WO2020248735A1 - 摄像模组、电路板组件及其制造方法以及电子设备 - Google Patents

摄像模组、电路板组件及其制造方法以及电子设备 Download PDF

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Publication number
WO2020248735A1
WO2020248735A1 PCT/CN2020/087287 CN2020087287W WO2020248735A1 WO 2020248735 A1 WO2020248735 A1 WO 2020248735A1 CN 2020087287 W CN2020087287 W CN 2020087287W WO 2020248735 A1 WO2020248735 A1 WO 2020248735A1
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WIPO (PCT)
Prior art keywords
base
substrate
molded
circuit board
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/087287
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English (en)
French (fr)
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WO2020248735A9 (zh
Inventor
梅其敏
黄桢
栾仲禹
席逢生
梅哲文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201920865182.7U external-priority patent/CN211089711U/zh
Priority claimed from CN201910498834.2A external-priority patent/CN112073599B/zh
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Publication of WO2020248735A1 publication Critical patent/WO2020248735A1/zh
Publication of WO2020248735A9 publication Critical patent/WO2020248735A9/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the invention relates to the field of optical imaging, in particular to a camera module, a circuit board assembly, a manufacturing method thereof, and electronic equipment.
  • the prior art camera module adopts molding technology to package the photosensitive element in the camera module to reduce the size of the camera module in the horizontal direction.
  • the electronic components of the camera module are mounted on the circuit board through a surface attachment process, and then a molding process is used to integrate the molding material on the circuit board to form a base circuit board.
  • the prior art molding process is to place a semi-finished circuit board in a molded mold, when the molding material is filled, a molded base solidified on the circuit board is formed, and then the mold is drawn to prepare the base. Block circuit board.
  • the drawing angle of the molded circuit board of the camera module in the prior art is less than 90°, which makes the molded circuit of the camera module
  • the structure of the molded base of the board is a structure with a small top and a large bottom. This results in a small width of the upper surface of the molded base, and the space reserved for subsequent processing operations is extremely limited.
  • the glue space reserved for the motor or lens holder to be pasted on the upper surface of the mould is very small, and the amount of glue is not easy to control.
  • the amount of glue is insufficient, which causes the motor or lens holder to be on the moulded base.
  • the surface adhesion is insufficient.
  • the prior art molding process can only increase the width of the upper surface of the molded base. In this way, the size of the lower surface of the molded base also becomes larger, thereby increasing In addition to the overall size of the molded base, the size of the camera module is also virtually increased.
  • the camera module especially the front camera module, must be installed closer to the top of the terminal, while the prior art camera
  • the structure of the molded base of the module has a small top and a large bottom, which makes the circuit board difficult to achieve extremely narrow edges.
  • the mold base of the prior art camera module has a draft angle of less than 90°, the mold base has a structure with a small top and a large bottom.
  • circuit board If one side of the circuit board is designed to be extremely narrow When edged, it will inevitably cause one side of the upper surface of the molded base to be narrower, which may cause the upper surface of the molded base to be unable to reliably attach the light-transmitting component, resulting in unstable imaging of the camera module Even scrapped as a whole.
  • One of the main advantages of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and electronic equipment. Under the premise of ensuring the imaging quality, the camera module can be reduced in size to facilitate the camera module It meets the needs of miniaturization and thinning of the electronic equipment.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the width of the camera module can be effectively reduced under the condition of ensuring the imaging quality, thereby reducing
  • the small camera module occupies the internal space of the electronic device, which is beneficial to the design, processing and development of the electronic device.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and electronic equipment, wherein the width of the circuit board assembly of the camera module can be effectively reduced, thereby maintaining the camera module When the module structure is stable, it is beneficial to reduce the width of the camera module.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein when the area of the lower end surface of the molded base remains unchanged, the mold can be increased The area of the upper end surface of the plastic base provides a larger space for the AA process or the HA process, so as to improve the assembly yield of the electronic product.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, in the same mold
  • the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, in the same mold
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the molded base of the circuit board assembly is extruded and shaped by a mold during the molding process Film, the molding space of the molding base is squeezed by the molding film, so that the draft angle of the molding base is greater than 90°.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and electronic equipment, wherein the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, and the camera module
  • the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, and the camera module
  • the width of the paint on the upper end surface of the molded base can be increased, thereby increasing the force of the lens holder or IR attachment, which helps to improve the manufacturing yield of the camera module.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the molded base of the circuit board assembly is integrally formed on one of the circuit board assemblies through a molding process The circuit board, wherein the draft angle during the molding process of the molded base is greater than 90°, so that the size of the upper end surface of the molded base is larger than the size of the lower end surface.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the inside draft angle of at least one side of the molded base of the circuit board assembly is greater than 90° Wherein, the inner surface of the molded base is inclined from top to bottom outward, thereby reducing the reflection of external stray light on the inner surface of the molded base, and improving the imaging performance of the camera module.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the mold extrudes the plastic film so that the upper end of the inner surface of the molded base is inclined
  • the lower end of the inner surface of the molded base is a curved surface, which is beneficial to reduce the reflection of external stray light on the inner surface of the molded base and improve the imaging performance of the camera module.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the curved surface of the inner surface of the molded base is a rough surface, which is beneficial to reduce the mold
  • the reflection effect of the inner surface of the plastic base on the stray light is beneficial to reduce the reflection of the stray light from the inner surface of the molded base to the photosensitive element and improve the imaging performance of the camera module.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method of manufacturing the same, and an electronic device, wherein at least one side of the molded base of the circuit board assembly has an outside draft angle greater than 90° , So that at least one outer side surface of the molded base is inclined from top to bottom inward to reduce the size of the lower end of the base of the molded base, which is beneficial to reduce the size of the circuit board assembly
  • the substrate reduces the overall size of the camera module.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and electronic equipment, wherein the internal draft angle of at least one side of the molding base of the circuit board assembly is greater than 90° and The external draft angle is greater than 90°, and the molded base gradually becomes narrower from top to bottom, so that the substrate of the circuit board assembly can form a narrow side.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein at least one side of the substrate of the circuit board assembly is a narrow side, and corresponds to the narrow side
  • the inner draft angle of the molded base is greater than 90° and the outer draft angle is greater than 90° to increase the area size of the upper surface of the base of the molded base corresponding to the narrow side. This facilitates the installation of the circuit board assembly and the light-transmitting assembly.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and electronic equipment, wherein at least one side of the circuit board of the circuit board assembly is narrow, and the camera module The extremely narrow side is installed close to the top of the electronic device, thereby helping to increase the screen-to-body ratio of the electronic device.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a method of manufacturing the same, and an electronic device, wherein the mold base is extruded during the molding process. Pressing a molding film to deform, so that the draft angle of at least one side of the molding base during the mold drawing process is greater than 90°.
  • Another advantage of the present invention is to provide a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device, wherein the mold squeezes the plastic film to deform, and the plastic film is deformed by the extrusion of the plastic film. According to the draft angle of the molding base, when the mold is pulled out, the molding film returns to an initial state, so that the mold and the molding film are released from the molding base.
  • a circuit board assembly of the present invention that can achieve the foregoing objectives and other objectives and advantages includes:
  • At least one molded base wherein the molded base includes a base inner wall, a base outer wall, and further has a molded upper end surface and a molded lower end surface, wherein the inner wall of the base forms the molded base A light window of the base, wherein the inner wall of the base further has an inner side surface and an inner arc surface, the inner arc surface extends from the inner side surface, and the inner arc surface faces the molded base.
  • the molded base is integrally formed on the substrate by a molding process, wherein the molded base is manufactured by the following steps:
  • the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold, and a shaping film;
  • the included angle between the inner side surface of the inner wall of the base and the substrate is less than or equal to 90°, so that the inner draft angle of demolding the molded base is greater than or equal to 90° .
  • the roughness of the inner arc surface is greater than the roughness of the inner side surface.
  • the base outer wall of the molded base has an outer side surface and an outer arc surface, wherein the outer side surface extends downwardly and obliquely inwardly from the molded upper end surface to the An outer arc surface, which extends upwardly and obliquely inwardly from the molded lower end surface of the molded base to the outer side surface.
  • the molded base is integrally formed on the substrate by a molding process, wherein the molded base is manufactured by the following steps:
  • the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold, and a shaping film;
  • the included angle between the outer surface of the outer wall of the base and the substrate is less than or equal to 90°, so that the outer draft angle of the molded base is greater than or equal to 90°.
  • the circuit board assembly further includes a photosensitive element, wherein the photosensitive element is electrically connected to the substrate, and the photosensitive element is integrally fixed to the substrate by the mold base.
  • the circuit board assembly further includes a photosensitive element, the photosensitive element is electrically connected to the substrate, and the molded base is integrally provided on the outside of the photosensitive element.
  • the photosensitive element includes a photosensitive portion and at least one non-photosensitive portion, wherein the non-photosensitive portion is located outside the photosensitive portion, and the non-photosensitive portion is electrically connected to the substrate
  • the molded base covers the top of the non-photosensitive portion of the photosensitive element, and the photosensitive element is fixed on the substrate by the molded base.
  • the substrate further has an upper surface of the substrate and a lower surface of the substrate corresponding to the upper surface of the substrate, wherein the photosensitive element is attached to the upper surface of the substrate, and the mold The plastic base is integrally formed on the upper surface of the substrate.
  • the circuit board assembly further includes a set of leads, wherein the leads are electrically connected to the non-photosensitive part of the photosensitive element to the substrate, and the leads are embedded in the molded base Above the substrate.
  • the circuit board assembly further includes at least one electronic device, wherein the electronic device is disposed in the edge area of the substrate, and the molded base embeds the electronic device ⁇ The substrate.
  • the substrate is further provided with a bonding area and an edge area, wherein the photosensitive element is attached to the bonding area, and the edge area is located at the periphery of the bonding area,
  • the photosensitive element is attached to the substrate in a manner close to one side of the substrate, so that the edge area of the substrate forms at least one narrow side and at least one load side, wherein the width of the narrow side is less than The width of the load side.
  • the circuit board assembly further includes at least one electronic device, wherein the electronic device is disposed on the load side of the substrate, and the molded base embeds the electronic device ⁇ The substrate.
  • the present invention further provides a camera module, including:
  • a lens wherein the lens is held above the photosensitive element along the photosensitive path of the photosensitive element;
  • At least one filter element wherein the filter element is held between the lens and the photosensitive element.
  • the camera module further includes a driving device, wherein the driving device is disposed above the molded base, the lens is installed on the driving device, and The driving device drives the movement of the lens.
  • the filter element is disposed above the molded base of the circuit board assembly, and the filter element is supported by the molded base.
  • the camera module further includes a lens holder, wherein the lens holder is disposed between the driving device and the molded base, and the filter element is disposed on The lens holder supports the filter element by the lens holder.
  • the present invention further provides an electronic device, including:
  • the present invention further provides a manufacturing method of a circuit board assembly, wherein the manufacturing method includes the following steps:
  • the photosensitive element is attached to the upper surface of the substrate, and a set of leads is arranged, and the photosensitive element is electrically connected by the leads.
  • the component is on the substrate.
  • the method before the step (b) of the above method, further includes the step of: extracting air between the plastic film and the upper mold in a manner of suction to attach the plastic A shaped film on the lower surface of the upper mold.
  • a spacer of the upper mold extrudes the shaped film onto the photosensitive element, wherein the shaped film is extruded
  • An inner extension portion is formed by pressing, wherein the inner extension portion squeezes the molding space outward from the spacer block, so that the inner draft angle of the molding base is greater than or equal to 90°.
  • the molding material is molded on the outer side of the inner extension portion, and cured to form a base of the molded base Inner wall.
  • the molding material fills the molding space, wherein the inner wall of the molded base is formed on the inner extension portion
  • the inner side and inner arc surface of the inner wall of the base are formed by the inner extension part.
  • a pressing block of the upper mold extrudes the shaped film onto the substrate, wherein the shaped film is extruded
  • An extension part is formed by pressing, wherein the extension part squeezes the molding space inwardly from the isolation block, so that the outer draft angle of the molding base is greater than or equal to 90°.
  • the molding material is molded on the inner side of the extension portion, and cured to form an outer wall of the molded base .
  • the molding material fills the molding space, wherein the base outer wall of the molding base is molded on the outer extension portion On the inner side, the outer side surface and the outer arc surface of the outer wall of the base are formed by the outer extension portion.
  • step (d) of the above method further includes: pulling the upper mold of the mold to release the pressure of the upper mold on the shaping film, wherein the shaping The membrane returns to its original state under the action of elasticity.
  • FIG. 1 is a perspective view of an electronic device according to a first preferred embodiment of the present invention.
  • FIG. 2 is an overall schematic diagram of a camera module of the electronic device according to the above preferred embodiment of the present invention.
  • FIG. 3 is an exploded schematic diagram of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 4 is a perspective cross-sectional view of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • Fig. 5A is a three-dimensional schematic diagram of a circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • 5B is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • 5C is a three-dimensional schematic diagram of a circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • 5D is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • 6A is a three-dimensional schematic diagram of another circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • 6B is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • 6C is a three-dimensional schematic diagram of another circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • 6D is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 7A is a perspective cross-sectional view of another circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 7B is a schematic diagram of an alternative implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 7C is a schematic diagram of another alternative implementation of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 7D is a schematic diagram of another alternative implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 8 is an overall schematic diagram of another camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 9 is an exploded schematic view of a camera module of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 10 is a perspective cross-sectional view of the camera module of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIGS. 11A to 11F are schematic diagrams of steps in the manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • 12A to 12F are schematic diagrams of steps in another manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 13 is a schematic diagram of another modified implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • 14A is a schematic diagram of the molding of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • 14B is a cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • 15 is a schematic diagram of a modified implementation of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 16 is a schematic diagram of another modified implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 17 is a schematic diagram of another modified implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 18 is a perspective cross-sectional view of a camera module according to the second preferred embodiment of the present invention.
  • 19A is a schematic diagram of the manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • 19B is a schematic diagram of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.
  • the electronic device includes at least one camera module 100 and an electronic device body 200 equipped with the at least one camera module 100, wherein the electronic device body 200 controls the camera module 100 to capture images.
  • the camera module 100 may be mounted on the electronic device body 200 in a manner facing the front of the electronic device body 200, and the camera module 100 assists the electronic device body 200 to assist in photographing the Image information in front of the electronic device.
  • the camera module 100 is used as a front camera device of the electronic equipment.
  • the manner in which the camera module 100 is installed on the electronic device body 200 is merely exemplary here, and not limited. Therefore, the at least one camera module 100 can also be mounted on the electronic device body 200 in a manner facing the back of the electronic device body 200, that is, the camera module 200 serves as a rear camera of the electronic device. A device for shooting image information behind the electronic device.
  • the electronic device may be implemented as a smart phone.
  • the camera device in the electronic device is shown in the form of a single camera.
  • the camera module can also be implemented as an array camera module, such as a dual camera. Camera module, triple camera module or other multi-camera module.
  • the type of the electronic device is only taken as an example here.
  • the drawings in the specification of the present invention take a mobile phone device as an example, but it is not limited to a smart phone device.
  • the electronic device can also be implemented as other electronic devices with shooting functions. Devices, such as tablet computers, smart home electronic devices, and other types of electronic devices.
  • the camera module 100 includes at least one circuit board assembly 10 and at least one lens 20, wherein the lens 20 is held above the circuit board assembly 10 along the photosensitive path of the camera module 100, and light passes through the The lens 20 is received to the circuit board assembly 10 for the circuit board assembly 10 to receive the light and convert the light signal into an electrical signal.
  • the circuit board assembly 10 includes a substrate 11, a molded base 12, and a photosensitive element 130, wherein the photosensitive element 130 is disposed on the substrate 11, and the molded base 12 is integrally formed The method is formed on the substrate 11, wherein the photosensitive element 130 is fixed to the substrate 11 by the mold base 12.
  • the photosensitive element 130 is electrically connected to the substrate 11 of the circuit board assembly 10, and the electrical signal generated by the photosensitive element 130 is transmitted to the electronic device body 200 through the substrate 11.
  • the circuit board assembly 10 of the camera module 100 is communicatively connected to the electronic device body 200.
  • the circuit board assembly 10 is based on a molding process to integrally form the molded base 12 on the substrate 11.
  • the camera module 100 further includes at least one filter element 40, wherein the filter element 40 is disposed between the photosensitive element 130 and the lens 20, and the filter element 40 filters the light by the lens 20 The stray light transmitted to the photosensitive element 130 helps to improve the imaging quality of the camera module 100.
  • the lens 20 is an optical system element of the camera module 100, wherein the lens 20 includes at least one optical lens 21 and at least one lens barrel 22, wherein the optical lens 21 is based on The optical axis of the camera module is arranged on the lens barrel 22.
  • the number of the optical lenses 21 of the lens 20 is multiple, wherein the optical lenses 21 are arranged on the lens barrel 22 based on the optical axis direction.
  • the lens barrel 22 holds the optical lens 21 of the lens 20 above the photosensitive path of the photosensitive element 130.
  • the filter element 40 of the camera module 100 is disposed on the molded base 12 of the circuit board assembly 10, and the molded base The seat 12 holds the filter element 40.
  • the filter element 40 is attached to the upper side of the molded base 12 in an attached manner.
  • the manner in which the filter element 40 is installed in the present invention is only exemplary here, and not limited. Therefore, the filter element 40 can also be installed on the molded base 12 by other installation methods, for example, the filter element 40 can be installed on the molded base 12 through a mounting bracket.
  • a bracket fixedly maintains the position of the filter element 40; or the filter element 40 is arranged on a bracket which is arranged above the photosensitive element 130.
  • the camera module 100 further includes a driving device 50, wherein the at least one lens 20 is disposed on the driving device 50, and the driving device 50 maintains a position based on the photosensitive path.
  • the lens 20 is above the photosensitive element 130.
  • the driving device 50 is disposed on the molded base 12 of the circuit board assembly 10, wherein the driving device 50 is supported by the molded base 12 to drive the lens 20 to move.
  • the driving device 50 can be attached to the upper side of the molded base 12 by gluing.
  • the lens barrel 22 of the lens 20 is drivably disposed on the driving device 50, wherein the driving device 50 drives the lens barrel 22 to move.
  • the driving device 50 of the camera module 100 may be but not limited to a motor, such as a voice coil motor, wherein the driving device 50 drives the lens 20 along the photosensitive element 130 Move above the photosensitive path.
  • the driving device 50 and the filter element 40 are attached or glued to the molded base 12 surface. Therefore, the upper surface of the molded base 12 of the circuit board assembly 10 needs to reserve a sufficiently large attachment surface for the driving device 50 and the filter element 40 to attach.
  • the molded base 12 is integrally formed on the substrate 11 through a molding process, and the molding material forming the molded base 12 is wrapped on the substrate 11 . It is understandable that since the molding material is integrally formed on the surface of the substrate 11, the size of the surface area of the substrate 11 must be at least greater than or equal to the size of the bottom of the molding base 12. So that the substrate 11 is sufficient to support the molding of the molding material. Those skilled in the art can understand that when the size of the lower part of the molded base 12 is reduced, the size of the substrate 11 corresponding to the lower part of the molded base 12 can be reduced, so as to be sufficient to carry the mold. In the case of the plastic base 12, the overall size of the circuit board assembly 10 can be reduced.
  • the mold base 12 fixes the photosensitive element 130 on the substrate 11 through a molding process.
  • the molded base 12 includes a base upper end 121 and a base lower end 122, wherein the base upper end 121 integrally extends upward from the base lower end 122, and the base lower end
  • the part 122 is integrally attached to the upper surface of the substrate 11.
  • the molded base 12 has a structure with a large top and a small bottom, wherein the size of the upper end 121 of the molded base 12 is larger than the size of the bottom 122 of the base.
  • the molded base 12 has a structure with a large upper part and a small lower part, wherein the lower part of the molded base 12 is small in size, so as to reduce the overall width of the circuit board assembly 10.
  • the size of the upper end 121 of the molded base 12 is larger than the size of the lower end 122 of the base, so that the upper end 121 of the molded base 12 has enough Space is provided for the driving device 50 and the filter element 40 to be attached to the upper end 121 of the base.
  • the structural size of the upper end 121 of the base is larger than the structural size of the lower end 122 of the base, when the size of the lower end 122 of the base is reduced in order to reduce the substrate 11 of the circuit board assembly 10
  • the upper end 121 of the molded base 12 also has enough space for subsequent processing processes, such as AA process and HA process.
  • the molded base 12 further has a molded upper end surface 123 and a molded lower end surface 124, wherein the molded upper end surface 123 is located on the upper surface of the molded base 12, that is, the upper end of the base 121 upper surface; wherein the lower molded end surface 124 is formed on the lower surface of the molded base 12, that is, the lower surface of the lower end 122 of the base.
  • the lower molded end surface 124 is integrally formed on the upper surface of the base 11 by the molding material through a molding process, or the lower molded end surface 124 faces each other through a molding process.
  • the ground is integrally attached to the upper surface of the base 11.
  • the molded upper end surface 123 is a smooth surface formed on the upper surface of the molded base 12, so that a glue layer is applied to the molded upper end surface 123 and uniformly applied to the supported object. The supporting force.
  • the size and area of the upper molded end surface 123 are larger than those of the lower molded end surface 124, so that the upper molded end surface 123 of the molded base 12 can be provided on the The filter element 40 and the driving device 50 have enough space to meet the processing requirements of the molded base 12. It is understandable that if the size of the upper molded end surface 123 of the molded base 12 meets the requirements of subsequent processing (such as the AA process or the HA process), the mold of the molded base 12 The size of the molded lower end surface 124 is smaller than the size of the molded lower end surface 123, so as to reduce the width of the substrate 11 of the circuit board assembly 10, thereby reducing the overall size of the circuit board assembly 10 size.
  • the size of the substrate 11 of the circuit board assembly 10 is the main factor that restricts the overall width of the camera module 100. Therefore, when the width of the substrate 11 of the circuit board assembly 10 is reduced, it is beneficial to reduce the overall size of the camera module 100. When the size of the camera module 100 is reduced and the camera module 100 is mounted on the electronic device body 200, the ratio of the camera module 100 to the electronic device body 200 can be reduced, which is beneficial to improve The screen-to-body ratio of the electronic device.
  • the upper end 121 of the molded base 12 can be enlarged, and the molded The area size of the upper end surface 123 is increased, thereby increasing the size of the contact surface of the driving device 50 and the filter element 40 with the circuit board assembly 10, which is easy to install on the molded base 12 Mold the upper end face with 123 paint glue, and increase the width of paint glue.
  • the space reserved for the AA process and the HA process is very small.
  • the size of the end surface 123 can increase the processing space reserved for the AA process or the HA process, thereby helping to improve the yield of the AA process.
  • the molded base 12 of the circuit board assembly 10 further includes a base inner wall 125 and a base outer wall 126, wherein the base inner wall 125 is formed on the inner inner wall of the molded base 12, wherein The base outer wall 126 is formed on the outer outer wall of the molded base 12.
  • the base inner wall 125 and the base outer wall 126 of the molded base 12 are formed on the inner and outer sides of the molded base 12 after being drawn through a molding process.
  • the base inner wall 125 of the molded base 12 is formed on an inclined surface of the molded base 12 that is inclined outward from top to bottom.
  • the inner surface of the molded base 12 is obliquely downward facing the substrate 11 of the circuit board assembly 10, and the projection of the inner wall 125 of the base in the vertical direction is reflected by the molded upper end surface.
  • the projection of 124 in the vertical direction is covered, that is, along the photosensitive path direction of the camera module 100, the projection of the inner wall 125 of the base is covered by the projection of the upper molded surface 124.
  • the base inner wall 125 and the base outer wall 126 of the molded base 12 are flat surfaces formed on the inner and outer sides of the molded base 12, or curved surfaces with a certain curvature shape, or It is an irregularly shaped arc. Therefore, in the present invention, the shape, curvature and smoothness of the base inner wall 125 and the base outer wall 126 are not limited herein.
  • the molded base 12 of the circuit board assembly 10 can By reducing the stray light from entering the photosensitive element 130 through reflection, the influence of stray light on the imaging of the camera module 100 can be effectively reduced, and the imaging performance of the camera module 100 can be improved.
  • the base inner wall 125 of the molded base 12 faces the substrate 11 of the circuit board assembly 10 so as to prevent stray light from being irradiated on the base inner wall 125 and then reflected to the photosensitive element 130.
  • the molded base 12 has the base inner wall 12 slanted inwardly and downwardly, which reduces the reflection of the base inner wall 12 of the molded base 12 to the photosensitive element 130 Stray light, thereby improving the imaging quality of the camera module 100.
  • the base inner wall 125 of the molded base 12 is a rough surface formed on the inner side of the molded base, wherein the molded base 12 The roughness of the inner wall 125 of the base is greater than the roughness of the upper surface of the molded base 12.
  • the base inner wall 125 of the molded base 12 is a non-smooth surface to reduce the reflection effect of the base inner wall 125 on light, which is beneficial to reduce the stray light reflected by the base inner wall 125.
  • Each base inner wall 125 of the molded base 12 has an inner side surface 1251 and an inner arc surface 1252 extending downwardly from the inner side surface 1251 integrally, wherein the inner side surface 1251 is molded from the molded base
  • the inner side of the molded upper end surface 123 of the base 12 extends downwardly and obliquely outward to the inner arc surface 1252.
  • the inner arc surface 1252 extends upward and obliquely outward from the lower molded end surface 124 of the molded base 12 to the inner side surface 1251.
  • the inner side 1251 of the inner wall 125 of the molded base 12 may also be a vertical surface perpendicular to the upper molded surface 123, that is, the inner side 1251 is perpendicular to The upper end surface 123 is molded.
  • the inner surface 1251 of the inner wall 125 of the base is an inclined plane of the inner wall 125 of the base.
  • the opening of the inner arc surface 1252 faces the inner side of the molded base 12.
  • the inner arc surface 1252 of the inner wall 125 of the base is a rough surface formed on the lower end of the inner wall 125 of the base, wherein the inner arc surface 1252 of the inner wall 125 of the base is formed on the molded base 12 The inside of the lower part.
  • the inner arc surface 1252 in the form of a rough surface can reduce the reflection of light, so that the inner arc surface 1252 can reduce the stray light reflected to the photosensitive element 130, which is beneficial to improve the camera module 100 imaging performance.
  • the base outer wall 126 of the molded base 12 is formed on an inclined surface inclined inwardly from the top to the bottom of the base 12, wherein the base 12
  • the projection of the base outer wall 126 in the vertical direction is covered by the projection of the molded upper end surface 124 in the vertical direction, that is, along the photosensitive path direction of the camera module 100, the projection of the base outer wall 126 is covered by the The upper end face 124 is covered by the molding.
  • the molded base 12 is a structure with a large top and a small bottom, wherein the base outer wall 126 of the molded base 12 is inclined downwardly toward the substrate of the circuit board assembly 10 11.
  • the base upper end 121 of the molded base 12 extends from top to bottom inwardly to the base lower end 122 of the molded base 12, and the base of the molded base 12
  • the size of the lower end 122 of the base is smaller than the size of the upper end 121 of the base.
  • the size of the lower end 122 of the molded base 12 is reduced, so as to reduce the width of the substrate 11 of the circuit board assembly 10.
  • Each base outer wall 126 of the molded base 12 has an outer side surface 1261 and an outer arc surface 1262, wherein the outer side surface 1261 extends from the molded upper end surface 123 of the molded base 12
  • the outer side extends downwardly and obliquely inward to the outer arc surface 1262.
  • the outer arc surface 1262 extends upwardly and obliquely inward from the molded lower end surface 124 of the molded base 12 to the outer side surface 1261.
  • the outer side surface 1261 of the base outer wall 126 of the molded base 12 may also be a vertical surface perpendicular to the molded upper end surface 123, that is, the outer side surface 1261 is perpendicular to The upper end surface 123 is molded.
  • the outer side surface 1261 of the base outer wall 126 is an inclined plane of the base outer wall 126.
  • the opening of the outer arc surface 1262 faces the outside of the molded base 12 or faces the substrate 11.
  • the outer arc surface 1262 of the base outer wall 126 is formed on the outside of the lower part of the molded base 12, wherein the outer arc surface 1262 of the base outer wall 126 is recessed from the outside to the inside to reduce The size of the lower end 122 of the molded base 12.
  • the driving device 50 of the camera module 100 is disposed on the molded base 12 of the circuit board assembly 10 by means of glue.
  • the camera module 100 further includes a base glue layer 60, wherein the base glue layer 60 is formed on the upper end surface 123 of the base 12 of the molded base 12 by way of paint. It is understandable that the base glue layer 60 can also be implemented as being formed on the bottom of the driving device 50 by a painting glue process.
  • the molded base 12 is further provided with a painting area 127, wherein the painting area 127 is located on the upper end surface 123 of the base of the molded base 12.
  • the glue is glued to the glue area 127, and the base glue layer 60 is formed on the glue area 127. It can be understood that the formation of the base glue layer 60 may not be limited to solid colloidal materials and fluid colloidal materials.
  • the base of the molded base 12 When the lower end 122 of the molded base 12 is reduced, or the size of the lower end 122 of the base remains unchanged, the base of the molded base 12
  • the upper end 121 can be enlarged to increase the size of the upper end surface 123 of the base 12 of the molded base 12, which is beneficial to increase the width of the paint area 127, so as to increase the size of the camera module 100.
  • the width of the base rubber layer 60 Those skilled in the art can understand that by increasing the width of the glue area 127 of the molded base 12 to increase the width of the base glue layer 60 of the camera module 100, it is beneficial to the molding.
  • the attachment of the base 12 and the driving device 50 improves the attachment reliability.
  • the circuit board assembly 10 of the camera module 100 further includes a set of lead wires 13, wherein the lead wires 13 connect the photosensitive element 130 to the substrate 11.
  • the substrate 11 of the circuit board assembly 10 communicates with the photosensitive element 130 through the lead 13, so that the photosensitive element 130 transmits electrical signals to the substrate 11 of the circuit board assembly 10 through the lead 13.
  • the lead 13 and the photosensitive element 130 of the circuit board assembly 10 of the camera module 100 are embedded in the molded base 12, In order to reduce the size of the width dimension of the camera module 100.
  • the molded base 12 is integrally molded on the substrate 11 so as to wrap around the photosensitive element 130 and the lead 13.
  • the lead 13 of the circuit board assembly 10 is embedded in the molded base 12, and the molded base 12 further fixes the photosensitive element 130 on the substrate. 11.
  • the lead 13 and part of the photosensitive element 130 are embedded by the molded base 12, so as to reduce the size of the substrate 11 of the circuit board assembly 10 and increase the utilization rate of the photosensitive element 130 .
  • the circuit board assembly 10 further has a light window 14, wherein the light window 14 is formed on the inner side of the molded base 12 through a molding process.
  • the lens 20 transmits light to the photosensitive element 130 through the light window 14.
  • the light window 14 is bounded by the inner wall 125 of the molded base 12.
  • the size of the opening of the light window 14 should be adapted to the photosensitive element 130 so that the light entering the module can be received by the photosensitive element 130.
  • the size of the upper opening of the light window 14 is less than or equal to the size of the lower opening of the light window 14, wherein the upper opening of the light window 14 limits the The light transmission of the camera module 100 is described.
  • the upper opening of the light window 14 can restrict the entry of part of the external stray light, and the inner wall 125 of the base faces the substrate 11 of the circuit board assembly 10, and light does not enter through the inner wall of the base 125 reflects, thereby avoiding the generation of stray light, thereby improving the imaging quality of the camera module 100.
  • the photosensitive element 130 further includes a photosensitive portion 31 and a non-photosensitive portion 32, wherein the non-photosensitive portion 32 extends outward from the photosensitive portion 31 integrally.
  • the photosensitive part 31 receives the light transmitted by the lens 20 and converts the light signal to a corresponding electrical signal.
  • the lead 13 connects the non-photosensitive portion 32 of the photosensitive element 130 to the substrate 11 of the circuit board assembly 10, so that the photosensitive element 130 transmits the photoelectric conversion signal to the substrate 11 through the lead 13
  • the light window 14 corresponds to the photosensitive portion 31 of the photosensitive element 130.
  • the non-photosensitive portion 31 of the photosensitive element 130 is embedded in the molded base of the circuit board assembly 10.
  • the molded base 12 fixes the photosensitive element 130 on the upper surface of the substrate 11.
  • the lower surface of the photosensitive element 130 is attached to the upper side of the substrate 11, wherein the upper surface of the photosensitive element 130 has a photosensitive area 33 and a non-sensitive area 34, wherein the non-sensitive area 33 is located on the photosensitive element.
  • the non-photosensitive area 34 is located on the upper end surface of the non-photosensitive portion 32 and the edge portion of the upper end surface of the photosensitive portion 31.
  • the size of the photosensitive area 33 of the photosensitive unit 30 corresponds to the size of the upper opening (aperture) of the light window 14, and the molded base 12 covers a portion of the upper surface of the photosensitive element Corresponding to the non-photosensitive area 34 of the photosensitive element 130.
  • the photosensitive area 33 of the photosensitive element 130 is based on the light window 14 and receives light transmitted by the lens 20.
  • the circuit board assembly 10 further includes at least one electronic device 15, wherein the electronic device 15 is disposed on the surface of the substrate 11.
  • the at least one electronic device 15 is attached to the edge of the substrate 11, and the electronic device 15 is embedded on the upper surface of the substrate 11 by the molded base 12.
  • the electronic device 15 of the circuit board assembly 10 is covered by the molded base 12, and the electronic device 15 is isolated by the molded base 12, so as to protect the electronic device of the circuit board assembly.
  • Device 15 avoid oxidation due to prolonged contact with the environment.
  • the substrate 11 has a substrate upper surface 111 and a substrate lower surface 112 corresponding to the substrate upper surface 111, wherein the photosensitive element 130 and the electronic device 15 are attached to the substrate upper surface 111.
  • the molded base 12 is integrally formed on the upper surface 111 of the substrate 11, wherein the width dimension of the substrate upper surface 111 of the substrate 11 is greater than or equal to the width dimension of the molded base 12 .
  • the width dimension of the molded base 12 can be reduced, the size of the substrate 11 corresponding to the lower end of the molded base 12 can be correspondingly reduced, thereby reducing the width of the circuit board assembly 10
  • the size is conducive to reducing the overall size of the camera module 100.
  • the substrate 11 is further provided with a bonding area 113 and an edge area 114, wherein the photosensitive element 130 is attached to the bonding area 113 of the substrate 11, and the edge area 114 is located in the bonding area 113 Surrounding.
  • the molded base 12 is integrally formed on the edge area 114 of the substrate 11.
  • the lower end 122 of the molded base 12 covers or is embedded in the edge area 114 of the substrate 11.
  • the size of the edge region 114 of the substrate 11 is greater than or equal to the size of the lower end 122 of the molded base 12. Therefore, the size of the substrate 11 of the circuit board assembly 10 can be reduced by reducing the size of the lower end 122 of the molded base 12, thereby reducing the camera module 100 The overall size.
  • FIGS. 5A to 7B of the drawings of the specification of the present invention several alternative implementations of the circuit board assembly 10 of the above-mentioned preferred embodiment of the present invention are shown.
  • the substrate 11 of the circuit board assembly 10 is connected to the photosensitive element 20 through the lead 13, wherein the electronic device 15 is arranged on the upper surface of the substrate 11.
  • the substrate 11 is placed in a mold 300 for molding, and the mold 300 is integrated by molding.
  • the molded base is formed on the upper surface of the substrate 11.
  • the draft angle of the drafting process for forming the molding base 12 is greater than or equal to 90° (including 90°), so that the After the molded base 12 is formed on the substrate 11, the size of the upper end 121 of the molded base 12 is larger than the size of the lower end 122 of the base.
  • FIG. 7C two different embodiments of the inner surface 1251 and the inner arc surface 1252 of the base inner wall 125 of the molded base 12 are shown, wherein the inner arc surface 1252 A groove is recessed from the inside to the outside, wherein the inner side surface 1251 is located above the groove.
  • the inner side surface 1251 of the base inner wall 125 of the molded base 12 smoothly extends downward to the inner arc surface 1252, wherein the inner side surface 1251 and the inner surface 1251
  • the connection part of the arc surface 1252 has a smooth chamfer.
  • the molded base 12 formed by impacting the molding material on the substrate 11 and/or the photosensitive element 130, the base inner wall 125 of which forms an inner side surface, an inner arc surface and an inclined surface.
  • the inner side surface is located above the inner arc surface, and the inclined surface is an inclined surface formed by the molding material impacting on the substrate 11 or the photosensitive element 130.
  • the draft angle of the drafting process for forming the molded base 12 includes at least one inner draft angle and at least one outer draft angle, wherein the base of the molded base 12
  • the inclination angle and shape of the inner wall 125 depend on the size of the inner draft angle
  • the inclination angle and shape of the base outer wall 126 of the molded base 12 depend on the outer draft angle.
  • at least one draft angle in the molding process of the molding base 12 is greater than or equal to 90°.
  • the inner draft angle of at least one side of the molded base 12 is greater than or equal to 90° (including 90°), so that the molded base 12 has at least The inner wall 125 of the base on one side extends obliquely from top to bottom.
  • the angle between the outer side of the molded base 12 and the substrate 11 is less than or equal to 90° (including 90°), so that the outer wall 126 of the molded base 12 after molding The lower ground tilts inward.
  • the inner draft angle of each side of the molded base 12 is greater than or equal to 90° (including 90°), so that the inner wall 125 of the molded base 12 is inclined inward, This prevents stray light from being reflected by the inner wall 125 of the base and entering the photosensitive element 130.
  • the included angle between the inner wall 125 of the molded base 12 and the vertical direction of the molded base 12 is ⁇ 1 , wherein the included angle ⁇ 1 is greater than zero. It can be understood that the base inner wall of the molded base 12 extends upwardly and obliquely from the molded base 12, when the molded lower end surface 124 of the molded base 12 Under the condition that the size of the area remains unchanged, the angle between the inner wall 125 of the base and the vertical direction of the molded base 12 is adjusted to ⁇ 1 by adjusting the inner draft angle to increase the The area of the upper end surface 123 of the base 12 is molded to facilitate the subsequent AA process or HA process.
  • Base molding 12 where the angle of the inner wall 125 of the base 11 of the substrate plane is ⁇ 1, where alpha] l or less 90 °, and the angle alpha] l and ⁇ 1 is 90 °.
  • the included angle between the inner wall 125 of the base and the plane where the substrate 11 is located is an acute angle ⁇ 1 of less than 90°. It can be understood that the inside draft angle of the molding base 12 is 90°+ ⁇ 1 .
  • the inner wall 125 of the molded base 12 may be a flat surface or a curved surface formed inside the molded base 12. As shown in FIGS. 5C and 5D, the inner wall 125 of the base is a curved surface formed on the inner side of the molded base 12, and the inner wall 125 of the base has a certain curvature along the photosensitive path of the camera module 100. The direction, that is, in the vertical direction of the camera module 100, the projection of the inner wall 125 of the base is covered by the upper end surface 123 of the base 12 of the molded base 12.
  • the molded base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 through a molding process, and at least one side of the molded base 12 is externally drawn The angle is greater than or equal to 90° (including 90°), so that the base outer wall 126 on at least one side of the molded base 12 after molding is inclined from top to bottom inward.
  • the angle between the inner side of the molded base 12 and the base plate 11 is less than or equal to 90° (including 90°), so that the outer wall 126 of the molded base 12 after molding is formed from above The lower ground tilts inward.
  • the inner draft angle of each side of the molded base 12 is greater than 90° (including 90°), so that the base outer wall 126 of the molded base 12 moves from top to bottom. Tilt within.
  • the included angle between the base outer wall 126 of the molded base 12 and the vertical direction of the molded base 12 is ⁇ 2 , wherein the included angle ⁇ 2 is greater than zero.
  • the angle between the base molding an outer wall 126 of the base plane of the substrate 11 is ⁇ 2, where alpha] 2 is less than equal to 90 °, and the angle ⁇ alpha] 2 and 2 is 90 °.
  • the included angle between the outer wall 126 of the base and the plane where the substrate 11 is located is an acute angle ⁇ 2 less than 90°. It can be understood that the inside draft angle of the molding base 12 is 90°+ ⁇ 2 .
  • the base outer wall 126 of the molded base 12 may be a flat surface or a curved surface formed on the outside of the molded base 12. As shown in FIGS. 6C and 6D, the base outer wall 126 is a curved surface formed on the outside of the molded base 12, wherein the base outer wall 126 has a certain curvature along the photosensitive path of the camera module 100 The direction, that is, in the vertical direction of the camera module 100, the projection of the outer wall 126 of the base is covered by the upper end surface 123 of the base 12 of the molded base 12.
  • the molded base 12 when the size of the base upper end 121 of the molded base 12 remains unchanged and is sufficient to support and assemble the driving device 50 and the green light element 40, the molded base The lower end 122 of the base 12 extends obliquely inward from the upper end 121 of the base, so that the bottom end of the molded base 12 becomes smaller, which is beneficial to reduce the circuit board assembly 10
  • the size of the substrate 11 is beneficial to reduce the overall size of the camera module.
  • FIGS. 7A to 7D of the accompanying drawings of the specification of the present invention another alternative implementation of the molded base 12 of the camera module 100 according to the above-mentioned preferred embodiment of the present invention is described in the following Clarified in.
  • the molded base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 through a molding process, and at least one side of the molded base 12 is externally drawn The angle is greater than or equal to 90° (including 90°), so that the base outer wall 126 on at least one side of the molded base 12 after molding is inclined from top to bottom inward.
  • the draft angle of the inner side of the molding base 12 is greater than or equal to 90° (including 90°), so that the base outer wall 126 of the molded base 12 after molding is inclined outward from top to bottom .
  • the inner draft angle of each side of the molding base 12 is greater than 90° and the outer draft angle is greater than 90°, so that the molded base 12 after molding is larger in size and smaller in size.
  • the included angle between the inner wall 125 of the molded base 12 and the vertical direction of the molded base 12 is ⁇ 1 , wherein the included angle ⁇ 1 is greater than zero.
  • the included angle between the base outer wall 126 of the molded base 12 and the vertical direction of the molded base 12 is ⁇ 2 , wherein the included angle ⁇ 2 is greater than zero.
  • Base molding 12 where the angle of the inner wall 125 of the base 11 of the substrate plane is ⁇ 1, where alpha] l or less 90 °, and the angle alpha] l and ⁇ 1 is 90 °.
  • the included angle between the inner wall 125 of the base and the plane where the substrate 11 is located is an acute angle ⁇ 1 of less than 90°.
  • the inside draft angle of the molding base 12 is 90°+ ⁇ 1 . 12 where the angle between the base molding an outer wall 126 of the base plane of the substrate 11 is ⁇ 2, where alpha] 2 is less than equal to 90 °, and the angle ⁇ alpha] 2 and 2 is 90 °.
  • the included angle between the outer wall 126 of the base and the plane where the substrate 11 is located is an acute angle ⁇ 2 less than 90°. It can be understood that the inside draft angle of the molding base 12 is 90°+ ⁇ 2 .
  • the inner wall 125 of the molded base 12 may be a flat surface or a curved surface formed inside the molded base 12.
  • the inner wall 125 of the base is a curved surface formed on the inner side of the molded base 12, wherein the inner wall 125 and the outer wall 126 of the base have a certain curvature along the The direction of the photosensitive path of the camera module 100, that is, in the vertical direction of the camera module 100, the projections of the inner wall 125 and the outer wall 126 of the base are affected by the base of the molded base 12
  • the upper end surface of the seat is covered with 123.
  • the inner wall of the molded base 12 can reduce the external stray light from entering the photosensitive element 130, and the size of the lower end 122 of the molded base 12 can be reduced to reduce the size of the base 11, which is beneficial to all
  • the overall size of the camera module 100 is described. While the base lower end surface 124 of the molded base 12 is reduced, the base upper end surface 123 of the molded base 12 can be enlarged to make the molded base 12 The upper end 121 of the molded base 12 is enlarged on the premise that the lower end 122 of the base is reduced.
  • the size of the lower end surface 124 of the molded base 12 decreases, In order to reduce the size of the molded base 12, and the size of the upper end surface 123 of the molded base 12 to increase, so that the molded base 12 provides a larger size for subsequent processing. Processing space.
  • the camera module 100 further includes a lens holder 70, wherein the lens holder 70 is disposed between the molding base 12 and the driving device 50, and the driving device is fixed by the lens holder 70 50 is attached to the molded base 12 of the circuit board assembly 10.
  • the filter element 40 of the camera module 100 is also disposed on the lens holder 70, wherein the lens holder 70 supports the filter element 40 to maintain the filter The element 40 is above the photosensitive element 130.
  • the lens holder 70 can be implemented as a supporting base, wherein the lens holder 70 further includes a lens holder body 71 and a lens holder glue layer 72, wherein the lens holder glue layer 72 is provided Above or below the lens holder 70, the driving device 50 is fixed to the lens holder body 71 through the lens holder adhesive layer 72, or the lens holder body 71 is fixed to the lens holder body 71 through the lens holder adhesive layer 72 The molded base 12. The driving device 50 is supported by the lens holder main body 71 to drive the lens 20 to move.
  • FIGS. 11A to 11G of the drawings of the specification of the present invention the process of the method for manufacturing the circuit board assembly 10 of the camera module 100 of the above-mentioned preferred embodiment of the present invention is shown.
  • FIG. 11A first, at least one substrate 11 of the circuit board assembly 10 is provided or prepared.
  • the photosensitive element 130 is attached to the upper end of the substrate 11.
  • the substrate 11 of the circuit board assembly 10 is provided as a semi-finished product, wherein the lead 13 connects the photosensitive element 130 to the substrate 11.
  • the substrate 11 of the circuit board assembly 10 is placed in the mold 300, and the substrate 11 is fixed by the mold 300.
  • the mold 300 includes an upper mold 310, a lower mold 320, and at least one processing space 330, wherein the processing space 330 is located between the upper mold 310 and the lower mold 320 .
  • the substrate 11 is placed in the processing space 330.
  • the processing space 330 between the upper mold 310 and the lower mold 320 is squeezed and reduced until the upper mold 310 is attached Fitted to the upper surface of the substrate 11.
  • the mold 300 further includes a molding film 340, wherein the molding film 340 is disposed under the upper mold 310 of the mold 300, when the upper mold 310 and the lower mold 320 When clamping the mold, the shaping film 340 is attached to the upper mold 310.
  • the upper mold 310 of the mold 300 squeezes the molding film 340 on the upper surface of the substrate 11 so that a part of the molding film 340 is closely adhered to the substrate 11.
  • a molding space 350 is further formed between the molding film 340 and the substrate 11, wherein the molding material of the molding base 12 is placed in the molding space 350 In the process, the molded base 12 is formed by curing.
  • the shaping film 340 of the mold 300 has elasticity. After the upper mold 310 and the lower mold 320 are closed, the upper mold 310 squeezes the shaping film 340, The plastic film 340 is squeezed to produce elastic deformation. It is understandable that the shape contour of the shaping film 340 determines the spatial shape characteristics of the molding space 350, and the molding base 12 is obtained after the molding material is molded in the molding space 350.
  • the upper mold 310 cures the molding base 12 through the molding film 340.
  • the molding space 350 When the molding material is cured and molded in the molding space 350, the molding material is cured based on the lower surface of the molding film 340 to form the molding base 12.
  • the upper molded end surface 123 of the molded base 12 is molded at the upper end of the molding space 350, and the molded upper end surface 123 is directly opposite to the molded upper end of the molding space 350.
  • the lower surface of the shaped film 340 It is worth mentioning that the surface of the shaping film 340 is smooth, and the upper end surface 123 of the molding base 12 formed by the shaping film 340 is smooth and flat.
  • the shaping film 340 is squeezed outward by the upper mold 310 to produce plastic elastic deformation, wherein the shaping film 340
  • the surface of the part protruding outward is rough, and the surface of the molding base 12 formed by the protruding part of the shaping film 340 is a rough surface.
  • the upper mold 310 of the mold 300 further includes at least one spacer block 311 and at least one pressing block 312, wherein the spacer block 311 and the pressing block 312 are pressed on the photosensitive element 130 and the substrate 11 to form a channel of the molding space 350.
  • the isolation block 311 has a groove, wherein two ends of the isolation block 311 squeeze the molding film 340, and an isolation space 360 is formed between the isolation block 311 and the photosensitive element 130.
  • the isolation block 311 is located inside the pressing block 312, wherein the isolation block 311 is correspondingly tightly attached to the upper surface of the photosensitive element 130 to prevent molding material from entering the molding space 350 Isolated space 360.
  • the isolation block 311 is tightly attached to the top of the photosensitive element 130 to form the light-transmitting path of the photosensitive element 130.
  • the isolating block 311 squeezes the shaping film 340 so that the shaping film 340 is closely attached to the upper surface of the photosensitive element 130 to isolate the shaping space 350 from the light path.
  • the pressing block 312 and the spacer block 311 squeeze the molding film 340 above the substrate 11 and the photosensitive element 130, Thus, the molding space 350 is formed between the molding film 340 and the substrate 11.
  • the shaping film 340 is attached to the lower surface of the upper mold 310, and the gas between the shaping film 340 and the upper mold 310 is extracted by means of air extraction, In this way, the shaping film 340 is closely attached to the upper mold 310 to prevent air between the shaping film 340 and the upper mold 310 from affecting the flatness of the shaping film 340.
  • the mold 300 is closed, wherein the upper mold 310 squeezes the shaping film 340, so that the shaping film 340 is elastically deformed, wherein the shaping film 340 is The molding space 350 is squeezed in an elastic deformation manner.
  • the isolation block 311 of the upper mold 310 squeezes the shaping film 340 so that the shaping film 340 is squeezed by the isolation block 311 to generate an elastic deformation extending outward from the isolation block 311. It is understandable that the lower end of the isolation block 311 squeezes the shaping film 340, and the elastic deformation of the shaping film 340 close to the bottom end of the isolation block 311 is greater than that of the top end of the isolation block 311.
  • the elastic deformation of the shaping film 340 is described.
  • the isolation block 311 squeezes the shaping film 340 on the photosensitive element 130, so that the shaping film 340 attached to the outside of the isolation block 311 generates elastic deformation that gradually decreases from bottom to top. , So that the shaping film 340 squeezes the shaping space 350 outward from the outer wall of the isolation block 311.
  • the shaping film 340 is squeezed by the isolation block 311 so that the thickness of the lower end of the shaping film 340 attached to the outside of the isolation block 311 is greater than the thickness of the upper end of the shaping film 340.
  • the spacer block 311 of the upper mold 310 extrudes the shaping film 340, wherein the shaping film 340 is extruded by the spacer block 311 to form an inner extension part 341, wherein the inner extension part 341 passes through It is extruded and molded on the outside of the isolation block 311, wherein the inner extension 341 extrudes the molding space 350 from the outside of the isolation block 311 outward.
  • the inner extension portion 341 forms the inner side surface 1251 and the inner arc surface 1252 of the molded base 12.
  • the inner extension part 341 formed by the extrusion of the shaping film 340 has rough outer surface at the lower part of the inner extension part 341, and the inner extension part 341 roughens the inner extension part 341. Arc surface 1252, so that the surface smoothness of the inner arc surface 1252 is reduced.
  • the pressing block 312 of the upper mold 310 squeezes the shaping film 340, so that the shaping film 340 is squeezed by the spacer block 311 to generate elasticity extending inward from the pressing block 312 deformation.
  • the lower end of the pressing block 312 squeezes the shaping film 340, and the elastic deformation of the shaping film 340 near the bottom end of the pressing block 312 is greater than that of the pressing block 312
  • the plastic film 340 at the top is deformed elastically.
  • the pressing block 312 squeezes the shaping film 340 on the substrate 11, so that the shaping film 340 attached to the inside of the pressing block 312 generates elasticity that gradually decreases from bottom to top. Deformed so that the shaping film 340 squeezes the shaping space 350 outward from the inner wall of the pressing block 312.
  • the pressing block 312 of the upper mold 310 squeezes the molding film 340 to form an extension portion 342, wherein the extension portion 342 is formed under the upper mold 310, and the extension portion 342 is formed On the inner side of the pressing block 312, the extension portion 342 presses the forming space 350 inwardly from the inner side of the pressing block 312. It can be understood that the extension portion 342 forms the outer side surface 1261 and the outer arc surface 1262 of the molded base 12.
  • the spacer block 311 of the upper mold 310 extrudes the shaping film 340, wherein the shaping film 340 is extruded by the spacer block 311 to form an inner extension 341, and the inner extension 341 is divided into An upper inner extension portion and a lower inner extension portion, the upper inner extension portion correspondingly forms the inner side surface 1251, and the lower inner extension portion correspondingly forms the inner arc surface 1252. It is worth mentioning that when the upper mold 210 and the lower mold 320 are closed, the plastic film 340 on the spacer 311 is squeezed, so that the plastic film 340 protrudes to the outside.
  • the lower inner extension part because the lower inner extension part is extruded the shaping film 340, so that the shaping film 340 is stacked, the shape of the lower inner extension part is not easy to be controlled, so the correspondingly formed
  • the shape of the inner arc surface 1252 is also not fixed.
  • the lower inner extension is formed by the elasticity of the plastic film 340 so it will be formed by extrusion, the surface of the lower inner extension will be relatively rough, and the upper inner extension is formed by the lower inner extension.
  • extension part causes the upper extension part to receive a certain force, so that the upper extension part may form an inclined surface; however, the upper extension part remains tight during the molding process Therefore, the surface of the upper inner extension part is relatively smooth, so the surface of the inner side surface 1251 is smoother than the inner arc surface 1252 after forming.
  • the spacer block 311 and the pressing block 312 of the upper mold 310 squeeze the shaping film 340 to produce deformation, and the magnitude of the elastic deformation produced by the shaping film 340 determines the The draft angle of the molded base 12 is described. Therefore, the shape and shape of the inner extension part 341 and the outer extension part 342 can be controlled by the thickness of the shaping film 340, the coefficient of elasticity, and the upper mold 311 and the pressure on the shaping film 340 after closing the mold. The size, thereby determining the draft angle of the molded base 12.
  • the thickness of the shaping film 340 of the present invention is H
  • the thickness of the inner extension part 341 and the outer extension part 342 produced by the upper die 310 extruding the shaping film 340 is 1.2H ⁇ 1.5H .
  • the lateral vertical distance between the inner arc surface 341 of the molded base 12 and the light window opening of the molded base 12 is 0.2H ⁇ 0.5H.
  • the thickness of the shaping film 340 is 100 ⁇ m
  • the distance between the upper end surface 123 of the base and the lower end surface 124 of the base 12 after molding is based on the optical axis direction.
  • the vertical distance is 20 ⁇ m ⁇ 50 ⁇ m.
  • a molding material is added to the molding space, so that the molding material is molded in the molding space 350 based on the outer wall of the molding film 340. Since the molding film 340 is squeezed by the spacer 311 of the upper mold 310 and is closely attached to the upper surface of the photosensitive element 130, when the molding material is molded in the molding space 350, the The molding film 340 is squeezed by the spacer 311 to prevent the molding material from entering the photosensitive channel of the photosensitive element 130 from the molding space 350.
  • the molding material is cured and molded in the molding space 350 to obtain the molded base 12.
  • the upper mold 310 and/or the lower mold 320 of the mold 300 are pulled so that the upper mold 310 and the lower mold 320 Phase separation.
  • the pressure between the upper mold 310 and the shaping film 340 is eliminated, and the shaping film 340 returns to its original state under the action of elasticity, so that The molding film 340 and the upper mold 310 are separated from the molding base 12.
  • FIGS. 12A to 12F of the drawings of the specification of the present invention another manufacturing process of the molded base 12 of the circuit board assembly 10 according to the above-mentioned preferred embodiment of the present invention will be described in the following Was clarified.
  • the photosensitive element 130 is connected to the substrate 11 through a lead 13
  • the electronic device 15 of the circuit board assembly 10 is connected to
  • the substrate 11 is composed of a plurality of semi-finished circuit boards to form a circuit board imposition.
  • the substrate imposition is placed in a mold 300, wherein the mold includes an upper mold 310 and a lower mold 320, wherein a processing space 330 is formed between the upper mold 310 and the lower mold 320 , Wherein the substrate imposition is placed in the processing space 330.
  • the mold 300 further includes a molding film 340, wherein the molding film 340 has elasticity and toughness, and the molding film 340 is attached to the upper mold 310 of the mold 300.
  • the air between the upper mold 310 and the shaping film 340 is extracted by air suction, so that the shaping film 340 is in close contact with the upper mold 310.
  • the upper mold 310 further includes a plurality of spacer blocks 311 and a plurality of pressing blocks 312, wherein each of the spacer blocks 311 corresponds to the upper surface of the photosensitive element 130, and each of the pressing blocks 312 is correspondingly tightly sealed ⁇ The substrate 11.
  • the adjacent spacers 311 and the pressing block 312 form at least one molding space 350 at intervals, wherein the molding material is solidified and molded in the molding space 350, thereby forming two adjacent The molded base 12 of the circuit board assembly 20.
  • the isolation block 311 is further provided with a groove, wherein both ends of the isolation block 311 squeeze the shaping film 340, so that an isolation space 360 is formed between the isolation block 311 and the photosensitive element 130, wherein The isolation space 360 corresponds to the photosensitive channel of the photosensitive element 130.
  • the isolation block 311 corresponds to the top of the photosensitive element 130, and the molding film 340 is pressed by the pressing block 312 to prevent the molding material in the molding space 350 from entering the isolation space 360.
  • the upper mold 310 and the lower mold 320 of the mold 300 are closed, and the upper mold 310 is in close contact with the Above the substrate 11 and the photosensitive element 130.
  • Each of the upper molds 310 presses the photosensitive element 130 and the substrate 11 through the molding film 340, wherein the molding film 340 is pressed by the upper mold 310 to generate elastic deformation.
  • the isolation block 311 of the upper mold 310 squeezes the shaping film 340 so that the shaping film 340 is squeezed by the isolation block 311 to generate an elastic deformation extending outward from the isolation block 311.
  • the lower end of the isolation block 311 squeezes the shaping film 340, and the elastic deformation of the shaping film 340 close to the bottom end of the isolation block 311 is greater than that of the top end of the isolation block 311.
  • the elastic deformation of the shaping film 340 is described.
  • the spacer block 311 squeezes the shaping film 340 on the photosensitive element 130, so that the shaping film 340 attached to the outside of the spacer block 311 generates elastic deformation that gradually decreases from bottom to top.
  • the shaping film 340 squeezes the shaping space 350 outward from the outer wall of the isolation block 311.
  • the shaping film 340 is squeezed by the isolation block 311 so that the thickness of the lower end of the shaping film 340 attached to the outside of the isolation block 311 is greater than the thickness of the upper end of the shaping film 340.
  • a molding material is injected into the molding space 350, wherein the molding material is cured in the molding space 350 to form the molding base 12.
  • the circuit board assembly 10 is taken out of the mold 300 by demolding. It is worth mentioning that during the demolding process, the upper mold 311 is separated from the shaping film 340, so that the shaping film 340 returns to its original state under the action of elasticity after being decompressed, so that the The upper mold 311 and the molding film 340 are separated from the molded base 12 after molding.
  • a circuit board assembly made of interconnected circuit board assemblies is obtained, and the circuit board assembly assembly is cut by cutting to obtain each of the circuit board assemblies 10.
  • the molded bases 12 of the adjacent circuit board assemblies 10 are connected to each other. It can be understood that the molded base 12 is cut in an oblique manner from top to bottom, so that the upper end 121 of the molded base 12 has a larger size than the lower end of the base. The size of 122.
  • the photosensitive element 130 and the electronic device 15 are attached to the substrate 11 of the circuit board assembly 10, wherein the photosensitive element 130 is attached to the substrate in a manner close to the side of the substrate 11 11, so that the edge region 114 of the substrate 11 has at least one narrow side 115 and at least one load side 116, wherein the width of the narrow side 115 is smaller than the width of the load side 116.
  • the electronic device 15 is disposed in the edge area 114 close to the load side 116, wherein the edge of the photosensitive element 130 is close to the narrow side 115 of the substrate 11.
  • the substrate 11 on which the photosensitive element 130 is attached is placed on the mold 300, wherein the spacer block 311 and the pressing block 312 of the upper mold 310 are pressed against the photosensitive element 130 and the mold respectively.
  • the width of the channel in the molding space 350 corresponding to the narrow side 115 is smaller than the width of the channel in the molding space 350 corresponding to the load side 116, so that the molding is formed
  • the bottom surface of at least one side of the molded base 12 obtained later is relatively narrow.
  • the draft angle of the molding base 12 corresponding to the narrow side 115 of the substrate 11 is greater than 90°, so that the molding is formed at all
  • the width of the lower end 122 of the molded base 12 above the narrow side 115 is smaller than the width of the upper end 121 of the base.
  • the molded base 12 formed above the narrow side 115 of the substrate 11 by molding has a structure with a large upper and a smaller lower side.
  • the inside draft angle and the outside draft angle of the molding base 12 corresponding to the upper side of the narrow side 115 are both greater than 90°, so that the upper side corresponding to the narrow side 115 of the substrate 11
  • the size of the upper end surface 123 of the molded base 12 is sufficient to support and be attached by the driving device 50.
  • the camera module 100 is mounted on the electronic device body 200 of the electronic device, and one side of the narrow side 115 of the circuit board assembly 10 faces the electronic device.
  • the top of the device body 200 is such that the lens 20 of the camera module 100 is close to the top of the electronic device body 200 upward.
  • the draft angle of the molded base 12 is greater than 90° to reduce the size of the lower end 122 of the molded base 12 and the base plate 11, thereby reducing The width dimension of the circuit board assembly 10 is shown.
  • the overall lateral size of the camera module 100 can be reduced to reduce the ratio of the camera module 100 to the electronic device body 200, thereby increasing the electronic The screen-to-body ratio of the device body 200.
  • the circuit board assembly 10 includes at least one substrate 11, at least one molded base 12, at least one set of leads 13, and at least one electronic device 15, wherein the leads 13 connect the photosensitive element 130 to the substrate 11,
  • the electronic device 15 is attached above the substrate 11.
  • the structure and function of the substrate 11, the lead 13, and the electronic device 15 are the same as those of the above-mentioned first preferred embodiment.
  • the difference is that the molded base 12 is embedded In the edge area 114 of the substrate 11, the photosensitive element 130 and the lead 13 are located inside the molded base 12.
  • the lower end 122 of the molded base 12 covers the edge area 114 of the substrate 11, and the lead 13 connects the photosensitive element 130 to the bonding area 113 of the substrate 11 .
  • the lower end 122 of the molded base 12 is located outside the photosensitive element 130.
  • the draft angle of the molded base 12 is greater than 90°, so that the upper end 121 of the molded base 12 has a larger structural size than the The structure size of the lower end 122 of the base.
  • the inner draft angle or the outer draft angle of at least one side of the molding base 12 is greater than 90°.
  • the inside draft angle and the outside draft angle of the molded base 12 are both greater than 90° to reduce the size of the lower end 122 of the molded base 12, so that the The size of the substrate 11 is reduced.
  • the inside draft angle and the outside draft angle of the mould base 12 are both greater than 90°, and the size of the upper end 121 of the mould base 12 is increased to make the mould base 12
  • the area of the upper end surface 123 of the base 12 is increased, which is convenient for attaching the driving device 50 or the lens holder 70.
  • the photosensitive element 130 is attached below the substrate 11 of the circuit board assembly 10, wherein the substrate 11 is further provided with a through hole 117, wherein the photosensitive element 130 is attached to the substrate based on the through hole 117 Below the substrate 11.
  • the molded base 12 of the circuit board assembly 10 is integrally formed above the substrate 11, wherein the draft angle of at least one side of the molded base 12 is greater than 90°, so that the molded base
  • the structural size of the upper end 121 of the base 12 is larger than the structural size of the lower end 122 of the base.
  • the difference from the above-mentioned first preferred embodiment is that during the molding process, the substrate 11 is placed in the mold 300, wherein the upper mold 310 of the mold 300 extrudes the plastic film 340 on the The substrate 11 is such that the plastic film 340 is closely adhered to the substrate 11.
  • the camera module 100 is a dual-camera, triple-camera, or multi-camera camera module, wherein the circuit board assembly 10 of the camera module 100 includes at least one substrate 11, at least two molded bases 12, and at least A set of leads 13 and a plurality of electronic devices 15, wherein the mold base 12 is integrally formed above the substrate 11 by molding.
  • the photosensitive element 130 is disposed above the substrate 11, and the molded base 12 is embedded above a part of the non-photosensitive area of the photosensitive element 130 and above the edge area 114 of the substrate 11.
  • the draft angle of at least one side of at least one side of the molded base 12 of the circuit board assembly 10 is greater than 90°, so that the structural size of the lower end 122 of the molded base 12 is smaller than that of the molded base 12
  • the structural dimensions of the upper end 121 of the base are described.
  • the inner draft angle and the outer draft angle of the molded base 12 are both greater than 90°, and the molded base 12 of the circuit board assembly 10 has a structure with a large upper and a small after being molded.
  • the width dimension of the molded base 12 of the circuit board assembly 10 is reduced, thereby reducing the size of the substrate 11 of the circuit board assembly 10.
  • the molded base 12 of the circuit board assembly 10 is formed into a structure with a large top and a small bottom after being molded, which increases the size of the upper end 121 of the base 12 of the molded base 12, thereby providing a subsequent AA process Or HA process provides enough processing space.
  • the camera module 100a can be, but is not limited to, a single projection module in the preferred embodiment of the present invention. Therefore, the camera module 100a can also be implemented as an array module composed of other camera units, such as TOF camera module.
  • the camera module 100a includes a circuit board assembly 10a, at least one optical element 20a, and a projection unit 30a, wherein the projection unit 30a is disposed on the circuit board assembly 10a, and the projection unit 30a is point-connected to The circuit board assembly 10a, wherein the circuit board assembly 10a provides the power required by the projection unit 30a.
  • the optical element 20a is held by the circuit board assembly 10a above the projection unit 30a to project the light generated by the projection element 30a outward.
  • the projection unit 30a of the camera module 100a is implemented as a light source, which can be but not limited to an LED light source, wherein the light generated by the projection unit 30a is diffused outwardly through the optical element 20a. emission.
  • the circuit board assembly 10a includes a substrate 11a and a molded base 12a, wherein the molded base 12a wraps the substrate 11a, and the projection unit 30a is disposed on the circuit board.
  • the substrate 11a of the assembly 10a provides power to the projection unit 30a through the substrate 11a.
  • the substrate 11a further includes a substrate main body 111a and at least one conductive element 112a disposed on the substrate main body 111a, wherein the conductive element 112a is electrically connected to the projection unit 30a.
  • the circuit board assembly 10a further includes at least one lead 13a, wherein the lead 13a is electrically connected to the conductive element 112a and the projection unit 30a.
  • the molded base 12a is integrally formed on the substrate 11a of the circuit board assembly 10a through a molding process, wherein the molded base 12a includes a base upper end 121a and a base lower end 122a And a base bottom plate 123a, wherein the base upper end 121a and the base lower end 122a integrally extend upward from the base bottom plate 123a.
  • the molded base 12a is integrally wrapped around the substrate 11a through a molding process, so as to reduce The thickness of the circuit board assembly 10a.
  • the base bottom plate 123a wraps the base plate 11a, and the thickness of the base base plate 123a is the same as the thickness of the base plate 11a.
  • the molded base 12a further has a supporting portion 124a, wherein the supporting portion 124a is formed at the upper end 121a of the base of the molded base 12a, and the supporting portion 124a supports the optical element 20a.
  • the supporting portion 124a is a groove formed at the upper end 121a of the base of the molded base 12a, wherein the optical element 20a is disposed in the Support 124a.
  • the molded base 12a is further provided with a base inner wall 125a and a base outer wall 126a, wherein the base inner wall 125a is formed on the inner side of the molded base 12a, and the base outer wall 126a is formed on the Mold the outside of the base 12a.
  • the inner wall 125a of the base extends inwardly and upwardly from the lower end 122a of the molded base 12a to the upper end 121a of the base.
  • the base outer wall 126a extends outwardly and upwardly from the base lower end 122a of the molded base 12a to the base upper end 121a.
  • the size of the lower end 122a of the molded base 12a is smaller than the size of the upper end 121a of the base.
  • the inner wall 125a of the base has an inner side surface 1251a and an inner arc surface 1252a, wherein the inner side surface 1251a extends from the inner side of the upper molded end surface 123a of the molded base 12a. It extends downwardly and obliquely outward to the inner arc surface 1252a.
  • the inner arc surface 1252a extends upwardly and obliquely outward from the lower molded end surface 124a of the molded base 12a to the inner side surface 1251a.
  • Each of the base outer walls 126a of the molded base 12a has an outer side surface 1261a and an outer arc surface 1262a, wherein the outer side surface 1261a extends from the molded upper end surface 123a of the molded base 12a The outer side extends downwardly and obliquely inwardly to the outer arc surface 1262a.
  • the outer arc surface 1262a extends upwardly and obliquely inwardly from the molded lower end surface 124a of the molded base 12a to the outer side surface 1261a.
  • FIGS. 19A to 19B there is shown a manufacturing method of the molded base 12a, wherein the molded base 12a is integrally formed with the substrate 11a through a molding process.
  • the draft angle of at least one side of the molding base 12a is greater than 90°, so that the molding base 12 has structural features of a large size, so that when the optical element 20a is placed on the supporting portion 124a, The contact surface between the supporting portion 124a and the optical element 20a is large enough to ensure the reliability of the installation of the molded base 12a and the optical element 20a.
  • a substrate is first processed to form an imposition.
  • the substrate may be, but is not limited to, a metal substrate, such as a copper substrate.
  • the imposition is processed by etching to form the conductive member on the substrate 11a.
  • the imposition is placed in a mold 300a, wherein the mold 300a includes an upper mold 310a, a lower mold 320a, and a shaping film 340a, wherein the shaping film 340a is attached to the mold 300a.
  • a processing space 330a is formed between the upper mold 310a and the lower mold 320a.
  • the upper module 310 includes a spacer block 311a and a pressing block 312a, wherein the spacer block 311a squeezes the plastic film 340a on the substrate 11a, so that the plastic film 340a is in close contact with the Substrate 11a.
  • the pressing block 312a squeezes the shaping film 340a on the lower mold 320a, so that the shaping film 340 is closely attached to the lower mold 320a.
  • the upper mold 310a squeezes the plastic film onto the lower mold 320a, wherein the plastic film 340a and the lower mold 320a are between A molding space 350a corresponding to the molding base 12a is formed.
  • a molding material is injected into the molding space 350, and solidified and molded in the molding space 350a to form the molding base 12a.
  • the molding material is cured in the mold 300a to form the mold base 12a on the substrate 11a. After the molded base 12a is cured and formed, it is demolded to obtain the circuit board assembly 10a. It is worth mentioning that the projection unit 30a may be disposed on the upper surface of the substrate 11a after the molding is completed, or may be disposed on the substrate 11a before the molding process. In other words, the installation sequence of the projection unit 30a is not limited here.
  • the draft angle of at least one side of the molded base 12a is greater than 90°, so that the size of the lower end 122a of the molded base 12a is It is smaller than the size of the upper end 121a of the base.
  • the inner molding film angle and the outer draft angle of the molded base 12a are both greater than 90°, so as to reduce the size of the lower end 122a of the molded base 12a, so that the The overall size of the molded base 12a becomes smaller. It can be understood that the reduction of the overall size of the molded base 12a can reduce the lateral size of the camera module 100a.
  • the size of the base lower end 122a of the molded base 12a is reduced, the size of the base upper end 121a of the molded base 12a is increased to enlarge the base
  • the size of the support portion 124a of the upper end portion 121a increases the contact area between the support portion 124a and the optical element 30a.
  • the upper mold 310a of the mold 300a extrudes the molding film 340a on the substrate 11a, so that the molding The film 340a is squeezed to produce elastic deformation. It is understandable that when the inner side of the upper mold 310a squeezes the plastic film 340a to produce elastic deformation from the inside to the outside, the inner draft angle of the mold base 12a is greater than 90° to form the The inner wall 125a of the molded base 12a. When the outer side of the upper mold 310a squeezes the molding film 340a to produce elastic deformation from the inside to the inside, the outer draft angle of the molding base 12a is greater than 90° to form the molding The base outer wall 126a of the base 12a.

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Abstract

本发明提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件包括一基板、一感光元件、以及至少一模塑基座。所述感光元件电气连接于所述基板，其中所述感光元件被所述模塑基座一体地固定于所述基板，所述模塑基座包括一基座内壁、一基座外壁和进一步具有一模塑上端面和一模塑下端面，其中所述基座内壁形成所述模塑基座的一光窗，其中所述基座内壁进一步具有一内斜面和一内弧面，所述内弧面延伸于所述内侧面，所述内弧面朝向于所述模塑基座。

Description

摄像模组、电路板组件及其制造方法以及电子设备 技术领域
本发明涉及光学成像领域，尤其涉及一摄像模组、电路板组件及其制造方法以及电子设备。
背景技术
当前，电子设备越来越朝向智能化、轻薄化的方向发展，这对于作为电子产品的标准配置之一的摄像模组的体积和成像品质都提出了更加苛刻的要求。高像素、高品质的摄像模组的硬件基础是感光元件具有更大尺寸的感光面积和数量更多、尺寸更大的被动元器件，由于智能电子设备对于更高像素、更高品质的追求，导致摄像模组的体积越来越大，这也使得摄像模组的发展趋势越来越不符合电子设备的轻薄化的发展趋势。
因此，为了缩小摄像模组的体积大小，现有技术的摄像模组采用模塑技术封装摄像模组中的感光元件，以缩小所述摄像模组水平方向的尺寸大小。具体地，所述摄像模组的电子元件通过表面贴附工艺贴装在电路板上，然后利用模塑工艺使模塑材料一体地结合在所述电路板形成基座式电路板。现有技术的模塑工艺是将半成品的电路板置于模塑的模具中，当模塑材料填充完成后形成固化于所述电路板的模塑基座，然后拔模以制得所述基座式电路板。
但是，为了便于拔模和保证拔模后的成品率，现有技术的摄像模组的模塑电路板的拔模角度小于90°，这也就使得所述摄像模组的所述模塑电路板的模塑基座的结构是上小下大的结构。这就导致模塑基座上表面宽度很小，给后续加工操作预留的空间位置非常极限。例如，预留给马达或者镜座粘贴在模塑上表面的画胶空间就非常小，胶水量的控制不容易，通常是胶水量不足，从而导致马达或镜座与所述模塑基座上表面的粘接力不够。因此，为了保证胶水量足够，现有技术的模塑工艺只能够通过增大模塑基座上表面的宽度，这样一来，模塑基座的下表面的大小也随之变大，从而增加了所述模塑基座整体的尺寸大小，也无形中增加了所述摄像模组的尺寸。
另外，现有技术的这种模塑工艺由于拔模角度小于90°，必然导致模塑基座的上窄下宽的结构特性，所述模塑基座的上部开口大小大于所述模塑基座下部的 开口大小，其中感光元件被安装于所述模塑基座下方的所述电路板。因此，不可避免地造成杂散光容易进入到感光元件，这样就需要额外的防杂散光的结构，从而在另一方面增加了模塑结构和组装的工序。
另外，随着全面屏出现，终端设备(手机)需要更高的屏占比，故需要对摄像模组，特别是前置摄像模组在终端的安装位置更加贴近顶端，而现有技术的摄像模组的模塑基座的上小下大的结构导致线路板难以做到极窄边。换言之，现有技术的摄像模组的所述模塑基座由于拔模角度小于90°，而导致所述模塑基座是上小下大的结构，如果设计所述线路板一边为极窄边时，必然会造成所述模塑基座的上表面的一边更窄，这样可能会导致所述模塑基座的上表面无法可靠地贴附透光组件，而造成摄像模组成像不稳甚至整体报废。
发明内容
本发明的一个主要优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中在保证成像质量的前提下，所述摄像模组可被缩小体积，以便于所述摄像模组适应所述电子设备的小型化、轻薄化需求。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中在保证成像品质的情况下，所述摄像模组的宽度尺寸能够被有效地减小，从而减小所述摄像模组占用所述电子设备内部空间，有利于所述电子设备的设计加工和发展。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述摄像模组的电路板组件的宽度尺寸可被有效地减小，从而在保持所述摄像模组结构稳定的情况下，有利于减小所述摄像模组的宽度尺寸。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中当所述模塑基座的下端面的面积大小不变的情况下，可增大所述模塑基座的上端面的面积大小，从而提供AA工艺或HA工艺更大的空间，以便提高所述电子产品组装良率。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的模塑基座至少一侧的拔模角度大于90°，在相同的模塑基座下端面积大小不变的情况下，有利于增大所述模塑基座的上端面的面积，从而便于所述摄像模组后续的加工。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的模塑基座在模塑成型过程中，通过一模具挤压一塑形膜，藉由所述塑形膜挤压所述模塑基座的成型空间，以使得所述模塑基座的拔模角度大于90°。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的模塑基座至少一侧的拔模角度大于90°，所述摄像模组在整体尺寸缩小的情况下，可增大所述模塑基座上端面的画胶宽度，从而增加镜座或IR贴附的作用力，有助于提高所述摄像模组制造良率。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的模塑基座通过模塑工艺一体地成型于所述电路板组件的一电路板，其中所述模塑基座模塑过程中的拔模角度大于90°，以使得所述模塑基座的上端面的尺寸大于所述下端面的尺寸。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的所述模塑基座的至少一个侧边的内侧拔模角度大于90°其中所述模塑基座的内侧表面自上而下向外地倾斜，从而减少外接杂散光反射于所述模塑基座的内侧表面，提高所述摄像模组的成像性能。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述模具挤压所述塑形膜，使得成型于模塑基座的内侧表面的上端为倾斜的斜面，所述模塑基座的内侧表面的下端为弧形面，有利于减少外接杂散光反射于所述模塑基座的内侧表面，提高所述摄像模组的成像性能。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述模塑基座的内侧表面的所述弧形面为粗糙面，有利于减少所述模塑基座的内侧表面对杂散光的反射作用，从而有利于减少杂散光被所述模塑基座的内侧表面反射至感光元件，提高所述摄像模组的成像性能。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的所述模塑基座的至少一个侧边的外侧拔模角度大于90°，使得所述模塑基座的至少一外侧面自上而下向内地倾斜，以减小所述模塑基座的所述基座下端部的尺寸，有利于减小所述电路板组件的所述基板，从而减小所述摄像模组的整体尺寸大小。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电 子设备，其中所述电路板组件的所述模塑基座的至少一侧的内拔模角度大于90°和外拔模角度大于90°，所述模塑基座的自上而下逐渐变窄，以利于所述电路板组件的所述基板形成窄边。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的所述基板的至少一侧为窄边，并且对应于所述窄边的所述模塑基座的内拔模角度大于90°和外拔模角度大于90°，以增大所述窄边对应的所述模塑基座的所述基座上表面的面积大小，有利于所述电路板组件与透光组件的安装。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述电路板组件的所述电路板存在至少一侧为窄边，其中所述摄像模组的极窄边靠近于电子设备的顶端安装，从而有助于提高所述电子设备的屏占比。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述模塑基座在被模塑成型过程中，加工所述模塑基座的模具通过挤压一塑形膜变形，以使得所述模具拔模过程中所述模塑基座的至少一侧的拔模角度大于90°。
本发明的另一个优势在于提供一摄像模组、电路板组件及其制造方法以及电子设备，其中所述模具挤压所述塑形膜变形，藉由所述塑形膜的挤压变形形成所述模塑基座的拔模角度，当所述模具拔模时，所述塑形膜恢复至初始状态，以便所述模具和所述塑形膜从所述模塑基座脱模。
本发明的其它优势和特点通过下述的详细说明得以充分体现并可通过所附权利要求中特地指出的手段和装置的组合得以实现。
依本发明的一个方面，能够实现前述目的和其他目的和优势的本发明的一电路板组件，包括：
一基板；和
至少一模塑基座，其中所述模塑基座包括一基座内壁、一基座外壁和进一步具有一模塑上端面和一模塑下端面，其中所述基座内壁形成所述模塑基座的一光窗，其中所述基座内壁进一步具有一内侧面和一内弧面，所述内弧面延伸于所述内侧面，所述内弧面朝向于所述模塑基座。
根据本发明的一实施例，所述模塑基座通过模塑工艺的方式一体地成型于所 述基板，其中所述模塑基座通过下述步骤被制得：
放置所述基板和所述感光元件于一模具的一加工空间，其中所述模具包括一上模具、一下模具以及一塑形膜；
合模所述上模具和所述下模具，在所述塑形膜和所述基板之间形成一成型空间，其中所述上模具的一隔离块挤压所述塑性膜产生一内延部，藉由所述内延部自所述隔离块向外挤压所述成型空间；
加入模塑材料至所述成型空间，和在所述成型空间固化成型，其中所述模塑基座的所述基座内壁成型于所述内延部的外侧；以及
脱模，以模制所述模塑基座于所述基板。
根据本发明的一实施例，所述基座内壁的所述内侧面与所述基板的夹角小于等于90°，以使所述模塑基座脱模的内拔模角度大于或等于90°。
根据本发明的一实施例，所述内弧面的粗糙度大于所述内侧面的粗糙度。。
根据本发明的一实施例，所述模塑基座的所述基座外壁具有一外侧面和外弧面，其中所述外侧面自所述模塑上端面向下地和倾斜向内地延伸至所述外弧面，所述外弧面自所述模塑基座的所述模塑下端面向上地和倾斜向内地延伸至所述外侧面。
根据本发明的一实施例，所述模塑基座通过模塑工艺的方式一体地成型于所述基板，其中所述模塑基座通过下述步骤被制得：
放置所述基板和所述感光元件于一模具的一加工空间，其中所述模具包括一上模具、一下模具以及一塑形膜；
合模所述上模具和所述下模具，在所述塑形膜和所述基板之间形成一成型空间，其中所述上模具的一压合块挤压所述塑性膜产生一外延部，藉由所述外延部自所述压合块向内挤压所述成型空间；
加入模塑材料至所述成型空间，和在所述成型空间固化成型，其中所述模塑基座的所述基座外壁成型于所述外延部的内侧；以及
脱模，以模制所述模塑基座于所述基板。
根据本发明的一实施例，所述基座外壁的所述外侧面与所述基板的夹角小于等于90°，以使所述模塑基座脱模的外拔模角度大于等于90°。
根据本发明的一实施例，所述电路板组件进一步包括以感光元件，其中所述感光元件电气连接于所述基板，所述感光元件被所述模塑基座一体地固定于所述 基板。
根据本发明的一实施例，所述电路板组件进一步包括以感光元件，所述感光元件电器连接于所述基板，其中所述模塑基座被一体地设置于所述感光元件的外侧。
根据本发明的一实施例，所述感光元件包括一感光部和至少一非感光部，其中所述非感光部位于所述感光部的外侧，其中所述非感光部被电连接于所述基板，其中所述模塑基座覆盖于所述感光元件的所述非感光部的上方，藉由所述模塑基座固定所述感光元件于所述基板。
根据本发明的一实施例，所述基板进一步具有一基板上表面和对应于所述基板上表面的一基板下表面，其中所述感光元件被贴附于所述基板上表面，其中所述模塑基座被一体地成型于所述基板上表面。
根据本发明的一实施例，所述电路板组件进一步包括一组引线，其中所述引线电连接所述感光元件的非感光部于所述基板，所述引线被所述模塑基座包埋于所述基板的上方。
根据本发明的一实施例，所述电路板组件进一步包括至少一电子器件，其中所述电子器件被设置于所述基板的所述边缘区，其中所述模塑基座包埋所述电子器件于所述基板。
根据本发明的一实施例，所述基板进一步设有一贴合区和一边缘区，其中所述感光元件被贴附于所述贴合区，所述边缘区位于所述贴合区的周边，其中所述感光元件以靠近于所述基板一侧的方式贴合于所述基板，使得所述基板的所述边缘区形成至少一窄边和至少一负载边，其中所述窄边的宽度小于所述负载边的宽度。
根据本发明的一实施例，所述电路板组件进一步包括至少一电子器件，其中所述电子器件被设置于所述基板的所述负载边，其中所述模塑基座包埋所述电子器件于所述基板。
根据本发明的另一方面，本发明进一步提供一摄像模组，包括：
如上所述的电路板组件；
一镜头，其中所述镜头沿所述感光元件的感光路径被保持在所述感光元件的上方；以及
至少一滤光元件，其中所述滤光元件被保持于所述镜头和所述感光元件之间。
根据本发明的一实施例，所述摄像模组进一步包括一驱动装置，其中所述驱动装置被设置于所述模塑基座的上方，所述镜头被安装于所述驱动装置，藉由所述驱动装置驱动所述镜头的移动。
根据本发明的一实施例，所述滤光元件被设置于所述电路板组件的所述模塑基座的上方，藉由所述模塑基座支撑所述滤光元件。
根据本发明的一实施例，所述摄像模组进一步包括一镜座，其中所述镜座被设置于所述驱动装置和所述模塑基座之间，其中所述滤光元件被设置于所述镜座，藉由所述镜座支撑所述滤光元件。
根据本发明的另一方面本发明进一步提供一电子设备，包括：
一电子设备本体；和
如上所述的摄像模组，其中所述摄像模组被搭载于所述电子设备本体的上端。
根据本发明的另一方面，本发明进一步提供一电路板组件的制造方法，其中所述制造方法包括如下步骤：
(a)放置一基板和至少一感光元件于一模具的一加工空间，其中所述模具包括一上模具、一下模具和一塑形膜，其中所述加工空间被形成于所述上模具和所述下模具之间；
(b)合模所述上模具和所述下模具，在所述塑形膜和所述基板之间形成一成型空间，和挤压所述塑形膜变形，藉由所述塑形膜挤压所述成型空间；
(c)加入模塑材料至所述成型空间，和固化所述模塑材料于所述成型空间；以及
(d)脱模所述上模具和所述下模具，以模制一模塑基座于所述基板。
根据本发明的一实施例，在上述方法的所述步骤(a)中，贴附所述感光元件于所述基板的上表面，和设置一组引线，藉由所述引线电气连接所述感光元件于所述基板。
根据本发明的一实施例，在上述方法的所述步骤(b)之前进一步包括步骤：以抽气的方式抽取所述塑形膜与所述上模具之间的空气，以贴附所述塑形膜于所述上模具的下表面。
根据本发明的一实施例，在上述制造方法的所述步骤(b)中，所述上模具的一隔离块挤压所述塑形膜于所述感光元件，其中所述塑形膜被挤压而形成一内延部，其中所述内延部自所述隔离块向外地挤压所述成型空间，以使所述模塑基 座的内拔模角度大于等于90°。
根据本发明的一实施例，在上述制造方法的所述步骤(c)中，所述模塑材料成型于所述内延部的外侧，而固化成型为所述模塑基座的一基座内壁。
根据本发明的一实施例，在上述制造方法的所述步骤(c)中，模塑材料充满所述成型空间，其中所述模塑基座的所述基座内壁成型于所述内延部的外侧，藉由所述内延部形成所述基座内壁的所述内侧面和内弧面。
根据本发明的一实施例，在上述制造方法的所述步骤(b)中，所述上模具的一压合块挤压所述塑形膜于所述基板，其中所述塑形膜被挤压而形成一外延部，其中所述外延部自所述隔离块向内地挤压所述成型空间，以使所述模塑基座的外拔模角度大于等于90°。
根据本发明的一实施例，在上述制造方法的所述步骤(c)中，所述模塑材料成型于所述外延部的内侧，而固化成型为所述模塑基座的一基座外壁。
根据本发明的一实施例，在上述制造方法的所述步骤(c)中，模塑材料充满所述成型空间，其中所述模塑基座的所述基座外壁成型于所述外延部的内侧，藉由所述外延部形成所述基座外壁的所述外侧面和外弧面。
根据本发明的一实施例，在上述方法的步骤(d)进一步包括：牵引所述模具的所述上模具，以泄除所述上模具对所述塑形膜的压力，其中所述塑形膜在弹性作用下恢复至初始状态。
通过对随后的描述和附图的理解，本发明进一步的目的和优势将得以充分体现。
本发明的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
图1是根据本发明的第一较佳实施例的一电子设备的立体示意图。
图2是根据本发明上述较佳实施例的所述电子设备的一摄像模组的整体示意图。
图3是根据本发明上述较佳实施例的所述摄像模组的分解示意图。
图4是根据本发明上述较佳实施例的所述摄像模组的立体剖视图。
图5A是根据本发明上述较佳实施例的所述摄像模组的一电路板组件的立体 示意图。
图5B是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的立体剖视图。
图5C是根据本发明上述较佳实施例的所述摄像模组的一电路板组件的立体示意图。
图5D是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的立体剖视图。
图6A是根据本发明上述较佳实施例的所述摄像模组的另一电路板组件的立体示意图。
图6B是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的立体剖视图。
图6C是根据本发明上述较佳实施例的所述摄像模组的另一电路板组件的立体示意图。
图6D是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的立体剖视图。
图7A是根据本发明上述较佳实施例的所述摄像模组的另一电路板组件的立体剖视图。
图7B是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的一可选实施方式的示意图。
图7C是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的另一可选实施方式的示意图。
图7D是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的另一可选实施方式的示意图。
图8是根据本发明上述较佳实施例的所述电子设备的另一摄像模组的整体示意图。
图9是根据本发明上述较佳实施例的所述摄像模组的一摄像模组的分解示意图。
图10是根据本发明上述较佳实施例的所述摄像模组的所述摄像模组的立体剖视图。
图11A至图11F是根据本发明上述较佳实施例的所述摄像模组的电路板组件 的制造流程的步骤的示意图。
图12A至图12F是根据本发明上述较佳实施例的所述摄像模组的电路板组件的另一制造流程的步骤的示意图。
图13是根据本发明上述较佳实施例的所述摄像模组的另一电路板组件的变形实施方式的示意图。
图14A是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的模塑的示意图。
图14B是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的剖视图。
图15是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的一变形实施方式的示意图。
图16是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的另一变形实施方式的示意图。
图17是根据本发明上述较佳实施例的所述摄像模组的所述电路板组件的另一变形实施方式的示意图。
图18是根据本发明第二较佳实施例的一摄像模组的立体剖视图。
图19A是根据本发明上述较佳实施例的所述摄像模组的电路板组件的制造流程示意图。
图19B是根据本发明上述较佳实施例的所述摄像模组的电路板组件的制造示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或 元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
参照本发明说明书附图之图1所示，依照本发明第一较佳实施例的一电子设备在接下来的描述中被阐明。所述电子设备包括至少一摄像模组100和搭载所述至少一摄像模组100的一电子设备本体200，其中所述电子设备本体200控制所述摄像模组100拍摄影像。示例性质地，所述摄像模组100可被以朝向于所述电子设备本体200正面的方式安装于所述电子设备本体200，所述摄像模组100辅助所述电子设备本体200辅助拍摄所述电子设备前方的影像信息。简言之所述摄像模组100被作为所述电子设备的一前置摄像装置。可以理解的是，在本发明的该较佳实施例中，所述摄像模组100被安装于所述电子设备本体200的方式在此仅仅作为示例性质的，而非限制。因此，所述至少一摄像模组100还可被以朝向于所述电子设备主体200背面的方式安装于所述电子设备本体200，即所述摄像模组200作为所述电子设备的后置摄像装置，以拍摄所述电子设备后方的影像信息。
示例性质的，所述电子设备可被实施为一智能手机。在本发明的说明书附图中所述电子设备中的所述摄像装置以单摄像头的形式展示，而在其他的实施例中，所述摄像模组也可被实施为阵列摄像模组，比如双摄模组、三摄模组或其他多摄模组。另外，所述电子设备的类型在此仅仅作为示例性质的，本发明的说明书附图以手机设备为例，但不限于智能手机设备，所述电子设备还可被实施为其他具有拍摄功能的电子装置，比如平板电脑、智能家居电子设备、以及其他种类的电子装置。
参考本发明说明书附图之图2至图7B所示，依照本发明上述较佳实施例的所述电子设备的所述摄像模组100在接下来的描述中被阐明。所述摄像模组100包括至少一电路板组件10和至少一镜头20，其中所述镜头20沿所述摄像模组100的感光路径被保持在所述电路板组件10的上方，光线通过所述镜头20被接收至所述电路板组件10，以供所述电路板组件10接收所述光线和转化所述光线的光信号为电信号。所述电路板组件10包括一基板11、一模塑基座12、以及一 感光元件130，其中所述感光元件130被设置于所述基板11，所述模塑基座12被以一体成型的方式形成于所述基板11，其中所述感光元件130被所述模塑基座12固定于所述基板11。
所述感光元件130电连接于所述电路板组件10的所述基板11，藉由所述基板11传输所述感光元件130产生的电信号至所述电子设备本体200。相应地，当所述摄像模组100被搭载至所述电子设备本体200时，所述摄像模组100的所述电路板组件10通信地连接于所述电子设备本体200。
在本发明中，所述电路板组件10是基于模塑加工的方式一体地成型所述模塑基座12于所述基板11。所述摄像模组100进一步包括至少一滤光元件40，其中所述滤光元件40被设置于所述感光元件130和所述镜头20之间，其中所述滤光元件40过滤由所述镜头20传输至所述感光元件130的杂散光，有助于提升所述摄像模组100的成像质量。
如图2至图4所示，所述镜头20为所述摄像模组100的光学系统元件，其中所述镜头20包括至少一光学透镜21和至少一镜筒22，其中所述光学透镜21基于所述摄像模组的光轴设置于所述镜筒22。优选地，在本发明的该较佳实施例中，所述镜头20的所述光学透镜21的数量为多片，其中所述光学透镜21基于所述光轴方向被设置于所述镜筒22。所述镜筒22保持所述镜头20的所述光学透镜21于所述感光元件130的所述感光路径的上方。
在本发明的第一较佳实施例中，所述摄像模组100的所述滤光元件40被设置于所述电路板组件10的所述模塑基座12，藉由所述模塑基座12保持所述滤光元件40。优选地，在本发明第一较佳实施例中，所述滤光元件40被以贴附的方式贴合于所述模塑基座12的上方。值得一提的是，在本发明中所述滤光元件40被安装的方式在此仅仅作为示例性质的，而非限制。因此，所述滤光元件40还可通过其它安装方式设置于所述模塑基座12，比如通过一安装支架安装所述滤光元件40于所述模塑基座12，藉由所述安装支架固定地保持所述滤光元件40的位置；或将所述滤光元件40设置于一支架，该支架被设置于所述感光元件130上方。
如图2至图4所示，所述摄像模组100进一步包括一驱动装置50，其中所述至少一镜头20被设置于所述驱动装置50，所述驱动装置50基于所述感光路径保持所述镜头20于所述感光元件130的上方。所述驱动装置50被设置于所述电 路板组件10的所述模塑基座12，其中所述驱动装置50被所述模塑基座12支撑而得以驱动所述镜头20移动。所述驱动装置50可通过胶粘的方式贴附于所述模塑基座12的上方。所述镜头20的所述镜筒22被可驱动地设置于所述驱动装置50，其中所述驱动装置50驱动所述镜筒22移动。
本领域技术人员可以理解的是，所述摄像模组100的所述驱动装置50可以但不限于马达，例如音圈马达，其中所述驱动装置50驱动所述镜头20沿所述感光元件130的感光路径的上方移动。
值得一提的是，在本发明第一较佳实施例中，所述驱动装置50和所述滤光元件40被贴附或被以胶粘的方式粘贴于所述模塑基座12的上表面。因此，所述电路板组件10的所述模塑基座12的上表面需要预留足够大的附着表面以便所述驱动装置50和所述滤光元件40贴附。
如图2至图4所示，所述模塑基座12是通过模塑工艺一体地成型于所述基板11，其中形成所述模塑基座12的模塑材料裹覆于所述基板11。可以理解的是，由于所述模塑材料一体地成型于基于所述基板11表面，所述基板11的表面面积的尺寸大小要至少大于或等于所述模塑基座12的底部的尺寸大小，以便所述基板11足以支撑所述模塑材料的成型。本领域技术人员可以理解的是，当所述模塑基座12的下部尺寸缩小，对应于所述模塑基座12下部的所述基板11的尺寸可被缩小，从而在足以承载所述模塑基座12的情况下得以缩小所述电路板组件10的整体尺寸。
值得一提的是，在本发明的该优选实施例中，所述模塑基座12通过模塑工艺将所述感光元件130固定地设置于所述基板11。
所述模塑基座12包括一基座上端部121和一基座下端部122，其中所述基座上端部121一体地向上地延伸自所述基座下端部122，并且所述基座下端部122一体地附着于所述基板11的上表面。优选地，所述模塑基座12为上大下小的结构，其中所述模塑基座12的所述基座上端部121的尺寸大小大于所述基座下端部122的尺寸大小。简言之，所述模塑基座12的为上大下小的结构，其中所述模塑基座12的下部尺寸小，以便减小所述电路板组件10的整体宽度尺寸。优选地，所述模塑基座12的所述基座上端部121的尺寸大于所述基座下端部122的尺寸，以便所述模塑基座12的所述基座上端部121具有足够的空间，以供所述驱动装置50和所述滤光元件40贴附在所述基座上端部121。换言之，所述基 座上端部121的结构尺寸大于所述基座下端部122的结构尺寸，当所述基座下端部122的尺寸被缩小以便减小所述电路板组件10的所述基板11宽度尺寸时，所述模塑基座12的所述基座上端部121还具有足够的空间以供后续的加工工艺，比如AA工艺和HA工艺。
所述模塑基座12进一步具有一模塑上端面123和一模塑下端面124，其中所述模塑上端面123位于所述模塑基座12的上表面，即所述基座上端部121的上表面；其中所述模塑下端面124被形成于所述模塑基座12的下表面，即所述基座下端部122的下表面。可以理解的是，所述模塑下端面124经模塑加工工艺由所述模塑材料一体地形成于所述基座11的上表面，或者所述模塑下端面124经模塑加工工艺面对面地一体地贴合于所述基座11的上表面。
值得一提的是，所述模塑上端面123为形成于所述模塑基座12上表面的光滑表面，以便在所述模塑上端面123涂覆胶层，和提供于被支撑物均匀的支撑作用力。
优选地，所述模塑上端面123的尺寸和面积大小大于所述模塑下端面124的尺寸和面积大小，以便所述模塑基座12的所述模塑上端面123能够提供于所述滤光元件40和所述驱动装置50足够的空间，从而满足所述模塑基座12的加工需求。可以理解的是，在所述模塑基座12的所述模塑上端面123的尺寸满足后续加工(比如AA工艺或HA工艺)需求的情况下，所述模塑基座12的所述模塑下端面124的尺寸小于所述模塑下端面123的尺寸大小，以便减小所述电路板组件10的所述基板11的宽度尺寸，从而减小了所述电路板组件10的整体尺寸的大小。换言之，当所述模塑基座12的所述模塑上端面123的尺寸保持不变的情况下，通过减小所述模塑基座12的所述基座下端部122的尺寸大小的方式减小所述模塑下端面124的尺寸大小，从而利于减小所述电路板组件10的所述基板11的宽度尺寸。
本领域技术人员可以理解的是，所述电路板组件10的所述基板11的尺寸大小制约所述摄像模组100的整体宽度尺寸的主要因素。因此，当所述电路板组件10的所述基板11的宽度尺寸被缩小时，有利于缩小所述摄像模组100的整体尺寸。当所述摄像模组100的尺寸被缩小，所述摄像模组100被安装于所述电子设备本体200时，可减小所述摄像模组100与所述电子设备本体200的比例，利于提高所述电子设备的屏占比。
当所述模塑基座12的所述模塑下端面124的尺寸和面积大小保持不变时，所述模塑基座12的所述基座上端部121可被增大，所述模塑上端面123的面积大小被增大，从而增加了所述驱动装置50和所述滤光元件40与所述电路板组件10的接触面的大小，易于在所述模塑基座12的所述模塑上端面123画胶，和增加画胶宽度。本领域技术人员可以理解的是，所述摄像模组100在被组装时，预留给AA工艺和HA工艺的空间是非常小的，通过增加所述模塑基座12的所述模塑上端面123的尺寸大小可增大预留给AA工艺或所述HA工艺的加工空间，从而有助于提高AA工艺的良率。
所述电路板组件10的所述模塑基座12进一步包括一基座内壁125和一基座外壁126，其中所述基座内壁125被形成于所述模塑基座12的内侧内壁，其中所述基座外壁126被形成于所述模塑基座12的外侧外壁。可以理解的是，所述模塑基座12的所述基座内壁125和所述基座外壁126通过模塑工艺拔模后形成在所述模塑基座12的内侧和外侧。优选地，在本发明第一较佳实施例中，所述模塑基座12的所述基座内壁125是形成于所述模塑基座12自上而下地向外侧倾斜的斜面。换言之，所述模塑基座12的内侧表面是倾斜向下地朝向于所述电路板组件10的所述基板11，其中所述基座内壁125在竖直方向的投影被所述模塑上端面124在竖直方向的投影所遮盖，即沿所述摄像模组100的感光路径方向，所述基座内壁125的投影被所述模塑上端面124的投影所遮盖。
优选地，所述模塑基座12的所述基座内壁125和所述基座外壁126是形成于所述模塑基座12内侧和外侧的平面、或具有一定曲率形状的曲面、亦或是不规则形状的弧面。因此，在本发明中，所述基座内壁125和所述基座外壁126的形状、曲率以及平滑度在此不做限定。
本领域技术人员可以理解的是，外界的杂散光通过所述摄像模组100的所述镜头20传输至所述电路板组件10时，所述电路板组件10的所述模塑基座12能够减少杂散光通过反射的方式进入至所述感光元件130，从而能够有效地减少杂散光对所述摄像模组100成像的影响，提高所述摄像模组100的成像性能。所述模塑基座12的所述基座内壁125朝向于所述电路板组件10的所述基板11，从而避免杂散光照射在所述基座内壁125，进而反射至所述感光元件130。简言之，所述模塑基座12具有向内地倾斜向下朝向的所述基座内壁12，减少了通过所述模塑基座12的所述基座内壁12反射至所述感光元件130的杂散光，从而提高所 述摄像模组100的成像质量。
优选地，在本发明的该优选实施例中，所述模塑基座12的所述基座内壁125是成型于所述模塑基座内侧的粗糙面，其中所述模塑基座12的所述基座内壁125的粗糙程度大于所述模塑基座12的上表面的粗糙程度。换言之，所述模塑基座12的所述基座内壁125是不光滑的表面，以降低所述基座内壁125对于光线的反射作用，有利于减少所述基座内壁125反射的杂散光。
所述模塑基座12的各所述基座内壁125具有一内侧面1251和所述内侧面1251一体向下地延伸而成的一内弧面1252，其中所述内侧面1251自所述模塑基座12的所述模塑上端面123的内侧边向下地和倾斜向外地延伸至所述内弧面1252。所述内弧面1252自所述模塑基座12的所述模塑下端面124向上地和倾斜向外地延伸至所述内侧面1251。值得一提的是，所述模塑基座12的所述基座内壁125的所述内侧面1251还可以是垂直于所述模塑上端面123的垂直面，即所述内侧面1251垂直于所述模塑上端面123。优选地，所述基座内壁125的所述内侧面1251为所述基座内壁125的倾斜平面。所述内弧面1252的开口朝向于所述模塑基座12的内侧。所述基座内壁125的所述内弧面1252是成型于所述基座内壁125下端的粗糙面，其中所述基座内壁125的所述内弧面1252形成于所述模塑基座12的下部内侧。可以理解的是，糙面形式的所述内弧面1252能够降低对于光线的反射作用，从而所述内弧面1252能够减少反射至所述感光元件130杂散光，有利于提高所述摄像模组100的成像性能。
优选地，在本发明第一较佳实施例中，所述模塑基座12的所述基座外壁126是形成于所述基座12自上而下地向内倾斜的斜面，其中所述基座外壁126在竖直方向的投影被所述模塑上端面124在竖直方向的投影所遮盖，即沿所述摄像模组100的感光路径方向，所述基座外壁126的投影被所述模塑上端面124所遮盖。简言之，所述模塑基座12是上大下小的结构，其中所述模塑基座12的所述基座外壁126是倾斜向下地朝向于所述电路板组件10的所述基板11。所述模塑基座12的所述基座上端部121自上而下地向内地延伸至所述模塑基座12的所述基座下端部122，所述模塑基座12的所述基座下端部122的尺寸小于所述基座上端部121的尺寸。所述模塑基座12的所述基座下端部122的尺寸缩小，以便减小所述电路板组件10的所述基板11的宽度尺寸。
所述模塑基座12的各所述基座外壁126具有一外侧面1261和一外弧面1262， 其中所述外侧面1261自所述模塑基座12的所述模塑上端面123的外侧边向下地和倾斜向内地延伸至所述外弧面1262。所述外弧面1262自所述模塑基座12的所述模塑下端面124向上地和倾斜向内地延伸至所述外侧面1261。值得一提的是，所述模塑基座12的所述基座外壁126的所述外侧面1261还可以是垂直于所述模塑上端面123的垂直面，即所述外侧面1261垂直于所述模塑上端面123。优选地，所述基座外壁126的所述外侧面1261为所述基座外壁126的倾斜平面。所述外弧面1262的开口朝向于所述模塑基座12的外侧，或者朝向于所述基板11。所述基座外壁126的所述外弧面1262形成于所述模塑基座12的下部的外侧，其中所述基座外壁126的所述外弧面1262自外向内的凹陷，以减小所述模塑基座12的所述基座下端部122的尺寸。
在本发明第一较佳实施例中，所述摄像模组100的所述驱动装置50通过胶粘的方式设置于所述电路板组件10的所述模塑基座12。所述摄像模组100进一步包括一基座胶层60，其中所述基座胶层60是以画胶的方式形成于所述模塑基座12的所述基座上端面123。可以理解的是，所述基座胶层60还可被实施为以画胶工艺形成于所述驱动装置50底部。
如图2至图5A所示，所述模塑基座12进一步设有一画胶区域127，其中所述画胶区域127位于所述模塑基座12的所述基座上端面123。胶体被画胶至所述画胶区域127，和在所述画胶区域127的上方形成所述基座胶层60。可以理解的是，形成所述基座胶层60可以单不限于固态胶体材料、流体胶体材料。在所述模塑基座12的所述基座下端部122被缩小的情况下，或者保持所述基座下端部122的尺寸大小不变时，所述模塑基座12的所述基座上端部121可被增大，以增加所述模塑基座12的所述基座上端面123的大小，从而有利于增加画胶区域127的宽度大小，以便增大所述摄像模组100的所述基座胶层60的宽度。本领域技术人员可以理解的是，通过增大所述模塑基座12的所述画胶区域127的宽度增加所述摄像模组100的所述基座胶层60宽度，利于所述模塑基座12与所述驱动装置50的贴附，并且提高贴附可靠性。
如图2至图4所示，所述摄像模组100的所述电路板组件10进一步包括一组引线13，其中所述引线13连接所述感光元件130于所述基板11。所述电路板组件10的所述基板11通过所述引线13与所述感光元件130连通，以供所述感光元件130通过所述引线13传输电信号至所述电路板组件10的基板11。
优选地，在本发明第一较佳实施例中，所述摄像模组100的所述电路板组件10的所述引线13和所述感光元件130被包埋于所述模塑基座12，以减小所述摄像模组100的宽度尺寸的大小。在其他实施例中，所述模塑基座12以绕于所述感光元件130和所述引线13外侧的方式一体地成型于所述基板11。
本领域技术人员可以理解的是，所述电路板组件10的所述引线13被包埋于所述模塑基座12，所述模塑基座12进一步固定所述感光元件130于所述基板11。所述引线13和部分的所述感光元件130被所述模塑基座12包埋，以便减小所述电路板组件10的所述基板11的尺寸大小，提高所述感光元件130的利用率。
进一步地，所述电路板组件10进一步具有一光窗14，其中所述光窗14通过模塑工艺形成于所述模塑基座12的内侧。所述镜头20通过所述光窗14传输光线至所述感光元件130。可以理解的是，所述光窗14由所述模塑基座12的所述基座内壁125界定。优选地，所述光窗14的开口大小尺寸应当于所述感光元件130适配，以使得进入所述模组的光线可被所述感光元件130接收。感光元件130根据本发明第一较佳实施例，所述光窗14的上部开口的尺寸大小小于或等于所述光窗14的下部开口的大小，其中所述光窗14的上部开口限制了所述摄像模组100的透光量。所述光窗14的上部开口可限制了部分外部的杂散光的进入，同时所述基座内壁125朝向于所述电路板组件10的所述基板11，光线进入不会通过所述基座内壁125反射，从而避免杂散光产生，因此提高了所述摄像模组100的成像质量。
如图2至图4所示，所述感光元件130进一步包括一感光部31和一非感光部32，其中所述非感光部32一体向外地延伸于所述感光部31。所述感光部31接收所述镜头20传输的光线和转化光信号至对应的电信号。所述引线13连通所述感光元件130的所述非感光部32于所述电路板组件10的所述基板11，以供所述感光元件130通过所述引线13传输所述光电转化的信号至所述基板11。优选地，在本发明第一较佳实施例中，所述光窗14对应于所述感光元件130的所述感光部31。相应地，所述感光元件130的所述非感光部31被包埋于所述电路板组件10的所述模塑基座。所述模塑基座12固定所述感光元件130于所述基板11的上表面。
所述感光元件130的下表面贴附于所述基板11的上方，其中所述感光元件130的上表面具有一感光区域33和一非感光区域34，其中所述非感光区域33位 于所述感光部31的上端表面，所述非感光区域34位于所述非感光部32的上端表面和所述感光部31的上端表面的边缘部分。具体地说，所述感光单元30的所述感光区域33的尺寸对应于所述光窗14的上部开口(孔径)的尺寸，所述模塑基座12遮盖所述感光元件的上表面的部分对应于所述感光元件130的非感光区域34。所述感光元件130的感光区域33基于所述光窗14，接收所述镜头20传输的光线。
如图2至图4所示，所述电路板组件10进一步包括至少一电子器件15，其中所述电子器件15被设置于所述基板11的表面。优选地，所述至少一电子器件15被贴附于所述基板11的边缘，被所述模塑基座12包埋所述电子器件15于所述基板11的上表面。所述电路板组件10的所述电子器件15被所述模塑基座12覆盖，藉由所述模塑基座12隔绝所述电子器件15，以便于保护所述电路板组件的所述电子器件15，避免长时间与环境接触而氧化。
所述基板11具有一基板上表面111和对应于所述基板上表面111的一基板下表面112，其中所述感光元件130和所述电子器件15被贴附于所述基板上表面111。所述模塑基座12一体地成型于所述基板11的所述上表面111，其中所述基板11的所述基板上表面111的宽度尺寸大于或等于所述模塑基座12的宽度尺寸。当所述模塑基座12的宽度尺寸可被缩小时，对应于所述模塑基座12下端的所述基板11的尺寸可被对应地缩小，从而减小所述电路板组件10的宽度尺寸，有利于减小所述摄像模组100的整体尺寸。
所述基板11进一步设有一贴合区113和一边缘区114，其中所述感光元件130贴附于所述基板11的所述贴合区113，所述边缘区114位于所述贴合区113的周边。所述模塑基座12一体地成型于所述基板11的所述边缘区114。优选地，所述模塑基座12的所述基座下端部122覆盖或包埋在所述基板11的所述边缘区114。可选地，所述基板11的所述边缘区114的尺寸大于或等于所述模塑基座12的所述基座下端部122的尺寸。因此，可通过缩小所述模塑基座12的所述基座下端部122的尺寸的方式减小所述电路板组件10的所述基板11的尺寸大小，从而减小所述摄像模组100的整体尺寸。
参考本发明说明书附图之图5A至图7B所示，示出了本发明上述较佳实施例的所述电路板组件10的几种可选实施方式。所述电路板组件10的基板11通过所述引线13连通于所述感光元件20，其中所述电子器件15被设置于所述基 板11的上表面。当所述电子器件15和所述电路板组件10被设置于所述基板11后，所述基板11被置于模塑加工的一模具300，藉由所述模具300以模塑加工的方式一体将所述模塑基座成型于所述基板11的上表面。值得一提的是，在所述电路板组件10的模塑加工过程中，成型所述模塑基座12的拔模工艺的拔模角度大于等于90°(包括90°)，以使所述模塑基座12成型于所述基板11后，所述模塑基座12的所述基座上端部121的尺寸大于所述基座下端部122的尺寸。
如图7C所示，示出了所述模塑基座12的所述基座内壁125的所述内侧面1251和所述内弧面1252的两种不同实施方式，其中所述内弧面1252自内向外凹陷形成一凹槽，其中所述内侧面1251位于所述凹槽的上方。在另一实施方式中，所述模塑基座12的所述基座内壁125的所述内侧面1251向下平滑地延伸至所述内弧面1252，其中所述内侧面1251和所述内弧面1252的连接部位具有平滑的倒角。
特别地，模塑材料冲击在所述基板11和/或感光元件130的上方而形成的所述模塑基座12，其基座内壁125形成内侧面、内弧面以及斜面。所述内侧面位于所述内弧面的上方，所述斜面是由所述模塑材料冲击在所述基板11或所述感光元件130的上方而形成的倾斜面。
值得一提的是，成型所述模塑基座12的拔模工艺的拔模角度包括至少一内拔模角度和至少一外拔模角度，其中所述模塑基座12的所述基座内壁125的倾斜角度和形状取决于所述内拔模角度的大小，其中所述模塑基座12的基座外壁126的倾斜角度和形状取决于所述外拔模角度。在本发明的该较佳实施例中，所述模塑基座12的模塑加工工艺中的至少一拔模角度大于等于90°。
如图5A至图5D所示，成型所述模塑基座12至少一侧边的内拔模角度大于等于90°(包括90°)，以使得成型后的所述模塑基座12的至少一侧的所述基座内壁125自上而下地向外地倾斜地延伸。成型所述模塑基座12的外侧边与所述基板11的角度小于或等于90°(包括90°)，使得成型后的所述模塑基座12的所述基座外壁126自上而下地向内地倾斜。优选地，所述模塑基座12的每一侧边的内拔模角度大于等于90°(包括90°)，以使得所述模塑基座12的所述基座内壁125向内地倾斜，以避免杂散光被所述基座内壁125反射进入到所述感光元件130。
所述模塑基座12的所述基座内壁125与所述模塑基座12的垂直方向的夹角 为θ 1，其中所述夹角θ 1大于0。可以理解的是，所述模塑基座12的所述基座内壁是自所述模塑基座12的向内地倾斜向上延伸，当所述模塑基座12的所述模塑下端面124的面积大小保持不变的情况下，通过调整所述内拔模角度的方式调节所述基座内壁125与所述模塑基座12的垂直方向的夹角为θ 1，以增大所述模塑基座12的基座上端面123的面积，从而有利于后续AA工艺或HA工艺。
所述模塑基座12的所述基座内壁125与所述基板11所在平面的夹角为α1，其中α1小于等于90°，并且α1与所述夹角θ 1的和为90°。优选地，所述基座内壁125与所述基板11所在平面的夹角为α1小于90°的锐角。可以理解的是，所述模塑基座12的内侧拔模角度为90°+θ 1。
值得一提的是，所述模塑基座12的所述基座内壁125可以是成型于所述模塑基座12内侧的平面或曲面。如图5C和图5D所示，所述基座内壁125是成型于所述模塑基座12内侧的曲面，其中所述基座内壁125具有一定弧度，沿所述摄像模组100的感光路径方向，即在所述摄像模组100的竖直方向上，所述基座内壁125的投影被所述模塑基座12的所述基座上端面123遮盖。
参考本发明说明书附图之图6A至图6D所示，依照本发明上述较佳实施例的所述摄像模组100的所述模塑基座12的另一可选实施方式在接下来的描述中被阐明。所述摄像模组100的所述模塑基座12通过模塑加工工艺一体地成型于所述电路板组件10的所述基板11，所述模塑基座12至少一侧边的外拔模角度大于等于90°(包括90°)，以使得成型后的所述模塑基座12的至少一侧的所述基座外壁126自上而下地向内地倾斜。成型所述模塑基座12的内侧边与所述基板11角度小于或等于90°(包括90°)，使得成型后的所述模塑基座12的所述基座外壁126自上而下地向内地倾斜。优选地，所述模塑基座12的每一侧边的内拔模角度大于90°(包括90°)，以使得所述模塑基座12的所述基座外壁126从上向下向内的倾斜。所述模塑基座12的所述基座外壁126与所述模塑基座12的垂直方向的夹角为θ 2，其中所述夹角θ 2大于0。
所述模塑基座12的所述基座外壁126与所述基板11所在平面的夹角为α2，其中α2小于等于90°，并且α2与所述夹角θ 2的和为90°。优选地，所述基座外壁126与所述基板11所在平面的夹角为α2小于90°的锐角。可以理解的是，所述模塑基座12的内侧拔模角度为90°+θ 2。
值得一提的是，所述模塑基座12的所述基座外壁126可以是成型于所述模 塑基座12外侧的平面或曲面。如图6C和图6D所示，所述基座外壁126是成型于所述模塑基座12外侧的曲面，其中所述基座外壁126具有一定弧度，沿所述摄像模组100的感光路径方向，即在所述摄像模组100的竖直方向上，所述基座外壁126的投影被所述模塑基座12的所述基座上端面123遮盖。
相应地，当保持所述模塑基座12的基座上端部121的尺寸大小保持不变，并且足以支撑和组装所述驱动装置50和所述绿光元件40时，所述模塑基座12的所述基座下端部122自所述基座上端部121向内的倾斜延伸，以使得所述模塑基座12的底端变小，从而有利于减小所述电路板组件10的所述基板11的尺寸，从而有利于减小所述摄像模组的整体尺寸。
参考本发明说明书附图之图7A至图7D所示，依照本发明上述较佳实施例的所述摄像模组100的所述模塑基座12的另一可选实施方式在接下来的描述中被阐明。所述摄像模组100的所述模塑基座12通过模塑加工工艺一体地成型于所述电路板组件10的所述基板11，所述模塑基座12至少一侧边的外拔模角度大于等于90°(包括90°)，以使得成型后的所述模塑基座12的至少一侧的所述基座外壁126自上而下地向内地倾斜。成型所述模塑基座12的内侧变的拔模角度大于等于90°(包括90°)，使得成型后的所述模塑基座12的所述基座外壁126自上而下地向外地倾斜。优选地，所述模塑基座12的每一侧的所述内拔模角度大于90°和外拔模角度大于90°，使得成型后的所述模塑基座12为上大下小的结构，其中所述模塑基座12的上端部121的尺寸大小大于所述下端部122的大小。所述模塑基座12的所述基座内壁125与所述模塑基座12的垂直方向的夹角为θ 1，其中所述夹角θ 1大于0。所述模塑基座12的所述基座外壁126与所述模塑基座12的垂直方向的夹角为θ 2，其中所述夹角θ 2大于0。
所述模塑基座12的所述基座内壁125与所述基板11所在平面的夹角为α1，其中α1小于等于90°，并且α1与所述夹角θ 1的和为90°。优选地，所述基座内壁125与所述基板11所在平面的夹角为α1小于90°的锐角。可以理解的是，所述模塑基座12的内侧拔模角度为90°+θ 1。所述模塑基座12的所述基座外壁126与所述基板11所在平面的夹角为α2，其中α2小于等于90°，并且α2与所述夹角θ 2的和为90°。优选地，所述基座外壁126与所述基板11所在平面的夹角为α2小于90°的锐角。可以理解的是，所述模塑基座12的内侧拔模角度为90°+θ 2。
值得一提的是，所述模塑基座12的所述基座内壁125可以是成型于所述模塑基座12内侧的平面或曲面。如图7C和图7D所示，所述基座内壁125是成型于所述模塑基座12内侧的曲面，其中所述基座内壁125和所述基座外壁126具有一定弧度，沿所述摄像模组100的感光路径方向，即在所述摄像模组100的竖直方向上，所述基座内壁125和所述基座外壁126的投影被所述模塑基座12的所述基座上端面123遮盖。
可以理解的是，所述模塑基座12的内拔模角度大于90°时，所述模塑基座12的所述基座内壁能够减少外界杂散光进入到所述感光元件130，所述模塑基座12的外拔模角度大于90°时，所述模塑基座12的所述基座下端部122的尺寸可被减小，以缩小所述基座11的尺寸，有利于所述摄像模组100的整体尺寸。所述模塑基座12的所述基座下端面124缩小的同时，所述模塑基座12的所述基座上端面123可被增大，以使得所述模塑基座12的所述基座下端部122缩小的前提下增大所述模塑基座12的所述基座上端部121。简言之，当所述模塑基座12的所述内拔模角度和外拔模角度均大于90°时，所述模塑基座12的所述基座下端面124的尺寸变下，以使得所述模塑基座12的尺寸减小，和所述模塑基座12的所述基座上端面123的尺寸变大，以使得所述模塑基座12提供于后续加工更大的加工空间。
参考本发明说明书附图之图8至图10所示，依照本发明上述第一较佳实施例的一摄像模组的另一可选实施方式在接下来的描述中被阐明。所述摄像模组100进一步包括一镜座70，其中所述镜座70被设置于所述模塑基座12和所述驱动装置50之间，藉由所述镜座70固定所述驱动装置50于所述电路板组件10的所述模塑基座12。
进一步，在该实施例中所述摄像模组100的所述滤光元件40也被设置于所述镜座70，其中所述镜座70支撑所述滤光元件40，以保持所述滤光元件40于所述感光元件130上方。
可以理解的是，所述镜座70可被实施为一支撑基座，其中所述镜座70进一步包括一镜座本体71和一镜座胶层72，其中所述镜座胶层72被设置于所述镜座70的上方或下方，通过所述镜座胶层72固定所述驱动装置50于所述镜座本体71，或通过所述镜座胶层72固定所述镜座本体71于所述模塑基座12。所述驱动装置50被所述镜座主体71支撑，以驱动所述镜头20移动。
参考本发明说明书附图之如图11A至图11G，示出了本发明上述较佳实施例的所述摄像模组100的所述电路板组件10的制造方法的流程。如图11A所示，首先，提供或准备所述电路板组件10的至少一所述基板11。根据本发明上述较佳实施例，其中所述基板11的上端被贴附所述感光元件130。简言之，提供半成品的所述电路板组件10的所述基板11，其中所述引线13连通所述感光元件130于所述基板11。
如图11B所示，所述电路板组件10的所述基板11被置于所述模具300，藉由所述模具300固定所述基板11。值得一提的是，所述模具300包括一上模具310、一下模具320、以及进一步设有至少一加工空间330，其中所述加工空间330位于所述上模具310和所述下模具320之间。所述基板11被放置于所述加工空间330，在合模时，所述上模具310和所述下模具320之间的所述加工空间330被挤压变小，直至所述上模具310贴合于所述基板11的上表面。
进一步地，所述模具300进一步包括一塑形膜340，其中所述塑形膜340被设置于所述模具300的所述上模具310的下方，当所述上模具310和所述下模具320合模时，所述塑形膜340贴合于所述上模具310。合模后，所述模具300的所述上模具310挤压所述塑形膜340于所述基板11的上表面，以使得部分所述塑形膜340密合于所述基板11。所述模具300合模后，在所述塑形膜340和所述基板11之间进一步形成一成型空间350，其中所述模塑基座12的模塑材料被置入到所述成型空间350中，以固化形成所述模塑基座12。
值得一提的是，所述模具300的所述塑形膜340具有弹性，当所述上模具310和所述下模具320合模后，所述上模具310挤压所述塑形膜340，其中所述塑形膜340被挤压而产生弹性形变。可以理解的是，所述塑形膜340的形状轮廓决定所述成型空间350的空间形状特征，当所述模塑材料在所述成型空间350中成型后得到所述模塑基座12。
更值得一提的是，当所述塑形膜340被吸附于所述模具300的所述上模具310的下方，所述上模具310通过所述塑形膜340固化所述模塑基座12于所述成型空间350。当模塑材料在所述成型空间350固化成型时，所述模塑材料基于所述塑形膜340的下表面固化形成所述模塑基座12。可以理解的是，所述模塑基座12的所述模塑上端面123成型于所述成型空间350的上端，其中所述模塑上端面123正对于所述成型空间350上端的所述塑形膜340的下表面。值得一提的是， 所述塑形膜340的表面光滑，藉由所述塑形膜340形成的所述模塑基座12的所述模塑上端面123为光滑平面。
当所述模具300的所述上模具310挤压所述塑形膜340变形时，所述塑形膜340被所述上模具310挤压向外产生塑性弹性形变，其中所述塑形膜340向外突出延伸的部分表面粗糙，藉由所述塑形膜340的突出部分形成的所述模塑基座12的表面为粗糙的表面。
所述模具300的所述上模具310进一步包括至少一隔离块311和至少一压合块312，其中所述隔离块311和所述压合块312压合在所述感光元件130和所述基板11的上方，以形成所述成型空间350的通道。所述隔离块311具有一凹槽，其中所述隔离块311两端挤压所述塑形膜340，所述隔离块311与所述感光元件130之间形成一隔离空间360。所述隔离块311位于所述压合块312的内侧，其中所述隔离块311对应地密合于所述感光元件130的上表面，以防止模塑材料自所述成型空间350进入到所述隔离空间360。简言之，当所述上模具310与所述下模具320合模后，所述隔离块311密合于所述感光元件130的上方，以形成所述感光元件130的所述通光路径。所述隔离块311挤压所述塑形膜340，以使得所述塑形膜340密合于所述感光元件130的上表面，以隔绝所述成型空间350与所述通光路径。当所述上模具310和所述下模具320合模后，所述压合块312和所述隔离块311挤压所述塑形膜340于所述基板11和所述感光元件130的上方，以使得所述塑形膜340和所述基板11之间形成所述成型空间350。
相应地，在上述步骤中，所述塑形膜340贴合于所述上模具310的下表面，其通过抽气的方式抽取所述塑形膜340与所述上模具310之间的气体，以使得所述塑形膜340紧贴于所述上模具310，避免所述塑形膜340与所述上模具310之间存在空气，而影响所述塑形膜340的平整度。
如图11C和图11D所示，所述模具300合模，其中所述上模具310挤压所述塑形膜340，使得所述塑形膜340产生弹性形变，其中所述塑形膜340以弹性变形的方式挤压所述成型空间350。所述上模具310的所述隔离块311挤压所述塑形膜340，使得所述塑形膜340被所述隔离块311挤压而产生自所述隔离块311向外延伸的弹性形变。可以理解的是，所述隔离块311的下端挤压所述塑形膜340，其中靠近于所述隔离块311底端的所述塑形膜340产生的弹性形变大于所述隔离块311顶端的所述塑形膜340产生的弹性形变。换言之，所述隔离块311 挤压所述塑形膜340于所述感光元件130，使得贴附于所述隔离块311外侧的所述塑形膜340产生自下而上逐渐变小的弹性形变，以使得所述塑形膜340自所述隔离块311的外壁向外地挤压所述成型空间350。简言之，所述塑形膜340被所述隔离块311挤压，使得贴附于所述隔离块311外侧的所述塑形膜340的下端厚度大于所述塑形膜340上端的厚度。
所述上模具310的所述隔离块311挤压所述塑形膜340，其中所述塑形膜340被所述隔离块311挤压形成一内延部341，其中所述内延部341经挤压成型于所述隔离块311的外侧，其中所述内延部341自所述隔离块311的外侧向外挤压所述成型空间350。可以理解的是，所述内延部341形成所述模塑基座12的所述内侧面1251和所述内弧面1252。可以理解的是，由于所述塑形膜340受挤压而成型的所述内延部341，所述内延部341下部的外表面粗糙，藉由所述内延部341糙化所述内弧面1252，以使得所述内弧面1252的表面光滑度降低。
所述上模具310的所述压合块312挤压所述塑形膜340，使得所述塑形膜340被所述隔离块311挤压而产生自所述压合块312向内延伸的弹性形变。可以理解的是，所述压合块312的下端挤压所述塑形膜340，其中靠近于所述压合块312底端的所述塑形膜340产生的弹性形变大于所述压合块312顶端的所述塑形膜340产生的弹性形变。换言之，所述压合块312挤压所述塑形膜340于所述基板11，使得贴附于所述压合块312内侧的所述塑形膜340产生自下而上逐渐变小的弹性形变，以使得所述塑形膜340自所述压合块312的内壁向外地挤压所述成型空间350。
所述上模具310的所述压合块312挤压所述塑形膜340而形成一外延部342，其中所述外延部342被形成于所述上模具310的下方，所述外延部342成型于所述压合块312的内侧，其中所述外延部342自所述压合块312的内侧向内挤压所述成型空间350。可以理解的是，所述外延部342形成所述模塑基座12的所述外侧面1261和所述外弧面1262。
所述上模具310的所述隔离块311挤压所述塑形膜340，其中所述塑形膜340被所述隔离块311挤压形成一内延部341，所述内延部341分为一上内延部和一下内延部，所述上内延部对应形成所述内侧面1251，所述下内延部对应形成所述内弧面1252。值得一提的是，当所述上模具210和所述下模具320合模时，所述隔离块311上的所述塑形膜340受到挤压，从而所述塑形膜340往外部突出 形成所述下内延部，由于所述下内延部为挤压所述塑形膜340，使得所述塑形膜340堆叠，所述下内延部的形状不易受到管控，故对应形成的所述内弧面1252的形状也不是固定。其次，所述下内延部形成是所述塑形膜340具有弹性故会受到挤压形成，所述下内延部的表面会比较粗糙，而所述上内延部由于是所述下内延部的形成，使得所述上内延部受到一定的力的作用，从而使得所述上内延部可能形成倾斜表面；但是，所述上内延部在模塑成型过程中还是保持绷紧的状态，故所述上内延部的表面的较为光滑，故在成型后所述内侧面1251的表面比所述内弧面1252光滑。
值得一提的是，所述上模具310的所述隔离块311和所述压合块312挤压所述塑形膜340产生形变，其中所述塑形膜340产生的弹性形变的大小决定所述模塑基座12的拔模角度。因此，可通过所述塑形膜340厚度、弹性系数、以及合模后所述上模具311和对所述塑形膜340的压力控制所述内延部341和所述外延部342的形状和大小，从而决定所述模塑基座12的拔模角度。
本发明的所述塑形膜340的厚度为H时，所述上模具310挤压所述塑形膜340产生的所述内延部341和所述外延部342的厚度为1.2H～1.5H。换言之，所述模塑基座12的所述内弧面341距离所述模塑基座12的光窗开口的横向垂直距离为0.2H～0.5H。示例性地，当所述塑形膜340的厚度为100μm时，成型后的所述模塑基座12的所述基座上端面123和所述基座下端面124之间在基于光轴方向的垂直距离为20μm～50μm。
如图11D和图11E所示，模塑材料被加入至所述成型空间，以使所述模塑材料基于所述塑形膜340的外壁成型于所述成型空间350。由于所述塑形膜340被所述上模具310的所述隔离块311挤压，而密合于所述感光元件130的上表面，在模塑材料成型于所述成型空间350时，所述塑形膜340被所述隔离块311挤压，以阻止所述模塑材料自所述成型空间350进入到所述感光元件130的感光通道。
如图11F和图11G所示，所述模塑材料在所述成型空间350中固化成型，而得到所述模塑基座12。所述模塑基座12与所述模具300脱模时，所述模具300的所述上模具310和/或所述下模具320被牵引，以使所述上模具310和所述下模具320相分离。所述上模具310在与所述下模具320分离过程中，所述上模具310与所述塑形膜340之间的压力消除，所述塑形膜340在弹性作用下回复至初始状态，以便所述塑形膜340和所述上模具310脱离于所述模塑基座12。
参考本发明说明书附图之图12A至图12F所示，依照本发明上述较佳实施例之所述电路板组件10的所述模塑基座12的另一制造工艺过程在接下来的描述中被阐明。如图12A所示，首先在由多个基板11组成的一基板拼版中，通过引线13连通所述感光元件130于所述基板11，和设置所述电路板组件10的所述电子器件15于所述基板11，由多个半成品电路板组成一电路板拼版。
如图12B所示，所述基板拼版被置于一模具300，其中所述模具包括一上模具310和一下模具320，其中所述上模具310和所述下模具320之间形成一加工空间330，其中所述基板拼版被置于所述加工空间330中。所述模具300进一步包括一塑形膜340，其中所述塑形膜340具有弹性和韧性，所述塑形膜340贴合于所述模具300的所述上模具310。通过抽气的方式抽取所述上模具310与所述塑形膜340之间的空气，以使得所述塑形膜340紧贴于所述上模具310。所述上模具310进一步包括多个隔离块311和多个压合块312，其中各所述隔离块311对应于所述感光元件130的上方表面，其中各所述压合块312对应地密合于所述基板11。在模塑过程中，相邻的所述隔离块311和所述压合块312间隔形成至少一成型空间350，其中模塑材料在所述成型空间350中固化成型，从而形成两相邻的所述电路板组件20的所述模塑基座12。所述隔离块311进一步设有一凹槽，其中所述隔离块311的两端挤压所述塑形膜340，使得所述隔离块311与所述感光元件130之间形成一隔离空间360，其中所述隔离空间360对应于所述感光元件130的感光通道。所述隔离块311对应于所述感光元件130的上方，藉由所述压合块312挤压所述塑形膜340，以阻止所述成型空间350内的模塑材料进入到所述隔离空间360。
如图12C所示，当所述基板拼版被置于所述加工空间330中，所述模具300的所述上模具310和所述下模具320合模，所述上模具310密合于所述基板11和所述感光元件130的上方。各所述上模具310通过所述塑形膜340挤压所述感光元件130和所述基板11，其中所述塑形膜340被所述上模具310挤压而产生弹性形变。所述上模具310的所述隔离块311挤压所述塑形膜340，使得所述塑形膜340被所述隔离块311挤压而产生自所述隔离块311向外延伸的弹性形变。可以理解的是，所述隔离块311的下端挤压所述塑形膜340，其中靠近于所述隔离块311底端的所述塑形膜340产生的弹性形变大于所述隔离块311顶端的所述塑形膜340产生的弹性形变。换言之，所述隔离块311挤压所述塑形膜340于所 述感光元件130，使得贴附于所述隔离块311外侧的所述塑形膜340产生自下而上逐渐变小的弹性形变，以使得所述塑形膜340自所述隔离块311的外壁向外地挤压所述成型空间350。简言之，所述塑形膜340被所述隔离块311挤压，使得贴附于所述隔离块311外侧的所述塑形膜340的下端厚度大于所述塑形膜340上端的厚度。
如图12D至图12E所示，模塑材料被注入至所述成型空间350，其中所述模塑材料再所述成型空间350固化形成所述模塑基座12。当所述模塑基座12固化后，通过脱模将所述电路板组件10从所述模具300中取出。值得一提的是，在脱模过程中，所述上模具311与所述塑形膜340离压，以使得所述塑形膜340离压后在弹性作用下回复至初始状态，以便所述上模具311和所述塑形膜340脱离于成型后的所述模塑基座12。
如图12F所示，脱模后得到的由电路板组件相互连接的一电路板组件拼版，通过切割的方式分切所述电路板组件拼版，以得到各所述电路板组件10。值得一提的是，经过脱模后，相邻的各所述电路板组件10的所述模塑基座12之间相互连接。可以理解的是，以自上而下向内倾斜地方式切割所述模塑基座12，以使得所述模塑基座12的所述基座上端部121的尺寸大于所述基座下端部122的尺寸。
参照本发明说明书附图之图13A至图14B所示，依照本发明上述较佳实施例的变形实施方式在接下来的描述中被阐明。所述感光元件130和所述电子器件15被贴附于所述电路板组件10的所述基板11，其中所述感光元件130以靠近于所述基板11一侧的方式贴合于所述基板11，使得所述基板11的所述边缘区114存在至少一窄边115和至少一负载边116，其中所述窄边115的宽度小于所述负载边116的宽度。
如图13A、13B所示，所述电子器件15被设置于靠近所述负载边116的所述边缘区114，其中所述感光元件130的边缘贴近于所述基板11的所述窄边115，以减小所述电路板组件10的所述基板11至少一个方向的长度。贴有所述感光元件130的所述基板11被放置于所述模具300，其中所述上模具310的所述隔离块311和所述压合块312分别压合于所述感光元件130和所述基板11。所述模具300合模后，在对应于所述窄边115对应的所述成型空间350的通道的宽度小于所述负载边116对应的所述成型空间350的通道的宽度，以使得模塑成型后得 到的所述模塑基座12的至少一侧的底面较窄。
如图14A和图14B所示，在模塑过程中，对应于所述基板11的所述窄边115的所述模塑基座12的拔模角度大于90°，以使得模塑成型于所述窄边115上方的所述模塑基座12的所述基座下端部122的宽度小于所述基座上端部121的宽度。简言之，通过模塑形成于所述基板11的所述窄边115上方的所述模塑基座12为上大下小的结构。优选地，对应于所述窄边115上方的所述模塑基座12的内侧拔模角度和外侧的拔模角度均大于90°，以使得所述基板11的所述窄边115上方对应的所述模塑基座12的所述基座上端面123的尺寸足以支撑和被所述驱动装置50贴附。
本领域技术人员可以理解的是，所述摄像模组100被安装于所述电子设备的所述电子设备本体200，所述电路板组件10的所述窄边115的一侧朝向于所述电子设备本体200的顶端，以使得所述摄像模组100的所述镜头20向上地贴近于所述电子设备本体200的顶端。
可以理解的是，所述模塑基座12的拔模角度大于90°，以减小所述模塑基座12的所述基座下端部122和所述基板11的尺寸大小，从而减小了所述电路板组件10的宽度尺寸。基于所述电路板组件10的尺寸缩小，所述摄像模组100的整体横向尺寸可被缩小，以减小所述摄像模组100与所述电子设备本体200的比例，从而增大所述电子设备本体200的屏占比。
参照本发明说明书附图之图15所示，依照本发明上述较佳实施例的所述摄像模组100的所述电路板组件10的一种变形实施方式在接下来的描述中被阐明。所述电路板组件10包括至少一基板11、至少一模塑基座12、至少一组引线13、以及至少一电子器件15，其中所述引线13连通所述感光元件130于所述基板11，其中所述电子器件15贴附于所述基板11的上方。
值得一提的是，所述基板11、所述引线13、以及所述电子器件15的结构与上述第一较佳实施例的结构和功能相同，不同点在于所述模塑基座12包埋于所述基板11的所述边缘区114，所述感光元件130和所述引线13位于所述模塑基座12的内侧。所述模塑基座12的所述基座下端部122覆盖于所述基板11的所述边缘区114，所述引线13连接所述感光元件130于所述基板11的所述贴合区113。换言之，所述模塑基座12的所述基座下端部122位于所述感光元件130的外侧。
与上述第一较佳实施例相同的是，所述模塑基座12的拔模角度大于90°，以使得所述模塑基座12的所述基座上端部121的结构尺寸大于所述基座下端部122的结构尺寸。所述模塑基座12的至少一侧的内拔模角度或外拔模角度大于90°。优选地，所述模塑基座12的内侧拔模角度和外侧拔模角度均大于90°，以减小所述模塑基座12的所述基座下端部122的尺寸，从而使得所述基板11的尺寸减小。所述模塑基座12的内侧拔模角度和外侧拔模角度均大于90°，增大所述模塑基座12的所述基座上端部121的尺寸，以使得所述模塑基座12的所述基座上端面123的面积增大，便于贴附所述驱动装置50或所述镜座70。
参照本发明说明书附图之图16所示，依照本发明上述较佳实施例的所述摄像模组100的所述电路板组件10的另一种变形实施方式在接下来的描述中被阐明。所述感光元件130被贴附于所述电路板组件10的所述基板11的下方，其中所述基板11进一步设有一通孔117，其中所述感光元件130基于所述通孔117贴附于所述基板11的下方。所述电路板组件10的模塑基座12一体地成型于所述基板11的上方，其中所述模塑基座12至少一侧的拔模角度大于90°，以使所述模塑基座12的所述基座上端部121的结构尺寸的大小大于所述基座下端部122的结构尺寸的大小。
与上述第一较佳实施例不同的是，在模塑过程中，所述基板11被置于所述模具300，其中所述模具300的上模具310挤压所述塑形膜340于所述基板11，以使得所述塑形膜340密合于所述基板11。
参照本发明说明书附图之图17所示，依照本发明上述较佳实施例的所述摄像模组100的所述电路板组件10的另一种变形实施方式在接下来的描述中被阐明。所述摄像模组100是双摄、三摄、或多摄的摄像模组，其中所述摄像模组100的所述电路板组件10包括至少一基板11、至少二模塑基座12、至少一组引线13、以及多个电子器件15，其中所述模塑基座12是以模塑的方式一体地成型于所述基板11的上方。所述感光元件130被设置于所述基板11的上方，所述模塑基座12包埋于所述感光元件130的部分非感光区域的上方和所述基板11的边缘区114的上方。
所述电路板组件10的至少一所述模塑基座12至少一侧边的拔模角度大于90°，以使得所述模塑基座12的所述基座下端部122的结构尺寸小于所述基座上端部121的结构尺寸。优选地，所述模塑基座12的内拔模角度和外拔模角度 均大于90°，所述电路板组件10的所述模塑基座12成型后为上大下小的结构，以使得所述电路板组件10的所述模塑基座12的宽度尺寸缩小，从而减小所述电路板组件10的所述基板11的尺寸大小。所述电路板组件10的所述模塑基座12成型后为上大下小的结构，增大了所述模塑基座12的所述基座上端部121的尺寸，从而为后续AA工艺或HA工艺提供足够的加工空间。
参照本发明说明书附图之图18至图19B所示，依照本发明第二较佳实施例的一摄像模组100a的另一可选实施方式在接下来的描述中被阐明。所述摄像模组100a在本发明的该优选实施例中可以但不限于一单投射模组，因此，所述摄像模组100a还可被实施为与其它摄像单元组成的一阵列模组，比如TOF摄像模组。
所述摄像模组100a包括一电路板组件10a、至少一光学元件20a、以及一投射单元30a，其中所述投射单元30a被设置于所述电路板组件10a，所述投射单元30a点连接于所述电路板组件10a，其中所述电路板组件10a提供所述投射单元30a所需电能。所述光学元件20a被所述电路板组件10a保持在所述投射单元30a的上方，以向外地投射所述投射元件30a产生的光线。
值得一提的是，所述摄像模组100a的所述投射单元30a被实施为一光源，可以但不限于LED光源，其中所述投射单元30a产生的光线经由所述光学元件20a向外扩散和发射。
如图18所示，所述电路板组件10a包括一基板11a和一模塑基座12a，其中所述模塑基座12a包裹所述基板11a，所述投射单元30a被设置于所述电路板组件10a的所述基板11a，藉由所述基板11a提供所述投射单元30a电能。所述基板11a进一步包括一基板主体111a和设置于所述基板主体111a的至少一导电件112a，其中所述导电件112a电连接于所述投射单元30a。所述电路板组件10a进一步包括至少一引线13a，其中所述引线13a电连接所述导电件112a于所述投射单元30a。
所述模塑基座12a是通过模塑工艺一体地成型于所述电路板组件10a的所述基板11a，其中所述模塑基座12a包括一基座上端部121a、一基座下端部122a、以及一基座底板123a，其中所述基座上端部121a和所述基座下端部122a一体地向上地延伸于所述基座底板123a。值得一提的是，在本发明的该较佳实施例中，与上述较佳实施例不同的是，所述模塑基座12a通过模塑工艺一体地包裹于所述 基板11a，以便减少所述电路板组件10a的厚度。优选地，所述基座底板123a包裹所述基板11a，并且所述基座底板123a的厚度与所述基板11a的厚度相同。
所述模塑基座12a进一步具有一支撑部124a，其中所述支撑部124a形成于所述模塑基座12a的所述基座上端部121a，所述支撑部124a支撑所述光学元件20a。优选地，在本发明的该优选实施例中，所述支撑部124a是形成于所述模塑基座12a的所述基座上端部121a的槽，其中所述光学元件20a被设置于所述支撑部124a。
所述模塑基座12a进一步设有一基座内壁125a和一基座外壁126a，其中所述基座内壁125a形成于所述模塑基座12a的内侧，所述基座外壁126a形成于所述模塑基座12a的外侧。优选地，所述基座内壁125a自所述模塑基座12a的所述基座下端部122a向内地和向上地延伸至所述基座上端部121a。更优选地，所述基座外壁126a自所述模塑基座12a的所述基座下端部122a向外地和向上地延伸至所述基座上端部121a。换言之，所述模塑基座12a的所述基座下端部122a的尺寸小于所述基座上端部121a的尺寸。
如图18所示，所述基座内壁125a具有一内侧面1251a和一内弧面1252a，其中所述内侧面1251a自所述模塑基座12a的所述模塑上端面123a的内侧边向下地和倾斜向外地延伸至所述内弧面1252a。所述内弧面1252a自所述模塑基座12a的所述模塑下端面124a向上地和倾斜向外地延伸至所述内侧面1251a。所述模塑基座12a的各所述基座外壁126a具有一外侧面1261a和一外弧面1262a，其中所述外侧面1261a自所述模塑基座12a的所述模塑上端面123a的外侧边向下地和倾斜向内地延伸至所述外弧面1262a。所述外弧面1262a自所述模塑基座12a的所述模塑下端面124a向上地和倾斜向内地延伸至所述外侧面1261a。
如图19A至图19B所示，示出了所述模塑基座12a的制造方法，其中所述模塑基座12a是通过模塑加工工艺与所述基板11a一体地成型。所述模塑基座12a至少一侧的拔模角度大于90°，以使所述模塑基座12形成上大小的结构特征，以便所述光学元件20a被放置于所述支撑部124a时，所述支撑部124a与所述光学元件20a的接触面足够大，从而确保所述模塑基座12a与所述光学元件20a的安装可靠性。
如图19A所示，首先对一基板加工形成一拼版，其中所述基板可以但不限于金属基板，例如铜基板。以蚀刻的方式加工所述拼版，以形成所述导电件于所述 基板11a。如图19B所示，所述拼版被放置于一模具300a中，其中所述模具300a包括一上模具310a、一下模具320a、以及一塑形膜340a，其中所述塑形膜340a贴附于所述上模具310a，所述上模具310a和所述下模具320a之间形成一加工空间330a。所述上模块310包括一隔离块311a和一压合块312a，其中所述隔离块311a挤压所述塑形膜340a于所述基板11a，以使所述塑形膜340a密合于所述基板11a。所述压合块312a挤压所述塑形膜340a于所述下模具320a，以使得所述塑形膜340密合于所述下模具320a。当所述上模具310a和所述下模具320a合模后，所述上模具310a挤压所述塑形膜于所述下模具320a，其中所述塑形膜340a与所述下模具320a之间形成对应于所述模塑基座12a的一成型空间350a。模塑材料被注入所述成型空间350，和在所述成型空间350a中固化成型，以形成所述模塑基座12a。
模塑材料再所述模具300a中固化成型为所述模塑基座12a于所述基板11a。所述模塑基座12a固化成型后，脱模以得到所述电路板组件10a。值得一提的是，所述投射单元30a可以是在模塑完成后再被设置于所述基板11a的上表面，或者在模塑工艺之前被设置于所述基板11a。换言之，所述投射单元30a的安装顺序在此不做限制。
与上述第一较佳实施例相同的是，所述模塑基座12a的至少一侧的拔模角度大于90°，以使所述模塑基座12a的所述基座下端部122a的尺寸小于所述基座上端部121a的尺寸。优选地，所述模塑基座12a的内塑形膜角度和外拔模角度均大于90°，以缩小所述模塑基座12a的所述基座下端部122a的尺寸，从而使得所述模塑基座12a的整体尺寸变小。可以理解的是，所述模塑基座12a的整体尺寸缩小，可使得所述摄像模组100a的横向尺寸缩小。在所述模塑基座12a的所述基座下端部122a的尺寸缩小的情况下，所述模塑基座12a的所述基座上端部121a的尺寸增大，以增大所述基座上端部121a的所述支撑部124a的大小，从而增大所述支撑部124a与所述光学元件30a的接触面积。
可以理解的是，在所述模塑基座12a的模塑工艺过程中，所述模具300a的所述上模具310a挤压所述塑形膜340a于所述基板11a，以使得所述塑形膜340a被挤压而产生弹性形变。可以理解的是，所述上模具310a的内侧挤压所述塑形膜340a，而产生自内向外的弹性形变时，所述模塑基座12a的内拔模角度大于90°，以形成所述模塑基座12a的所述基座内壁125a。所述上模具310a的外侧 挤压所述塑形膜340a，而产生自内向内的弹性形变时，所述模塑基座12a的所述外拔模角度大于90°，以形成所述模塑基座12a的所述基座外壁126a。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (30)

  1. 一电路板组件，其特征在于，包括：
    一基板；和
    至少一模塑基座，其中所述模塑基座包括一基座内壁、一基座外壁和进一步具有一模塑上端面和一模塑下端面，其中所述基座内壁形成所述模塑基座的一光窗，其中所述基座内壁进一步具有一内侧面和一内弧面，所述内弧面延伸于所述内侧面，所述内弧面朝向于所述模塑基座。
  2. 根据权利要求1所述的电路板组件，其中所述模塑基座通过模塑工艺的方式一体地成型于所述基板，其中所述模塑基座通过下述步骤被制得：
    放置所述基板和所述感光元件于一模具的一加工空间，其中所述模具包括一上模具、一下模具以及一塑形膜；
    合模所述上模具和所述下模具，在所述塑形膜和所述基板之间形成一成型空间，其中所述上模具的一隔离块挤压所述塑性膜产生一内延部，藉由所述内延部自所述隔离块向外挤压所述成型空间；
    加入模塑材料至所述成型空间，和在所述成型空间固化成型，其中所述模塑基座的所述基座内壁成型于所述内延部的外侧；以及
    脱模，以模制所述模塑基座于所述基板。
  3. 根据权利要求2所述的电路板组件，其中所述基座内壁的所述内侧面与所述基板的夹角小于等于90°，以使所述模塑基座脱模的内拔模角度大于或等于90°。
  4. 根据权利要求1所述的电路板组件，其中所述内弧面的粗糙度大于所述内侧面的粗糙度。
  5. 根据权利要求1所述的电路板组件，其中所述模塑基座的所述基座外壁具有一外侧面和外弧面，其中所述外侧面自所述模塑上端面向下地和倾斜向内地延伸至所述外弧面，所述外弧面自所述模塑基座的所述模塑下端面延伸至所述外侧面。
  6. 根据权利要求5所述的电路板组件，其中所述模塑基座通过模塑工艺的方式一体地成型于所述基板，其中所述模塑基座通过下述步骤被制得：
    放置所述基板和所述感光元件于一模具的一加工空间，其中所述模具包括一 上模具、一下模具以及一塑形膜；
    合模所述上模具和所述下模具，在所述塑形膜和所述基板之间形成一成型空间，其中所述上模具的一压合块挤压所述塑性膜产生一外延部，藉由所述外延部自所述压合块向内挤压所述成型空间；
    加入模塑材料至所述成型空间，和在所述成型空间固化成型，其中所述模塑基座的所述基座外壁成型于所述外延部的内侧；以及
    脱模，以模制所述模塑基座于所述基板。
  7. 根据权利要求6所述的电路板组件，其中所述基座外壁的所述外侧面与所述基板的夹角小于等于90°，以使所述模塑基座脱模的外拔模角度大于等于90°。
  8. 根据权利要求1至7任一所述的电路板组件，其中所述电路板组件进一步包括以感光元件，其中所述感光元件电气连接于所述基板，所述感光元件被所述模塑基座一体地固定于所述基板。
  9. 根据权利要求1至7任一所述的电路板组件，其中所述电路板组件进一步包括以感光元件，所述感光元件电器连接于所述基板，其中所述模塑基座被一体地设置于所述感光元件的外侧。
  10. 根据权利要求8所述的电路板组件，其中所述感光元件包括一感光部和至少一非感光部，其中所述非感光部位于所述感光部的外侧，其中所述非感光部被电连接于所述基板，其中所述模塑基座覆盖于所述感光元件的所述非感光部的上方，藉由所述模塑基座固定所述感光元件于所述基板。
  11. 根据权利要求10所述的电路板组件，其中所述基板进一步具有一基板上表面和对应于所述基板上表面的一基板下表面，其中所述感光元件被贴附于所述基板上表面，其中所述模塑基座被一体地成型于所述基板上表面。
  12. 根据权利要求11所述的电路板组件，其中所述电路板组件进一步包括一组引线，其中所述引线电连接所述感光元件的非感光部于所述基板，所述引线被所述模塑基座包埋于所述基板的上方。
  13. 根据权利要求11所述的电路板组件，其中所述电路板组件进一步包括至少一电子器件，其中所述电子器件被设置于所述基板的所述边缘区，其中所述模塑基座包埋所述电子器件于所述基板。
  14. 根据权利要求10所述的电路板组件，其中所述基板进一步设有一贴合 区和一边缘区，其中所述感光元件被贴附于所述贴合区，所述边缘区位于所述贴合区的周边，其中所述感光元件以靠近于所述基板一侧的方式贴合于所述基板，使得所述基板的所述边缘区形成至少一窄边和至少一负载边，其中所述窄边的宽度小于所述负载边的宽度。
  15. 根据权利要求14所述的电路板组件，其中所述电路板组件进一步包括至少一电子器件，其中所述电子器件被设置于所述基板的所述负载边，其中所述模塑基座包埋所述电子器件于所述基板。
  16. 一摄像模组，其特征在于，包括：
    如权利要求1至15任一所述的电路板组件；
    一镜头，其中所述镜头沿所述感光元件的感光路径被保持在所述感光元件的上方；以及
    至少一滤光元件，其中所述滤光元件被保持于所述镜头和所述感光元件之间。
  17. 根据权利要求16所述的摄像模组，其中所述摄像模组进一步包括一驱动装置，其中所述驱动装置被设置于所述模塑基座的上方，所述镜头被安装于所述驱动装置，藉由所述驱动装置驱动所述镜头的移动。
  18. 根据权利要求17所述的摄像模组，其中所述滤光元件被设置于所述电路板组件的所述模塑基座的上方，藉由所述模塑基座支撑所述滤光元件。
  19. 根据权利要求18所述的摄像模组，其中所述摄像模组进一步包括一镜座，其中所述镜座被设置于所述驱动装置和所述模塑基座之间，其中所述滤光元件被设置于所述镜座，藉由所述镜座支撑所述滤光元件。
  20. 一电子设备，其特征在于，包括：
    一电子设备本体；和
    如权利要求16至19至少一所述的摄像模组，其中所述摄像模组被搭载于所述电子设备本体的上端。
  21. 一电路板组件的制造方法，其特征在于，其中所述制造方法包括如下步骤：
    (a)放置一基板和至少一感光元件于一模具的一加工空间，其中所述模具包括一上模具、一下模具和一塑形膜，其中所述加工空间被形成于所述上模具和所述下模具之间；
    (b)合模所述上模具和所述下模具，在所述塑形膜和所述基板之间形成一 成型空间，和挤压所述塑形膜变形，藉由所述塑形膜挤压所述成型空间；
    (c)加入模塑材料至所述成型空间，和固化所述模塑材料于所述成型空间；以及
    (d)脱模所述上模具和所述下模具，以模制一模塑基座于所述基板。
  22. 根据权利要求21所述的所述制造方法，其中在上述方法的所述步骤(a)中，贴附所述感光元件于所述基板的上表面，和设置一组引线，藉由所述引线电气连接所述感光元件于所述基板。
  23. 根据权利要求21所述的所述制造方法，其中在上述方法的所述步骤(b)之前进一步包括步骤：以抽气的方式抽取所述塑形膜与所述上模具之间的空气，以贴附所述塑形膜于所述上模具的下表面。
  24. 根据权利要求21所述的所述制造方法，其中在上述制造方法的所述步骤(b)中，所述上模具的一隔离块挤压所述塑形膜于所述感光元件，其中所述塑形膜被挤压而形成一内延部，其中所述内延部自所述隔离块向外地挤压所述成型空间，以使所述模塑基座的内拔模角度大于等于90°。
  25. 根据权利要求24所述的所述制造方法，其中在上述制造方法的所述步骤(c)中，所述模塑材料成型于所述内延部的外侧，而固化成型为所述模塑基座的一基座内壁。
  26. 根据权利要求25所述的所述制造方法，其中在上述制造方法的所述步骤(c)中，模塑材料充满所述成型空间，其中所述模塑基座的所述基座内壁成型于所述内延部的外侧，藉由所述内延部形成所述基座内壁的所述内侧面和内弧面。
  27. 根据权利要求21所述的所述制造方法，其中在上述制造方法的所述步骤(b)中，所述上模具的一压合块挤压所述塑形膜于所述基板，其中所述塑形膜被挤压而形成一外延部，其中所述外延部自所述隔离块向内地挤压所述成型空间，以使所述模塑基座的外拔模角度大于等于90°。
  28. 根据权利要求27所述的所述制造方法，其中在上述制造方法的所述步骤(c)中，所述模塑材料成型于所述外延部的内侧，而固化成型为所述模塑基座的一基座外壁。
  29. 根据权利要求28所述的所述制造方法，其中在上述制造方法的所述步骤(c)中，模塑材料充满所述成型空间，其中所述模塑基座的所述基座外壁成 型于所述外延部的内侧，藉由所述外延部形成所述基座外壁的所述外侧面和外弧面。
  30. 根据权利要求21所述的制造方法，其中在上述方法的步骤(d)进一步包括：牵引所述模具的所述上模具，以泄除所述上模具对所述塑形膜的压力，其中所述塑形膜在弹性作用下恢复至初始状态。
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