WO2021020415A1 - 熱可塑性樹脂フィルム及びその製造方法 - Google Patents

熱可塑性樹脂フィルム及びその製造方法 Download PDF

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Publication number
WO2021020415A1
WO2021020415A1 PCT/JP2020/028970 JP2020028970W WO2021020415A1 WO 2021020415 A1 WO2021020415 A1 WO 2021020415A1 JP 2020028970 W JP2020028970 W JP 2020028970W WO 2021020415 A1 WO2021020415 A1 WO 2021020415A1
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WO
WIPO (PCT)
Prior art keywords
thermoplastic resin
resin film
oxygen atom
cleaning treatment
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/028970
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
亮太 遠山
小池　弘
祐太郎 菅俣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yupo Corp
Original Assignee
Yupo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yupo Corp filed Critical Yupo Corp
Priority to US17/630,715 priority Critical patent/US20220267564A1/en
Priority to JP2021535372A priority patent/JP7336522B2/ja
Publication of WO2021020415A1 publication Critical patent/WO2021020415A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/242—All polymers belonging to those covered by group B32B27/32
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/30—Particles characterised by physical dimension
    • B32B2264/303—Average diameter greater than 1µm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/10—Homopolymers or copolymers of propene
    • C08J2323/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives

Definitions

  • thermoplastic resin film has a multilayer structure
  • at least one outermost layer is the inorganic filler-containing layer
  • the outermost layer is a surface of the outermost layer that does not face the other layer (that is, one of the thermoplastic resin films).
  • the inorganic filler forms undulations (projection structure) on the film surface to roughen the surface.
  • the surface area of the film is increased by roughening the surface, and an anchoring effect can be imparted.
  • pores (voids) are formed in the film, elastic relaxation is exhibited due to the presence of the air layer, and the adhesion of the film surface is improved.
  • inorganic fillers include heavy calcium carbonate, light calcium carbonate, calcined clay, silica, silica soil, white clay, talc, titanium oxide, barium sulfate, silicon oxide, magnesium oxide, alumina, zeolite, mica, sericite, and bentonite. , Sepiolite, vermiculite, dolomite, wallastonite, glass fiber, or inorganic particles obtained by surface-treating these with a fatty acid, a polymer surfactant, an antistatic agent, or the like.
  • heavy calcium carbonate, light calcium carbonate, calcined clay or talc is preferable, and heavy calcium carbonate is more preferable.
  • One of these may be used alone or in combination of two or more.
  • An organic filler may be used in combination with the inorganic filler.
  • the organic filler is added, it is incompatible with the thermoplastic resin which is the main component of the inorganic filler-containing layer, the melting point or the glass transition temperature is higher than that of the thermoplastic resin, and the melt kneading conditions of the thermoplastic resin are satisfied.
  • Organic particles that are finely dispersed in the above are preferable.
  • the thermoplastic resin is a polyolefin resin
  • the organic filler is a weight of polyethylene terephthalate, polybutylene terephthalate, polycarbonate, nylon-6, nylon-6,6, cyclic polyolefin, polystyrene, polymethacrylate or the like.
  • the content of the inorganic filler in the inorganic filler-containing layer is preferably 1% by mass or more, more preferably 5% by mass or more, from the viewpoint of anchoring effect and moldability of pores. Further, from the viewpoint of the mechanical strength of the thermoplastic resin film, the content is preferably 70% by mass or less, and more preferably 60% by mass or less. Therefore, the content is preferably 1 to 70% by mass, more preferably 5 to 60% by mass. A part of the inorganic filler may be replaced with an organic filler as long as the effect of the present invention is not impaired.
  • the inorganic filler-containing layer can contain additives such as a heat stabilizer (antioxidant), a light stabilizer, a dispersant, and a lubricant, if necessary.
  • the content of the heat stabilizer in the thermoplastic resin film is usually 0.001 to 1% by mass.
  • the heat stabilizer include steric hindrance phenol-based, phosphorus-based, amine-based and the like stabilizers.
  • the content of the light stabilizer in the inorganic filler-containing layer is usually 0.001 to 1% by mass.
  • the light stabilizer include steric hindrance amine-based, benzotriazole-based, and benzophenone-based light stabilizers.
  • At least one skin layer is an inorganic filler-containing layer.
  • the surface that does not face the other layer that is, the outermost surface of the thermoplastic resin film
  • the oxidation treatment is not particularly limited as long as the surface of the object to be treated can be oxidized, and a known oxidation treatment can be used.
  • Specific examples of the oxidation treatment include dielectric barrier discharge treatment, frame treatment, ozone treatment and the like. Among them, a dielectric barrier discharge that can obtain a high treatment effect and cause less damage to the base material is preferable as a film treatment method.
  • the frequency f of the AC voltage output from the high frequency transmitter is preferably in the range of 10 to 200 kHz.
  • uniform discharge is likely to occur (local discharge concentration is unlikely to occur), which is preferable.
  • the frequency region of 200 kHz or less it is difficult to form a low-resistance discharge channel due to the residual ions generated by the staying of the ions generated by the discharge as they are. Discharges are locally concentrated and uniform processing cannot be performed, and it is easy to avoid a large current flowing and high heat is generated, which is preferable for safety.
  • the surface that has been oxidized is subjected to the cleaning treatment (B).
  • the cleaning solvent used in the cleaning treatment (B) is preferably water or an aqueous solution from the viewpoint of solubility of a low molecular weight acidic compound to be removed by cleaning, and for example, a cleaning treatment such as immersion in water or an aqueous solution is performed. ..
  • a cleaning treatment such as immersion in water or an aqueous solution is performed.
  • FIG. 2 shows an example of the manufacturing process of the thermoplastic resin film 1. This manufacturing process is an example, and the process differs depending on the layer structure of the film, the number of stretched axes, and the like.
  • thermoplastic resin films obtained in Examples and Comparative Examples Solid printing was performed on the oxidation-treated surface side with an ink filling amount of 2.0 g / m 2 .
  • UV irradiation was carried out using a UV irradiator so that the irradiation intensity was 100 mJ / cm 2 , and samples for ink transfer and ink adhesion evaluation were obtained.

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2020/028970 2019-07-31 2020-07-29 熱可塑性樹脂フィルム及びその製造方法 Ceased WO2021020415A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/630,715 US20220267564A1 (en) 2019-07-31 2020-07-29 Thermoplastic resin film, and method for producing same
JP2021535372A JP7336522B2 (ja) 2019-07-31 2020-07-29 熱可塑性樹脂フィルム及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-141778 2019-07-31
JP2019141778 2019-07-31

Publications (1)

Publication Number Publication Date
WO2021020415A1 true WO2021020415A1 (ja) 2021-02-04

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PCT/JP2020/028970 Ceased WO2021020415A1 (ja) 2019-07-31 2020-07-29 熱可塑性樹脂フィルム及びその製造方法

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US (1) US20220267564A1 (https=)
JP (1) JP7336522B2 (https=)
WO (1) WO2021020415A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3622581B1 (https=) * 1960-08-05 1961-11-21
JPS4831268A (https=) * 1971-08-27 1973-04-24
JPS5876430A (ja) * 1981-11-02 1983-05-09 Tokuyama Soda Co Ltd 改質ポリプロピレンフイルムの製造方法
JPH01104377A (ja) * 1987-10-16 1989-04-21 Mitsubishi Paper Mills Ltd 塗布方法
JPH07330930A (ja) * 1994-06-03 1995-12-19 Kanegafuchi Chem Ind Co Ltd 高分子フィルムの表面処理方法
JP2002082223A (ja) * 2000-09-08 2002-03-22 Konica Corp 偏光板用保護フィルム、光学用フィルムおよび画像表示材料
JP2010023502A (ja) * 2008-06-16 2010-02-04 Yupo Corp 積層フィルム
JP2012155147A (ja) * 2011-01-26 2012-08-16 Nitto Denko Corp 偏光板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4887098B2 (ja) * 2005-08-23 2012-02-29 株式会社ユポ・コーポレーション 樹脂フィルムとその製造方法、印刷物、ラベル及び樹脂成形品
JP2007116134A (ja) 2005-09-22 2007-05-10 Toray Ind Inc 半導体用テープ、半導体用接着剤付きテープ、半導体集積回路接続用基板および半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3622581B1 (https=) * 1960-08-05 1961-11-21
JPS4831268A (https=) * 1971-08-27 1973-04-24
JPS5876430A (ja) * 1981-11-02 1983-05-09 Tokuyama Soda Co Ltd 改質ポリプロピレンフイルムの製造方法
JPH01104377A (ja) * 1987-10-16 1989-04-21 Mitsubishi Paper Mills Ltd 塗布方法
JPH07330930A (ja) * 1994-06-03 1995-12-19 Kanegafuchi Chem Ind Co Ltd 高分子フィルムの表面処理方法
JP2002082223A (ja) * 2000-09-08 2002-03-22 Konica Corp 偏光板用保護フィルム、光学用フィルムおよび画像表示材料
JP2010023502A (ja) * 2008-06-16 2010-02-04 Yupo Corp 積層フィルム
JP2012155147A (ja) * 2011-01-26 2012-08-16 Nitto Denko Corp 偏光板の製造方法

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Publication number Publication date
JP7336522B2 (ja) 2023-08-31
US20220267564A1 (en) 2022-08-25
JPWO2021020415A1 (https=) 2021-02-04

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