WO2021001691A3 - 透明導電性フィルム - Google Patents

透明導電性フィルム Download PDF

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Publication number
WO2021001691A3
WO2021001691A3 PCT/IB2020/000799 IB2020000799W WO2021001691A3 WO 2021001691 A3 WO2021001691 A3 WO 2021001691A3 IB 2020000799 W IB2020000799 W IB 2020000799W WO 2021001691 A3 WO2021001691 A3 WO 2021001691A3
Authority
WO
WIPO (PCT)
Prior art keywords
transparent conductive
conductive film
conductive layer
mpa
glass substrate
Prior art date
Application number
PCT/IB2020/000799
Other languages
English (en)
French (fr)
Other versions
WO2021001691A4 (ja
WO2021001691A2 (ja
Inventor
才将 西森
智剛 梨木
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Publication of WO2021001691A2 publication Critical patent/WO2021001691A2/ja
Publication of WO2021001691A3 publication Critical patent/WO2021001691A3/ja
Publication of WO2021001691A4 publication Critical patent/WO2021001691A4/ja

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

【解決手段】透明導電性フィルム1は、ガラス基材2と、透明導電層3とを順に備える。ガラス基材2の厚みは、150μm以下である。透明導電層3が結晶性である。透明導電層3の残留応力は、-100MPa以上100MPa以下である。
PCT/IB2020/000799 2019-06-21 2020-06-16 透明導電性フィルム WO2021001691A2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-115612 2019-06-21
JP2019115612A JP2021002478A (ja) 2019-06-21 2019-06-21 透明導電性フィルム

Publications (3)

Publication Number Publication Date
WO2021001691A2 WO2021001691A2 (ja) 2021-01-07
WO2021001691A3 true WO2021001691A3 (ja) 2021-03-04
WO2021001691A4 WO2021001691A4 (ja) 2021-05-06

Family

ID=73994105

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2020/000799 WO2021001691A2 (ja) 2019-06-21 2020-06-16 透明導電性フィルム

Country Status (3)

Country Link
JP (1) JP2021002478A (ja)
TW (1) TW202117757A (ja)
WO (1) WO2021001691A2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012090735A1 (ja) * 2010-12-27 2012-07-05 日東電工株式会社 透明導電性フィルムおよびその製造方法
JP2013071380A (ja) * 2011-09-28 2013-04-22 Toppan Printing Co Ltd 透明導電性フィルム及びタッチパネル
JP2014017128A (ja) * 2012-07-09 2014-01-30 Dainippon Printing Co Ltd 透明導電性基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012090735A1 (ja) * 2010-12-27 2012-07-05 日東電工株式会社 透明導電性フィルムおよびその製造方法
JP2013071380A (ja) * 2011-09-28 2013-04-22 Toppan Printing Co Ltd 透明導電性フィルム及びタッチパネル
JP2014017128A (ja) * 2012-07-09 2014-01-30 Dainippon Printing Co Ltd 透明導電性基板の製造方法

Also Published As

Publication number Publication date
WO2021001691A4 (ja) 2021-05-06
TW202117757A (zh) 2021-05-01
JP2021002478A (ja) 2021-01-07
WO2021001691A2 (ja) 2021-01-07

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