line connecting the electrical points, and at least one of the ends of the energy balance belt is grounded.
  • one of the ends of the energy balance belt having the radiation source has at least one ground point electrically connected to the reference ground to allow the radiation to be sourced from the reference ground.
  • the end of the energy balance belt is grounded by the conductive connection between the ground point and the reference ground.
  • At least one of the grounding points is located on the energy balance line of the radiation source.
  • the grounding points are arranged in pairs, and the grounding points arranged in pairs are symmetrically distributed on the energy balance belt of the radiation source along the energy balance line.
  • the other end of the energy balance belt has at least one ground point electrically connected to the reference ground, so as to allow the radiation to originate from
  • the two ends of the energy balance belt are respectively grounded through the conductive connection between the ground point and the reference ground.
  • each of the grounding points is located on the energy balance line of the radiation source.
  • the energy balance band of the source is symmetrically distributed along the energy balance line.
  • At least one of the grounding points located at one of the ends of the energy balance belt is connected to the connection line between the physical center point of the radiation source and the feeding point.
  • the ground point of the other end of the energy balance belt is symmetrical.
  • the grounding point is located at the side edge of the radiation source at the corresponding end of the energy balance belt.
  • the physical center point of the radiation source from the radiation source has a central ground point that is conductively connected to the reference ground, so as to allow the radiation source to originate from the physical center of the radiation source.
  • the center point is grounded by the conductive connection between the center ground point and the reference ground.
  • the physical center point of the radiation source from the radiation source has at least one central ground point electrically conductively connected to the reference ground, so as to allow the radiation source to originate from the radiation source.
  • the physical center point is grounded by the conductive connection between the center ground point and the reference ground.
  • the microwave detector further includes a base board, wherein the reference ground is mounted on one side of the base board so as to be kept flat by the base board, wherein the excitation The circuit is arranged on the opposite side of the base board to the side where the reference ground is attached.
  • the microwave detector further includes a shielding cover, wherein the shielding cover is arranged on the base board in a manner of covering the excitation circuit.
  • the present invention further provides a manufacturing method of a microwave detector, wherein the manufacturing method includes the following steps:
  • the manufacturing method further includes the step of: (d) arranging a shielding cover on the lower substrate of the lower plate assembly in a manner of covering the excitation circuit.
  • the conducting element and each of the grounding elements are formed by a metallization via process.
  • the present invention further provides a manufacturing method of a microwave detector, wherein the manufacturing method includes the following steps:
  • (C) A conductive element formed from a position deviated from the physical center of the upper etching plate to and connected to an excitation circuit located on the lower surface of the plate body, extending from the upper etching plate At least three grounding elements connected to and connected to the lower side etching plate to make the microwave detector, wherein the upper side etching plate forms a radiation source of the microwave detector, and the plate body forms the A radiation gap of the microwave detector, the lower side etching plate forms a reference ground of the microwave detector, and the position of the upper side etching plate for connecting the conductive element forms a part of the radiation source Feeding point, the position of the upper etching board for connecting each of the grounding elements respectively forms each grounding point of the radiation source, and one of the grounding points is located at the zero potential point of the radiation source.
  • a central ground point is formed, at least one of the ground points is located to the left of the zero potential point of the radiation source to form at least one left ground point, and at least one of the ground points is located to the right of the zero potential point of the radiation source At least one right ground point is formed on the side.
  • the step (B) is before the step (A), so that the lower metal plate is etched first to form the lower etched plate, and then the lower etched plate is formed.
  • the upper metal plate forms the upper etching plate.
  • the driving circuit is formed by the lower metal plate. At least part of it.
  • the conducting element and each of the grounding elements are formed by a metallization via process.
  • the manufacturing method further includes the step of: (D) arranging a shielding cover on the reference ground in a manner of covering the excitation circuit.
  • FIG. 1 is a three-dimensional schematic diagram of one of the manufacturing steps of a microwave detector according to a preferred embodiment of the present invention.
  • Fig. 2 is a three-dimensional schematic diagram of the second manufacturing step of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • 3A and 3B are three-dimensional schematic diagrams of different viewing angles in the third manufacturing step of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 4 is a three-dimensional schematic diagram of the fourth step of manufacturing the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • Fig. 5 is a three-dimensional schematic diagram of the fifth manufacturing step of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • Fig. 6 is a three-dimensional schematic diagram of the sixth manufacturing step of the microwave detector according to the above preferred embodiment of the present invention, which illustrates the three-dimensional state of the microwave detector.
  • Fig. 7A is a schematic cross-sectional view taken along the line A-A of Fig. 6, which illustrates a cross-sectional state of the microwave detector at a cross-sectional position.
  • Fig. 7B is a schematic cross-sectional view taken along the line B-B of Fig. 6, which illustrates the cross-sectional state of the microwave detector at another cross-sectional position.
  • Fig. 8A is a parameter test diagram of a microwave detector with only a central ground point.
  • Fig. 8B is a parameter test diagram of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • Fig. 9 is a three-dimensional schematic diagram of a modified implementation of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • Fig. 10 is a three-dimensional schematic diagram of a modified implementation of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 11 is a three-dimensional schematic diagram of one of the manufacturing steps of a microwave detector according to a preferred embodiment of the present invention.
  • 12A and 12B are three-dimensional schematic diagrams of different viewing angles in the second manufacturing step of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 13 is a three-dimensional schematic diagram of different viewing angles in the fourth manufacturing step of the microwave detector according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 14 is a three-dimensional schematic diagram of the fifth manufacturing step of the microwave detector according to the above preferred embodiment of the present invention, which illustrates the three-dimensional state of the microwave detector.
  • Fig. 15A is a schematic cross-sectional view taken along the line A'-A' of Fig. 14, which illustrates a cross-sectional state of the microwave detector at a cross-sectional position.
  • Fig. 15B is a schematic cross-sectional view taken along the line B'-B' of Fig. 14, which illustrates the cross-sectional state of the microwave detector at another cross-sectional position.
  • the term “a” should be understood as “at least one” or “one or more”, that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element The number can be more than one, and the term “one” cannot be understood as a restriction on the number.
  • a microwave detector according to a preferred embodiment of the present invention is disclosed and explained in the following description, wherein the microwave detector includes a radiation The source 10, a reference ground 20 and a radiation slot 30.
  • the radiation source 10 has an upper surface 11 of the radiation source, a lower surface 12 of the radiation source corresponding to the upper surface 11 of the radiation source, and a feeding point 13.
  • the reference ground 20 has a reference ground surface 21 and a reference underground surface 22 corresponding to the reference ground surface 21.
  • the radiation source 10 is arranged at intervals on one side of the reference ground 20 in such a manner that the upper surface 11 of the radiation source of the radiation source 10 and the upper surface 21 of the reference ground 20 are parallel to each other, and
  • the radiation gap 30 is arranged between the radiation source 10 and the reference ground 20 of the radiation source 10.
  • the microwave detector further includes an excitation circuit 40, wherein the feeding point 13 of the radiation source 10 is electrically connected to the excitation circuit 40, wherein the excitation circuit 40 can transfer the alternating electrical signal from the The feeding point 13 of the radiation source 10 is provided to the radiation source 10, so that the radiation energy is distributed to the radiation source 10. At this time, the radiation source 10 and the reference ground 20 can interact to make the radiation The microwave detector sends and receives microwaves.
  • the feed point 13 of the radiation source 10 deviates from the zero potential point (physical center point) of the radiation source 10, so that the feed point 13 of the radiation source 10 from the excitation circuit 40 is
  • the electrical point 13 provides an alternating electrical signal
  • the radiation energy can be distributed to the radiation source 10 so that the radiation source 10 and the reference ground 20 interact to enable the microwave detector to receive and transmit microwaves.
  • the radiation source 10 has an energy balance band at the feeding point 13 under the excitation of the alternating signal of the excitation circuit 40, wherein the energy balance band is the radiation source 10 at the feeding point.
  • the electric point 13 is excited by the alternating signal of the excitation circuit 40, and the area on the radiation source 10 that has zero potential and tends to zero potential.
  • the energy balance zone is the area of the radiation source 10
  • the energy balance line translates in the direction close to and away from the feeding point 13 and in the area defined by the radiation source 10, that is to say, the energy balance belt is close to and away from the energy balance line respectively.
  • the direction of the feeding point 13 is equidistantly translated with two translation lines as the boundary, and the energy balance zone defined by the radiation source 10 is symmetrical about the energy balance line, and the feeding point 13 is at the energy Outside the balance zone.
  • the two sides of the energy balance belt bounded by the physical center point of the radiation source 10 and the feed point 13 along the direction of the energy balance line form the two ends of the energy balance belt , That is, the two ends of the energy balance belt are areas on both sides bounded by the physical center point of the radiation source 10 and the line connecting the feeding point 13, wherein the radiation source 10 is At least one of the ends of the energy balance belt is grounded, and at least one ground point 14 is formed on the end, so as to extend from the ground point 14 along the physical center point of the radiation source 10 and the feeding point 13 equalizes the energy distribution of the radiation source 10 in the connection direction, that is, reduces the corresponding amount of the radiation source 10 by grounding the radiation source 10 at the end of the energy balance belt.
  • the energy concentration degree of the end area can reduce the energy concentration degree of the rectangular radiation source 10 in the corner area corresponding to the end portion, and then Reducing the high-order harmonic components of the microwave detector is conducive to reducing the loss of the microwave detector and improving the transmission and reception efficiency of the microwave detector, so that the gain of the microwave detector can be enhanced while reducing all the components.
  • the high-order harmonic components of the microwave detector are also beneficial to reduce the interference caused by the microwave detector to other microwave devices.
  • the feeding point 13 of the radiation source 10 deviates from the physical center point of the radiation source 10, the zero-crossing point of the alternating electrical signal provided from the feeding point 13 deviates from the radiation source
  • the energy balance line of 10 causes uneven energy distribution on the radiation source 10 when an alternating electrical signal is provided from the feed point 13, especially the energy balance zone corresponding to the radiation source 10
  • the end region of the radiation source 10 is grounded to at least one of the ends of the energy balance belt, and the radiation source 10 corresponding to the energy balance belt can be balanced. The energy distribution of the end region.
  • the radiation source 10 when the radiation source 10 is grounded at the two ends of the energy balance belt, and at least one ground point 14 is formed at the two ends, the radiation source 10 is The energy distribution of the ground point 14 along the connection direction between the physical center point of the radiation source 10 and the feed point 13 is equalized, so that the area of the radiation source 10 corresponding to the energy balance zone The energy concentration degree of the radiation source 10 is reduced, that is, the energy concentration degree of the radiation source 10 on the two sides bounded by the physical center point of the radiation source 10 and the feed point 13 is reduced, which is beneficial to further Reduce the high-order harmonic components of the microwave detector.
  • the radiation source 10 is preferably arranged on at least one of the ends of the energy balance belt to be grounded at a position close to the energy balance line, that is, the ground point 14 is preferably Approaching the energy balance line, for example, the ground point 14 is directly formed on the energy balance line.
  • the ground point 14 is at zero potential or tends to zero potential, which is beneficial to the radiation source 10
  • a pair of ground points 14 distributed symmetrically along an energy balance line is equivalent to the ground points 14 formed on the energy balance line on the line of the pair of ground points 14, so when the radiation source 10 is formed with a plurality of ground points 14 deviating from the energy balance line at one end of the energy balance belt, preferably, the ground points 14 are symmetrically distributed in pairs. The two sides of the energy balance line.
  • the radiation source 10 is respectively formed with the grounding points 14 at the two ends of the energy balance belt
  • the radiation source 10 is located at one of the ends of the energy balance belt.
  • the grounding point 14 is symmetrical or equivalently symmetrical with the grounding point at the other end of the energy balance belt by the connection line between the physical center point of the radiation source 10 and the feeding point 13, such as
  • the ground point 14 at one of the ends of the energy balance belt is equivalently formed as an equivalent ground point
  • the ground point 14 at the other end of the energy balance belt is equivalently formed
  • the two equivalent ground points are preferably symmetrically distributed along the line connecting the physical center point of the radiation source 10 and the feeding point 13, so that the radiation source 10 corresponds to each other.
  • the energy of the two end regions of the energy balance belt is evenly and symmetrically distributed on the connection line between the physical center point of the radiation source 10 and the feeding point 13, which is beneficial for the radiation source 10 to be distributed in all areas.
  • the balanced distribution of energy in the direction of the energy balance line is further conducive to reducing the high-order harmonic components of the microwave detector.
  • the impedance between the radiation source 10 and the reference ground 20 can also be reduced, thereby increasing
  • the quality factor of the microwave detector is beneficial to control the bandwidth of the microwave detector, so that the anti-interference ability of the microwave detector can be effectively improved.
  • the wavelength of the microwave emitted by the microwave detector is ⁇ , wherein the ground point 14 at the corresponding end of the energy balance belt is in contact with the radiation source 10 along the direction of the energy balance line.
  • the distance between the central point and the line connecting the feeding point 13 is greater than or equal to ⁇ /16, so as to facilitate the balanced distribution of energy at the corresponding end of the radiation source 10.
  • the energy balance line has the shortest distance between the physical center point of the radiation source 10 and the feeding point 13, so when the radiation source 10 is further than the physical center of the radiation source 10
  • the impedance between the radiation source 10 and the reference ground 20 can be further greatly reduced, that is, the radiation source 10 is grounded at at least one of the ends of the energy balance belt.
  • the impedance between the radiation source 10 and the reference ground 20 can be reduced to a greater extent, so that the impedance between the radiation source 10 and the reference ground 20 can be reduced to a greater extent.
  • the anti-interference ability of the microwave detector is improved to a great extent.
  • the radiation source 10 has a central ground point 14C, at least one left ground point 14L, and at least one right ground point 14R,
  • the position of the zero potential point of the radiation source 10 is grounded so that the radiation source 10 is formed with the central ground point 14C, and one of the energy balance belts on the side of the zero potential point of the radiation source 10 At least one position of the end portion is grounded so that the radiation source 10 is formed with at least one left ground point 14L.
  • the energy balance of the radiation source 10 on the other side of the zero potential point At least one position of the other end of the belt is grounded so that the radiation source 10 is formed with at least one right ground point 14R.
  • the excitation circuit 40 transfers the alternating electrical signal from the radiation source 10 After the feeding point 13 is provided to the radiation source 10, the radiation energy tends to be evenly distributed in the radiation source 10, so that the loss of the microwave detector can be effectively reduced and the transmission and reception of the microwave detector Efficiency can be effectively improved.
  • the left ground point 14L and the right ground point 14R of the radiation source 10 are symmetrical to each other, so that the radiation energy can be evenly distributed on the left and right sides of the radiation source 10 to reduce The loss of the microwave detector and the improvement of the transceiver efficiency of the microwave detector, so that the gain of the microwave detector can be enhanced.
  • the left ground point 14L, the center ground point 14C, and the right side of the radiation source 10 are distributed along the energy balance line of the radiation source 10 to be able to effectively reduce the scattering of radiated energy and avoid the appearance of clutter.
  • the radiation source 10 has a left ground point 14L and a right ground point 14R, wherein The left ground point 14L is located at the left edge of the radiation source 10, and the right ground point 14R is located at the right edge of the radiation source 10.
  • the bandwidth of the microwave detector can be reduced. Effectively improve the anti-interference ability of the microwave detector.
  • FIG. 8A shows a parameter test chart of a microwave detector with only a central ground point
  • FIG. 8B shows the present invention with the central ground point 14C, one of the left ground points 14L and A parameter test chart of the microwave detector at the right ground point 14R, where the abscissa x in the parameter test chart represents the oscillation frequency of the microwave detector, and the ordinate y in the parameter test chart represents the gain of the microwave detector ,
  • the curve is the microwave sent and received by the microwave detector. Comparing Fig. 8A and Fig.
  • the gain (-22.4614R) of the microwave detector of the present invention when the oscillation frequency is 5.9500 GHz is significantly higher than only The gain (-14C.8849) when the oscillation frequency of the microwave detector with a central ground point is 5.9000GHz;
  • the oscillation frequency of the microwave detector of the present invention is 5.9500GHz
  • the bandwidth when the microwave detector only has a central ground point is significantly smaller than the bandwidth when the oscillation frequency of the microwave detector is 5.9000 GHz, so that the anti-interference ability of the microwave detector of the present invention is significantly stronger than that of the microwave detector with only a central ground point. Anti-interference ability of microwave detectors.
  • the microwave detector further includes a base plate 50 having a base plate upper surface 51 and a base plate lower surface 52 corresponding to the base plate upper surface 51 , wherein the reference underground surface 22 of the reference ground 20 is mounted on the upper surface 51 of the base board 50 of the base board 50 to allow the base board 50 to ensure the flatness of the reference ground 20.
  • the excitation circuit 40 is formed on the lower surface 52 of the base board 50 to allow the base board 50 to isolate the reference ground 20 and the excitation circuit 40.
  • the microwave detector further includes a shielding cover 60, the shielding cover 60 has a shielding space 61, wherein the shielding cover 60 is arranged to cover the excitation circuit 40 On the bottom surface 52 of the base plate 50 to allow the excitation circuit 40 to be held in the shield space 61 of the shield cover 60, so that the shield cover 60 can prevent the excitation circuit 40
  • the microwaves transmitted and received with the microwave detector interfere with each other.
  • the top-view shape of the radiation source 10 is a square (especially a rectangle) as an example to disclose the microwave of the present invention.
  • the content and characteristics of the detector but those skilled in the art should connect that the microwave detector with the radiation source 10 with a square radiation shape shown in FIGS. 1 to 7B is only an example, and it does not It should not be regarded as a limitation on the content and scope of the microwave detector of the present invention.
  • the top-view shape of the radiation source 10 of the microwave detector may be, but not limited to, a circle.
  • the present invention further provides a manufacturing method of the microwave detector, wherein the manufacturing method includes the step S1: providing an upper plate assembly 100, wherein the upper plate assembly 100 includes an upper substrate 101 and a first metal plate 102.
  • the upper substrate 101 has a first attachment surface 1011 and a mounting surface 1012 corresponding to the first attachment surface 1011.
  • the first metal plate 102 It is attached to the first attachment surface 101 of the upper substrate 101 so that the upper substrate 101 and the first metal plate 102 of the upper plate assembly 100 form a laminated structure, refer to FIG. 1.
  • the type of the upper substrate 101 of the upper plate assembly 100 is not limited in the manufacturing method of the present invention.
  • the type of the upper substrate 101 may be, but not limited to, a phenolic paper substrate, Composite substrate, glass fiber substrate.
  • the type of the first metal plate 102 of the upper plate assembly 100 is not limited in the manufacturing method of the present invention.
  • the first metal plate 102 of the upper plate assembly 100 may be but not Limited to copper plates.
  • the upper board assembly 100 may be a single-sided copper-clad assembly.
  • both opposite sides of the upper substrate 101 are coated with copper, so as to be attached to the upper substrate during the process of manufacturing the microwave detector.
  • the copper plate on one side surface of the upper substrate 101 is removed to expose the side surface of the upper substrate 101 so that the side surface of the upper substrate 101 forms the mounting surface 1012 of the upper substrate 101, and is attached to the upper substrate 101 accordingly.
  • the copper plate on the other side of the upper substrate 101 is not removed to form the first metal plate 102, and the side surface of the upper substrate 101 for attaching the first metal plate 102 forms all of the upper substrate 101 The first attachment surface 1011.
  • the manufacturing method further includes step S2: providing a lower plate assembly 200, wherein the lower plate assembly 200 includes a lower substrate 201, a second metal plate 202, and a third metal plate 203.
  • the lower substrate 201 has a second attachment surface 2011 and a third attachment surface 2012 corresponding to the second attachment surface 2011, and the second metal plate 202 is attached to the second attachment surface 2011 of the lower substrate 201,
  • the third metal plate 203 is attached to the third attachment surface 2012 of the lower substrate 201 so that the second metal plate 202 of the lower plate assembly 200, the lower substrate 201 and the first The three metal plates 203 form a laminated structure.
  • the type of the lower substrate 201 of the lower plate assembly 200 is not limited in the manufacturing method of the present invention.
  • the type of the lower substrate 201 may be, but not limited to, a phenolic paper substrate, Composite substrate, glass fiber substrate.
  • the types of the second metal plate 202 and the third metal plate 203 of the lower plate assembly 200 are not limited in the manufacturing method of the present invention, for example, the second metal plate 202 and the The third metal plate 203 may be, but is not limited to, a copper plate.
  • the lower board assembly 200 may be a double-sided copper-clad assembly.
  • the manufacturing method further includes step S3: etching the second metal plate 202 of the lower plate assembly 200 to allow the second metal plate 202 to form a gap 2021, and etching the The third metal plate 203 of the lower plate assembly 200 allows the third metal plate 203 to form the excitation circuit 40 or form a part of the excitation circuit 40.
  • the middle of the third metal plate 203 is etched to form at least a part of the excitation circuit 40 in the middle of the third metal plate 203.
  • the second metal plate 202 and the third metal plate 203 of the lower plate assembly 200 can be simultaneously etched to make the The second metal plate 202 forms the notch 2021 and the third metal plate 203 forms the excitation circuit 40 or a part of the excitation circuit 40.
  • the etching order of the second metal plate 202 and the third metal plate 203 of the lower plate assembly 200 can be selected, for example, etching first
  • the second metal plate 202 makes the second metal plate 202 form the notch 2021, and then the third metal plate 203 is etched so that the third metal plate 203 forms the excitation circuit 40 or the excitation Part of the circuit 40, or firstly etch the third metal plate 203 so that the third metal plate 203 forms the driver circuit 40 or a part of the driver circuit 40, and then etch the second metal plate 202 to make The second metal plate 202 forms the gap 2021.
  • the manufacturing method includes step S3': etching the second metal plate 202 of the lower plate assembly 200 to allow the second metal plate 202 forms the notch 2021, and etches the third metal plate 203 to allow the third metal plate 203 to form at least one wiring space so that the driver circuit 40 can be formed in the wiring space later.
  • the driver circuit 40 can be formed in the wiring space by means of a printed circuit.
  • the manufacturing method further includes step S4: attaching the mounting surface 1012 of the upper substrate 101 of the upper plate assembly 100 to the second metal plate of the lower plate assembly 200
  • the upper board assembly 100 is attached to the lower board assembly 200 in a 202 manner.
  • the upper substrate 101 of the upper plate assembly 100 and the second metal plate 202 of the lower plate assembly 200 are attached and fixed to each other, so as to avoid the upper plate assembly 100 and the lower plate assembly.
  • the board assemblies 200 are separated from each other.
  • the method of attaching and fixing the upper substrate 101 of the upper plate assembly 100 and the second metal plate 202 of the lower plate assembly 200 to each other is different in the manufacturing method of the present invention.
  • glue can be applied to the pasting of the upper substrate 101 first.
  • the mounting surface 1012 and/or the exposed surface of the second metal plate 202 are attached to the mounting surface 1012 of the upper substrate 101 and the second metal plate 202, and then the upper plate is cured after the glue is cured
  • the upper substrate 101 of the assembly 100 and the second metal plate 202 of the lower plate assembly 200 are attached and fixed to each other.
  • the manufacturing method further includes step S5: forming an upper end portion at the position of the notch 2021 of the second metal plate 202 through the upper substrate 101 to be conductively connected by a metalized via process A conductive element 70 passing through the lower substrate 201 at the first metal plate 102 and the lower end portion to be conductively connected to the driving circuit 40, and a conductive element 70 that penetrates the upper substrate 101 to be conductively connected At least three grounding elements 80 of the first metal plate 102 and the second metal plate 202.
  • the upper end of the conduction element 70 of the microwave detector extends upward to be conductively connected to the first metal plate 102 after passing through the upper substrate 101, and the conduction element 70
  • the lower end portion of the second metal plate 202 extends downward to be conductively connected to the excitation circuit 40 after passing through the lower substrate 201, and the notch 2021 formed by the second metal plate 202 is used to prevent the conductive element 70 and the second metal plate 202 are connected, so that after the microwave detector is manufactured, the first metal plate 102 is allowed to form the radiation source 10 and the upper substrate 101 forms the After the radiation gap 30, the second metal plate 202 form the reference ground 20, and the lower substrate 201 form the base plate 50, the connection position of the conductive element 70 and the first metal plate 102 is formed.
  • the feeding point 13 of the radiation source 10 so that the conducting element 70 is conductively connected to the feeding point 13 of the radiation source 10 and the excitation circuit 40.
  • grounding elements 80 is a central grounding element 80a, and at least one of the grounding elements 80 is at least one left-side grounding element 80b. Accordingly, these grounding elements 80 are At least one of the grounding elements 80 is at least one right grounding element 80c.
  • the central ground element 80a is conductively connected to the first metal plate 102 and the second metal plate 202 after passing through the upper substrate 101 at the physical center of the first metal plate 102, and the left side
  • the ground element 80b is conductively connected to the first metal plate 102 and the second metal plate 202 on the left side of the first metal plate 102 after passing through the upper substrate 101, and the right ground element 80c On the right side of the first metal plate 102, after passing through the upper substrate 101, the first metal plate 102 and the second metal plate 202 are conductively connected, so that in the following, the microwave detector After being manufactured, the first metal plate 102 is allowed to form the radiation source 10, the upper substrate 101 forms the radiation gap 30, and the second metal plate 202 forms the reference ground 20 and the lower substrate 201 After the base plate 50 is formed, the center ground element 80a, the left ground element 80b, and the right ground element 80c of the microwave detector are conductively connected to the radiation source 10 and the reference ground 20 so that the radiation source 10 is grounded, and the connection position
  • the shielding cover 60 is fixedly mounted on the lower substrate 201 in a manner that the shielding cover 60 covers the excitation circuit 40 to make the microwave detector.
  • the manufacturing method of the present invention includes the following steps:
  • the first metal plate 102 formed from the upper plate assembly 100 extends through the notch 2021 of the second metal plate 202 to and is connected to the conduction element 70 of the excitation circuit 40 , At least three of the grounding elements 80 extending from the first metal plate 102 to and connected to the second metal plate 202 to make the microwave detector, wherein the first metal plate 102 forms The radiation source 10 of the microwave detector, the upper substrate 101 forms the radiation gap 30 of the microwave detector, and the second metal plate 202 forms the reference ground 20 of the microwave detector,
  • the position of the first metal plate 102 for connecting the conductive element 80 forms the feeding point 13 of the radiation source 10, and the position of the first metal plate 102 is used for connecting each of the ground elements
  • the positions of 80 respectively form each ground point of the radiation source 10, wherein one of the ground points is located at the zero potential point of the radiation source 10 to form the central ground point 14C, and at least one of the ground points is located in the The left side of the zero potential point of the radiation source 10 forms at least one of the left ground points
  • the manufacturing method further includes the step of: (d) arranging the shielding cover 60 on the lower substrate 201 of the lower plate assembly 200 in a manner of covering the excitation circuit 40.
  • Fig. 9 shows a modified example of the microwave detector of the present invention, which is different from the microwave detector shown in Figs. 1 to 7B in that the microwave detector shown in Fig. 9
  • the number of the left ground point 14L and the right ground point 14R of the radiation source 10 are both two, and the two left ground points 14L and the center ground point 14L 14C and the two right grounding points 14R are both distributed on the energy balance line of the radiation source 10, and the left grounding point 14L and the right grounding point 14R are symmetrical with respect to the central grounding point 14C.
  • the two left grounding points 14L are respectively named a first left grounding point 14La and a second left grounding point 14Lb
  • the two right grounding points 14R are respectively Named as a first right ground point 14Ra and a second right ground point 14Rb, wherein the first left ground point 14La, the second left ground point 14Lb, the central ground point 14C, and the The second right ground point 14Rb and the first right ground point 14Ra are distributed on the energy balance line of the radiation source 10, and the first left ground point 14La and the first right ground point 14Ra They are symmetrical with respect to the central ground point 14C, and the second left ground point 14Lb and the second right ground point 14Rb are symmetrical to each other corresponding to the central ground point 14C.
  • the first left ground point 14La, the second left ground point 14Lb, the center ground point 14C, the second right ground point 14Rb, and the first right ground point 14Ra are balanced
  • the ground is formed on the energy balance line of the radiation source 10, so that the first left ground point 14La, the second left ground point 14Lb, the central ground point 14C, and the second right ground point
  • the distance between 14Rb and any adjacent grounding point in the first right grounding point 14Ra is equal.
  • Fig. 10 shows a modified example of the microwave detector of the present invention.
  • the microwave detector shown in Fig. 10 In this preferred example, the number of the left ground point 14L and the right ground point 14R of the radiation source 10 are both two, so that the left ground point 14L of the radiation source 10 and The right ground points 14R respectively appear in pairs, wherein the two left ground points 14L are symmetrical with respect to the energy balance line of the radiation source 10, and the two right ground points 14R are symmetrical with respect to the radiation source.
  • the energy balance line of 10 is symmetrical, and the two left ground points 14L and the two right ground points 14R are symmetrical with respect to the central ground point 14C.
  • the two left ground points 14L are named as a left first ground point 14LA and a left second ground point 14LB
  • the two right ground points 14R are named Is a right first ground point 14RA and a right second ground point 14RB, wherein the left first ground point 14LA and the left second ground point 14LB are relative to the energy balance line of the radiation source 10
  • the right first ground point 14RA and the right second ground point 14RB are symmetrical with respect to the energy balance line of the radiation source 10
  • the left first ground point 14LA and the right second ground point 14LA are symmetrical.
  • a ground point 14RA is symmetrical with respect to the central ground point 14C
  • the left second ground point 14LB and the right second ground point 14RB are symmetrical with respect to the central ground point 14C.
  • a microwave detector according to another preferred embodiment of the present invention is disclosed and illustrated in the following description, wherein the microwave detector includes a The radiation source 10', a reference ground 20' and a radiation gap 30'.
  • the radiation source 10' has a radiation source upper surface 11', a radiation source lower surface 12' corresponding to the radiation source upper surface 11', and a feeding point 13'.
  • the reference ground 20' has a reference ground surface 21' and a reference underground surface 22' corresponding to the reference ground surface 21'.
  • the radiation source 10' is arranged on the reference ground 20' in such a manner that the upper surface 11' of the radiation source of the radiation source 10' and the upper surface 21' of the reference ground 20' are parallel to each other And the radiation gap 30' is formed between the radiation source 10' and the reference ground 20'.
  • top-view shape of the radiation source 10' of the microwave detector shown in FIG. 11 to FIG. 15B is a square (especially a rectangle), the other parts of the microwave detector In a possible example, the top-view shape of the radiation source 10' may also be, but not limited to, a circle.
  • the microwave detector further includes an excitation circuit 40', wherein the feeding point 13' of the radiation source 10' is electrically connected to the excitation circuit 40', wherein the excitation circuit 40' can convert alternating current
  • the electrical signal is provided from the feeding point 13' of the radiation source 10' to the radiation source 10', so that the radiation energy is distributed to the radiation source 10'.
  • the radiation source 10' and the radiation source 10' The reference ground 20' can interact with each other to enable the microwave detector to send and receive microwaves.
  • the radiation source 10' has a central ground point 14C', at least one left ground point 14L', and at least one right connection point.
  • Location 14R' where the zero potential point (physical center) of the radiation source 10' is grounded so that the radiation source 10' forms the central ground point 14C', and the radiation source 10' is located at zero potential At least one position on the left side of the point is grounded so that the radiation source 10' is formed with at least one left ground point 14L'.
  • the radiation source 10' is grounded so that the radiation source 10' is formed with at least one of the right ground points 14R'.
  • the alternating electric signal is transmitted from the excitation circuit 40'.
  • the radiation energy tends to be evenly distributed in the radiation source 10', so the loss of the microwave detector can be effectively reduced
  • the transceiving efficiency with the microwave detector can be effectively improved.
  • the left ground point 14L' and the right ground point 14R' of the radiation source 10' are symmetrical to each other, so that the radiation energy can be evenly distributed on the left and right sides of the radiation source 10' , In order to reduce the loss of the microwave detector and improve the transmission and reception efficiency of the microwave detector, so that the gain of the microwave detector can be enhanced.
  • the left ground point 14L', the center ground point 14C', and the radiation source 10' is distributed along the energy balance line of the radiation source 10', so as to effectively reduce the scattering of radiation energy and avoid the appearance of clutter.
  • the radiation source 10' has one left ground point 14L' and one right ground point 14R ', wherein the left ground point 14L' is located at the left edge of the radiation source 10', and the right ground point 14R' is located at the right edge of the radiation source 10', thus reducing the microwave
  • the bandwidth of the detector can effectively improve the anti-interference ability of the microwave detector.
  • the microwave detector further includes a shielding cover 60', the shielding cover 60' has a shielding space 61', wherein the shielding cover 60' is used to cover the excitation circuit 40 'Is set on the reference underground surface 22' of the reference ground 20' to allow the excitation circuit 40' to be held in the shielding space 61' of the shielding cover 60', so that the shielding The cover 60' can prevent the microwaves transmitted and received by the excitation circuit 40' and the microwave detector from interfering with each other.
  • the present invention further provides a manufacturing method of the microwave detector, wherein the manufacturing method includes the step S1: providing a plate assembly 300', wherein the plate assembly 300' includes a plate body 301', an upper metal plate 302', and a lower metal plate 303'.
  • the plate body 301' has an upper surface 3011' and a lower side corresponding to the upper surface 3011' Surface 3012', the upper metal plate 302' is attached to the upper surface 3011' of the plate body 301', and the lower metal plate 303' is attached to all of the plate body 301' With respect to the lower surface 3012', the upper metal plate 302', the plate body 301' and the lower metal plate 303' form a laminated structure, refer to FIG. 11.
  • the type of the board body 301' of the board assembly 300' is not limited in the manufacturing method of the present invention.
  • the type of the board body 301' may be but not limited to phenolic paper.
  • the types of the upper metal plate 302' and the lower metal plate 303' of the plate assembly 300' are not limited in the manufacturing method of the present invention.
  • the type of the plate assembly 300' The upper metal plate 302' and the lower metal plate 303' may be but not limited to copper plates.
  • the sheet component 300' may be a single-sided copper-clad component.
  • the manufacturing method further includes step S2: etching the upper metal plate 302' to allow a part of the upper metal plate 302' to form an upper etching plate 304', and etching the lower
  • the side metal plate 303' allows a part of the lower metal plate 303' to form a lower side etching plate 305' and the driving circuit 40'.
  • etching the upper metal plate 302' and etching the lower metal plate 303' is not limited in the manufacturing method of the present invention, for example, in the manufacturing method of the present invention.
  • etching the upper metal plate 302' and etching the lower metal plate 303' at the same time allows a part of the upper metal plate 302' to form the upper etching plate 304', and A part of the lower metal plate 303' is allowed to form the lower etching plate 305' and the driving circuit 40'.
  • one of the upper metal plate 302' and the lower metal plate 303' is selectively etched first, and then the upper metal plate is etched. The other metal plate of the side metal plate 302' and the lower metal plate 303'.
  • the peripheral edge portion of the lower metal plate 303' forms the lower etching plate 305'
  • the lower side etching plate 305' is in the projection of the projection surface.
  • one side of the lower metal plate 303' forms the lower etching plate 305'
  • the other side of the lower metal plate 303' forms the excitation circuit 40', and is parallel to In the projection surface of the plate body 301 ′, the projection of the upper etching plate 304 ′ on the projection surface is included in the projection of the lower etching plate 305 ′ on the projection surface.
  • the manufacturing method further includes step S3: forming an upper end through the plate body 301' through a metallization via process to be conductively connected to the upper etching plate 304' and a lower end through
  • the plate body 301' is conductively connected to a conductive element 70' of the excitation circuit 40', and is formed to penetrate through the plate body 301' to conductively connect the upper etching plate 304' and At least three grounding elements 80' of the lower side etching plate 305'.
  • the upper end of the conducting element 70' extends upward to be conductively connected to the upper etching plate 304' and the lower end of the conducting element 70' after passing through the plate body 301' Extend downward to be conductively connected to the lower etching plate 305' after passing through the plate body 301', so that after the microwave detector is manufactured, the upper etching plate 304 is allowed After'forming the radiation source 10', the plate body 301' forming the radiation gap 30', and the lower etching plate 305' forming the reference ground 20', the conducting element 70' is connected to the ground Connect the radiation source 10' and the excitation circuit 40', wherein the connection position of the conductive element 70' and the upper etching plate 304' forms the feeding point 13' of the radiation source 10' .
  • ground elements 80' is a central ground element 80a', and at least one of the ground elements 80' is at least one left ground element 80b' Correspondingly, at least one of the grounding elements 80' is at least one right grounding element 80c'.
  • the physical center of the central ground element 80a' on the upper etching plate 304' is conductively connected to the lower etching plate 305' after passing through the plate body 301', and the left ground element 80b' on the left side of the upper etching plate 304' is conductively connected to the lower etching plate 305' after passing through the plate body 301', and the right ground element 80c' is connected to the The right side of the upper side etching plate 304' is conductively connected to the lower side etching plate 305' after passing through the plate body 301', so that afterwards, the microwave detector is manufactured to allow all
  • the central ground element 80a', the left grounding element 80b' and the right grounding element 80c' are conductively connected to the radiation source 10' and the reference ground 20' so that the radiation source 10' is grounded,
  • the reference ground 20' is fixedly installed in a manner that the shielding cover 60' covers the excitation circuit 40' to make the microwave detector.
  • the manufacturing method of the present invention further includes the steps:
  • the step (B) is before the step (A), so that the lower metal plate 303' is first etched to form the The lower side etching plate 305', and then the upper side metal plate 302' is etched to form the upper side etching plate 304'.
  • the step (A) and the step (B) are performed at the same time, thereby simultaneously etching the upper metal plate 302' and the The lower metal plate 303' forms the upper etching plate 304' and the lower etching plate 305'.
  • the driving circuit is formed by the lower metal plate 303' At least part of 40'.

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Abstract

本发明公开了一具有接地点的微波探测器及其制造方法，其中所述微波探测器包括一辐射缝隙、一参考地和一辐射源，所述辐射缝隙被设置于所述辐射源和所述参考地之间。所述辐射源进一步具有一中心接地点、至少一左侧接地点以及至少一右侧接地点，所述中心接地点允许所述辐射源的零电位点被接地，所述左侧接地点允许所述辐射源的位于零电位点的左侧的位置被接地，相应地，所述右侧接地点允许所述辐射源的位于零电位点的右侧的位置被接地，如此所述微波探测器的辐射能量趋向于均匀分布，以降低所述微波探测器的耗损和提高所述微波探测器的收发效率，从而所述微波探测器的增益能够被增强。

Description

具有接地点的微波探测器及其制造方法 技术领域
本发明涉及微波技术，特别涉及一具有接地点的微波探测器及其制造方法。
背景技术
微波探测器，例如5.8G天线，是一种基于微波技术探测相应空间内的物体的动作的探测器，其中该微波探测器通常包括至少一参考地、一辐射缝隙以及一辐射源，该辐射缝隙被设置于该辐射源和该参考地之间，其中该微波探测器在该参考地的相对于该辐射缝隙的一侧设置有电路(例如微波激励电路)，该辐射源在其偏离物理中心的位置设置有一个馈电点，该辐射源的该馈电点被电连接于该微波探测器的该电路，从而当自该微波探测器的该电路向该辐射源的该馈电点提供交变电信号时，该辐射源和该参考地能够相互作用而收发微波，以用于在后续获得相应空间内的物体的动作。可以理解的是，该辐射源的物理中心为该辐射源的零电位点，穿过该辐射源的物理中心的众多直线中的一个直线为该辐射源的能量平衡线，其中该辐射源的能量平衡线垂直于该辐射源的物理中心点与馈电点的连线，例如当该辐射源的俯视形状为长方形时，该辐射源的该能量平衡线平行于该辐射源的长边且穿过该辐射源的物理中心，而当该辐射源的俯视形状为圆形时，该辐射源的该能量平衡线穿过圆形的该辐射源的圆心且垂直于该圆心与馈电点的连线。然而，由于在该辐射源和该参考地之间存在该辐射缝隙，这导致自该微波探测器的该电路向该辐射源的该馈电点提供的交变电信号的过零点偏离该辐射源的该能量平衡线而造成该微波探测器的辐射能量不均衡，并造成该微波探测器的高次谐波增加，以至于严重地影响了该微波探测器的增益和增加了该微波探测器的耗损。
发明内容
本发明的一个目的在于提供一具有接地点的微波探测器及其制造方法，其中所述微波探测器的辐射能量趋向于均衡分布，以降低所述微波探测器的耗损和提高所述微波探测器的收发效率，从而所述微波探测器的增益能够被增强。
本发明的一个目的在于提供一具有接地点的微波探测器及其制造方法，其中 所述微波探测器的辐射能量的散射被有效地减少，以有利于降低所述微波探测器的高次谐波分量。
本发明的一个目的在于提供一具有接地点的微波探测器及其制造方法，其中所述微波探测器的品质因子能够被提高，以有利于控制所述微波探测器的带宽，从而所述微波探测器的抗干扰能力能够被有效地提高。
本发明的一个目的在于提供一具有接地点的微波探测器及其制造方法，其中所述微波探测器能够有效地降低被雷击的风险，以使得所述微波探测器被适于应用于户外环境。
本发明的一个目的在于提供一具有接地点的微波探测器及其制造方法，其中所述微波探测器提供一辐射源、一参考地以及被设置于所述辐射源和所述参考地之间的一辐射缝隙，其中所述辐射源具有一中心接地点以及位于所述中心接地点左侧的至少一左侧接地点和位于所述中心接地点右侧的至少一右侧接地点，这些接地点使得辐射能量能够均衡地分布于所述辐射源。
本发明的一个目的在于提供一具有接地点的微波探测器及其制造方法，其中所述左侧接地点、所述中心接地点和所述右侧接地点沿着所述辐射源的能量平衡线分布，以有效地减少辐射能量的散射和避免杂波的出现。优选地，所述左侧接地点和所述右侧接地点相对于所述中心接地点相对称，如此辐射能量能够趋向于均衡地分布于所述辐射源，以有效地降低所述微波探测器的耗损和提高所述微波探测器的收发效率。
本发明的一个目的在于提供一具有接地点的微波探测器及其制造方法，其中一个所述左侧接地点位于所述辐射源的左侧边缘，一个所述右侧接地点位于所述辐射源的右侧边缘，如此有利于减小所述微波探测器的带宽而提高所述微波探测器的抗干扰能力。
依本发明的一个方面，本发明提供一具有接地点的微波探测器，其包括：
一辐射缝隙；
一参考地；
一激励电路，所述激励电路被设置用于提供交变信号；
一辐射源，其中所述辐射源以与所述参考地相平行的方式被间隔地保持于所述参考地的一侧，其中所述辐射缝隙形成于所述参考地和所述辐射源之间，其中所述辐射源具有一馈电点，其中所述馈电点偏离于所述辐射源的物理中心点，其 中所述辐射源的所述馈电点被电连接于所述激励电路，其中所述辐射源于所述馈电点在所述激励电路的交变信号的激励下具有一能量平衡线和以所述能量平衡线分别在靠近和远离所述馈电点的方向平移而于所述辐射源界定的一能量平衡带，其中所述馈电点于所述辐射源位于所述能量平衡带之外，其中所述能量平衡线为所述辐射源上穿过所述辐射源的物理中心点并垂直于所述辐射源的物理中心点与所述馈电点连线的直线，其中所述能量平衡带沿所述能量平衡线方向以所述辐射源的物理中心点和所述馈电点的连线为界的两侧形成所述能量平衡带的两端部，其中所述辐射源于所述能量平衡带的至少一所述端部被接地。
根据本发明的一个实施例，其中所述辐射源于所述能量平衡带的其中一所述端部具有与所述参考地导电相接的至少一接地点，以允许所述辐射源于所述能量平衡带的该所述端部藉由所述接地点与所述参考地的导电连接被接地。
根据本发明的一个实施例，其中至少一所述接地点位于所述辐射源的所述能量平衡线。
根据本发明的一个实施例，其中所述接地点被成对设置，其中被成对设置的所述接地点于所述辐射源的所述能量平衡带以所述能量平衡线对称分布。
根据本发明的一个实施例，其中所述辐射源于所述能量平衡带的另一所述端部具有与所述参考地导电相接的至少一所述接地点，以允许所述辐射源于所述能量平衡带的两所述端部分别藉由所述接地点与所述参考地的导电连接被接地。
根据本发明的一个实施例，其中各所述接地点均位于所述辐射源的所述能量平衡线。
根据本发明的一个实施例，其中位于所述能量平衡带的同一所述端部的至少一对所述接地点被成对设置，其中被成对设置的该对所述接地点于所述辐射源的所述能量平衡带以所述能量平衡线对称分布。
根据本发明的一个实施例，其中位于所述能量平衡带的其中一所述端部的至少一所述接地点以所述辐射源的物理中心点和所述馈电点的连线与位于所述能量平衡带的另一所述端部的所述接地点对称。
根据本发明的一个实施例，其中所述接地点于所述能量平衡带的相应所述端部位于所述辐射源的侧边缘。
根据本发明的一个实施例，其中所述辐射源于所述辐射源的物理中心点具有与所述参考地导电相接的一中心接地点，以允许所述辐射源于所述辐射源的物理 中心点藉由所述中心接地点与所述参考地的导电连接被接地。
根据本发明的一个实施例，其中所述辐射源于所述辐射源的物理中心点具有与所述参考地导电相接的至少一中心接地点，以允许所述辐射源于所述辐射源的物理中心点藉由所述中心接地点与所述参考地的导电连接被接地。
根据本发明的一个实施例，其中所述的微波探测器进一步包括一基础板，其中所述参考地被贴装于所述基础板的一侧以被所述基础板保持平整，其中所述激励电路被设置于所述基础板的贴装有所述参考地的一侧的相对侧。
根据本发明的一个实施例，其中所述的微波探测器进一步包括一屏蔽罩，其中所述屏蔽罩以罩设所述激励电路的方式被设置于所述基础板。
依本发明的另一个方面，本发明进一步提供一微波探测器的制造方法，其中所述制造方法包括如下步骤：
(a)蚀刻一下板组件的一第二金属板以允许所述第二金属板形成一缺口和蚀刻所述下板组件的一第三金属板以允许所述第三金属板形成一激励电路的至少一部分；
(b)贴装一上板组件的一上基板于所述第二金属板；以及
(c)形成自所述上板组件的一第一金属板经所述第二金属板的所述缺口延伸至和导通于所述激励电路的一导通元件、自所述第一金属板延伸至和导通于所述第二金属板的至少三接地元件，以制得所述微波探测器，其中所述第一金属板形成所述微波探测器的一辐射源，所述上基板形成所述微波探测器的一辐射缝隙，所述第二金属板形成所述微波探测器的一参考地，所述第一金属板的用于连接所述导通元件的位置形成所述辐射源的一馈电点，所述第一金属板的用于连接每个所述接地元件的位置分别形成所述辐射源的每个接地点，其中一个所述接地点位于所述辐射源的零电位点而形成一中心接地点，至少一个所述接地点位于所述辐射源的零电位点的左侧而形成至少一左侧接地点，至少一个所述接地点位于所述辐射源的零电位点的右侧而形成至少一右侧接地点。
根据本发明的一个实施例，所述制造方法进一步包括步骤：(d)以罩设所述激励电路的方式设置一屏蔽罩于所述下板组件的一下基板。
根据本发明的一个实施例，在所述步骤(c)中，通过金属化过孔工艺形成所述导通元件和每个所述接地元件。
依本发明的另一个方面，本发明进一步提供一微波探测器的制造方法，其中 所述制造方法包括如下步骤：
(A)蚀刻一板材组件的被贴装于一板材主体的上侧表面的一上侧金属板，以形成一上侧蚀刻板；
(B)蚀刻所述板材组件的被贴装于所述板材主体的下侧表面的一下侧金属板，以形成一下侧蚀刻板；以及
(C)形成自所述上侧蚀刻板的偏离物理中心的位置延伸至和导通于位于所述板材主体的下侧表面的一激励电路的一导通元件、自所述上侧蚀刻板延伸至和导通于所述下侧蚀刻板的至少三接地元件，以制得所述微波探测器，其中所述上侧蚀刻板形成所述微波探测器的一辐射源，所述板材主体形成所述微波探测器的一辐射缝隙，所述下侧蚀刻板形成所述微波探测器的一参考地，所述上侧蚀刻板的用于连接所述导通元件的位置形成所述辐射源的一馈电点，所述上侧蚀刻板的用于连接每个所述接地元件的位置分别形成所述辐射源的每个接地点，其中一个所述接地点位于所述辐射源的零电位点而形成一中心接地点，至少一个所述接地点位于所述辐射源的零电位点的左侧而形成至少一左侧接地点，至少一个所述接地点位于所述辐射源的零电位点的右侧而形成至少一右侧接地点。
根据本发明的一个实施例，在上述方法中，所述步骤(B)在所述步骤(A)之前，从而首先蚀刻所述下侧金属板而形成所述下侧蚀刻板，其次蚀刻所述上侧金属板而形成所述上侧蚀刻板。
根据本发明的一个实施例，在所述步骤(B)中，在蚀刻所述下侧金属板以形成所述下侧蚀刻板的同时，藉由所述下侧金属板形成所述激励电路的至少一部分。
根据本发明的一个实施例，在所述步骤(C)中，通过金属化过孔工艺形成所述导通元件和每个所述接地元件。
根据本发明的一个实施例，所述制造方法进一步包括步骤：(D)以罩设所述激励电路的方式设置一屏蔽罩于所述参考地。
附图说明
图1是依本发明的一较佳实施例的一微波探测器的制造步骤之一的立体示意图。图2是依本发明的上述较佳实施例的所述微波探测器的制造步骤之二的立体示意图。
图3A和图3B是依本发明的上述较佳实施例的所述微波探测器的制造步骤之三的不同视角的立体示意图。
图4是依本发明的上述较佳实施例的所述微波探测器的制造步骤之四的立体示意图。
图5是依本发明的上述较佳实施例的所述微波探测器的制造步骤之五的立体示意图。
图6依本发明的上述较佳实施例的所述微波探测器的制造步骤之六的立体示意图，其示意了所述微波探测器的立体状态。
图7A是沿着图6的A-A线剖开后的剖视示意图，其示意了所述微波探测器在一个剖视位置的剖视状态。
图7B是沿着图6的B-B线剖开后的剖视示意图，其示意了所述微波探测器在另一个剖视位置的剖视状态。
图8A是仅具有中心接地点的微波探测器的参数测试图。
图8B是依本发明的上述较佳实施例的所述微波探测器的参数测试图。
图9是依本发明的上述较佳实施例的所述微波探测器的一个变形实施方式的立体示意图。
图10是依本发明的上述较佳实施例的所述微波探测器的一个变形实施方式的立体示意图。
图11是依本发明的一较佳实施例的一微波探测器的制造步骤之一的立体示意图。
图12A和图12B是依本发明的上述较佳实施例的所述微波探测器的制造步骤之二的不同视角的立体示意图。
图13分别是依本发明的上述较佳实施例的所述微波探测器的制造步骤之四的不同视角的立体示意图。
图14是依本发明的上述较佳实施例的所述微波探测器的制造步骤之五的立体示意图，其示意了所述微波探测器的立体状态。
[根据细则91更正 30.10.2019]　
图15A是沿着图14的A’-A’线剖开后的剖视示意图，其示意了所述微波探测器在一个剖视位置的剖视状态。
[根据细则91更正 30.10.2019]　
图15B是沿着图14的B’-B’线剖开后的剖视示意图，其示意了所述微波探测器在另一个剖视位置的剖视状态。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
参考本发明的说明书附图之附图1至图7B，依本发明的一较佳实施例的一微波探测器在接下来的描述中被揭露和被阐述，其中所述微波探测器包括一辐射源10、一参考地20以及一辐射缝隙30。
所述辐射源10具有一辐射源上表面11、对应于所述辐射源上表面11的一辐射源下表面12以及一馈电点13。所述参考地20具有一参考地上表面21和对应于所述参考地上表面21的一参考地下表面22。所述辐射源10以所述辐射源10的所述辐射源上表面11和所述参考地20的所述参考地上表面21相互平行的方式被间隔设置于所述参考地20的一侧，并且所述辐射缝隙30被设置于所述辐射源10的所述辐射源10和所述参考地20之间。
所述微波探测器进一步包括一激励电路40，其中所述辐射源10的所述馈电点13被电连接于所述激励电路40，其中所述激励电路40能够将交变电信号自所述辐射源10的所述馈电点13提供至所述辐射源10，以使辐射能量分布于所述辐射源10，此时，所述辐射源10和所述参考地20能够相互作用而使所述微波探测器收发微波。
可以理解的是，所述辐射源10的所述馈电点13偏离所述辐射源10的零电位点(物理中心点)，如此在所述激励电路40自所述辐射源10的所述馈电点13 提供交变电信号时，辐射能量能够分布于所述辐射源10而使所述辐射源10和所述参考地20相互作用以使所述微波探测器收发微波。
进一步地，所述辐射源10于所述馈电点13在所述激励电路40的交变信号的激励下具有一能量平衡带，其中所述能量平衡带为所述辐射源10于所述馈电点13在所述激励电路40的交变信号的激励下，所述辐射源10上零电位和趋于零电位的区域，具体地，所述能量平衡带为所述辐射源10的所述能量平衡线分别在靠近和远离所述馈电点13的方向平移而于所述辐射源10界定的区域，也就是说，所述能量平衡带以所述能量平衡线分别在靠近和远离所述馈电点13的方向等距平移的两平移线为边界，而于所述辐射源10界定的以所述能量平衡线对称的所述能量平衡带，并且所述馈电点13处于所述能量平衡带之外。
特别地，所述能量平衡带沿所述能量平衡线方向以所述辐射源10的物理中心点和所述馈电点13的连线为界的两侧形成所述能量平衡带的两端部，即所述能量平衡带的两所述端部为以所述辐射源10的物理中心点和所述馈电点13的连线为界的两侧区域，其中所述辐射源10于所述能量平衡带的至少一所述端部被接地而于该所述端部形成有至少一接地点14，以自所述接地点14沿所述辐射源10的物理中心点和所述馈电点13的连线方向上均衡化所述辐射源10的能量分布，即通过将所述辐射源10于所述能量平衡带的该所述端部接地的方式降低所述辐射源10的对应该所述端部的区域的能量集中程度，尤其是当所述辐射源10被设置为长方形时，能够降低长方形的所述辐射源10的对应该所述端部的边角区域的能量集中程度，进而降低所述微波探测器的高次谐波分量，有利于降低所述微波探测器的耗损和提高所述微波探测器的收发效率，从而使得所述微波探测器的增益能够被增强，同时降低所述微波探测器的高次谐波分量还有利于降低所述微波探测器对其他微波装置产生的干扰。
也就是说，因所述辐射源10的所述馈电点13偏离所述辐射源10的物理中心点而使得自所述馈电点13提供的交变电信号的过零点偏离所述辐射源10的所述能量平衡线，进而在自所述馈电点13提供交变电信号时造成所述辐射源10上的能量分布不均，特别是所述辐射源10的对应所述能量平衡带的所述端部的区域，而通过将所述辐射源10于所述能量平衡带的至少一所述端部接地的方式能够均衡化所述辐射源10的对应所述能量平衡带的该所述端部的区域的能量分布。
进一步地，当所述辐射源10于所述能量平衡带的两所述端部分别被接地而于两所述端部分别形成有至少一所述接地点14时，所述辐射源10的自所述接地点14沿所述辐射源10的物理中心点和所述馈电点13的连线方向上的能量分布被均衡化，以使得所述辐射源10的对应所述能量平衡带的区域的能量集中程度得以降低，即同时降低了所述辐射源10的以所述辐射源10的物理中心点和所述馈电点13的连线为界的两侧的能量集中程度，有利于进一步降低所述微波探测器的高次谐波分量。
值得一提的是，所述辐射源10优选地被设置在所述能量平衡带的至少一所述端部于趋近于所述能量平衡线的位置被接地，即所述接地点14优选地趋近于所述能量平衡线，如所述接地点14直接形成于所述能量平衡线，通过这样的方式，所述接地点14为零电位或趋于零电位，有利于所述辐射源10的自所述接地点14沿所述辐射源10的物理中心点和所述馈电点13的连线方向上的能量分布的均衡化，进而有利于降低所述微波探测器的高次谐波分量。
可以理解的是，以能量平衡线对称分布的一对所述接地点14等效于在该对所述接地点14连线上形成于所述能量平衡线的所述接地点14，因此当所述辐射源10于所述能量平衡带的一所述端部形成有偏离于所述能量平衡线的多个所述接地点14时，优选地，各所述接地点14成对对称分布于所述能量平衡线两侧。
进一步地，当所述辐射源10于所述能量平衡带的两所述端部分别形成有所述接地点14时，优选地，位于所述能量平衡带的其中一所述端部的所述接地点14以所述辐射源10的物理中心点和所述馈电点13的连线与位于所述能量平衡带的另一所述端部的所述接地点对称或等效对称，如位于所述能量平衡带的其中一所述端部的所述接地点14等效形成一等效接地点，且位于所述能量平衡带的另一所述端部的所述接地点14等效形成另一等效接地点，则两所述等效接地点优选地以所述辐射源10的物理中心点和所述馈电点13的连线对称分布，以利于所述辐射源10上分别对应所述能量平衡带的两所述端部的区域的能量以所述辐射源10的物理中心点和所述馈电点13的连线均衡对称的分布，即有利于所述辐射源10在所述能量平衡线方向的能量的均衡分布，进而有利于降低所述微波探测器的高次谐波分量。
值得一提的是，通过将所述辐射源10于所述能量平衡带的至少一所述端部接地的方式还能够降低所述辐射源10与所述参考地20之间的阻抗，从而提高所 述微波探测器的品质因子，以有利于控制所述微波探测器的带宽，从而所述微波探测器的抗干扰能力能够被有效地提高。
优选地，设所述微波探测器发射的微波波长为λ，其中所述接地点14于所述能量平衡带的相应所述端部在沿所述能量平衡线方向与所述辐射源10的物理中心点和所述馈电点13的连线之间的距离大于等于λ/16，以有利于所述辐射源10的相应所述端部的能量的均衡分布。
进一步地，所述能量平衡线于所述辐射源10的物理中心点具有与所述馈电点13之间最短的距离，因此当所述辐射源10进一步于所述辐射源10的所述物理中心点被接地时，所述辐射源10与所述参考地20之间的阻抗能够被进一步大幅降低，即在所述辐射源10于所述能量平衡带的至少一所述端部被接地的基础上，通过将所述辐射源10于所述辐射源10的所述物理中心点接地的方式能够更大程度地降低所述辐射源10与所述参考地20之间的阻抗，从而更大程度地提高所述微波探测器的抗干扰能力。
在附图1至图7B示出的所述微波探测器的这个较佳示例中，所述辐射源10具有一中心接地点14C、至少一左侧接地点14L以及至少一右侧接地点14R，其中所述辐射源10的零电位点位置被接地而使所述辐射源10形成有所述中心接地点14C，所述辐射源10的位于零电位点一侧的所述能量平衡带的其中一所述端部的至少一个位置被接地而使所述辐射源10形成有至少一个所述左侧接地点14L，相应地，所述辐射源10的位于零电位点另一侧的所述能量平衡带的另一所述端部的至少一个位置被接地而使所述辐射源10形成有至少一个所述右侧接地点14R。通过使所述辐射源10形成所述中心接地点14C、所述左侧接地点14L和所述右侧接地点14R的方式，在所述激励电路40将交变电信号自所述辐射源10的所述馈电点13提供至所述辐射源10后，辐射能量趋向于均衡分布于所述辐射源10，如此所述微波探测器的耗损能够被有效地降低和所述微波探测器的收发效率能够被有效地提高。
优选地，所述辐射源10的所述左侧接地点14L和所述右侧接地点14R相互对称，如此辐射能量能够均衡地分布于所述辐射源10的左侧和右侧，以降低所述微波探测器的耗损和提高所述微波探测器的收发效率，从而所述微波探测器的增益能够被增强。
继续参考附图1至图7B，在本发明的所述微波探测器的这个较佳示例中，所 述辐射源10的所述左侧接地点14L、所述中心接地点14C和所述右侧接地点14R沿着所述辐射源10的能量平衡线分布，以能够有效地减少辐射能量的散射和避免杂波的出现。
具体地，在附图1至图7B示出的所述微波探测器的这个较佳示例中，所述辐射源10具有一个所述左侧接地点14L和一个所述右侧接地点14R，其中所述左侧接地点14L位于所述辐射源10的左侧边缘，和所述右侧接地点14R位于所述辐射源10的右侧边缘，如此通过减少所述微波探测器的带宽的方式能够有效地提高所述微波探测器的抗干扰能力。
更具体地，附图8A示出了仅具有中心接地点的微波探测器的参数测试图，附图8B示出了本发明的具有所述中心接地点14C、一个所述左侧接地点14L和一个所述右侧接地点14R的所述微波探测器的参数测试图，其中参数测试图中的横坐标x表示微波探测器的震荡频率，参数测试图中的纵坐标y表示微波探测器的增益，曲线为微波探测器收发的微波。在对比附图8A和图8B后可知：第一，在振荡频率大约为5.8GHz时，本发明的所述微波探测器的振荡频率为5.9500GHz时的增益(-22.4614R)明显地高于仅具有中心接地点的微波探测器的振荡频率为5.9000GHz时的增益(-14C.8849)；第二，在振荡频率大约为5.8GHz时，本发明的所述微波探测器的振荡频率为5.9500GHz时的带宽明显地小于仅具有中心接地点的微波探测器的振荡频率为为5.9000GHz时的带宽，从而使得本发明的所述微波探测器的抗干扰能力明显地强于仅具有中心接地点的微波探测器的抗干扰能力。
继续参考附图1至图7B，所述微波探测器进一步包括一基础板50，所述基础板50具有一基础板上表面51和对应于所述基础板上表面51的一基础板下表面52，其中所述参考地20的所述参考地下表面22被贴装于所述基础板50的所述基础板上表面51，以允许所述基础板50保证所述参考地20的平整度。优选地，所述激励电路40形成于所述基础板50的所述基础板下表面52，以允许所述基础板50隔离所述参考地20和所述激励电路40。
继续参考附图1至图7B，所述微波探测器进一步包括一屏蔽罩60，所述屏蔽罩60具有一屏蔽空间61，其中所述屏蔽罩60以罩设所述激励电路40的方式被设置于所述基础板50的所述基础板下表面52，以允许所述激励电路40被保持于所述屏蔽罩60的所述屏蔽空间61，如此所述屏蔽罩60能够阻止所述激励 电路40和所述微波探测器收发的微波相互干扰。
值得一提的是，尽管在附图1至图7B示出的所述微波探测器中，以所述辐射源10的俯视形状为方形(尤其是长方形)为例来揭露本发明的所述微波探测器的内容和特征，但本领域技术人员应当连接的是，附图1至图7B示出的带有辐射形状为方形的所述辐射源10的所述微波探测器仅为举例，其并不应当被视为对本发明的所述微波探测器的内容和范围限制的限制。例如，在本发明的所述微波探测器的其他示例中，所述微波探测器的所述辐射源10的俯视形状可以还是但不限于圆形。
依本发明的另一个方面，参考附图1至6，本发明进一步提供所述微波探测器的制造方法，其中所述制造方法包括步骤S1：提供一上板组件100，其中所述上板组件100包括一上基板101和一第一金属板102，所述上基板101具有一第一附着面1011和对应于所述第一附着面1011的一贴装面1012，所述第一金属板102被附着于所述上基板101的所述第一附着面101，以使所述上板组件100的所述上基板101和所述第一金属板102形成层叠结构，参考附图1。
值得一提的是，所述上板组件100的所述上基板101的类型在本发明的所述制造方法中不受限制，例如所述上基板101的类型可以是但不限于酚醛纸基板、复合基板、玻纤基板。另外，所述上板组件100的所述第一金属板102的类型在本发明的所述制造方法中不受限制，例如所述上板组件100的所述第一金属板102可以是但不限于铜板。也就是说，所述上板组件100可以是一个单面覆铜的组件。
可选地，在本发明的所述制造方法的其他示例中，所述上基板101的两个相对侧面均被覆铜，从而在制造所述微波探测器的过程中，被附着于所述上基板101的一个侧面的铜板被去除，以暴露所述上基板101的该侧面而使所述上基板101的该侧面形成所述上基板101的所述贴装面1012，相应地，被附着于所述上基板101的另一个侧面的铜板没有被去除而形成所述第一金属板102，和所述上基板101的用于附着所述第一金属板102的侧面形成所述上基板101的所述第一附着面1011。
参考附图2，所述制造方法进一步包括步骤S2：提供一下板组件200，其中所述下板组件200包括一下基板201、一第二金属板202以及一第三金属板203，所述下基板201具有一第二附着面2011和对应于所述第二附着面2011的一第三 附着面2012，所述第二金属板202被附着于所述下基板201的所述第二附着面2011，所述第三金属板203被附着于所述下基板201的所述第三附着面2012，以使所述下板组件200的所述第二金属板202、所述下基板201和所述第三金属板203形成层叠结构。
值得一提的是，所述下板组件200的所述下基板201的类型在本发明的所述制造方法中不受限制，例如所述下基板201的类型可以是但不限于酚醛纸基板、复合基板、玻纤基板。另外，所述下板组件200的所述第二金属板202和所述第三金属板203的类型在本发明的所述制造方法中不受限制，例如所述第二金属板202和所述第三金属板203可以是但不限于铜板。也就是说，所述下板组件200可以是一个双面覆铜的组件。
参考附图3A和图3B，所述制造方法进一步包括步骤S3：蚀刻所述下板组件200的所述第二金属板202以允许所述第二金属板202形成一缺口2021，和蚀刻所述下板组件200的所述第三金属板203以允许所述第三金属板203形成所述激励电路40或者形成所述激励电路40的一部分。例如，在本发明的所述制造方法的这个具体示例中，所述第三金属板203的中部被蚀刻而于所述第三金属板203的中部形成所述激励电路40的至少一部分。
值得一提的是，在本发明的所述制造方法的一个具体示例中，所述下板组件200的所述第二金属板202和所述第三金属板203能够被同时蚀刻而使所述第二金属板202形成所述缺口2021和使所述第三金属板203形成所述激励电路40或者所述激励电路40的一部分。可选地，在本发明的所述制造方法的另一些示例中，所述下板组件200的所述第二金属板202和所述第三金属板203的蚀刻顺序能够被选择，例如首先蚀刻所述第二金属板202而使所述第二金属板202形成所述缺口2021，其次蚀刻所述第三金属板203而使所述第三金属板203形成所述激励电路40或者所述激励电路40的一部分，或者首先蚀刻所述第三金属板203而使所述第三金属板203形成所述激励电路40或者所述激励电路40的一部分，其次蚀刻所述第二金属板202而使所述第二金属板202形成所述缺口2021。
可选地，在本发明的所述制造方法的一个变形示例中，所述制造方法包括步骤S3’：蚀刻所述下板组件200的所述第二金属板202以允许所述第二金属板202形成所述缺口2021，和蚀刻所述第三金属板203以允许所述第三金属板203形成至少一个布线空间而在后续能够于所述布线空间形成所述激励电路40。例 如，通过印刷电路的方式能够于所述布线空间形成所述激励电路40。
参考附图4，所述制造方法进一步包括步骤S4：以所述上板组件100的所述上基板101的所述贴装面1012贴合于所述下板组件200的所述第二金属板202的方式贴装所述上板组件100于所述下板组件200。
应当理解的是，所述上板组件100的所述上基板101和所述下板组件200的所述第二金属板202相互贴合和固定，以避免所述上板组件100和所述下板组件200相互分离。
值得一提的是，相互贴合和固定所述上板组件100的所述上基板101和所述下板组件200的所述第二金属板202的方式在本发明的所述制造方法中不受限制，例如可以在贴合所述上板组件100的所述上基板101和所述下板组件200的所述第二金属板202之前，首先施胶于所述上基板101的所述贴装面1012和/或所述第二金属板202的裸露面，其次贴合所述上基板101的所述贴装面1012和所述第二金属板202，然后在胶水固化后所述上板组件100的所述上基板101和所述下板组件200的所述第二金属板202相互贴合和固定。
参考附图5，所述制造方法进一步包括步骤S5：通过金属化过孔工艺于所述第二金属板202的所述缺口2021的位置形成上端部穿过所述上基板101以导通地连接于所述第一金属板102和下端部穿过所述下基板201以导通地连接所述激励电路40的一导通元件70，和形成穿过所述上基板101而导通地连接所述第一金属板102和所述第二金属板202的至少三个接地元件80。
换言之，所述微波探测器的所述导通元件70的上端部向上延伸以在穿过所述上基板101后被导通地连接于所述第一金属板102，和所述导通元件70的下端部向下延伸以在穿过所述下基板201后被导通地连接于所述激励电路40，并且所述第二金属板202形成的所述缺口2021用于阻止所述导通元件70和所述第二金属板202被导通，从而在后续，在所述微波探测器被制造完成而允许所述第一金属板102形成所述辐射源10、所述上基板101形成所述辐射缝隙30、所述第二金属板202形成所述参考地20和所述下基板201形成所述基础板50后，所述导通元件70与所述第一金属板102的连接位置形成所述辐射源10的所述馈电点13，从而所述导通元件70导通地连接所述辐射源10的所述馈电点13和所述激励电路40。
这些所述接地元件80中的一个所述接地元件80为一中心接地元件80a，这 些所述接地元件80中的至少一个所述接地元件80为至少一左侧接地元件80b，相应地，这些所述接地元件80中的至少一个所述接地元件80为至少一右侧接地元件80c。所述中心接地元件80a于所述第一金属板102的物理中心在穿过所述上基板101后导通地连接所述第一金属板102和所述第二金属板202，所述左侧接地元件80b于所述第一金属板102的左侧在穿过所述上基板101后导通地连接所述第一金属板102和所述第二金属板202，所述右侧接地元件80c于所述第一金属板102的右侧在穿过所述上基板101后导通地连接所述第一金属板102和所述第二金属板202，从而在后续，在所述微波探测器被制造完成而允许所述第一金属板102形成所述辐射源10、所述上基板101形成所述辐射缝隙30、所述第二金属板202形成所述参考地20和所述下基板201形成所述基础板50后，所述微波探测器的所述中心接地元件80a、所述左侧接地元件80b和所述右侧接地元件80c导通地连接所述辐射源10和所述参考地20而使所述辐射源10被接地，并且所述中心接地元件80a和所述辐射源10的连接位置形成所述辐射源10的所述中心接地点14C，所述左侧接地元件80b和所述辐射源10的连接位置形成所述辐射源10的所述左侧接地点14L，所述右侧接地元件80c和所述辐射源10的连接位置形成所述辐射源10的所述右侧接地点14R。
参考附图6，以所述屏蔽罩60罩设所述激励电路40的方式固定地安装所述屏蔽罩60于所述下基板201，以制得所述微波探测器。
也就是说，本发明的所述制造方法包括如下步骤：
(a)蚀刻所述下板组件200的所述第二金属板202以允许所述第二金属板202形成所述缺口2021和蚀刻所述下板组件200的所述第三金属板203以允许所述第三金属板203形成所述激励电路40的至少一部分；
(b)贴装所述上板组件100的所述上基板101于所述第二金属板202；以及
(c)形成自所述上板组件100的所述第一金属板102经所述第二金属板202的所述缺口2021延伸至和导通于所述激励电路40的所述导通元件70、自所述第一金属板102延伸至和导通于所述第二金属板202的至少三个所述接地元件80，以制得所述微波探测器，其中所述第一金属板102形成所述微波探测器的所述辐射源10，所述上基板101形成所述微波探测器的所述辐射缝隙30，所述第二金属板202形成所述微波探测器的所述参考地20，所述第一金属板102的用于连接所述导通元件80的位置形成所述辐射源10的所述馈电点13，所述第一 金属板102的用于连接每个所述接地元件80的位置分别形成所述辐射源10的每个接地点，其中一个所述接地点位于所述辐射源10的零电位点而形成所述中心接地点14C，至少一个所述接地点位于所述辐射源10的零电位点的左侧而形成至少一个所述左侧接地点14L，至少一个所述接地点位于所述辐射源10的零电位点的右侧而形成至少一个所述右侧接地点14R。
所述制造方法进一步包括步骤：(d)以罩设所述激励电路40的方式设置所述屏蔽罩60于所述下板组件200的所述下基板201。
附图9示出了本发明的所述微波探测器的一个变形示例，与附图1至图7B示出的所述微波探测器不同的是，在附图9示出的所述微波探测器的这个较佳示例中，所述辐射源10的所述左侧接地点14L和所述右侧接地点14R的数量均是两个，两个所述左侧接地点14L、所述中心接地点14C和两个所述右侧接地点14R均分布于所述辐射源10的能量平衡线，并且所述左侧接地点14L和所述右侧接地点14R相对于所述中心接地点14C对称。
具体地，在附图9中，两个所述左侧接地点14L分别被命名为一第一左侧接地点14La和一第二左侧接地点14Lb，两个所述右侧接地点14R分别被命名为一第一右侧接地点14Ra和一第二右侧接地点14Rb，其中所述第一左侧接地点14La、所述第二左侧接地点14Lb、所述中心接地点14C、所述第二右侧接地点14Rb和所述第一右侧接地点14Ra分布于所述辐射源10的能量平衡线，并且所述第一左侧接地点14La和所述第一右侧接地点14Ra相对于所述中心接地点14C相互对称，和所述第二左侧接地点14Lb和所述第二右侧接地点14Rb相当于所述中心接地点14C相互对称。
优选地，所述第一左侧接地点14La、所述第二左侧接地点14Lb、所述中心接地点14C、所述第二右侧接地点14Rb和所述第一右侧接地点14Ra均衡地形成于所述辐射源10的能量平衡线，从而使得所述第一左侧接地点14La、所述第二左侧接地点14Lb、所述中心接地点14C、所述第二右侧接地点14Rb和所述第一右侧接地点14Ra中任意相邻接地点之间的间距相等。
附图10示出了本发明的所述微波探测器的一个变形示例，与附图1至图7B示出的所述微波探测器不同的是，在附图10示出的所述微波探测器的这个较佳示例中，所述辐射源10的所述左侧接地点14L和所述右侧接地点14R的数量均是两个而使所述辐射源10的所述左侧接地点14L和所述右侧接地点14R分别成 对出现，其中两个所述左侧接地点14L相对于所述辐射源10的能量平衡线对称，两个所述右侧接地点14R相对于所述辐射源10的能量平衡线对称，并且两个所述左侧接地点14L和两个所述右侧接地点14R相对于所述中心接地点14C对称。
具体地，在附图10中，两个所述左侧接地点14L被命名为一左侧第一接地点14LA和一左侧第二接地点14LB，两个所述右侧接地点14R被命名为一右侧第一接地点14RA和一右侧第二接地点14RB，其中所述左侧第一接地点14LA和所述左侧第二接地点14LB相对于所述辐射源10的能量平衡线对称，所述右侧第一接地点14RA和所述右侧第二接地点14RB相对于所述辐射源10的能量平衡线对称，并且所述左侧第一接地点14LA和所述右侧第一接地点14RA相对于所述中心接地点14C对称，和所述左侧第二接地点14LB和所述右侧第二接地点14RB相对于所述中心接地点14C对称。
[根据细则91更正 30.10.2019]　
参考本发明的说明书附图之附图11至图15B，依本发明的另一较佳实施例的一微波探测器在接下来的描述中被揭露和被阐述，其中所述微波探测器包括一辐射源10’、一参考地20’以及一辐射缝隙30’。
所述辐射源10’具有一辐射源上表面11’、对应于所述辐射源上表面11’的一辐射源下表面12’以及一馈电点13’。所述参考地20’具有一参考地上表面21’和对应于所述参考地上表面21’的一参考地下表面22’。所述辐射源10’以所述辐射源10’的所述辐射源上表面11’和所述参考地20’的所述参考地上表面21’相互平行的方式被设置于所述参考地20’的一侧，并且所述辐射缝隙30’形成于所述辐射源10’和所述参考地20’之间。
[根据细则91更正 30.10.2019]　
值得一提的是，尽管在附图11至图15B中示出的所述微波探测器的所述辐射源10’的俯视形状为方形(尤其是长方形)，但是在所述微波探测器的其他可能示例中，所述辐射源10’的俯视形状还可以是但不限于圆形。
所述微波探测器进一步包括一激励电路40’，其中所述辐射源10’的所述馈电点13’被电连接于所述激励电路40’，其中所述激励电路40’能够将交变电信号自所述辐射源10’的所述馈电点13’提供至所述辐射源10’，以使辐射能量分布于所述辐射源10’，此时，所述辐射源10’和所述参考地20’能够相互作用而使所述微波探测器收发微波。
[根据细则91更正 30.10.2019]　
在附图11至图15B示出的所述微波探测器的这个较佳示例中，所述辐射源10’具有一中心接地点14C’、至少一左侧接地点14L’以及至少一右侧接地点 14R’，其中所述辐射源10’的零电位点(物理中心)位置被接地而使所述辐射源10’形成有所述中心接地点14C’，所述辐射源10’的位于零电位点左侧的至少一个位置被接地而使所述辐射源10’形成有至少一个所述左侧接地点14L’，相应地，所述辐射源10’的位于零电位点右侧的至少一个位置被接地而使所述辐射源10’形成有至少一个所述右侧接地点14R’。通过使所述辐射源10’形成的中心接地点14C’、所述左侧接地点14L’和所述右侧接地点14R’的方式，在所述激励电路40’将交变电信号自所述辐射源10’的所述馈电点13’提供至所述辐射源10’后，辐射能量趋向于均衡分布于所述辐射源10’，如此所述微波探测器的耗损能够被有效地降低和所述微波探测器的收发效率能够被有效地提高。优选地，所述辐射源10’的所述左侧接地点14L’和所述右侧接地点14R’相互对称，如此辐射能量能够均衡地分布于所述辐射源10’的左侧和右侧，以降低所述微波探测器的耗损和提高所述微波探测器的收发效率，从而所述微波探测器的增益能够被增强。
[根据细则91更正 30.10.2019]　
继续参考附图11至图15B，在本发明的所述微波探测器的这个较佳示例中，所述辐射源10’的所述左侧接地点14L’、所述中心接地点14C’和所述右侧接地点14R’沿着所述辐射源10’的能量平衡线分布，以能够有效地减少辐射能量的散射和避免杂波的出现。
[根据细则91更正 30.10.2019]　
具体地，在附图11至图15B示出的所述微波探测器的这个较佳示例中，所述辐射源10’具有一个所述左侧接地点14L’和一个所述右侧接地点14R’，其中所述左侧接地点14L’位于所述辐射源10’的左侧边缘，和所述右侧接地点14R’位于所述辐射源10’的右侧边缘，如此通过减少所述微波探测器的带宽的方式能够有效地提高所述微波探测器的抗干扰能力。
[根据细则91更正 30.10.2019]　
继续参考附图11至图15B，所述微波探测器进一步包括一屏蔽罩60’，所述屏蔽罩60’具有一屏蔽空间61’，其中所述屏蔽罩60’以罩设所述激励电路40’的方式被设置于所述参考地20’的所述参考地下表面22’，以允许所述激励电路40’被保持于所述屏蔽罩60’的所述屏蔽空间61’，如此所述屏蔽罩60’能够阻止所述激励电路40’和所述微波探测器收发的微波相互干扰。
依本发明的另一个方面，参考附图11至图14，本发明进一步提供所述微波探测器的制造方法，其中所述制造方法包括步骤S1：提供一板材组件300’，其中所述板材组件300’包括一板材主体301’、一上侧金属板302’以及一下侧金 属板303’，所述板材主体301’具有一上侧表面3011’和对应于所述上侧表面3011’的一下侧表面3012’，所述上侧金属板302’贴装于所述板材主体301’的所述上侧表面3011’，和所述下侧金属板303’贴装于所述板材主体301’的所述下侧表面3012’，如此所述上侧金属板302’、所述板材主体301’和所述下侧金属板303’形成层叠结构，参考附图11。
值得一提的是，所述板材组件300’的所述板材主体301’的类型在本发明的所述制造方法中不受限制，例如所述板材主体301’的类型可以是但不限于酚醛纸基板、复合基板、玻纤基板。另外，所述板材组件300’的所述上侧金属板302’和所述下侧金属板303’的类型在本发明的所述制造方法中不受限制，例如所述板材组件300’的所述上侧金属板302’和所述下侧金属板303’可以是但不限于铜板。也就是说，所述板材组件300’可以是一个单面覆铜的组件。
参考附图12，所述制造方法进一步包括步骤S2：蚀刻所述上侧金属板302’，以允许所述上侧金属板302’的一部分形成一上侧蚀刻板304’，和蚀刻所述下侧金属板303’，以允许所述下侧金属板303’的一部分形成一下侧蚀刻板305’和所述激励电路40’。
值得一提的是，蚀刻所述上侧金属板302’和蚀刻所述下侧金属板303’的顺序在本发明的所述制造方法中不受限制，例如在本发明的所述制造方法的一个较佳示例中，同时蚀刻所述上侧金属板302’和蚀刻所述下侧金属板303’，以允许所述上侧金属板302’的一部分形成所述上侧蚀刻板304’，和允许所述下侧金属板303’的一部分形成所述下侧蚀刻板305’和所述激励电路40’。在本发明的所述制造方法的另一个较佳示例中，选择性地首先蚀刻所述上侧金属板302’和所述下侧金属板303’中的一个金属板，然后再蚀刻所述上侧金属板302’和所述下侧金属板303’中的另一个金属板。
另外，在附图11至图14示出的所述制造方法的这个较佳示例中，所述下侧金属板303’的四周边缘部分形成所述下侧蚀刻板305’，所述激励电路40’形成于所述下侧蚀刻板305’的中部，并且在一个平行于所述板材主体301’的投影面中，所述上侧蚀刻板304’于所述投影面中的投影被包含在所述下侧蚀刻板305’于所述投影面的投影中。可选地，所述下侧金属板303’的一侧形成所述下侧蚀刻板305’，所述下侧金属板303’的另一侧形成所述激励电路40’，并且在一个平行于所述板材主体301’的投影面中，所述上侧蚀刻板304’于所述投 影面中的投影被包含在所述下侧蚀刻板305’于所述投影面的投影中。
参考附图13，所述制造方法进一步包括步骤S3：通过金属化过孔工艺形成上端部穿过所述板材主体301’以导通地连接于所述上侧蚀刻板304’和下端部穿过所述板材主体301’以导通地连接于所述激励电路40’的一导通元件70’，和形成穿过所述板材主体301’而导通地连接所述上侧蚀刻板304’和所述下侧蚀刻板305’的至少三个接地元件80’。
换言之，所述导通元件70’的上端部向上延伸以在穿过所述板材主体301’后导通地连接于所述上侧蚀刻板304’，和所述导通元件70’的下端部向下延伸以在穿过所述板材主体301’后导通地连接于所述下侧蚀刻板305’，从而在后续，在所述微波探测器被制造完成而允许所述上侧蚀刻板304’形成所述辐射源10’、所述板材主体301’形成所述辐射缝隙30’和所述下侧蚀刻板305’形成所述参考地20’后，所述导通元件70’导通地连接所述辐射源10’和所述激励电路40’，其中所述导通元件70’与所述上侧蚀刻板304’的连接位置形成所述辐射源10’的所述馈电点13’。
这些所述接地元件80’中的一个所述接地元件80’为一中心接地元件80a’，这些所述接地元件80’中的至少一个所述接地元件80’为至少一左侧接地元件80b’，相应地，这些所述接地元件80’中的至少一个所述接地元件80’为至少一右侧接地元件80c’。所述中心接地元件80a’于所述上侧蚀刻板304’的物理中心在穿过所述板材主体301’后被导通地连接于所述下侧蚀刻板305’，所述左侧接地元件80b’于所述上侧蚀刻板304’的左侧在穿过所述板材主体301’后被导通地连接于所述下侧蚀刻板305’，所述右侧接地元件80c’于所述上侧蚀刻板304’的右侧在穿过所述板材主体301’后被导通地连接于所述下侧蚀刻板305’，从而在后续，在所述微波探测器被制造完成而允许所述上侧蚀刻板304’形成所述辐射元件10、所述板材主体301’形成所述辐射缝隙30’和所述下侧蚀刻板305’形成所述参考地20’后，所述中心接地元件80a’、所述左侧接地元件80b’和所述右侧接地元件80c’导通地连接所述辐射源10’和所述参考地20’而使所述辐射源10’被接地，并且所述中心接地元件80a’和所述辐射源10’的连接位置形成所述辐射源10’的所述中心接地点14C’，所述左侧接地元件80b’和所述辐射源10’的连接位置形成所述辐射源10’的所述左侧接地点14L’，所述右侧接地元件80c’和所述辐射源10’的连接位置形成所述辐射源 10’的所述右侧接地点14R’。
参考附图14，以所述屏蔽罩60’罩设所述激励电路40’的方式固定地安装所述参考地20’，以制得所述微波探测器。
也就是说，本发明的所述制造方法进一步包括步骤：
(A)蚀刻所述板材组件300’的被贴装于所述板材主体301’的所述上侧表面3011’的所述上侧金属板302’，以形成所述上侧蚀刻板304’；
(B)蚀刻所述板材组件300’的被贴装于所述板材主体301’的所述下侧表面3012’的所述下侧金属板303’，以形成所述下侧蚀刻板305’；以及
(C)形成自所述上侧蚀刻板304’的偏离物理中心的位置延伸至和导通于位于所述板材主体301’的所述下侧表面3012’的所述激励电路40’的所述导通元件70’、自所述上侧蚀刻板304’延伸至和导通于所述下侧蚀刻板305’的至少三个所述接地元件80’，以制得所述微波探测器，其中所述上侧蚀刻板304’形成所述微波探测器的所述辐射源10’，所述板材主体301’形成所述微波探测器的所述辐射缝隙30’，所述下侧蚀刻板305’形成所述微波探测器的所述参考地20’，所述上侧蚀刻板304’的用于连接所述导通元件70’的位置形成所述辐射源10’的所述馈电点13’，所述上侧蚀刻板304’的用于连接每个所述接地元件80’的位置分别形成所述辐射源10’的每个接地点，其中一个所述接地点位于所述辐射源10’的零电位点而形成所述中心接地点14C’，至少一个所述接地点位于所述辐射源10’的零电位点的左侧而形成至少一个所述左侧接地点14L’，至少一个所述接地点位于所述辐射源10’的零电位点的右侧而形成至少一个所述右侧接地点14R’。
值得一提的是，在本发明的所述制造方法另一个较佳示例中，所述步骤(B)在所述步骤(A)之前，从而首先蚀刻所述下侧金属板303’而形成所述下侧蚀刻板305’，其次蚀刻所述上侧金属板302’而形成所述上侧蚀刻板304’。可选地，在本发明的所述制造方法的再一个较佳示例中，所述步骤(A)和所述步骤(B)同时进行，从而同时蚀刻所述上侧金属板302’和所述下侧金属板303’而形成所述上侧蚀刻板304’和所述下侧蚀刻板305’。
优选地，在所述步骤(B)中，在蚀刻所述下侧金属板303’以形成所述下侧蚀刻板305’的同时，藉由所述下侧金属板303’形成所述激励电路40’的至少一部分。
本领域的技术人员可以理解的是，以上实施例仅为举例，其中不同实施例的特征可以相互组合，以得到根据本发明揭露的内容很容易想到但是在附图中没有明确指出的实施方式。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (22)

  1. 一具有接地点的微波探测器，其特征在于，包括：
    一辐射缝隙；
    一参考地；
    一激励电路，所述激励电路被设置用于提供交变信号；以及
    一辐射源，其中所述辐射源以与所述参考地相平行的方式被间隔地保持于所述参考地的一侧，其中所述辐射缝隙形成于所述参考地和所述辐射源之间，其中所述辐射源具有一馈电点，其中所述馈电点偏离于所述辐射源的物理中心点，其中所述辐射源的所述馈电点被电连接于所述激励电路，其中所述辐射源于所述馈电点在所述激励电路的交变信号的激励下具有一能量平衡线和以所述能量平衡线分别在靠近和远离所述馈电点的方向等距平移而于所述辐射源界定的一能量平衡带，其中所述馈电点于所述辐射源位于所述能量平衡带之外，其中所述能量平衡线为所述辐射源上穿过所述辐射源的物理中心点并垂直于所述辐射源的物理中心点与所述馈电点连线的直线，其中所述能量平衡带沿所述能量平衡线方向以所述辐射源的物理中心点和所述馈电点的连线为界的两侧形成所述能量平衡带的两端部，其中所述辐射源于所述能量平衡带的至少一所述端部被接地。
  2. 根据权利要求1所述的具有接地点的微波探测器，其中所述辐射源于所述能量平衡带的其中一所述端部具有与所述参考地导电相接的至少一接地点，以允许所述辐射源于所述能量平衡带的该所述端部藉由所述接地点与所述参考地的导电连接被接地。
  3. 根据权利要求2所述的具有接地点的微波探测器，其中至少一所述接地点位于所述辐射源的所述能量平衡线。
  4. 根据权利要求2所述的具有接地点的微波探测器，其中所述接地点被成对设置，其中被成对设置的所述接地点于所述辐射源的所述能量平衡带以所述能量平衡线对称分布。
  5. 根据权利要求2所述的具有接地点的微波探测器，其中所述辐射源于所述能量平衡带的另一所述端部具有与所述参考地导电相接的至少一所述接地点，以允许所述辐射源于所述能量平衡带的两所述端部分别藉由所述接地点与所述参考地的导电连接被接地。
  6. 根据权利要求5所述的具有接地点的微波探测器，其中各所述接地点均位于所述辐射源的所述能量平衡线。
  7. 根据权利要求5所述的具有接地点的微波探测器，其中位于所述能量平衡带的同一所述端部的至少一对所述接地点被成对设置，其中被成对设置的该对所述接地点于所述辐射源的所述能量平衡带以所述能量平衡线对称分布。
  8. 根据权利要求5所述的具有接地点的微波探测器，其中位于所述能量平衡带的其中一所述端部的至少一所述接地点以所述辐射源的物理中心点和所述馈电点的连线与位于所述能量平衡带的另一所述端部的所述接地点对称。
  9. 根据权利要求2至8中任一所述的具有接地点的微波探测器，设所述微波探测器发射的微波波长为λ，其中所述接地点于所述能量平衡带的相应所述端部在沿所述能量平衡线方向与所述辐射源的物理中心点和所述馈电点的连线之间的距离大于等于λ/16。
  10. 根据权利要求9所述的具有接地点的微波探测器，其中所述接地点于所述能量平衡带的相应所述端部位于所述辐射源的侧边缘。
  11. 根据权利要求2至8中任一所述的具有接地点的微波探测器，其中所述辐射源于所述辐射源的物理中心点具有与所述参考地导电相接的至少一中心接地点，以允许所述辐射源于所述辐射源的物理中心点藉由所述中心接地点与所述参考地的导电连接被接地。
  12. 根据权利要求9所述的具有接地点的微波探测器，其中所述辐射源于所述辐射源的物理中心点具有与所述参考地导电相接的一中心接地点，以允许所述辐射源于所述辐射源的物理中心点藉由所述中心接地点与所述参考地的导电连接被接地。
  13. 根据权利要求1至8中任一所述的具有接地点的微波探测器，其中所述的微波探测器进一步包括一基础板，其中所述参考地被贴装于所述基础板的一侧以被所述基础板保持平整，其中所述激励电路被设置于所述基础板的贴装有所述参考地的一侧的相对侧。
  14. 根据权利要求13所述的具有接地点的微波探测器，其中所述的微波探测器进一步包括一屏蔽罩，其中所述屏蔽罩以罩设所述激励电路的方式被设置于所述基础板。
  15. 一微波探测器的制造方法，其特征在于，所述制造方法包括如下步骤：
    (a)蚀刻一下板组件的一第二金属板以允许所述第二金属板形成一缺口和蚀刻所述下板组件的一第三金属板以允许所述第三金属板形成一激励电路的至少一部分；
    (b)贴装一上板组件的一上基板于所述第二金属板；以及
    (c)形成自所述上板组件的一第一金属板经所述第二金属板的所述缺口延伸至和导通于所述激励电路的一导通元件、自所述第一金属板延伸至和导通于所述第二金属板的至少三接地元件，以制得所述微波探测器，其中所述第一金属板形成所述微波探测器的一辐射源，所述上基板形成所述微波探测器的一辐射缝隙，所述第二金属板形成所述微波探测器的一参考地，所述第一金属板的用于连接所述导通元件的位置形成所述辐射源的一馈电点，所述第一金属板的用于连接每个所述接地元件的位置分别形成所述辐射源的每个接地点，其中一个所述接地点位于所述辐射源的零电位点而形成一中心接地点，至少一个所述接地点位于所述辐射源的零电位点的左侧而形成至少一左侧接地点，至少一个所述接地点位于所述辐射源的零电位点的右侧而形成至少一右侧接地点。
  16. 根据权利要求15所述的制造方法，进一步包括步骤：(d)以罩设所述激励电路的方式设置一屏蔽罩于所述下板组件的一下基板。
  17. 根据权利要求15或16所述的制造方法，其中在所述步骤(c)中，通过金属化过孔工艺形成所述导通元件和每个所述接地元件。
  18. 一微波探测器的制造方法，其特征在于，所述制造方法包括如下步骤：
    (A)蚀刻一板材组件的被贴装于一板材主体的上侧表面的一上侧金属板，以形成一上侧蚀刻板；
    (B)蚀刻所述板材组件的被贴装于所述板材主体的下侧表面的一下侧金属板，以形成一下侧蚀刻板；以及
    (C)形成自所述上侧蚀刻板的偏离物理中心的位置延伸至和导通于位于所述板材主 体的下侧表面的一激励电路的一导通元件、自所述上侧蚀刻板延伸至和导通于所述下侧蚀刻板的至少三接地元件，以制得所述微波探测器，其中所述上侧蚀刻板形成所述微波探测器的一辐射源，所述板材主体形成所述微波探测器的一辐射缝隙，所述下侧蚀刻板形成所述微波探测器的一参考地，所述上侧蚀刻板的用于连接所述导通元件的位置形成所述辐射源的一馈电点，所述上侧蚀刻板的用于连接每个所述接地元件的位置分别形成所述辐射源的每个接地点，其中一个所述接地点位于所述辐射源的零电位点而形成一中心接地点，至少一个所述接地点位于所述辐射源的零电位点的左侧而形成至少一左侧接地点，至少一个所述接地点位于所述辐射源的零电位点的右侧而形成至少一右侧接地点。
  19. 根据权利要求18所述的制造方法，其中在上述方法中，所述步骤(B)在所述步骤(A)之前，从而首先蚀刻所述下侧金属板而形成所述下侧蚀刻板，其次蚀刻所述上侧金属板而形成所述上侧蚀刻板。
  20. 根据权利要求18所述的制造方法，其中在所述步骤(B)中，在蚀刻所述下侧金属板以形成所述下侧蚀刻板的同时，藉由所述下侧金属板形成所述激励电路的至少一部分。
  21. 根据权利要求18至20中任一所述的制造方法，其中在所述步骤(C)中，通过金属化过孔工艺形成所述导通元件和每个所述接地元件。
  22. 根据权利要求18至20中任一所述的制造方法，进一步包括步骤：(D)以罩设所述激励电路的方式设置一屏蔽罩于所述参考地。
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