WO2020237712A1 - 负极集流体、负极极片及电化学装置 - Google Patents
负极集流体、负极极片及电化学装置 Download PDFInfo
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- WO2020237712A1 WO2020237712A1 PCT/CN2019/090403 CN2019090403W WO2020237712A1 WO 2020237712 A1 WO2020237712 A1 WO 2020237712A1 CN 2019090403 W CN2019090403 W CN 2019090403W WO 2020237712 A1 WO2020237712 A1 WO 2020237712A1
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- H01M6/14—Cells with non-aqueous electrolyte
Definitions
- Electrochemical devices such as lithium ion secondary batteries, have good charge and discharge performance and are environmentally friendly, and are widely used in electric vehicles and consumer electronic products.
- the current collector is an important part of the electrochemical device. It not only provides support for the active material layer, but also collects the current generated by the active material layer for external output. Therefore, the current collector has an important influence on the performance of electrode pole pieces and electrochemical devices.
- the embodiments of the present application provide a negative electrode current collector, a negative pole piece, and an electrochemical device, aiming to improve the mechanical properties of the negative electrode current collector, and make it have a small weight and good electrical conductivity and current collection performance.
- an embodiment of the present application provides a negative electrode piece.
- the negative electrode piece includes a negative electrode current collector and a negative electrode active material layer disposed on the negative electrode current collector, wherein the negative electrode current collector is a negative electrode collector according to one aspect of the embodiments of the present application. fluid.
- an embodiment of the present application provides an electrochemical device.
- the electrochemical device includes a positive pole piece, a negative pole piece and an electrolyte, wherein the negative pole piece is the negative pole piece according to the second aspect of the embodiments of the present application.
- the negative electrode current collector, negative electrode piece and electrochemical device provided by the embodiments of the present application.
- the negative electrode current collector includes an organic support layer and a copper-based conductive layer disposed on the organic support layer.
- the support layer using organic materials is lighter in weight and has It is beneficial to make the negative electrode current collector and negative pole piece have a smaller weight, so that the electrochemical device has a higher weight energy density; in addition, the support layer of organic material has higher toughness, and the copper in the copper-based conductive layer
- the base crystal grain size d is 10nm ⁇ 500nm, which makes the copper-based conductive layer and the organic support layer have a high interface bonding force, and the copper-based conductive layer can be uniformly deformed with the extension of the organic support layer, effectively preventing local stress concentration , Greatly reducing the probability of the copper-based conductive layer breaking, thereby greatly improving the fracture toughness of the negative electrode current collector, improving the mechanical properties of the negative electrode current collector, and then significantly improving the preparation process of the negative electrode current collector, the
- Fig. 2 is a schematic structural diagram of a negative electrode current collector according to another embodiment of the present application.
- Fig. 5 is a schematic structural diagram of a negative electrode current collector according to another embodiment of the present application.
- Fig. 6 is a schematic structural diagram of a negative pole piece according to an embodiment of the present application.
- FIG. 1 is a schematic structural diagram of a negative electrode current collector 10 according to an embodiment of the present application. Please refer to FIG. 1.
- the negative electrode current collector 10 includes an organic support layer 101 and a copper-based conductive layer 102 that are stacked.
- the organic support layer 101 has a first surface 101 a and a second surface 101 b opposite in the thickness direction, and the copper-based conductive layer 102 is disposed on the first surface 101 a and the second surface 101 b of the organic support layer 101.
- the copper-based crystal grain size d in the copper-based conductive layer 102 is 10 nm to 500 nm.
- the copper-based crystal grain size d in the copper-based conductive layer 102 can be tested according to the following test method: X-ray diffraction analysis is performed on the negative current collector 10, and the diffraction peak of the copper-based conductive layer 102 is measured, such as Cu (111 ) The diffraction peak of the crystal plane, according to the diffraction angle and half-height width of the diffraction peak, the copper-based crystal grain size d is calculated using the Scherrer formula. The specific formula is
- the negative electrode current collector 10 can be subjected to X-ray diffraction analysis using instruments and methods known in the art, for example, an X-ray powder diffractometer is used to determine the X-ray diffraction spectrum in accordance with JIS K0131-1996 X-ray diffraction analysis general rules.
- an X-ray powder diffractometer is used to determine the X-ray diffraction spectrum in accordance with JIS K0131-1996 X-ray diffraction analysis general rules.
- the scanning 2 ⁇ angle range is 20° ⁇ 80°, and the scanning rate is 0.05°/s.
- the negative current collector 10 of the embodiment of the present application includes an organic support layer 101 and a copper-based conductive layer 102 disposed on the organic support layer 101.
- the support layer made of organic materials has high toughness, and the copper-based crystal grain size d in the copper-based conductive layer 102 is 10 nm to 500 nm, so that the copper-based conductive layer 102 and the organic support layer 101 have a higher interface
- the copper-based conductive layer 102 can be uniformly deformed with the extension of the organic support layer 101, effectively preventing local stress concentration, greatly reducing the probability of the copper-based conductive layer 102 breaking, thereby greatly improving the fracture of the negative electrode current collector 10 Toughness improves the mechanical properties of the negative electrode current collector 10, prevents the negative electrode current collector 10 from breaking or forming microcracks during processing or use, thereby significantly improving the negative electrode current collector 10, the negative electrode piece 20 and the electrochemical device during the preparation process. The rate of excellence and the safety and reliability during use.
- the range of the copper-based crystal grain size d in the copper-based conductive layer 102 can be formed by a combination of any lower limit and any upper limit, or a combination of any lower limit and any other lower limit, and can also be formed by any upper limit and any other upper limit. Combination formation.
- the thickness D 1 of the copper-based conductive layer 102 is preferably 30 nm ⁇ D 1 ⁇ 3 ⁇ m.
- the upper limit of the thickness D 1 of the copper-based conductive layer 102 may be selected from 3 ⁇ m, 2.5 ⁇ m, 2 ⁇ m, 1.8 ⁇ m, 1.5 ⁇ m, 1.2 ⁇ m, 1 ⁇ m, 900 nm, 750 nm, 450 nm, 250 nm, 100 nm.
- the conductive copper layer to a thickness of 1 D 102 300nm ⁇ D 1 ⁇ 2 ⁇ m, preferably 500nm ⁇ D 1 ⁇ 1.5 ⁇ m, further to 600nm ⁇ D 1 ⁇ 1.2 ⁇ m.
- the thickness D 1 of the copper-based conductive layer 102 and the copper-based crystal grain size d satisfy 1 ⁇ D 1 /d ⁇ 300.
- the above relationship between the thickness D 1 of the copper-based conductive layer 102 and the copper-based crystal grain size d can enable the negative electrode current collector 10 to have better mechanical properties, as well as higher conductivity and current collection performance.
- the copper-based conductive layer 102 includes one or more of copper (Cu) and copper alloy.
- Copper alloy is an alloy in which copper is the main element and contains one or more additional elements.
- the additive element is selected from titanium (Ti), vanadium (V), nickel (Ni), chromium (Cr), iron (Fe), cobalt (Co), manganese (Mn), zinc (Zn), zirconium ( Zr), molybdenum (Mo), niobium (Nb), tungsten (W), silver (Ag), palladium (Pd) and cadmium (Cd).
- the additive element is selected from titanium (Ti), vanadium (V), nickel (Ni), chromium (Cr), iron (Fe), cobalt (Co), manganese (Mn), zinc (Zn), zirconium ( Zr), molybdenum (Mo), niobium (Nb), tungsten (W), silver (Ag), palladium (Pd) and cadmium (Cd).
- the introduction of one or more of the above-mentioned additional elements
- the mass percentage of the copper element in the copper alloy is 80 wt% or more, more preferably 90 wt% or more, for example, 90 wt% to 95 wt%.
- the mass percentage of the copper element in the copper alloy is within the above-mentioned range, which enables the copper alloy conductive layer to have higher conductivity, mechanical properties, processing resistance and corrosion resistance.
- the Young's modulus E of the organic support layer 101 is preferably E ⁇ 2GPa, which makes the organic support layer 101 have good toughness and appropriate rigidity, which not only meets the requirements of the organic support layer
- the support function of 101 on the copper-based conductive layer 102 ensures the overall strength of the negative electrode current collector 10, and also prevents the organic support layer 101 from being excessively stretched or deformed during the processing of the negative electrode current collector 10, which more effectively prevents The organic support layer 101 and the copper-based conductive layer 102 are broken.
- the bonding strength between the organic support layer 101 and the copper-based conductive layer 102 is higher, so that the copper-based conductive layer 102 is not easy to peel off, and the negative electrode current collector 10 is improved.
- Mechanical stability and working stability thereby improving the performance of electrochemical devices.
- the Young's modulus E of the organic support layer 101 is preferably 2GPa ⁇ E ⁇ 20Gpa, for example 2GPa, 3GPa, 4GPa, 5GPa, 6GPa, 7GPa, 8GPa, 9GPa, 10GPa, 11GPa, 12GPa, 13GPa, 14GPa, 15GPa , 16GPa, 17GPa, 18GPa, 19GPa, 20GPa.
- the organic support layer 101 has good toughness, appropriate rigidity, and flexibility for winding during processing.
- the thickness D 2 of the organic support layer 101 is preferably 1 ⁇ m ⁇ D 2 ⁇ 30 ⁇ m.
- the thickness D 2 of the organic support layer 101 is 1 ⁇ m or more.
- the organic support layer 101 has high mechanical strength and is not prone to breakage during processing and use. It has a good support and protection effect on the copper-based conductive layer 102 and improves the negative electrode.
- the mechanical stability and working stability of the current collector 10; the thickness D 2 of the organic support layer 101 is less than 30 ⁇ m, which is beneficial to make the electrochemical device have a smaller volume and a lower weight, thereby increasing the volume energy density of the electrochemical device And weight energy density.
- the upper limit of the thickness D 2 of the organic support layer 101 can be selected from 30 ⁇ m, 25 ⁇ m, 20 ⁇ m, 18 ⁇ m, 15 ⁇ m, 12 ⁇ m, 10 ⁇ m, 8 ⁇ m, and the lower limit can be selected from 1 ⁇ m, 1.5 ⁇ m. , 2 ⁇ m, 3 ⁇ m, 4 ⁇ m, 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 9 ⁇ m, 16 ⁇ m.
- the range of the thickness D 2 of the organic support layer 101 can be formed by the combination of any lower limit and any upper limit, or by a combination of any lower limit and any other lower limit, and can also be formed by any upper limit. The value is formed by combining any other upper limit value.
- the thickness D 2 of the organic support layer 101 is 1 ⁇ m ⁇ D 2 ⁇ 15 ⁇ m, preferably not more than 10 ⁇ m, especially not more than 8 ⁇ m, the weight energy density and volume energy density of the electrochemical device can be made higher, and the copper
- the d value and D 1 /d of the base conductive layer 102 within the above range will be able to better improve the mechanical properties of the negative electrode current collector 10, and make the negative electrode current collector 10 have both higher conductivity and current collecting performance, and At this time, the d value, D 1 /d, etc. of the copper-based conductive layer 102 have more obvious effects on the mechanical properties and mechanical properties of the negative electrode current collector 10.
- the organic support layer 101 adopts one or more of polymer materials and polymer-based composite materials.
- polystyrene resins for example, polyamides, polyimides, polyesters, polyolefins, polyalkynes, siloxane polymers, polyethers, polyols, polysulfones, polyamides, etc.
- Carbohydrate polymers amino acid polymers, polysulfur nitrides, aromatic ring polymers, aromatic heterocyclic polymers, epoxy resins, phenolic resins, their derivatives, their cross-linked products and their copolymers One or more of.
- polymer material is, for example, polycaprolactam (commonly known as nylon 6), polyhexamethylene adipamide (commonly known as nylon 66), polyparaphenylene terephthalamide (PPTA), polyisophthalamide M-phenylenediamine (PMIA), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polycarbonate ( PC), polyethylene (PE), polypropylene (PP), polypropylene (PPE), polyvinyl alcohol (PVA), polystyrene (PS), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), Polytetrafluoroethylene (PTEE), polystyrene sulfonate (PSS), polyacetylene (PA), silicone rubber, polyoxymethylene (POM), polyphenylene oxide (PPO), polyphenylene sulfide Ether (PPS),
- the polymer-based composite material may include the above-mentioned polymer materials and additives, and the additives may be one or more of metal materials and inorganic non-metal materials.
- metal material additives for example, one or more of aluminum, aluminum alloy, copper, copper alloy, nickel, nickel alloy, titanium, titanium alloy, iron, iron alloy, silver, and silver alloy.
- inorganic non-metallic material additives for example, one or more of carbon-based materials, alumina, silicon dioxide, silicon nitride, silicon carbide, boron nitride, silicate, and titanium oxide, and for example, glass materials One or more of ceramic materials and ceramic composite materials.
- the carbon-based material additives are, for example, one or more of graphite, superconducting carbon, acetylene black, carbon black, Ketjen black, carbon dots, carbon nanotubes, graphene, and carbon nanofibers.
- additives it may also be a carbon-based material coated with a metal material, such as one or more of nickel-coated graphite powder and nickel-coated carbon fiber.
- the organic support layer 101 adopts one or more of insulating polymer materials and insulating polymer-based composite materials.
- the volume resistivity of the organic support layer 101 is relatively high, which is beneficial to improve the safety performance of the electrochemical device.
- the organic support layer 101 includes polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polystyrene sulfonate One or more of sodium (PSS) and polyimide (PI).
- PET polyethylene terephthalate
- PBT polybutylene terephthalate
- PEN polyethylene naphthalate
- PSS polystyrene sulfonate
- PSS polystyrene sulfonate
- PSS polystyrene sulfonate
- PSS polystyrene sulfonate
- PI polyimide
- the organic support layer 101 may have a single-layer structure or a composite layer structure of two or more layers, such as two layers, three layers, or four layers.
- FIGS. 3 to 5 show that there is a copper-based conductive layer 102 on a single side of the organic support layer 101, one or the other of the two opposite surfaces in the thickness direction of the copper-based conductive layer 102
- a protective layer 103 on the two, but in other embodiments, the copper-based conductive layer 102 may also be provided on the two opposite surfaces of the organic support layer 101, which may be in the thickness direction of any copper-based conductive layer 102.
- a protective layer 103 is provided on one or both of the two opposite surfaces, or a protective layer 103 is provided on one or both of the two opposite surfaces in the thickness direction of the two copper-based conductive layers 102. .
- the protective layer 103 includes one or more of metal, metal oxide, and conductive carbon.
- the aforementioned metals are, for example, one or more of nickel, chromium, nickel-based alloys, and copper-based alloys.
- the aforementioned nickel-based alloy is an alloy formed by adding one or more other elements to pure nickel as a matrix, preferably a nickel-chromium alloy.
- the nickel-chromium alloy is an alloy formed of metallic nickel and metallic chromium.
- the weight ratio of nickel to chromium in the nickel-chromium alloy is 1:99 to 99:1, such as 9:1.
- the aforementioned copper-based alloy is an alloy formed by adding one or more other elements to pure copper as a matrix, preferably a nickel-copper alloy.
- the weight ratio of nickel to copper in the nickel-copper alloy is 1:99-99:1, such as 9:1.
- the aforementioned metal oxide is, for example, one or more of alumina, cobalt oxide, chromium oxide, and nickel oxide.
- the aforementioned conductive carbon is, for example, one or more of graphite, superconducting carbon, acetylene black, carbon black, Ketjen black, carbon dots, carbon nanotubes, graphene, and carbon nanofibers, and further is carbon black, carbon nano One or more of tube, acetylene black and graphene.
- the protective layer 103 preferably adopts one or more of metals and metal oxides, which can improve the performance of the negative electrode current collector 10.
- the metal protective layer and the metal oxide protective layer have high corrosion resistance, high hardness and large specific surface area, which can effectively prevent the copper-based conductive layer 102 from chemical corrosion or mechanical damage, and enhance the strength of the negative electrode current collector 10. Improve the stability and service life of the negative electrode current collector 10; at the same time, it can further improve the interface between the copper-based conductive layer 102 and the organic support layer 101 or the negative electrode active material layer 20 (shown in Figure 6), and improve the performance of the electrochemical device .
- a protective layer 103 (hereinafter referred to as the upper protective layer) is provided on the surface of the copper-based conductive layer 102 facing away from the organic support layer 101 to protect the copper-based conductive layer 102 from chemical corrosion and mechanical damage.
- the interface between the anode current collector 10 and the anode active material layer 20 is improved, and the binding force between the anode current collector 10 and the anode active material layer 20 is improved.
- the upper protective layer is a metal protective layer or a metal oxide protective layer, the above effects can be better exerted.
- the upper protective layer is a metal oxide protective layer, it can more obviously protect against chemical corrosion and mechanical damage.
- the upper protective layer may be a double-layer protective layer of a metal protective layer and a metal oxide protective layer, preferably a metal protective layer is provided on the surface of the copper-based conductive layer 102 facing away from the organic support layer 101, and the metal A metal oxide protective layer is further provided on the surface of the protective layer facing away from the organic support layer 101, so as to better improve the conductivity, corrosion resistance and mechanical damage prevention of the negative electrode current collector 10.
- the negative electrode current collector 10 includes an organic support layer 101, a copper-based conductive layer 102 and a protective layer 103 that are stacked.
- the organic support layer 101 has a first surface 101a and a second surface 101b opposite to each other in the thickness direction
- the copper-based conductive layer 102 is stacked on at least one of the first surface 101a and the second surface 101b of the organic support layer 101
- the protective layer 103 is stacked on the surface of the copper-based conductive layer 102 facing the organic support layer 101.
- a protective layer 103 (hereinafter referred to as the lower protective layer) is provided on the surface of the copper-based conductive layer 102 facing the organic support layer 101.
- the lower protective layer protects the copper-based conductive layer 102 from chemical corrosion and mechanical damage.
- the bonding force between the copper-based conductive layer 102 and the organic support layer 101 can be improved, the copper-based conductive layer 102 and the organic support layer 101 can be prevented from being separated, and the support and protection effect of the copper-based conductive layer 102 can be improved.
- the lower protective layer is a metal oxide protective layer.
- the metal oxide protective layer has a larger specific surface area and higher hardness, which is more conducive to improving the bonding force between the copper-based conductive layer 102 and the organic support layer 101, and The strength of the negative current collector 10.
- the lower protective layer is a metal protective layer, it can improve the bonding force between the copper-based conductive layer 102 and the organic support layer 101, increase the strength of the negative electrode current collector 10, and better reduce the pole pieces.
- the polarization increases the conductivity of the negative electrode current collector 10.
- the lower protective layer is preferably a metal protective layer.
- the negative electrode current collector 10 includes an organic support layer 101, a copper-based conductive layer 102 and a protective layer 103 that are stacked.
- the organic support layer 101 has a first surface 101a and a second surface 101b opposite to each other in the thickness direction
- the copper-based conductive layer 102 is stacked on at least one of the first surface 101a and the second surface 101b of the organic support layer 101
- the protective layer 103 is stacked on the surface of the copper-based conductive layer 102 facing away from the organic support layer 101 and on the surface facing the organic support layer 101.
- the protective layer 103 is provided on both surfaces of the copper-based conductive layer 102 to more fully protect the copper-based conductive layer 102, so that the negative electrode current collector 10 has a higher comprehensive performance.
- the materials of the protective layers 103 on the two surfaces of the copper-based conductive layer 102 may be the same or different, and the thicknesses may be the same or different.
- the thickness D 3 of the protective layer 103 is 1 nm ⁇ D 3 ⁇ 200 nm, and D 3 ⁇ 0.1D 1 . If the protective layer 103 is too thin, it will not be sufficient to protect the copper-based conductive layer 102; if it is too thick, the energy density of the electrochemical device will be reduced.
- the upper limit value of the thickness D 3 of the protective layer 103 may be 200 nm, 180 nm, 150 nm, 120 nm, 100 nm, 80 nm, 60 nm, 55 nm, 50 nm, 45 nm, 40 nm, 30 nm, 20 nm, and the lower limit value may be 1nm, 2nm, 5nm, 8nm, 10nm, 12nm, 15nm, 18nm.
- the range of the thickness D 3 of the protective layer 103 can be formed by a combination of any lower limit and any upper limit, or a combination of any lower limit and any other lower limit, and can also be formed by any upper limit. Combined with any other upper limit value.
- the protective layer 103 both surfaces of the copper conductive layer 102 are provided, the protective layer has a thickness D a of 1nm ⁇ D a ⁇ 200nm, and D a ⁇ 0.1D 1; lower protective layer thickness D b is 1nm ⁇ D b ⁇ 200nm, and D b ⁇ 0.1D 1 .
- D a > D b which is beneficial for the upper protective layer and the lower protective layer to cooperate with the copper-based conductive layer 102 to protect the copper-based conductive layer 102 from chemical corrosion and mechanical damage, while enabling the electrochemical device to have higher energy density.
- 0.5D a ⁇ D b ⁇ 0.8D a which can better exert the cooperative protection effect of the upper protective layer and the lower protective layer.
- the elongation at break of the negative electrode current collector 10 is greater than or equal to 3%.
- the negative electrode current collector 10 with a breaking elongation greater than or equal to 3% has higher fracture toughness, which greatly reduces the probability of fracture and cracks in the copper-based conductive layer 102 during processing and use, thereby improving the negative electrode current collector 10.
- the elongation at break can be measured by a method known in the art.
- the negative electrode current collector 10 is cut into a sample of 15mm ⁇ 200mm and stretched using a high-speed rail tension machine at room temperature and pressure (25°C, 0.1MPa) For testing, set the initial position so that the length of the sample between the clamps is 50mm long, and the tensile speed is 5mm/min. Record the device displacement y (mm) at tensile fracture, and finally calculate the elongation at break (y/50) ⁇ 100 %.
- the copper-based conductive layer 102 may be formed on the organic support by at least one of mechanical rolling, bonding, vapor deposition, electroless plating, and electroplating.
- the copper-based conductive layer 102 is preferably a vapor-deposited layer or an electroplated layer, which is beneficial to make the copper-based crystal grain size d in the copper-based conductive layer 102 be 10nm-500nm Within the range, and make the copper-based conductive layer 102 and the organic support layer 101 have a higher binding force, and improve the mechanical properties and conductivity of the negative electrode current collector 10.
- the above-mentioned vapor deposition method is preferably a physical vapor deposition method.
- the physical vapor deposition method is preferably at least one of an evaporation method and a sputtering method, wherein the evaporation method is preferably at least one of a vacuum evaporation method, a thermal evaporation method, and an electron beam evaporation method, and the sputtering method is preferably a magnetron sputtering method.
- forming the copper-based conductive layer 102 by a vacuum evaporation method includes: placing the organic support layer 101 with a surface cleaning treatment in a vacuum plating chamber, and melting the metal wires in the metal evaporation chamber at a high temperature of 1300°C to 2000°C After evaporation, the evaporated metal passes through the cooling system in the vacuum plating chamber, and is finally deposited on the organic support layer 101 to form the copper-based conductive layer 102.
- FIG. 6 is a schematic structural diagram of a negative pole piece 30 according to an embodiment of the present application. Please refer to FIG. 6.
- the negative pole piece 30 includes a stacked negative current collector 10 and the negative active material layer 20, wherein the negative current collector 10 is the negative current collector 10 of the first aspect of the embodiments of the application.
- the negative electrode piece 30 includes a negative electrode current collector 10 and a negative electrode active material layer 20 that are stacked.
- the negative electrode current collector 10 includes two opposite surfaces in its thickness direction.
- the negative electrode active material layer 20 is stacked. On both surfaces of the negative electrode current collector 10.
- the negative active material layer 20 may also be stacked on any one of the two surfaces of the negative current collector 10.
- the negative electrode active material layer 20 may further include a conductive agent, and the type of the conductive agent is not limited in this application.
- the conductive agent is one or more of graphite, superconducting carbon, acetylene black, carbon black, Ketjen black, carbon dots, carbon nanotubes, graphene, and carbon nanofibers.
- the negative active material layer 20 may further include a binder, and the type of the binder is not limited in this application.
- the binder is styrene butadiene rubber (SBR), water-based acrylic resin, carboxymethyl cellulose (CMC), polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE)
- SBR styrene butadiene rubber
- CMC carboxymethyl cellulose
- PVDF polyvinylidene fluoride
- PTFE polytetrafluoroethylene
- EVA ethylene-vinyl acetate copolymer
- PVA polyvinyl alcohol
- PVB polyvinyl butyral
- the negative pole piece 30 can be prepared according to conventional methods in the art. Generally, the negative electrode active material and optional conductive agent, binder and thickener are dispersed in a solvent.
- the solvent can be NMP or deionized water to form a uniform negative electrode slurry.
- the negative electrode slurry is coated on the negative electrode current collector 10, after drying and other processes, the negative pole piece 30 is obtained.
- the electrochemical device of the embodiment of the present application has higher comprehensive electrochemical performance, and it has higher energy density, rate performance, and cycle performance. And safety performance.
- the above-mentioned positive pole piece may include a positive electrode current collector and a positive electrode active material layer.
- the positive electrode current collector may use one or more of aluminum, aluminum alloy, copper, copper alloy, nickel, nickel alloy, titanium, titanium alloy, silver, and silver alloy.
- the positive electrode active material used in lithium ion secondary batteries can be one or more of composite oxides obtained by adding other transition metals or non-transition metals or non-metals to lithium transition metal composite oxides and lithium transition metal composite oxides.
- the transition metal can be one or more of Mn, Fe, Ni, Co, Cr, Ti, Zn, V, Al, Zr, Ce, and Mg.
- the positive electrode active material may be selected from lithium cobalt oxide, lithium nickel oxide, lithium manganese oxide, lithium nickel manganese oxide, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide, and lithium-containing olivine structure One or more of phosphates.
- the positive electrode active material layer may further include a binder, and the type of the binder is not limited in this application.
- the binder is styrene butadiene rubber (SBR), water-based acrylic resin, carboxymethyl cellulose (CMC), polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE)
- SBR styrene butadiene rubber
- CMC carboxymethyl cellulose
- PVDF polyvinylidene fluoride
- PTFE polytetrafluoroethylene
- EVA ethylene-vinyl acetate copolymer
- PVA polyvinyl alcohol
- PVB polyvinyl butyral
- the electrolyte may be a solid electrolyte or a non-aqueous electrolyte, such as dispersing an electrolyte salt in an organic solvent to form an electrolyte.
- an organic solvent is used as a medium for transporting ions in an electrochemical reaction, and any organic solvent in the art can be used.
- the electrolyte salt can be any electrolyte salt in the art.
- the organic solvent used in lithium ion secondary batteries can be ethylene carbonate (EC), propylene carbonate (PC), ethyl methyl carbonate (EMC), diethyl carbonate (DEC), dimethyl carbonate (DMC) ), dipropyl carbonate (DPC), methyl propyl carbonate (MPC), ethylene propyl carbonate (EPC), butylene carbonate (BC), fluoroethylene carbonate (FEC), methyl formate (MF), Methyl acetate (MA), ethyl acetate (EA), propyl acetate (PA), methyl propionate (MP), ethyl propionate (EP), propyl propionate (PP), methyl butyrate ( MB), ethyl butyrate (EB), 1,4-butyrolactone (GBL), sulfolane (SF), dimethyl sulfone (MSM), methyl ethyl sulfone (EMS), diethyl sulf
- the electrolyte salt used in lithium ion secondary batteries can be LiPF 6 (lithium hexafluorophosphate), LiBF 4 (lithium tetrafluoroborate), LiClO 4 (lithium perchlorate), LiAsF 6 (lithium hexafluoroarsenate), LiFSI ( Lithium bisfluorosulfonimide), LiTFSI (lithium bis(trifluoromethanesulfonimide)), LiTFS (lithium trifluoromethanesulfonate), LiDFOB (lithium difluorooxalate), LiBOB (lithium bisoxalate), LiPO 2 F 2 (lithium difluorophosphate), LiDFOP (lithium difluorodioxalate phosphate) and LiTFOP (lithium tetrafluorooxalate phosphate) one or more.
- LiPF 6 lithium hexafluorophosphate
- LiBF 4 lithium tetrafluoroborate
- isolation membrane When the electrochemical device adopts the electrolyte, it is also necessary to provide a separator between the positive pole piece and the negative pole piece to play a role of isolation.
- type of isolation membrane there is no particular limitation on the type of isolation membrane, and any well-known porous structure isolation membrane with good chemical and mechanical stability can be selected, such as glass fiber, non-woven fabric, polyethylene, polypropylene and polyvinylidene fluoride.
- the isolation film can be a single-layer film or a multilayer composite film. When the isolation film is a multilayer composite film, the materials of each layer may be the same or different.
- the negative active material graphite, conductive carbon black, thickener sodium carboxymethyl cellulose (CMC), and binder styrene butadiene rubber emulsion (SBR) are fully mixed in an appropriate amount of deionized water at a weight ratio of 96.5:1.0:1.0:1.5 Stirring and mixing to form a uniform negative electrode slurry; coating the negative electrode slurry on the negative electrode current collector and drying and other steps to obtain a negative electrode pole piece.
- the positive electrode active material LiNi 1/3 Co 1/3 Mn 1/3 O 2 (NCM333), conductive carbon black, and binder polyvinylidene fluoride (PVDF) are added to an appropriate amount of N in a weight ratio of 93:2:5.
- -Methylpyrrolidone (NMP) solvent is fully stirred and mixed to form a uniform positive electrode slurry; the positive electrode slurry is coated on the positive electrode current collector, and the positive electrode pieces are obtained after drying and other processes.
- Ethylene carbonate (EC) and ethyl methyl carbonate (EMC) with a volume ratio of 3:7 are uniformly mixed to obtain an organic solvent, and then 1 mol/L LiPF6 is uniformly dissolved in the above organic solvent.
- the positive pole piece, the separator film, and the negative pole piece are stacked in sequence.
- the separator uses a PP/PE/PP composite film, which is then wound into a cell and packed into a packaging shell. The above electrolyte is injected into the cell. And sealed to obtain a lithium ion secondary battery.
- the wavelength of the rays is 20° ⁇ 80°, the scanning rate is 0.05°/s, and the X-ray diffraction spectrum of the copper-based conductive layer is measured.
- the copper-based crystal grain size d is calculated using the Scherrer formula.
- the lithium ion secondary battery is charged to 4.2V at a constant current rate of 1C, then charged at a constant voltage until the current is less than or equal to 0.05C, and then discharged at a constant current rate of 1C to 2.8V, which is a charge and discharge Cycle, the discharge capacity this time is the discharge capacity of the first cycle.
- the lithium ion secondary battery was subjected to 1000 charge-discharge cycles according to the above method, the discharge capacity of the 1000th cycle was recorded, and the capacity retention rate of the lithium ion secondary battery after 1000 1C/1C cycles was calculated.
- the lithium ion secondary battery is charged to 4.2V at a constant current rate of 1C, then charged at a constant voltage until the current is less than or equal to 0.05C, and then discharged to 3.0V at a rate of 1C at a constant current rate, and the lithium ion secondary battery is tested. 1C rate discharge capacity of the battery.
- the lithium ion secondary battery is charged to 4.2V at a constant current rate of 1C, then charged at a constant voltage until the current is less than or equal to 0.05C, and then discharged to 3.0V at a rate of 4C at a constant current rate, and the test obtains the lithium ion secondary
- the battery has a 4C rate discharge capacity.
- Lithium ion secondary battery 4C rate capacity retention rate (%) 4C rate discharge capacity/1C rate discharge capacity ⁇ 100%
- the weight percentage of the negative electrode current collector is the weight of the negative electrode current collector per unit area divided by the weight of the conventional negative electrode current collector per unit area.
- the weight of the negative electrode current collector of the present application can be reduced to varying degrees, thereby increasing the weight energy density of the battery.
- the upper protective layer of the negative current collector 7-14 adopts a double-layer protective layer. Specifically, a 25nm thick nickel protective layer (ie, the lower layer) is provided on the surface of the copper-based conductive layer facing away from the organic support layer, and the nickel protective layer A 25nm thick nickel oxide protective layer (that is, the upper layer) is provided on the surface facing away from the organic support layer.
- composition of the copper alloy in Table 5 is: 95wt% copper and 5wt% nickel.
Abstract
Description
Claims (10)
- 一种负极集流体,其中,包括有机支撑层以及设置于所述有机支撑层的至少一个表面上的铜基导电层,所述铜基导电层中的铜基晶粒尺寸d为10nm~500nm。
- 根据权利要求1所述的负极集流体,其中,所述铜基导电层的厚度D 1与所述铜基晶粒尺寸d之间满足1≤D 1/d≤300,优选为2≤D 1/d≤100,更优选为3≤D 1/d≤50;和/或,所述铜基导电层中的铜基晶粒尺寸d为30nm~300nm,优选为50nm~150nm。
- 根据权利要求1所述的负极集流体,其中,所述有机支撑层的杨氏模量E为E≥2GPa,优选为2GPa≤E≤20GPa。
- 根据权利要求1所述的负极集流体,其中,所述负极集流体的断裂伸长率大于或等于3%。
- 根据权利要求1所述的负极集流体,其中,所述铜基导电层的厚度D 1为30nm≤D 1≤3μm,优选为300nm≤D 1≤2μm,优选为500nm≤D 1≤1.5μm,更优选为600nm≤D 1≤1.2μm;和/或,所述有机支撑层的厚度D 2为1μm≤D 2≤30μm,优选为1μm≤D 2≤15μm,优选为1μm≤D 2≤10μm,优选为1μm≤D 2≤8μm,优选为2μm≤D 2≤8μm,更优选为2μm≤D 2≤6μm。
- 根据权利要求1所述的负极集流体,其中,所述铜基导电层包括铜及铜合金中的一种或多种;所述铜合金包含铜元素及添加元素,所述添加元素优选为钛、钒、镍、铬、铁、钴、锰、锌、锆、钼、铌、钨、银、钯及镉中的一种或多种,所述铜合金中铜元素的质量百分含量优选为80wt%以上;优选地,所述铜基导电层为气相沉积层或电镀层。
- 根据权利要求1所述的负极集流体,其中,所述有机支撑层包括高分子材料及高分子基复合材料中的一种或多种;所述高分子材料为聚酰胺、聚酰亚胺、聚对苯二甲酸乙二醇酯、聚对 苯二甲酸丁二醇酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚乙烯、聚丙烯、聚丙乙烯、丙烯腈-丁二烯-苯乙烯共聚物、聚乙烯醇、聚苯乙烯、聚氯乙烯、聚偏氟乙烯、聚四氟乙烯、聚苯乙烯磺酸钠、聚乙炔、硅橡胶、聚甲醛、聚苯醚、聚苯硫醚、聚乙二醇、聚氮化硫类、聚苯、聚吡咯、聚苯胺、聚噻吩、聚吡啶、纤维素、淀粉、蛋白质、环氧树脂、酚醛树脂、它们的衍生物、它们的交联物及它们的共聚物中的一种或多种;所述高分子基复合材料包括所述高分子材料和添加剂,所述添加剂包括金属材料及无机非金属材料中的一种或多种。
- 根据权利要求1所述的负极集流体,其中,进一步包括保护层,所述保护层设置于所述铜基导电层自身厚度方向上相对的两个表面中的至少一者上;所述保护层包括金属、金属氧化物及导电碳中的一种或多种,优选包括镍、铬、镍基合金、铜基合金、氧化铝、氧化钴、氧化铬、氧化镍、石墨、超导碳、乙炔黑、炭黑、科琴黑、碳点、碳纳米管、石墨烯及碳纳米纤维中的一种或多种;优选地,所述保护层的厚度D 3为1nm≤D 3≤200nm,且所述保护层的厚度D 3与所述铜基导电层的厚度D 1之间满足D 3≤0.1D 1。
- 一种负极极片,其中,包括负极集流体以及设置于所述负极集流体上的负极活性物质层,其中所述负极集流体为权利要求1至8任一项所述的负极集流体。
- 一种电化学装置,其中,包括正极极片、负极极片及电解质,其中所述负极极片为权利要求9所述的负极极片。
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JP2021557695A JP2022528846A (ja) | 2019-05-31 | 2019-06-06 | 負極集電体、負極シート及び電気化学装置 |
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WO2023025067A1 (zh) * | 2021-08-27 | 2023-03-02 | 深圳市原速光电科技有限公司 | 一种电极保护层及其制备方法和应用 |
CN114335557B (zh) * | 2021-11-30 | 2023-07-14 | 蜂巢能源科技有限公司 | 复合箔材及制备方法、集流体和锂离子电池 |
CN114540802B (zh) * | 2022-01-27 | 2023-12-01 | 江阴纳力新材料科技有限公司 | 低能耗制备复合集流体的方法 |
CN114551896A (zh) * | 2022-01-27 | 2022-05-27 | 江阴纳力新材料科技有限公司 | 复合集流体的制备方法 |
CN114744205B (zh) * | 2022-03-29 | 2023-05-16 | 电子科技大学 | 一种用于集流体的复合膜材料、制备方法以及锂离子电池 |
CN114824160B (zh) * | 2022-04-25 | 2023-10-27 | 江阴纳力新材料科技有限公司 | 复合集流体及其制备方法、电极极片和二次电池 |
CN115275212B (zh) * | 2022-08-10 | 2023-06-23 | 哈尔滨工业大学 | 一种无阳极锂离子电池铜基集流体的制备方法 |
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