WO2020252864A1 - Plaque de masque, dispositif de masque et procédé d'application associé - Google Patents

Plaque de masque, dispositif de masque et procédé d'application associé Download PDF

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Publication number
WO2020252864A1
WO2020252864A1 PCT/CN2019/099638 CN2019099638W WO2020252864A1 WO 2020252864 A1 WO2020252864 A1 WO 2020252864A1 CN 2019099638 W CN2019099638 W CN 2019099638W WO 2020252864 A1 WO2020252864 A1 WO 2020252864A1
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WO
WIPO (PCT)
Prior art keywords
substrate
mask
area
film layer
opening area
Prior art date
Application number
PCT/CN2019/099638
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English (en)
Chinese (zh)
Inventor
肖世艳
Original Assignee
武汉华星光电半导体显示技术有限公司
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Publication of WO2020252864A1 publication Critical patent/WO2020252864A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the invention relates to the field of display, in particular to a mask plate, a mask device and an application method thereof.
  • OLED Organic electroluminescent diode Light-Emitting Diode
  • the display panel has evolved from a special-shaped screen to a full-scale screen today. "Full screen” has gradually become the mainstream of smart terminals. Smart terminals have a display panel.
  • the display panel includes an opening area for placing the front camera, amplifier components, light metering components, and light-filling components on the display panel. On the component.
  • OLED manufacturing the biggest difference from general liquid crystal display panels is that a vacuum evaporation process is required. During the evaporation process, the mask is accurately attached to the substrate, and then the evaporation material is vacuum-evaporated onto the substrate through the mask to form an organic material layer. Evaporation materials include red (R), green (G), and blue (B) organic light-emitting materials. OLED display panels emit red, green and blue primary colors through self-luminous organic materials to form different colors.
  • the mask includes a shading area and an opening area.
  • the position of the substrate and the opening area will be deposited with organic material, and the position of the substrate and the light-shielding area will not be deposited with the organic material, thereby forming a unique pattern.
  • the substrate is masked through the mask, and the substrate is evaporated by the evaporation source, and the sub-pixels on the substrate corresponding to the opening area of the mask are evaporated.
  • the use of mask evaporation method can easily produce shadow effects (shadow effect), that is, when the first seed pixel is evaporated, the organic material may diffuse beyond the specified area of the first seed pixel, that is, diffuse to the second seed pixel area or the third seed pixel area to cause color mixing or color shift
  • shadow effect affects the luminous display effect of OLED.
  • the mask plate also includes at least one separation line for separating the shading area from the opening area, but in the prior art, the direction and angle of the separation line are not clearly specified. Therefore, after the film is formed, the position of the separation line of the mask corresponding to the substrate is prone to display abnormalities.
  • the display panel generally adopts LCD technology to realize the camera under the screen (Camera Under Panel, CUP), and no one has yet adopted OLED technology to achieve CUP.
  • the present invention provides a mask, a mask device and an application method thereof, to solve the problem that the mask in the prior art causes the organic material to easily produce color mixing or color shift in the peripheral area of the opening area, and on the substrate The technical problem of uneven surface film.
  • the present invention provides a mask for film formation on a substrate.
  • the substrate includes a predetermined opening area.
  • the mask is divided into two parts: a light shielding area and an opening area by a dividing line.
  • the mask includes a shielding area protruding from one side of the light shielding area, the side is connected to the opening area at the separation line, when the mask and the substrate are opposed When the position is set, the projection of the shielding area on the surface of the substrate is located in the opening area.
  • the shielding area is semicircular, the opening area is circular, and the radius of the shielding area is the same as the radius of the opening area.
  • the substrate includes a substrate separation line, which partially overlaps with the projection of the separation line on the surface of the substrate.
  • the mask is rectangular or rounded rectangle; and/or, both ends of the separation line are respectively provided on two adjacent sides of the mask; the separation line and the Two adjacent sides of the mask plate respectively form an included angle, and the angle of the included angle is 40°-50°.
  • the present invention also provides a mask device, including any one of the aforementioned mask plates, which are respectively a first mask plate and a second mask plate; wherein, the first mask plate The mask is divided into a first light-shielding area and a first opening area by a first separation line, and the area of the first light-shielding area is larger than that of the first opening area; the second mask is divided by a second separation line Are the second shading area and the second opening area, the area of the second shading area is smaller than the second opening area; the size of the first mask is the same as the size of the second mask; the first partition The projection of the line on the surface of the substrate partially overlaps the projection of the second dividing line on the surface of the substrate.
  • the first dividing line includes a first straight portion and a first arc portion; the second dividing line includes a second straight portion and a second arc portion; the first straight portion is in the The projection of the surface of the substrate coincides with the projection of the second linear portion on the surface of the substrate; the projection of the first arc portion on the surface of the substrate is the same as the projection of the second arc portion on the surface of the substrate.
  • the projection forms a circle, which coincides with the marginal line of the opening area.
  • the present invention also provides an application method of a mask device, which includes the following steps: a substrate setting step, placing a substrate in an evaporation chamber, the substrate including a predetermined opening area;
  • the alignment step is to perform a first alignment treatment on the substrate and the first mask;
  • the first deposition step is to deposit organic materials on one surface of the substrate to form a first film layer, the first film layer It has a first notch;
  • a second alignment process which performs a second alignment process on the substrate and a second mask;
  • a second deposition step which deposits an organic material on one surface of the substrate to form a second film Layer connected to the first film layer;
  • the second film layer has a second gap; wherein the first gap and the second gap form a through hole on the surface of the substrate, and the opening Relative setting of zone.
  • the substrate in the first deposition step, in a vacuum evaporation environment, an organic material is deposited on the substrate, and the first film layer is formed on the surface of the substrate; in the second deposition step, In a vacuum evaporation environment, an organic material is deposited on the substrate, and the second film layer is formed on the surface of the substrate.
  • the substrate includes a substrate separation line; the connection between the first film layer and the second film layer is opposite to the substrate separation line.
  • the first film layer includes more than two first pixels
  • the second film layer includes more than two second pixels; the first pixels and the second pixels are arranged in a matrix; A pixel and the second pixel are respectively located on two sides of the substrate separation line.
  • the technical effect of the present invention is to provide a mask, a mask device and an application method thereof.
  • Two different masks are used to sequentially perform secondary deposition on the surface of the same substrate, so that the upper surface of the substrate except for the opening area Each position is coated into a film, and there is no overlap of the film, which can improve the uniformity of the film formation of organic materials in the peripheral area of the opening area, and prevent multiple sub-pixels of different colors at the same position on the substrate surface Therefore, the phenomenon of color mixing or color shift can be prevented, and the quality of the display panel can be improved.
  • FIG. 1 is a schematic diagram of the structure of the first mask
  • FIG. 2 is a schematic diagram of the structure of the second mask
  • Figure 3 is a schematic diagram of the structure of the substrate
  • Figure 4 is a flow chart of the application method of the mask
  • FIG. 5 is a schematic diagram of the structure of the first mask plate forming a film on the substrate
  • FIG. 6 is a schematic diagram of the structure of forming a film on the substrate by the second mask
  • FIG. 7 is a schematic diagram of the structure of pixels located on both sides of the substrate separation line.
  • this embodiment provides a mask device, including a first mask plate 100 and a second mask plate 200.
  • the two types of mask plates are generally rectangular or rounded rectangle, but are not limited to Other shapes.
  • the mask device is used to form a film on the substrate 300 to form a desired pattern.
  • the size of the first mask plate 100 is the same as the size of the second mask plate 200.
  • the first mask 100 is divided into a first light-shielding area 11 and a first opening area 12 by a first dividing line 10.
  • the area of the first light-shielding area 11 is larger than that of the first opening area 12.
  • Two ends of the first dividing line 10 are respectively arranged on two adjacent sides of the first mask plate 100, and the first dividing line 10 and the two adjacent sides of the first mask plate 100 respectively form an included angle, They are the first included angle 1 and the second included angle 2, and the first included angle 1 and the second included angle 2 are 40°-50°, preferably 45°.
  • the first dividing line 10 includes a first straight line portion 101 and a first arc line portion 102. The projection of the first dividing line 10 on the surface of the substrate partially overlaps the substrate dividing line, and the projection of the first linear portion 101 on the surface of the substrate partially overlaps the substrate dividing line.
  • the first mask 100 includes a first shielding area 111 protruding from one side of the first light shielding area 11, and the side is connected to the first opening area 12 at the first dividing line 10.
  • the projection of the first shielding area 111 on the surface of the substrate is located in the opening area.
  • the first shielding area 111 is semicircular, the opening area is circular, and the radius of the first shielding area 111 is the same as the radius of the opening area.
  • the second mask 200 is divided into a second light-shielding area 21 and a second opening area 22 by a second dividing line 20.
  • the area of the second light-shielding area 21 is smaller than that of the second opening area 22.
  • Two ends of the second separation line 20 are respectively provided on two adjacent sides of the second mask 200, and the second separation line 20 and the two adjacent sides of the second mask 200 respectively form an included angle, They are the third included angle 3 and the fourth included angle 4, respectively.
  • the third included angle 3 and the fourth included angle 4 are 40°-50°, preferably 45°.
  • the angle of the included angle is 40°-50°.
  • the second dividing line 20 includes a second straight line portion 201 and a second arc line portion 202. The projection of the second separation line 20 on the surface of the substrate partially overlaps the substrate separation line, and the projection of the second straight portion 201 on the surface of the substrate partially overlaps the substrate separation line.
  • the second mask 200 includes a second shielding area 211 protruding from one side of the second light shielding area 21, and the side is connected to the second opening area 22 at the second dividing line 20.
  • the projection of the second shielding area 211 on the surface of the substrate is located in the opening area.
  • the second shielding area 211 is semicircular, the opening area is circular, and the radius of the second shielding area 211 is the same as the radius of the opening area.
  • the substrate 300 includes a predetermined opening area 30 and a substrate separation line 31.
  • the substrate 300 is divided into a first area 301 and a second area 302 by the substrate separation line 31.
  • the substrate separation line 31 and the adjacent side of the substrate 300 respectively form an included angle, which is a fifth included angle 5 and a sixth included angle 6, wherein the fifth included angle 5 and the sixth included angle 6 are 40° ⁇ 50°, preferably 45°.
  • the projection of the first mask on the surface of the substrate is mostly overlapped with the projection of the second mask on the surface of the substrate, which can reduce the The shadow effect produced by the second mask on the same substrate makes the exposed position on the substrate more accurate.
  • the projection of the first dividing line on the surface of the substrate overlaps with the projection of the second dividing line on the surface of the substrate;
  • the projection of the first straight line on the surface of the substrate is the same as The projections of the second straight portion on the surface of the substrate coincide;
  • the angle of the first included angle is the same as the angle of the third included angle, and the angle of the third included angle is greater than that of the fourth included angle
  • the angle is the same;
  • the projection of the first arc on the surface of the substrate and the projection of the second arc on the surface of the substrate form a circle, which coincides with the marginal line of the opening area.
  • this embodiment also provides an application method of a mask device, which is the first mask plate and the second mask plate described above.
  • the application method of the mask device includes the following steps S11 to S15.
  • the user places a substrate in an evaporation chamber, and the substrate includes a predetermined opening area.
  • S12 In the first alignment step, the user performs a first alignment process on the substrate and the first mask, so that the substrate is masked by the first mask.
  • the first mask 100 is divided into two parts, a first light-shielding area and a first opening area by a first dividing line.
  • the first area corresponds to the first shading area
  • the second area corresponds to the first opening area.
  • the substrate separation line overlaps with the projection of the first separation line on the surface of the substrate, and the substrate separation line completely coincides with the projection of the first linear portion on the substrate surface.
  • the projection of a shielding area on the surface of the substrate is located in the opening area, the angle of the fifth included angle is the same as the angle of the first included angle, and the angle of the sixth included angle is the same as that of the second included angle.
  • the angle of the included angle is the same. Therefore, the precise alignment of the substrate and the first mask is beneficial to the uniformity of subsequent film formation on one side of the substrate.
  • S13 In the first deposition step, an organic material is deposited on one surface of the substrate to form a first film layer, the first film layer having a first notch.
  • the first film layer includes more than two first pixels, and the first pixels are arranged in a matrix.
  • the first area 301 is shielded by the first light-shielding area 11
  • the second area 302 is arranged opposite to the first opening area 12
  • the projection of the first shielding area 111 on the surface of the substrate 300 is located in the open area. ⁇ 30 ⁇ .
  • an organic material is deposited on the substrate 300.
  • the organic material is deposited from the upper right of the second area 302 to the right boundary of the substrate separation line, so that the second area 302 is deposited with organic material, and the first area 301 Without organic material deposited, a first film layer is formed on the surface of the substrate 300, the first film layer is provided with a first notch, and the position of the first notch corresponds to the first shielding area 111.
  • the second alignment process is to perform a second alignment process on the substrate and the second mask, so that the substrate is masked by the second mask.
  • the second mask is divided into two parts, a second shading area and a second opening area, by a second dividing line.
  • the first area corresponds to the second opening area
  • the second area corresponds to the second shading area.
  • the substrate separation line overlaps with the projection of the second separation line on the surface of the substrate, the substrate separation line completely coincides with the projection of the second linear portion on the substrate surface, and the second The projection of the shielding area on the surface of the substrate is located in the opening area, the angle of the fifth included angle is the same as the angle of the third included angle, and the angle of the sixth included angle is the same as that of the fourth included angle.
  • the angles of the corners are the same. Therefore, the precise alignment of the substrate and the second mask is beneficial to the uniformity of subsequent film formation on one side of the substrate.
  • an organic material is deposited on one surface of the substrate to form a second film layer, which is connected to the first film layer; the second film layer has a second gap; wherein, the first film layer
  • the notch and the second notch enclose a through hole on the surface of the substrate and are arranged opposite to the opening area.
  • the second film layer includes more than two second pixels, and the second pixels are arranged in a matrix.
  • the first area 301 corresponds to the second opening area 22
  • the second area 302 is shielded by the second light shielding area 21, and the projection of the second shielding area 211 on the surface of the substrate 300 is located in the opening Within district 30.
  • the organic material is sputtered on the substrate 300, and the organic material is deposited from the bottom left of the first region 301 to the left boundary of the substrate separation line 31, so that the first region 301 is deposited with organic material, and the second region 302 is not deposited with organic material.
  • a second film layer is formed on the surface of the substrate 300 and is connected to the first film layer.
  • first film layer and the second film layer are located on the same side of the substrate 300, the connection between the first film layer and the second film layer is disposed opposite to the substrate separation line 31, and the second film layer
  • the film layer is provided with a second notch, and the position of the second notch corresponds to the second shielding area 211.
  • This embodiment provides an application method of a mask device, which performs the above steps in sequence in the order of S11 to S15.
  • the order of use of the first mask and the second mask can be changed, and the present invention is not particularly limited.
  • Another embodiment of the present invention provides an application method of a mask device, which sequentially executes the above steps in the order of S11, S14, S15, S12, and S13, and its technical effect is consistent with this embodiment.
  • the first film layer and the second film layer are located on the same side surface of the substrate, and the first notch and the second notch enclose a through hole on the surface of the substrate, which is connected to the The opening areas are arranged relatively.
  • the first pixels are evenly arranged in the first area; in the second deposition step, the second pixels are evenly arranged in all The second area.
  • every position on the upper surface of the substrate except the opening area is coated into a film, and each position is only coated once, so that the pixel structure of the film layer on the entire substrate surface is uniformly distributed.
  • the first film layer and the second film layer mentioned above may be light-emitting film layers, which are provided with sub-pixels.
  • the two depositions are respectively formed on both sides of the separation line, and two films are not formed at a certain position on the substrate. Secondly, there will be no overlap of pixels, which can prevent color mixing or color shift after the substrate is formed, and improve the quality of the display panel.
  • the first film layer and the second film layer mentioned above can be non-luminescent film layers, including the electron transport layer, the cathode layer, and the flat layer.
  • the two depositions are respectively formed on both sides of the separation line, and will not
  • the film is formed twice at a certain position on the substrate, so that the entire film layer is evenly coated, preventing color mixing or color shift due to uneven film thickness, and improving the quality of the display panel.
  • the aperture area is used to place components such as cameras and is located in the non-display area.
  • the aperture area is set at the corner of the substrate.
  • the substrate separation line passes through the center of the opening area, which can improve the accuracy of the alignment of the substrate and the mask device (the first mask plate, the second mask plate), thereby preventing the substrate Color mixing or color shift occurs after the film is formed, which improves the quality of the display panel.
  • the first pixel 401 and the second pixel 402 are respectively located on both sides of the substrate separation line 31.
  • the first pixel 401 and the second pixel 402 both include red, green, and blue (R, G, B) sub-pixels arranged in a matrix.
  • the size of each sub-pixel is different, but it can also be the same.
  • the size of the sub-pixels in this embodiment is preferably different .
  • the pitch of every two adjacent sub-pixels is also different, and the pitch of two adjacent sub-pixels is 23um ⁇ 37um.
  • the distance between R sub-pixel and G sub-pixel is 23um ⁇ 25um; the distance between G sub-pixel and B sub-pixel is 26um ⁇ 29um; the distance between R sub-pixel and B sub-pixel is 30um ⁇ 37um; therefore every two adjacent The pitch of the sub-pixels varies.
  • the substrate separation line 31 is provided in the middle of the distance between two adjacent sub-pixels, or the substrate separation line 31 passes through a row of sub-pixels, and the substrate separation line 31 passes through the middle of each sub-pixel.
  • the substrate separation line 31 of the present embodiment is set in the middle of the gap between the widest two adjacent sub-pixels, which can reduce color mixing or color shift.
  • the substrate separation line 31 and the adjacent sides of the substrate 300 respectively form an included angle of 40°-50°, the substrate separation line 31 is set in the middle of the widest two adjacent sub-pixels.
  • adjacent sub-pixels of different colors on both sides of the substrate separation line 31 may also constitute a pixel unit, the structure of which is the same as or similar to the structure of the pixel unit in the first area and the second area, so that the substrate
  • the display effect of the area near the dividing line 30 is the same as the first area and the second area, and the overall display effect of the entire panel is the same.
  • This embodiment provides a mask, a mask device and an application method thereof.
  • Two different masks are used to sequentially perform secondary deposition on the surface of the same substrate, so that every part of the upper surface of the substrate except the holed area The positions are coated to form a film, and there is no overlap of the film, which can improve the uniformity of the film formation of the organic material in the peripheral area of the opening area, and prevent the presence of multiple sub-pixels of different colors at the same position on the substrate surface, thereby It can prevent the phenomenon of color mixing or color shift, and improve the quality of the display panel.
  • the above embodiments provide a mask, a mask device and an application method thereof, which can be used to implement OLED CUP (Camera Under Panel) technology, which can be used in mobile phones, tablet computers, televisions, monitors, laptops, and digital photo frames Or any product or component with display function such as navigator.
  • OLED CUP Organic LED Under Panel

Abstract

La présente invention concerne une plaque de masque (100, 200). La plaque de masque (100, 200) est utilisée pour la formation de film d'un substrat (300). Le substrat (300) comprend une région de trou prédéfinie (30). La plaque de masque (100, 200) est divisée par une ligne de division (10, 20) en deux parties, à savoir une région d'ombrage (11, 21) et une région d'ouverture (12, 22). La plaque de masque (100, 200) comprend un substrat de blindage (111, 211). Lorsque la plaque de masque (100, 200) et le substrat (300) sont agencés de manière alignée, la projection de la région de blindage (111, 211) sur la surface du substrat (300) est située dans la région de trou (30). L'invention concerne également un dispositif de masque et un procédé d'application associé.
PCT/CN2019/099638 2019-06-21 2019-08-07 Plaque de masque, dispositif de masque et procédé d'application associé WO2020252864A1 (fr)

Applications Claiming Priority (2)

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CN201910540107.8A CN110241384A (zh) 2019-06-21 2019-06-21 掩膜板、掩膜装置及其应用方法
CN201910540107.8 2019-06-21

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WO2020252864A1 true WO2020252864A1 (fr) 2020-12-24

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Publication number Priority date Publication date Assignee Title
CN110629165B (zh) * 2019-10-31 2021-11-30 昆山国显光电有限公司 一种掩膜版

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