WO2021006466A1 - Procédé de fabrication d'un film adhésif conducteur anisotrope présentant des particules conductrices séparées par une distance contrôlée - Google Patents

Procédé de fabrication d'un film adhésif conducteur anisotrope présentant des particules conductrices séparées par une distance contrôlée Download PDF

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WO2021006466A1
WO2021006466A1 PCT/KR2020/005258 KR2020005258W WO2021006466A1 WO 2021006466 A1 WO2021006466 A1 WO 2021006466A1 KR 2020005258 W KR2020005258 W KR 2020005258W WO 2021006466 A1 WO2021006466 A1 WO 2021006466A1
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Prior art keywords
conductive particles
particles
conductive
adhesive film
adhesive
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PCT/KR2020/005258
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English (en)
Korean (ko)
Inventor
김동원
서경원
강상용
김병석
황은별
김재호
김효섭
박재강
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에이치엔에스하이텍 (주)
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Priority to JP2022501257A priority Critical patent/JP7317415B2/ja
Priority to CN202080046585.4A priority patent/CN114051523B/zh
Publication of WO2021006466A1 publication Critical patent/WO2021006466A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Definitions

  • the present invention relates to a circuit connection technology using an anisotropic conductive adhesive, and in more detail, in interconnecting two circuit members facing each other, two electrodes facing each other in the thickness direction are electrically conductive while being adjacent in the plane direction at the same time. It relates to an anisotropically conductive adhesive for circuit connection capable of maintaining insulation between the electrodes.
  • anisotropic conductive adhesive Japanese Patent Laid-Open No. 51-21192
  • anisotropic conductive adhesives contain conductive particles in an adhesive component including a curable resin
  • It refers to a circuit connecting member capable of electrically conducting two electrodes facing each other in the thickness direction by adjustment and maintaining insulation between adjacent electrodes in the surface direction at the same time.
  • anisotropically conductive adhesives are widely used for the purpose of electrically connecting and bonding various circuit members when manufacturing display devices and semiconductor devices.
  • the conventional anisotropically conductive adhesive film is manufactured in a form in which conductive particles are randomly dispersed on a resin constituting the adhesive layer.
  • the electrode connection area In the presence of a region with a small number of conductive particles, or too many conductive particles between the gaps between electrodes, electrical conduction occurs between neighboring electrodes. In order to solve this problem, there is a need to arrange conductive particles at regular intervals in a two-dimensional area.
  • an object of the present invention is to provide an anisotropically conductive adhesive film having excellent electrical connection reliability between circuit members when applied to an electronic circuit having a fine pitch between electrodes.
  • the method of manufacturing an anisotropically conductive adhesive film according to the present invention is interposed between opposing circuit members to electrically connect the opposing circuit electrodes in the thickness direction while at the same time electrically connecting adjacent circuit electrodes in the plane direction.
  • a method of manufacturing an insulated anisotropically conductive adhesive film comprising: a first step of preparing a mold including an adhesive film in which barrier particles having a diameter smaller than the diameter of the conductive particles are densely arranged on a surface; and the adhesiveness on a base substrate
  • a third step of selectively removing the barrier particles a fourth step of applying the conductive particles to the surface of the adhesive film to which the barrier particles are not attached, and preparing a film on which the first adhesive layer is formed to form the first adhesive layer.
  • the distance (L) between the centers of the conductive particles is not more than 1.7 times the average diameter (D) of the conductive particles, or the distance between the centers of the adjacent printing layers is more than 2.3 times the average diameter (D) of the conductive particles. do.
  • the surface of the adhesive film may be exposed by using an area to which the barrier particles are attached as an exposed portion, and an area to which the barrier particles are not attached as an unexposed portion.
  • the diameter of the barrier particles is preferably 10% or more to 50% or less of the diameter of the conductive particles.
  • the second adhesive layer preferably has a minimum melting viscosity of 500,000 cps or more and 1,200,000 cps or less within a circuit connection temperature range of the anisotropic conductive adhesive film.
  • the adhesive film has a surface tension lower than that of the barrier particles.
  • the present invention provides an anisotropically conductive adhesive film manufactured according to the method of manufacturing the anisotropically conductive adhesive film described above.
  • the anisotropically conductive adhesive film according to the present invention includes: first and third adhesive layers including a curing agent; and a second adhesive layer interposed between the first and third adhesive layers and impregnated with conductive particles therein.
  • the conductive particles are arranged such that a distance L between neighboring conductive particles is 1.7 times or less or 2.3 times or more with respect to the average diameter D of the conductive particles.
  • the second adhesive layer is preferably formed of a low-flow resin having a minimum melting viscosity of 500,000 cps or more and 1,200,000 cps or less within a circuit connection temperature range.
  • conductive particles can be arranged to a high density level while maintaining a separate state individually, and it is possible to effectively prevent the conductive particles from agglomeration in the local area. Furthermore, it is possible to manufacture an anisotropically conductive adhesive film including conductive particles fixed at a high capture rate as well as in which conductive particles are regularly arranged at regular intervals. In addition, since it is possible to precisely control and form fine-dimensional conductive particles as a two-dimensional single layer, it is possible to effectively prevent conductive particles present in the anisotropically conductive adhesive film from conducting in the plane direction.
  • the anisotropic conductive adhesive film manufactured by the manufacturing method according to the present invention is used, even when applied to a flexible circuit board (FPCB) employed in electronic circuits and wearable devices having an ultra-fine pitch, the connection resistance between electrodes is increased. It can be greatly reduced, and at the same time, aggregation between conductive particles does not occur, and thus electrical connection reliability of circuit members and insulation between neighboring circuit electrodes can be greatly improved.
  • FPCB flexible circuit board
  • FIG. 1 is a process flow diagram schematically showing a method of manufacturing an anisotropically conductive adhesive film according to an embodiment of the present invention for each process.
  • FIG. 2 is a cross-sectional view schematically showing a cross-section of an anisotropically conductive adhesive film manufactured by a manufacturing method according to the present invention.
  • FIG. 3 is a schematic view for explaining a problem in which other conductive particles are sandwiched between neighboring conductive particles when the conductive particles are attached to the adhesive film on which the barrier particles are formed.
  • FIG. 4 is a schematic diagram illustrating a process for precisely controlling a position at which conductive particles are attached to a mold used for manufacturing an anisotropically conductive adhesive film according to the present invention.
  • FIG. 5 is a schematic diagram for explaining a pattern of a printing layer formed on a positioning film.
  • FIG. 6 is an image photographing the arrangement of conductive particles transferred to the first adhesive layer, and is a diagram showing a change in the settlement rate of the conductive particles according to the relative diameter of the barrier particles to the diameter of the conductive particles.
  • FIG. 8 is a view showing a graph showing a change in the capture rate of conductive particles according to the lowest melting viscosity of a low-flow resin and an indentation image.
  • FIG. 10 is a comparative example of an image (A) photographing an arrangement of conductive particles showing that the pinching and aggregation of conductive particles is significantly reduced when the distance L between conductive particles is controlled according to the present invention ( B) together.
  • the method of manufacturing an anisotropically conductive adhesive film according to the present invention is interposed between opposing circuit members to electrically connect the opposing circuit electrodes in the thickness direction while at the same time electrically connecting adjacent circuit electrodes in the plane direction.
  • a method of manufacturing an insulated anisotropically conductive adhesive film comprising: a first step of preparing a mold including an adhesive film in which barrier particles having a diameter smaller than the diameter of the conductive particles are densely arranged on a surface; and the adhesiveness on a base substrate
  • a third step of selectively removing the barrier particles a fourth step of applying the conductive particles to the surface of the adhesive film to which the barrier particles are not attached, and preparing a film on which the first adhesive layer is formed to form the first adhesive layer.
  • the distance (L) between the centers of the conductive particles is not more than 1.7 times the average diameter (D) of the conductive particles, or the distance between the centers of the adjacent printing layers is more than 2.3 times the average diameter (D) of the conductive particles. do.
  • the surface of the adhesive film may be exposed by using an area to which the barrier particles are attached as an exposed portion, and an area to which the barrier particles are not attached as an unexposed portion.
  • the diameter of the barrier particles is preferably 10% or more to 50% or less of the diameter of the conductive particles.
  • the second adhesive layer preferably has a minimum melting viscosity of 500,000 cps or more and 1,200,000 cps or less within a circuit connection temperature range of the anisotropic conductive adhesive film.
  • the adhesive film has a surface tension lower than that of the barrier particles.
  • the present invention provides an anisotropically conductive adhesive film manufactured according to the method of manufacturing the anisotropically conductive adhesive film described above.
  • the anisotropically conductive adhesive film according to the present invention includes: first and third adhesive layers including a curing agent; and a second adhesive layer interposed between the first and third adhesive layers and impregnated with conductive particles therein.
  • the conductive particles are arranged such that a distance L between neighboring conductive particles is 1.7 times or less or 2.3 times or more with respect to the average diameter D of the conductive particles.
  • the second adhesive layer is preferably formed of a low-flow resin having a minimum melting viscosity of 500,000 cps or more and 1,200,000 cps or less within a circuit connection temperature range.
  • the anisotropic conductive adhesive film according to the present invention is interposed between circuit members opposed to each other to electrically connect the circuit electrodes facing each other in the thickness direction while at the same time electrically insulating adjacent circuit electrodes in the plane direction.
  • the anisotropically conductive adhesive film may include an electrically insulating adhesive layer that can be cured by heat or a light source, and electrically conductive conductive particles dispersed in the adhesive layer.
  • the inventors of the present invention developed a process of transferring a two-dimensional arrangement of conductive particles onto a film coated with a curable resin using a mold in which conductive particles are attached on a pre-designed two-dimensional plane, thereby making the product of an anisotropic conductive adhesive film.
  • the characteristics were made to be maximized.
  • electrical conduction due to aggregation of conductive particles does not occur between neighboring electrodes, and a sufficient number of conductive particles are arranged between opposite electrodes to ensure electrical conduction reliability. Made it possible.
  • a mold is prepared for patterning of conductive particles.
  • the mold is formed of an adhesive film, and for example, a polymer material such as polydimethylsiloxane (PDMS), polyethylene (PE), and polyvinylchloride (PVC) may be used.
  • a film or the like can be used that is easily deformed in its surface shape.
  • the adhesive film constituting the mold has an adhesive force lower than that of the adhesive layer constituting the anisotropic conductive adhesive film to be described below.
  • the adhesive film can maintain a shape in a solid state (ie, a substrate or film shape) at room temperature without a separate support.
  • Barrier particles (M) are attached to the remaining areas except for the areas where conductive particles are to be attached to the above-described adhesive film.
  • the barrier particles inorganic particles such as silicon oxide and zirconium oxide may be used.
  • the barrier particles are preferably spherical particles having a smaller particle diameter than the conductive particles.
  • the barrier particles preferably have a diameter of 10% or more and 50% or less of the conductive particle diameter. As shown in Fig. 6, when the diameter of the barrier particles is less than 10% of the diameter of the conductive particles, the PDMS resin used as the adhesive film is exposed on the barrier particles, causing the conductive particles to be trapped in unwanted positions (approximately At the level of 30%, conductive particles are pinched and agglomerated).
  • the diameter of the barrier particles exceeds 50% of the diameter of the conductive particles, the area to which the conductive particles are attached (that is, the area in which the barrier particles are not disposed) is not uniformly formed, and the subsequent conductive particle arrangement process In the case, the settlement rate at which the conductive particles are settled on the adhesive film decreases rapidly (conductive particles cannot be settled at about 20% of the total area).
  • the barrier particles are selectively attached to a predesigned area on the adhesive film, and at this time, the surface of the adhesive film is disposed in a state pressed to a predetermined depth by the hardness of the barrier particles. That is, the barrier particles are not simply attached by the adhesive force provided by the adhesive film, but are pressed with a constant pressure after the barrier particles are disposed on the surface of the adhesive film. At this time, the surface tension of the adhesive film has a lower surface tension than the surface tension of the barrier particles, and thus, has a property of broadly adhering the barrier particles due to the low surface tension of the adhesive film. Due to the flexible surface material and low surface tension of the adhesive film, the barrier particles may be in close contact and disposed on the adhesive film in a predetermined area.
  • the adhesion of the barrier particles to the adhesive film is increased. That is, light is irradiated on the upper surface of the mold using a mask in which the area where the barrier particles are not disposed (ie, the area where the conductive particles are to be attached) is used as the non-exposed portion, and the area where the barrier particles are disposed is the exposed area. At this time, the adhesive force of the exposed portion irradiated with light is greater than that of the non-exposed portion not irradiated with light.
  • the barrier particles located in the exposed portion may maintain a state attached to the adhesive film with a stronger bonding force than the conductive particles disposed in the exposed area located in the non-exposed portion.
  • the methyl portion of the chemical structure is damaged, through which reactive functional groups are formed in the polymer constituting the adhesive film. These functional groups form covalent chemical bonds through dehydration and condensation bonds that can have adhesion to barrier particles such as hydrogen bonds compared to methyl groups.
  • Conductive particles are coated on the mold on which the barrier particles prepared above are arranged.
  • the coated conductive particles are positioned in regions where barrier particles are not disposed. At this time, the conductive particles are attached to the adhesive film with weaker adhesion than the barrier particles having increased adhesion through exposure or the like.
  • a film on which the first adhesive layer (R) of the anisotropic conductive adhesive film is formed is attached onto a mold in which conductive particles are disposed.
  • the adhesive force of the first adhesive layer is smaller than the adhesive force of the area where the barrier particles are disposed (exposed portion) and greater than that of the area where the conductive particles are disposed (non-exposed portion).
  • the diameter of the barrier particles is smaller than the diameter of the conductive particles, when attaching the first adhesive layer on the mold, the area in which the first adhesive layer contacts the conductive particles is compared to the area in which the first adhesive layer contacts the barrier particles. It becomes bigger. Therefore, only the conductive particles disposed in the mold can be selectively attached to the first adhesive layer and separated due to the limitation of the adhesive strength of the first adhesive layer and the difference in diameters of the barrier particles and the conductive particles.
  • conductive particles are two-dimensionally arranged at a certain position. At this time, some of the conductive particles may be impregnated on the first adhesive layer, but most of the conductive particles are exposed.
  • a second adhesive layer is formed on the first adhesive layer to which the conductive particles are exposed, using a resin having low flow characteristics.
  • the low flow layer improves the capture rate of conductive particles when the anisotropic conductive adhesive film containing conductive particles is applied to an actual product. That is, the fluidity of the adhesive layer is increased due to high heat of the surrounding environment, so that the position of the conductive particles is moved at a predetermined position to prevent aggregation or separation of the conductive particles from the positions between opposite electrodes.
  • the low-flow resin to be used as the second adhesive layer has a minimum melting viscosity of at least within a circuit connection temperature range (generally, a temperature range of room temperature to 150°C) for connecting a circuit member using an anisotropic conductive adhesive film. It is preferably 500,000 cps or more and 1,200,000 cps or less.
  • a third adhesive layer is formed on the film including the first and second adhesive layers prepared above.
  • the third adhesive layer serves to sufficiently fill the space between adjacent electrodes provided in the circuit members when the circuit members are connected by using the anisotropic conductive adhesive film together with the first adhesive layer.
  • the anisotropically conductive adhesive film thus prepared has a three-layer structure of a first adhesive layer, a second adhesive layer, and a third adhesive layer.
  • the first adhesive layer and the third adhesive layer use a resin having the above-described physical properties, but each resin composition includes a polymerizable material having a functional group polymerizable by radicals and a curing agent that generates free radicals by heat or light.
  • the second adhesive layer does not contain a curing agent as a low flow layer.
  • the anisotropic conductive adhesive film is applied to an actual product, the adhesive film is interposed between the opposing circuit members and then compressed. At this time, the first and third adhesive layers closely fill the voids between the electrodes between the circuit members. While being cured, the second adhesive layer is partially cured while being in contact with the curing agent present in the first or third adhesive layer during compression.
  • the second adhesive layer is interposed between the first and third adhesive layers, and conductive particles are impregnated therein, and in particular, the minimum melting viscosity in the circuit connection temperature range (approximately room temperature to 150°C) is 500,000 cps or more. It is preferably formed of a low-fluidity resin of 1,200,000 cps or less.
  • the low-fluidity resin used as the second adhesive layer has a melt viscosity that changes depending on the temperature in the circuit connection temperature range (see Fig. 7), and the lowest melting viscosity is when the melt viscosity is the lowest within the circuit connection temperature
  • the minimum melting viscosity varies depending on the type, component, and manufacturing method of the resin used, and the inventors of the present invention use the anisotropically conductive adhesive film finally manufactured according to the minimum melting viscosity of the low-fluidity resin when connecting circuit members. It has been found that the capture ratio at which conductive particles are captured between electrodes facing each other varies.
  • an anisotropically conductive adhesive film was prepared using a low-flow resin having a different lowest melting viscosity as shown in Table 1 below.
  • the first to third adhesive layers used in Examples 1 to 3 were all made of a phenoxy-based epoxy resin and a cycloaliphatic epoxy resin, wherein the second adhesive layer was made of resin.
  • the minimum melting viscosity was adjusted by changing the process conditions (temperature and time).
  • Example 8 [(B): Indentation image of Example 1 / (C) : The indentation image of Example 2 / (D): The indentation image of Example 3) shows a capture rate of 85% or more and good indentation properties.
  • barrier particles Since each conductive particle is transferred to the first adhesive layer in a state in which each conductive particle is disposed at an individually determined position through the mold in which is disposed, it is easy to regularly arrange the conductive particles having a fine diameter on a two-dimensional plane.
  • the adhesive film constituting the mold in which the barrier particles are disposed provides only an adhesive force capable of reversibly attaching the conductive particles, and can be used repeatedly several times.
  • the conductive particles can be arranged up to a high density level while maintaining the individually separated state.
  • the conductive particles are preferably disposed in a single layer. This is required in order to prevent a short-circuit phenomenon that occurs when several conductive particles come into contact with each other when a product is applied when the conductive particles are arranged in a single layer when the final anisotropic conductive adhesive film is manufactured.
  • the conductive particles are disposed on the adhesive film to which the barrier particles are attached, when the exposed areas to which the barrier particles are not attached are too adjacent, a problem occurs in that other conductive particles are sandwiched between neighboring conductive particles.
  • the area in the mold to which the conductive particles are to be adhered needs to be sufficiently narrow or wide.
  • a location to which conductive particles are attached is formed in the following manner when manufacturing a mold.
  • a conductive particle alignment film is prepared.
  • the position alignment film is formed with a printed layer on which an adhesive layer is printed that provides an adhesive force greater than that provided by the adhesive film on a base substrate having no adhesive force.
  • the barrier particles (M) attached to the area formed at the location where the conductive particles will be attached can be selectively removed.
  • the adhesive printing layer formed on the alignment film may be formed in an approximately circular shape, and the distance (L) between the centers of the adjacent printing layers is 1.7 times or less of the average diameter (D) of the conductive particles, or It is formed to be at least 2.3 times the average diameter (D) of the conductive particles.
  • the distance (L) between the centers of the adjacent printing layers is 1.7 times or less of the average diameter (D) of the conductive particles, or It is formed to be at least 2.3 times the average diameter (D) of the conductive particles.
  • the distance between adjacent printing layers may be patterned to have a long diameter L1 and a short diameter L2, where the long diameter L1 is The distance between the centers of the neighboring printed layers is 2.3 times more than the average diameter (D) of the conductive particles, and the short diameter (L2) has a distance between the centers of the neighboring printed layers than the average diameter (D) of the conductive particles. It is formed to have a dimension of 1.7 times or less.
  • the position where the conductive particles formed on the mold are attached is determined according to the distance L between the centers of the printing layers. Therefore, in the "arrangement of conductive particles" process, the conductive particles disposed on the mold may be arranged such that the center distance of the adjacent conductive particles is 1.7 times or less and 2.3 times or more of the conductive particle diameter D. By controlling the spacing at which the conductive particles are arranged on the mold as described above, it is possible to reduce the pinching and aggregation between the transferred conductive particles to a level of less than 5 ppm.
  • the ratio (L/D) of the distance (L) between the conductive particles to the diameter of the conductive particles (D) is a graph confirming the degree to which "ball jamming level" occurs in the arrangement of the transferred conductive particles (Fig. 9)
  • the "L/D” value can satisfy the conditions of 1.7 or less and 5 ppm or less at 2.3 or more.
  • the "ball jamming level” means the degree of defects in which other conductive particles are sandwiched between neighboring conductive particles among the total number of tested conductive particles, and a level of 5 ppm or less is a condition that can be used as an anisotropic conductive adhesive film. .
  • the distance between conductive particles disposed in the mold is not more than 1.7 times the average diameter (D) of the conductive particles, and In the case of 2.3 times or more (Fig. 10(A)) and the case of more than 1.7 times and less than 2.3 times of the average diameter (D) of the conductive particles (Fig. 10(B)), each of the first adhesive layers An image of the transferred conductive particles is shown. As shown in FIG.
  • the conductive particles coated on the mold may be arranged as a single layer, and it is possible to effectively prevent other conductive particles from being sandwiched between neighboring conductive particles. Therefore, even in the subsequent transfer process of the conductive particles through the first adhesive layer, the conductive particles can be transferred while forming a single layer in two dimensions on the first adhesive layer.
  • the conductive particles of fine dimensions can be precisely controlled as a two-dimensional single layer. Through this, it is possible to effectively prevent conductive particles present in the anisotropically conductive adhesive film from conducting in the plane direction.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un film adhésif conducteur anisotrope. Selon le présent procédé, grâce à l'utilisation d'un moule comprenant un film adhésif sur la surface duquel des particules barrières sont fixées, ces particules barrières ayant un diamètre inférieur à celui de particules conductrices, les emplacements auxquels les particules conductrices doivent être formées sur le film adhésif conducteur anisotrope peuvent être contrôlés avec précision. En particulier, les emplacements des particules barrières, auxquels les particules conductrices doivent être fixées, parmi les particules barrières disposées sur le moule, peuvent être ajustés avec précision à l'aide d'un film de positionnement, et des couches d'impression adhésives formées sur le film de positionnement sont caractérisées en ce que la distance entre les centres de couches d'impression voisines est d'au plus 1,7 fois le diamètre moyen (D) des particules conductrices ou la distance entre les centres de couches d'impression voisines est d'au moins 2,3 fois le diamètre moyen (D) des particules conductrices.
PCT/KR2020/005258 2018-07-12 2020-04-21 Procédé de fabrication d'un film adhésif conducteur anisotrope présentant des particules conductrices séparées par une distance contrôlée WO2021006466A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022501257A JP7317415B2 (ja) 2018-07-12 2020-04-21 導電粒子の隔離距離が制御された異方性導電接着フィルムの製造方法
CN202080046585.4A CN114051523B (zh) 2018-08-03 2020-04-21 导电粒子隔开距离得到控制的异方性导电胶膜的制备方法

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KR20180080984 2018-07-12
KR10-2019-0083682 2019-07-11
KR1020190083682A KR102254470B1 (ko) 2018-07-12 2019-07-11 도전입자의 이격거리가 제어된 이방도전성 접착필름의 제조방법

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090024311A (ko) * 2007-09-03 2009-03-09 이형곤 탄성이 개선된 이방성도전필름과 도전박막,쉬트 및도전입자와 제조방법
KR20150048667A (ko) * 2012-08-29 2015-05-07 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
KR20160082537A (ko) * 2013-11-06 2016-07-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 기능적 특징부를 갖는 미세접촉 인쇄 스탬프
KR20170005950A (ko) * 2015-07-06 2017-01-17 삼성디스플레이 주식회사 이방성 도전 필름 및 그 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4130747B2 (ja) 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 異方導電性接着シートおよびその製造方法
KR101150116B1 (ko) 2006-04-12 2012-06-08 히다치 가세고교 가부시끼가이샤 회로 접속용 접착 필름, 회로 부재의 접속 구조 및 회로 부재의 접속 방법
KR101175325B1 (ko) * 2009-08-24 2012-08-20 한국기초과학지원연구원 양자점 형성방법
SG10201909698RA (en) 2015-01-13 2019-11-28 Dexerials Corp Anisotropic conductive film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090024311A (ko) * 2007-09-03 2009-03-09 이형곤 탄성이 개선된 이방성도전필름과 도전박막,쉬트 및도전입자와 제조방법
KR20150048667A (ko) * 2012-08-29 2015-05-07 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
KR20160082537A (ko) * 2013-11-06 2016-07-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 기능적 특징부를 갖는 미세접촉 인쇄 스탬프
KR20170005950A (ko) * 2015-07-06 2017-01-17 삼성디스플레이 주식회사 이방성 도전 필름 및 그 제조방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
2016, vol. 29, no. 9, pp. 571-575 (JO, Sungjin. Development of Nanowire Patterning Process Using Microcontact Printing. Journal of the Korean Institute of Electrical and Electronic Material Engineers.). See page 572; and Fig. 1. *

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