WO2021012518A1 - 一种灯源组件及显示面板 - Google Patents

一种灯源组件及显示面板 Download PDF

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Publication number
WO2021012518A1
WO2021012518A1 PCT/CN2019/117932 CN2019117932W WO2021012518A1 WO 2021012518 A1 WO2021012518 A1 WO 2021012518A1 CN 2019117932 W CN2019117932 W CN 2019117932W WO 2021012518 A1 WO2021012518 A1 WO 2021012518A1
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WO
WIPO (PCT)
Prior art keywords
substrate
photosensitive detector
source assembly
emitting diode
microcontroller
Prior art date
Application number
PCT/CN2019/117932
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English (en)
French (fr)
Inventor
温雷
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2021012518A1 publication Critical patent/WO2021012518A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Definitions

  • the present application relates to the technical field of panel manufacturing, in particular to a light source assembly and a display panel.
  • Micro Lighting Emitting Diode As a current-type light-emitting semiconductor device, is regarded as the next-generation advanced due to its self-luminous, high luminous efficiency, and low energy consumption. Display technology.
  • the purpose of the embodiments of the present application is to provide a light source assembly and a display panel, which can solve the existing technical problems of poor luminous intensity uniformity and poor display effect.
  • the embodiment of the present application provides a light source assembly, including:
  • the substrate has a first surface and a second surface disposed oppositely;
  • a micro light emitting diode which is arranged on the first surface and is electrically connected to the substrate;
  • a microcontroller is electrically connected to the substrate and the photosensitive detector, and the microcontroller receives the feedback signal to control the micro light emitting diode through the substrate.
  • the light source assembly further includes a cover plate located on the first surface and away from the substrate.
  • the photosensitive detector is fixed on the cover plate, the orthographic projection of the photosensitive detector on the substrate overlaps the microcontroller, and the light source assembly further includes a connecting wire, One end of the connecting wire is connected with the photosensitive detector, and the other end is connected with the microcontroller, and the connection position of the connecting wire and the microcontroller is located in the overlapping part of the photosensitive detector and the micro controller.
  • the light source assembly further includes a reflective layer, the reflective layer is located on the first surface, and the reflective layer is used to reflect the light of the micro light emitting diode to the photosensitive detector.
  • the reflective layer is fixed inside the cover plate.
  • the photosensitive detector is fixed on the first surface, and the orthographic projection of the photosensitive detector on the cover plate completely covers the reflective layer.
  • the micro light emitting diode includes a chip and a display pixel, the chip controls the display pixel to emit light, and the substrate is electrically connected to the chip.
  • the substrate includes a transistor, and the transistor is electrically connected to the chip.
  • the microcontroller is integrated on the first surface and is electrically connected to the transistor.
  • the micro light emitting diode includes a chip and a display pixel, the chip controls the display pixel to emit light, and the substrate is electrically connected to the chip.
  • An embodiment of the present application also provides a display panel, which includes a light source assembly, the light source assembly includes a substrate, a micro light-emitting diode, a photosensitive detector, and a microcontroller, and the substrate has a first surface and a first surface opposite to each other. On the two sides, miniature light-emitting diodes are arranged on the first surface and electrically connected to the substrate. The photosensitive detector is located on the first surface. The photosensitive detector is used to detect the light intensity of the miniature light-emitting diodes. A feedback signal is obtained, the microcontroller is electrically connected to the substrate and the photosensitive detector, and the microcontroller receives the feedback signal to control the micro light-emitting diode through the substrate.
  • the light source assembly further includes a cover plate located on the first surface and away from the substrate.
  • the photosensitive detector is fixed on the cover plate, the orthographic projection of the photosensitive detector on the substrate overlaps the microcontroller, and the light source assembly further includes a connecting wire, One end of the connecting wire is connected with the photosensitive detector, and the other end is connected with the microcontroller, and the connection position of the connecting wire and the microcontroller is located in the overlapping part of the photosensitive detector and the micro controller.
  • the light source assembly further includes a reflective layer, the reflective layer is located on the first surface, and the reflective layer is used to reflect the light of the micro light emitting diode to the photosensitive detector.
  • the reflective layer is fixed inside the cover plate.
  • the photosensitive detector is fixed on the first surface, and the orthographic projection of the photosensitive detector on the cover plate completely covers the reflective layer.
  • the micro light emitting diode includes a chip and a display pixel, the chip controls the display pixel to emit light, and the substrate is electrically connected to the chip.
  • the substrate includes a transistor, and the transistor is electrically connected to the chip.
  • the microcontroller is integrated on the first surface and is electrically connected to the transistor.
  • the micro light emitting diode includes a chip and a display pixel, the chip controls the display pixel to emit light, and the substrate is electrically connected to the chip.
  • the light intensity of the micro light-emitting diode is monitored in real time by a photosensitive detector.
  • the photosensitive detector detects that the light intensity of the micro light-emitting diode is insufficient
  • the photosensitive detector sends a feedback signal to the microcontroller, and the microcontroller passes
  • the substrate inputs electrical signals to the micro light-emitting diodes with insufficient light intensity, so as to compensate the micro light-emitting diodes with insufficient light intensity, so that the display uniformity of the display panel is improved, and the display effect of the display panel is improved.
  • FIG. 1 is a schematic structural diagram of a display panel in an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first structure of the light source assembly in the embodiment of the application.
  • FIG. 3 is a schematic diagram of the second structure of the light source assembly in the embodiment of the application.
  • Fig. 4 is a schematic diagram of a third structure of the light source assembly in the embodiment of the application.
  • FIG. 5 is a schematic diagram of the structure of the micro light emitting diode in the lamp source assembly in the embodiment of the application.
  • FIG. 6 is a schematic diagram of the structure of the substrate in the lamp source assembly in the embodiment of the application.
  • Fig. 7 is a working principle diagram of the light source assembly in an embodiment of the application.
  • FIG. 1 is a schematic diagram of the structure of a display panel 100 in an embodiment of the application.
  • the display panel 100 includes a light source assembly 10 and a liquid crystal module 20.
  • the liquid crystal module 20 is disposed above the light source assembly 10, and the light source assembly 10 provides a light source for the liquid crystal module 20 so that the liquid crystal module 20 can display.
  • the display panel 100 may also include other devices.
  • the liquid crystal module 20 and other devices and their assembly in the embodiments of the present application are related technologies well known to those skilled in the art, and will not be repeated here.
  • the light source assembly 10 provides the light source through the micro light emitting diode 12.
  • the chip 121 of the micro light emitting diode 12 is mainly cut through the GaN epitaxial wafer with a specific device structure and further transferred to The display is realized on the substrate in the liquid crystal module 20.
  • the uniformity of the luminous intensity in the prepared micro-light-emitting diode 12 is poor, which greatly affects the display effect of the display panel 100. Therefore, an embodiment of the present application provides a light source assembly 10 that can make the light intensity uniformity of the micro light-emitting diode 12 better.
  • the light source assembly 10 will be described in detail below.
  • FIG. 2 is a schematic diagram of the first structure of the light source assembly 10 in the embodiment of the application.
  • the light source assembly 10 includes a substrate 11, a micro light emitting diode 12, a photosensitive detector 13, and a microcontroller 14.
  • the substrate 11 has a first surface 11a and a second surface 11b disposed oppositely, and the micro light emitting diode 12 is disposed on the first surface.
  • the photosensitive detector 13 is located on the first surface 11a, the photosensitive detector 13 is used to detect the light intensity of the miniature light-emitting diode 12 to obtain a feedback signal, the microcontroller 14 is connected to the substrate 11 and the photosensitive detector 13 is electrically connected, and the micro controller receives a feedback signal to control the micro light emitting diode 12 through the substrate 11.
  • the light intensity of the micro light emitting diode 12 is monitored in real time by the photosensitive detector 13.
  • the photosensitive detector 13 detects that the light intensity of the micro light emitting diode 12 is insufficient
  • the photosensitive detector 13 sends a feedback signal to the microcontroller 14.
  • the microcontroller 14 inputs electrical signals to the micro LED 12 with insufficient light intensity through the substrate 11, thereby compensating for the micro LED 12 with insufficient light intensity, so that the display uniformity of the display panel 100 is improved, thereby improving the display panel 100 display effect.
  • first surface 11 a may be the upper surface of the substrate 11, and the second surface 11 b may be the lower surface of the substrate 11.
  • second case may also be the lower surface of the substrate 11, and the second surface 11b may be the upper surface of the substrate 11.
  • the default is that the first surface 11a is the upper surface of the substrate 11 and the second surface 11b is the lower surface of the substrate 11.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • features defined with “first” and “second” may explicitly or implicitly include one or more features.
  • “multiple” means two or more than two, unless otherwise specifically defined.
  • the light source assembly 10 further includes a cover plate 15 which is located on the first surface 11 a and far away from the substrate 11.
  • the cover plate 15 is used to protect the substrate 11, the micro light emitting diode 12, the photosensitive detector 13, and the like.
  • the cover plate 15 is far away from the substrate 11, that is, there is a distance between the cover plate 15 and the substrate 11. As for the distance between the cover plate 15 and the substrate 11, it will not be repeated in the embodiment of the present application.
  • the cover plate 15 is provided corresponding to the substrate 11.
  • the light source assembly 10 also includes a connecting wire 16, and one end of the connecting wire 16 is connected to the photosensitive detector 13. The other end is connected to the microcontroller 14, and the position where the connection line 16 is connected to the microcontroller 14 is located at the overlapping part of the photosensitive detector 13 and the microcontroller. Because the orthographic projection of the photosensitive detector 13 on the substrate 11 overlaps the microcontroller 14. Therefore, one end of the connecting wire 16 is connected to the photosensitive detector 13 and the other end is connected to the microcontroller 14 when the distance is compared. In this way, it is more convenient to assemble the light source assembly 10.
  • FIG. 4 is a schematic diagram of a third structure of the light source assembly 10 in the embodiment of the application.
  • the lamp source assembly 10 further includes a reflective layer 17, the reflective layer 17 is located on the first surface 11 a, and the reflective layer 17 is used to reflect the light of the micro light emitting diode 12 to the photosensitive detector 13.
  • the reflective layer 17 can cover the micro light emitting diode 12, so that all the light of the micro light emitting diode 12 is reflected into the photosensitive detector 13, so as to realize the light intensity detection of the micro light emitting diode 12.
  • the micro-controller 14 can control the substrate 11 to compensate for the light intensity of the micro light emitting diode 12.
  • the reflective layer 17 is fixed inside the cover 15. It should be noted that the reflective layer 17 can be integrated in the cover plate 15, of course, can also be fixed inside the cover plate 15 in other ways. In the embodiment of the present application, the specific form of fixing the reflective layer 17 inside the cover plate 15 has not been done. Go into details.
  • the photosensitive detector 13 is fixed on the first surface 11 a, and the orthographic projection of the photosensitive detector 13 on the cover 15 is completely covered in the reflective layer 17.
  • a light guide plate can be provided in the cover plate 15.
  • the light guide plate is provided on the cover plate 15 to form a light guide path to guide the light of the micro light emitting diode 12 to the reflective layer, and the reflective layer 17 reflects the light of the micro light emitting diode 12 to the photosensitive layer.
  • Inside the detector 13 to realize real-time monitoring of the light intensity of the micro light emitting diode 12.
  • the photosensitive detector 13 can completely receive the light intensity reflected by the reflective layer 17, so as to better realize the micro-light-emitting diode 12
  • the light intensity monitoring improves the light intensity compensation of the micro light emitting diode 12.
  • FIG. 5 is a schematic diagram of the structure of the micro light emitting diode 12 in the light source assembly 10 in the embodiment of the application.
  • the micro light emitting diode 12 includes a chip 121 and a display pixel 122.
  • the chip 121 controls the display pixel 122 to emit light, and the substrate 11 and the chip 121 are electrically connected.
  • each display pixel 122 can correspond to each chip 121
  • the photosensitive detector 13 detects the light intensity of each display pixel 122 in the micro light-emitting diode 12, and the substrate 11 passes to each corresponding display pixel.
  • the pixels 122 input current to realize the light intensity compensation for each display pixel 122, so that the light intensity of all the display pixels 122 is uniform to improve the display effect of the display panel 100.
  • FIG. 6 is a schematic diagram of the structure of the substrate 11 in the lamp source assembly 10 in the embodiment of the application.
  • the substrate 11 includes a transistor 111, and the transistor 111 is electrically connected to the chip 121.
  • the transistor 111 inputs current to the chip 121 and increases the current to the chip 121 to increase the light intensity of the display pixels 122, so that the light intensity of the display pixels 122 of all the micro light emitting diodes 12 is uniform, thereby improving the display effect of the display panel 100.
  • FIG. 7 is a working principle diagram of the light source assembly 10 in the embodiment of the application.
  • the working principle of the light source assembly 10 in the embodiment of the present application is: the photosensitive detector 13 monitors the light intensity of the micro light emitting diode 12 in real time. When the photosensitive detector 13 detects that the light intensity of the micro light emitting diode 12 is insufficient, the photosensitive detector 13 The feedback signal is sent to the microcontroller 14, and the microcontroller 14 inputs an electrical signal to the micro light emitting diode 12 with insufficient light intensity through the substrate 11, so as to compensate the micro light emitting diode 12 with insufficient light intensity.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

一种灯源组件（10）及显示面板（100），灯源组件（10）包括基板（11），基板（11）具有相对设置的第一面（11a）和第二面（12b），微型发光二极管（12）设置在第一面（11a）且与基板（11）电性连接，光敏探测器（13）位于第一面（11a），光敏探测器（13）用于检测微型发光二极管（12）的光强以得到反馈信号，微控制器（14）与基板（11）以及光敏探测器（13）电性连接，微控制器（14）接收反馈信号以通过基板（11）控制微型发光二极管（12）。

Description

一种灯源组件及显示面板 技术领域
本申请涉及面板制造技术领域，特别涉及一种灯源组件及显示面板。
 背景技术
随着显示技术的不断发展，微型发光二极管（Micro Lighting Emitting Diode，MicroLED）作为一种电流型发光半导体器件，因其具有自发光，光效高，能耗低等优点而被视为次世代先进显示技术。
现有技术中，微型发光二极管在生产过程中，因为微型发光二极管与其他部件接触不良等问题导致微型发光二极管的发光强度均匀性较差，极大的影响了显示效果。
 技术问题
本申请实施例的目的在于提供一种灯源组件及显示面板，能够解决现有中发光强度均匀性较差、显示效果不好的技术问题。
 技术解决方案
本申请实施例提供一种灯源组件，包括：
基板，具有相对设置的第一面和第二面；
微型发光二极管，设置在所述第一面且与所述基板电性连接；
光敏探测器，位于所述第一面，所述光敏探测器用于检测所微型发光二极管的光强以得到反馈信号；
微控制器，与所述基板以及所述光敏探测器电性连接，所述微控制接收所述反馈信号以通过所述基板控制所述微型发光二极管。
在一些实施例中，所述灯源组件还包括盖板，所述盖板位于所述第一面且远离所述基板。
在一些实施例中，所述光敏探测器固定在所述盖板上，所述光敏探测器在所述基板的正投影与所述微控制器交叠，所述灯源组件还包括连接线，所述连接线一端与所述光敏探测器连接，另一端与所述微控制器连接，所述连接线与微控制器连接的位置位于所述光敏探测器与所述微控制交叠的部分。
在一些实施例中，所述灯源组件还包括反射层，所述反射层位于所述第一面，所述反射层用于将所述微型发光二极管的光反射到所述光敏探测器。
在一些实施例中，所述反射层固定在所述盖板内部。
在一些实施例中，所述光敏探测器固定在所述第一面，所述光敏探测器在所述盖板的正投影完全覆盖在所述反射层内。
在一些实施例中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
在一些实施例中，所述基板包括晶体管，所述晶体管与所述芯片电性连接。
在一些实施例中，所述微控制器集成在所述第一面且与所述晶体管电性连接。
在一些实施例中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
本申请实施例还提供一种显示面板，其中，包括灯源组件，所述灯源组件包括基板、微型发光二极管、光敏探测器以及微控制器，所述基板具有相对设置的第一面和第二面，微型发光二极管，设置在所述第一面且与所述基板电性连接，所述光敏探测器位于所述第一面，所述光敏探测器用于检测所微型发光二极管的光强以得到反馈信号，所述微控制器与所述基板以及所述光敏探测器电性连接，所述微控制接收所述反馈信号以通过所述基板控制所述微型发光二极管。
在一些实施例中，所述灯源组件还包括盖板，所述盖板位于所述第一面且远离所述基板。
在一些实施例中，所述光敏探测器固定在所述盖板上，所述光敏探测器在所述基板的正投影与所述微控制器交叠，所述灯源组件还包括连接线，所述连接线一端与所述光敏探测器连接，另一端与所述微控制器连接，所述连接线与微控制器连接的位置位于所述光敏探测器与所述微控制交叠的部分。
在一些实施例中，所述灯源组件还包括反射层，所述反射层位于所述第一面，所述反射层用于将所述微型发光二极管的光反射到所述光敏探测器。
在一些实施例中，所述反射层固定在所述盖板内部。
在一些实施例中，所述光敏探测器固定在所述第一面，所述光敏探测器在所述盖板的正投影完全覆盖在所述反射层内。
在一些实施例中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
在一些实施例中，所述基板包括晶体管，所述晶体管与所述芯片电性连接。
在一些实施例中，所述微控制器集成在所述第一面且与所述晶体管电性连接。
在一些实施例中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
 有益效果
本申请实施例中，通过光敏探测器实时监测微型发光二极管的光强，当光敏探测器监测到微型发光二极管的光强不足时，光敏探测器将反馈信号发送给微控制器，微控制器通过所述基板向光强不足所述微型发光二极管输入电信号，从而对光强不足的微型发光二极管进行补偿，使得显示面板的显示均匀性提高，从而提高显示面板的显示效果。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例中显示面板的结构示意图。
图2为本申请实施例中灯源组件的第一种结构示意图。
图3为本申请实施例中灯源组件的第二种结构示意图。
图4为本申请实施例中灯源组件的第三种结构示意图。
图5为本申请实施例中灯源组件中微型发光二极管的结构示意图。
图6为本申请实施例中灯源组件中基板的结构示意图。
图7为本申请实施例中灯源组件的工作原理图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种灯源组件及显示面板。图1为本申请实施例中显示面板100的结构示意图。其中，显示面板100包括灯源组件10和液晶模组20，液晶模组20设置在灯源组件10的上方，灯源组件10为液晶模组20提供灯源以使得液晶模组20能够显示。当然，显示面板100还可以包括其他装置。本申请实施例中液晶模组20和其他装置及其装配是本领域技术人员所熟知的相关技术，在此不做过多赘述。
需要说明的是，在本申请的描述中，需要理解的是，术语上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
现有的技术中，灯源组件10中通过微型发光二极管12提供光源，微型发光二极管12在生产过程中，微型发光二极管12的芯片121主要通过切割具备特定器件结构的GaN外延片进一步通过转移至液晶模组20中基板上来实现显示。然而，由于GaN生产时的不均匀性以及转移过程的良率，导致制备的微型发光二极管12中发光强度均匀性较差，极大的影响了显示面板100的显示效果。因此，本申请实施例中提供一种灯源组件10能够使得微型发光二极管12发光强度均匀性比较好，以下对灯源组件10做详细描述。
请参阅图2，图2为本申请实施例中灯源组件10的第一种结构示意图。其中，灯源组件10包括基板11、微型发光二极管12，光敏探测器13以及微控制器14，基板11具有相对设置的第一面11a和第二面11b，微型发光二极管12设置在第一面11a且与基板11电性连接，光敏探测器13位于第一面11a，光敏探测器13用于检测所微型发光二极管12的光强以得到反馈信号，微控制器14与基板11以及光敏探测器13电性连接，微控制接收反馈信号以通过基板11控制微型发光二极管12。
本申请实施例中，通过光敏探测器13实时监测微型发光二极管12的光强，当光敏探测器13监测到微型发光二极管12的光强不足时，光敏探测器13将反馈信号发送给微控制器14，微控制器14通过基板11向光强不足微型发光二极管12输入电信号，从而对光强不足的微型发光二极管12进行补偿，使得显示面板100的显示均匀性提高，从而提高显示面板100的显示效果。
需要说明的是，第一面11a可以为基板11的上表面，第二面11b可以为基板11的下表面。当然，第二以免也可以为基板11的下表面，第二面11b可以为基板11的上表面。本申请实施例中不做特殊说明的情况下，默认为第一面11a为基板11的上表面，第二面11b为基板11的下表面。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
请参阅图3，图3为本申请实施例中灯源组件10的第二种结构示意图。其中，灯源组件10还包括盖板15，盖板15位于第一面11a且远离基板11。需要说明的是，盖板15用于保护基板11、微型发光二极管12以及光敏探测器13等。盖板15远离基板11也就是盖板15与基板11具有间距，至于盖板15与基板11之间的间距为多少，本申请实施例中不做过多赘述。另外的，盖板15与基板11对应设置。
其中，光敏探测器13固定在盖板15上，光敏探测器13在基板11的正投影与微控制器14交叠，灯源组件10还包括连接线16，连接线16一端与光敏探测器13连接，另一端与微控制器14连接，连接线16与微控制器14连接的位置位于光敏探测器13与微控制交叠的部分。由于光敏探测器13在基板11的正投影与微控制器14交叠。因此，连接线16一端与光敏探测器13连接、另一端与微控制器14连接时距离比较端。这样在装配灯源组件10时，能够更加方便。
请参阅图4，图4为本申请实施例中灯源组件10的第三种结构示意图。其中，灯源组件10还包括反射层17，反射层17位于第一面11a，反射层17用于将微型发光二极管12的光反射到光敏探测器13。需要说明的是，反射层17可以与覆盖微型发光二极管12，从而将微型发光二极管12的光全部反射到光敏探测器13内，以实现微型发光二极管12的光强检测，当某个微型发光二极管12的光强不足时，可以通过微控制器14控制基板11补偿微型发光二极管12的光强。
其中，反射层17固定在盖板15内部。需要说明的是，反射层17可以集成在盖板15内，当然也可以通过其他方式固定在盖板15内部，本申请实施例中对于反射层17固定在盖板15内部的具体形式不做过多赘述。
其中，光敏探测器13固定在第一面11a，光敏探测器13在盖板15的正投影完全覆盖在反射层17内。需要说明的是，盖板15内可以设置导光板，导光板在盖板15设形成导光路径，将微型发光二极管12的光导到反射层，反射层17将微型发光二极管12的光反射到光敏探测器13内，以实现对微型发光二极管12光强的实时监测。另外，因为光敏探测器13在盖板15的正投影完全覆盖在反射层17内，也就是光敏探测器13能够完全接受反射层17反射的光强，从而更好的实现对微型发光二极管12的光强监测，提高对微型发光二极管12的光强补偿。
请参阅图5，图5为本申请实施例中灯源组件10中微型发光二极管12的结构示意图。其中，微型发光二极管12包括芯片121和显示像素122，芯片121控制显示像素122发光，基板11与芯片121电性连接。需要说明的是，每个显示像素122可以对应每一个芯片121，光敏探测器13在检测微型发光二极管12中没一个颗显示像素122的光强，同时基板11通过向没没一颗对应的显示像素122输入电流，从而实现对每一颗显示像素122的光强补偿，使得所有的显示像素122光强均匀以提高显示面板100的显示效果。
请参阅图6，图6为本申请实施例中灯源组件10中基板11的结构示意图。其中，基板11包括晶体管111，晶体管111与芯片121电性连接。晶体管111为芯片121输入电流，向芯片121增大电流从而增大显示像素122的光强，使得所有微型发光二极管12的显示像素122光强均匀，从而提高显示面板100的显示效果。
请参阅图7，图7为本申请实施例中灯源组件10的工作原理图。其中，本申请实施例灯源组件10的工作原理为：光敏探测器13实时监测微型发光二极管12的光强，当光敏探测器13监测到微型发光二极管12的光强不足时，光敏探测器13将反馈信号发送给微控制器14，微控制器14通过基板11向光强不足微型发光二极管12输入电信号，从而对光强不足的微型发光二极管12进行补偿。
以上对本申请实施例提供的灯源组件10及显示面板100进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种灯源组件，其中，包括：
    基板，具有相对设置的第一面和第二面；
    微型发光二极管，设置在所述第一面且与所述基板电性连接；
    光敏探测器，位于所述第一面，所述光敏探测器用于检测所微型发光二极管的光强以得到反馈信号；
    微控制器，与所述基板以及所述光敏探测器电性连接，所述微控制接收所述反馈信号以通过所述基板控制所述微型发光二极管。
  2. 根据权利要求1所述的灯源组件，其中，所述灯源组件还包括盖板，所述盖板位于所述第一面且远离所述基板。
  3. 根据权利要求2所述的灯源组件，其中，所述光敏探测器固定在所述盖板上，所述光敏探测器在所述基板的正投影与所述微控制器交叠，所述灯源组件还包括连接线，所述连接线一端与所述光敏探测器连接，另一端与所述微控制器连接，所述连接线与微控制器连接的位置位于所述光敏探测器与所述微控制交叠的部分。
  4. 根据权利要求2所述的灯源组件，其中，所述灯源组件还包括反射层，所述反射层位于所述第一面，所述反射层用于将所述微型发光二极管的光反射到所述光敏探测器。
  5. 根据权利要求4所述的灯源组件，其中，所述反射层固定在所述盖板内部。
  6. 根据权利要求5所述的灯源组件，其中，所述光敏探测器固定在所述第一面，所述光敏探测器在所述盖板的正投影完全覆盖在所述反射层内。
  7. 根据权利要求6所述的灯源组件，其中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
  8. 根据权利要求7所述的灯源组件，其中，所述基板包括晶体管，所述晶体管与所述芯片电性连接。
  9. 根据权利要求7所述的灯源组件，其中，所述微控制器集成在所述第一面且与所述晶体管电性连接。
  10. 根据权利要求1所述的灯源组件，其中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
  11. 一种显示面板，其中，包括灯源组件，所述灯源组件包括基板、微型发光二极管、光敏探测器以及微控制器，所述基板具有相对设置的第一面和第二面，微型发光二极管，设置在所述第一面且与所述基板电性连接，所述光敏探测器位于所述第一面，所述光敏探测器用于检测所微型发光二极管的光强以得到反馈信号，所述微控制器与所述基板以及所述光敏探测器电性连接，所述微控制接收所述反馈信号以通过所述基板控制所述微型发光二极管。
  12. 根据权利要求11所述的显示面板，其中，所述灯源组件还包括盖板，所述盖板位于所述第一面且远离所述基板。
  13. 根据权利要求12所述的显示面板，其中，所述光敏探测器固定在所述盖板上，所述光敏探测器在所述基板的正投影与所述微控制器交叠，所述灯源组件还包括连接线，所述连接线一端与所述光敏探测器连接，另一端与所述微控制器连接，所述连接线与微控制器连接的位置位于所述光敏探测器与所述微控制交叠的部分。
  14. 根据权利要求12所述的显示面板，其中，所述灯源组件还包括反射层，所述反射层位于所述第一面，所述反射层用于将所述微型发光二极管的光反射到所述光敏探测器。
  15. 根据权利要求14所述的显示面板，其中，所述反射层固定在所述盖板内部。
  16. 根据权利要求15所述的显示面板，其中，所述光敏探测器固定在所述第一面，所述光敏探测器在所述盖板的正投影完全覆盖在所述反射层内。
  17. 根据权利要求6所述的显示面板，其中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
  18. 根据权利要求17所述的显示面板，其中，所述基板包括晶体管，所述晶体管与所述芯片电性连接。
  19. 根据权利要求17所述的显示面板，其中，所述微控制器集成在所述第一面且与所述晶体管电性连接。
  20. 根据权利要求11所述的显示面板，其中，所述微型发光二极管包括芯片和显示像素，所述芯片控制所述显示像素发光，所述基板与所述芯片电性连接。
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