WO2020259097A1 - 介质单腔、介质波导滤波器 - Google Patents

介质单腔、介质波导滤波器 Download PDF

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Publication number
WO2020259097A1
WO2020259097A1 PCT/CN2020/089479 CN2020089479W WO2020259097A1 WO 2020259097 A1 WO2020259097 A1 WO 2020259097A1 CN 2020089479 W CN2020089479 W CN 2020089479W WO 2020259097 A1 WO2020259097 A1 WO 2020259097A1
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WO
WIPO (PCT)
Prior art keywords
dielectric
carrier
coupling
waveguide filter
metal
Prior art date
Application number
PCT/CN2020/089479
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English (en)
French (fr)
Chinese (zh)
Inventor
周虹
卜伟
龚红伟
杨锋
余万里
丁玲
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP20833385.6A priority Critical patent/EP3985790A4/de
Publication of WO2020259097A1 publication Critical patent/WO2020259097A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/2002Dielectric waveguide filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • H01P7/04Coaxial resonators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/205Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2056Comb filters or interdigital filters with metallised resonator holes in a dielectric block
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/212Frequency-selective devices, e.g. filters suppressing or attenuating harmonic frequencies

Definitions

  • This application relates to the field of communications, for example, to a dielectric single cavity and dielectric waveguide filter.
  • the filter is used to select the communication signal frequency and filter out the clutter or interference signal outside the communication signal frequency.
  • the size and weight of the filter directly affect the development of the miniaturization and light weight of the base station system architecture .
  • the dielectric waveguide filter replaces the air part with a high dielectric constant dielectric material to conduct electromagnetic waves and structural support.
  • the surface of the dielectric block is metalized for electromagnetic shielding, which can significantly reduce the volume and weight of the filter module.
  • the processing method of the dielectric waveguide filter and the metal cavity filter is different.
  • the dielectric waveguide filter is formed by powder sintering and die-casting, and the conversion cost is much lower. In short, dielectric waveguide filters have become the development trend of passive filter modules in 5G base station systems.
  • the weight and volume advantages of the dielectric waveguide filter will be weakened.
  • the inner core coupling structure of the radio frequency connector is built into the input and output ends of the dielectric waveguide filter.
  • this coupling structure is not simple enough and affects the design of the dielectric waveguide filter. Height, design direction and design size, while the dielectric waveguide filter is still an independent module, rather than a small device that can be mounted on the board.
  • the dielectric waveguide filter can be used as a small device board, it is only limited to the microstrip line surface mount assembly method, and the signal shielding, coupling range, welding firmness, and high and low temperature stress resistance are not available. Able to meet market demand.
  • the input and output still adopt the conventional connector solution, which causes the weight and volume advantages of the dielectric waveguide filter to be weakened. There is no better one. s solution.
  • the embodiments of the present application provide a dielectric single cavity, dielectric waveguide filter to at least solve the problem that the small volume and light weight dielectric waveguide filter cannot fully exert its performance due to the conventional connector solution still used for input and output in the related art.
  • a medium single cavity including: a medium single cavity main body, including an outer shell and an inner shell arranged inside the outer shell, a cavity is formed between the outer shell and the inner shell, The inner shell is provided with a metal coupling hole for inserting and coupling a PIN pin; a first avoiding hole is communicated with the cavity, and the first avoiding hole is arranged on the outer shell and surrounds the metal The outside of the coupling hole.
  • a dielectric waveguide filter including: a filter dielectric block and one or more of the dielectric single cavities arranged in the filter dielectric block, the dielectric single The cavity is the aforementioned medium single cavity.
  • Fig. 1 is a structural diagram of a medium single cavity according to an embodiment of the present application.
  • Fig. 2 is a cross-sectional structure diagram of a medium single cavity according to an embodiment of the present application
  • Fig. 3 is a schematic structural diagram of a coupled PIN needle according to an embodiment of the present application.
  • Figure 4 is a schematic structural diagram of another coupled PIN needle according to an embodiment of the present application.
  • Fig. 5 is a schematic structural diagram of a dielectric waveguide filter according to an embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of another dielectric waveguide filter according to an embodiment of the present application.
  • Fig. 7 is a schematic structural diagram of a carrier according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of yet another dielectric waveguide filter according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another carrier according to an embodiment of the present application.
  • Fig. 10 is a schematic structural diagram of another carrier according to an embodiment of the present application.
  • FIG. 1 is a structural diagram of a medium single cavity according to an embodiment of the present application.
  • the medium single cavity 1 includes: a medium single cavity main body 12, a medium
  • the single-cavity body 12 includes an outer shell 122 and an inner shell 124 arranged inside the outer shell 122.
  • a cavity is formed between the outer shell 122 and the inner shell 124, and the inner shell 124 is provided with a plug-in coupling PIN.
  • the metal coupling hole 126 of the needle 2; the first avoiding hole 14, the first avoiding hole 14 is arranged on the housing 122 and surrounds the outer side of the metal coupling hole 126.
  • the first escape hole 14 penetrates the housing 122, so that the inside of the cavity of the medium single cavity main body 12 communicates with the external environment.
  • the first escape hole 14 may also be a hole that is recessed to a certain depth but does not allow the inside of the cavity of the medium single cavity body 12 to communicate with the external environment.
  • the conventional adapter connector is used as input and output coupling.
  • a metal coupling hole capable of inserting and coupling the PIN pin is provided in the inner shell of the dielectric single cavity, and a avoiding hole is also provided outside the metal coupling hole, thus, It can not only solve the problem that the small size and light weight dielectric waveguide filter cannot fully exert its performance due to the conventional connector solution still used in the input and output of the related technology, but also make it possible to reduce the size, weight and cost of the dielectric waveguide filter. Under the premise, the performance of the dielectric waveguide filter can be fully utilized.
  • FIG. 2 is a cross-sectional structure diagram of a single medium cavity according to an embodiment of the present application.
  • the number of the first avoiding holes 14 may be one or more.
  • the first avoiding hole 14 is a circular ring surrounding the outer side of the metal coupling hole 126 and co-centered with the metal coupling hole 126. If the number of the first avoiding holes 14 is multiple, the first avoiding holes 14 are a plurality of circular holes surrounding the outer side of the metal coupling hole 126, and these circular holes communicate with each other. The arrangement of the multiple round holes can be determined according to the number and size of the first avoiding holes 14.
  • the outer surface of the housing 122 and the inner surface of the metal coupling hole 126 are both covered with metallized plating.
  • the metallization plating layer may be a silver plating layer, a copper plating layer or a copper-silver mixed plating layer.
  • the metallization coating may be a metallization coating of other metal materials that can facilitate signal transmission.
  • the metallization coating on the outer surface of the housing 122 and the metallization coating on the inner surface of the metal coupling hole 126 may be metallization coatings of the same metal material.
  • the metallization coating on the outer surface of the housing 122 and the metallization coating on the inner surface of the metal coupling hole 126 may also cover the metallization coating of different metal materials.
  • Fig. 3 is a schematic structural diagram of a coupled PIN needle according to an embodiment of the present application.
  • the coupling PIN pin 2 includes a plurality of elastic pins 22 arranged at intervals.
  • the plurality of elastic pins 22 occur. They are elastically deformed and close to each other, so that the coupling PIN pin 2 is interference fit inside the metal coupling hole 126.
  • the coupling PIN pin 2 may include other elasticity that can be assembled into the metal coupling hole 126 during the process of the coupling PIN pin 2 being assembled into the metal coupling hole 126. The structure will not be repeated here.
  • the coupling PIN pin 2 may also be fixed inside the metal coupling hole 126.
  • the fixing methods include but are not limited to: fixing by welding.
  • the coupling PIN needle 2 is a PIN needle.
  • the coupling PIN needle 2 is cylindrical.
  • Fig. 4 is a schematic structural diagram of another coupled PIN needle according to an embodiment of the present application.
  • the upper half of the coupled PIN needle 2 is a cylinder, and the lower half of the coupled PIN needle 2 is a disc.
  • the upper half of the coupled PIN needle 2 is a cylinder, and the lower half of the coupled PIN needle 2 is a square plate.
  • the metal coupling hole 126 and the coupling PIN needle 2 are coaxial with the center of the first escape hole 14.
  • the center of the first avoiding holes 14 here refers to the center of the circle surrounded by the multiple first avoiding holes 14.
  • the size of the metal coupling hole 126, the size of the coupling pin 2 and the first avoidance is adjusted to achieve this.
  • a dielectric waveguide filter is also provided, and the dielectric waveguide filter is used to implement the above-mentioned embodiments and optional implementation manners, and those that have been explained will not be repeated.
  • Fig. 5 is a schematic structural diagram of a dielectric waveguide filter according to an embodiment of the present application. As shown in Fig. 5, the device includes: a filter dielectric block 3; one or more of the filter dielectric blocks 3 The medium single cavity 1.
  • the medium single cavity 1 in Embodiment 2 is the medium single cavity described in Embodiment 1.
  • the single dielectric cavity 1 described in this embodiment is provided in the filter dielectric block 3, but also other single dielectric cavities corresponding to the filtering function are provided.
  • FIG. 6 is a schematic structural diagram of another dielectric waveguide filter according to an embodiment of the present application.
  • one or more first debugging devices 32 are provided in the filter dielectric block 3.
  • each of the dielectric single cavity 1 is provided with one first debugging device 32, and the first debugging device 32 is configured to debug the resonance frequency of the dielectric single cavity 1.
  • the dielectric waveguide filter further includes a second debugging device 34, which is located between the multiple dielectric single cavities 1, and is configured to perform multiple calculations. The coupling and debugging between the medium single cavity 1 is described.
  • the filter dielectric block 3 is covered with a metal film with adhesive backing.
  • the metallization coating of the debugging device is likely to be destroyed.
  • the entire surface of the filter dielectric block 3 may be covered with a metal film (for example, tin foil).
  • a metal film for example, tin foil.
  • Metal film In addition, the metal film must also have the characteristics of not warping or falling off for a long time when the filter works at a high temperature.
  • Fig. 7 is a schematic structural diagram of a carrier according to an embodiment of the present application.
  • the dielectric waveguide filter includes: a carrier 4 connected to the dielectric single cavity 1; the carrier 4 includes: a second avoiding hole 42 that penetrates the carrier 4 and is configured to avoid the coupling PIN The needle 2 and at least part of the area of the first escape hole 14.
  • the outer size of the carrier 4 is larger than the outer periphery of the dielectric waveguide filter, and the material can be selected according to hardness, elasticity, expansion coefficient, and heat dissipation requirements, and is usually a printed circuit board (PCB) plate.
  • the carrier 4 further includes: two metal layers 44 covering the surface and bottom layers of the carrier 4 respectively; and an inner layer 46 arranged between the two metal layers 44.
  • the metal layer 44 and/or the inner layer 46 covering the surface layer of the carrier 4 are configured for signal transmission.
  • the coupling PIN pin 2 is connected to the metal layer 44 and/or the inner layer 46 covering the surface layer of the carrier 4 configured for signal transmission.
  • the metal layer 44 covering the bottom layer of the carrier 4 is used for welding and fixing the dielectric waveguide filter to strengthen grounding.
  • FIG. 8 is a schematic structural diagram of another dielectric waveguide filter according to an embodiment of the present application.
  • the dielectric waveguide filter in FIG. 8 is provided with a carrier 4 under the dielectric block 3 of the dielectric filter.
  • a plurality of opening grooves can be formed on the outside of the carrier 4 close to the filter dielectric block 3. Since the temperature of the dielectric waveguide filter is very high when the surface is attached, the difference in the cold and heat shrinkage ratio of the dielectric waveguide filter and the carrier 4 can be released through the open slot, which effectively prevents the dielectric waveguide filter from fission and affects the dielectric The problem of the normal use of the filter.
  • the filter dielectric block 3 is placed on the carrier 4, crimped in place by a tooling fixture, and then placed in a welding equipment with a set temperature and time for welding.
  • the back view shows the bottom of the carrier 4, including the ground hole in the bottom layer and the second avoiding hole 42.
  • the inside of the second avoiding hole 42 can be metalized and transitioned to the bottom layer to form a hermetic coupling with the PIN needle 2.
  • Peripheral shielding layer At the same time, a ground hole can be added between the input/output coupling PIN pin 2 to strengthen the input/output port isolation.
  • FIG. 9 is a schematic structural diagram of another carrier according to an embodiment of the present application.
  • the length of the metal coupling PIN needle 2 is adjusted according to design requirements, and can be higher than the carrier 4.
  • the via pin welding method is combined with the inner layer 46.
  • the internal layer 46 may be the internal signal layer of the carrier 4 or the internal signal layer of the PCB board of other modules of the base station system.
  • Other modules of the base station system are not limited to power amplifier (PA) modules or antenna modules.
  • PA power amplifier
  • Fig. 10 is a schematic structural diagram of another carrier according to an embodiment of the present application.
  • a low-pass filter 5 is integrated on the carrier 4 to suppress the remote harmonics of the dielectric waveguide filter.
  • the low-pass filter 5 is located on the surface of the carrier 4 and is in the form of a microstrip, but the low-pass filter 5 can also be built in the middle of the carrier 4, and the implementation form can be adjusted according to the requirements of the solution design.
  • the carrier 4 in the dielectric waveguide filter is not necessary. If the size of other modules of the base station system is not large, and the high and low temperature deformation does not affect the welding requirements of the dielectric filter, the carrier 4 can be eliminated.
PCT/CN2020/089479 2019-06-28 2020-05-09 介质单腔、介质波导滤波器 WO2020259097A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20833385.6A EP3985790A4 (de) 2019-06-28 2020-05-09 Filter mit dielektrischem einzelhohraum dielektrischem wellenleiter

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CN201910578718.1 2019-06-28
CN201910578718.1A CN112151924B (zh) 2019-06-28 2019-06-28 介质单腔、介质波导滤波器

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Cited By (2)

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CN114792874A (zh) * 2021-01-25 2022-07-26 南京以太通信技术有限公司 介质滤波器的制作方法及其电极制作方法
WO2023092518A1 (zh) * 2021-11-27 2023-06-01 华为技术有限公司 介质滤波器和通信设备

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CN114464971A (zh) * 2022-02-28 2022-05-10 华为技术有限公司 介质滤波器和电子设备

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Publication number Priority date Publication date Assignee Title
CN114792874A (zh) * 2021-01-25 2022-07-26 南京以太通信技术有限公司 介质滤波器的制作方法及其电极制作方法
CN114792874B (zh) * 2021-01-25 2024-04-02 南京以太通信技术有限公司 介质滤波器的制作方法及其电极制作方法
WO2023092518A1 (zh) * 2021-11-27 2023-06-01 华为技术有限公司 介质滤波器和通信设备

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CN112151924B (zh) 2023-07-14
CN112151924A (zh) 2020-12-29
EP3985790A1 (de) 2022-04-20
EP3985790A4 (de) 2022-08-03

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