WO2021017344A1 - 一种减少远端参考电源噪声影响信号质量的方法和系统 - Google Patents

一种减少远端参考电源噪声影响信号质量的方法和系统 Download PDF

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WO2021017344A1
WO2021017344A1 PCT/CN2019/121112 CN2019121112W WO2021017344A1 WO 2021017344 A1 WO2021017344 A1 WO 2021017344A1 CN 2019121112 W CN2019121112 W CN 2019121112W WO 2021017344 A1 WO2021017344 A1 WO 2021017344A1
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noise
remote reference
power
plane
power supply
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PCT/CN2019/121112
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English (en)
French (fr)
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李德恒
刘法志
田民政
武宁
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苏州浪潮智能科技有限公司
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Priority to US17/615,228 priority Critical patent/US11490505B2/en
Publication of WO2021017344A1 publication Critical patent/WO2021017344A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/373—Design optimisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/06—Power analysis or power optimisation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/10—Noise analysis or noise optimisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Definitions

  • This application belongs to the field of electronic design technology, and in particular relates to a method and system for reducing the influence of remote reference power noise on signal quality.
  • the circuit board In the field of electronic design, the circuit board is the physical carrier of all electronic design content, so the intent of electronic design must be realized through the circuit board, so the circuit board design is an indispensable link in any electronic device.
  • the circuit board design is mainly divided into two parts, signal design and power supply design.
  • the power supply design is the design basis of the entire circuit board, and all chips need a stable power supply to work normally.
  • Signal design is the soul of circuit board design.
  • the realization of various functions needs to be controlled by signals.
  • the quality of signal design is related to the realization and stability of each function of the circuit board.
  • Traditional signal integrity design methods have a clear requirement for the near-end reference of high-speed signals, but there is a lack of relevant guidance documents for the far-end reference. But when there is noise in the remote reference plane, its impact on high-speed signals cannot be ignored, and sometimes it even affects signal transmission.
  • Figure 1 shows a schematic diagram of reducing the influence of the far-end reference plane in the prior art.
  • the middle is the signal layer
  • the upper side is the near-end reference plane
  • the bottom is the far-end reference plane.
  • the distance between the signal and the near-end reference is H
  • the signal and The distance of the far-end reference plane should be designed to be 3H to minimize the influence of the far-end reference plane.
  • the remote reference plane is designed as a ground or a power supply, and whether the power supply has excessive noise.
  • the prior art has certain design limitations. When the remote reference plane is a noisy power plane, power noise will interfere with the signal of the signal layer, and may even cause false triggering of the signal, thereby affecting the quality of high-speed or low-speed signals.
  • This application proposes a method and system for reducing the influence of remote reference power supply noise on signal quality.
  • this application proposes a method and system for reducing the influence of remote reference power noise on signal quality.
  • the method includes the following steps:
  • S1 According to the schematic diagram of the signal design, identify the remote reference power plane connected to the power module, determine the power plane with noise, and find the position of the noise power plane in the PCB to determine whether it is referenced by the remote high-speed signal;
  • S2 Determine the location and quantity of connecting capacitors according to the layout and wiring position of high-speed signals and the width of the power supply surface with noise;
  • S3 Place two types of capacitors with fixed capacitance at the position where the capacitor is connected.
  • step S1 an oscilloscope is selected for measurement at the switch directly connected to the pin of the switching power supply chip. If the oscillation voltage is greater than 10% of the switching power supply chip voltage, it is determined that there is a noisy power supply surface.
  • step S1 an oscilloscope is selected for measurement at the switch directly connected to the pin of the switching power supply chip. If the voltage amplitude jumps and the rising edge rate is greater than 0.3V/ns, it is determined that there is a noisy power surface ;
  • the voltage oscillates during the conversion process and the oscillation frequency is between 100Khz-1Ghz, it is determined that there is a noisy power supply surface.
  • step S2 the method for determining the position and number of connecting capacitors according to the layout and wiring position of the high-speed signal and the width of the power supply surface with noise is:
  • connection capacitor is placed on the L1 layer within the range of 80 mils perpendicular to the farthest end of the high-speed signal line; at the same time, according to the noise power plane A pair of connection capacitors are placed every 300 mils; the connection capacitors are used to connect the power plane and ground where there is noise.
  • step S3 the two types of capacitors with fixed capacitance are 0.01uF and 0.1uF, respectively.
  • connection capacitor is placed next to the high-speed signal line, the connection capacitor is located at the L1 layer, and is used to connect the remote reference power plane and the ground; the high-speed signal line is located at the L7 layer; the ground layer is located at the L6 layer; The remote reference power plane is located on the L8 layer.
  • This application also proposes a system for reducing the influence of remote reference power supply noise on signal quality, including a recognition and judgment module; a determination module and a placement module;
  • the identification and judgment module is used to identify the remote reference power plane connected to the power module according to the schematic diagram of the signal design, determine the power plane with noise, and find the position of the noisy power plane in the PCB to determine whether it is high-speed signal Remote reference
  • the determining module is used to determine the location and quantity of connecting capacitors according to the layout and wiring position of the high-speed signal and the width of the power supply plane with noise;
  • the placement module is used to place two types of capacitors with fixed capacitance at the position where the capacitor is connected.
  • the identification and judgment module includes an identification module and a judgment module
  • the identification and judgment module includes an identification module and a judgment module
  • the identification module is used to identify the remote reference power plane connected to the power module according to the principle diagram of the signal design, and determine the power plane with noise;
  • the judgment module is used to find the position of the noise power plane in the PCB, and judge whether it is referenced by the remote end of the high-speed signal.
  • the determining module includes a first determining module and a second determining module
  • the first determination module is used to determine the high-speed signal line and the position of the remote reference plane, in order to ensure the quality of the high-speed signal line, place a connection capacitor on the L1 layer perpendicular to the farthest end of the high-speed signal line 80 mil. ;
  • the second determining module is used to place a pair of connection capacitors every 300 mils according to the width of the power surface with noise; the connection capacitor is used to connect the power surface with noise and the ground.
  • the embodiment of the application proposes a method and system for reducing the influence of remote reference power noise on signal quality.
  • the method first identifies the remote reference power plane connected to the power module according to the schematic diagram of the signal design, and determines the presence of noise Power surface, and record the position and name of the noise power surface; find the position of the noise power surface in the PCB, and determine whether it is referenced by the remote end of the high-speed signal; then, according to the layout and routing position of the high-speed signal and the width of the noise power surface , Determine the location and quantity of connecting capacitors.
  • connection capacitor on the L1 layer within the range of 80 mils perpendicular to the farthest end of the high-speed signal line; at the same time, according to the width of the power plane with noise ,Place a pair of connection capacitors every 300mil; the connection capacitors are used to connect the power plane and ground where there is noise. Finally, place two types of capacitors with fixed capacitance in the place where the capacitors are connected. Based on the method for reducing the influence of remote reference power supply noise on signal quality proposed in this application, a system for reducing the influence of remote reference power supply noise on signal quality is also proposed.
  • This application determines where the noise occurs, determines the power plane with noise, and then refers to the position of the power plane at the far end of the noisy signal line, adds a connection capacitor, connects the power plane and the ground, and removes most of the power supply noise through the connection capacitor Filter out, reduce the influence of the noise on the signal quality of the remote reference power plane of the signal, and improve the signal integrity.
  • Figure 1 shows a schematic diagram of reducing the influence of the remote reference plane in the prior art
  • Figure 2 shows the principle diagram of the signal design proposed in Embodiment 1 of the present application
  • FIG. 3 shows a waveform diagram of the voltage amplitude jumping and noise in Embodiment 1 of the present application.
  • FIG. 4 shows a schematic diagram of reducing the influence of the noise of the remote reference power supply on the signal quality according to Embodiment 1 of the present application;
  • FIG. 5 shows a schematic diagram of the simulation result of reducing the influence of the noise of the remote reference power supply on the signal quality according to Embodiment 1 of the present application;
  • FIG. 6 shows a flow chart of a method for reducing the influence of noise from a remote reference power supply on signal quality proposed in Embodiment 1 of the present application;
  • FIG. 7 shows a schematic diagram of a system for reducing the influence of noise from a remote reference power supply on signal quality proposed in Embodiment 1 of the present application.
  • Embodiment 1 of the present application proposes a method and system for reducing the influence of remote reference power noise on signal quality.
  • This method first identifies the remote reference power plane connected to the power supply module according to the schematic diagram of the signal design, then determines the power plane with noise, and records the position and name of the noise power plane; then finds the noise power supply in the PCB The position of the surface is judged whether it is referenced by the far end of the high-speed signal.
  • Fig. 2 shows the principle diagram of the signal design proposed in Embodiment 1 of the present application, and the power supply surface with a large voltage in the PCB, such as 12V, 5V, etc.
  • the power planes directly connected to the power chip are VIN, Phase, and GND, where GND is the GND connected to Q2 in the figure. Because the power is always on and off, the voltage at the circled place in the figure will oscillate to a certain extent.
  • FIG. 3 shows a waveform diagram of the voltage amplitude jumping and noise in Embodiment 1 of the present application. If the voltage amplitude jumps and the rising edge rate is greater than 0.3V/ns, it is determined that there is a noisy power surface. If the voltage oscillates during the conversion and the oscillation frequency is in the range of 100k-1ghz, it is considered that there is noise.
  • Fig. 4 shows a schematic diagram of reducing the influence of noise on the remote reference power supply on signal quality proposed in Example 1 of the present application;
  • the signal layer has a pair of differential signals, the near-end reference ground, the remote reference power plane 1, and the power plane 1.
  • the noise is very large, and the remote reference plane also has power plane 2, power plane 3 and other power planes.
  • Add a connecting capacitor at the position of the reference power plane 1 at the far end of the signal line connect the power plane 1 and the ground, and filter most of the power noise through the connecting capacitor, thereby reducing its influence on the signal.
  • connection capacitor is placed next to the high-speed signal line, and the connection capacitor is located on the L1 layer to connect the remote reference power plane and ground; the high-speed signal line is on the L7 layer; the ground plane is on the L6 layer; the remote reference power plane is on the L8 layer.
  • the method to determine the position and quantity of the connecting capacitor is: according to the determined position of the high-speed signal line and the remote reference surface, in order to ensure the quality of the high-speed signal line, Place the connection capacitors perpendicular to the L1 layer within the range of 80 mils from the farthest end of the high-speed signal line; at the same time, determine the location and quantity according to the layout position of the high-speed signal and the width of the power surface with noise, and place a pair of connection capacitors every 300 mil;
  • the connection capacitor is used to connect the noisy power plane and ground.
  • the distance between the capacitor pad and the farthest reference surface of the signal line should be within 80 mils to enhance the noise filtering effect.
  • the distance between the far end of the signal line and the reference noise power plane is about 1200 mils, a total of 4 300 mils, then 4 pairs of capacitors should be placed, and the capacitors are located in the middle of about 300 mils.
  • Fig. 5 shows a schematic diagram of the simulation result of reducing the noise of the remote reference power supply and its influence on the signal quality proposed in Embodiment 1 of the present application;
  • the solid line A is the initial design waveform without noise on the power plane 1, and the dashed line A with more deviation is
  • the power supply side 1 is noisy and the waveform when the capacitor is not added.
  • the broken line B closer to the solid line indicates that the power supply side 1 is noisy.
  • the waveform after the capacitor is increased. You can see the signal waveform after the capacitor is added. It has been greatly improved, and the impact on signal quality is greatly reduced.
  • the capacitors of 0.01uF and 0.1uF can be added at the positions adjacent to the power supply surface 1 and the power supply surface 2 to reduce the interference between them.
  • FIG. 6 shows a flow chart of a method for reducing the influence of noise from a remote reference power supply on signal quality proposed in Embodiment 1 of the present application;
  • step S601 according to the schematic diagram of the signal design, identify the remote reference power plane connected to the power module, determine the power plane with noise, and record the location and name of the noise power plane; then find the noise in the PCB The position of the power plane and judge whether it is referenced by the remote end of the high-speed signal.
  • step S602 according to the layout and wiring position of the high-speed signal and the width of the power supply plane with noise, the position and the number of connecting capacitors are determined.
  • step S603 two types of capacitors with fixed capacitance are placed at the positions where the connected capacitors are placed.
  • FIG. 7 shows a method proposed in Embodiment 1 of the application.
  • System diagram for reducing the influence of remote reference power noise on signal quality includes a recognition and judgment module; a determination module and a placement module;
  • the identification and judgment module is used to identify the remote reference power plane connected to the power module according to the schematic diagram of the signal design, determine the power plane with noise, and find the position of the noise power plane in the PCB to determine whether it is remote from the high-speed signal reference;
  • the determining module is used to determine the location and quantity of connecting capacitors according to the layout and wiring position of high-speed signals and the width of the power supply surface with noise;
  • the placement module is used to place two types of capacitors with fixed capacitance at the location where the capacitor is connected.
  • the identification and judgment module includes an identification module and a judgment module
  • the identification module is used to identify the remote reference power plane connected to the power module according to the schematic diagram of the signal design, and determine the power plane with noise;
  • the judgment module is used to find the position of the noise power surface in the PCB and judge whether it is referenced by the remote end of the high-speed signal.
  • the determining module includes a first determining module and a second determining module
  • the first determining module is used to place a connection capacitor on the L1 layer within a range of 80 mils perpendicular to the farthest end of the high-speed signal line in order to ensure the quality of the high-speed signal line according to the determined high-speed signal line and the position of the remote reference plane;
  • the second determining module is used to place a pair of connection capacitors every 300 mils according to the width of the noisy power surface; the connection capacitors are used to connect the noisy power surface and the ground.

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Abstract

一种减少远端参考电源噪声影响信号质量的方法和系统，该方法首先根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定出存在噪声的电源面，然后在PCB中找到噪声电源面的位置，并判断是否被高速信号远端参考；根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量最后，在连接电容放置的位置，放置容值固定的两种电容。基于本申请提出的方法，还提出了一种减少远端参考电源噪声影响信号质量的系统。在存在噪声的信号线远端参考电源面的位置，增加连接电容，连接电源面和地，通过连接电容将大部分电源噪声滤除，减少信号远端参考电源面噪声对信号质量的影响，提高信号完整性。

Description

一种减少远端参考电源噪声影响信号质量的方法和系统
本申请要求于2019年8月1日提交中国专利局、申请号为201910706556.5、名称为“一种减少远端参考电源噪声影响信号质量的方法和系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于电子设计技术领域，特别涉及一种减少远端参考电源噪声影响信号质量的方法和系统。
背景技术
在电子设计领域，电路板是所有电子设计内容的物理载体，所以电子设计的意图都要通过电路板来实现，所以电路板设计是任何电子设备中不可或缺的一个环节。电路板设计主要分为两个部分，信号设计和电源设计。电源设计为整个电路板的设计基础，所有芯片需要有一个稳定的电源才能正常工作。信号设计为电路板设计的灵魂，各种功能的实现都需要由信号来控制，信号设计的好坏关系到电路板各个功能的实现和稳定性。传统的信号完整性设计方法对高速信号的近端参考都有一个明确的要求，但是对远端参考确缺少相关的指导文件。但是当远端参考平面存在噪声时，其对高速信号的影响将不能忽略，有时候甚至会影响到信号的传输。
图1给出了现有技术中减少远端参考面的影响的示意图，中间为信号层，上边为近端参考面，下方为远端参考面，信号与近端参考的距离为H,信号与远端参考面的距离要设计为3H，以尽可能减小远端参考面的影响。现阶段，对远端参考面设计为地还是电源，对电源的噪声是否过大等都没有相关要求。现有技术存在一定的设计局限，当远端参考面为噪声较大的电源层面时，电源噪声会干扰信号层的信号，甚至可能导致信号的误触发，从而影响高速或低速信号的质量。
发明内容
本申请提出了一种减少远端参考电源噪声影响信号质量的方法和系 统，通过在电源远端参考面的位置，增加连接电容，连接电源远端参考面和地，将大部分电源噪声滤除，从而减少对信号的影响。
为了实现上述目的，本申请提出了一种减少远端参考电源噪声影响信号质量的方法和系统，该方法包括以下步骤：
S1：根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面，并在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考；
S2：根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量；
S3：在连接电容放置的位置，放置容值固定的两种电容。
进一步的，在步骤S1中，在对开关电源芯片引脚直接相连的开关处选择示波器进行测量，如果振荡电压大于开关电源芯片电压的10％，则判定为存在噪声的电源面。
进一步的，在步骤S1中，在对开关电源芯片引脚直接相连的开关处选择示波器进行测量，如果电压振幅发生跳变，且上升沿速率大于0.3V/ns，则判定为存在噪声的电源面；
如果电压在转换过程中存在振荡，振荡频率在100Khz-1Ghz之间，则判定为存在噪声的电源面。
进一步的，在步骤S2中，所述根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量的方法为：
根据确定的高速信号线和远端参考面的位置，为了保证高速信号线的质量，在垂直于所述高速信号线最远端80mil范围内的L1层放置连接电容；同时根据存在噪声的电源面的宽度，每300mil放置一对连接电容；所述连接电容用于连接存在噪声的电源面和地。
进一步的，在步骤S3中，容值固定的两种电容分别为0.01uF和0.1uF。
进一步的，所述连接电容放置在高速信号线旁，所述连接电容位于L1层，用于连接远端参考电源面和地；所述高速信号线位于L7层；所述地层位于L6层；所述远端参考电源面位于L8层。
本申请还提出了一种减少远端参考电源噪声影响信号质量的系统，包 括识别判断模块；确定模块和放置模块；
所述识别判断模块用于根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面，并在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考；
所述确定模块用于根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量；
所述放置模块用于在连接电容放置的位置，放置容值固定的两种电容。
进一步的，所述识别判断模块包括识别模块和判断模块；
所述识别判断模块包括识别模块和判断模块；
所述识别模块用于根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面；
所述判断模块用于在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考。
进一步的，所述确定模块包括第一确定模块和第二确定模块；
所述第一确定模块用于根据确定的高速信号线和远端参考面的位置，为了保证高速信号线的质量，在垂直于所述高速信号线最远端80mil范围内的L1层放置连接电容；
所述第二确定模块用于根据存在噪声的电源面的宽度，每300mil放置一对连接电容；所述连接电容用于连接存在噪声的电源面和地。
申请内容中提供的效果仅仅是实施例的效果，而不是申请所有的全部效果，上述技术方案中的一个技术方案具有如下优点或有益效果：
本申请实施例提出了一种减少远端参考电源噪声影响信号质量的方法和系统，该方法首先根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定出存在噪声的电源面，并记录存在噪声电源面的位置和名字；在PCB中找到噪声电源面的位置，并判断是否被高速信号远端参考；然后，根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量。根据确定的高速信号线和远端参考面的位置，为了保证高速信号线的质量，在垂直于高速信号线最远端80mil范围内的L1层放置连接电容；同时根据存在噪声的电源面的宽度，每300mil放置 一对连接电容；连接电容用于连接存在噪声的电源面和地。最后，在连接电容放置的位置放置容值固定的两种电容。基于本申请提出的一种减少远端参考电源噪声影响信号质量的方法，还提出了一种减少远端参考电源噪声影响信号质量的系统。本申请通过判断出现噪声的位置，确定出存在噪声的电源面，然后在存在噪声的信号线远端参考电源面的位置，增加连接电容，连接电源面和地，通过连接电容将大部分电源噪声滤除，减少信号远端参考电源面噪声对信号质量的影响，提高信号完整性。
附图说明
图1给出了现有技术中减少远端参考面的影响的示意图；
图2给出了本申请实施例1提出的信号设计的原理图；
图3给出了本申请实施例1中电压振幅发生跳变存在噪声的波形图。
图4给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的示意图；
图5给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的仿真结果示意图；
图6给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的方法流程图；
图7给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的系统示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外” 等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
实施例1
本申请实施例1提出了一种减少远端参考电源噪声影响信号质量的方法和系统。该方法首先根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，进而确定出存在噪声的电源面，并记录存在噪声电源面的位置和名字；然后在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考。
然后，根据高速信号的布局布线位置和存在噪声的电源面宽度，判断放置连接电容的位置和数量。
最后，在连接电容放置的位置，放置容值固定的两种电容。
图2给出了本申请实施例1提出的信号设计的原理图，PCB中电压较大的电源面，比如12V，5V等。电源芯片直接相连的电源面，分别为VIN、Phase和GND,其中GND为图中Q2连接的GND。因电源一直开关，图中画圆圈的地方电压会有一定的振荡。
选择10Ghz带宽的示波器，对于原理图中存在电压振荡处进行测量，如果振荡电压大于开关电源芯片电压的10％，则判定为存在噪声的电源面。
图3给出了本申请实施例1中电压振幅发生跳变存在噪声的波形图。如果电压振幅发生跳变，且上升沿速率大于0.3V/ns，则判定为存在噪声的电源面。如果电压在转换过程中存在振荡，振荡频率在100k-1ghz范围内，就认为存在噪声。
图4给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的示意图；信号层有1对差分信号，其近端参考地，远端参考电源面1，电源面1的噪声很大，远端参考面还有电源面2、电源面3等电源面。在信号线远端参考电源面1的位置，增加一个连接电容，连接电源面1和地，通过连接电容将大部分电源噪声滤除，从而减少其对信号的影响。连接电容放置在高速信号线旁，连接电容位于L1层，用于连接远端参考电源面和地；高速信号线位于L7层；地层位于L6层；远端参考电源面位于 L8层。
根据高速信号的布局布线位置和存在噪声的电源面宽度，判断放置连接电容的位置和数量的方法为：根据确定的高速信号线和远端参考面的位置，为了保证高速信号线的质量，在垂直于高速信号线最远端80mil范围内的L1层放置连接电容；同时根据高速信号的布局布线位置和存在噪声的电源面的宽度，确定放置的位置和数量，每300mil放置一对连接电容；连接电容用于连接存在噪声的电源面和地。电容的pad距离信号线最远端的参考面的距离要在80mil以内，以增强噪声滤除效果。信号线远端参考噪声电源面的距离约为1200mil，共4个300mil，那么就要放置4对电容，电容位置在约每个300mil的中间。
图5给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的仿真结果示意图；实线A为电源面1没有噪声的初始设计的波形，偏离较多的虚线A为电源面1噪声较大，且未增加连接电容时的波形，与实线较近的虚线B为电源面1噪声较大，增加连接电容后的波形，可看到增加连接电容后，信号的波形有了很大的改善，对信号质量的影响大大减小。
确定放置连接电容的位置和数量后，固定为每处放置0.01uF和0.1uF的电容组合进行测试。如果电源面1和电源面2之间的距离很近，电源面1噪声很大，但两者相邻又不可避免。这时就可以在电源面1与电源面2相邻的位置，增加0.01uF和0.1uF的电容，减小他们之间的干扰。
图6给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的方法流程图；
在步骤S601中，根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定出存在噪声的电源面，并记录存在噪声电源面的位置和名字；然后在PCB中找到噪声电源面的位置，并判断是否被高速信号远端参考。
在步骤S602中，根据高速信号的布局布线位置和存在噪声的电源面宽度，判断放置连接电容的位置和数量。
在步骤S603中，在连接电容放置的位置，放置容值固定的两种电容。
基于本申请提出的一种减少远端参考电源噪声影响信号质量的方法，还提出了一种减少远端参考电源噪声影响信号质量的系统，图7给出了本申请实施例1提出的一种减少远端参考电源噪声影响信号质量的系统示意图。该系统包括识别判断模块；确定模块和放置模块；
识别判断模块用于根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面，并在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考；
确定模块用于根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量；
放置模块用于在连接电容放置的位置，放置容值固定的两种电容。
识别判断模块包括识别模块和判断模块；
识别模块用于根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面；
判断模块用于在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考。
确定模块包括第一确定模块和第二确定模块；
第一确定模块用于根据确定的高速信号线和远端参考面的位置，为了保证高速信号线的质量，在垂直于所述高速信号线最远端80mil范围内的L1层放置连接电容；；
第二确定模块用于根据存在噪声的电源面的宽度，每300mil放置一对连接电容；连接电容用于连接存在噪声的电源面和地。
以上内容仅仅是对本申请的结构所作的举例和说明，所属本技术领域的技术人员对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代，只要不偏离申请的结构或者超越本权利要求书所定义的范围，均应属于本申请的保护范围。

Claims (9)

  1. 一种减少远端参考电源噪声影响信号质量的方法，其特征在于，包括以下步骤：
    S1：根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面，并在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考；
    S2：根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量；
    S3：在连接电容放置的位置，放置容值固定的两种电容。
  2. 根据权利要求1所述的一种减少远端参考电源噪声影响信号质量的方法，其特征在于，在步骤S1中，在对开关电源芯片引脚直接相连的开关处选择示波器进行测量，如果振荡电压大于开关电源芯片电压的10％，则判定为存在噪声的电源面。
  3. 据权利要求1所述的一种减少远端参考电源噪声影响信号质量的方法，其特征在于，在步骤S1中，在对开关电源芯片引脚直接相连的开关处选择示波器进行测量，如果电压振幅发生跳变，且上升沿速率大于0.3V/ns，则判定为存在噪声的电源面；
    如果电压在转换过程中存在振荡，振荡频率在100Khz-1Ghz之间，则判定为存在噪声的电源面。
  4. 根据权利要求1所述的一种减少远端参考电源噪声影响信号质量的方法，其特征在于，在步骤S2中，所述根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量的方法为：
    根据确定的高速信号线和远端参考面的位置，为了保证高速信号线的质量，在垂直于所述高速信号线最远端80mil范围内的L1层放置连接电容；根据存在噪声的电源面的宽度，每300mil放置一对连接电容；所述连接电容用于连接存在噪声的电源面和地。
  5. 根据权利要求1所述的一种减少远端参考电源噪声影响信号质量的方法，其特征在于，在步骤S3中，容值固定的两种电容分别为0.01uF和0.1uF。
  6. 根据权利要求4所述的一种减少远端参考电源噪声影响信号质量的方法，其特征在于，所述连接电容放置在高速信号线旁，所述连接电容位于L1层，用于连接远端参考电源面和地；所述高速信号线位于L7层；所述地层位于L6层；所述远端参考电源面位于L8层。
  7. 一种减少远端参考电源噪声影响信号质量的系统，其特征在于，包括识别判断模块；确定模块和放置模块；
    所述识别判断模块用于根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面，并在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考；
    所述确定模块用于根据高速信号的布局布线位置和存在噪声的电源面宽度，确定放置连接电容的位置和数量；
    所述放置模块用于在连接电容放置的位置，放置容值固定的两种电容。
  8. 根据权利要求7所述的一种减少远端参考电源噪声影响信号质量的系统，其特征在于，所述识别判断模块包括识别模块和判断模块；
    所述识别模块用于根据信号设计的原理图，识别出与电源模块连接的远端参考电源面，确定存在噪声的电源面；
    所述判断模块用于在PCB中找到噪声电源面的位置，判断是否被高速信号远端参考。
  9. 根据权利要求7所述的一种减少远端参考电源噪声影响信号质量的系统，所述确定模块包括第一确定模块和第二确定模块；
    所述第一确定模块用于根据确定的高速信号线和远端参考面的位置，为了保证高速信号线的质量，在垂直于所述高速信号线最远端80mil范围内的L1层放置连接电容；
    所述第二确定模块用于根据存在噪声的电源面的宽度，每300mil放置一对连接电容；所述连接电容用于连接存在噪声的电源面和地。
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