WO2020001270A1 - Massive mimo天线 - Google Patents

Massive mimo天线 Download PDF

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Publication number
WO2020001270A1
WO2020001270A1 PCT/CN2019/090792 CN2019090792W WO2020001270A1 WO 2020001270 A1 WO2020001270 A1 WO 2020001270A1 CN 2019090792 W CN2019090792 W CN 2019090792W WO 2020001270 A1 WO2020001270 A1 WO 2020001270A1
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WIPO (PCT)
Prior art keywords
massive mimo
mimo antenna
calibration
filter
radio frequency
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PCT/CN2019/090792
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English (en)
French (fr)
Inventor
刘培涛
陈礼涛
李明超
赖展军
黄明达
李轶帆
苏国生
段红彬
丁海
范颂东
Original Assignee
京信通信系统(中国)有限公司
京信通信技术(广州)有限公司
京信通信系统(广州)有限公司
天津京信通信系统有限公司
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Application filed by 京信通信系统(中国)有限公司, 京信通信技术(广州)有限公司, 京信通信系统(广州)有限公司, 天津京信通信系统有限公司 filed Critical 京信通信系统(中国)有限公司
Publication of WO2020001270A1 publication Critical patent/WO2020001270A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • the present invention relates to the field of wireless communication technologies, and in particular, to a MASSIVE MIMO antenna.
  • MASSIVE MIMO massive multiple-input multiple-output
  • a cavity filter is usually installed on the back of the antenna.
  • the input port of the filter is connected to the signal receiving / transmitting circuit module of the base station device, and the output port is connected to the antenna port.
  • a MASSIVE MIMO antenna includes:
  • a calibration module including:
  • a calibration network formed on the PCB includes a calibration port, a plurality of main signal channels, and a plurality of coupled signal channels, and output ends of the plurality of main signal channels are electrically connected to the plurality of radiating units in a one-to-one correspondence;
  • a plurality of filters and a plurality of radio frequency connectors provided on the PCB the input ends of the plurality of main signal channels and the output ends of the plurality of filters are electrically connected one-to-one correspondingly, and the plurality of The output end of the radio frequency connector is electrically connected to the input ends of the plurality of filters in a one-to-one correspondence.
  • the calibration network includes a power divider and a plurality of directional couplers, and each of the directional couplers forms one of the main signal channel and one of the coupled signal channels. A common end forms the calibration port.
  • the calibration module further includes a second radio frequency connector, and the second radio frequency connector is electrically connected to a common end of the power divider to form the calibration port.
  • the line type of the calibration network is a microstrip line or a strip line.
  • the filter is a dielectric filter.
  • a circuit matching load is electrically connected to an output end of the coupled signal channel.
  • the PCB has a ground layer, and the calibration network, the filter, and the radio frequency connector are all electrically connected to the ground layer.
  • the filter and the radio frequency connector are disposed on the PCB board by a surface mount technology, and a plurality of metallized vias are formed on the surface of the PCB board to enable the filter And the radio frequency connector is electrically connected to the ground layer.
  • the plurality of filters and the corresponding plurality of radio frequency connectors form two sets of queues, and the two sets of queues are symmetrically distributed on a surface of the PCB.
  • it further includes a reflection plate, the plurality of radiation units are disposed on a surface of the reflection plate, and the calibration module is disposed on a side of the reflection plate facing away from the plurality of radiation units.
  • the above-mentioned MASSIVE MIMO antenna has at least the following advantages:
  • the calibration network, filter and RF connector are integrated on the PCB, so the MASSIVE MIMO antenna does not need an external filter during use.
  • the calibration network, filter, and RF connector are integrated through the PCB board, making the structure of the calibration module more compact. Therefore, the miniaturization of the above MASSIVE MIMO antenna is higher, which is beneficial to the miniaturization of the communication base station;
  • the filter and calibration network are integrated design, the matching performance of the electrical parameters of the two cascaded components can be fully considered during the design. Therefore, the electrical parameter matching performance can be optimized as much as possible, so as to achieve the optimal interconnection design of filter performance and antenna performance.
  • FIG. 1 is a schematic structural diagram of a MASSIVE MIMO antenna in a preferred embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a calibration module in the MASSIVE MIMO antenna shown in FIG. 1;
  • FIG. 3 is a partially enlarged view of the calibration module shown in FIG. 2.
  • the present invention provides a communication base station and a MASSIVE MIMO antenna 100.
  • the communication base station includes a signal transmitting and receiving device (not shown) and a MASSIVE MIMO antenna 100.
  • the signal transceiving device includes a transmitting end and a receiving end.
  • the MASSIVE MIMO antenna 100 is electrically connected to the signal transmitting and receiving device, and can radiate electrical signals sent from the transmitting end of the signal transmitting and receiving device, and can also send a feedback signal to the receiving end of the signal transmitting and receiving device.
  • the MASSIVE MIMO antenna 100 in the preferred embodiment of the present invention includes a reflection plate 110, a radiation unit 120, and a calibration module 130.
  • the reflecting plate 110 is generally a sheet metal structure formed of a metal material, and plays a role of reflecting electromagnetic wave signals and supporting it.
  • the edge of the reflecting plate 110 generally has a folded edge, which can improve the efficiency of signal transmission and reception.
  • the reflection plate 110 may have a shape such as a circle, a rectangle, and the like. Specifically, in this embodiment, the reflecting plate 110 is in an elongated shape.
  • Each radiating unit 120 can independently radiate and receive low-frequency or high-frequency signals.
  • the plurality of radiation units 120 are disposed on a surface of the reflection plate 110. Specifically, the radiating units 120 may be fixed on the reflecting plate 110 by welding, snapping or the like, and a plurality of radiating units 120 may be arranged in an array on the surface of the reflecting plate 110.
  • the calibration module 130 is disposed on a side of the reflective plate 110 facing away from the radiation unit 120. Specifically, the calibration module 130 is a functional module integrated with filtering and calibrating the signals of each radiating unit 120.
  • the calibration module 130 includes a PCB board 131, a calibration network 133, a filter 135, and a radio frequency connector 137.
  • the PCB board 131 functions as a carrier, and its shape can match the shape of the reflective plate 110.
  • a preset circuit is formed on the PCB board 131. Specifically, a strip line or a microstrip line is formed on the PCB board 131, so that the electrical components installed on the PCB board 131 can be electrically connected.
  • the surface of the PCB board 131 can function similarly to the reflection board 110. Therefore, in other embodiments, the reflection plate 110 may be omitted, and the plurality of radiation units 120 may be directly mounted on the surface of the PCB.
  • the calibration network 133 is formed on the PCB board 131 and plays a role of calibrating the signals of the respective radiation units 120.
  • the line type of the calibration network 133 is a microstrip line or a strip line.
  • the calibration network 133 includes a calibration port 1331, a plurality of main signal channels 1333, and a plurality of coupled signal channels 1335.
  • the output terminals of the plurality of main signal channels 1333 are electrically connected to the plurality of radiating units 120 in a one-to-one correspondence.
  • the number of main signal channels 1333 is not less than the number of radiating units 120, and one main signal channel 1333 corresponds to one radiating unit 120, respectively.
  • the electrical signal sent by the signal transceiving device can be transmitted to the corresponding radiation unit 120 through the output terminal of the main signal channel 1333.
  • the calibration network 133 includes a power divider 1332 and a plurality of directional couplers 1334.
  • Each directional coupler 1334 forms a main signal channel 1333 and a coupled signal channel 1335, and the common end of the power divider 1332 forms a calibration port 1331.
  • the power divider 1332 may be a multi-stage Wilkinson power divider, which includes a common terminal and multiple branches, and each branch is electrically connected to an input terminal of a coupled signal channel 1335, respectively.
  • the main signal channel 1333 is used to transmit the radio frequency signal of the MASSIVE MIMO antenna 100;
  • the coupling signal channel 1335 is used to transmit the radio frequency signal coupled by the directional coupler 1334, and transmitted to the calibration port 1331 through the power divider 1332, so as to realize the antenna port
  • the radiating unit 120 corresponds to an antenna port) monitoring of radio frequency signals.
  • a circuit matching load 1336 is electrically connected to an output end of the coupled signal path 1335.
  • the circuit matching load 1336 is used to match the circuit and absorb the power energy transmitted to the end of the circuit, so that the circuit has a smaller standing wave.
  • each of the filter 135 and the radio frequency connector 137 is plural.
  • the filter 135 is a dielectric filter 135.
  • the dielectric filter has the advantages of small size and light weight.
  • the dielectric filter is electrically connected to the PCB 131, there is no need to add additional interconnection joints, and the interconnection can be directly connected through soldering through the PCB pads.
  • the filter 135 and the radio frequency connector 137 are disposed on the PCB board 131 and are electrically connected through the PCB board 131.
  • the filter 135 and the radio frequency connector 137 are generally disposed on the PCB board 131 through a surface mount technology (SMT technology), and can be connected to the PCB board 131 by using a blind plug connector.
  • SMT technology surface mount technology
  • each filter 135 is connected in series with the corresponding RF connector 137 and the calibration network 133 in order to form an antenna channel.
  • Each radiating unit 120 corresponds to one antenna channel, that is, the number of antenna channels is equal to the number of radiating units 120.
  • each antenna channel includes a radio frequency connector 137, a filter 135, and a common calibration network 133.
  • the receiving end of the signal transceiving device is electrically connected to the calibration port 1331.
  • the transmitting end of the signal transceiving device is electrically connected to the input ends of the plurality of radio frequency connectors 137.
  • the signal transceiving device may be electrically connected to the radio frequency connecting machine 137 and the calibration port 1331 through a blind-plug type connector.
  • the radio frequency signal sent by the transmitting end of the signal transmitting and receiving device enters the radio frequency connector 137, and after filtering out the noise through the filter 135, it passes through the output end of the main signal channel 1333 of the calibration network 133 and enters the corresponding
  • the radiating unit 120 radiates to space through the radiating unit 120; at the same time, the coupling signal channel 1335 of the calibration network 133 couples the radio frequency signal passing through the main signal channel 1333, and the coupled signal enters the phase through the output terminal of the coupling signal channel 1335
  • the connected power divider 1332 reaches the calibration port 1331 and is finally received by the receiving end of the signal transceiver.
  • the MASSIVE MIMO antenna 100 Since the calibration network 133, the filter 135, and the RF connector 137 are integrated on the PCB 131, the MASSIVE MIMO antenna 100 does not need an external filter during use. In addition, the calibration network 133, the filter 135, and the radio frequency connector 137 are integrated through the PCB board 131, so that the structure of the calibration module 130 is more compact. Therefore, the above-mentioned MASSIVE MIMO antenna 100 has a higher degree of miniaturization, which is beneficial to miniaturization of a communication base station.
  • the filter 135 and the calibration network 133 are an integrated design, the matching performance of the electrical parameters of the two cascaded components can be fully considered in the design. Therefore, the electrical parameter matching performance can be optimized as much as possible, so as to realize the optimal interconnection design of the performance of the filter 135 and the performance of the antenna.
  • the calibration module 130 further includes a second radio frequency connector 139.
  • the second radio frequency connector 139 is electrically connected to the common end of the power divider 1332 to form a calibration port 1331.
  • the PCB 131 has a ground layer (not shown), and the calibration network 133, the filter 135, and the RF connector 137 are all electrically connected to the ground layer.
  • the calibration network 133, the filter 135, and the radio frequency connector 137 are implemented in common through the ground layer of the PCB 131. Therefore, there is no need to separately design the ground structure, so the structure of the calibration module 130 can be simplified, thereby further improving the miniaturization of the MASSIVE MIMO antenna 100.
  • a plurality of metallized vias are formed on the surface of the PCB board 131 to electrically connect the filter 135 and the RF connector 137 to the ground layer.
  • the metalized via is a conductive structure formed by punching a hole in the PCB 131 first, and then filling the hole with liquid metal and solidifying. Moreover, the metallized vias communicate with the surface of the PCB board 131 and the ground layer.
  • the filter 135 and the RF connector 137 are generally set by SMT technology, welding and fixing are required after the positioning.
  • the position of the metal via is generally located at the pad, so that the filter 135 and the RF connector 137 can be electrically connected to the ground layer after the installation is completed. It can be seen that the filter 135 and the RF connector 137 can be grounded through the metalized via without additional wiring, thereby making the calibration module 130 compact in structure and further improving the miniaturization of the MASSIVE MIMO antenna 100.
  • the multiple filters 135 and the corresponding multiple RF connectors 137 form two sets of queues, and the two sets of queues are symmetrically distributed on the surface of the PCB 131. Therefore, the plurality of filters 135 and the plurality of radio frequency connectors 137 are more compactly arranged on the PCB board 131, so the volume of the calibration module 130 can be reduced.
  • the plurality of radiating units 120 can also be arranged in a symmetrical manner during the setting, which is beneficial to reducing the volume of the MASSIVE MIMO antenna 100.
  • the filter 135 and the radio frequency connector 137 are disposed on a surface of the PCB board 131 facing the reflective plate 110.
  • a receiving cavity may be formed between the PCB board 131 and the reflective plate 130, and the receiving cavity may provide protection for the filter 135 and the RF connector 137.
  • a configuration makes the structure of the MASSIVE MIMO antenna 100 more compact, which is more conducive to the miniaturization of the MASSIVE MIMO antenna 100.
  • a calibration network 133, a filter 135, and a radio frequency connector 137 are integrated on the PCB 131, so the calibration module 130 has a function of signal calibration and filtering at the same time. Therefore, the MASSIVE MIMO antenna 100 does not need an external filter during use.
  • the calibration network 133, the filter 135, and the radio frequency connector 137 are integrated through the PCB board 131, so that the structure of the calibration module 130 is more compact. Therefore, the miniaturization degree of the MASSIVE MIMO antenna is higher, so that the communication base station is miniaturized.
  • the filter 135 and the calibration network 133 are an integrated design, the matching performance of the electrical parameters of the two cascaded components can be fully considered in the design. Therefore, the electrical parameter matching performance can be optimized as much as possible, so as to realize the optimal interconnection design of the performance of the filter 135 and the performance of the antenna.

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Abstract

本发明涉及一种MASSIVE MIMO天线,MASSIVE MIMO天线包括反射板、多个辐射单元及校准模块。校准模块的PCB板上集成有校准网络、滤波器及射频连接器,故校准模块同时具有信号校准及滤波的功能。因此,MASSIVE MIMO天线在使用过程中无需外置滤波器。而且,校准网络、滤波器及射频连接器通过PCB板实现集成,使得校准模块的结构更紧凑。因此,上述MASSIVE MIMO天线的小型化程度更高,使得上述通信基站实现小型化。此外,由于滤波器与校准网络为一体化的设计,故设计时可充分考虑两个级联部件的电气参数的匹配性能。因此,电气参数匹配性能可尽可能优化,从而实现滤波器性能与天线性能的最优互连设计。

Description

MASSIVE MIMO天线 技术领域
本发明涉及无线通信技术领域,特别涉及一种MASSIVE MIMO天线。
背景技术
移动通信从4G向5G不断发展演进,MASSIVE MIMO(大规模多入多出)天线得到广泛应用。在传统的大规模MIMO天线中,通常需在天线背面安装有腔体滤波器,滤波器的输入端口连接基站设备的信号收/发电路模块,输出端口连接天线端口。
而随着移动通信的发展、网络覆盖的深入,导致站点资源愈发紧张,故对基站设备小型化、轻量化提出了更高的要求。然而,现有的基站天线中,由于需要外置与天线端口数量相同的滤波器,故将导致传统基站天线的体积增加,不利于基站的小型化。
发明内容
基于此,有必要针对现有基站天线体积较大的问题,提供一种小型化程度较高的MASSIVE MIMO天线。
一种MASSIVE MIMO天线,包括:
多个辐射单元;及
校准模块,所述校准模块包括:
PCB板;
形成于所述PCB板的校准网络,包括校准端口、多个主信号通道及多个耦 合信号通道,所述多个主信号通道的输出端与所述多个辐射单元一一对应地电连接;
设置于所述PCB板上的多个滤波器及多个射频连接器,所述多个主信号通道的输入端与所述多个滤波器的输出端一一对应地电连接,所述多个射频连接器的输出端与所述多个滤波器的输入端一一对应地电连接。
在其中一个实施例中,所述校准网络包括功分器及多个定向耦合器,每个所述定向耦合器形成一个所述主信号通道及一个所述耦合信号通道,所述功分器的公共端形成所述校准端口。
在其中一个实施例中,所述校准模块还包括第二射频连接器,所述第二射频连接器与所述功分器的公共端电连接以形成所述校准端口。
在其中一个实施例中,所述校准网络的线路类型为微带线或带状线。
在其中一个实施例中,所述滤波器为介质滤波器。
在其中一个实施例中,所述耦合信号通道的输出端电连接有电路匹配负载。
在其中一个实施例中,所述PCB板具有接地层,所述校准网络、所述滤波器及所述射频连接器均与所述接地层电连接。
在其中一个实施例中,所述滤波器及所述射频连接器通过表面贴装技术设置于所述PCB板,所述PCB板的表面形成有多个金属化过孔,以使所述滤波器及所述射频连接器与所述接地层电连接。
在其中一个实施例中,所述多个滤波器与对应的所述多个射频连接器形成两组队列,且所述两组队列对称分布于所述PCB板的表面。
在其中一个实施例中,还包括反射板,所述多个辐射单元设置于所述反射板的表面,所述校准模块设置于所述反射板背向所述多个辐射单元的一侧。
与现有技术相比,上述MASSIVE MIMO天线至少具有以下优势:
1、PCB板上集成有校准网络、滤波器及射频连接器,故MASSIVE MIMO天线在使用过程中无需外置滤波器。而且,校准网络、滤波器及射频连接器通过PCB板实现集成,使得校准模块的结构更紧凑。因此,上述MASSIVE MIMO天线的小型化程度更高,有利于实现通信基站的小型化;
2、由于滤波器与校准网络为一体化的设计,故设计时可充分考虑两个级联部件的电气参数的匹配性能。因此,电气参数匹配性能可尽可能优化,从而实现滤波器性能与天线性能的最优互连设计。
附图说明
图1为本发明较佳实施例中MASSIVE MIMO天线的结构示意图;
图2为图1所示MASSIVE MIMO天线中校准模块的结构示意图;
图3为图2所示校准模块的局部放大图。
具体实施方式
为了便于理解本发明,下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是,本发明可以以许多不同的形式来实现,并不限于本文所描述的实施例。相反地,提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是,当元件被称为“固定于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术 领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图1,本发明提供了一种通信基站及MASSIVE MIMO天线100。其中,通信基站包括信号收发装置(图未示)及MASSIVE MIMO天线100。信号收发装置包括发射端及接收端。而且,MASSIVE MIMO天线100与该信号收发装置电连接,可将由信号收发装置的发射端发出的电信号进行辐射,也可将反馈信号发送至信号收发装置的接收端。
请一并参阅图2及图3,本发明较佳实施例中的MASSIVE MIMO天线100包括反射板110、辐射单元120及校准模块130。
反射板110一般为由金属材料成型的钣金结构,起到反射电磁波信号以及支撑的作用。反射板110的边缘一般具有折边,可提升信号收发的效率。反射板110可以呈圆形、矩形等形状。具体在本实施例中,反射板110呈长条形。
辐射单元120为多个,用于实现多输入多输出。每个辐射单元120均可单独进行低频或高频信号的辐射及接收。多个辐射单元120设置于反射板110表面。具体的,辐射单元120可以通过焊接、卡接等方式固定于反射板110上,且多个辐射单元120在反射板110的表面可呈阵列排布。
校准模块130设置于反射板110背向辐射单元120一侧。具体的,校准模块130为集成有滤波及对各个辐射单元120的信号进行校准的功能模块。其中,校准模块130包括PCB板131、校准网络133、滤波器135及射频连接器137。
PCB板131起载体作用,其形状可与反射板110的形状相匹配。PCB板131上形成有预设电路。具体的,PCB板131上形成有带状线或微带线,从而可使安装于PCB板131上的电气元件实现电连接。
需要指出的是,PCB板131的表面可起到类似反射板110的功能。因此,在其他实施例中,反射板110可省略,而将多个辐射单元120直接安装于PCB板的表面。
校准网络133形成于PCB板131,起对各个辐射单元120的信号进行校准的作用。具体在本实施例中,校准网络133的线路类型为微带线或带状线。进一步的,校准网络133包括校准端口1331、多个主信号通道1333及多个耦合信号通道1335。多个主信号通道1333的输出端与多个辐射单元120一一对应地电连接。具体的,主信号通道1333的数量不少于辐射单元120的数量,一个主信号通道1333分别对应一个辐射单元120。
其中,信号收发装置发出的电信号可经主信号通道1333的输出端输送至对应的辐射单元120。
在本实施例中,校准网络133包括功分器1332及多个定向耦合器1334。每个定向耦合器1334形成一个主信号通道1333及一个耦合信号通道1335,功分器1332的公共端形成校准端口1331。
其中,功分器1332可以为多级威尔金森功分器,其包括一个公共端及多个分支,每个分支分别与一个耦合信号通道1335的输入端电连接。主信号通道1333用于传输MASSIVE MIMO天线100的射频信号;耦合信号通道1335用于传输定向耦合器1334耦合到的射频信号,通过功分器1332传到校准端口1331,实现对天线各个端口(一个辐射单元120对应一个天线端口)射频信号的监控。
在本实施例中,耦合信号通道1335的输出端电连接有电路匹配负载1336。其中,电路匹配负载1336用于匹配电路,吸收传输到电路末端的功率能量,使得电路具有较小的驻波。
滤波器135及射频连接器137均为多个。具体在本实施例中,滤波器135 为介质滤波器135。其中,介质滤波器具有体积小、重量轻的优点。而且,介质滤波器与PCB板131电连接时不需要额外增加互连接头,可直接通过PCB焊盘通过焊接互连。
滤波器135及射频连接器137设置于PCB板131上,并通过PCB板131实现电连接。具体的,滤波器135及射频连接器137一般通过表面贴装技术(SMT技术)设置于PCB板131,并可采用盲插型接头与PCB板131实现对接。
其中,多个主信号通道1333的输入端与多个滤波器135的输出端一一对应地电连接,多个射频连接器137的输出端与多个滤波器135的输入端一一对应地电连接。因此,每个滤波器135与对应的射频连接器137及校准网络133依次串联,形成一个天线通道。每个辐射单元120对应一个天线通道,即天线通道的数量等于辐射单元120的数量。而且,每个天线通道包括一个射频连接器137、滤波器135及共用的校准网络133。
在上述通信基站中,信号收发装置的接收端与校准端口1331电连接。信号收发装置的发射端与多个射频连接器137的输入端电连接。具体的,信号收发装置可通过盲插型接头与射频连机器137及校准端口1331实现电连接。
通信基站工作时,由信号收发装置的发射端发出的射频信号进入到射频连接器137,并经过滤波器135滤掉杂波后,再经过校准网络133的主信号通道1333的输出端进入对应的辐射单元120并经辐射单元120向空间辐射;同时,校准网络133的耦合信号通道1335耦合了经过主信号通道1333的射频信号,耦合到的信号经过耦合信号通道1335的输出端进入到与之相联的功分器1332并达校准端口1331,并最终被信号收发装置的接收端所接收。
由于PCB板131上集成有校准网络133、滤波器135及射频连接器137,故MASSIVE MIMO天线100在使用过程中无需外置滤波器。而且,校准网络133、 滤波器135及射频连接器137通过PCB板131实现集成,使得校准模块130的结构更紧凑。因此,上述MASSIVE MIMO天线100的小型化程度更高,有利于实现通信基站的小型化。
此外,由于滤波器135与校准网络133为一体化的设计,故设计时可充分考虑两个级联部件的电气参数的匹配性能。因此,电气参数匹配性能可尽可能优化,从而实现滤波器135性能与天线性能的最优互连设计。
在本实施例中,校准模块130还包括第二射频连接器139。第二射频连接器139与功分器1332的公共端电连接以形成校准端口1331。
在本实施例中,PCB板131具有接地层(图未示),校准网络133、滤波器135及射频连接器137均与接地层电连接。
由于校准网络133、滤波器135及射频连接器137通过PCB板131的接地层实现共地设置。因此,无需分别单独设计接地结构,故可使校准模块130的结构简单,从而进一步提升MASSIVE MIMO天线100的小型化程度。
进一步的,在本实施中,PCB板131的表面形成有多个金属化过孔(图未示),以使滤波器135及射频连接器137与接地层电连接。
具体的,金属化过孔即先在PCB板131上打孔,再向孔内填充液态金属并凝固而形成的导电结构。而且,金属化过孔连通PCB板131的表面与接地层。
由于滤波器135及射频连接器137一般通过SMT技术进行设置,在贴装定位后还需进行焊接固定。其中,金属过孔的位置一般位于焊盘处,从而使得滤波器135及射频连接器137安装完成便可与接地层实现电连接。可见,通过金属化过孔无需额外走线更可使滤波器135及射频连接器137实现接地,从而使得校准模块130结构紧凑,可再一步提升MASSIVE MIMO天线100的小型化程度。
在本实施例中,多个滤波器135与对应的多个射频连接器137形成两组队列,且两组队列对称分布于PCB板131的表面。因此,多个滤波器135及多个射频连接器137在PCB板131上排列更紧凑,故可减小校准模块130的体积。而且,多个辐射单元120在设置时也可按照对称的方式设置,从而有利于减小MASSIVE MIMO天线100的体积。
在本实施例中,滤波器135及射频连接器137设置于PCB板131朝向反射板110的表面。
具体的,PCB板131与反射板130之间可形成一个收容腔,收容腔可对滤波器135及射频连接器137提供保护。而且,如此设置使得MASSIVE MIMO天线100的结构更紧凑,更有利于MASSIVE MIMO天线100实现小型化。
上述MASSIVE MIMO天线100,PCB板131上集成有校准网络133、滤波器135及射频连接器137,故校准模块130同时具有信号校准及滤波的功能。因此,MASSIVE MIMO天线100在使用过程中无需外置滤波器。而且,校准网络133、滤波器135及射频连接器137通过PCB板131实现集成,使得校准模块130的结构更紧凑。因此,上述MASSIVE MIMO天线的小型化程度更高,使得上述通信基站实现小型化。此外,由于滤波器135与校准网络133为一体化的设计,故设计时可充分考虑两个级联部件的电气参数的匹配性能。因此,电气参数匹配性能可尽可能优化,从而实现滤波器135性能与天线性能的最优互连设计。
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细, 但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种MASSIVE MIMO天线,其特征在于,包括:
    多个辐射单元;及
    校准模块,所述校准模块包括:
    PCB板;
    形成于所述PCB板的校准网络,包括校准端口、多个主信号通道及多个耦合信号通道,所述多个主信号通道的输出端与所述多个辐射单元一一对应地电连接;
    设置于所述PCB板上的多个滤波器及多个射频连接器,所述多个主信号通道的输入端与所述多个滤波器的输出端一一对应地电连接,所述多个射频连接器的输出端与所述多个滤波器的输入端一一对应地电连接。
  2. 根据权利要求1所述的MASSIVE MIMO天线,其特征在于,所述校准网络包括功分器及多个定向耦合器,每个所述定向耦合器形成一个所述主信号通道及一个所述耦合信号通道,所述功分器的公共端形成所述校准端口。
  3. 根据权利要求2所述的MASSIVE MIMO天线,其特征在于,所述校准模块还包括第二射频连接器,所述第二射频连接器与所述功分器的公共端电连接以形成所述校准端口。
  4. 根据权利要求1所述的MASSIVE MIMO天线,其特征在于,所述校准网络的线路类型为微带线或带状线。
  5. 根据权利要求1所述的MASSIVE MIMO天线,其特征在于,所述滤波器为介质滤波器。
  6. 根据权利要求1所述的MASSIVE MIMO天线,其特征在于,所述耦合信号通道的输出端电连接有电路匹配负载。
  7. 根据权利要求1所述的MASSIVE MIMO天线,其特征在于,所述PCB板具有接地层,所述校准网络、所述滤波器及所述射频连接器均与所述接地层电连接。
  8. 根据权利要求7所述的MASSIVE MIMO天线,其特征在于,所述滤波器及所述射频连接器通过表面贴装技术设置于所述PCB板,所述PCB板的表面形成有多个金属化过孔,以使所述滤波器及所述射频连接器与所述接地层电连接。
  9. 根据权利要求1所述的MASSIVE MIMO天线,其特征在于,所述多个滤波器与对应的所述多个射频连接器形成两组队列,且所述两组队列对称分布于所述PCB板的表面。
  10. 根据权利要求1所述的MASSIVE MIMO天线,其特征在于,还包括反射板,所述多个辐射单元设置于所述反射板的表面,所述校准模块设置于所述反射板背向所述多个辐射单元的一侧。
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