WO2021019863A1 - アンテナ装置 - Google Patents

アンテナ装置 Download PDF

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Publication number
WO2021019863A1
WO2021019863A1 PCT/JP2020/018514 JP2020018514W WO2021019863A1 WO 2021019863 A1 WO2021019863 A1 WO 2021019863A1 JP 2020018514 W JP2020018514 W JP 2020018514W WO 2021019863 A1 WO2021019863 A1 WO 2021019863A1
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WO
WIPO (PCT)
Prior art keywords
conductive
conductive plate
substrate
conductive portion
antenna device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/018514
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
威 山保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Yokowo Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd, Yokowo Mfg Co Ltd filed Critical Yokowo Co Ltd
Priority to EP20847416.3A priority Critical patent/EP4007070B1/en
Priority to CN202080052020.7A priority patent/CN114128046B/zh
Priority to US17/628,902 priority patent/US11855363B2/en
Publication of WO2021019863A1 publication Critical patent/WO2021019863A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/10—Resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/50—Feeding or matching arrangements for broad-band or multi-band operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0428—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave
    • H01Q9/0435—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave using two feed points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0464—Annular ring patch

Definitions

  • the present invention relates to an antenna device.
  • the antenna device of Patent Document 1 includes a substrate (for example, a printed circuit board (PCB)), a first patch antenna, and a second patch antenna.
  • the first patch antenna is tuned for the first frequency band (for example, the Satellite Digital Audio Radio Service (SDARS) frequency band).
  • the second patch antenna is tuned for the second frequency band (eg, the Global Positioning System (GPS) frequency band).
  • the second patch antenna is located on the substrate.
  • the first patch antenna is located on the second patch antenna.
  • the present inventor has considered facilitating the manufacture of an antenna device including a plurality of elements.
  • the characteristics (for example, resonance frequency) of the antenna device may fluctuate according to the variation in the dielectric materials of the first patch antenna and the second patch antenna. Therefore, in order to suppress fluctuations in the characteristics of the antenna device, a complicated process may be required for manufacturing the antenna device.
  • An example of an object of the present invention is to facilitate the manufacture of an antenna device. Other objects of the invention will become apparent from the description herein.
  • a substrate having a first surface and A first conductive plate located on the first surface side of the substrate away from the first surface of the substrate and having an opening, and a first conductive plate that electrically connects the first conductive plate and the substrate.
  • the first element having a part and A second conductive plate located on the first surface side of the substrate separated from the first surface of the substrate, and a second conductive portion for electrically connecting the second conductive plate and the substrate.
  • the second element to have With The second conductive plate is an antenna device located inside the opening of the first conductive plate.
  • the manufacture of the antenna device can be facilitated.
  • FIG. 1 It is a perspective view of the antenna device which concerns on embodiment. It is a perspective view which saw the 1st element shown in FIG. 1 from the side opposite to FIG. It is a perspective view which looked at the 2nd element shown in FIG. 1 from the side opposite to FIG. It is a top view of the 1st surface of the substrate shown in FIG. It is a top view of the 2nd surface of the substrate shown in FIG. It is a block diagram which shows a part of the antenna device shown in FIG. It is a graph which shows an example of the frequency characteristic of VSWR (Voltage Standing Wave Ratio) in each of the 1st feeding part (observation point P1 of FIG. 6) and the 2nd feeding part (observation point P2 of FIG. 6) of the 1st element.
  • VSWR Voltage Standing Wave Ratio
  • the antenna device according to the embodiment of the present invention will be described with reference to the drawings.
  • similar components are designated by the same reference numerals, and description thereof will be omitted as appropriate.
  • the antenna device according to the present embodiment described below can be used as, for example, an in-vehicle antenna device, and can also be used in various devices other than the in-vehicle antenna device depending on the application. ..
  • FIG. 1 is a perspective view of the antenna device 10 according to the embodiment.
  • FIG. 2 is a perspective view of the first element 100 shown in FIG. 1 as viewed from the side opposite to that in FIG.
  • FIG. 3 is a perspective view of the second element 200 shown in FIG. 1 as viewed from the side opposite to that in FIG.
  • the antenna device 10 includes a first element 100, a second element 200, and a substrate 300.
  • the substrate 300 has a first surface 302 and a second surface 304.
  • the second surface 304 is on the opposite side of the first surface 302.
  • the first element 100 has a first conductive plate 110, two first conductive portions 120, and four third conductive portions 130.
  • the second element 200 has a second conductive plate 210, two second conductive portions 220, and four fourth conductive portions 230.
  • the first conductive plate 110 is located on the first surface 302 (first surface 302 side) of the substrate 300 apart from the first surface 302 of the substrate 300.
  • the first conductive plate 110 faces the first surface 302.
  • the first conductive plate 110 may be parallel or inclined as long as it faces the first surface 302. Further, the first conductive plate 110 has an opening 112. Each of the first conductive portions 120 is connected to the first conductive plate 110, and electrically connects the first conductive plate 110 and the substrate 300. Each third conductive portion 130 is connected to the first conductive plate 110 and inserted into the substrate 300.
  • the second conductive plate 210 is located on the first surface 302 (first surface 302 side) of the substrate 300 apart from the first surface 302 of the substrate 300. The second conductive plate 210 faces the first surface 302. The second conductive plate 210 may be opposed to the first surface 302, and may be parallel or inclined.
  • the second conductive plate 210 is located inside the opening 112 of the first conductive plate 110 when viewed from a direction perpendicular to the first surface 302 of the substrate 300.
  • Each of the second conductive portions 220 is connected to the second conductive plate 210, and electrically connects the second conductive plate 210 and the substrate 300.
  • Each of the fourth conductive portions 230 is connected to the second conductive plate 210 and inserted into the substrate 300.
  • the characteristics (for example, resonance frequency) of the first element 100 include, for example, adjusting the shape of the first conductive plate 110, adjusting the distance between the first conductive plate 110 and the substrate 300, and the like. It can be adjusted by a simple method. Similarly, the characteristics of the second element 200 can be adjusted by a simple method. Therefore, the manufacture of the antenna device 10 can be facilitated.
  • the first element 100 and the second element 200 have different resonance frequencies from each other.
  • the resonance frequency of the second element 200 is higher than the resonance frequency of the first element 100.
  • the resonance frequency of the second element 200 may be lower than or the same as the resonance frequency of the first element 100.
  • the first element 100 functions as a GNSS (Global Navigation Satellite System) band antenna (for example, a GPS (Global Positioning Satellite) band antenna), and the second element 200 , SXM (Sirius XM) band function as an antenna.
  • GNSS Global Navigation Satellite System
  • SXM Small XM
  • the distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second element 200 is equal to or greater than the distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first element 100. It has become. Specifically, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second element 200 is from the first surface 302 of the substrate 300. It is longer than the shortest distance to the first conductive plate 110 of the first element 100. In this case, as will be described later, the gain of the second element 200 can be improved.
  • the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second element 200 is the first element from the first surface 302 of the substrate 300. It may be shorter than the shortest distance to the first conductive plate 110 of 100.
  • the first element 100 is made of sheet metal. Specifically, the first conductive plate 110, the first conductive portion 120, and the third conductive portion 130 are integrated. In other words, the first conductive portion 120 and the third conductive portion 130 are physically coupled to the first conductive plate 110. Further, the portions of the first element 100 from the first conductive plate 110 to the first conductive portion 120 and the third conductive portion 130 are formed on the first surface 302 of the substrate 300 from the direction along the first surface 302 of the substrate 300. It is bent in the direction of the direction. The first element 100 is formed by bending a sheet metal. Therefore, the first element 100 can be easily manufactured as compared with the case where the first conductive portion 120 and the third conductive portion 130 are attached to the first conductive plate 110 by welding.
  • the manufacturing method of the first element 100 is not limited to this example.
  • at least one of the first conductive portion 120 and the third conductive portion 130 is not by bending the sheet metal, but by attaching the first conductive portion 120 or the third conductive portion 130 to the first conductive plate 110 by welding, for example. 1 It may be integrated with the conductive plate 110.
  • the first conductive plate 110 has an inner edge that defines the opening 112 and an outer edge that is located outside the inner edge.
  • the inner edge of the first conductive plate 110 is a quadrangular region (opening 112).
  • the shape of the inner edge of the first conductive plate 110 is not limited to the above-mentioned square shape, and may be, for example, a circular shape or a polygonal shape.
  • the outer edge of the first conductive plate 110 is a rectangular region (this quadrangle does not have to be a strict quadrangle.
  • the third conductive portion 130 is bent in the direction from the first conductive plate 110 toward the first surface 302 of the substrate 300. By doing so, the shape is such that the four corners of the quadrangle are cut off.
  • the shape of the outer edge of the first conductive plate 110 is, strictly speaking, an octagon.
  • the outer edge of the first conductive plate 110 does not have a section recessed toward the inside of the first conductive plate 110 or a protrusion protruding toward the outside of the first conductive plate 110. That is, each side of the outer edge of the first conductive plate 110 is linear. Therefore, as compared with the case where the outer edge of the first conductive plate 110 has a section recessed toward the inside of the first conductive plate 110 or a protrusion protruding toward the outside of the first conductive plate 110, the first The element 100 can be easily bent, and the first element 100 can be easily molded.
  • the first The length (including the electrical length) of each side of the outer edge of the conductive plate 110 can be easily adjusted, and the design of the first element 100 is easy.
  • the shape of the outer edge of the first conductive plate 110 is not limited to the above shape, and may be, for example, a circle. Further, the outer edge of the first conductive plate 110 may have the above-mentioned section or protrusion.
  • the four third conductive portions 130 are located around the center of the first conductive plate 110 at intervals of 90 °. There is. Therefore, the first element 100 is stably supported on the substrate 300 by the four third conductive portions 130 as compared with the case where less than four (for example, two) third conductive portions 130 are provided. Can be done.
  • Each third conductive portion 130 is fixed to the substrate 300 by, for example, solder (not shown).
  • the four third conductive portions 130 are connected to the outer edge of the first conductive plate 110. More specifically, the four third conductive portions 130 are connected to the four corners of the outer edge of the first conductive plate 110. In this way, each of the third conductive portions 130 is electrically connected to the outer edge of the first conductive plate 110.
  • the number and arrangement of the third conductive portions 130 are not limited to the examples shown in FIGS. 1 and 2.
  • the two first conductive portions 120 are located around the center of the first conductive plate 110 at intervals of 90 °. Two feeding points are formed by the two first conductive portions 120. Therefore, the first element 100 is capable of transmitting and receiving circularly polarized radio waves. By using not only the third conductive portion 130 but also the first conductive portion 120, the first element 100 can be stably supported by the substrate 300.
  • Each first conductive portion 120 is fixed to the substrate 300 by, for example, solder (not shown). In the present embodiment, the two first conductive portions 120 are connected to the outer edge of the first conductive plate 110.
  • the first conductive portion 120a is connected to the central portion between the third conductive portion 130a and the third conductive portion 130b in the outer edge of the first conductive plate 110.
  • the first conductive portion 120b is connected to the central portion between the third conductive portion 130a and the third conductive portion 130d in the outer edge of the first conductive plate 110.
  • each of the first conductive portions 120 is electrically connected to the outer edge of the first conductive plate 110.
  • the first element 100 can be formed by bending the first conductive portion 120 located on the outer edge of the first conductive plate 110 in the direction toward the first surface 302 of the substrate 300.
  • the first element 100 is easier to bend, and the first element 100 is easier to manufacture.
  • the number and arrangement of the first conductive portions 120 are not limited to the examples shown in FIGS. 1 and 2.
  • the first conductive portion 120 may be connected to the inner edge of the first conductive plate 110.
  • the number of the first conductive portions 120 may be only one so that only one feeding point is formed, or three or more so that three or more feeding points are formed. You may. Further, even if the number of the first conductive portions 120 is plural, the number of feeding points may be smaller than the number of the first conductive portions 120. In this case, the first conductive portion 120 in which the feeding point is not formed functions as a support portion of the first element 100.
  • the second element 200 is made of sheet metal. Specifically, the second conductive plate 210, the second conductive portion 220, and the fourth conductive portion 230 are integrated. In other words, the second conductive portion 220 and the fourth conductive portion 230 are physically coupled to the second conductive plate 210. Further, the portion of the second element 200 from the second conductive plate 210 to the second conductive portion 220 and the fourth conductive portion 230 is formed on the first surface 302 of the substrate 300 from the direction along the first surface 302 of the substrate 300. It is bent in the direction of the direction. The second element 200 is formed by bending a sheet metal.
  • the second element 200 can be easily manufactured as compared with the case where the second conductive portion 220 and the fourth conductive portion 230 are attached to the second conductive plate 210 by welding.
  • the manufacturing method of the second element 200 is not limited to this example.
  • at least one of the second conductive portion 220 and the fourth conductive portion 230 is not bent by the sheet metal, but by, for example, attaching the second conductive portion 220 or the fourth conductive portion 230 to the second conductive plate 210 by welding. 2 It may be integrated with the conductive plate 210.
  • the second conductive plate 210 has a quadrangular shape (this quadrangle does not have to be a strict quadrangle.
  • the fourth conductive portion 230 is bent in the direction from the second conductive plate 210 toward the first surface 302 of the substrate 300. Therefore, the shape is such that the four corners of the quadrangle are cut off. That is, the shape of the second conductive plate 210 is, strictly speaking, an octagon.)
  • the outer edge of the second conductive plate 210 does not have a section recessed toward the inside of the second conductive plate 210 or a protrusion protruding toward the outside of the second conductive plate 210. That is, each side of the outer edge of the second conductive plate 210 is linear.
  • the second is compared with the case where the outer edge of the second conductive plate 210 has a section recessed toward the inside of the second conductive plate 210 or a protrusion protruding toward the outside of the second conductive plate 210.
  • the element 200 can be easily bent, and the second element 200 can be easily molded.
  • a second The length (including the electrical length) of each side of the outer edge of the conductive plate 210 can be easily adjusted, and the design of the second element 200 is easy.
  • the shape of the second conductive plate 210 is not limited to the above shape, and may be, for example, a circle or a polygon. Further, the outer edge of the second conductive plate 210 may have the above-mentioned section or protrusion.
  • the four fourth conductive portions 230 are located around the center of the second conductive plate 210 at intervals of 90 °. There is. Therefore, the second element 200 is stably supported on the substrate 300 by the four fourth conductive portions 230 as compared with the case where less than four (for example, two) fourth conductive portions 230 are provided. Can be done.
  • Each fourth conductive portion 230 is fixed to the substrate 300 by, for example, solder (not shown). In the present embodiment, the four fourth conductive portions 230 are connected to the outer edge of the second conductive plate 210.
  • the four fourth conductive portions 230 are connected to the four corners of the outer edge of the second conductive plate 210. In this way, each of the fourth conductive portions 230 is electrically connected to the outer edge of the second conductive plate 210.
  • the number and arrangement of the fourth conductive portions 230 are not limited to the examples shown in FIGS. 1 and 3.
  • the two second conductive portions 220 are located around the center of the second conductive plate 210 at intervals of 90 °. Two feeding points are formed by the two second conductive portions 220. Therefore, the second element 200 is capable of transmitting and receiving circularly polarized radio waves. By using not only the fourth conductive portion 230 but also the second conductive portion 220, the second element 200 can be stably supported by the substrate 300.
  • Each second conductive portion 220 is fixed to the substrate 300 by, for example, solder (not shown). In the present embodiment, the two second conductive portions 220 are connected to the outer edge of the second conductive plate 210.
  • the second conductive portion 220a is connected to the central portion between the fourth conductive portion 230b and the fourth conductive portion 230c in the outer edge of the second conductive plate 210.
  • the second conductive portion 220b is connected to the central portion between the fourth conductive portion 230c and the fourth conductive portion 230d on the outer edge of the second conductive plate 210.
  • each of the second conductive portions 220 is electrically connected to the outer edge of the second conductive plate 210.
  • the number and arrangement of the second conductive portions 220 are not limited to the examples shown in FIGS. 1 and 3.
  • the number of the second conductive portions 220 may be only one so that only one feeding point is formed, or three or more so that three or more feeding points are formed.
  • the number of feeding points may be smaller than the number of the second conductive portions 220.
  • the second conductive portion 220 in which the feeding point is not formed functions as a support portion of the second element 200.
  • the third conductive portion 130 located between the two first conductive portions 120 around the center of the first conductive plate 110 and two around the center of the second conductive plate 210.
  • the fourth conductive portion 230 located between the two second conductive portions 220 is located on opposite sides of the center of the first conductive plate 110 or the second conductive plate 210. ..
  • the two first conductive portions 120 and the two second conductive portions 220 are located symmetrically with respect to the center of the first conductive plate 110 or the second conductive plate 210. Therefore, the two first conductive portions 120 of the first element 100 and the two second conductive portions 220 of the second element 200 can be separated from each other at a sufficient distance. Therefore, isolation between the first element 100 and the second element 200 can be ensured.
  • the layout of the first element 100 and the second element 200 is not limited to this example.
  • the antenna device 10 includes two elements (first element 100 and second element 200). However, the antenna device 10 may further include other elements. The other element may be located outside the second element 200 so as to surround the second element 200, for example.
  • the first element 100 has a third conductive portion 130. However, the first element 100 does not have to have the third conductive portion 130. Even when the first element 100 does not have the third conductive portion 130, the first conductive portion 120 can support the first conductive plate 110 apart from the first surface 302 of the substrate 300. Similarly, the second element 200 may not have the fourth conductive portion 230.
  • the center of the first conductive plate 110 and the center of the second element 200 coincide with each other.
  • the center of the first conductive plate 110 and the center of the second element 200 may be deviated from each other.
  • the first element 100 and the second element 200 do not have a conductive portion for grounding to the substrate 300. Therefore, it is not necessary to form such a conductive portion, and the first element 100 and the second element 200 can be easily manufactured. However, at least one of the first element 100 and the second element 200 may have a conductive portion for grounding to the substrate 300.
  • the first conductive portion 120 and the third conductive portion 130 are physically directly connected to the first conductive plate 110.
  • the first conductive portion 120 and the third conductive portion 130 may be physically separated from the first conductive plate 110, and are electrically connected to the first conductive plate 110 via a conductive member (for example, a copper wire). May be connected.
  • the second conductive portion 220 and the fourth conductive portion 230 are physically directly connected to the second conductive plate 210.
  • the second conductive portion 220 and the fourth conductive portion 230 may be physically separated from the second conductive plate 210, and are electrically connected to the second conductive plate 210 via a conductive member (for example, a copper wire). May be connected.
  • the first conductive portion 120 and the third conductive portion 130 are conductive plates.
  • the first conductive portion 120 and the third conductive portion 130 may be conductive wires such as copper wire, for example.
  • the first conductive portion 120 may be able to electrically connect the first conductive plate 110 and the substrate 300.
  • the second conductive portion 220 and the fourth conductive portion 230 are conductive plates.
  • the second conductive portion 220 and the fourth conductive portion 230 may be conductive wires such as copper wire, for example.
  • the second conductive portion 220 may be able to electrically connect the second conductive plate 210 and the substrate 300.
  • all the members (second conductive plate 210, second conductive portion 220, fourth conductive portion 230) constituting the second element 200 are located inside the opening 112 of the first conductive plate 110. ..
  • the second conductive portion 220 may be located outside the inside of the opening 112 of the first conductive plate 110 of the first element 100. If the second conductive plate 210 of the second element 200 is located inside the opening 112 of the first conductive plate 110 of the first element 100, various other configurations can be adopted.
  • FIG. 4 is a plan view of the first surface 302 of the substrate 300 shown in FIG.
  • FIG. 5 is a plan view of the second surface 304 of the substrate 300 shown in FIG.
  • the details of the antenna device 10 will be described with reference to FIGS. 1 to 3 and FIGS. 4 and 5.
  • the substrate 300 is, for example, a printed circuit board (PCB).
  • the substrate 300 has two first holes 310 (first hole 310a and first hole 310b) and four second holes 320 (second hole 320a, second hole 320b, second hole 320c and second hole 320d). It has two third holes 330 (third hole 330a and third hole 330b) and four fourth holes 340 (fourth hole 340a, fourth hole 340b, fourth hole 340c and fourth hole 340d). ..
  • the substrate 300 further includes a first hybrid circuit 350a, a second hybrid circuit 350b, and a diplexer 360.
  • the board 300 further includes wiring 352a, wiring 352b, wiring 352c, wiring 352d, wiring 362a, and wiring 362b.
  • the first conductive plate 110 of the first element 100 may have a conductive pattern to which a fixed potential (for example, a ground potential) is applied.
  • a fixed potential for example, a ground potential
  • First conductive portions 120 different from each other are inserted into each of the two first holes 310. That is, the first conductive portion 120a and the first conductive portion 120b are inserted into the first hole 310a and the first hole 310b, respectively.
  • the first conductive portion 120a inserted into the first hole 310a is electrically connected to the first hybrid circuit 350a via the wiring 352a.
  • the first conductive portion 120b inserted into the first hole 310b is electrically connected to the first hybrid circuit 350a via the wiring 352b.
  • the first hybrid circuit 350a is electrically connected to the diplexer 360 via the wiring 362a.
  • a third conductive portion 130 different from each other is inserted into each of the four second holes 320. That is, the third conductive portion 130a, the third conductive portion 130b, the third conductive portion 130c, and the third conductive portion 130d are inserted into the second hole 320a, the second hole 320b, the second hole 320c, and the second hole 320d, respectively.
  • each second hole 320 is surrounded by a first fixed pattern 322. It should be noted that a part of each second hole 320 may not be surrounded by the first fixed pattern 322.
  • the first fixing pattern 322 is provided to fix the third conductive portion 130 to the substrate 300.
  • the third conductive portion 130 is fixed to the substrate 300 by, for example, soldering the portion of the third conductive portion 130 inserted into the substrate 300 and the first fixing pattern 322.
  • the first fixed pattern 322 surrounds the portion of the third conductive portion 130 inserted into the substrate 300, and is separated from the portion of the third conductive portion 130, for example, via a space. Therefore, a capacitance can be formed between the third conductive portion 130 and the first fixed pattern 322. Further, the resonance frequency of the first element 100 can be adjusted by adjusting this capacitance according to the distance between the third conductive portion 130 and the first fixed pattern 322.
  • a second conductive portion 220 different from each other is inserted into each of the two third holes 330. That is, the second conductive portion 220a and the second conductive portion 220b are inserted into the third hole 330a and the third hole 330b, respectively.
  • the second conductive portion 220a inserted into the third hole 330a is electrically connected to the second hybrid circuit 350b via the wiring 352c.
  • the second conductive portion 220b inserted into the third hole 330b is electrically connected to the second hybrid circuit 350b via the wiring 352d.
  • the second hybrid circuit 350b is electrically connected to the diplexer 360 via the wiring 362b.
  • a fourth conductive portion 230 different from each other is inserted into each of the four fourth holes 340. That is, the fourth conductive portion 230a, the fourth conductive portion 230b, the fourth conductive portion 230c, and the fourth conductive portion 230d are inserted into the fourth hole 340a, the fourth hole 340b, the fourth hole 340c, and the fourth hole 340d, respectively.
  • each fourth hole 340 is surrounded by a second fixed pattern 342. It should be noted that a part of each of the fourth holes 340 may not be surrounded by the second fixed pattern 342.
  • the second fixing pattern 342 is provided to fix the fourth conductive portion 230 to the substrate 300.
  • the fourth conductive portion 230 is fixed to the substrate 300 by, for example, soldering the portion of the fourth conductive portion 230 inserted into the substrate 300 and the second fixing pattern 342.
  • the second fixed pattern 342 surrounds the portion of the fourth conductive portion 230 inserted into the substrate 300, and is separated from the portion of the fourth conductive portion 230, for example, via a space. Therefore, a capacitance can be formed between the fourth conductive portion 230 and the second fixed pattern 342. Further, the resonance frequency of the second element 200 can be adjusted by adjusting this capacitance according to the distance between the fourth conductive portion 230 and the second fixed pattern 342.
  • the first fixed pattern 322 is such that an effective capacitance is formed not only between the first conductive portion 120 and the first fixed pattern 322 but also between the first conductive plate 110 and the first fixed pattern 322. Is located in. For example, the area of the first fixed pattern 322 is increased so that the area of the region where the first conductive plate 110 and the first fixed pattern 322 overlap is large, and the area between the first conductive plate 110 and the first fixed pattern 322 is increased. The capacity of the can be increased. As a result, the resonance frequency of the first element 100 can be lowered. Further, the second fixed pattern 342 is arranged so that an effective capacitance is formed between the second conductive plate 210 and the second fixed pattern 342.
  • the area of the second fixed pattern 342 is increased so that the area of the region where the second conductive plate 210 and the second fixed pattern 342 overlap is large, and the second conductive plate 210 and the second fixed pattern 342 are combined. The capacity between them can be increased. As a result, the resonance frequency of the second element 200 can be lowered.
  • FIG. 6 is a block diagram showing the antenna device 10 shown in FIG. An example of the operation of the antenna device 10 will be described with reference to FIGS. 1 to 5 and FIG.
  • the first hybrid circuit 350a When the antenna device 10 receives the radio wave, the first hybrid circuit 350a has the phase of the signal output from the first conductive portion 120a of the first element 100 (the signal passing through the observation point P1 described later) and the first element 100. The phase of the signal output from the first conductive portion 120b (the signal passing through the observation point P2 described later) is shifted by 90 ° from each other. Then, the first hybrid circuit 350a outputs a composite signal (a signal passing through the observation point P5 described later) generated by synthesizing these signals whose phases are 90 ° out of phase with each other to the diplexer 360.
  • the second hybrid circuit 350b outputs the phase of the signal output from the second conductive portion 220a of the second element 200 (the signal passing through the observation point P3 described later) and the second conductive portion 220b of the second element 200.
  • the phase of the signal (the signal passing through the observation point P4 described later) is shifted by 90 ° from each other.
  • the second hybrid circuit 350b outputs a composite signal (a signal passing through the observation point P6 described later) generated by synthesizing these signals whose phases are 90 ° out of phase with each other to the diplexer 360.
  • the diplexer 360 includes a composite signal output from the first hybrid circuit 350a (a signal passing through the observation point P5 described later), a composite signal output from the second hybrid circuit 350b (a signal passing through the observation point P6 described later), and a composite signal. Is output to generate a signal (a signal passing through the observation point P7 described later).
  • the diplexer 360 observes the signal input to the diplexer 360 (the signal input through the observation point P7 described later) as two signals (the signal passing through the observation point P5 described later). (Signal passing through point P6) is separated. Then, the diplexer 360 outputs one and the other of the two separated signals to the first hybrid circuit 350a and the second hybrid circuit 350b, respectively.
  • the first hybrid circuit 350a divides the signal output from the diplexer 360 (the signal passing through the observation point P5 described later) into two signals (the signal passing through the observation point P1 and the signal passing through the observation point P2 described later). The phases of the two signals are offset by 90 ° from each other.
  • the first hybrid circuit 350a outputs one and the other of these two signals, which are 90 ° out of phase with each other, to the first conductive portion 120a and the first conductive portion 120b of the first element 100, respectively. Then, a circularly polarized radio wave is transmitted by the first conductive plate 110.
  • the second hybrid circuit 350b divides the signal output from the diplexer 360 (the signal passing through the observation point P6 described later) into two signals (the signal passing through the observation point P3 and the signal passing through the observation point P4 described later). , The phases of these two signals are shifted by 90 ° from each other.
  • the second hybrid circuit 350b outputs one and the other of these two signals whose phases are 90 ° out of phase with each other to the second conductive portion 220a and the second conductive portion 220b of the second element 200, respectively. Then, the second conductive plate 210 transmits a circularly polarized radio wave.
  • the size of the first element 100 is 45 mm ⁇ 45 mm ⁇ 8 mm
  • the size of the second element 200 is 25 mm ⁇ 25 mm ⁇ 9 mm. That is, the height (9 mm) of the second element 200 is higher than the height (8 mm) of the first element 100.
  • the height of the first element 100 is the shortest distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first element 100 in the direction perpendicular to the first surface 302 of the substrate 300.
  • the height of the second element 200 is the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second element 200 in the direction perpendicular to the first surface 302 of the substrate 300.
  • the first element 100 operates as an antenna in the GPS frequency band
  • the second element 200 operates as an antenna in the SXM frequency band.
  • FIG. 7 shows the first feeding portion (observation point P1 in FIG. 6, the first conductive portion 120a in FIG. 1) and the second feeding portion (observation point P2 in FIG. 6, the first conductive portion in FIG. 1) of the first element 100. It is a graph which shows an example of the frequency characteristic of VSWR (Voltage Standing Wave Ratio) in each of 120b). The VSWR at the observation point P1 and the observation point P2 is approximately 3 at a frequency of around 1525 MHz.
  • VSWR Voltage Standing Wave Ratio
  • FIG. 8 shows the first feeding portion (observation point P3 in FIG. 6, the second conductive portion 220a in FIG. 1) and the second feeding portion (observation point P4 in FIG. 6, the second conductive portion in FIG. 1) of the second element 200. It is a graph which shows an example of the frequency characteristic of VSWR in each of 220b). The VSWR at the observation point P3 and the observation point P4 is approximately 2 in the vicinity of the frequency of 2340 MHz.
  • FIG. 9 is a graph showing an example of the frequency characteristics of VSWR at the portion (observation point P5 in FIG. 6) connected to the diplexer 360 in the first hybrid circuit 350a.
  • the VSWR at the observation point P5 is less than 3 from the frequency of 1375.42 MHz to 1775.42 MHz.
  • FIG. 10 is a graph showing an example of the frequency characteristics of VSWR at the portion of the second hybrid circuit 350b connected to the diplexer 360 (observation point P6 in FIG. 6).
  • the VSWR at the observation point P6 is less than 2 from the frequency 2238.75 MHz to 2438.75 MHz.
  • FIG. 11 is a graph showing an example of the frequency characteristics of VSWR at the input / output unit (observation point P7 in FIG. 6) of the diplexer 360.
  • the VSWR at the observation point P7 is less than 3 from the frequency of 1400 MHz to 2400 MHz except for the frequency of about 1850 MHz.
  • FIG. 12 is a diagram showing an example of the directivity characteristic of the gain (dBi) of the first element 100.
  • the gain of the first element 100 is 0.6 dBi at the bore site (where 1 is described inside the inverted triangle in FIG. 12).
  • FIG. 13 is a diagram showing an example of the directivity characteristics of the axial ratio (dB) of the first element 100.
  • the axial ratio of the first element 100 is 4.3 dB at the bore site (where 1 is described inside the inverted triangle in FIG. 13).
  • FIG. 14 is a diagram showing an example of the directivity characteristic of the gain (dBi) of the second element 200.
  • the gain of the second element 200 is 1.8 dBi at the bore site (where 1 is described inside the inverted triangle in FIG. 14).
  • FIG. 15 is a diagram showing an example of the directivity characteristics of the axial ratio (dB) of the second element 200.
  • the axial ratio of the second element 200 is 3.1 dB at the bore site (where 1 is described inside the inverted triangle in FIG. 15).
  • FIG. 16 is a graph showing an example of the relationship between the height of each of the first element 100 and the second element 200 and the directivity characteristic of the gain of the second element 200.
  • the antenna devices 10 in each of the first to third embodiments of FIG. 16 are adjusted so that the VSWRs are substantially the same.
  • the direction from the lower side to the upper side of FIG. 16 is the direction from the first surface 302 of the substrate 300 toward the second conductive plate 210 of the second element 200.
  • the height of the second element 200 is 1 mm higher than the height of the first element 100. That is, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second element 200 is the first element from the first surface 302 of the substrate 300. It is longer than the shortest distance to the first conductive plate 110 of 100.
  • the height of the second element 200 is equal to the height of the first element 100. That is, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second element 200 is the first element from the first surface 302 of the substrate 300. It is equal to the shortest distance to the first conductive plate 110 of 100.
  • the height of the second element 200 is 1 mm lower than the height of the first element 100. That is, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second element 200 is the first element from the first surface 302 of the substrate 300. It is shorter than the shortest distance to the first conductive plate 110 of 100.
  • FIG. 17 is a perspective view showing the antenna device 10 according to the first modification.
  • the antenna device 10 according to this modification is the same as the antenna device 10 according to the embodiment except for the following points.
  • the antenna device 10 further includes a dielectric 400.
  • the dielectric 400 is located both between the first conductive plate 110 and the substrate 300 and between the second conductive plate 210 and the substrate 300. In other words, the dielectric 400 extends from a region overlapping the second conductive plate 210 to a region overlapping the first conductive plate 110.
  • the dielectric 400 can increase the capacitance between the first conductive plate 110 and the substrate 300, maintaining the performance of the first element 100 as compared to the case where the antenna device 10 does not include the dielectric 400.
  • the size of the first conductive plate 110 can be reduced as it is.
  • the dielectric 400 can increase the capacitance between the second conductive plate 210 and the substrate 300, with the second element 200 as compared to the case where the antenna device 10 does not include the dielectric 400.
  • the size of the second conductive plate 210 can be reduced while maintaining the performance.
  • the dielectric 400 may be solid or hollow.
  • the dielectric 400 may be a dielectric member attached to the substrate 300, the first conductive plate 110 or the second conductive plate 210, or may be a dielectric layer deposited on the substrate 300.
  • the first conductive plate 110 and the second conductive plate 210 may be formed by patterning on the dielectric layer (dielectric 400).
  • each first conductive portion 120 of the first element 100 is located outside the dielectric 400, and each second conductive portion 220 of the second element 200 is formed on the dielectric 400. It is inserted in the hole.
  • the second conductive portion 220 By inserting the second conductive portion 220 into the dielectric 400, the second conductive portion 220 can be supported by the dielectric 400.
  • each first conductive portion 120 of the first element 100 may also be inserted into a hole formed in the dielectric 400. By inserting the first conductive portion 120 into the dielectric 400, the first conductive portion 120 can be supported by the dielectric 400.
  • the height (thickness) of the dielectric 400 can be changed according to the capacitance between the first conductive plate 110 and the substrate 300 and the capacitance between the second conductive plate 210 and the substrate 300. ..
  • the dielectric 400 may be located, for example, over the entire region between the first conductive plate 110 and the substrate 300, or the first conductive. It may be located only in a part of the area between the plate 110 and the substrate 300.
  • the dielectric 400 may be located, for example, over the entire region between the second conductive plate 210 and the substrate 300, or the region between the second conductive plate 210 and the substrate 300. It may be located only in part.
  • the first element 100 does not have the third conductive portion 130 shown in FIG. Even if the first element 100 does not have the third conductive portion 130, the first conductive plate 110 is separated from the first surface 302 of the substrate 300 by mounting the first conductive plate 110 on the dielectric 400. Can be positioned. However, the first element 100 may have a third conductive portion 130. In this case, the third conductive portion 130 may be located outside the dielectric 400, or may be inserted into a hole formed in the dielectric 400. Similarly, in this modification, the second element 200 does not have the fourth conductive portion 230 shown in FIG. However, the second element 200 may have a fourth conductive portion 230. In this case, the fourth conductive portion 230 may be inserted into the hole formed in the dielectric 400.
  • FIG. 18 is a perspective view showing the antenna device 10 according to the second modification.
  • the antenna device 10 according to this modification is the same as the antenna device 10 according to the embodiment except for the following points.
  • the antenna device 10 further includes a first dielectric 410 and a second dielectric 420.
  • the first dielectric 410 is located between the first conductive plate 110 and the substrate 300.
  • the second dielectric 420 is located between the second conductive plate 210 and the substrate 300.
  • the first dielectric 410 and the second dielectric 420 are separated from each other.
  • the first dielectric 410 can increase the capacitance between the first conductive plate 110 and the substrate 300, and the antenna device 10 of the first element 100 can be compared with the case where the antenna device 10 does not include the first dielectric 410.
  • the size of the first conductive plate 110 can be reduced while maintaining the performance.
  • the second dielectric 420 can increase the capacitance between the second conductive plate 210 and the substrate 300, and the antenna device 10 has a second dielectric 420 as compared to the case where the second dielectric 420 is not provided.
  • the size of the second conductive plate 210 can be reduced while maintaining the performance of the two elements 200.
  • the first dielectric 410 and the second dielectric 420 are separated from each other, as compared with the case where the first dielectric 410 and the second dielectric 420 are connected to each other as shown in FIG. Therefore, it is easy to individually adjust the capacitance between the first conductive plate 110 and the substrate 300 and the capacitance between the second conductive plate 210 and the substrate 300.
  • the first dielectric 410 and the second dielectric 420 may be solid or hollow.
  • the first dielectric 410 may be a dielectric member attached to the substrate 300 or the first conductive plate 110, or may be a dielectric layer deposited on the substrate 300.
  • the first conductive plate 110 may be formed by patterning on the dielectric layer (first dielectric 410).
  • each first conductive portion 120 is located outside the first dielectric 410.
  • each first conductive portion 120 may be inserted into a hole formed in the first dielectric 410. In this case, the first conductive portion 120 can be supported by the first dielectric 410.
  • the second dielectric 420 the same aspect as that of the first dielectric 410 can be adopted.
  • the height (thickness) of the first dielectric 410 can be changed according to the capacitance between the first conductive plate 110 and the substrate 300. In a direction perpendicular to the first surface 302 of the substrate 300, the first dielectric 410 may be located over the entire region between the first conductive plate 110 and the substrate 300, or the first element. It may be located only in a part of the area between the 100 and the substrate 300.
  • the height (thickness) of the second dielectric 420 can be determined in the same manner.
  • the dielectric is located both between the first conductive plate 110 and the substrate 300 and between the second conductive plate 210 and the substrate 300.
  • the dielectric may be located only between the first conductive plate 110 and the substrate 300 and between the second conductive plate 210 and the substrate 300. That is, the dielectric may be located at least one of the space between the first conductive plate 110 and the substrate 300 and the space between the second conductive plate 210 and the substrate 300.
  • the first element 100 does not have the third conductive portion 130 shown in FIG. Even if the first element 100 does not have the third conductive portion 130, by mounting the first conductive plate 110 on the first dielectric 410, the first conductive plate 110 can be mounted on the first surface 302 of the substrate 300. Can be positioned away from. However, the first element 100 may have a third conductive portion 130. In this case, the third conductive portion 130 may be located outside the first dielectric 410, or may be inserted into a hole formed in the first dielectric 410. Similarly, in this modification, the second element 200 does not have the fourth conductive portion 230 shown in FIG. However, the second element 200 may have the fourth conductive portion 230 shown in FIG. In this case, the fourth conductive portion 230 may be located outside the second dielectric 420, or may be inserted into a hole formed in the second dielectric 420.
  • Antenna device 100 1st element 110 1st conductive plate 112 Opening 120 1st conductive part 120a 1st conductive part 120b 1st conductive part 130 3rd conductive part 130a 3rd conductive part 130b 3rd conductive part 130c 3rd conductive part 130d 3rd conductive part 200 2nd element 210 2nd conductive plate 220 2nd conductive part 220a 2nd conductive part 220b 2nd conductive part 230 4th conductive part 230a 4th conductive part 230b 4th conductive part 230c 4th conductive part 230d 4 Conductive part 300 Substrate 302 First surface 304 Second surface 310 First hole 310a First hole 310b First hole 320 Second hole 320a Second hole 320b Second hole 320c Second hole 320d Second hole 322 First fixed pattern 330 3rd hole 330a 3rd hole 330b 3rd hole 340 4th hole 340a 4th hole 340b 4th hole 340c 4th hole

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Waveguide Aerials (AREA)
  • Transducers For Ultrasonic Waves (AREA)
PCT/JP2020/018514 2019-07-26 2020-05-07 アンテナ装置 Ceased WO2021019863A1 (ja)

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CN202080052020.7A CN114128046B (zh) 2019-07-26 2020-05-07 天线装置
US17/628,902 US11855363B2 (en) 2019-07-26 2020-05-07 Antenna device

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EP4007070B1 (en) 2026-04-08
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CN114128046A (zh) 2022-03-01
EP4007070A4 (en) 2023-08-09
EP4007070A1 (en) 2022-06-01
JP7368134B2 (ja) 2023-10-24
CN114128046B (zh) 2025-11-04

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