WO2020255597A1 - Module de batterie solaire - Google Patents

Module de batterie solaire Download PDF

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Publication number
WO2020255597A1
WO2020255597A1 PCT/JP2020/019287 JP2020019287W WO2020255597A1 WO 2020255597 A1 WO2020255597 A1 WO 2020255597A1 JP 2020019287 W JP2020019287 W JP 2020019287W WO 2020255597 A1 WO2020255597 A1 WO 2020255597A1
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WO
WIPO (PCT)
Prior art keywords
layer
bus bar
solar cell
interface
electrode portion
Prior art date
Application number
PCT/JP2020/019287
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English (en)
Japanese (ja)
Inventor
雄太 南
Original Assignee
株式会社カネカ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社カネカ filed Critical 株式会社カネカ
Priority to JP2021527464A priority Critical patent/JP7514233B2/ja
Publication of WO2020255597A1 publication Critical patent/WO2020255597A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a solar cell module.
  • a plurality of solar cell cells are electrically connected via a wiring member.
  • bus bar electrode portions and finger electrode portions are provided as collecting electrodes on both sides of each solar cell, and the end portions of wiring members are soldered to the bus bar electrode portions to each solar cell. The cells are connected.
  • a solar cell is sandwiched between EVA sheets, and the outside of the EVA sheet is sandwiched between a base material such as a glass substrate or a back sheet to seal the solar cells.
  • a base material such as a glass substrate or a back sheet to seal the solar cells.
  • the base material and the EVA sheet are peeled off and disassembled to identify the cause of the defect.
  • the adhesive strength between the bus bar electrode portion which is a part of the collecting electrode and the base layer which is the base of the bus bar electrode portion is the bus bar electrode. It is small compared to the adhesive strength between the part and the EVA sheet.
  • the bus bar electrode portion may be pulled by the EVA sheet and peeled off from the base layer. If the bus bar electrode portion is peeled off from the base layer, it is not possible to inspect the energization or the like, and there is a problem that the cause of the defect such as the initial defect cannot be identified.
  • an object of the present invention is to provide a solar cell module in which the bus bar electrode portion is less likely to be peeled off when the base material or the sealing material is peeled off.
  • a solar cell module the solar cell has a front electrode layer, a back electrode layer, a photoelectric conversion portion sandwiched between the front electrode layer and the back electrode layer, and the front electrode layer and the front electrode layer.
  • a bus bar electrode portion is provided on at least one electrode layer of the back side electrode layer, the wiring member is adhered to the bus bar electrode portion via a solder layer, and the solar cell is interfacially peeled.
  • the interface peeling layer has a layer, and when the solar cell is viewed in cross section, it covers at least a part of the side surface of the bus bar electrode portion, and further extends to the one electrode layer, and the bus bar electrode portion.
  • the adhesive strength at the interface between the sealing material and the interface peeling layer is larger than the adhesive strength at the interface between the sealing material and the interface peeling layer, and the adhesive strength at the interface between the sealing material and the interface peeling layer is the one electrode.
  • a solar cell module having a strength greater than the adhesive strength at the interface between the layer and the interface peeling layer.
  • the adhesive strength at the interface between the bus bar electrode portion and the interface peeling layer is larger than the adhesive strength at the interface between the sealing material and the interface peeling layer. Therefore, when the base material and the sealing material are peeled off, the interface The release layer is hung by the sealing material and self-destructs and partially peels off, or the interface between the sealing material and the interface release layer is peeled off preferentially as compared with the interface between the bus bar electrode portion and the interface release layer. Further, according to this aspect, the adhesive strength at the interface between the sealing material and the interface peeling layer is larger than the adhesive strength at the interface between one electrode layer and the interface peeling layer, so that when the base material and the sealing material are peeled off.
  • the interface between one electrode layer and the interface peeling layer is preferentially peeled off as compared with the interface between the sealing material and the interface peeling layer. That is, according to this aspect, when the base material and the sealing material are peeled off, the interface between the interface peeling layer and one electrode layer is formed in the portion extending from the side surface of the bus bar electrode portion of the interface peeling layer to one electrode layer. On the bus bar electrode portion, it is peeled off at the interface between the bus bar electrode portion and the interface peeling layer. Therefore, the base material and the sealing material can be peeled off without the bus bar electrode portion being peeled off from one electrode portion. As a result, the bus bar electrode portion is less likely to be broken due to being pulled by the encapsulant, and initial defects and the like can be evaluated with the base material and the encapsulant peeled off.
  • interfacial peeling layer extends from the side surface of the bus bar electrode portion to a range of 0.5 times or more the width of the bus bar electrode portion on the one electrode layer.
  • a more preferable aspect is that the interface peeling layer extends from the side surface of the bus bar electrode portion to a range of 1.5 times or more the width of the bus bar electrode portion on the one electrode layer.
  • one of the electrode layers is made of a transparent conductive oxide.
  • the delamination layer is a flux layer containing a rosin compound, and the halide content of the flux component is 0.5 wt% or less.
  • the grade equivalent to JIS Z 3283: 2006 is A or AA
  • the interfacial exfoliation layer is composed of a flux with medium or low activity, so that corrosion of one of the underlying electrode layers is suppressed. Or it can be prevented.
  • the preferred aspect is that the bus bar electrode portion is wider than the solder layer, and the interface peeling layer is exposed from the solder layer of the bus bar electrode portion when the solar cell is viewed in cross section. It covers the part.
  • the width of the bus bar electrode portion is wider than the width of the solder layer, the solder stays at the bus bar electrode portion when forming the solder layer and does not come into contact with one of the electrode layers. Therefore, one of the electrode layers is unlikely to become hot due to the formation of the solder layer.
  • the interface peeling layer covers the exposed portion of the bus bar electrode portion, the bus bar electrode portion is difficult to peel off from one electrode layer, and when the base material or the sealing material is peeled off, the bus bar electrode portion Easy to peel off leaving.
  • a preferred aspect is a battery module that receives light from the front side electrode layer side to generate power with reference to the photoelectric conversion part, and the front side electrode layer and the back side electrode layer are provided with a bus bar electrode part.
  • the bus bar electrode portion of the back side electrode layer is wider than the bus bar electrode portion of the front side electrode layer.
  • the width of the back side electrode layer is wider than the width of the front side electrode layer on the light receiving side, a sufficient area of the back side electrode layer can be secured, and the resistance loss in the back side electrode layer can be suppressed.
  • the sealing material contains a sealing sheet and the bus bar electrode portion is formed of a thin film.
  • the conventional solar cell module is sealed by sandwiching the solar cell between a sealing sheet such as an EVA sheet, even if it seems to be in close contact with each other, it can be sealed accurately. It may not be.
  • air, water, or the like enters between the sealing sheet and its adhesive surface to generate voids, and the sealing sheet floats.
  • the bus bar electrode portion is formed of a thin film as in this aspect, the rigidity of the bus bar electrode portion itself is smaller than that of the case where the bus bar electrode portion is formed of a bulk material.
  • the adhesive strength at the interface between the bus bar electrode portion and the interface peeling layer is larger than the adhesive strength at the interface between the sealing material and the interface peeling layer, so that the sealing material floats.
  • the interface peeling layer is coagulated and broken inside before the interface between the bus bar electrode portion and the interface peeling layer, or is peeled off at the interface with the sealing material. Therefore, the force generated by the floating of the sealing material is released, and it is possible to prevent the bus bar electrode portion from peeling off from the underlying electrode layer.
  • the preferred aspect is that the bus bar electrode portion stays on the one electrode layer when the sealing material is peeled off.
  • the bus bar electrode part does not peel off from one electrode layer, and the reliability is high.
  • a preferred aspect is that a second interface peeling layer is interposed between the wiring member and the sealing material, and the adhesive strength between the wiring member and the bus bar electrode portion is such that the second interface peeling layer and the sealing material are sealed. It is greater than the adhesive strength with the material.
  • One aspect of the present invention is a solar cell module in which a solar cell and a wiring member are arranged between two base materials, and the space between the two base materials is filled with a sealing material.
  • the solar cell has a photoelectric conversion unit, a bus bar electrode portion is provided on the photoelectric conversion portion, and the wiring member is adhered to the bus bar electrode portion via a solder layer.
  • the solar cell has an interfacial exfoliation layer containing a rosin compound, and the interfacial exfoliation layer covers at least a part of the side surface of the bus bar electrode portion when the solar cell is viewed in cross section, and further, the photoelectric conversion
  • the adhesive strength between the bus bar electrode portion and the interface peeling layer is larger than the adhesive strength between the sealing material and the interface peeling layer, and the sealing material and the interface peeling layer
  • the adhesive strength of the interface is larger than the adhesive strength of the interface between the photoelectric conversion unit and the interface peeling layer, which is a solar cell module.
  • the adhesive strength at the interface between the bus bar electrode portion and the interface peeling layer is larger than the adhesive strength at the interface between the sealing material and the interface peeling layer. Therefore, when the base material and the sealing material are peeled off, the bus bar The interface between the encapsulant and the interface release layer is preferentially peeled off as compared with the interface between the electrode portion and the interface release layer. According to this aspect, the adhesive strength at the interface between the encapsulant and the interfacial release layer is larger than the adhesive strength at the interface between the photoelectric conversion part and the interfacial release layer. Therefore, when the base material and the encapsulant are peeled off, the seal is sealed.
  • the interface between the photoelectric conversion part and the interface peeling layer is preferentially peeled off as compared with the interface between the stop material and the interface peeling layer. That is, according to this aspect, when the base material is peeled off, the portion extending from the side surface of the bus bar electrode portion of the interface peeling layer to the photoelectric conversion portion is peeled off at the interface between the interface peeling layer and the photoelectric conversion portion, and the bus bar electrode portion.
  • the bus bar electrode portion is peeled off at the interface between the interface peeling layer, the base material can be peeled off without the bus bar electrode portion being peeled off from the photoelectric conversion portion. As a result, the bus bar electrode portion is less likely to be broken due to being pulled by the encapsulant, and initial defects and the like can be evaluated with the base material and the encapsulant peeled off.
  • the bus bar electrode portion is less likely to be peeled off as compared with the conventional case.
  • FIG. 5 is a cross-sectional perspective view of the solar cell string of FIG. 2 as viewed from the front side.
  • FIG. 5 is a cross-sectional perspective view of the solar cell string of FIG. 2 as viewed from the back side. It is an exploded perspective view of the solar cell string of FIG. It is explanatory drawing of the solar cell of FIG. 7, (a) is a front view, and (b) is a rear view. It is sectional drawing which shows the solar cell module immediately after the coating process in the manufacturing process of the solar cell module of FIG. It is sectional drawing which shows the state of the main part of the front side when the base material and the sealing material are peeled off from the solar cell module of FIG. 1, and (a) is orthogonal to the extension direction of the 1st bus bar electrode part of a solar cell module.
  • (B) is a cross section orthogonal to the extension direction of the first bus bar electrode portion of the solar cell module, and represents the situation of the position where it does not pass through the first finger electrode portion. Represents the situation of the position passing through the part. It is sectional drawing which shows the state of the main part of the back side at the time of peeling the base material and the sealing material from the solar cell module of FIG. 1, and (a) is orthogonal to the extension direction of the 1st bus bar electrode part of a solar cell module. (B) is a cross section orthogonal to the extension direction of the first bus bar electrode portion of the solar cell module, and represents the situation of the position where it does not pass through the first finger electrode portion. Represents the situation of the position passing through the part.
  • FIG. 12 is a cross-sectional view orthogonal to the extending direction of the first bus bar electrode portion of the solar cell module of FIG. 12, and is a cross-sectional view at a position passing through the first finger electrode portion. It is sectional drawing which looked at the solar cell string of FIG. 12 from the front side. It is sectional drawing which shows the solar cell module immediately after the coating process in the manufacturing process of the solar cell module of FIG.
  • FIG. 16 is a cross-sectional view orthogonal to the extending direction of the first bus bar electrode portion of the solar cell module when the base material and the sealing material are peeled off from the solar cell module of FIG. 16, at a position not passing through the first finger electrode portion.
  • the situation is represented, (a) represents the front side, and (b) represents the back side.
  • It is sectional drawing which is orthogonal to the extension direction of the 1st bus bar electrode portion of the solar cell module of 4th Embodiment of this invention, and is the sectional view at the position which does not pass through a 1st finger electrode portion.
  • the solar cell module 1 of the first embodiment of the present invention is a heterojunction type solar cell module. As shown in FIGS. 1 and 2, the solar cell module 1 includes a first base material 2, a second base material 3, a solar cell string 5, and sealing materials 6a and 6b. In the solar cell module 1, the outer main surface of the first base material 2 forms a light receiving surface with reference to the photoelectric conversion unit 21 (see FIG. 3) of the solar cell string 5, and the solar cell module 1 receives light from the first base material 2 side and receives the sun. This is a single-sided light receiving type solar cell module that generates electricity with the battery string 5.
  • the first base material 2 is a plate-like or film-like member having a planar spread, and in the present embodiment, is a transparent insulating substrate having translucency and insulation.
  • the first base material 2 is not particularly limited as long as it has translucency and insulating properties, and for example, a glass substrate, a transparent resin substrate, or the like can be used.
  • the second base material 3 is a plate-like or film-like member having a planar spread, and in the present embodiment, is an insulating sheet having an insulating property.
  • the second base material 3 is not particularly limited as long as it has an insulating property, and for example, a glass substrate, a resin sheet, or the like can be used.
  • the solar cell string 5 includes a plurality of solar cells 10, a wiring member 11 connecting the solar cells 10, and a solder layer 12 connecting the solar cells 10 and the wiring member 11. , 13 is provided.
  • the solar cell 10 is a crystalline solar cell, and includes a front electrode layer 20, a photoelectric conversion unit 21, and a back electrode layer 22 as shown in FIGS. 3 and 4. Further, in the solar cell 10, the first collecting electrode 25 and the first interfacial peeling layer 26 are provided on the front electrode layer 20, and the second collecting electrode 35 and the second interfacial peeling layer 36 are provided on the back electrode layer 22. Is provided.
  • the front electrode layer 20 is a transparent conductive layer having translucency and conductivity.
  • the front electrode layer 20 of this embodiment is made of a transparent conductive oxide such as indium tin oxide (ITO) or zinc oxide.
  • the photoelectric conversion unit 21 has a PN junction, and a semiconductor layer is formed on a semiconductor substrate.
  • the solar cell 10 is a crystalline silicon solar cell, in which a monoconductive silicon substrate is used as a support substrate, and a reverse conductive silicon layer or the like is formed on the monoconductive silicon substrate.
  • the "uniconductive type” means that it is either an n-type or a p-type conductive type
  • the "reverse conductive type” means that it is a conductive type opposite to the "uniconductive type”. That is, when the "single conductive type” is n type, the "reverse conductive type” is p type, and when the "uniconductive type” is p type, the "reverse conductive type” is n type.
  • the back side electrode layer 22 is a transparent conductive layer having translucency and conductivity like the front side electrode layer 20.
  • the back electrode layer 22 of the present embodiment is made of a transparent conductive oxide such as indium tin oxide (ITO) or zinc oxide.
  • the first collecting electrode 25 is a comb-shaped electrode that extracts electricity from the front electrode layer 20, and is a thin film-shaped electrode.
  • the first collecting electrode 25 is not particularly limited as long as it has higher conductivity than the front electrode layer 20, and for example, a metal such as gold, silver, copper, or palladium, or a metal alloy can be used.
  • the method for forming the first collecting electrode 25 is not particularly limited, and for example, it can be formed by a printing method, a plating method, or a vapor phase film forming method.
  • the first collecting electrode 25 is preferably formed by a printing method or a vapor phase film forming method from the viewpoint of cost reduction, and is formed by a printing method from the viewpoint of more effectively exerting it. Is more preferable.
  • Examples of the vapor phase film forming method include a CVD method and a sputtering method.
  • the first collecting electrode 25 is composed of a first bus bar electrode portion 40 and a first finger electrode portion 41.
  • the first bus bar electrode portion 40 is a conductive portion extending on the front electrode layer 20 in a predetermined direction (hereinafter, also referred to as a vertical direction Y).
  • the width W1 of the first bus bar electrode portion 40 shown in FIG. 8A is thicker than the width W2 of the first finger electrode portion 41, and is more than twice the width W2 of the first finger electrode portion 41.
  • the width W1 of the first bus bar electrode portion 40 is preferably 0.5 mm or more and 3 mm or less.
  • the first finger electrode portion 41 is a conductive portion extending orthogonally from the first bus bar electrode portion 40 to the first bus bar electrode portion 40 on the front electrode layer 20. That is, the first finger electrode portion 41 extends in the lateral direction X.
  • the first interfacial exfoliation layer 26 is an organic compound layer having translucency and containing a rosin compound as a main component, and is a flux layer in which the flux 70 is cured.
  • the "main component" as used herein means that the proportion of all the components is 50% or more.
  • the first interfacial delamination layer 26 is composed of a flux having a grade of AA or A according to JIS Z 3283: 2006, and the halide content of the flux component is preferably 0.5 wt% or less.
  • the flux 70 preferably contains a rosin compound and an activator.
  • the second collecting electrode 35 is a comb-shaped electrode that extracts electricity from the back side electrode layer 22, and is a thin film-shaped electrode.
  • the second collecting electrode 35 is not particularly limited as long as it has higher conductivity than the back side electrode layer 22, and for example, a metal such as gold, silver, copper, palladium, or a metal alloy can be used.
  • the method for forming the second collection electrode 35 is not particularly limited, and can be formed by, for example, a printing method, a plating method, or a vapor phase method.
  • the second collection electrode 35 is preferably formed by a printing method or a vapor phase method from the viewpoint of cost reduction, and is more preferably formed by a printing method from the viewpoint of more effectively exerting it. preferable.
  • Examples of the vapor phase film forming method include a CVD method and a sputtering method.
  • the second collecting electrode 35 is composed of a second bus bar electrode portion 50 and a second finger electrode portion 51.
  • the second bus bar electrode portion 50 is a conductive portion extending in the vertical direction Y on the back side electrode layer 22.
  • the width W3 of the second bus bar electrode portion 50 shown in FIG. 8B is thicker than the width W4 of the second finger electrode portion 51, and is four times or more the width W4 of the second finger electrode portion 51.
  • the width W3 of the second bus bar electrode portion 50 is preferably 1 mm or more and 3 mm or less.
  • the second finger electrode portion 51 is a conductive portion extending perpendicularly from the second bus bar electrode portion 50 to the second bus bar electrode portion 50 on the back side electrode layer 22. That is, the second finger electrode portion 51 extends in the lateral direction X.
  • the second interfacial exfoliation layer 36 is an organic compound layer having translucency and containing a rosin compound as a main component, and is a flux layer in which the flux 70 is cured.
  • the second interfacial exfoliation layer 36 of the present embodiment is composed of a flux having a grade of AA or A according to JIS Z 3283: 2006, and the halide content of the flux component is 0. It is preferably 5.5 wt% or less.
  • the wiring member 11 is a so-called interconnector, and as shown in FIG. 7, is a long member having a certain thickness and extending in a predetermined direction. As shown in the enlarged view of FIG. 7, the wiring member 11 is a conductor having the solder 71 formed on the surface thereof, and the solder 71 is formed on the outer surface of the conductive core material 72. The thickness of the wiring member 11 is thicker than that of the thin film collector electrodes 25 and 35, and it is difficult to bend. As shown in FIG. 7, the wiring member 11 includes connector portions 60 and 61 and a connection portion 62. The connector portions 60 and 61 are portions that can be connected to the bus bar electrode portions 40 and 50 of the solar cell 10. The connection portion 62 is a portion that connects the first connector portion 60 and the second connector portion 61.
  • the solder layers 12 and 13 are adhesive layers that physically and electrically connect the bus bar electrode portions 40 and 50 and the connector portions 60 and 61 of the wiring member 11.
  • the solder layers 12 and 13 are layers in which the solder 71 (see FIG. 7) is cured, and are conductive layers having conductivity.
  • the solder layers 12 and 13 contain a rosin compound component like the interfacial release layers 26 and 36.
  • the sealing materials 6a and 6b are adhesive members that seal the solar cell string 5 arranged between the two base materials 2 and 3 and adhere the two base materials 2 and 3. Is.
  • the sealing materials 6a and 6b are sheet-shaped sealing sheets, and for example, sealing sheets such as EVA, polyolefin, and ionomer can be used.
  • the solar cell string 5 is sandwiched between the sheet-shaped sealing materials 6a and 6b, and the two base materials 2 and 3 are further outside the sealing materials 6a and 6b. Is sandwiched between. That is, in the solar cell module 1, the solar cell string 5 is arranged between the base materials 2 and 3, and the sealing materials 6a and 6b are filled between the base materials 2 and 3.
  • the wiring member 11 has a first bus bar electrode portion of one of the two adjacent solar cells 10a and 10b to which the first connector portion 60 is connected. It is connected to the 40 via the first solder layer 12, and as shown in FIGS.
  • the second connector portion 61 connects the second bus bar electrode portion 50 and the second solder layer 13 of the other solar cell 10b. Connected via.
  • the width W1 of the first bus bar electrode portion 40 is the width of the second bus bar electrode portion 50 when viewed in cross section in a cross section orthogonal to the extending direction of the first bus bar electrode portion 40 as shown in FIGS. 3 and 8. It is narrower than W3.
  • the first interface peeling layer 26 has end faces (end faces in the width direction) on both sides of the first solder layer 12 when viewed in cross section in a cross section orthogonal to the extension direction of the first bus bar electrode portion 40. Is in contact with. Further, as shown in FIG. 3, the first interface peeling layer 26 extends from both sides of the first solder layer 12 in a cross section that does not pass through the first finger electrode portion 41, and extends in the width direction (horizontal direction X) of the first bus bar electrode portion 40. ), And extends onto the front electrode layer 20. That is, as shown in FIG. 5, the first interface peeling layer 26 is formed so as to spread on the front electrode layer 20 and sandwich the first bus bar electrode portion 40 in the lateral direction X, and the first bus bar electrode portion 40. Covers the exposed portion from the first solder layer 12 of the above.
  • the first bus bar electrode portion 40 has a cross section passing through the first finger electrode portion 41, both ends of the lateral direction X being covered with the first interface peeling layer 26, and the first finger electrode portion 40.
  • the 41 has a portion covered with the first interfacial peeling layer 26 and a portion not covered with the first interface peeling layer 26.
  • the first interface peeling layer 26 extends in parallel with the first bus bar electrode portion 40, and extends across the plurality of first finger electrode portions 41 in the vertical direction Y.
  • the stretch length D1 of the first interface peeling layer 26 shown in FIG. 3 from the first solder layer 12 is preferably 0.25 mm or more and 10 mm or less.
  • the stretch length D1 is preferably 0.5 times or more, more preferably 1 time or more, and 1.5 times or more the width W1 of the first bus bar electrode portion 40 shown in FIG. 8 (a). Is particularly preferable.
  • the stretch length D1 is preferably 10 times or less, more preferably 5 times or more, the width W1 of the first bus bar electrode portion 40.
  • the second bus bar electrode portion 50 is wider than the width of the second solder layer 13, and the overhanging portions 52 projecting from both sides of the second solder layer 13 in the width direction (horizontal direction X). , 53 are provided.
  • the second interfacial release layer 36 is the second solder in the width direction (horizontal direction X) when viewed in cross section in a cross section orthogonal to the extension direction of the second bus bar electrode portion 50. It is in contact with the end faces on both sides of the layer 13.
  • the second interface peeling layer 36 spreads from both sides of the second solder layer 13 in a cross section that does not pass through the second finger electrode portion 51 as shown in FIG.
  • the second interface peeling layer 36 is formed so as to sandwich the second bus bar electrode portion 50 as shown in FIG. 6, and covers the exposed portion of the second bus bar electrode portion 50 from the second solder layer 13. ..
  • the second interface peeling layer 36 extends from above the second bus bar electrode portion 50 to a part of the second finger electrode portion 51 in a cross section passing through the second finger electrode portion 51 as shown in FIG. That is, in the cross section of the second bus bar electrode portion 50 passing through the second finger electrode portion 51, both ends in the lateral direction X are covered with the second interface peeling layer 36, and the second finger electrode portion 51 is covered with the second finger electrode portion 51. There is a portion covered with the second interfacial release layer 36 and a portion not covered. As shown in FIG. 6, the second interfacial peeling layer 36 extends in parallel with the second bus bar electrode portion 50, and extends across the plurality of second finger electrode portions 51 in the vertical direction Y.
  • the stretch length D2 of the second interface peeling layer 36 from the second solder layer 13 shown in FIG. 3 is about the same as the stretch length D1 of the first interface peeling layer 26 from the first solder layer 12, and is 0. It is preferably .25 mm or more and 10 mm or less.
  • the stretch length D2 is preferably 0.5 times or more, more preferably 1 time or more, and 1.5 times or more the width W3 of the second bus bar electrode portion 50 shown in FIG. 8 (b). Is particularly preferable.
  • the stretch length D2 is preferably 10 times or less, more preferably 5 times or more, the width W3 of the second bus bar electrode portion 50.
  • the stretch length D3 from the overhanging portions 52 and 53 of the second interface peeling layer 36 is not particularly limited, but is preferably not more than the stretch length D2 from the second solder layer 13.
  • the draw length from the solder layer 13 is preferably less than D2.
  • the adhesive strength at the interface between the first bus bar electrode portion 40 and the first interface peeling layer 26 shown in FIG. 3 is larger than the adhesive strength at the interface between the sealing material 6a and the first interface peeling layer 26.
  • the adhesive strength at the interface of the first interface peeling layer 26 is larger than the adhesive strength at the interface between the front electrode layer 20 and the first interface peeling layer 26. That is, the interface between the first bus bar electrode portion 40 and the first interface peeling layer 26 is less likely to peel off than the interface between the sealing material 6a and the first interface peeling layer 26, and the interface between the sealing material 6a and the first interface peeling layer 26. Is less likely to peel off than the interface between the front side electrode layer 20 and the first interface peeling layer 26.
  • the adhesive strength at the interface between the second bus bar electrode portion 50 and the second interface peeling layer 36 is larger than the adhesive strength at the interface between the sealing material 6b and the second interface peeling layer 36, and the sealing material 6b and the second The adhesive strength at the interface of the interface peeling layer 36 is larger than the adhesive strength at the interface between the back side electrode layer 22 and the second interface peeling layer 36. That is, the interface between the second bus bar electrode portion 50 and the second interface peeling layer 36 is less likely to peel off than the interface between the sealing material 6b and the second interface peeling layer 36, and the interface between the sealing material 6b and the second interface peeling layer 36. Is less likely to peel off than the interface between the back side electrode layer 22 and the second interface peeling layer 36.
  • the photoelectric conversion unit 21 is formed, the electrode layers 20 and 22 are formed on the respective main surfaces of the photoelectric conversion unit 21, and the collector electrodes 25 and 35 are further formed on the electrode layers 20 and 22.
  • the solar cell 10 collecting electrode forming step.
  • the flux 70 which is the raw material of the interfacial release layers 26 and 36 having fluidity, is applied to the bus bar electrode portions 40 and 50 of the solar cell 10 (coating step). Specifically, on the front side of the solar cell 10, it intentionally protrudes from the first bus bar electrode portion 40 so as to straddle the front electrode layer 20 and the first finger electrode portion 41 from above the first bus bar electrode portion 40. And apply. Similarly, on the back side of the solar cell 10, the coating is intentionally projected from the bus bar electrode portion 50 so as to straddle the back side electrode layer 22 and the second finger electrode portion 51 from the top of the second bus bar electrode portion 50. ..
  • the flux 70 is applied from the side surfaces of the bus bar electrode portions 40 and 50 to a range of 0.5 times or more the widths W1 and W3 (see FIG. 8) of the bus bar electrode portions 40 and 50 on the electrode layers 20 and 22. It is preferable to apply the flux 70 from the side surface of the bus bar electrode portions 40, 50 to a range equal to or more than 1 times the widths W1 and W3 of the bus bar electrode portions 40, 50 on the electrode layers 20 and 22, and the bus bar electrode portions 40 and 50. It is more preferable to apply the flux 70 to a range of 1.5 times or more the widths W1 and W3.
  • the connector portions 60 and 61 of the wiring member 11 having the solder 71 formed on the surface are placed on the bus bar electrode portions 40 and 50 covered with the flux 70 and heated to melt the solder 71, and the solder 71 melts the bus bar electrode portion 40. , 50 are bonded to the connector portions 60 and 61 of the wiring member 11 (adhesion step). At this time, the components of the flux 70 are vaporized to form the interfacial release layers 26 and 36 which are resin layers.
  • the solar cell module 1 is completed by providing a box or the like.
  • the adhesive strength at the interface between the first bus bar electrode portion 40 and the first interface peeling layer 26 is larger than the adhesive strength at the interface between the sealing material 6a and the first interface peeling layer 26.
  • the adhesive strength at the interface between the sealing material 6a and the first interface peeling layer 26 is larger than the adhesive strength at the interface between the front electrode layer 20 and the first interface peeling layer 26. Therefore, when the first base material 2 is pulled to peel off the sealing material 6a from the solar cell string 5, the first interface peeling layer 26 passes through the first finger electrode portion 41 as shown in FIG. 10A. In the cross section not provided, the portion in contact with the first bus bar electrode portion 40 remains, and the portion in contact with the front electrode layer 20 is preferentially peeled off.
  • the first interface peeling layer 26 is a portion in contact with a part of the first finger electrode portion 41 and the first bus bar electrode portion 40 in a cross section passing through the first finger electrode portion 41. Remains. As a result, the first bus bar electrode portion 40 is not substantially peeled off from the front electrode layer 20.
  • the adhesive strength at the interface between the second bus bar electrode portion 50 and the second interface peeling layer 36 is the adhesive strength at the interface between the sealing material 6b and the second interface peeling layer 36.
  • the adhesive strength at the interface between the sealing material 6b and the second interface peeling layer 36 is larger than the adhesive strength at the interface between the back side electrode layer 22 and the second interface peeling layer 36.
  • the second interface peeling layer 36 passes through the second finger electrode portion 51 as shown in FIG. 11A.
  • the portion in contact with the second bus bar electrode portion 50 remains, and the portion in contact with the back side electrode layer 22 is preferentially peeled off.
  • the second interface peeling layer 36 is a portion in contact with a part of the second finger electrode portion 51 and the second bus bar electrode portion 50 in a cross section passing through the second finger electrode portion 51. Remains. As a result, the second bus bar electrode portion 50 covered with the second interface peeling layer 36 is not substantially peeled from the back side electrode layer 22.
  • the portion mainly contributing to energization is the base material 2.
  • 3 and the sealing materials 6a and 6b are not peeled off, so that initial defects and the like can be accurately evaluated.
  • the interleaving layers 26 and 36 are provided so as to straddle the electrode layers 20 and 22 from above the bus bar electrode portions 40 and 50, and the bus bar is provided from the side surface of the bus bar electrode portions 40 and 50. Since the widths W1 and W3 of the electrode portions 40 and 50 are expanded to a range of 0.5 times or more, the bus bar electrode portions 40 and 50 are unlikely to be peeled off from above the electrode layers 20 and 22.
  • the sheet-shaped sealing material 6a and the thin-film first collecting electrode 25 are interposed between the first interfacial release layer 26 which is preferentially aggregated and broken. .. That is, since a portion that is easily coagulated and broken is formed on the first collecting electrode 25 and the cohesive breaking of the first collecting electrode 25 is suppressed, the portion covered by the first interface peeling layer 26 of the first collecting electrode 25.
  • the first bus bar electrode portion 40 of the first collecting electrode 25 is less likely to peel off from the front electrode layer 20 even if the sealing material 6a is floated. Therefore, long-term reliability is high.
  • a second interfacial release layer 36 that is preferentially aggregated and broken is interposed between the sheet-shaped sealing material 6b and the thin-film second collecting electrode 35. doing. That is, since a portion that is easily coagulated and broken is formed on the second collecting electrode 35 and the cohesive fracture of the second collecting electrode 35 is suppressed, the portion covered by the second interface peeling layer 36 of the second collecting electrode 35. Is difficult to peel off the second bus bar electrode portion 50 of the second collecting electrode 35 from the back side electrode layer 22 even if the sealing material 6b is lifted. Therefore, long-term reliability is high.
  • the solar cell module of the second embodiment of the present invention will be described.
  • the same components as those of the solar cell module 1 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the solar cell module of the second embodiment of the present invention is a so-called PERC type solar cell module, and the solar cell is different from that of the first embodiment.
  • the solar cell 110 of the second embodiment has a reverse conductive semiconductor layer 112 and an antireflection layer on one main surface of a monoconductive semiconductor substrate 111 (hereinafter, also simply referred to as a semiconductor substrate 111). It includes 113 and a first collecting electrode 25.
  • the solar cell 110 includes a back surface electric field layer 116, a protective layer 117, a back side electrode layer 118, and a second collecting electrode 35 on the other main surface of the semiconductor substrate 111.
  • the solar cell 110 is composed of an antireflection layer 113, a reverse conductive semiconductor layer 112, a semiconductor substrate 111, a back surface electric field layer 116, and a protective layer 117 to form a photoelectric conversion unit 120. That is, in the solar cell 110, the first collecting electrode 25 is formed on the front side of the photoelectric conversion unit 120, and the back side electrode layer 118 and the second collecting electrode 35 are formed on the back side of the photoelectric conversion unit 120.
  • the semiconductor substrate 111 is an n-type or p-type semiconductor substrate, and for example, a p-type or n-type silicon substrate can be used.
  • the reverse conductive semiconductor layer 112 is a semiconductor substrate having a conductive type opposite to that of the semiconductor substrate 111, and for example, an n-type or p-type silicon thin film layer can be used.
  • the semiconductor substrate 111 is composed of a p-type silicon substrate
  • the reverse conductive semiconductor layer 112 is composed of an n-type silicon thin film layer
  • the semiconductor substrate 111 and the reverse conductive semiconductor layer are formed.
  • a PN junction is formed at 112.
  • the antireflection layer 113 is a layer for reducing the reflectance on the light receiving surface of the solar cell 110, and is a layer for confining the light incident on the photoelectric conversion unit 120 in the photoelectric conversion unit 120.
  • the antireflection layer 113 is an insulating layer having an insulating property, and for example, a silicon oxide layer, a silicon nitride layer, an aluminum oxide layer, or the like can be used.
  • the back surface electric field layer 116 is a so-called BSF (Back Surface Field) layer, and is a semiconductor layer having the same conductive type as the semiconductor substrate 111.
  • the back surface electric field layer 116 is a layer having a dopant concentration higher than that of the semiconductor substrate 111 and forming an internal electric field.
  • the backside electric field layer 116 can be formed, for example, by diffusing a dopant element such as boron or aluminum on the other main surface of the semiconductor substrate 111.
  • the back surface electric field layer 116 of this embodiment uses aluminum as a dopant element.
  • the protective layer 117 is a passivation layer, which is a layer that reduces the defect position that causes recombination of a small number of carriers at the interface with the semiconductor substrate 111.
  • the protective layer 117 is an insulating layer having an insulating property, and for example, a silicon oxide layer, a silicon nitride layer, an aluminum oxide layer, or the like can be used.
  • the protective layer 117 is preferably formed of a material having a negative fixed charge such as aluminum oxide.
  • the protective layer 117 is preferably formed of a material having a positive fixed charge such as silicon nitride.
  • the back side electrode layer 118 is an electrode that collects electricity from the photoelectric conversion unit 120, and is also an extraction electrode that extracts electricity to the wiring member 11.
  • the back side electrode layer 118 is a conductive layer having conductivity, and for example, metals such as aluminum, silver, gold, platinum, and palladium, and alloys thereof can be used.
  • the solar cell 110 will be mainly described, and the same description as in the first embodiment will be omitted.
  • the solar cell module includes a front-side bottomed hole 121 that penetrates the antireflection layer 113 and has the reverse conductive semiconductor layer 112 as the bottom.
  • the first collecting electrode 25 is filled in the bottomed hole 121 on the front side, and is in contact with the reverse conductive semiconductor layer 112 inside the bottomed hole 121 on the front side. That is, the first collecting electrode 25 is electrically connected to the reverse conductive semiconductor layer 112 via the bottomed hole 121 on the front side.
  • the front-side bottomed hole 121 is a bottomed groove that extends continuously or intermittently in the extending direction of the first bus bar electrode portion 40.
  • the antireflection layer 113 covers the reverse conductive semiconductor layer 112.
  • the first interface peeling layer 26 spreads from both sides of the first solder layer 12 in the width direction (horizontal direction X) when viewed in cross section in a cross section orthogonal to the extending direction of the first bus bar electrode portion 40. 1 It extends over the antireflection layer 113 through the end surface of the bus bar electrode portion 40.
  • a back surface electric field layer 116, a protective layer 117, and a back side electrode layer 118 are laminated on the other main surface of the semiconductor substrate 111.
  • the solar cell 110 penetrates the protective layer 117 and includes a back-side bottomed hole 122 with the back-side electric field layer 116 as the bottom.
  • the back side bottomed hole 122 is filled with the back side electrode layer 118, and the back side electrode layer 118 and the back side electric field layer 116 are in contact with each other inside the back side bottomed hole 122. That is, the back side electrode layer 118 is electrically connected to the back side electric field layer 116.
  • the bottomed hole 122 on the back side is a bottomed groove that extends continuously or intermittently in the extending direction of the second bus bar electrode portion 50.
  • the protective layer 117 is interposed between the back side electrode layer 118 and the semiconductor substrate 111, and the back side electrode layer 118 and the semiconductor substrate 111 are not directly connected to each other.
  • the second interface peeling layer 36 has a second in the width direction (horizontal direction X) when viewed in cross section in a cross section orthogonal to the extending direction of the second bus bar electrode portion 50. It is in contact with the end faces on both sides of the solder layer 13 and extends from both sides of the second solder layer 13. Further, the second interfacial peeling layer 36 passes over the overhanging portions 52 and 53 of the second bus bar electrode portion 50, covers the end surface of the second bus bar electrode portion 50, and further extends over the back side electrode layer 118.
  • the adhesive strength at the interface between the sealing material 6a and the first interface peeling layer 26 shown in FIG. 12 is larger than the adhesive strength at the interface between the antireflection layer 113 and the first interface peeling layer 26. That is, the interface between the sealing material 6a and the first interface peeling layer 26 is less likely to peel off than the interface between the antireflection layer 113 and the first interface peeling layer 26.
  • the adhesive strength at the interface between the sealing material 6b and the second interface peeling layer 36 is larger than the adhesive strength at the interface between the back side electrode layer 118 and the second interface peeling layer 36. That is, the interface between the sealing material 6b and the second interface peeling layer 36 is less likely to peel off than the interface between the back side electrode layer 118 and the second interface peeling layer 36.
  • the photoelectric conversion unit 120 is formed, the back side electrode layer 118 is formed on the back side of the photoelectric conversion unit 120, and the first collection electrode 25 is further formed on the reverse conductive semiconductor layer 112.
  • the second collecting electrode 35 is formed on the back side electrode layer 118 to form the solar cell 110 (collection electrode forming step).
  • the flux 70 having fluidity is applied to the bus bar electrode portions 40 and 50 of the solar cell 110 (coating step). Specifically, on the front side of the solar cell 110, the coating is intentionally projected from the first bus bar electrode portion 40 so as to straddle the antireflection layer 113 from the bus bar electrode portion 40. Similarly, on the back side of the solar cell 10, the coating is intentionally projected from the top of the bus bar electrode portion 50 so as to straddle the top of the second bus bar electrode portion 50 and the back side electrode layer 118.
  • the flux 70 is applied from the side surface of the first bus bar electrode portion 40 onto the antireflection layer 113 to a range of 0.5 times or more the width W1 of the bus bar electrode portion 40.
  • the flux 70 is applied from the side surface of the second bus bar electrode portion 50 to a range of 0.5 times or more the width W3 of the second bus bar electrode portion 50 on the back side electrode layer 118.
  • the connector portions 60, 61 of the wiring member 11 having the solder 71 formed on the surface thereof are placed on the bus bar electrode portions 40, 50 covered with the flux 70 and heated to melt the solder 71, and the solder 71 melts the bus bar electrode portions 40, The connector portions 60 and 61 of the wiring member 11 are bonded to 50 (adhesion step).
  • the base materials 2 and 3 having the sealing materials 6a and 6b formed on the surface are adhered and sealed so that the sealing materials 6a and 6b face each other and sandwich the solar cell 110, and if necessary, the terminals
  • the solar cell module is completed by providing a box or the like.
  • the adhesive strength at the interface between the first bus bar electrode portion 40 and the first interface peeling layer 26 is larger than the adhesive strength at the interface between the sealing material 6a and the first interface peeling layer 26.
  • the adhesive strength at the interface between the sealing material 6a and the first interface peeling layer 26 is larger than the adhesive strength at the interface between the antireflection layer 113 and the first interface peeling layer 26. Therefore, when the first base material 2 is pulled and peeled off from the solar cell string 5, the portion of the first interface peeling layer 26 in contact with the first bus bar electrode portion 40 remains, and the portion in contact with the antireflection layer 113 has priority. It peels off.
  • the adhesive strength at the interface between the second bus bar electrode portion 50 and the second interface peeling layer 36 is the adhesive strength at the interface between the sealing material 6b and the second interface peeling layer 36.
  • the adhesive strength at the interface between the sealing material 6b and the second interface peeling layer 36 is larger than the adhesive strength at the interface between the back side electrode layer 118 and the second interface peeling layer 36. Therefore, when the second base material 3 is pulled and peeled off from the solar cell string 5, the portion of the second interface peeling layer 36 in contact with the second bus bar electrode portion 50 remains, and the portion in contact with the back side electrode layer 118 has priority.
  • the second bus bar electrode portion 50 is substantially not peeled off from the back side electrode layer 118.
  • the portion contributing to energization is the base materials 2 and 3. And since it does not peel off following the sealing materials 6a and 6b, it is possible to accurately evaluate initial defects and the like.
  • the first interface peeling layer 26 is provided so as to straddle the first bus bar electrode portion 40 and the photoelectric conversion portion 120, and the first bus bar is provided from the side surface of the first bus bar electrode portion 40. Since the width of the electrode portion 40 extends to 0.5 times or more the width W1, the first bus bar electrode portion 40 is unlikely to be peeled off from the photoelectric conversion portion 120.
  • the second interface peeling layer 36 is provided so as to straddle the second bus bar electrode portion 50 and the back side electrode layer 118, and the second bus bar is provided from the side surface of the second bus bar electrode portion 50. Since the width of the electrode portion 50 extends to 0.5 times or more the width W3, the second bus bar electrode portion 50 is unlikely to peel off from the back side electrode layer 118.
  • the solar cell module according to the third embodiment of the present invention will be described.
  • the solar cell module of the third embodiment further includes interfacial peeling layers 246 and 256 that cover the outside of the wiring member 11 with reference to the photoelectric conversion unit 21 in the solar cell module of the first embodiment.
  • the interfacial peeling layers 246 and 256 are organic compound layers having translucency and containing a rosin compound as a main component, like the first interfacial peeling layer 26, and are flux layers in which the flux 70 is cured.
  • the interfacial peeling layers 246 and 256 of the wiring members 11 and 11 with reference to the photoelectric conversion unit 21 when viewed in cross section in a cross section orthogonal to the extension direction of the first bus bar electrode unit 40. It is located on the outside. Further, the interfacial release layers 246 and 256 are interposed between the wiring members 11 and 11 and the sealing materials 6a and 6b, and cover the side surfaces and the outer surfaces of the wiring members 11 and 11. That is, the interface peeling layers 246 and 256 cover the exposed portions of the wiring members 11 and 11 from the interface peeling layers 26 and 36, and also cover a part of the interface peeling layers 26 and 36.
  • the adhesive strength at the interface between the wiring members 11 and 11 and the interface peeling layers 246 and 256 is larger than the adhesive strength at the interface between the interface peeling layers 246 and 256 and the sealing materials 6a and 6b.
  • the adhesive strength between the wiring members 11 and 11 and the bus bar electrode portions 40 and 50 via the solder layers 12 and 13 is larger than the adhesive strength at the interface between the wiring members 11 and 11 and the interface peeling layers 246 and 256.
  • the interface between the wiring members 11 and 11 and the bus bar electrode portions 40 and 50 is less likely to be peeled off than the interface between the wiring members 11 and 11 and the interface peeling layers 246 and 256, and the interface peeling layers 246 and 256 and the sealing materials 6a and 6b It is harder to peel off than the adhesive strength of the interface.
  • the method for manufacturing the solar cell module of the third embodiment is almost the same as the method for manufacturing the solar cell module of the first embodiment.
  • the flux 70 is applied to the wiring member 11 again, and then the sealing material is applied. It is sandwiched between the base materials 2 and 3 on which 6a and 6b are formed and sealed.
  • the interface between the wiring members 11 and 11 and the bus bar electrode portions 40 and 50 is less likely to be peeled off than the interface between the wiring members 11 and 11 and the interface peeling layers 246 and 256, and the interface peeling layer. It is harder to peel off than the adhesive strength at the interface between 246, 256 and the sealing materials 6a and 6b. Therefore, when the first base material 2 is pulled to peel off the sealing material 6a from the solar cell string 5, the interfacial release layer 246 is coagulated and broken or the sealing material 6a is as shown in FIG. 17A. , 6b and peel off preferentially at the interface.
  • the portion in contact with the wiring member 11 remains, and the portion in contact with the sealing material 6a is preferentially peeled off. Therefore, the wiring member 11 is not substantially peeled off from the first bus bar electrode portion 40.
  • the interfacial release layer 256 is cohesively broken or the sealing material is broken as shown in FIG. 17 (b). It is preferentially peeled off at the interface with 6a and 6b.
  • the wiring member 11 is not substantially peeled off from the second bus bar electrode portion 50.
  • interfacial peeling layers 246 and 256 that are preferentially coagulated and broken are interposed between the sealing materials 6a and 6b and the wiring members 11 and 11. That is, since a portion that is easily coagulated and broken is formed on the wiring members 11 and 11, the wiring members 11 and 11 covered by the first interface peeling layer 26 are floated in the sealing materials 6a and 6b. However, the wiring members 11 and 11 are not easily peeled off from the bus bar electrode portions 40 and 50. Therefore, long-term reliability is high.
  • the solar cell module according to the fourth embodiment of the present invention will be described.
  • the structure of the solar cell string of the solar cell module of the fourth embodiment is different from that of the second embodiment. That is, as shown in FIG. 18, the solar cell string of the fourth embodiment includes the solar cell 110, the wiring member 11, and the solder layers 12 and 13, and is on the outside of the wiring member 11 as in the third embodiment.
  • the interfacial release layer 246, 256 is provided.
  • the front electrode layer 20 and the back electrode layer 22 are formed on the photoelectric conversion unit 21, and the collector electrodes 25 and 35 are connected to the photoelectric conversion unit 21 via the front electrode layer 20 and the back electrode layer 22.
  • the present invention is not limited to this.
  • the collector electrodes 25 and 35 may be formed directly on the photoelectric conversion unit 21.
  • the collecting electrodes 25 and 35 include the finger electrode portions 41 and 51, but the present invention is not limited thereto.
  • the collecting electrodes 25 and 35 do not have to include the finger electrode portions 41 and 51.
  • each solar cell is connected by two wiring members 11, but the present invention is not limited to this. It may be connected by one wiring member 11 or may be connected by three or more wiring members 11.
  • solder layers 12 and 13 are formed of the solder 71 coated on the surface of the wiring member 11, but the present invention is not limited thereto.
  • the solder layers 12 and 13 may be formed of solder prepared separately from the wiring member 11.
  • first bus bar electrode portion 40 and the second bus bar electrode portion 50 have different widths, but the present invention is not limited to this.
  • the first bus bar electrode portion 40 and the second bus bar electrode portion 50 may have the same width.
  • the first bus bar electrode portion 40 has the same width as the width of the wiring member 11, but the present invention is not limited to this.
  • the width of the first bus bar electrode portion 40 may be wider than the width of the wiring member 11.
  • the width of the second bus bar electrode portion 50 is wider than the width of the wiring member 11, but the present invention is not limited thereto.
  • the width of the second bus bar electrode portion 50 may be the same as the width of the wiring member 11.
  • the present invention is not limited thereto. It may be a double-sided light receiving type solar cell module in which both sides of the main surface of the first base material 2 and the main surface of the second base material 3 are light receiving surfaces.
  • the interface peeling layer is formed by flux, but the present invention is not limited to this.
  • the delamination layer may be formed of another material.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
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Abstract

Module de batterie solaire comportant une unité d'électrode de barre omnibus qui se décolle difficilement par rapport aux électrodes classiques lorsqu'elle se décompose. Un élément de batterie solaire (10) et un élément de câblage (60) sont agencés entre deux matériaux de base (2, 3), et un matériau d'étanchéité (6a) est chargé entre les deux matériaux de base (2, 3). L'élément de batterie solaire (10) comprend une couche d'électrode avant (20), une couche d'électrode arrière (22), et une unité de conversion photoélectrique (21), et une unité d'électrode de barre omnibus (40) est disposée sur au moins une couche d'électrode (20) parmi la couche d'électrode avant (20) et la couche d'électrode arrière (22). L'élément de câblage (60) est collé à l'unité d'électrode de barre omnibus (60) par l'intermédiaire d'une couche de brasure (12). L'élément de batterie solaire (10) présente une couche de décollement interfacial (26) contenant un composé de colophane. Sur une vue en coupe, la couche de décollement interfacial (26) recouvre au moins une partie du côté de l'unité d'électrode de barre omnibus (60) et s'étend plus loin vers l'une des couches d'électrode (20). La force d'adhérence d'une interface entre l'unité d'électrode de barre omnibus (60) et la couche de décollement interfacial (26) est supérieure à la force d'adhérence d'une interface entre le matériau d'étanchéité (6a) et la couche de décollement interfacial (26), et la force d'adhérence de l'interface entre le matériau d'étanchéité (6a) et la couche de décollement interfacial (26) est supérieure à la force d'adhérence de l'interface entre la couche d'électrode (20) et la couche de décollement interfacial (26).
PCT/JP2020/019287 2019-06-21 2020-05-14 Module de batterie solaire WO2020255597A1 (fr)

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JP2003142720A (ja) * 2001-11-06 2003-05-16 National Institute Of Advanced Industrial & Technology リサイクル対応型太陽電池モジュール
JP2007201291A (ja) * 2006-01-27 2007-08-09 Kyocera Corp 太陽電池モジュールの再生方法及び太陽電池モジュール
JP2009004613A (ja) * 2007-06-22 2009-01-08 Sanyo Electric Co Ltd 太陽電池群及びその製造方法、太陽電池群を備える太陽電池モジュール及びその製造方法
JP2011086964A (ja) * 2006-08-25 2011-04-28 Sanyo Electric Co Ltd 太陽電池モジュール及び太陽電池モジュールの製造方法
JP2012079948A (ja) * 2010-10-01 2012-04-19 Mitsubishi Electric Corp 太陽電池モジュールおよび太陽電池モジュールの分解方法
US20140000683A1 (en) * 2010-12-20 2014-01-02 Solar Machines Incorporated Single-cell encapsulation and flexible-format module architecture for photovoltaic power generation and method for constructing the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5230089B2 (ja) 2006-09-28 2013-07-10 三洋電機株式会社 太陽電池モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142720A (ja) * 2001-11-06 2003-05-16 National Institute Of Advanced Industrial & Technology リサイクル対応型太陽電池モジュール
JP2007201291A (ja) * 2006-01-27 2007-08-09 Kyocera Corp 太陽電池モジュールの再生方法及び太陽電池モジュール
JP2011086964A (ja) * 2006-08-25 2011-04-28 Sanyo Electric Co Ltd 太陽電池モジュール及び太陽電池モジュールの製造方法
JP2009004613A (ja) * 2007-06-22 2009-01-08 Sanyo Electric Co Ltd 太陽電池群及びその製造方法、太陽電池群を備える太陽電池モジュール及びその製造方法
JP2012079948A (ja) * 2010-10-01 2012-04-19 Mitsubishi Electric Corp 太陽電池モジュールおよび太陽電池モジュールの分解方法
US20140000683A1 (en) * 2010-12-20 2014-01-02 Solar Machines Incorporated Single-cell encapsulation and flexible-format module architecture for photovoltaic power generation and method for constructing the same

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