WO2021007981A1 - 柔性电路板、超声波指纹模组及电子设备 - Google Patents

柔性电路板、超声波指纹模组及电子设备 Download PDF

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Publication number
WO2021007981A1
WO2021007981A1 PCT/CN2019/112610 CN2019112610W WO2021007981A1 WO 2021007981 A1 WO2021007981 A1 WO 2021007981A1 CN 2019112610 W CN2019112610 W CN 2019112610W WO 2021007981 A1 WO2021007981 A1 WO 2021007981A1
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WO
WIPO (PCT)
Prior art keywords
pin
circuit board
electrode layer
flexible circuit
fingerprint module
Prior art date
Application number
PCT/CN2019/112610
Other languages
English (en)
French (fr)
Inventor
刘宣宣
Original Assignee
南昌欧菲生物识别技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南昌欧菲生物识别技术有限公司 filed Critical 南昌欧菲生物识别技术有限公司
Publication of WO2021007981A1 publication Critical patent/WO2021007981A1/zh
Priority to US17/205,327 priority Critical patent/US20210209325A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to a flexible circuit board, an ultrasonic fingerprint module and electronic equipment.
  • the ultrasonic fingerprint module can accurately collect the user's fingerprint even when the finger is dirty or oily, electronic devices with the ultrasonic fingerprint module are becoming more and more popular among users.
  • anisotropic conductive film (ACF) is first applied to the substrate, and then a part of the flexible circuit board is bound to the substrate with anisotropic conductive film. It is electrically connected to the pixel electrode. During the binding process, the anisotropic conductive adhesive will overflow to the electrode layer and solidify. At this time, another part of the flexible circuit board can be bound to the electrode layer through the cured anisotropic conductive adhesive.
  • ACF anisotropic conductive film
  • the inventor further studied and analyzed that during the second binding process, the anisotropic conductive adhesive accumulated between the flexible circuit board and the electrode layer could not be compacted by the indenter, making the flexible circuit board and the second There will be a gap between the two electrode layers, so that external air or water vapor easily enters the gap and affects the electrical connection between the flexible circuit board and the electrode layer, thereby affecting the electrical connection reliability of the ultrasonic fingerprint module.
  • the application provides a flexible circuit board, an ultrasonic fingerprint module, and electronic equipment.
  • the flexible circuit board is applied to the ultrasonic fingerprint module and the electronic device, the ultrasonic fingerprint module and the electronic device have better electrical connection reliability.
  • the flexible circuit board provided in this embodiment includes a substrate, a first pin and a plurality of second pins.
  • the substrate includes a first connection area and a second connection area connected to the first connection area.
  • the first pin is provided in the first connection area
  • the plurality of second pins are provided in the second connection area
  • the first pin has a first connection surface facing away from the substrate
  • the An accommodation space is provided in the first pin, and an opening of the accommodation space is located on the first connection surface.
  • part of the anisotropic conductive adhesive can be filled into the electrode layer when the first pin is bound to the electrode layer.
  • the thickness of the anisotropic conductive adhesive formed between the first connection surface and the electrode layer is relatively thin, so as to ensure that the conductive particles in the anisotropic conductive adhesive can be electrically connected to the first at the same time.
  • a pin and the electrode layer further ensure the electrical connection stability of the first pin and the first part.
  • the thickness of the anisotropic conductive adhesive between the first connection surface and the electrode layer is relatively thin, no gap will be generated between the flexible circuit board and the electrode layer, thereby ensuring external moisture Or air will not enter the gap.
  • the contact area between the first pin and the first part is increased, so as to significantly increase the electrical power between the first pin and the first part. Connection stability.
  • the first pin includes a second connection surface.
  • the second connecting surface is arranged opposite to the first connecting surface.
  • the accommodating space penetrates the second connecting surface. At this time, the volume of the accommodating space is relatively large, so that during the process of binding the first pin to the electrode layer, the accommodating space can accommodate more anisotropic conductive adhesive, thereby reducing the equipment.
  • the thickness of the anisotropic conductive adhesive between the first connection surface and the electrode layer to ensure that the conductive particles in the anisotropic conductive adhesive can be electrically connected to the first pin and the Electrode layer.
  • the first pin includes a peripheral side surface.
  • the peripheral side surface is connected between the first connection surface and the second connection surface.
  • the accommodating space penetrates at least part of the peripheral side, that is, the peripheral side has an opening for the accommodating space.
  • the side wall of the groove of the containing space is flat.
  • the side wall of the groove and the first connecting surface are arranged at an included angle.
  • the included angle is greater than 90°.
  • the surface area of the side wall of the groove of the containing space is larger, so that on the one hand, the flexible circuit board
  • the accommodating space can accommodate more anisotropic conductive glue, thereby reducing the anisotropy between the first connection surface and the electrode layer.
  • the thickness of the conductive adhesive on the other hand, the contact area between the first pin and the first portion is increased to significantly improve the electrical connection stability of the first pin and the first portion.
  • the process difficulty of preparing the receiving space on the first pin can be reduced.
  • the side wall of the groove of the containing space is curved, and the side wall of the groove is recessed in a direction away from the center of the containing space.
  • the surface area of the sidewall of the groove of the containing space is relatively large, so on the one hand, when the first pin of the flexible circuit board is bound to the electrode layer, the containing space can contain more Square conductive adhesive, thereby reducing the thickness of the anisotropic conductive adhesive provided between the first connection surface and the electrode layer; on the other hand, increasing the contact area between the first pin and the first part , Thereby significantly improving the electrical connection stability of the first pin and the first part.
  • the number of the accommodation spaces is multiple, and the multiple accommodation spaces are arranged in an array.
  • the total volume of the accommodating space is larger, that is, the accommodating space can accommodate more anisotropic conductive glue, thereby reducing the anisotropic conductivity between the first connection surface and the electrode layer The thickness of the glue.
  • the contact area between the first pin and the first portion can also be significantly increased, thereby significantly improving the electrical connection stability of the first pin and the first portion.
  • An ultrasonic fingerprint module includes a substrate, a plurality of pixel electrodes, piezoelectric elements, electrode layers, anisotropic conductive glue, a fingerprint chip, and any of the above-mentioned flexible circuit boards.
  • the substrate has a first surface; the plurality of pixel electrodes are arranged on the first surface; the piezoelectric element is arranged on the surface of the plurality of pixel electrodes away from the first surface, and covers the plurality of pixel electrodes.
  • Pixel electrode; at least part of the electrode layer is provided on the surface of the piezoelectric element away from the first surface.
  • the anisotropic conductive adhesive includes a first part and a second part connected to the first part, the first part is disposed on the electrode layer, and a part of the second part is disposed on the first surface.
  • the first connection surface of the flexible circuit board is attached to the first part, and the accommodating space is filled with part of the first part, and the first pin is electrically connected to the electrode layer through the first part,
  • the plurality of second pins are provided in the second part and are electrically connected to the plurality of pixel electrodes through the second part.
  • the fingerprint chip is mounted on the flexible circuit board, and the fingerprint chip is electrically connected between the first pin and the second pin.
  • the first pin provided with the accommodation space is bound to the first part, so that part of the anisotropic conductive adhesive is disposed in the accommodation space.
  • the thickness of the anisotropic conductive adhesive formed between the first connection surface and the electrode layer is relatively thin, so as to ensure that the conductive particles in the anisotropic conductive adhesive can be electrically connected to the first at the same time.
  • a pin and the electrode layer further ensure the electrical connection stability of the first pin and the first part, that is, ensure that the ultrasonic fingerprint module has better electrical connection stability.
  • the electrode layer includes a body portion and an extension portion connected to the body portion, and the thickness of the body portion in the first direction is greater than the thickness of the extension portion in the first direction.
  • One direction is the direction in which the substrate faces the piezoelectric element, and the first part is provided at the extension portion.
  • the first pin of the flexible circuit board is electrically connected to the extension portion, so that the flexible circuit board and the electrode layer have an overlap in the thickness direction of the ultrasonic fingerprint module Therefore, the thickness of the ultrasonic fingerprint module is reduced, which is beneficial to realize a thin configuration of the ultrasonic module.
  • the thickness of the body portion in the first direction is greater than the thickness of the extension portion in the first direction, when the first portion is provided in the extension portion, the conductive particles of the anisotropic conductive adhesive can be reduced. The probability of being trapped in the first part so that the conductive particles are not easily crushed by the indenter.
  • the thickness of the first portion in the first direction is greater than or equal to the thickness of the extension portion in the first direction.
  • the first pin is bound to the first part.
  • the conductive particles of the anisotropic conductive adhesive will not fall into the first part so that the conductive particles are not easily crushed by the indenter, thereby ensuring the electrical connection stability of the flexible circuit board and the electrode layer , Thereby ensuring that the ultrasonic fingerprint module has better connection reliability.
  • the electrode layer includes a main body portion, a conductive portion, and a connecting portion connected between the main body portion and the conductive portion, and the main body portion is provided on the piezoelectric element away from the first On the surface of the surface, the connecting portion is provided on the side surface of the piezoelectric element, the conductive portion is provided on the first surface, and the conductive portion is provided with the first portion.
  • the first pin of the flexible circuit board is electrically connected to the conductive part, so that the flexible circuit board, the electrode layer and the piezoelectric element are in the ultrasonic fingerprint module.
  • the flexible circuit board, the electrode layer and the piezoelectric element are in the ultrasonic fingerprint module.
  • the thickness of the first portion in the first direction is greater than or equal to the thickness of the conductive portion in the first direction.
  • the first direction is the direction in which the substrate faces the piezoelectric element.
  • the first pin is bound to the conductive part.
  • the conductive particles of the anisotropic conductive adhesive will not fall into the conductive part so that the conductive particles are not easily crushed by the indenter, thereby ensuring the electrical connection stability of the flexible circuit board and the electrode layer, This ensures that the ultrasonic fingerprint module has better connection reliability.
  • the material of the electrode layer is silver.
  • the price of silver is lower and the conductivity is better, when the material of the electrode layer is set to silver, the stability of the connection between the electrode layer and the flexible circuit board can be ensured, but also It can ensure that the input cost of the ultrasonic fingerprint is low.
  • the ultrasonic fingerprint module includes a protective layer covering the surface of the electrode layer away from the piezoelectric element.
  • a protective layer is provided on the surface of the electrode layer away from the piezoelectric element, and the protective layer covers the surface of the electrode layer away from the piezoelectric element, thereby effectively protecting the
  • the electrode layer can prevent the electrode layer from being damaged due to collision with other components, and can also prevent the electrode layer from oxidizing, thereby ensuring that the electrode layer has reliable connectivity with the piezoelectric element.
  • the electronic device provided by the embodiment of the present application includes a housing, a display screen, and the aforementioned ultrasonic fingerprint module.
  • the display screen is mounted on the housing, and the display screen and the housing enclose a device accommodating cavity.
  • the ultrasonic fingerprint module is arranged in the device containing cavity, and the top surface of the connection part of the ultrasonic fingerprint module faces the display screen.
  • the ultrasonic fingerprint module by placing the above-mentioned ultrasonic fingerprint module in the device accommodating cavity, when the user’s finger is placed in the fingerprint collection area of the display screen, the ultrasonic fingerprint module can accurately collect the user Fingerprints.
  • the ultrasonic fingerprint module has better electrical connection reliability, the electronic device also has better reliability in the process of collecting user fingerprints.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
  • Fig. 2 is a schematic partial cross-sectional view of the electronic device shown in Fig. 1 at the line M-M;
  • FIG. 3 is a schematic cross-sectional view of an embodiment of the ultrasonic fingerprint module of the electronic device shown in FIG. 2;
  • FIG. 4 is a schematic diagram of the structure of the flexible circuit board of the ultrasonic fingerprint module shown in FIG. 3;
  • FIG. 5 is an enlarged schematic diagram of an embodiment of the flexible circuit board shown in FIG. 4 at A;
  • Fig. 6 is an enlarged schematic diagram of the ultrasonic fingerprint module shown in Fig. 3 at B;
  • FIG. 7 is an enlarged schematic diagram of the ultrasonic fingerprint module shown in FIG. 3 at C;
  • FIG. 8 is an enlarged schematic diagram of another embodiment of the flexible circuit board shown in FIG. 4 at A;
  • FIG. 9 is a schematic cross-sectional view of another embodiment of the ultrasonic fingerprint module of the electronic device shown in FIG. 2.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided in this embodiment.
  • the electronic device 100 may include smart devices such as a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, a vehicle-mounted device, an inbound gate or a wearable device.
  • the electronic device 100 of the embodiment shown in FIG. 1 is illustrated by taking a mobile phone as an example.
  • the electronic device 100 includes a housing 10, a display screen 20 and an ultrasonic fingerprint module 30.
  • the display screen 20 is used to display electronic images.
  • the display screen 20 may be, but is not limited to, a liquid crystal display or an OLED (Organic Light-Emitting Diode, organic light emitting diode) display.
  • the display screen 20 may be a rigid screen or a flexible screen.
  • the display screen 20 can also be used as a touch screen, that is, the user can operate the application software in the display screen 20 by touching the display screen 20.
  • the display screen 20 is installed on the housing 10.
  • the display screen 20 is usually a plate-shaped structure, and the housing 10 is usually a receiving structure with an open upper end.
  • the display screen 20 and the housing 10 enclose a device accommodating cavity 11 for accommodating related parts of the mobile phone, such as a receiver, a speaker, a camera, or a battery.
  • the peripheral side of the display screen 20 abuts against the inner side of the corresponding opening position of the housing 10, and is connected to each other by glue.
  • the housing 10 can effectively protect the display screen 20.
  • the ultrasonic fingerprint module 30 is disposed in the device containing cavity 11.
  • the dashed line in FIG. 1 roughly illustrates the ultrasonic fingerprint module 30.
  • the size and position of the ultrasonic fingerprint module 30 are not limited to those shown in FIG. 1.
  • the ultrasonic fingerprint module 30 can cover the display part of the display screen 20 or the ultrasonic fingerprint module 30 can also be a part of the display screen 20.
  • the ultrasonic fingerprint module 30 is adhered to the inner surface of the display screen 20.
  • the ultrasonic fingerprint module 30 can collect the fingerprint at the position of the display part of the display screen 20.
  • the ultrasonic fingerprint module 30 emits ultrasonic waves, which pass through the display screen 20 and are projected onto the user's fingers.
  • the ultrasonic wave is reflected at the user's fingerprint, returns to the ultrasonic fingerprint module 30, and is received by the ultrasonic fingerprint module 30.
  • the ultrasonic fingerprint module 30 converts the received ultrasonic waves into electrical signals to collect user fingerprints.
  • the ultrasonic fingerprint module 30 collects the user's fingerprint according to the converted different electrical signals.
  • the ultrasonic fingerprint module 30 can compare the collected fingerprints with the standard fingerprints stored in the database. It is understandable that the standard fingerprint refers to the correct fingerprint that the user himself has stored in the database in advance.
  • a controller (not shown) is provided in the device containing cavity 11. The controller may be the central processing unit of the electronic device 100. The controller is electrically connected to the ultrasonic fingerprint module 30. At this time, the ultrasonic fingerprint module 30 can send the comparison result to the controller. The controller controls whether the display screen 20 is activated according to the comparison result. For example, when the fingerprint collected by the ultrasonic fingerprint module 30 matches the standard fingerprint, the ultrasonic fingerprint module 30 sends the comparison result to the controller. The controller controls the display screen 20 to start.
  • the ultrasonic fingerprint module 30 When the fingerprint collected by the ultrasonic fingerprint module 30 does not match the standard fingerprint, the ultrasonic fingerprint module 30 sends the comparison result to the controller.
  • the controller control display screen 20 cannot be activated.
  • the fingerprint collected by the ultrasonic fingerprint module 30 is the characteristic information of the user's fingerprint.
  • the feature information of the user's fingerprint is collected by the ultrasonic fingerprint module 30, and the collected feature information of the fingerprint is compared with the standard feature information in the database.
  • the ultrasonic fingerprint module 30 includes a substrate 31, a plurality of pixel electrodes 32, a piezoelectric element 33, an electrode layer 34, an anisotropic conductive adhesive 35, a fingerprint chip 36, and a flexible circuit Board 37.
  • the substrate 31 has a first surface 311.
  • the material of the substrate 31 can be, but is not limited to, glass or polyimide film.
  • the shape of the substrate 31 matches the shape of the display screen 20.
  • the substrate 31 made of glass or polyimide film has the advantages of lower cost and better light transmittance. Therefore, the ultrasonic sensor 30 made of the substrate 31 also has the advantages of lower cost and better light transmittance. When the ultrasonic sensor 30 is integrated in the display screen 20, the ultrasonic sensor 30 with better light permeability will not block the display of the display screen 20.
  • a plurality of pixel electrodes 32 are provided on the first surface 311.
  • the pixel electrodes 2 are arranged in an array.
  • the material of the pixel electrode 32 may be, but is not limited to, any one of indium tin oxide (ITO), nano silver wire (Agnanowire), metal mesh, carbon nanotube, and graphene (Graphene). kind.
  • ITO indium tin oxide
  • nano silver wire Agnanowire
  • metal mesh metal mesh
  • carbon nanotube carbon nanotube
  • graphene graphene
  • the piezoelectric element 33 is disposed on the surface of the plurality of pixel electrodes 32 away from the first surface 311 and covers the plurality of pixel electrodes 32. It can be understood that the piezoelectric element 32 is made of piezoelectric material. The piezoelectric element 32 transmits and receives ultrasonic waves through the piezoelectric effect.
  • the piezoelectric material can be, but is not limited to, polyvinylidene fluoride (PVDF). Since polyvinylidene fluoride has good toughness and light transmittance, the piezoelectric element 33 also has good flexibility and light transmittance. At this time, the ultrasonic sensor 30 also has good flexibility and light transmittance.
  • the electrode layer 34 is provided on the surface of the piezoelectric element 33 away from the first surface 311.
  • the electrode layer 34 covers the surface of the piezoelectric element 33 away from the first surface 311.
  • the material of the electrode layer 34 is silver. Because the price of silver is lower and the conductivity is better, when the material of the electrode layer 34 is set to silver, the stability of the connection between the electrode layer 34 and the flexible circuit board 37 can be ensured, and the input cost of the ultrasonic fingerprint can be lower. .
  • the anisotropic conductive adhesive 35 includes a first part 351 and a second part 352 connected to the first part 351.
  • the first part 351 is provided on the electrode layer 34.
  • Part of the second part 352 is provided on the first surface 311.
  • Part of the second part 352 is provided on the side surface of the piezoelectric element 33. It can be understood that the anisotropic conductive adhesive 35 contains conductive particles. When the conductive particles are ruptured under the pressure of the indenter, the conductive particles can electrically connect the two components in the direction of force.
  • the flexible circuit board 37 includes a first connection area 371 and a second connection area 372 connected to the first connection area 371.
  • the first connection area 371 is electrically connected to the electrode layer 34 through the first portion 351.
  • the second connection area 372 is electrically connected to the plurality of pixel electrodes 32 through the second portion 352.
  • the flexible circuit board 37 may be disposed on the side of the substrate 31 away from the pixel electrode 32.
  • the flexible circuit board 37 is provided with a connector so that the ultrasonic sensor is electrically connected to other electronic components through the connector of the flexible circuit board 37.
  • the fingerprint chip 36 is mounted on the flexible circuit board 37.
  • the fingerprint chip 36 can be used to control the voltage on both sides of the piezoelectric element 33.
  • the fingerprint chip 36 can control the electrode layer 34 to connect to a high-frequency voltage and the pixel electrode 32 to be grounded. At this time, when a high-frequency voltage is applied to the piezoelectric element 33, the piezoelectric element 33 generates and emits ultrasonic waves to the outside.
  • the fingerprint chip 36 is also used to receive the piezoelectric signal generated by the piezoelectric element 33 and form an ultrasonic image of the object to be detected according to the received electrical signal.
  • a plurality of pixel electrodes 32, piezoelectric elements 33, electrode layers 34, anisotropic conductive adhesive 35, flexible circuit board 37 and fingerprint chip 36 constitute a closed loop of the ultrasonic fingerprint module.
  • the specific method for the ultrasonic fingerprint module 30 to collect fingerprints is as follows:
  • the fingerprint chip 36 When the user places a finger on the display screen 20, the fingerprint chip 36 outputs an electrical signal.
  • the electrical signal is transmitted to the piezoelectric element 33 through the electrode layer 34 and the plurality of pixel electrodes 32.
  • the piezoelectric element 33 generates ultrasonic waves when an electric signal is applied. After the ultrasonic wave penetrates the display screen 20, it propagates to the user's finger and is reflected back by the fingerprint of the finger. At this time, the piezoelectric element 33 converts the received ultrasonic waves into electrical signals, and transmits them to the fingerprint chip 36 through the electrode layer 34 and the plurality of pixel electrodes 32. Finally, after the fingerprint chip 36 receives the electrical signal, it identifies the user's fingerprint according to the received electrical signal.
  • the location of the fingerprint ridge and the fingerprint valley can be distinguished.
  • the user's fingerprint can be collected.
  • the ultrasonic fingerprint module 30 includes a protective layer 38.
  • the protective layer 38 can be, but is not limited to, a transparent optical glue.
  • the protective layer 38 is provided on the surface of the electrode layer 34 away from the piezoelectric element 33, and covers the surface of the electrode layer 34 away from the piezoelectric element 33.
  • the protective layer 38 can also be used to adhere to the display screen 20 to achieve stable fixation of the ultrasonic fingerprint module 30.
  • the electrode layer 34 can be effectively protected, that is, the electrode layer 34 can be effectively protected.
  • the layer 34 is damaged due to collision with other components, and oxidation of the electrode layer 34 can be avoided, thereby ensuring reliable connectivity between the electrode layer 34 and the piezoelectric element 33.
  • the electrode layer 34 includes a body portion 341 and an extension portion 342 connected to the body portion 341.
  • the thickness of the body portion 341 in the first direction is greater than the thickness of the extension portion 342 in the first direction.
  • the first direction is the direction in which the substrate 31 faces the piezoelectric element 33.
  • the first part 351 is provided at the extension part 342.
  • the first pin 374 of the flexible circuit board 37 is electrically connected to the extension 342, so that the flexible circuit board 37 and the electrode layer 34 have an overlap in the thickness direction of the ultrasonic fingerprint module 30, thereby Reducing the thickness of the ultrasonic fingerprint module 30 facilitates the thinning of the ultrasonic module.
  • the extension portion 342 can reduce the conductive particles of the anisotropic conductive adhesive 35. The probability that the conductive particles are not easily crushed by the indenter due to being trapped in the first portion 351.
  • the thickness of the first portion 351 in the first direction is greater than or equal to the thickness of the extension portion 342 in the first direction.
  • the anisotropic conductivity The conductive particles of the glue 35 will not be trapped in the first part 351 so that the conductive particles are not easily crushed by the indenter, thereby ensuring the electrical connection stability of the flexible circuit board 37 and the electrode layer 34, thereby ensuring that the ultrasonic fingerprint module 30 has a relatively high Good connection reliability.
  • the flexible circuit board 37 includes a substrate 373, a first pin 374 and a plurality of second pins 375.
  • the material of the substrate 373 may be, but not limited to, polymethyl methacrylate (PMMA).
  • the first pin 374 is provided in the first connection area 371.
  • the first pin 374 has a first connecting surface 3741 facing away from the base material 373.
  • the first connecting surface 3741 is attached to the first part 351.
  • a receiving space 3742 is provided in the first pin 374.
  • the opening of the receiving space 3742 is located on the first connecting surface 3741.
  • the receiving space 3742 is filled with a part of the first part 351.
  • the first pin 374 is electrically connected to the electrode layer 34 through the first portion 351. It can be understood that the first pin 374 is electrically connected to the electrode layer 34 through the broken conductive particles.
  • a plurality of second pins 375 are provided in the second connection area 372.
  • a plurality of second pins 375 are provided in the second part 352 and are electrically connected to the plurality of pixel electrodes 32 through the second part 352.
  • a plurality of metal pins 3111 are provided on the first surface 311. The plurality of metal pins 3111 are electrically connected to the plurality of pixel electrodes 32. At this time, the plurality of second pins 375 and the plurality of metal pins 3111 are electrically connected through the second part 352 in a one-to-one correspondence. Because the anisotropic conductive adhesive 35 can electrically connect the two components in the direction of force, the anisotropic conductive adhesive 35 can prevent the multiple second pins 375 or the multiple metal pins 3111 from short-circuiting each other .
  • the fingerprint chip 36 is electrically connected between the first pin 374 and the second pin 375, that is, the fingerprint chip 36 passes through the first pin 374 and the second lead
  • the pin 375 applies an electrical signal to the piezoelectric element 33 or receives the electrical signal of the piezoelectric element 33 through the first pin 374 and the second pin 375.
  • part of the anisotropic conductive adhesive 35 can be filled into the receiving space 3742 during the process of binding the first pin 374 to the electrode layer 34 .
  • the thickness of the anisotropic conductive adhesive 35 formed between the first connection surface 3741 and the electrode layer 34 is relatively thin, so as to ensure that the conductive particles in the anisotropic conductive adhesive 35 can be electrically connected to the first pins 374 at the same time.
  • the electrode layer 34 With the electrode layer 34, the stability of the electrical connection between the first pin 374 and the first portion 351 is ensured.
  • the thickness of the anisotropic conductive adhesive 35 between the first connection surface 3741 and the electrode layer 34 is relatively thin, there will be no gap between the flexible circuit board 37 and the electrode layer 34, so as to ensure that the outside water vapor or air does not Will enter the gap.
  • the contact area between the first pin 374 and the first portion 351 is increased, so as to significantly improve the electrical connection stability of the first pin 374 and the first portion 351.
  • the first pin 374 includes a second connection surface 3743.
  • the second connection surface 3743 is opposite to the first connection surface 3741.
  • the accommodating space 3742 penetrates the second connecting surface 3743.
  • the volume of the accommodating space 3742 is relatively large, so that when the first pin 374 is bound to the electrode layer 34, the accommodating space 3742 can accommodate more anisotropic conductive adhesive 35, thereby reducing the size of the The thickness of the anisotropic conductive adhesive 35 between the connecting surface 3741 and the electrode layer 34 is to ensure that the conductive particles in the anisotropic conductive adhesive 35 can be electrically connected to the first pin 374 and the electrode layer 34 at the same time.
  • the first pin 374 includes a peripheral side surface 3744.
  • the peripheral side surface 3744 is connected between the first connection surface 3741 and the second connection surface 3743.
  • the accommodating space 3742 penetrates at least part of the peripheral side 3744, that is, the peripheral side 3744 has an opening for the accommodating space 3742.
  • a part of the anisotropic conductive adhesive 35 can flow out in a direction away from the first pin 374 through the opening on the peripheral side surface 3744, thereby further reducing the The thickness of the anisotropic conductive adhesive 35 between a connecting surface 3741 and the electrode layer 34.
  • the groove side wall of the containing space 3742 is flat.
  • the groove sidewall and the first connecting surface 3741 are arranged at an included angle.
  • the included angle is greater than 90°.
  • the included angle is greater than 90°, so that the surface area of the side wall of the groove of the containing space 3742 is larger, so that the first pin 374 is bound to
  • the accommodating space 3742 can accommodate more anisotropic conductive adhesive 35, thereby reducing the thickness of the anisotropic conductive adhesive 35 provided between the first connection surface 3741 and the electrode layer 34; ,
  • the contact area between the first pin 374 and the first portion 351 is increased to significantly improve the electrical connection stability of the first pin 374 and the first portion 351.
  • the process difficulty of preparing the receiving space 3742 in the first pin 374 can be reduced.
  • the side wall of the groove of the receiving space 3742 is curved, and the side wall of the groove is recessed in a direction away from the center of the receiving space 3742.
  • the surface area of the sidewall of the groove of the receiving space 3742 is relatively large, so that on the one hand, when the first pin 374 of the flexible circuit board 37 is bound to the electrode layer 34, the receiving space 3742 can accommodate more anisotropic conductive materials.
  • the adhesive 35 further reduces the thickness of the anisotropic conductive adhesive 35 disposed between the first connection surface 3741 and the electrode layer 34; on the other hand, the contact area between the first pin 374 and the first portion 351 is increased, thereby significantly increasing The electrical connection between the first pin 374 and the first part 351 is stable.
  • the number of the accommodating space 3742 is multiple.
  • the multiple accommodation spaces 3742 are arranged in an array.
  • the total volume of the accommodating space 3742 is larger, that is, the accommodating space 3742 can accommodate more anisotropic conductive adhesive 35, thereby reducing the amount of anisotropic conductive adhesive 35 between the first connection surface 3741 and the electrode layer 34. thickness.
  • the contact area between the first pin 374 and the first portion 351 can also be significantly increased, thereby significantly improving the electrical connection stability of the first pin 374 and the first portion 351.
  • the electrode layer 34 includes a main body portion 343, a conductive portion 344, and a connecting portion 345 connected between the main body portion 343 and the conductive portion 344.
  • the main body 343 is disposed on the surface of the piezoelectric element 33 away from the first surface 311.
  • the connecting portion 345 is provided on the side surface of the piezoelectric element 33, the conductive portion 344 is provided on the first surface 311, and the conductive portion 344 is provided with a first portion 351.
  • the conductive portion 344 is provided on the first surface 311, and the first pin 374 of the flexible circuit board 37 is electrically connected to the conductive portion 344, so that the flexible circuit board 37 and the electrode layer 34 and piezoelectric
  • the element 33 has an overlapping part in the thickness direction of the ultrasonic fingerprint module 30, thereby reducing the thickness of the ultrasonic fingerprint module 30, which is beneficial to the realization of a thinner configuration of the ultrasonic fingerprint module.
  • the thickness of the first portion 351 in the first direction is greater than or equal to the thickness of the conductive portion 344 in the first direction.
  • the first direction is the direction in which the substrate 31 faces the piezoelectric element 33.
  • the thickness of the first portion 351 in the first direction is greater than or equal to the thickness of the conductive portion 344 in the first direction, in the process of binding the first pin 374 to the conductive portion 344, anisotropic conductive
  • the conductive particles of the glue 35 will not fall into the conductive portion 344 so that the conductive particles are not easily crushed by the indenter, thereby ensuring the stability of the electrical connection between the flexible circuit board 37 and the electrode layer 34, thereby ensuring that the ultrasonic fingerprint module 30 has a relatively high Good connection reliability.

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Abstract

本申请公开了一种柔性电路板、超声波指纹模组及电子设备。所述柔性电路板包括基材、一个第一引脚及多个第二引脚，所述基材包括第一连接区及连接所述第一连接区的第二连接区，所述第一引脚设于所述第一连接区，所述多个第二引脚设于所述第二连接区，所述第一引脚具有背离所述基材的第一连接面，所述第一引脚中设有容纳空间，所述容纳空间的开口位于所述第一连接面。当将具有所述柔性电路板的超声波指纹模组应用于电子设备时，电子设备具有更佳的电连接稳定性。

Description

柔性电路板、超声波指纹模组及电子设备
本申请要求2019年7月17日递交的实用新型名称为“柔性电路板、超声波指纹模组及电子设备”的申请号201921126123.4的在先申请优先权。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种柔性电路板、超声波指纹模组及电子设备。
背景技术
由于超声波指纹模组在手指具有污垢或者油渍的条件下也能够准确地采集用户的指纹，使得具有超声波指纹模组的电子设备越来越受到广大用户的喜爱。
在传统的超声波指纹模组的制备中，先在基板点上异方性导电胶(Anisotropic Conductive Film，ACF)，再将柔性电路板的一部分通过异方性导电胶绑定在基板上，以用于与像素电极电连接。在绑定的过程中，异方性导电胶会溢流至电极层，并发生固化。此时，可通过固化的异方性导电胶将柔性电路板的另一部分绑定于电极层。然而，发明人发现，当前异方性导电胶在第二次绑定后存在连接不可靠的问题。此外，发明人进一步研究分析得出，在第二次绑定的过程中，堆积在柔性电路板与电极层之间的异方性导电胶未能够被压头压实，使得柔性电路板与第二电极层之间会存在间隙，从而外界的空气或者水汽容易进入该间隙而影响柔性电路板与电极层之间的电连接，进而影响超声波指纹模组的电连接可靠性。
发明内容
本申请提供一种柔性电路板、超声波指纹模组及电子设备。当所述柔性电路板应用于所述超声波指纹模组和所述电子设备时，所述超声波指纹模组与所述电子设备具有较佳的电连接可靠性性。
本实施例提供的柔性电路板包括基材、一个第一引脚及多个第二引脚，所 述基材包括第一连接区及连接所述第一连接区的第二连接区，所述第一引脚设于所述第一连接区，所述多个第二引脚设于所述第二连接区，所述第一引脚具有背离所述基材的第一连接面，所述第一引脚中设有容纳空间，所述容纳空间的开口位于所述第一连接面。
在本实施例中，通过在所述第一引脚中设置所述容纳空间，以在所述第一引脚绑定于所述电极层的过程中，部分异方性导电胶能够填充进所述容纳空间内。此时，形成于所述第一连接面与所述电极层之间的异方性导电胶的厚度较薄，从而保证所述异方性导电胶内的导电粒子能够同时电连接于所述第一引脚与所述电极层，进而保证所述第一引脚与所述第一部分的电连接稳定性。
此外，当所述第一连接面与所述电极层之间的异方性导电胶的厚度较薄时，所述柔性电路板与所述电极层之间不会产生间隙，从而保证外界的水汽或者空气不会进入该间隙内。
此外，通过在所述第一引脚中设置容纳空间，从而增加了所述第一引脚与所述第一部分的接触面积，以显著地提高所述第一引脚与所述第一部分的电连接稳定性。
一种实施例中，所述第一引脚包括第二连接面。所述第二连接面与所述第一连接面相背设置。所述容纳空间贯穿所述第二连接面。此时，所述容纳空间的体积较大，从而使得在所述第一引脚绑定于所述电极层的过程中，所述容纳空间能够容纳更多的异方性导电胶，进而降低设于所述第一连接面与所述电极层之间的异方性导电胶的厚度，以保证所述异方性导电胶内的导电粒子能够同时电连接于所述第一引脚与所述电极层。
一种实施例中，所述第一引脚包括周侧面。所述周侧面连接于所述第一连接面与所述第二连接面之间。所述容纳空间贯穿至少部分所述周侧面，也即所述周侧面具有容纳空间的一开口。此时，在所述第一引脚绑定于所述第一部分时，部分所述异方性导电胶能够经位于周侧面的开口向远离所述第一引脚的方向流出，从而进一步地降低设于所述第一连接面与所述电极层之间的异方性导电胶的厚度。
一种实施例中，所述容纳空间的槽侧壁为平面。所述槽侧壁与所述第一连接面呈夹角设置。所述夹角大于90°。此时，相较于夹角等于90°，本实施 例的通过设置所述夹角大于90°，以使所述容纳空间的槽侧壁的表面积较大，从而一方面在所述柔性电路板第一引脚绑定于所述电极层的过程中，所述容纳空间能够容纳更多的异方性导电胶，进而降低设于所述第一连接面与所述电极层之间的异方性导电胶的厚度；另一方面，增加所述第一引脚与所述第一部分的接触面积，以显著地提高所述第一引脚与所述第一部分的电连接稳定性。
此外，相较于夹角小于或等于90°，本实施例通过设置所述夹角大于90°，能够降低在第一引脚制备容纳空间的工艺困难度。
一种实施例中，所述容纳空间的槽侧壁为弧面，且所述槽侧壁朝远离所述容纳空间的中心的方向凹陷。此时，所述容纳空间的槽侧壁的表面积较大，从而一方面在所述柔性电路板第一引脚绑定于所述电极层的过程中，所述容纳空间能够容纳更多的异方性导电胶，进而降低设于所述第一连接面与所述电极层之间的异方性导电胶的厚度；另一方面，增加所述第一引脚与所述第一部分的接触面积，从而显著地提高所述第一引脚与所述第一部分的电连接稳定性。
一种实施例中，所述容纳空间的数量为多个，所述多个容纳空间阵列排布。此时，所述容纳空间的总体积较大，也即所述容纳空间能够容纳更多的异方性导电胶，从而降低所述第一连接面与所述电极层之间的异方性导电胶的厚度。此外，所述第一引脚与所述第一部分的接触面积也能够显著地增加，从而显著地提高所述第一引脚与所述第一部分的电连接稳定性。
本实施例提供的一种超声波指纹模组包括基板、多个像素电极、压电元件、电极层、异方性导电胶、指纹芯片及上述任一种柔性电路板。所述基板具有第一面；所述多个像素电极设于所述第一面；所述压电元件设于所述多个像素电极背离所述第一面的表面，且覆盖所述多个像素电极；所述电极层的至少部分设于所述压电元件背离所述第一面的表面。所述异方性导电胶包括第一部分及连接于所述第一部分的第二部分，所述第一部分设于所述电极层，部分所述第二部分设于所述第一面。所述柔性电路板的第一连接面贴合于所述第一部分，且所述容纳空间填充有部分所述第一部分，所述第一引脚通过所述第一部分电连接于所述电极层，所述多个第二引脚设于所述第二部分，且通过所述第二部分电连接于所述多个像素电极。所述指纹芯片安装于所述柔性电路板，且所述指纹芯片电连接于所述第一引脚与所述第二引脚之间。
在本实施例中，通过将设有容纳空间的所述第一引脚绑定于所述第一部分，以使部分所述异方性导电胶设于所述容纳空间内。此时，形成于所述第一连接面与所述电极层之间的异方性导电胶的厚度较薄，从而保证所述异方性导电胶内的导电粒子能够同时电连接于所述第一引脚与所述电极层，进而保证所述第一引脚与所述第一部分的电连接稳定性，也即保证所述超声波指纹模组具有较佳的电连接稳定性。
一种实施例中，所述电极层包括本体部及连接于所述本体部的延伸部，所述本体部在第一方向的厚度大于所述延伸部在第一方向上的厚度，所述第一方向为所述基板朝向所述压电元件的方向，所述第一部分设于所述延伸部。
在本实施例中，通过将所述柔性电路板的第一引脚电连接于所述延伸部，从而使得所述柔性电路板与所述电极层在超声波指纹模组的厚度方向上具有重叠部分，从而减小所述超声波指纹模组的厚度，有利于所述超声波模组实现薄形化设置。
此外，因为所述本体部在第一方向的厚度大于所述延伸部在第一方向上的厚度，所以当所述第一部分设于所述延伸部，可以降低异方性导电胶的导电粒子因陷入所述第一部分内而使得导电粒子不容易被压头压破的概率。
一种实施例中，所述第一部分在所述第一方向的厚度大于或等于所述延伸部在所述第一方向的厚度。
可以理解的是，因为所述第一部分在所述第一方向的厚度大于或等于所述延伸部在所述第一方向的厚度，所以在将所述第一引脚绑定于所述第一部分的过程中，异方性导电胶的导电粒子不会因陷入所述第一部分内而使得导电粒子不容易被压头压破，从而保证所述柔性电路板与所述电极层的电连接稳定性，进而保证所述超声波指纹模组具有较佳的连接可靠性。
一种实施例中，所述电极层包括主体部、导电部及连接于所述主体部与所述导电部之间的连接部，所述主体部设于所述压电元件背离所述第一面的表面，所述连接部设于所述压电元件的侧面，所述导电部设于所述第一面，所述导电部设有所述第一部分。
在本实施例中，通过将所述柔性电路板的第一引脚电连接于所述导电部，从而使得所述柔性电路板与所述电极层及所述压电元件在超声波指纹模组的 厚度方向上具有重叠部分，从而减小所述超声波指纹模组的厚度，有利于所述超声波模组实现薄形化设置。
一种实施例中，所述第一部分在所述第一方向的厚度大于或等于所述导电部在所述第一方向的厚度。所述第一方向为所述基板朝向所述压电元件的方向。
可以理解的是，因为所述第一部分在所述第一方向的厚度大于或等于所述导电部在所述第一方向的厚度，所以在将所述第一引脚绑定于所述导电部的过程中，异方性导电胶的导电粒子不会因陷入所述导电部内而使得导电粒子不容易被压头压破，从而保证所述柔性电路板与所述电极层的电连接稳定性，进而保证所述超声波指纹模组具有较佳的连接可靠性。
可选的，所述电极层的材质为银。
在本实施例中，因为银的价格较低且导电性较佳，所以当将所述电极层的材质设置为银，既可以保证所述电极层与所述柔性电路板的连接稳定性，又可以保证所述超声波指纹的投入成本较低。
其中，所述超声波指纹模组包括保护层，所述保护层覆盖所述电极层背离所述压电元件的表面。
在本实施例中，通过在所述电极层背离所述压电元件的表面设置保护层，且所述保护层覆盖所述电极层背离所述压电元件的表面，从而既可以有效地保护所述电极层，也即避免所述电极层因与其他部件发生碰撞而发生损坏，又可以避免所述电极层发生氧化，从而保证所述电极层与所述压电元件具有可靠地连接性。
本申请实施例提供的电子设备包括壳体、显示屏及上述的超声波指纹模组，所述显示屏安装于所述壳体，所述显示屏与所述壳体围设出器件容纳腔，所述超声波指纹模组设于所述器件容纳腔内，且所述超声波指纹模组的连接部的顶面朝向所述显示屏。
在本实施例中，通过将上述的超声波指纹模组设置在所述器件容纳腔内，以当用户的手指放置在所述显示屏的指纹采集区内时，超声波指纹模组能够准确地采集用户的指纹。此外，由于超声波指纹模组具有较佳的电连接可靠性，使得电子设备在采集用户的指纹过程中也具有较佳的可靠性。
附图说明
为更清楚地阐述本申请的构造特征和功效，下面结合附图与具体实施例来对其进行详细说明。
图1是本申请实施例中提供的电子设备的结构示意图；
图2是图1所示的电子设备在M-M线处的部分剖面示意图；
图3是图2所示的电子设备的超声波指纹模组的一种实施方式的剖面示意图；
图4是图3所示的超声波指纹模组的柔性电路板的结构示意图；
图5是图4所示的柔性电路板在A处的一种实施方式的放大示意图；
图6是图3所示的超声波指纹模组在B处的放大示意图；
图7是图3所示的超声波指纹模组在C处的放大示意图；
图8是图4所示的柔性电路板在A处的另一种实施方式的放大示意图；
图9是图2所示的电子设备的超声波指纹模组的另一种实施方式的剖面示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本申请的一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本申请保护的范围。
请参阅图1，图1为本实施例提供的电子设备100的一种结构示意图。电子设备100可以包括平板电脑、手机、照相机、个人计算机、笔记本电脑、车载设备、进站闸机或可穿戴设备等智能设备。图1所示实施例的电子设备100以手机为例进行阐述。
如图1所示，电子设备100包括壳体10、显示屏20及超声波指纹模组30。可以理解的是，显示屏20用于显示电子图像。显示屏20可以为但不仅限于为液晶显示屏或者OLED(Organic Light-Emitting Diode，有机发光二极管)显示屏。此外，显示屏20可以为刚性屏，或者为柔性屏。当然，显示屏20也可以用作触 控屏，也即用户能够通过触摸显示屏20来操作显示屏20内的应用软件。
请参阅图2，并结合附图1所示，显示屏20安装于壳体10。其中，显示屏20通常为板状结构，壳体10通常为上端开口的容纳结构。显示屏20与壳体10围设出器件容纳腔11，用于容纳手机相关部件，例如，听筒、扬声器、摄像头或者电池。可选的，显示屏20的周侧面抵接于壳体10相应开口位置的内侧，并通过胶水彼此连接。此时，壳体10能够有效保护显示屏20。再者，超声波指纹模组30设于器件容纳腔11内。为了能够更好的示意出超声波指纹模组30在电子设备100中的位置，附图1的虚线大致示意出了超声波指纹模组30。但超声波指纹模组30的大小及位置并不局限于附图1的所给出的大小及位置。例如，超声波指纹模组30能够铺满显示屏20的显示部分或者超声波指纹模组30也可以为显示屏20的一部分。
可选的，请再次参阅图2，超声波指纹模组30粘接于显示屏20的内表面。此时，超声波指纹模组30能够采集显示屏20的显示部分的位置处的指纹。具体的，当用户的手指放置在显示屏20中与超声波指纹模组30对应的位置时，超声波指纹模组30发射超声波，超声波穿过显示屏20，投射至用户的手指上。超声波在用户的指纹处发生反射，返回至超声波指纹模组30，并被超声波指纹模组30所接收。超声波指纹模组30根据所接收超声波转换成电信号以采集用户的指纹。可以理解的是，因为手指的指纹具有脊与谷的区别，所以被指纹所反射的超声波不同，也即超声波指纹模组30根据所采集的超声波所形成电信号也是不同的。故而，超声波指纹模组30根据所转换的不同电信号采集到用户的指纹。
可选的，超声波指纹模组30能够将所采集的指纹与数据库中所存储的标准指纹进行比对。可以理解的是，标准指纹指的是用户自身预先在数据库中存储的正确的指纹。器件容纳腔11中设有控制器(图未示)。控制器可以为电子设备100的中央处理器。控制器电连接于超声波指纹模组30。此时，超声波指纹模组30能够将比对结果发送给控制器。控制器根据比对结果控制显示屏20是否启动。例如，当超声波指纹模组30所采集的指纹与标准指纹吻合时，超声波指纹模组30将比对结果发送给控制器。控制器控制显示屏20启动。当超声波指纹模组30所采集的指纹与标准指纹不吻合时，超声波指纹模组30将比对结果发送给控制器。控制器控制显示屏20不能启动。当然，在其他实施例中，超声波指 纹模组30所采集的指纹为用户指纹的特征信息。此时，通过超声波指纹模组30采集用户指纹的特征信息，并将所采集的指纹的特征信息与数据库中的标准特征信息进行比对。
请参阅图3，并结合附图2所示，超声波指纹模组30包括基板31、多个像素电极32、压电元件33、电极层34、异方性导电胶35、指纹芯片36以及柔性电路板37。
其中，基板31具有第一面311。基板31的材质可以为但不仅限于为玻璃或聚酰亚胺薄膜。基板31的形状与显示屏20的形状相适配。玻璃或聚酰亚胺薄膜材质的基板31具有成本较低和透光性较佳等优点，因此，由该基板31制成的超声波传感器30也具有成本较低和透光性较佳等优点。当超声波传感器30集成在显示屏20内时，具有较佳的透光性的超声波传感器30不会遮挡显示屏20的显示。
其中，多个像素电极32设于第一面311。多个像素电极2呈阵列分布。像素电极32的材料可以为但不仅限于为氧化铟锡(Indium tin oxide,ITO)、纳米银线(Agnanowire)、金属网格(metal mesh)、纳米碳管以及石墨烯(Graphene)中的任意一种。此时，像素电极32具有较佳的柔韧性及透光性，也即超声波传感器30具有较佳的韧性及透光性。
其中，压电元件33设于多个像素电极32背离第一面311的表面，且覆盖多个像素电极32。可以理解的是，压电元件32由压电材料构成。压电元件32是通过压电效应发射和接收超声波。压电材料可以为但不仅限于为聚偏氟乙烯(Polyvinylidene fluoride,PVDF)。由于聚偏氟乙烯具有较好的韧性及透光性，使压电元件33也具有较好的柔韧性及透光性，此时，超声波传感器30的柔韧性及透光性也较好。
其中，电极层34的至少部分设于压电元件33背离第一面311的表面。电极层34覆盖压电元件33背离第一面311的表面。可选的，电极层34的材质为银。因为银的价格较低且导电性较佳，所以当将电极层34的材质设置为银，既可以保证电极层34与柔性电路板37的连接稳定性，又可以保证超声波指纹的投入成本较低。
其中，异方性导电胶35包括第一部分351及连接于第一部分351的第二部分 352。第一部分351设于电极层34。部分第二部分352设于第一面311。部分第二部分352设于压电元件33的侧面。可以理解的是，异方性导电胶35内具有导电粒子。当导电粒子在压头挤压下发生破裂时，导电粒子能够将施力方向上的两个部件进行电连接。
其中，柔性电路板37包括第一连接区371及连接第一连接区371的第二连接区372。第一连接区371通过第一部分351电连接于电极层34。第二连接区372通过第二部分352电连接于多个像素电极32。可以理解的是，因为异方性导电胶35在施力方向上能够将两个部件进行电连接，所以异方性导电胶35可以避免多个像素电极32之间相互短路。可选的，柔性电路板37可以设置在基板31的远离像素电极32的一侧上。此外，在其他实施方式中，柔性电路板37设置有连接器以便于超声波传感器通过柔性电路板37的连接器与其他电子元件电连接。
其中，指纹芯片36安装于柔性电路板37。指纹芯片36可以用于控制压电元件33两侧的电压。例如，指纹芯片36可以控制电极层34连通高频电压，以及像素电极32接地。此时，当压电元件33被施加高频电压后，压电元件33产生并向外发射超声波。此外，指纹芯片36还用于接收压电元件33所产生的压电信号并根据所接收的电信号形成待检测物的超声波影像。
由以上可知，多个像素电极32、压电元件33、电极层34、异方性导电胶35、柔性电路板37以及指纹芯片36构成超声波指纹模组的闭合回路。此时，超声波指纹模组30用于采集指纹的具体方式如下：
当用户将手指放置于显示屏20上时，指纹芯片36输出电信号。电信号经电极层34与多个像素电极32传递给压电元件33。压电元件33在电信号的施加下，产生超声波。超声波穿透显示屏20后，传播至用户的手指上，并被手指的指纹反射回来。此时，压电元件33将所接收的超声波转换为电信号，并通过电极层34及多个像素电极32传递给指纹芯片36。最后，当指纹芯片36接收电信号后，根据所接收的电信号识别用户的指纹。可以理解的是，因为皮肤与空气对于声波阻抗的差异，可以区分指纹脊与指纹谷所在的位置。此时，根据所反射回的超声波差异，可以采集到用户的指纹。
可选的，请再次参阅图3，超声波指纹模组30包括保护层38。可以理解的是，保护层38可以为但不仅限于为透明光学胶。保护层38设于电极层34背离压 电元件33的表面，且覆盖电极层34背离压电元件33的表面。保护层38还可以用于粘接于显示屏20上，以实现稳定固定超声波指纹模组30。在本实施例中，通过在电极层34背离压电元件33的表面设置保护层38，且覆盖电极层34背离压电元件33的表面，从而既可以有效地保护电极层34，也即避免电极层34因与其他部件发生碰撞而发生损坏，又可以避免电极层34发生氧化，从而保证电极层34与压电元件33具有可靠地连接性。
请再次参阅图3，电极层34包括本体部341及连接于本体部341的延伸部342。本体部341在第一方向的厚度大于延伸部342在第一方向上的厚度。第一方向为基板31朝向压电元件33的方向。第一部分351设于延伸部342。
在本实施例中，通过将柔性电路板37的第一引脚374电连接于延伸部342，从而使得柔性电路板37与电极层34在超声波指纹模组30的厚度方向上具有重叠部分，从而减小超声波指纹模组30的厚度，有利于超声波模组实现薄形化设置。
此外，因为本体部341在第一方向的厚度大于延伸部342在第一方向上的厚度，所以当第一部分351设于延伸部342时，延伸部342可以降低异方性导电胶35的导电粒子因陷入第一部分351内而使得导电粒子不容易被压头压破的概率。
一种实施例中，第一部分351在第一方向的厚度大于或等于延伸部342在第一方向的厚度。
可以理解的是，因为第一部分351在第一方向的厚度大于或等于延伸部342在第一方向的厚度，所以在将第一引脚374绑定于第一部分351的过程中，异方性导电胶35的导电粒子不会因陷入第一部分351内而使得导电粒子不容易被压头压破，从而保证柔性电路板37与电极层34的电连接稳定性，进而保证超声波指纹模组30具有较佳的连接可靠性。
请一并参阅图4至图7，柔性电路板37包括基材373、一个第一引脚374及多个第二引脚375。
其中，请参阅图5至图7，基材373的材质可以为但不仅限于为聚甲基丙烯酸甲酯(polymethyl methacrylate，PMMA)。
其中，请再次参阅图4及图5，第一引脚374设于第一连接区371。此外，请 参阅图6，并结合附图5，第一引脚374具有背离基材373的第一连接面3741。第一连接面3741贴合于第一部分351。此外，第一引脚374中设有容纳空间3742。容纳空间3742的开口位于第一连接面3741。容纳空间3742填充有部分第一部分351。此时，第一引脚374通过第一部分351电连接于电极层34。可以理解的是第一引脚374通过破裂的导电粒子电连接于电极层34。
其中，请再次参阅图7并结合附图4，多个第二引脚375设于第二连接区372。请再次参阅图7并结合附图3，多个第二引脚375设于第二部分352，且通过第二部分352电连接于多个像素电极32。可选的，第一面311设有多个金属引脚3111。多个金属引脚3111与多个像素电极32电连接。此时，多个第二引脚375与多个金属引脚3111一一对应的通过第二部分352电连接。因为异方性导电胶35在施力方向上能够将两个部件进行电连接，所以异方性导电胶35可以避免多个第二引脚375之间或者多个金属引脚3111之间相互短路。
此外，请一并结合附图3至图7所示，第一引脚374与第二引脚375之间电连接有指纹芯片36，也即指纹芯片36通过第一引脚374与第二引脚375对压电元件33施加电信号，或者通过第一引脚374与第二引脚375接收压电元件33的电信号。
在本实施例中，通过在第一引脚374中设置容纳空间3742，以在第一引脚374绑定于电极层34的过程中，部分异方性导电胶35能够填充进容纳空间3742内。此时，形成于第一连接面3741与电极层34之间的异方性导电胶35的厚度较薄，从而保证异方性导电胶35内的导电粒子能够同时电连接于第一引脚374与电极层34，进而保证第一引脚374与第一部分351的电连接稳定性。
此外，当第一连接面3741与电极层34之间的异方性导电胶35的厚度较薄时，柔性电路板37与电极层34之间不会产生间隙，从而保证外界的水汽或者空气不会进入该间隙内。
此外，通过在第一引脚374中设置容纳空间3742，从而增加了第一引脚374与第一部分351的接触面积，以显著地提高第一引脚374与第一部分351的电连接稳定性。
请再次参阅图6并结合附图3，第一引脚374包括第二连接面3743。第二连接面3743与第一连接面3741相背设置。容纳空间3742贯穿第二连接面3743。此 时，容纳空间3742的体积较大，从而使得在第一引脚374绑定于电极层34的过程中，容纳空间3742能够容纳更多的异方性导电胶35，进而降低设于第一连接面3741与电极层34之间的异方性导电胶35的厚度，以保证异方性导电胶35内的导电粒子能够同时电连接于第一引脚374与电极层34。
请参阅图8并结合图6，第一引脚374包括周侧面3744。周侧面3744连接于第一连接面3741与第二连接面3743之间。容纳空间3742贯穿至少部分周侧面3744，也即周侧面3744具有容纳空间3742的一开口。此时，在第一引脚374绑定于第一部分351时，部分异方性导电胶35能够经位于周侧面3744的开口向远离第一引脚374的方向流出，从而进一步地降低设于第一连接面3741与电极层34之间的异方性导电胶35的厚度。
一种实施例中，容纳空间3742的槽侧壁为平面。槽侧壁与第一连接面3741呈夹角设置。夹角大于90°。此时，相较于夹角等于90°，本实施例的通过设置夹角大于90°，以使容纳空间3742的槽侧壁的表面积较大，从而一方面在第一引脚374绑定于电极层34的过程中，容纳空间3742能够容纳更多的异方性导电胶35，进而降低设于第一连接面3741与电极层34之间的异方性导电胶35的厚度；另一方面，增加第一引脚374与第一部分351的接触面积，以显著地提高第一引脚374与第一部分351的电连接稳定性。
此外，相较于夹角小于或等于90°，本实施例通过设置夹角大于90°，能够降低在第一引脚374制备容纳空间3742的工艺困难度。
一种实施例中，容纳空间3742的槽侧壁为弧面，且槽侧壁朝远离容纳空间3742的中心的方向凹陷。此时，容纳空间3742的槽侧壁的表面积较大，从而一方面在柔性电路板37第一引脚374绑定于电极层34的过程中，容纳空间3742能够容纳更多的异方性导电胶35，进而降低设于第一连接面3741与电极层34之间的异方性导电胶35的厚度；另一方面，增加第一引脚374与第一部分351的接触面积，从而显著地提高第一引脚374与第一部分351的电连接稳定性。
一种实施例中，请再次参阅图5至图8，容纳空间3742的数量为多个。多个容纳空间3742阵列排布。此时，容纳空间3742的总体积较大，也即容纳空间3742能够容纳更多的异方性导电胶35，从而降低第一连接面3741与电极层34之间的异方性导电胶35的厚度。此外，第一引脚374与第一部分351的接触面积也能够 显著地增加，从而显著地提高第一引脚374与第一部分351的电连接稳定性。
请参阅图9，并结合附图5，电极层34包括主体部343、导电部344及连接于主体部343与导电部344之间的连接部345。主体部343设于压电元件33背离第一面311的表面。连接部345设于压电元件33的侧面，导电部344设于第一面311，导电部344设有第一部分351。
在本实施例中，通过将导电部344设于第一面311，且将柔性电路板37的第一引脚374电连接于导电部344，从而使得柔性电路板37与电极层34及压电元件33在超声波指纹模组30的厚度方向上具有重叠部分，从而减小超声波指纹模组30的厚度，有利于超声波模组实现薄形化设置。
一种实施例中，第一部分351在第一方向的厚度大于或等于导电部344在第一方向的厚度。第一方向为基板31朝向压电元件33的方向。
可以理解的是，因为第一部分351在第一方向的厚度大于或等于导电部344在第一方向的厚度，所以在将第一引脚374绑定于导电部344的过程中，异方性导电胶35的导电粒子不会因陷入导电部344内而使得导电粒子不容易被压头压破，从而保证柔性电路板37与电极层34的电连接稳定性，进而保证超声波指纹模组30具有较佳的连接可靠性。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种柔性电路板，其特征在于，包括基材、一个第一引脚及多个第二引脚，所述基材包括第一连接区及连接所述第一连接区的第二连接区，所述第一引脚设于所述第一连接区，所述多个第二引脚设于所述第二连接区，所述第一引脚具有背离所述基材的第一连接面，所述第一引脚中设有容纳空间，所述容纳空间的开口位于所述第一连接面。
  2. 根据权利要求1所述的柔性电路板，其特征在于，所述第一引脚包括第二连接面，所述第二连接面与所述第一连接面相背设置，所述容纳空间贯穿所述第二连接面。
  3. 根据权利要求2所述的柔性电路板，其特征在于，所述第一引脚包括周侧面，所述周侧面连接于所述第一连接面与所述第二连接面之间，所述容纳空间贯穿至少部分所述周侧面。
  4. 根据权利要求1至3中任一项所述的柔性电路板，其特征在于，所述容纳空间的槽侧壁为平面，所述槽侧壁与所述第一连接面呈夹角设置，所述夹角大于90°。
  5. 根据权利要求1至3中任一项所述的柔性电路板，其特征在于，所述容纳空间的槽侧壁为弧面，且所述槽侧壁朝远离所述容纳空间的中心的方向凹陷。
  6. 根据权利要求1至3中任一项所述的柔性电路板，其特征在于，所述容纳空间的数量为多个，所述多个容纳空间阵列排布。
  7. 一种超声波指纹模组，其特征在于，包括：
    基板，所述基板具有第一面；
    多个像素电极，所述多个像素电极设于所述第一面；
    压电元件，所述压电元件设于所述多个像素电极背离所述第一面的表面，且覆盖所述多个像素电极；
    电极层，所述电极层的至少部分设于所述压电元件背离所述第一面的表面；
    异方性导电胶，所述异方性导电胶包括第一部分及连接于所述第一部分的 第二部分，所述第一部分设于所述电极层，部分所述第二部分设于所述第一面；及，
    如权利要求1至6中任一项所述的柔性电路板，所述第一连接面贴合于所述第一部分，所述容纳空间填充有部分所述第一部分，所述第一引脚通过所述第一部分电连接于所述电极层，所述多个第二引脚设于所述第二部分，且通过所述第二部分电连接于所述多个像素电极；
    指纹芯片，所述指纹芯片安装于所述柔性电路板，且所述指纹芯片电连接于所述第一引脚与所述第二引脚之间。
  8. 根据权利要求7所述的超声波指纹模组，其特征在于，所述电极层包括本体部及连接于所述本体部的延伸部，所述本体部在第一方向的厚度大于所述延伸部在第一方向上的厚度，所述第一方向为所述基板朝向所述压电元件的方向，所述第一部分设于所述延伸部。
  9. 根据权利要求8所述的超声波指纹模组，其特征在于，所述第一部分在所述第一方向的厚度大于或等于所述延伸部在所述第一方向的厚度。
  10. 根据权利要求7所述的超声波指纹模组，其特征在于，所述电极层包括主体部、导电部及连接于所述主体部与所述导电部之间的连接部，所述主体部设于所述压电元件背离所述第一面的表面，所述连接部设于所述压电元件的侧面，所述导电部设于所述第一面，所述导电部设有所述第一部分。
  11. 根据权利要求10所述的超声波指纹模组，其特征在于，所述第一部分在第一方向的厚度大于或等于所述导电部在所述第一方向的厚度，所述第一方向为所述基板朝向所述压电元件的方向。
  12. 一种电子设备，包括壳体、显示屏及如权利要求7至11中任一项所述的超声波指纹模组，所述显示屏安装于所述壳体，所述显示屏与所述壳体围设出器件容纳腔，所述超声波指纹模组设于所述器件容纳腔内，且所述超声波指纹模组的第一面朝向所述显示屏。
PCT/CN2019/112610 2019-07-17 2019-10-22 柔性电路板、超声波指纹模组及电子设备 WO2021007981A1 (zh)

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