WO2021029360A1 - 導電材でコーティングされた基材を製造する方法、多層材料、および導電材でコーティングされた基材 - Google Patents
導電材でコーティングされた基材を製造する方法、多層材料、および導電材でコーティングされた基材 Download PDFInfo
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- WO2021029360A1 WO2021029360A1 PCT/JP2020/030367 JP2020030367W WO2021029360A1 WO 2021029360 A1 WO2021029360 A1 WO 2021029360A1 JP 2020030367 W JP2020030367 W JP 2020030367W WO 2021029360 A1 WO2021029360 A1 WO 2021029360A1
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Classifications
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
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- C09D133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
- C09D133/16—Homopolymers or copolymers of esters containing halogen atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
Definitions
- This disclosure relates to a novel conductor structure and a method for manufacturing the same. More specifically, the present disclosure relates to a method of making a substrate coated with a conductive material, the substrate or conductor produced, and certain solvents used in the production thereof.
- the present disclosure provides a conductive material containing a desired combination of conductive components and a base material.
- the disclosure provides, for example:
- (Item 1) A method for producing a base material coated with a conductive material, in which a coating agent containing a conductive component, a coating component, and a solvent is used on a part or all of the surface of the base material.
- the solvent comprises the steps of forming the conductive material from the conductive component and the coating component on the substrate, and the solvent dissolves the coating component so as to allow coating, but the group.
- (Item 1B) A method for producing a base material coated with a conductive material, in which a coating agent containing a conductive component, a coating component, and a solvent is used on a part or all of the surface of the base material.
- a method comprising a step of coating with a substrate and a step of forming the conductive material from the conductive component on the substrate and the coating component, wherein the solubility of the substrate in the solvent is smaller than the solubility of the coating component.
- a method for producing a base material coated with a conductive material in which a coating agent containing a conductive component, a coating component, and a solvent is used on a part or all of the surface of the base material. Including the step of coating with the coating component and the step of forming the conductive material from the conductive component on the base material and the coating component, the solvent dissolves the coating component, but substantially dissolves the base material. Not the way.
- (Item 2) The method according to any one of the above items, wherein the coating component is a homopolymer containing one kind of monomer component or a copolymer containing two or three kinds of monomer components.
- (Item 2a) The method according to any one of the above items, wherein the coating component is a copolymer.
- (Item 2b) The method according to any one of the above items, wherein the coating component is conductive polyacetylene.
- (Item 2c) The method according to any one of the above items, wherein both the coating component and the conductive component are conductive polyacetylene.
- (Item 3) The method according to any one of the above items, wherein the conductive material is formed from the coating agent by heat treatment.
- (Item 4) The method according to any one of the above items, wherein the conductive component is a metal filler.
- the conductive component contains silver, copper, gold, aluminum, zinc, nickel, tin, and / or iron.
- (Item 5a) The method according to any one of the above items, wherein the conductive component is silver.
- the base material is a resin.
- (Item 6a) The method according to the above item, wherein the base material is a polyolefin resin, a polyacrylic resin, or a polyamide resin.
- the coating component is a copolymer of isostearyl acrylate, 2,2,2-trifluoroethyl acrylate and (3-ethyloxetane-3-yl) acrylate, according to any one of the above items. the method of. (Item 15) The method according to any one of the above items, wherein the coating agent further contains a dispersant. (Item 16) The method according to any one of the above items, wherein the dispersant is 2- (2-butoxyethoxy) ethanol. (Item 17) Combination of base material, conductive material and solvent. (Item 17a) The combination according to any one of the above items, which comprises one or more of the features described in the above item.
- the substrate according to any one of the above items, which comprises one or more of the features described in the above item.
- the disclosure also provides, for example:
- (Item A1a) A method for producing a base material coated with a conductive material, in which a coating agent containing a conductive component, a coating component, and a solvent is used on a part or all of the surface of the base material.
- the solvent comprises the steps of forming the conductive material from the conductive component and the coating component on the substrate, and the solvent dissolves the coating component so as to allow coating, but the group.
- (Item A1b) A method for producing a base material coated with a conductive material, in which a coating agent containing a conductive component, a coating component, and a solvent is used on a part or all of the surface of the base material.
- a method comprising a step of coating with a substrate and a step of forming the conductive material from the conductive component on the substrate and the coating component, wherein the solubility of the substrate in the solvent is smaller than the solubility of the coating component.
- a method for producing a base material coated with a conductive material in which a coating agent containing a conductive component, a coating component, and a solvent is used on a part or all of the surface of the base material.
- the solvent comprises the steps of coating with and the conductive component on the substrate and the step of forming the conductive material from the coating component, wherein the solvent dissolves the coating component but substantially dissolves the substrate. Not the way.
- (Item A2a) The method according to any one of the preceding items, wherein the coating component is a homopolymer containing one monomer component or a copolymer containing two or more monomer components.
- (Item A2b) The method according to any one of the preceding paragraphs, wherein the coating component is a homopolymer containing one monomer component or a copolymer containing two to three monomer components.
- (Item A2c) The method according to any one of the preceding items, wherein the coating component is a copolymer.
- (Item A2d) The method according to any one of the preceding items, wherein the coating component is conductive polyacetylene.
- (Item A6a) The method according to any one of the preceding items, wherein the base material is a resin.
- (Item A6b) The method according to any one of the preceding items, wherein the base material is a polyolefin resin, a polyacrylic resin, or a polyamide resin.
- (Item A7) The method according to any one of the preceding items, wherein the solvent is a hydrocarbon solvent or an alcohol solvent.
- (Item A8) The method according to any one of the preceding items, wherein the solvent is a hydrocarbon solvent.
- (Item A9) The method according to any one of the preceding items, wherein the hydrocarbon solvent is hepsane, octane, limonene, or undecane or a combination thereof.
- the coating component is a copolymer of isostearyl acrylate, 2,2,2-trifluoroethyl acrylate and (3-ethyloxetane-3-yl) acrylate, according to any one of the preceding items.
- the method described. (Item A18) The method according to any one of the preceding items, wherein the coating component is a copolymer of lauryl acrylate and 2,2,2-trifluoroethyl acrylate.
- the coating component is a copolymer of stearyl acrylate and 2,2,2-trifluoroethyl acrylate.
- a conductive material containing a desired combination of a conductive component and a base material can be freely produced.
- the base material is less damaged, a high-quality conductive material can be provided.
- conductivity is used in the usual sense in the art and means the property of conducting electricity, and the amount of physical properties thereof is called “conductivity”, and is used for a certain object (also called a conductor). It is defined as the reciprocal of resistivity (specific resistivity, also called volume resistivity in the resin field).
- the conductivity is measured as follows. Specifically, unless otherwise specified, a measurement target (for example, a film) is cut out into a length of 0.5 cm, a width of 2.00 cm, and a thickness of 0.2 cm, and a four-terminal measurement method (for example, Loresta GP [Mitsubishi Chemical]. Analytech] can be used, but the value measured by is not limited to this).
- firing refers to a process of molding a raw material powder, heating it, shrinking and densifying it, and obtaining a sintered body having a certain shape and strength.
- sintering refers to a phenomenon in which raw material powder is baked and hardened at a high temperature, and although gaps are observed between the particles of the raw material powder, sintering is performed in a high temperature environment (temperature lower than the melting point). When this happens, the contact area between the particles increases, the gaps decrease, and the particles harden. The remaining gap is called a "void” or "vacancy”.
- the "base material” refers to a material coated with a conductive material.
- Examples include commonly available papers such as fine paper, kraft paper, crepe paper, glassin paper, polyolefins such as polyethylene, polypropylene, polystyrene, and polyvinyl chloride, polyesters, polyamides, polyacrylics, polyurethanes, etc.
- Examples thereof include resins such as cellophane, woven fabrics, non-woven fabrics, textile products such as fabrics, and the like, but the present disclosure is not limited to such examples.
- the term "conductive material" refers to any material having conductivity.
- the conductive material has a resistance of 1.0 ⁇ 10 -1 ⁇ ⁇ cm or less, usually 1.0 ⁇ 10 ⁇ 2 ⁇ ⁇ cm or less, preferably 1.0 ⁇ 10 -3 ⁇ ⁇ cm or less. It is intended for those with a rate, but is not limited to this.
- the conductive material contains a conductive component that imparts conductivity.
- the conductive material is usually composed of a coating component and a conductive component.
- the "conductive component” means any component that imparts conductivity.
- the conductive component include, but are not limited to, any metal component, a metal oxide, a metal component such as a metal carbide, carbon, a conductive organic compound, a conductive polymer, and the like.
- the "coating component” means a component used for the purpose of covering a certain material as a coating.
- the coating component include polymers, and specific examples include (meth) acrylic polymers, epoxy polymers, urethane polymers, fluoropolymers, polyester resins, melamine resins, silicone resins and the like.
- coating agent refers to any drug containing a coating component, and is usually provided by dissolving the coating component and other optional components in a solvent.
- coating agents include those containing coating components, solvents, and optionally dispersants.
- the specific composition of each of these components is irrelevant to the essence of the present disclosure. That is, it should be noted that the range is not determined by the relationship with the specific chemical properties of each component because it is defined by the relationship with the solubility.
- the "solvent” refers to a medium that dissolves a certain component, and examples thereof include a solvent that dissolves a conductive component, a raw material of a base material, a coating component, and the like.
- dissolution of a coating component or the like means a phenomenon in which a substance to be dissolved dissolves in a solvent without remaining undissolved to become a uniform liquid.
- damage of a base material or the like means that a substance such as a base material is damaged or damaged. Damage to the base material and the like includes, for example, leaving a mark after dropping the solvent on the surface of the base material, and swelling (swelling) the portion in contact with the solvent.
- “does not damage the base material” means that "damage” does not occur or is not caused in the base material. Damage to the base material is the weight or volume of the base material after immersing the target base material in the solvent used as the target for a certain period of time (for example, 1 minute, 10 minutes, 1 hour) and then removing the solvent. It can be determined by measuring whether there is a change. Here, typically, when there is a change in weight of 1% by weight, it can be determined that the product is damaged. Alternatively, if there is a change in weight such as less than 2% by weight, less than 1% by weight, less than 0.5% by weight, or less than 0.1% by weight, it can be determined that the product is damaged.
- the change in volume is less than 1 volume%.
- if there is a change in weight such as less than 2% by volume, less than 1% by volume, less than 0.5% by volume, or less than 0.1% by volume, it can be determined that the product is damaged.
- the "solubility" in a solvent means the limit amount at which a certain solute is soluble in a certain amount of solvent.
- substantially insoluble means that a substance (for example, a base material, a resin) in a solvent is immersed for a certain period of time (for example, 1 minute, 10 minutes, 1 hour), and then the solvent is used. It means that less than 2% by weight, less than 1% by weight, less than 0.5% by weight, or less than 0.1% by weight of a substance is dissolved. Alternatively, when viewed by volume, it means that less than 2% by volume, less than 1% by volume, less than 0.5% by volume, or less than 0.1% by volume of a substance is dissolved.
- solvent dissolves the coating component but does not substantially dissolve the substrate
- solvent dissolves the coating component, while the solvent does not substantially dissolve the substrate.
- the "metal-based component” is a component containing a metal atom as a component thereof in some form, and is a component derived from a metal other than a metal, for example, a metal oxide, a metal carbide, or a metal sulfide. It is a concept that includes such things.
- the "metal component” includes a metal or an alloy.
- the "(metal) filler” is an additive containing or composed of a metal-based component. In the present disclosure, it is used to fill (fill) the polymer network of coating components.
- the "copolymer containing a monomer component” means a copolymer produced by polymerizing the monomer component.
- resin includes natural resin and synthetic resin
- natural resin means a naturally occurring substance in a plant
- synthetic resin is synthesized by the development of organic chemistry. It means a substance that has properties similar to those of natural resin.
- examples of resins include polyolefin resins, polyacrylic resins, polyurethane resins, and polyamide resins.
- the polyolefin resin refers to a resin containing a polymer synthesized by using simple olefins or alkenes as a monomer (unit molecule), and examples thereof include polyethylene and polypropylene.
- the polyacrylic resin refers to a resin containing a polymer synthesized from a monomer having an acrylic unit such as acrylic acid, an acrylic acid ester, and an acrylic acid amide, and examples thereof include polyacrylic acid, polyacrylate, and polyacrylamide. ..
- the polyurethane resin refers to a resin containing a polymer having a urethane bond, and examples thereof include a polymerization product of a diisocyanate and a diol monomer or a triol monomer.
- Polyamide resin is a polymer formed by binding a large number of monomers by amide bonds.
- the "hydrocarbon-based solvent” means a compound composed of carbon and hydrogen that can be used as a solvent. Specific examples thereof include, but are not limited to, n-hexane, n-heptane, n-octane, n-undecane, benzene, toluene, xylene, cyclopentane, cyclohexane, limonene, and combinations thereof.
- the "alcohol-based solvent” means a compound that has a carbon atom and one or more hydroxyl groups and can be used as a solvent.
- the alcohol-based solvent is, for example, one in which the hydrogen atom of the hydrocarbon-based solvent is substituted with one or more hydroxyl groups.
- Specific examples include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, isobutyl alcohol, 3-methoxy-3-methyl-1-butanol, octanol, 2-ethyl-1-hexanol, Examples include, but are not limited to, ethylene glycol, diethylene glycol, triethylene glycol, glycerol, and combinations thereof.
- the "monomer” means a compound obtained by polymerizing two or more of them to form a polymer.
- the monomers of the present disclosure include (meth) acrylic monomers, ethylene-based monomers, urethane-based monomers, amide-based monomers, ester-based monomers, ether-based monomers, imide-based monomers, amide-imide-based monomers, and carbonate-based monomers.
- Acetal-based monomer, sulfone-based monomer, phenylene sulfide-based monomer, ether ether ketone-based monomer, silicone-based monomer, styrene-based monomer, butadiene-based monomer and AES resin, diallyl phthalate resin, ABS resin, silicone resin, etc. are formed by polymerization. Monomers can be mentioned.
- alkyl-containing monomer that improves the solubility in a hydrocarbon solvent refers to the target alkyl-containing monomer when the solubility is tested using the target hydrocarbon solvent.
- the “monomer for improving elasticity” means that the glass transition temperature Tg of the homopolymer measured by a thermogravimetric differential thermal analyzer (Tg-DTA) is 25 ° C. or lower, more preferably 0 ° C. or lower. It is a monomer.
- Tg-DTA thermogravimetric differential thermal analyzer
- the "monomer containing a chain or cyclic ether structure” is a monomer having -C-OC- as a part of the structure, and the -C-O-C- portion is a monomer. It may be a part of a chain structure or a part of a cyclic structure. Specific examples of this monomer include glycidyl acrylate, (3-ethyloxetane-3-yl) acrylate, 2-methoxyethyl acrylate, 4-hydroxybutyl vinyl ether, 2-hydroxyethyl vinyl ether (HEVE), and diethylene glycol monovinyl ether (DEVG).
- N-propyl vinyl ether NPVE
- isopropyl vinyl ether IPVE
- n-butyl vinyl ether NBVE
- isobutyl vinyl ether IBVE
- 2-ethylhexyl vinyl ether 2-EHVE
- cyclohexyl vinyl ether CHVE
- 1,4-butanediol divinyl ether BDVE
- TEGDVE 1,4-butanediol divinyl ether
- DEGDVE 1,4-cyclohexanedimethanol divinyl ether
- CHDVE 1,4-cyclohexanedimethanol divinyl ether
- the "dispersant” means that solid particles in a slurry are uniformly dispersed in a dispersion medium (for example, an organic solvent or water) to reduce the viscosity and improve the stability of the slurry (aggregation and sedimentation of solid particles).
- a dispersion medium for example, an organic solvent or water
- Prevention ⁇ It is an additive that contributes to high concentration and improves the efficiency of the dispersion process.
- the "kit” usually refers to a unit in which parts to be provided (for example, coating component, conductive component, solvent, instruction manual, etc.) are provided by dividing into two or more sections.
- the form of this kit is preferred when the purpose is to provide a composition that should not be mixed and provided for stability and the like, but is preferably mixed and used immediately before use.
- Such a kit preferably describes how to use the provided parts (eg, conductive components, coating components) or how to treat the reagents or waste liquid after use. Or it is advantageous to have instructions.
- the kit may usually include instructions and the like that describe how to use the solvent and the like.
- the conductive material provided in the present disclosure includes any conductive component available in the art.
- the conductive material of the present disclosure is characterized in that the conductivity is improved by containing a composition (also referred to as a conductivity improver) for improving the conductivity provided in the present disclosure.
- the conductive material of the present disclosure may typically contain a base material in addition to a conductive component.
- the coating component of the present disclosure can be prepared by heating the monomer and / or by irradiating the monomer with ultraviolet rays having a specific illuminance to polymerize the monomer. Such ultraviolet irradiation can be arbitrarily set and carried out by those skilled in the art. When the coating component is prepared by polymerizing using ultraviolet rays, a drying operation for removing the solvent, which is a complicated operation, is not required, and the workability is excellent.
- ultraviolet rays refer to electromagnetic waves having a shorter wavelength than visible light and a longer wavelength than X-rays.
- the short wavelength end of visible light at the upper limit is 400 nm, and ultraviolet light can be defined as an electromagnetic wave having a wavelength lower than this.
- the lower limit of the wavelength of ultraviolet rays is about 10 nm, and it is understood that electromagnetic waves having a wavelength longer than this fall into the category of ultraviolet rays.
- the wavelength of the ultraviolet rays used in the present disclosure may be any wavelength, and an appropriate wavelength can be selected according to the intended purpose.
- any wavelength may be used as long as it can exert an initial effect on the monomer.
- it is of a wavelength that can be emitted by the light source used in the examples.
- a light source of about 150 nm to 400 nm is used, preferably 300 nm to 400 nm.
- the preferred illuminance of ultraviolet light used in this disclosure depends on the starting material.
- the ultraviolet irradiation device is not particularly limited, and for example, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, a black light lamp, a UV electrodeless lamp, a short arc lamp, an LED, etc. Can be mentioned.
- a polymerization initiator When polymerizing the monomer, it is preferable to use a polymerization initiator.
- the polymerization initiator include a thermal polymerization initiator, a photopolymerization initiator, a redox polymerization initiator, an ATRP (atomic transfer radical polymerization) initiator, an ICAR ATRP initiator, an ARGET ATRP initiator, and a RAFT (reversible addition-cleavage).
- ATRP atomic transfer radical polymerization
- ICAR ATRP initiator atomic transfer radical polymerization
- ARGET ATRP initiator an ARGET ATRP initiator
- RAFT reversible addition-cleavage
- Examples thereof include a chain transfer polymerization) agent, an NMP (nitroxide-mediated polymerization) agent, and a polymer polymerization initiator.
- These polymerization initiators may be used alone or in combination of two or more.
- a photopolymerization initiator is preferable from the viewpoint of not leaving a
- photopolymerization initiator examples include 2,4,6-trimethylbenzoyldiphenylphosphenyl oxide, 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetraphenyl-1,1'.
- the amount of the photopolymerization initiator is usually preferably about 0.01 part by weight to about 20 parts by weight per 100 parts by weight of all the monomers.
- thermal polymerization initiator examples include azobisisobutyronitrile (AIBN), 2,2'-azobis (methyl isobutyrate), 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2.
- Azo-based polymerization initiators such as'-azobis (2-methylbutyronitrile) and 1,1'-azobis (cyclohexane-1-carbonitrile), peroxides such as benzoyl peroxide, potassium persulfate, and ammonium persulfate. Examples thereof include a polymerization initiator, but the present disclosure is not limited to such examples. These polymerization initiators may be used alone or in combination of two or more.
- the amount of the thermal polymerization initiator is usually preferably about 0.01 part by weight to about 20 parts by weight per 100 parts by weight of all the monomers.
- the resulting composite material may contain air bubbles. Since such bubbles can be the starting point of fracture, it is predicted that the impact absorption capacity can be improved while the properties such as the extensibility of the composite material may be deteriorated.
- the bubbles contained in the composite material are not limited to those derived from the polymerization initiator, and the resin or the like contains bubbles, such as those obtained by adding a foaming agent and those obtained by removing the solvent. It may be a bubble obtained by a known method capable of this.
- redox polymerization initiators such as hydrogen peroxide and iron (II) salt, persulfate and sodium hydrogen sulfite, and ATRP using alkyl halides under a metal catalyst.
- RAFT reversible addition-cleavage chain transfer polymerization
- NMP nitrogen-mediated polymerization
- Polydimethylsiloxane unit-containing polymer azo polymerization initiator polyethylene glycol unit-containing polymer azo polymerization initiator, and other polymer polymerization initiators, but the present disclosure is not limited to these examples. .. These polymerization initiators may be used alone or in combination of two or more.
- a chain transfer agent When polymerizing the monomer, a chain transfer agent may be used to adjust the molecular weight. Chain transfer agents can usually be used by mixing with monomers. Examples of the chain transfer agent include 2- (dodecylthiocarbonothio oil thio) -2-methylpropionic acid, 2- (dodecylthiocarbonoti oil thio) propionate, and methyl 2- (dodecylthio carbonothio oil thio)-.
- the atmosphere for polymerizing the monomer is not particularly limited and may be the atmosphere or an inert gas such as nitrogen gas or argon gas.
- the temperature at which the monomer is polymerized is not particularly limited, and is usually preferably about 5 to 100 ° C.
- the time required to polymerize the monomer varies depending on the polymerization conditions and cannot be unconditionally determined. Therefore, it is arbitrary, but it is usually about 1 to 20 hours.
- the polymerization reaction can be arbitrarily terminated when the amount of the remaining monomer is 20% by mass or less.
- the amount of the remaining monomer can be measured by using, for example, gel permeation chromatography (GPC).
- the coating component can be obtained by bulk polymerization of the monomers as described above.
- the monomer is polymerized in the absence of a cross-linking agent. In another embodiment, the monomer is polymerized in the presence of a cross-linking agent.
- the coating component is thermally polymerized or photopolymerized. In another embodiment, the coating component is thermally polymerized. In another embodiment, the coating component is photopolymerized.
- Examples of the method for polymerizing the monomer include a massive polymerization method, a solution polymerization method, an emulsion polymerization method, a suspension polymerization method, and the like, but the present disclosure is not limited to these examples.
- a massive polymerization method and a solution polymerization method are preferable.
- the polymerization of the monomer can be carried out by a method such as a radical polymerization method, a living radical polymerization method, an anion polymerization method, a cationic polymerization method, an addition polymerization method, a polycondensation method, or a catalytic polymerization method.
- the monomer when the monomer is polymerized by a solution polymerization method, for example, the monomer can be polymerized by dissolving the monomer in a solvent and adding a polymerization initiator to the solution while stirring the obtained solution.
- the monomer can be polymerized by dissolving the initiator in a solvent and adding the monomer to the solution while stirring the obtained solution.
- the solvent is preferably an organic solvent that is compatible with the monomer.
- the homopolymers or copolymers contained in the conductive materials of the present disclosure use peroxide-based initiators (for example, benzoyl peroxide and azobisisobutyronitrile, and their analogs) as polymerization initiators. It is polymerized by.
- peroxide-based initiators for example, benzoyl peroxide and azobisisobutyronitrile, and their analogs
- the amount of the polymerization initiator is usually preferably about 0.01 part by weight to about 20 parts by weight per 100 parts by weight of all the monomers.
- electron beam polymerization is performed by irradiating the monomer with an electron beam.
- the monomer can be polymerized by irradiation with only an electron beam.
- the electron beam is irradiated in the presence of a photopolymerization initiator in one embodiment and in the absence of a photopolymerization initiator in another embodiment. Both embodiments are within the scope of the present disclosure.
- the polymerization reaction temperature and atmosphere when polymerizing the monomer are not particularly limited. Generally, the polymerization reaction temperature is about 50 ° C. to about 120 ° C.
- the atmosphere during the polymerization reaction is preferably an inert gas atmosphere such as nitrogen gas.
- the polymerization reaction time of the monomer varies depending on the polymerization reaction temperature and the like and cannot be unconditionally determined, but is usually about 3 to 20 hours.
- the conductive material of the present disclosure is prepared by mixing one or more specific monomers and adding an appropriate polymerization initiator or other additive as necessary under appropriate polymerization conditions. It can be produced by polymerizing with.
- Specify the solvent for the selected coating component The identification is realized by selecting a solvent that dissolves the coating component.
- the selection may be specified by literature values or may be actually experimented. Preferably, it is desirable to confirm by actual experiment.
- a base material that does not dissolve in the solvent may be specified by literature values or may be actually experimented. Preferably, it is desirable to confirm by actual experiment.
- the following procedure can be performed.
- (1) Determine the coating component to be used.
- (2) The coating component is immersed in a candidate solvent, and a solvent for dissolving the coating component is specified.
- (3) The solvent specified in (2) is dropped onto the candidate base material to specify a base material that is not damaged by the solvent.
- (4) The coating component is dissolved in the solvent specified in (3) to prepare a coating component solution.
- the coating component solution is dropped onto the "solvent-insoluble substrate" specified in (3), and it is confirmed that the coating component solution does not damage the substrate.
- Examples of conductive components include natural graphite such as scaly graphite, graphite such as artificial graphite, acetylene black, ketjen black, channel black, furnace black, lamp black, thermal black and other carbon black, graphene, carbon nanotubes, and fullerene.
- Carbon-based materials such as; conductive fibers such as carbon fiber and metal fiber; carbon fluoride; powder of metal particles such as copper, nickel, gold, tin, aluminum, zinc, iron and silver; zinc oxide, potassium titanate, etc.
- Examples thereof include conductive whiskers; conductive metal oxides such as titanium oxide; organic conductive materials such as polyphenylene derivatives, but the present disclosure is not limited to these examples.
- Each of these conductive components may be used alone, or two or more types may be used in combination.
- carbon nanotubes, carbon black, graphene and metals are excellent in workability and moldability, and from the viewpoint of obtaining a conductive film having excellent flexibility and extensibility in a wide range of changes in electrical resistance. Particles are preferred, with carbon nanotubes, carbon black, graphene and silver particles being more preferred.
- the solid content of the conductive component in the total solid content of the coating component and the conductive component cannot be unconditionally determined because it differs depending on the type of the conductive component and the like, but it is usually excellent in workability and moldability, and also From the viewpoint of obtaining a conductive film having excellent flexibility and extensibility in a wide range of rate of change in electrical resistance, it is preferably 1% by mass or more, which is excellent in workability and moldability and in a wide range of rate of change in electrical resistance. From the viewpoint of obtaining a conductive film having excellent flexibility and extensibility, it is preferably 100% by mass or less.
- Examples of carbon nanotubes include single-wall carbon nanotubes having a hollow cylindrical structure in which one sheet of graphite (graphene sheet) is rolled into a cylinder, and multi-walls having a structure in which a plurality of single-wall carbon nanotubes having different diameters are concentrically laminated.
- Examples thereof include carbon nanotubes, single-wall carbon nanotubes manufactured by the super-growth method, carbon nanocones having a conical and closed end of the single-wall carbon nanotubes, and carbon nanotubes containing fullerenes inside. Is not limited to such examples.
- Each of these carbon nanotubes may be used alone, or two or more types may be used in combination.
- multi-wall carbon nanotubes are preferable.
- the length of the carbon nanotubes is preferably 0.1 to 1000 ⁇ m, more preferably 0.1 to 1000 ⁇ m, from the viewpoint of obtaining a conductive film having excellent workability and moldability and excellent flexibility and extensibility in a wide range of changes in electrical resistance. Is 1 to 500 ⁇ m, more preferably 1 to 90 ⁇ m.
- the diameter of the carbon nanotubes is preferably 10 to 50 nm, more preferably 10 to 50 nm, from the viewpoint of obtaining a conductive film having excellent workability and moldability and excellent flexibility and extensibility in a wide range of changes in electrical resistance. It is 20 nm.
- the solid content of carbon nanotubes in the total solid content of the coating component and carbon nanotubes is excellent in workability and moldability, and a conductive film having excellent flexibility and extensibility in a wide range of changes in electrical resistance is obtained. From the viewpoint, it is preferably 1% by mass or more, more preferably 1.5% by mass or more, still more preferably 2% by mass or more, excellent in workability and moldability, and flexible and flexible in a wide range of rate of change in electrical resistance. From the viewpoint of obtaining a conductive film having excellent extensibility, it is preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less, and even more preferably 3.5 to 10% by mass. is there.
- the coating agent used in the present disclosure may contain a coating component and a solvent, as well as other components for imparting other functions such as promoting coating.
- the coating agent of the present disclosure may contain a dispersant.
- the number of hydroxyl groups in the molecule may be 1 or more, for example, 1 to 10, preferably 1 to 5, and more preferably 1 to 3 (particularly 1 to 2).
- the number of ether bonds in the molecule may be 1 or more, for example, 1 to 10, preferably 1 to 5, and more preferably 1 to 3 (particularly 1 to 2).
- Specific examples of the dispersant include diethylene glycol diethylene glycol (245 ° C.), triethylene glycol (179 ° C.), tetraethylene glycol (327.3 ° C.), polyethylene glycol, cellosolves (for example).
- Methyl cellosolve also known as ethylene glycol monomethyl ether (124.5 ° C), ethyl cellosolve (ethylene glycol monoethyl ether) (135.1 ° C), ethylene glycol monobutyl ether (171.2 ° C), ethylene glycol mono t- C 1-4 alkyl cellosolve such as butyl ether (also known as 2-t-butoxyethanol) (152 ° C.), propylene glycol mono C 1-4 alkyl ether (eg, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol) Monobutyl ether, etc.), carbitols (eg, methyl carbitol (also known as diethylene glycol monomethyl ether) (194 ° C), ethyl carbitol (200 ° C), butyl carbitol (also known as 2- (2-butoxyethoxy) ethanol) (C 1-4 alkyl carbito
- the number of hydroxyl groups in the molecule may be 1 or more, for example, 1 to 10, preferably 1 to 5, and more preferably 1 to 3 (particularly 1 to 2). is there.
- the number of ether bonds in the molecule may be 1 or more, and is, for example, 1 to 10, preferably 1 to 5, and more preferably 1 to 3 (particularly 1 to 2).
- the coating agent comprises 2- (2-butoxyethoxy) ethanol.
- the dispersant may be used to disperse the conductive component in the coating agent.
- any base material can be used as the base material as long as the relationship between the solvent and the coating component is satisfied. That is, what kind of substrate is used as long as the solvent dissolves the coating components so that the coating is possible, but satisfies the conditions that do not damage the substrate (that is, as long as the solvent and the coating are present). May be used.
- the relationship between the base material, the solvent, and the coating component can be observed in the above-mentioned damage, and as an alternative, the solubility of the base material in the solvent becomes smaller than the solubility of the coating component.
- a substrate may be selected in which the coating component and the solvent are present.
- the base material may be slightly reduced because of the degree of solubility, but it can be said that the coating is sufficiently possible in relation to the coating components. Therefore, this relationship can be used in situations where a decrease in the base material is allowed to some extent.
- a base material in which the coating component and the solvent are present which has a relationship in which the solvent dissolves the coating component but does not substantially dissolve the base material, may be selected.
- substantially insoluble means that a decrease in the base material is substantially observed when the object (base material) is immersed in a solvent, for example, a decrease of less than 1% by weight is observed. To be done.
- This alternative can be said to express the presence or absence of damage by the presence or absence of solubility.
- Identify the appropriate solvent for the provided substrate is realized by selecting a solvent that does not dissolve the base material.
- the selection may be specified by literature values or may be actually experimented. Preferably, it is desirable to confirm by actual experiment.
- the coating component that dissolves in the solvent may be specified by literature values or may be actually experimented. Preferably, it is desirable to confirm by actual experiment.
- Specify the base material for the solvent The identification is realized by selecting a base material that is insoluble in the solvent. The selection may be specified by literature values or may be actually experimented. Preferably, it is desirable to confirm by actual experiment.
- the coating component that dissolves in the solvent may be specified by literature values or may be actually experimented. Preferably, it is desirable to confirm by actual experiment.
- examples of the base material include, but are not limited to, polyolefin, polyacrylic, polyamide, polyurethane and the like.
- polyolefins and polyacrylics have low solubility in heptane, octane, undecane, limonene, 2-ethyl-1-hexanol, 1-octanol, 3-methoxy3-methyl-1-butanol. Therefore, for polyolefins and polyacrylics, all of the solvents listed above can be used, especially heptane, octane, undecane, limonene, 2-ethyl-1-hexanol, 1-octanol, 3-methoxy 3-methyl-1. -All butanol is considered available.
- the conductive material of the present disclosure is suitable for, for example, sensors, wirings, electrodes, substrates, power generation elements, speakers, microphones, noise cancellers, transducers, artificial muscles, small pumps, medical instruments and the like used in actuators, industrial robots and the like. It can be suitably used as a conductive film that can be used in the above and as a raw material of the conductive film.
- a method of applying the coating agent to a substrate for example, screen printing, gravure printing, offset printing, knife coater, slot die coater, lip coater, roll coater, flow coater, spray coater, bar coater, dipping and the like are generally used. Examples thereof include methods that can be used, but the present disclosure is not limited to such examples.
- the coating agent When the coating agent is applied to the base material, the coating agent may be applied directly to the base material, or the coated material may be transferred onto the base material after being applied to a paper pattern or the like. By applying the coating agent in this way and then drying it, a conductive film can be formed on the base material.
- the thickness of the coating agent to be applied to the base material varies depending on the types of the coating component and the conductive component and the like, it cannot be unconditionally determined. Therefore, the desired thickness of the conductive material to be formed on the base material can be obtained. It is preferable to make an appropriate decision accordingly.
- the thickness of the coating agent applied to the base material is usually about 100 to 1000 ⁇ m from the viewpoint of obtaining a conductive material having excellent flexibility and extensibility in a wide range of changes in electrical resistance.
- Examples of the method of applying the coating agent to the substrate and then drying it include hot air, far-infrared irradiation, and the like, but the present disclosure is not limited to such examples.
- the present disclosure provides a technique for selecting a solvent according to its solubility according to the application. Therefore, the present disclosure is a method for producing a base material coated with a conductive material, and the method is a coating agent containing a conductive component, a coating component, and a solvent on a part or all of the surface of the base material. Including the step of coating with, and the step of forming the conductive material from the conductive component and the coating component on the substrate, the solvent dissolves the coating component so that it can be coated. Provided is a method that does not damage the substrate.
- the solvent dissolves the coating component so that it can be coated, but does not damage the substrate means the following.
- the solvent enables coating of the coating component on the substrate by dissolving the coating component, and the coating agent containing the coating component, the solvent and, if necessary, the dispersant in the coating step is the group. Does not damage the material.
- the present disclosure provides a desired combination of conductive materials by identifying the solvent by comparing the solubility of the substrate and the coating components. Therefore, the present disclosure is a method for producing a base material coated with a conductive material, and the method is a coating agent containing a conductive component, a coating component, and a solvent on a part or all of the surface of the base material. Including the step of coating with the substrate and the step of forming the conductive material from the conductive component and the coating component on the substrate, the solubility of the substrate in the solvent is smaller than the solubility of the coating component. , Provide a method.
- the step of coating a part or all of the surface of the base material with a coating agent containing a conductive component, a coating component, and a solvent is appropriately performed based on a technique described separately in the present specification or a known technique. be able to.
- a coating agent containing a conductive component, a coating component, and a solvent may be applied to a part or all of the base material.
- the step of forming the conductive material from the conductive component and the coating component on the base material can also be carried out using any method described elsewhere in the present specification or known.
- the solubility of the base material in the solvent is smaller than the solubility of the coating component
- the solubility of the coating component means the following. That is, when comparing the solubility of the base material in a certain solvent and the solubility of the coating component in the solvent, the former is smaller than the latter.
- the present disclosure provides the desired combination of conductive materials by using a solvent that dissolves the coating component and substantially insoluble in the substrate. Therefore, the present disclosure is a method for producing a base material coated with a conductive material, and the method is a coating agent containing a conductive component, a coating component, and a solvent on a part or all of the surface of the base material. Including the step of coating with the substrate and the step of forming the conductive material from the conductive component on the substrate and the coating component, the solvent dissolves the coating component, but substantially the substrate. Provides a method that does not dissolve in.
- the step of coating a part or all of the surface of the base material with a coating agent containing a conductive component, a coating component, and a solvent is appropriately performed based on a technique described separately in the present specification or a known technique. be able to.
- a coating agent containing a conductive component, a coating component, and a solvent may be applied to a part or all of the base material.
- the step of forming the conductive material from the conductive component and the coating component on the base material can also be carried out using any method described elsewhere in the present specification or known.
- the solvent dissolves the coating component but does not substantially dissolve the substrate means the following. That is, the solvent enables coating of the coating component on the base material by dissolving the coating component, and the solvent is less than 2% by weight, less than 1% by weight, and 0.5% by weight of the base material. It means that it dissolves less than% or less than 0.1% by weight.
- a step of coating a part or all of the surface of the base material with a coating agent containing a conductive component, a coating component and a solvent is carried out. Any of the techniques described herein and / or known techniques can be used in this step. In this step, the coating step may also be carried out by the method exemplified in the above-mentioned (Coating method) section.
- a step of forming the conductive material from the conductive component and the coating component on the base material is further carried out. Any technique and / or known technique described herein can be used in this step, but the step of removing the solvent is preferred.
- the coating component is a homopolymer containing one monomer component or a copolymer containing two to three monomer components.
- the coating component is a copolymer.
- the conductive material can be formed from the coating agent by heat treatment.
- the heat treatment can be carried out by the following methods: for example, heating in an oven, heating with superheated steam, heating with microwaves, heating with infrared rays, and the like.
- the conductive component can be a metallic component.
- the metal can be a metal filler.
- the metal component may preferably comprise one or more of silver, copper, gold, aluminum, zinc, nickel, tin, and / or iron, or one or more alloys thereof.
- One preferred metal is silver, but is not limited to it.
- the substrate comprises a resin.
- the substrate can be a resin.
- the resin include, but are not limited to, polyolefin resins, polyacrylic resins, and polyamide resins.
- the solvent may be advantageous for the solvent to contain a hydrocarbon solvent.
- the solvent can be heptane, octane, or limonene, or a combination thereof.
- the solvent can be heptane, octane, undecane, or limonene, or a combination thereof.
- the solvent may contain an alcohol solvent.
- the solvent is 3-methoxy-3-methyl-1-butanol, octanol, 2-ethyl-1-hexanol or a combination thereof.
- the first monomer component of the polymer constituting the coating component is an alkyl-containing monomer for improving the solubility in a hydrocarbon solvent.
- the first monomer component of the monomer component may be isostearyl acrylate, stearyl acrylate or lauryl acrylate.
- the first monomer component is an isostearyl acrylate.
- the first monomer component is stearyl acrylate.
- the first monomer component is lauryl acrylate.
- the second monomer component of the polymer constituting the coating component is a monomer that improves elasticity.
- the second monomer component of the monomer component may be acrylic acid, ethyl acrylate or 2,2,2-trifluoroethyl acrylate.
- the second monomer component is acrylic acid, or 2,2,2-trifluoroethyl acrylate.
- the second monomer component is acrylic acid.
- the second monomer component is ethyl acrylate.
- the second monomer component is 2,2,2-trifluoroethyl acrylate.
- the third monomer component of the polymer constituting the coating component is a monomer containing a chain or cyclic ether structure.
- the third monomer component of the monomer component is glycidyl acrylate, (3-ethyloxetane-3-yl) acrylate, 4-hydroxybutyl vinyl ether, or 2-methoxy. It can be ethyl acrylate. In one embodiment, the third monomer component is glycidyl acrylate or (3-ethyloxetane-3-yl) acrylate. In one embodiment, the third monomer component is 4-hydroxybutyl vinyl ether, or 2-methoxyethyl acrylate. In one embodiment, the third monomer component is a 4-hydroxybutyl vinyl ether.
- the third monomer component is 2-methoxyethyl acrylate. In one preferred embodiment, the third monomer component is glycidyl acrylate. In another preferred embodiment, the third monomer component is (3-ethyloxetane-3-yl) acrylate.
- first monomer component, second monomer component and third monomer component can be arbitrarily combined, and preferably two types (first monomer component and second monomer component) from the above specific example are used. , 2nd monomer component and 3rd monomer component, 3rd monomer component and 1st monomer component, etc.), or 3 types (1st, 2nd and 3rd monomer components) may be combined.
- the first monomer component, the second monomer component and the third monomer component may be combined separately from monomer A, monomer B and monomer C, respectively, and two or three are the same. It may be.
- the coating component is a copolymer of isostearyl acrylate (ISTA) and acrylic acid (AA).
- the coating component is a copolymer of isostearyl acrylate and ethyl acrylate (EA).
- the coating component is a copolymer of lauryl acrylate and 2,2,2-trifluoroethyl acrylate.
- the coating component is a copolymer of stearyl acrylate and 2,2,2-trifluoroethyl acrylate.
- the coating component is a copolymer of lauryl acrylate (LA) and ethyl acrylate.
- the coating component is a copolymer of ethyl acrylate and Cyraplane® FM0725 (manufactured by JNC Corporation).
- the coating component is a copolymer of ethyl acrylate and 4-hydroxybutyl vinyl ether.
- the coating component is a copolymer of ethyl acrylate and 2-methoxyethyl acrylate.
- the coating component is a copolymer of 2,2,2-trifluoroethyl acrylate and 2-methoxyethyl acrylate.
- the coating component can be a copolymer of isostearyl acrylate, preferably a copolymer of isostearyl acrylate and 2,2,2-trifluoroethyl acrylate. This can be advantageous because the volume resistivity is low and the change in resistance value is small.
- the coating component can be a copolymer of isostearyl acrylate, 2,2,2-trifluoroethyl acrylate and glycidyl acrylate. This can be advantageous due to the low volume resistivity.
- the coating component can be a copolymer of isostearyl acrylate, 2,2,2-trifluoroethyl acrylate and (3-ethyloxetane-3-yl) acrylate. This can be advantageous because the volume resistivity is low and the change in resistance value is small.
- the coating agent used in the present disclosure comprises a dispersant.
- the dispersant can be advantageous because it disperses the conductive component sufficiently uniformly in the coating agent, resulting in a decrease in volume resistivity and resistance value change.
- the dispersant is 2- (2-butoxyethoxy) ethanol.
- the present disclosure provides a particular combination of a substrate, a conductive material and a solvent that can be used in the manufacturing process of the present disclosure. As long as it is used in the method of the present disclosure, it may be provided in the form of a combination of a base material and a conductive material, a combination of a conductive material and a solvent, and a combination of a solvent and a base material.
- the present disclosure is a multilayer material having a base material and a conductive layer coated on the surface of the base material, wherein the conductive layer contains a conductive component and a coating component, and the base.
- the material is a multi-layer material that is insoluble in a solvent that dissolves the coating component.
- the base material, the conductive component, the coating component, and the base material to be adopted any combination described in other parts of the present specification can be used, and in those combinations, the base material is a base material. Any material can be used as long as it does not dissolve in a solvent that dissolves the coating component.
- the "layer” means that the conductive layer is present (coated) on the entire surface of the base material, and the conductive layer is present (coated) on at least a part of the surface of the base material. good.
- the present disclosure is a substrate coated with a conductive material, the conductive material containing a metal component and a coating component, the substrate being insoluble in a solvent that dissolves the coating component.
- a substrate that is a thing.
- the base material, the conductive component, the coating component, and the base material to be adopted any combination described in other parts of the present specification can be used, and in those combinations, the base material is a base material. Any material can be used as long as it does not dissolve in a solvent that dissolves the coating component.
- Example 1 Preparation of acrylic coating component
- an acrylic coating component was prepared.
- Isostearyl acrylate (ISTA, 5.1 g), 2,2,2-trifluoroethyl acrylate (4.7 g, manufactured by Osaka Organic Chemical Industry Co., Ltd., trade name Viscoat V # 3F), and 2,4 as a polymerization initiator
- MISA Industrial Chemical Industry Co., Ltd., trade name: Irgacure TPO
- a monomer component containing a polymerization initiator was obtained.
- Example 2 Dissolution test of acrylic coating component
- Example 1 When the coating component (3.00 g) obtained in Example 1 was immersed in heptane, octane, undecane, or limonene (7.00 g each) and checked to see if it was dissolved, it was found that heptane, octane, and limonene It was completely dissolved, and no unmelted residue was confirmed. The resulting coating component solution was used to make a conductive film.
- Example 2 instead of the isostearyl acrylate and 2,2,2-trifluoroethyl acrylate in Example 1, the combination of the first monomer component and the second monomer component shown in the table below, the first monomer component and the second monomer component.
- Each coating component was obtained according to the same method. The resulting coating component was then tested for solubility as described in Example 2. The results are shown in the table below.
- Example 3 Determining damage to the base material due to the solvent
- the degree of damage to the base material by the solvent that dissolves the acrylic coating component was determined.
- Ethyl acrylate (EA, 10.00 g) and 2,4,6-trimethylbenzoyldiphenylphosphine oxide (0.10 g, manufactured by BASF, trade name Irgacure TPO) as a polymerization initiator By mixing, a monomer component containing a polymerization initiator was obtained. After injecting the obtained monomer component into a molding mold made of transparent glass (length: 100 mm, width: 100 mm, depth: 0.3 mm), the irradiation dose of the monomer component is adjusted to 0.36 mW / cm 2. Was irradiated with ultraviolet rays, and the monomer components were bulk-polymerized for 2 hours to obtain a polyacrylic resin film.
- a reactive polyurethane resin (10.00 g, UN-9000PEP manufactured by Negami Kogyo Co., Ltd.) was dissolved in toluene (5.00 g) to obtain a resin solution.
- a reactive polyurethane resin solution containing a polymerization initiator was obtained by mixing 0.1 g of 2-hydroxy-2 methylpropiophenone as a polymerization initiator with the obtained solution.
- the obtained polymer solution was applied as a release film to a release polyethylene terephthalate film (manufactured by Mitsui Chemicals Tohcello Co., Ltd., trade name Separator SP-PET PET-01-Bu) to form a coating film.
- the obtained coating film was cured in an air atmosphere at an ultraviolet irradiation amount of 67 mW / cm 2 in 7 seconds ⁇ 10 passes to obtain a polyurethane resin film.
- Example 4 Final determination of damage to the base material due to the coating component solution
- the degree of damage to the base material due to the coating component solution was determined.
- Example 1 The coating components obtained in Example 1 were dissolved in heptane, octane and limonene tested in Example 3 to obtain three types of coating component solutions 1, 2 and 3.
- the degree of damage was determined in the same manner as in (4) of Example 3.
- the polyolefin resin film was evaluated as B, and the polyacrylic resin film and the polyurethane resin film were evaluated as A.
- the solvent is selected from heptane, octane, and limonene
- the base resin is selected from polyacrylic resin and polyurethane resin.
- Example 5 A method of identifying a solvent that dissolves the coating component so that it can be coated but does not damage the substrate based on the solubility parameter (SP) value).
- the solvent to be used is selected from the solvents in which the solubility of the base material in the solvent is smaller than the solubility of the coating component.
- SP solubility parameter
- solubility parameter (SP) values select a substrate whose SP value is far from the solvent to be used. On the contrary, it is also possible to select a solvent whose SP value is different from that of the base material used.
- the SP values in the table below are C.I. M. By Hansen: J.M. Paint. Tech. , 39 (505), 104-117 (1967), and Hideki Yamamoto: "SP Value Basics / Applications and Calculation Methods", Information Mechanism (2005).
- the base resin to be used may be selected based on the SP value in the above table.
- Example 6 When the solvent is determined first, the coating component and substrate are selected based on the solvent used.
- Example 7 Selection of solvent based on the base material used
- the solvent is selected based on the substrate used.
- Example 8 Selection of coating component based on solvent selected based on base material used
- a coating component is selected in which the solvent selected based on the substrate used is soluble.
- Example 7 Whether or not the coating component is dissolved in the solvent selected as described in Example 7 is tested by the same method as in Example 2.
- a coating component (polymer) having an SP value different from that of the selected solvent can also be selected. (See Table 1)
- Example 9 Preparation of conductive film
- a silver filler (7.20 g, manufactured by Fukuda Metal Leaf Powder Industry Co., Ltd., trade name AgC-A) and 2- (2-butoxyethoxy) as a dispersant are added to the coating component solution (6.00 g) obtained in Example 1.
- Ethanol (0.10 g) was mixed with Kurabo Industries' Mazel Star to obtain a coating agent.
- the obtained coating agent was applied as a release film to a release polyethylene terephthalate film (manufactured by Mitsui Chemicals Tohcello Co., Ltd., trade name Separator SP-PET PET-01-Bu) to form a coating film.
- the obtained coating film was heated in an oven at 150 ° C. for 60 minutes to obtain a conductive film having a thickness of about 30 ⁇ m.
- Example 10 Confirmation of volume resistivity
- the conductive film obtained in Example 9 was cut into a length of 0.5 cm and a width of 2.00 cm, and measured by a 4-terminal method using Loresta GP (manufactured by Mitsubishi Chemical Analytech). Its volume resistivity was 0.00036 ⁇ ⁇ cm.
- Example 11 Confirmation of resistance value change
- the conductive film obtained in Example 9 was cut into a length of 0.5 cm and a width of 2.00 cm, and the distance between the electrodes was fixed at 1.00 cm with a digital multimeter [trade name PC773 manufactured by Sanwa Denki Keiki Co., Ltd.].
- the pre-stretch resistance value ( ⁇ A) was measured.
- the distance between the electrodes was set to 2.00 cm, and the resistance value ( ⁇ B) in that state was measured.
- Example 12 Method of analyzing a polymer that dissolves in a solvent that does not damage the substrate
- a solvent that dissolves the coating component to allow coating but does not damage the substrate is specified.
- Example 1 Based on a substrate, a solvent that does not damage the substrate is identified by the same method as in Example 3 (4) and / or Example 5.
- the coating component (polymer) is prepared under the same conditions except that the monomers are different.
- the obtained coating component is immersed in the solvent to evaluate whether or not it dissolves.
- the coating component found to be dissolved is dissolved in the solvent to obtain a coating component solution.
- diethylene glycol monobutyl ether acetate was used to dissolve the coating component of the cycloolefin polymer.
- Example 2 Determining Solubility When the coating component (1.00 g) obtained in Example 1 was immersed in diethylene glycol monobutyl ether acetate (9.00 g), it was dissolved in a solvent without remaining undissolved. As a result, a coating component solution was obtained.
- Example 1 When the coating component (1.00 g) obtained in Example 1 was immersed in n-octane (9.00 g), it was dissolved in a solvent without remaining undissolved. As a result, a coating component solution was obtained.
- Example 1 Judgment of Solubility When the coating component obtained in Example 1 was immersed in n-octane, it was dissolved in a solvent without remaining undissolved. As a result, a coating component solution was obtained.
- Example 1 When the coating component (1.00 g) obtained in Example 1 was immersed in n-octane (9.00 g), it was dissolved in a solvent without remaining undissolved. As a result, a coating component solution was obtained.
- Example 14 Selection of coating component (polymer) with polyolefin resin
- an appropriate coating component is selected for the combination of the base resin and the solvent.
- An appropriate coating component is selected for the resin-solvent combination selected in Example 7 (1).
- Example 15 Selection of coating component (polymer) with polyacrylic resin
- an appropriate coating component is selected for the combination of the base resin and the solvent.
- An appropriate coating component is selected for the resin-solvent combination selected in Example 7 (2).
- Example 16 Selection of coating component (polymer) with polyurethane resin
- an appropriate coating component is selected for the combination of the base resin and the solvent.
- An appropriate coating component is selected for the resin-solvent combination selected in Example 7 (3).
- kit for sale is manufactured.
- Example 13 (1) In the coating component solution (10.00 g) obtained in Example 13 (1), a silver filler (4.00 g, manufactured by Fukuda Metal Leaf Powder Industry Co., Ltd., trade name: AgC-A), and 2- (2) as a dispersant. -Butoxyethoxy) ethanol (0.08 g) is mixed with Mazelstar manufactured by Kurabou Co., Ltd. to obtain a conductive material precursor.
- a silver filler (7.20 g, manufactured by Fukuda Metal Leaf Powder Industry Co., Ltd., trade name: AgCA), and a dispersant are added to the coating component solutions (6.00 g each) obtained in Examples 13 (2) and 13 (3).
- 2- (2-Butoxyethoxy) ethanol (0.10 g) is mixed with Mazelstar manufactured by Kurabou Co., Ltd. to obtain a conductive material precursor.
- the kit may include instructions showing how to use it.
- Example 18 Production of a coated conductive material using a base material, a conductive material, and a solvent kit
- a coated conductive material is produced using the specific combinations provided in the above-described examples.
- the conductive material precursors obtained in Example 17 are coated on the corresponding substrates. After coating, heat in an oven at 150 ° C. for 60 minutes.
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TW (1) | TW202112988A (enrdf_load_stackoverflow) |
WO (1) | WO2021029360A1 (enrdf_load_stackoverflow) |
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WO2023074722A1 (ja) * | 2021-10-27 | 2023-05-04 | 大阪有機化学工業株式会社 | 導電性エラストマー形成用組成物、導電性エラストマー、及び、重合体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013025971A (ja) * | 2011-07-20 | 2013-02-04 | Sumitomo Electric Ind Ltd | 導電性ペースト |
WO2018055890A1 (ja) * | 2016-09-20 | 2018-03-29 | 大阪有機化学工業株式会社 | (メタ)アクリル系導電性材料 |
-
2020
- 2020-08-07 WO PCT/JP2020/030367 patent/WO2021029360A1/ja active Application Filing
- 2020-08-07 TW TW109126879A patent/TW202112988A/zh unknown
- 2020-08-07 JP JP2021539273A patent/JPWO2021029360A1/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013025971A (ja) * | 2011-07-20 | 2013-02-04 | Sumitomo Electric Ind Ltd | 導電性ペースト |
WO2018055890A1 (ja) * | 2016-09-20 | 2018-03-29 | 大阪有機化学工業株式会社 | (メタ)アクリル系導電性材料 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023074722A1 (ja) * | 2021-10-27 | 2023-05-04 | 大阪有機化学工業株式会社 | 導電性エラストマー形成用組成物、導電性エラストマー、及び、重合体 |
JPWO2023074722A1 (enrdf_load_stackoverflow) * | 2021-10-27 | 2023-05-04 | ||
JP7719879B2 (ja) | 2021-10-27 | 2025-08-06 | 大阪有機化学工業株式会社 | 導電性エラストマー形成用組成物、導電性エラストマー、及び、重合体 |
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JPWO2021029360A1 (enrdf_load_stackoverflow) | 2021-02-18 |
TW202112988A (zh) | 2021-04-01 |
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