WO2020237672A1 - 柔性电路板及其制作方法 - Google Patents

柔性电路板及其制作方法 Download PDF

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Publication number
WO2020237672A1
WO2020237672A1 PCT/CN2019/089664 CN2019089664W WO2020237672A1 WO 2020237672 A1 WO2020237672 A1 WO 2020237672A1 CN 2019089664 W CN2019089664 W CN 2019089664W WO 2020237672 A1 WO2020237672 A1 WO 2020237672A1
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WO
WIPO (PCT)
Prior art keywords
cable
antenna
area
layer
substrate
Prior art date
Application number
PCT/CN2019/089664
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English (en)
French (fr)
Inventor
钟福伟
肖如敏
何明展
Original Assignee
庆鼎精密电子（淮安）有限公司
鹏鼎控股(深圳)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 庆鼎精密电子（淮安）有限公司, 鹏鼎控股(深圳)股份有限公司 filed Critical 庆鼎精密电子（淮安）有限公司
Priority to PCT/CN2019/089664 priority Critical patent/WO2020237672A1/zh
Publication of WO2020237672A1 publication Critical patent/WO2020237672A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the application relates to a flexible circuit board and a manufacturing method thereof.
  • LDS laser-direct-structuring
  • a flexible circuit board includes at least one insulating substrate layer and at least one circuit layer.
  • the flexible circuit board further includes a cable area and at least one antenna area.
  • the cable area is provided with a cable.
  • the cable includes at least one cable substrate layer and at least one cable circuit layer formed on a surface of the cable substrate layer, the antenna area is provided with at least one antenna, and each antenna includes at least one antenna area substrate and at least one
  • the antenna area line formed on one surface of the antenna area substrate, the antenna area substrate and the cable substrate layer on the same plane are different parts of the same insulating substrate layer, and the antenna area line is on the same plane
  • the cable circuit layers are produced at the same time and are different parts of the same circuit layer.
  • the material of the cable substrate layer and the antenna area substrate is liquid crystal polymer, Teflon, polyethylene naphthalate, polyethylene terephthalate, and polyimide. , At least one of polyethylene and polyvinyl chloride.
  • the sum of the number of layers of the antenna area substrate and the antenna area line of each antenna is not greater than the sum of the number of layers of the cable substrate layer and the cable line layer of the cable.
  • the cable line layer includes a plurality of signal lines, and the number of the signal lines is the same as the number of the antennas.
  • a method for manufacturing a flexible circuit board includes: providing a plurality of cable circuit substrates and at least one antenna circuit substrate, each of the cable circuit substrates includes a cable substrate layer and a cable circuit formed on a surface of the cable substrate layer Layer, the antenna circuit substrate includes a cable area and an antenna area, the antenna circuit substrate further includes an insulating substrate layer and a circuit layer formed on the insulating substrate layer, the insulating substrate layer includes The cable area base material of the cable area and the antenna area base material located in the antenna area, the circuit layer includes a cable area line located on a surface of the cable area base material and an antenna located on a surface of the antenna area base material Zone circuit; and pressing the cable circuit substrate and the antenna circuit substrate together; wherein the cable zone base material of the antenna circuit substrate and the cable zone circuit and the cable circuit substrate are pressed together Together; the cable area base material and the cable area line of the antenna circuit substrate and the cable circuit substrate form a cable; the antenna area base material and the antenna area line of the antenna circuit substrate form an antenna.
  • the method further includes: forming a protective film layer on the exposed surface of the cable circuit substrate and the exposed surface of the antenna circuit substrate, the protective film At least one opening is formed on the layer, and part of the antenna area wiring is exposed from the opening.
  • the method further includes: stacking a plurality of the cable circuit substrates and at least one antenna circuit substrate in order.
  • the method further includes: pressing a plurality of the cable circuit substrates together; and then pressing the pressed cable circuit substrate and the antenna The circuit board is pressed together.
  • the material of the cable substrate layer and the antenna area substrate is liquid crystal polymer, Teflon, polyethylene naphthalate, polyethylene terephthalate, and polyimide. , At least one of polyethylene and polyvinyl chloride.
  • a method for manufacturing a flexible circuit board provides at least one cable circuit substrate and at least one copper-clad substrate.
  • the cable circuit substrate includes at least one cable substrate layer and at least one cable circuit formed on one side of the cable substrate layer Layer
  • the copper-clad substrate includes a cable area and an antenna area
  • the copper-clad substrate further includes a cable area base material located in the cable area and a cable area copper-clad on one side of the cable area base material, located The antenna area base material of the antenna area and the antenna area copper clad formed on one side of the antenna area base material; the cable circuit substrate and the copper clad substrate are pressed together; wherein, the cable area base Material and the cable circuit substrate are pressed together; and the cable area copper clad and the antenna area copper clad are made to form the cable area line and the antenna area line, so that the copper clad substrate is made to form the antenna circuit substrate, the The cable area base material and the cable area line of the antenna circuit substrate and the cable circuit substrate form a cable; the antenna area base material and
  • the flexible circuit board provided in the present application is used to manufacture the antenna circuit layer and the cable circuit layer of the flexible circuit board by the method of making conductive circuits known in the industry.
  • the antenna circuit layer and the cable circuit layer are formed at the same time, thereby saving space and simplifying the process Process.
  • the substrate layer of the cable and the antenna adopts an insulating substrate with low and stable dielectric constant and dielectric loss and low moisture absorption characteristics in the millimeter wave frequency band, so that the overall loss of the flexible circuit board is low, so as to meet the requirements of 5G The signal transmission requirements of the antenna.
  • FIG. 1 is a three-dimensional schematic diagram of a flexible circuit board provided by an embodiment of the application.
  • FIG. 2 is a cross-sectional view of the flexible circuit board shown in FIG. 1 along the line II-II.
  • Fig. 3 is a sectional view of an intermediate body provided for manufacturing the flexible circuit board shown in Fig. 2.
  • FIG. 4 is a cross-sectional view of the intermediate body described in FIG. 3 after a blind hole is formed.
  • FIG. 5 is a cross-sectional view of the blind hole shown in FIG. 4 after being filled with conductive paste.
  • FIG. 6 is a cross-sectional view after removing the protective film shown in FIG. 5 to form a first circuit board.
  • FIG. 7 is a cross-sectional view of the first, second, third, and fourth circuit boards manufactured by the above-mentioned method of manufacturing the first circuit board.
  • FIG. 8 is a cross-sectional view of the first, second, third, and fourth circuit substrates shown in FIG. 7 after being stacked and laminated in the order of the second, first, third, and fourth circuit substrates.
  • FIG. 9 is a cross-sectional view of the first, second, and fourth circuit substrates shown in FIG. 8 after forming protective films on the exposed surfaces.
  • FIG. 10 is a cross-sectional view of a flexible circuit board provided by the second embodiment of the present application.
  • FIG. 11 is a cross-sectional view of a flexible circuit board provided by the third embodiment of the present application.
  • FIG. 12 is a cross-sectional view of a flexible circuit board provided by the fourth embodiment of the present application.
  • FIG. 13 is a cross-sectional view of a flexible circuit board provided by the fifth embodiment of the present application.
  • FIG. 14 is a cross-sectional view of a flexible circuit board provided by the sixth embodiment of the present application.
  • 15 is a cross-sectional view of a flexible circuit board provided by the seventh embodiment of the present application.
  • FIG. 16 is a cross-sectional view of a flexible circuit board provided by the eighth embodiment of the present application.
  • FIG. 17 is a cross-sectional view of a cable circuit board provided for manufacturing the flexible circuit board shown in FIG. 10.
  • FIG. 18 is a cross-sectional view of a first single-sided copper-clad substrate and a second single-sided copper-clad substrate after being pressed on two opposite surfaces of the cable circuit substrate shown in FIG. 17, respectively.
  • Fig. 19 is a cross-sectional view of the first single-sided copper clad substrate and the second single-sided copper clad substrate shown in Fig. 18 after the copper foil layers are respectively fabricated to form the first circuit layer and the fifth circuit layer.
  • FIG. 20 is a cross-sectional view of a third single-sided copper-clad substrate after pressing on the surface of the first circuit layer shown in FIG. 19.
  • FIG. 21 is a cross-sectional view of the second circuit layer after the copper foil layers of the third single-sided copper-clad substrate shown in FIG. 20 are respectively fabricated.
  • Second cable zone line 221 Second antenna area line 222 Second conductive paste 102 Third circuit board 30 The third insulating substrate layer 31 Third circuit layer 32 Signal line 321 Ground wire 322 Third conductive paste 103 Fourth circuit board 40 Fourth insulating substrate layer 41 The third cable zone base material 41a Third antenna area base material 41b Fourth circuit layer 42 The fourth cable zone line 421 Fourth conductive paste 104 Fifth circuit board 50 The fifth insulating substrate layer 51 The fourth cable zone base material 51a Fourth antenna area base material 51b Fifth circuit layer 52 Fifth Cable Zone Line 521 Fifth conductive paste 105 The first protective film layer 60 Opening 61 Second protective film layer 70 Gold layer 90 The third protective film layer 81
  • Fourth protective film layer 82 Third antenna area line 323 Fourth antenna area line 422 Fifth antenna area line 522 Cable circuit board 130
  • the first single-sided copper clad substrate 140 The first copper clad layer 141 Copper coating in the first cable area 141a Copper coating in the first antenna area 141b
  • the second single-sided copper clad substrate 150 Second copper clad layer 151
  • the third single-sided copper clad substrate 160 The third copper clad layer 161 Copper coating in the second cable area 161a Copper coating in the second antenna area 161b
  • an element when an element is considered to be “connected” to another element, it may be directly connected to another element or a centrally arranged element may exist at the same time.
  • an element When an element is considered to be “disposed on” another element, it can be directly disposed on another element or a centrally disposed element may also exist at the same time.
  • the present application provides a flexible circuit board.
  • the flexible circuit board includes at least one insulating substrate layer and at least one circuit layer.
  • the flexible circuit board further includes a cable area and at least one antenna area.
  • a cable is arranged in the cable area, and the cable includes at least one cable substrate layer and at least one cable circuit layer formed on a surface of the cable substrate layer.
  • the antenna area is provided with at least one antenna, and each antenna includes at least one antenna area substrate and at least one antenna area line formed on a surface of the antenna area substrate.
  • the antenna area base material and the cable base material layer on the same plane are different parts of the same insulating base material layer, and the antenna area line and the cable line layer on the same plane are produced at the same time and are the same Different parts of the circuit layer.
  • the cable may be at least one of common cables such as a coaxial cable, a microstrip coplanar cable, and an electromagnetic coupling cable.
  • the antenna may be at least one of common antennas such as patch antennas, dipole antennas, slot antennas, F-type antennas, dipole antennas, and Yagi antennas, to correspond to different frequency bands and frequency band combinations.
  • common antennas such as patch antennas, dipole antennas, slot antennas, F-type antennas, dipole antennas, and Yagi antennas, to correspond to different frequency bands and frequency band combinations.
  • the flexible circuit board 100 includes a cable area 1001 and an antenna area 1002.
  • the cable area 1001 is provided with a cable 110
  • the antenna area 1002 is provided with a plurality of antennas 120.
  • the multiple antennas 120 are located on one side of the cable 110, and the cable 110 and the multiple antennas 120 are integrally formed.
  • the number of cable substrate layers and cable circuit layers included in the cable 110 are both 5. In other embodiments, the number of cable substrate layers and cable circuit layers included in the cable 110 may be determined according to actual conditions.
  • the flexible circuit board 100 includes a first insulating substrate layer 11, a second insulating substrate layer 21, a third insulating substrate layer 31, a fourth insulating substrate layer 41, and a fifth insulating substrate layer.
  • Five line layer 52 is a first insulating substrate layer 11, a second insulating substrate layer 21, a third insulating substrate layer 31, a fourth insulating substrate layer 41, and a fifth insulating substrate layer.
  • the second insulating substrate layer 21 is attached to the first insulating substrate layer 11
  • the third insulating substrate layer 31 is attached to the first circuit layer 12
  • the fourth insulating substrate The material layer 41 is attached to the third circuit layer 32
  • the fifth insulating substrate layer 51 is attached to the fourth circuit layer 42. After pressing, the second insulating substrate layer 21 and the first insulating substrate layer 11 are fused together.
  • the third insulating base material layer 31, the fourth insulating base material layer 41, the fifth insulating base material layer 51, the third circuit layer 32, the fourth circuit layer 42, and the fifth circuit layer 52 are located in the cable area Within 1001.
  • the first insulating substrate layer 11, the second insulating substrate layer 21, the first circuit layer 12 and the second circuit layer 22 are located in the cable area 1001 and the antenna area 1002.
  • the third insulating base material layer 31, the fourth insulating base material layer 41, and the fifth insulating base material layer 51 are the cable base material layers of the flexible circuit board 100, and the third circuit layer 32.
  • the fourth circuit layer 42 and the fifth circuit layer 52 are the cable circuit layers of the flexible circuit board 100.
  • the first insulating substrate layer 11 includes a first cable area substrate 11a and a first antenna area substrate 11b
  • the first circuit layer 12 includes a plurality of first cable area circuits 121 and a plurality of first
  • the antenna area line 122, the first cable area base material 11a and the third insulating base material layer 31 are filled in the gaps of the plurality of first cable area lines 121, and the first antenna area base material 11b is filled Between the slots of the lines 122 of the first antenna area.
  • the second insulating substrate layer 21 includes a second cable region substrate 21a and a second antenna region substrate 21b
  • the second circuit layer 22 includes a plurality of second cable region circuits 221 and a plurality of second cable regions.
  • Antenna area line 222, the second cable area base material 21a is filled in the gaps of the plurality of second cable area lines 221, and the second antenna area base material 21b is filled in the plurality of second antenna area lines 222 in the gap.
  • the first cable area substrate 11a and the first antenna area substrate 11b are different parts of the first insulating substrate layer 11, and the second cable area substrate 21a and the The second antenna area substrate 21b is a different part of the second insulating substrate layer 21, and the first cable area line 121 and the first antenna area line 122 are different parts of the first circuit layer 12
  • the second cable area line 221 and the second antenna area line 222 are different parts of the second line layer 22.
  • the third circuit layer 32 includes at least one signal line 321 and at least one ground line 322, and the ground line 322 is provided on opposite sides of each signal line 321.
  • the signal line 321 and the ground line 322 are the cable area lines of the third circuit layer 32.
  • the third insulating substrate layer 31 and the fourth insulating substrate layer 41 are filled in the gap between the signal line 321 and the ground line 322. In Figure 1, only one signal line is drawn. In other embodiments, the number of the signal lines 321 is the same as the number of the antennas 120.
  • the fourth circuit layer 42 includes a plurality of fourth cable area circuits 421, and the fourth insulating substrate layer 41 and the fifth insulating substrate layer 51 are filled in the plurality of fourth cable area circuits. 421 within the gap.
  • the fifth circuit layer 52 includes a plurality of fifth cable area circuits 521, and the fifth insulating substrate layer 51 is filled in the gaps of the plurality of fifth cable area circuits 521.
  • the material of the first insulating base material layer 11, the second insulating base material layer 21, the third insulating base material layer 31, the fourth insulating base material layer 41, and the fifth insulating base material layer 51 is liquid crystal polymer ⁇ (liquid crystal polymer, LCP), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) or polyethylene naphthalate (Polyethylene Naphthalate, PEN), At least one of polyethylene (PE), Teflon (Teflon), polyvinyl chloride polymer (PVC) and other materials.
  • the antenna-integrated flexible circuit board 100 further includes a plurality of first conductive pastes 101, a plurality of second conductive pastes 102, a plurality of third conductive pastes 103, a plurality of fourth conductive pastes 104, and a plurality of fifth conductive pastes.
  • Conductive paste 105 is a plurality of first conductive pastes 101, a plurality of second conductive pastes 102, a plurality of third conductive pastes 103, a plurality of fourth conductive pastes 104, and a plurality of fifth conductive pastes.
  • the first circuit layer 12 and the second circuit layer 22 are electrically connected through the first conductive paste 101 and the second conductive paste 102, and the first circuit layer 12 is electrically connected to
  • the third circuit layer 32 is electrically connected through the third conductive paste 103
  • the third circuit layer 32 and the fourth circuit layer 42 are electrically connected through the fourth conductive paste 104.
  • the fourth circuit layer 42 and the fifth circuit layer 52 are electrically connected through the fifth conductive paste 105.
  • the electrical connection structure of the first conductive paste 101 and the second conductive paste 102 is not necessarily regular, for example, the heights of the first conductive paste 101 and the second conductive paste 102 are not necessarily equal Yes, its contact surface is not necessarily flat, and its shape is not necessarily straight cylindrical, etc.
  • the first circuit layer 12 and the second circuit layer 22 may also be electrically connected only through the first conductive paste 101 or the second conductive paste 102.
  • the flexible circuit board 100 further includes a first protective film layer 60, a second protective film layer 70 and a fourth protective film layer 82.
  • the first protective film layer 60 is formed on the second circuit layer 22
  • the second protective film layer 70 is formed on the fifth circuit layer 52
  • the fourth protective film layer 82 is formed on The first antenna area base material 11b and the first antenna area line 122 are on.
  • the first protective film layer 60 is located in the cable area 1001 and the antenna area 1002
  • the second protective film layer 70 is located in the cable area 1001
  • the fourth protective film layer 82 is located in the Inside the antenna area 1002.
  • a plurality of openings 61 are also formed on the first protective film layer 60, and part of the second circuit layer 22 is exposed from the opening 61. In FIG.
  • the opening 61 is located in the antenna area 1002.
  • a gold layer 90 is also formed in the opening 61.
  • the gold layer 90 is used to protect the exposed second circuit layer 22 and is used for external switches, tuners, filters, duplexers, transceivers and other common antenna electronic components.
  • the second cable area line 221 and the fifth cable area line 521 have a strip line structure. In other embodiments, the second cable area line 221 and the fifth cable area line 521 have an embedded microstrip line structure to facilitate bending.
  • the second embodiment of the present application discloses a flexible circuit board 200, the structure of the flexible circuit board 200 is similar to the structure of the flexible circuit board 100, the only difference is: the flexible circuit board 200
  • the second insulating substrate layer 21 of the flexible circuit board 200 is located between the second circuit layer 22 and the first circuit layer 12, and the first insulating substrate layer 11 of the flexible circuit board 200 is located at On the side of the first circuit layer 12 and the third circuit layer 32 is located on the side of the first insulating substrate layer 11 of the cable area 1001, the fourth insulating substrate layer 41 is located on the third On the side of the circuit layer 32, the fourth circuit layer 42 is formed on the fourth insulating substrate layer 41, the fifth insulating substrate layer 51 is located on the side of the fourth circuit layer 42, and the fifth The circuit layer 52 is formed on the fifth insulating substrate layer 51.
  • the cable 110 is composed of five circuit layers and four substrate layers (lack of the third substrate layer of the first embodiment).
  • the difference between the antenna 120 in this embodiment and the antenna in the first embodiment is that the second antenna area base material 21b and the first antenna area base material 11b in this embodiment are not attached to each other but are The first antenna area lines 122 are spaced apart.
  • the fourth protective film layer 82 in this embodiment is attached to the first antenna area base material 11 b instead of being attached to the first antenna area line 122.
  • the third embodiment of the present application discloses a flexible circuit board 300.
  • the structure of the flexible circuit board 300 is similar to that of the flexible circuit board 100. The only difference is: the flexible circuit board 300
  • the antenna is composed of a part of the third circuit layer 32 and the first insulating substrate layer 11.
  • the third circuit layer 32 further includes a plurality of third antenna area circuits 323.
  • the antenna of the flexible circuit board 300 is composed of the third antenna area line 323 and the first antenna area base material 11b.
  • the difference between the structure of the flexible circuit board 300 and the flexible circuit board 100 is that the first protective film layer 60 is only located in the cable area 1001, and the first antenna area substrate 11b is pasted
  • the third protective film layer 81 is unified.
  • the cable 110 is composed of five circuit layers and four substrate layers (lack of the third substrate layer of the first embodiment).
  • the antenna of the flexible circuit board 300 may also be composed of any insulating substrate layer and a part of any adjacent circuit layer, and is not limited to the third circuit layer 32 and the A part of the insulating base layer 11 is composed.
  • the fourth embodiment of the present application discloses a flexible circuit board 400, the structure of the flexible circuit board 400 is similar to the structure of the flexible circuit board 300, the only difference is: the flexible circuit board 400
  • the antenna consists of two circuit layers and a part of an insulating substrate layer.
  • the antenna of the flexible circuit board 400 consists of a third antenna area line 323, the first antenna area line 122, and a second antenna area located between the third antenna area line 323 and the first antenna area line 122.
  • An antenna area base material 11b is composed.
  • the antenna of the flexible circuit board 400 may also be composed of any insulating substrate layer and a part of any two adjacent circuit layers, and is not limited to the first and second embodiments.
  • the structure of the antenna may also be composed of any insulating substrate layer and a part of any two adjacent circuit layers, and is not limited to the first and second embodiments. The structure of the antenna.
  • the fifth embodiment of the present application discloses a flexible circuit board 500.
  • the structure of the flexible circuit board 500 is similar to the structure of the flexible circuit board 400. The only difference is: the flexible circuit board 500
  • the antenna consists of three circuit layers and part of two insulating substrate layers. Specifically, the antenna of the flexible circuit board 500 consists of the third antenna area line 323, the first antenna area base material 11b, the first antenna area line 122, the second antenna area base material 21b, and The second antenna area is composed of lines 222.
  • the antenna of the flexible circuit board 500 may also be composed of any two insulating substrate layers and a part of any three adjacent circuit layers, and is not limited to those in the fifth embodiment.
  • the structure of the antenna may also be composed of any two insulating substrate layers and a part of any three adjacent circuit layers, and is not limited to those in the fifth embodiment. The structure of the antenna.
  • the sixth embodiment of the present application discloses a flexible circuit board 600.
  • the structure of the flexible circuit board 600 is similar to that of the flexible circuit board 500.
  • the only difference is: the fourth insulating base
  • the material layer 41 includes a third cable area base material 41 a located in the cable area 1001 and a third antenna area base material 41 b located in the antenna area 1002.
  • the fifth insulating base material layer 51 includes a fourth cable area base material 51 a located in the cable area 1001 and a fourth antenna area base material 51 b located in the antenna area 1002.
  • the fourth circuit layer 42 includes a fourth cable area circuit 421 located in the cable area 1001 and a fourth antenna area circuit 422 located in the antenna area 1002.
  • the fifth circuit layer 52 includes a fifth cable area circuit 521 located in the cable area 1001 and a fifth antenna area circuit 522 located in the antenna area 1002.
  • the antenna of the flexible circuit board 600 is composed of part of four circuit layers and three insulating substrate layers. Specifically, the antenna of the flexible circuit board 600 is composed of the first antenna area line 122, the first antenna area base material 11b, the third antenna area line 323, the third antenna area base material 41b, The fourth antenna area line 422, the fourth antenna area base material 51b, and the fifth antenna area line 522 are composed.
  • the second protective film layer 70 is located on the fifth circuit layer 52 in the cable area 1001 and the antenna area 1002.
  • the antenna of the flexible circuit board 400 may also be composed of any three insulating substrate layers and any part of any four adjacent circuit layers, and is not limited to the antenna in the sixth embodiment. Structure.
  • the seventh embodiment of the present application discloses a flexible circuit board 700.
  • the structure of the flexible circuit board 700 is similar to that of the flexible circuit board 600. The only difference is: the flexible circuit board 700
  • the antenna consists of four circuit layers and part of four insulating substrate layers. Specifically, the antenna of the flexible circuit board 700 consists of the second antenna area line 222, the second antenna area base material 21b, the first antenna area base material 11b, the third antenna area line 323, The third antenna area base material 41b, the fourth antenna area line 422, the fourth antenna area base material 51b, and the fifth antenna area line 522 are composed.
  • the first circuit layer 12 in this embodiment only includes the first cable area circuit 121, so that the second antenna area base material 21b is in contact with the first antenna area base material 11b.
  • the first protective film layer 60 is located on the second circuit layer 22 in the cable area 1001 and the antenna area 1002.
  • the antenna circuit layer of the flexible circuit board 700 may also be composed of any four of the first, second, third, fourth, and fifth circuit layers.
  • the flexible circuit board 700 The antenna substrate layer can also be composed of any four of the first, second, third, fourth, and fifth insulating substrate layers, and any two of the insulating substrate layers are attached to each other.
  • the eighth embodiment of the present application discloses a flexible circuit board 800.
  • the structure of the flexible circuit board 800 is similar to the structure of the flexible circuit board 600. The only difference is: the flexible circuit board 800
  • the antenna consists of five circuit layers and part of four insulating substrate layers.
  • the antenna of the flexible circuit board 800 is composed of the second antenna area line 222, the second antenna area base material 21b, the first antenna area line 122, the first antenna area base material 11b, The third antenna area line 323, the third antenna area base material 41b, the fourth antenna area line 422, the fourth antenna area base material 51b, and the fifth antenna area line 522 are composed.
  • the sum of the number of circuit layers and the number of insulating substrate layers of the antenna 120 in this embodiment is equal to the sum of the number of circuit layers and the number of substrate layers of the cable 110.
  • the number of circuit layers and insulating substrate layers of cables and antennas is not limited to the above-mentioned number of layers.
  • the number of circuit layers and the number of layers of the antenna can be flexibly designed according to actual conditions Number and position of substrate layers.
  • the present application also provides a method for manufacturing a flexible circuit board, including: providing a plurality of cable circuit substrates and at least one antenna circuit substrate, each of the cable circuit substrates includes a cable substrate layer and a cable substrate layer formed on the cable substrate layer.
  • the cable circuit layer on the surface, the antenna circuit substrate includes a cable area and an antenna area, the antenna circuit substrate further includes an insulating substrate layer and a circuit layer formed on the insulating substrate layer, the insulating substrate
  • the layer includes a cable area base material located in the cable area and an antenna area base material located in the antenna area, and the circuit layer includes a cable area line located on a surface of the cable area base material and a base material located in the antenna area Layer one surface of the antenna area line; and pressing the cable circuit substrate and the antenna circuit substrate together; wherein the cable area base material and the cable area line of the antenna circuit substrate and the cable The circuit substrate is pressed together; the cable area base material and the cable area line of the antenna circuit substrate form a cable with the cable circuit substrate; the antenna area
  • the present application provides a method for manufacturing a flexible circuit board 100, which includes the steps:
  • the intermediate body 1 includes a first insulating substrate layer 11 and a first circuit layer 12 and a resin layer 13 formed on two opposite surfaces of the first insulating substrate layer 11.
  • the intermediate body 1 is divided into a cable area 1001 and an antenna area 1002 adjacent to it.
  • the first circuit layer 12 includes a plurality of first cable area circuits 121 and a plurality of first antenna area circuits 122.
  • the first cable area line 121 is located in the cable area 1001, and the first antenna area line 122 is located in the antenna area 1002.
  • the first insulating substrate layer 11 includes a first cable region substrate 11a and a first antenna region substrate 11b.
  • the first cable area base material 11 a is located in the cable area 1001, and the first antenna area base material 11 b is located in the antenna area 1002.
  • the material of the first insulating substrate layer 11 is LCP, polyimide (PI), polyethylene terephthalate (PET) or polyethylene naphthalate. At least one of materials such as Polyethylene Naphthalate (PEN), Polyethylene (PE), Teflon (Teflon), and Polyvinyl Chloride Polymer (PVC).
  • the resin layer 13 is polyethylene terephthalate (PET). In other embodiments, the resin layer 13 may also be a resin layer or other film layer that can be removed or etched away later.
  • PET polyethylene terephthalate
  • the resin layer 13 may also be a resin layer or other film layer that can be removed or etched away later.
  • a plurality of blind holes 14 are formed on the intermediate body 1, and the first conductive paste 101 is filled in the blind holes 14.
  • the blind hole 14 penetrates the resin layer 13 and the first insulating substrate layer 11.
  • One end of the first conductive paste 101 is in electrical contact with the first circuit layer 12.
  • the blind hole 14 can be formed by a method such as laser or mechanical drilling.
  • the resin layer 13 is removed to obtain a first circuit substrate 10.
  • the first circuit substrate 10 includes a first insulating substrate layer 11 and a first circuit layer 12 formed on a surface of the first insulating substrate layer 11. Wherein, the first circuit substrate 10 is divided into a cable area 1001 and an antenna area 1002 adjacent to it.
  • the first insulating substrate layer 11 includes a first cable region substrate 11a and a first antenna region substrate 11b.
  • the first cable area base material 11 a is located in the cable area 1001, and the first antenna area base material 11 b is located in the antenna area 1002.
  • the first circuit layer 12 includes a plurality of first cable area circuits 121 and a plurality of first antenna area circuits 122.
  • the first cable area line 121 is located in the cable area 1001, and the first antenna area line 122 is located in the antenna area 1002.
  • the first circuit substrate 10 further includes a plurality of first conductive pastes 101.
  • One end of the first conductive paste 101 penetrates the first insulating substrate layer 11 and is in electrical contact with the first circuit layer 12, and the other end of the first conductive paste 101 protrudes from the first insulating base ⁇ 11 ⁇ Material layer 11.
  • the fourth step referring to FIG. 7, provide a first circuit substrate 10, a second circuit substrate 20, a third circuit substrate 30, a fourth circuit substrate 40, and a fifth circuit substrate 50.
  • the manufacturing method of the second circuit substrate 20, the third circuit substrate 30, the fourth circuit substrate 40, and the fifth circuit substrate 50 is the same as the manufacturing method of the first circuit substrate 10.
  • the second circuit substrate 20 includes a second insulating base material layer 21 and a second circuit layer 22 formed on a surface of the second insulating base material layer 21. Wherein, the second circuit substrate 20 is also divided into a cable area 1001 and an antenna area 1002 adjacent to it.
  • the second insulating substrate layer 21 includes a second cable area substrate 21a and a second antenna area substrate 21b.
  • the second cable area base material 21 a is located in the cable area 1001, and the second antenna area base material 21 b is located in the antenna area 1002.
  • the second circuit layer 22 includes a plurality of second cable area circuits 221 and a plurality of second antenna area circuits 222.
  • the second cable area line 221 is located in the cable area 1001, and the second antenna area line 222 is located in the antenna area 1002.
  • the second circuit substrate 20 further includes a plurality of second conductive pastes 102.
  • One end of the second conductive paste 102 penetrates the second insulating substrate layer 21 and is in electrical contact with the second circuit layer 22, and the other end of the second conductive paste 102 protrudes from the second insulating base ⁇ 21 ⁇ Material layer 21.
  • the third circuit substrate 30 includes a third insulating substrate layer 31 and a third circuit layer 32 formed on a surface of the third insulating substrate layer 31.
  • the third circuit layer 32 includes at least one signal line 321 and at least two ground lines 322.
  • a ground wire 322 is provided on opposite sides of each signal wire 321.
  • the signal line 321 and the ground line 322 constitute the cable area line of the third circuit layer 32.
  • the third circuit substrate 30 further includes a plurality of third conductive pastes 103. One end of the third conductive paste 103 penetrates the third insulating substrate layer 31 and is in electrical contact with the third circuit layer 32, and the other end of the third conductive paste 103 protrudes from the third insulating base ⁇ 31.
  • the fourth circuit substrate 40 includes a fourth insulating base layer 41 and a fourth circuit layer 42 formed on a surface of the fourth insulating base layer 41.
  • the fourth circuit layer 42 includes a plurality of fourth cable area circuits 421.
  • the fourth circuit substrate 40 further includes a plurality of fourth conductive pastes 104. One end of the fourth conductive paste 104 penetrates the fourth insulating substrate layer 41 and is in electrical contact with the fourth circuit layer 42, and the other end of the fourth conductive paste 104 protrudes from the fourth insulating base. ⁇ 41 ⁇ Material layer 41.
  • the fifth circuit substrate 50 includes a fifth insulating substrate layer 51 and a fifth circuit layer 52 formed on a surface of the fifth insulating substrate layer 51.
  • the fifth circuit layer 52 includes a plurality of fifth cable area circuits 521.
  • the fifth circuit substrate 50 further includes a plurality of fifth conductive pastes 105. One end of the fifth conductive paste 105 penetrates the fifth insulating substrate layer 51 and is in electrical contact with the fifth circuit layer 52, and the other end of the fifth conductive paste 105 protrudes from the fifth insulating base. ⁇ 51 ⁇ Material layer 51.
  • the fifth step please refer to Figure 8, the first circuit substrate 10, the second circuit substrate 20, the third circuit substrate 30, the fourth circuit substrate 40 and the fifth circuit substrate 50 according to the second circuit substrate 20, the first The circuit substrate 10, the third circuit substrate 30, the fourth circuit substrate 40, and the fifth circuit substrate 50 are stacked in this order and pressed together.
  • the third circuit substrate 30, the fourth circuit substrate 40, and the fifth circuit substrate 50 are located in the cable area 1001
  • the first circuit substrate 10 and the second circuit substrate 20 are located in the cable area 1001 and the cable area 1001. In the antenna area 1002.
  • the stacking order may be the first circuit substrate 10, the second circuit substrate 20, the third circuit substrate 30, the fourth circuit substrate 40, and the fifth circuit substrate 50.
  • the first circuit substrate 10 and the second circuit substrate 20 may be pressed together first, and the first circuit substrate 10 and the second circuit substrate 20 are named antenna circuit substrates;
  • the third circuit substrate 30, the fourth circuit substrate 40 and the fifth circuit substrate 50 are pressed together, and the third circuit substrate 30, the fourth circuit substrate 40 and the fifth circuit substrate 50 are named cable circuit substrates.
  • the second insulating substrate layer 21 is attached to the first insulating substrate layer 11, the third insulating substrate layer 31 is attached to the first circuit layer 12, and the fourth insulating substrate
  • the material layer 41 is attached to the third circuit layer 32, and the fifth insulating substrate layer 51 is attached to the fourth circuit layer 42.
  • the second insulating substrate layer 21 and the first insulating substrate layer 11 are fused together.
  • the first insulating substrate layer 11 and the third insulating substrate layer 31 are filled in the gaps between the plurality of first cable area lines 121 and the plurality of first antenna area lines 122.
  • the second insulating substrate layer 21 is filled in the gaps between the plurality of second cable area lines 221 and the plurality of second antenna area lines 222.
  • the third insulating substrate layer 31 and the fourth insulating substrate layer 41 are filled in the gap between the signal line 321 and the ground line 322.
  • the fourth insulating base material layer 41 and the fifth insulating base material layer 51 are filled in the gaps of the plurality of fourth cable area lines 421.
  • the fifth insulating substrate layer 51 is filled in the gaps of the plurality of fifth cable area lines 521.
  • a first protective film layer 60 is attached to the surface of the second circuit layer 22
  • a second protective film layer 70 is attached to the surface of the fifth circuit layer 52
  • a fourth protective film layer 82 is attached to the surface of the line 122 in the first antenna area.
  • the first protective film layer 60 is located in the cable area 1001 and the antenna area 1002.
  • a plurality of openings 61 are also formed on the first protective film layer 60, and part of the second circuit layer 22 is exposed from the opening 61.
  • the opening 61 is located in the antenna area 1002.
  • gold is formed in the opening 61 to form a gold layer 90 to obtain the flexible circuit board 100.
  • the present invention also provides another method for manufacturing a flexible circuit board, which includes the following steps:
  • the cable circuit substrate includes at least one cable substrate layer and at least one cable circuit layer formed on one side of the cable substrate layer.
  • the copper substrate includes a cable area and an antenna area.
  • the single-sided copper-clad substrate further includes an insulating substrate layer and a copper-clad layer formed on a surface of the insulating substrate layer.
  • the insulating substrate layer includes The cable area base material in the cable area and the antenna area base material located in the antenna area, the copper clad layer includes a cable area copper clad located on a surface of the cable area base material and a base material layer located in the antenna area
  • the surface of the antenna area is copper-clad; the cable circuit substrate and the single-sided copper-clad substrate are pressed together; wherein the cable circuit substrate and the single-sided copper-clad substrate are pressed against the cable base material Together; and the copper-clad layer is made to form a circuit layer to make the single-sided copper-clad substrate to form an antenna circuit substrate, and the circuit layer includes a cable area line located in the cable area and a line located in the antenna area
  • the antenna area line, the cable area base material and the cable area line of the antenna circuit substrate and the cable circuit substrate form a cable; the antenna area base material and the antenna area line of the antenna circuit substrate form antenna.
  • the present invention provides another method for manufacturing the flexible circuit board 200, which includes the following steps:
  • a cable circuit substrate 130 is provided.
  • the cable circuit substrate 130 includes a fourth insulating substrate layer 41 and a second insulating substrate layer 41 formed on opposite surfaces of the fourth insulating substrate layer 41.
  • the third circuit layer 32 and the fourth circuit layer 42 are electrically connected by a fourth conductive paste 104.
  • the fourth insulating substrate layer 41 is filled in the gap between the lines of the third circuit layer 32 and the fourth circuit layer 42.
  • the fourth insulating substrate layer 41 includes a third cable region substrate 41a.
  • the third circuit layer 32 includes at least one signal line 321 and at least one ground line 322, and the ground line 322 is provided on opposite sides of each signal line 321.
  • the signal line 321 and the ground line 322 are the cable area lines of the third circuit layer 32.
  • the third cable area base material 41 a is filled in the gap between the signal line 321 and the ground line 322. In Figure 1, only one signal line is drawn. In other embodiments, the number of the signal lines 321 is the same as the number of the antennas 120.
  • the fourth circuit layer 42 includes a plurality of fourth cable region circuits 421, and the third cable region base material 41a is filled in the gaps of the plurality of fourth cable region circuits 421.
  • a first single-sided copper-clad substrate 140 and a second single-sided copper-clad substrate 150 are laminated on the surfaces of the third circuit layer 32 and the fourth circuit layer 42, respectively.
  • the first single-sided copper-clad substrate 140 includes a cable area 1001 and an antenna area 1002, and the cable circuit substrate 130 is located in the cable area 1001.
  • the first single-sided copper-clad substrate 140 includes a first insulating substrate layer 11 formed on the third circuit layer 32 and a first copper-clad layer formed on a surface of the first insulating substrate layer 11 141.
  • the first insulating substrate layer 11 includes a first cable area substrate 11a located in the cable area 1001 and a first antenna area substrate 11b located in the antenna area 1002, and the first copper-clad layer 141 It includes a first cable area copper clad 141a on a surface of the first cable area substrate 11a and a first antenna area copper clad 141b on a surface of the first antenna area substrate 11b.
  • the second single-sided copper-clad substrate 150 includes a fifth insulating substrate layer 51 formed on the fourth circuit layer 42 and a second copper-clad layer 151 formed on the fifth insulating substrate layer 51 .
  • the first copper clad layer 141 and the second copper clad layer 151 are respectively fabricated to form the first circuit layer 12 and the fifth circuit layer 52 through an image transfer process, wherein the first circuit layer 12 includes a first cable area line 121 located in the cable area 1001 and a first antenna area line 122 located in the antenna area 1002, and is electrically connected to the first cable area line 121 and the first cable area line 121 through the third conductive paste 103
  • the third circuit layer 32 is electrically connected to the fourth circuit layer 42 and the fifth circuit layer 52 through the fifth conductive paste 105.
  • the first cable area line 121 is made of the first cable area copper 141a
  • the first antenna area line 122 is made of the first antenna area copper 141b.
  • a third single-sided copper-clad substrate 160 is pressed on the first circuit layer 12, and the third single-sided copper-clad substrate 160 is located in the cable area 1001 and Inside the antenna area 1002.
  • the third single-sided copper-clad substrate 160 includes a second insulating substrate layer 21 formed on a surface of the first circuit layer 12 and a third copper-clad substrate formed on a surface of the second insulating substrate layer 21 Layer 161, the second insulating base material layer 21 includes a second cable area base material 21a located in the cable area 1001 and a second antenna area base material 21b located in the antenna area 1002, the third copper clad layer 161 includes a second cable area copper clad 161a on a surface of the second cable area substrate 21a and a second antenna area copper clad 161b on a surface of the second antenna area substrate 21b.
  • the third copper clad layer 161 is fabricated to form a second circuit layer 22 through an image transfer process, wherein the second circuit layer 22 includes a second cable area circuit located in the cable area 1001 221 and the second antenna area circuit 222 located in the antenna area 1002, and are electrically connected to the second circuit layer 22 and the first circuit layer 12 through the second conductive paste 102.
  • the second insulating base material layer 21 is filled in the gaps between the lines of the second circuit layer 22.
  • the second cable area line 221 is made of the second cable area copper-clad 161a
  • the second antenna area line 222 is made of the second antenna area copper-clad 161b.
  • a first protective film layer 60 is attached to the second circuit layer 22
  • a second protective film layer 70 is attached to the fifth circuit layer 52
  • the A fourth protective film layer 82 is attached to the first antenna area substrate 11b.
  • the first protective film layer 60 is located in the cable area 1001 and the antenna area 1002
  • the second protective film layer 70 is located in the cable area 1001
  • the fourth protective film layer 82 is located in the cable area 1001.
  • a plurality of openings 61 are formed on the first protective film layer 60, and a gold layer 90 is formed in the openings 61.
  • the method for manufacturing the antenna-integrated flexible circuit board 200 provided by the present invention is also suitable for manufacturing the antenna-integrated flexible circuit board 300, 400, 500, 600, 700, and 800.
  • the flexible circuit board provided in the present application is used to manufacture the antenna circuit layer and the cable circuit layer of the flexible circuit board by the method of making conductive circuits known in the industry.
  • the antenna circuit layer and the cable circuit layer are formed at the same time, thereby saving space and simplifying the process Process.
  • the substrate layer of the cable and the antenna adopts an insulating substrate with low and stable dielectric constant and dielectric loss and low moisture absorption characteristics in the millimeter wave frequency band, so that the overall loss of the flexible circuit board is low, so as to meet the requirements of 5G The signal transmission requirements of the antenna.

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种柔性电路板（100，200，300，400，500，600，700，800），所述柔性电路板（100，200，300，400，500，600，700，800）包括至少一绝缘基材层（11，21，31，41，51）及至少一线路层（12，22，32，42，52），所述柔性电路板（100，200，300，400，500，600，700，800）还包括一电缆区（1001）及至少一天线区（1002），所述电缆区（1001）设置一电缆（110），所述电缆（110）包括至少一电缆基材层及至少一形成在所述电缆基材层一表面的电缆线路层，所述天线区（1002）设置至少一天线（120），每个所述天线（120）包括至少一天线区基材（11b，21b，41b，51b）及至少一形成在所述天线区基材（11b，21b，41b，51b）一表面的天线区线路（122，222，323，422，522），所述天线区基材（11b，21b，41b，51b）与同一平面上的电缆基材层是同一个绝缘基材层（11，21，31，41，51）的不同部分，所述天线区线路（122，222，323，422，522）与同一平面上的电缆线路层同时制作形成并且是同一个线路层（12，22，32，42，52）的不同部分；还涉及一种柔性电路板（100，200，300，400，500，600，700，800）的制作方法。

Description

柔性电路板及其制作方法 技术领域
本申请涉及一种柔性电路板及其制作方法。
背景技术
随着5G时代的到来，手机等电子产品对天线的需求量也越来越大。而在现有技术中，常将天线与电缆分开设计并组装。而随着天线数量的增加，采用这种设计方法组装出来的电缆与天线所占的空间较大，制作流程多。另外，现有技术中采用激光直接成型(Laser-Direct-Structuring，LDS)技术制作天线。具体地，LDS天线技术是通过激光技术直接在成型的塑料支架上化镀形成金属天线图案。而塑料+化镀金属制作的天线在信号传输过程中的损耗较大。
发明内容
鉴于以上内容，有必要提供一种所占空间小、制作工艺简单且损耗小的集成有天线的柔性电路板。
还有必要提供一种所占空间小、制作工艺简单且损耗小的集成有天线的柔性电路板的制作方法。
一种柔性电路板，所述柔性电路板包括至少一绝缘基材层及至少一线路层，所述柔性电路板还包括一电缆区及至少一天线区，所述电缆区设置一电缆，所述电缆包括至少一电缆基材层及至少一形成在所述电缆基材层一表面的电缆线路层，所述天线区设置至少一天线，每个所述天线包括至少一天线区基材及至少一形成在所述天线区基材一表面的天线区线路，所述天线区基材与同一平面上的电 缆基材层是同一个绝缘基材层的不同部分，所述天线区线路与同一平面上的电缆线路层同时制作形成并且是同一个线路层的不同部分。
进一步地，所述电缆基材层及所述天线区基材的材质是液晶聚合物、特氟龙、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯、聚酰亚胺、聚乙烯、聚氯乙烯中的至少一种。
进一步地，每个所述天线的天线区基材及天线区线路的层数之和不大于所述电缆的电缆基材层及电缆线路层的层数之和。
进一步地，所述电缆线路层包括多条信号线路，所述信号线路的数量与所述天线的个数相同。
一种柔性电路板的制作方法，包括：提供多个电缆电路基板及至少一天线电路基板，每个所述电缆电路基板包括电缆基材层及形成在所述电缆基材层一表面的电缆线路层，所述天线电路基板包括一电缆区及一天线区，所述天线电路基板还包括一绝缘基材层及形成在所述绝缘基材层的线路层，所述绝缘基材层包括位于所述电缆区的电缆区基材及位于所述天线区的天线区基材，所述线路层包括位于所述电缆区基材一表面的电缆区线路及位于所述天线区基材一表面的天线区线路；及将所述电缆电路基板与所述天线电路基板压合在一起；其中，所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板压合在一起；所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板构成电缆；所述天线电路基板的所述天线区基材及所述天线区线路构成天线。
进一步地，在将所述电缆电路基板与所述天线电路基板压合之后，还包括：在所述电缆电路基板的外露表面及所述天线电路基板的外露表面形成保护膜层，所述保护膜层上形成有至少一开口，部分所述天线区线路从所述开口内裸露出来。
进一步地，在将所述电缆电路基板与所述天线电路基板压合之前，还包括：将多个所述电缆电路基板、至少一天线电路基板按顺序堆叠在一起。
进一步地，在将所述电缆电路板与所述天线电路基板压合之前，还包括：将多个所述电缆电路基板压合在一起；之后再将压合后的电缆电路基板与所述天线电路基板压合。
进一步地，所述电缆基材层及所述天线区基材的材质是液晶聚合物、特氟龙、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯、聚酰亚胺、聚乙烯、聚氯乙烯中的至少一。
一种柔性电路板的制作方法，提供至少一电缆电路基板及至少一覆铜基板，所述电缆电路基板包括至少一电缆基材层及形成在所述电缆基材层一侧的至少一电缆线路层，所述覆铜基板包括一电缆区及一天线区，所述覆铜基板还包括位于所述电缆区的电缆区基材及在所述电缆区基材一侧的电缆区覆铜、位于所述天线区的天线区基材及形成在所述天线区基材一侧的天线区覆铜；将所述电缆电路基板与所述覆铜基板压合在一起；其中，所述电缆区基材与所述电缆电路基板压合在一起；及将所述电缆区覆铜及天线区覆铜制作形成电缆区线路及天线区线路，以将所述覆铜基板制作形成天线电路基板，所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板构成电缆；所述天线电路基板的所述天线区基材及所述天线区线路构成天线。
本申请提供的柔性电路板，通过业界习知的制作导电线路的方法制作柔性电路板的天线线路层与电缆线路层，天线线路层与电缆线路层同时形成，从而能够节约占地空间、简化工艺流程。另外，电缆和天线的基材层采用在毫米波频段具有低且稳定的介电常数和介质损耗以及低吸湿特性的绝缘基材，使得所述柔性电路板的整体损耗较低，从而能够满足5G天线的信号传输要求。
附图说明
图1为本申请一实施方式提供的柔性电路板的立体示意图。
图2为图1所示的柔性电路板的沿线II-II的剖视图。
图3是为制作图2所示的柔性电路板所提供的一中间体的剖视 图。
图4为在图3所述的中间体上形成盲孔后的剖视图。
图5是在图4所示的盲孔内填充导电膏后的剖视图。
图6是去除图5所示的保护膜，形成第一电路基板后的剖视图。
图7是提供由上述制作第一电路基板的方法制作的第一、第二、第三及第四电路基板后的剖视图。
图8是将图7所示的第一、第二、第三及第四电路基板按照第二、第一、第三、第四电路基板的顺序叠构在一起并压合后的剖视图。
图9为在图8所示的第一、第二及第四电路基板的裸露表面上形成保护膜后的剖视图。
图10是本申请第二实施方式提供的一种柔性电路板的剖视图。
图11是本申请第三实施方式提供的一种柔性电路板的剖视图。
图12是本申请第四实施方式提供的一种柔性电路板的剖视图。
图13是本申请第五实施方式提供的一种柔性电路板的剖视图。
图14是本申请第六实施方式提供的一种柔性电路板的剖视图。
图15是本申请第七实施方式提供的一种柔性电路板的剖视图。
图16是本申请第八实施方式提供的一种柔性电路板的剖视图。
图17是为制作图10所示的柔性电路板所提供的一电缆电路基板的剖视图。
图18是分别在图17所示的电缆电路基板的相背两表面上压合一第一单面覆铜基板及一第二单面覆铜基板后的剖视图。
图19是将图18所示的第一单面覆铜基板及第二单面覆铜基板 的铜箔层分别制作形成第一线路层及第五线路层后的剖视图。
图20是在图19所示的第一线路层的表面上压合一第三单面覆铜基板后的剖视图。
图21是将图20所示的第三单面覆铜基板的铜箔层分别制作形成第二线路层后的剖视图。
主要元件符号说明
柔性电路板 100,200,300,400,500,600,700,800
电缆 110
天线 120
中间体 1
第一绝缘基材层 11
第一电缆区基材 11a
第一天线区基材 11b
第一线路层 12
第一电缆区线路 121
第一天线区线路 122
树脂层 13
电缆区 1001
天线区 1002
盲孔 14
第一导电膏 101
第一电路基板 10
第二电路基板 20
第二绝缘基材层 21
第二电缆区基材 21a
第二天线区基材 21b
第二线路层 22
第二电缆区线路 221
第二天线区线路 222
第二导电膏 102
第三电路基板 30
第三绝缘基材层 31
第三线路层 32
信号线 321
接地线 322
第三导电膏 103
第四电路基板 40
第四绝缘基材层 41
第三电缆区基材 41a
第三天线区基材 41b
第四线路层 42
第四电缆区线路 421
第四导电膏 104
第五电路基板 50
第五绝缘基材层 51
第四电缆区基材 51a
第四天线区基材 51b
第五线路层 52
第五电缆区线路 521
第五导电膏 105
第一保护膜层 60
开口 61
第二保护膜层 70
化金层 90
第三保护膜层 81
第四保护膜层 82
第三天线区线路 323
第四天线区线路 422
第五天线区线路 522
电缆电路基板 130
第一单面覆铜基板 140
第一覆铜层 141
第一电缆区覆铜 141a
第一天线区覆铜 141b
第二单面覆铜基板 150
第二覆铜层 151
第三单面覆铜基板 160
第三覆铜层 161
第二电缆区覆铜 161a
第二天线区覆铜 161b
如下具体实施方式将结合上述附图进一步说明本申请。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明的是，当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中设置的元件。当一个元件被认为是“设置在”另一个元件，它可以是直接设置在另一个元件上或者可能同时存在居中设置的元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本 申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
本申请提供一种柔性电路板，所述柔性电路板包括至少一绝缘基材层及至少一线路层，所述柔性电路板还包括一电缆区及至少一天线区。所述电缆区设置一电缆，所述电缆包括至少一电缆基材层及至少一形成在所述电缆基材层一表面的电缆线路层。所述天线区设置至少一天线，每个所述天线包括至少一天线区基材及至少一形成在所述天线区基材一表面的天线区线路。所述天线区基材与同一平面上的所述电缆基材层是同一个绝缘基材层的不同部分，所述天线区线路与同一平面上的所述电缆线路层同时制作形成并且是同一个线路层的不同部分。
其中，所述电缆可以为同轴电缆、微带共面电缆、电磁耦合电缆等常见电缆中的至少一种。
其中，所述天线可以为贴片天线、振子天线、缝隙天线、F型天线、偶极天线、八木天线等常见天线中的至少一种，以对应不同的频带和频带组合。
请参阅图1-2，于第一实施方式中，所述柔性电路板100包括电缆区1001及天线区1002，所述电缆区1001设置一电缆110，所述天线区1002设置多个天线120。多个所述天线120位于所述电缆110的一侧，所述电缆110与多个所述天线120一体成型。
在本实施方式中，所述电缆110包括的电缆基材层及电缆线路层的数量均为5。在其他实施方式中，所述电缆110包括的电缆基材层及电缆线路层的数量可根据实际情况而定。
具体地，所述柔性电路板100包括一第一绝缘基材层11、一第二绝缘基材层21、一第三绝缘基材层31、一第四绝缘基材层41、一第五绝缘基材层51、一形成在所述第一绝缘基材层11上的第一线路层12、一形成在所述第二绝缘基材层21上的第二线路层22、 一形成在所述第三绝缘基材层31上的第三线路层32、一形成在所述第四绝缘基材层41上的第四线路层42及一形成在所述第五绝缘基材层51上的第五线路层52。其中，所述第二绝缘基材层21与所述第一绝缘基材层11相贴，所述第三绝缘基材层31与所述第一线路层12相贴，所述第四绝缘基材层41与所述第三线路层32相贴，所述第五绝缘基材层51与所述第四线路层42相贴。在压合后，所述第二绝缘基材层21与所述第一绝缘基材层11融合在一起。
其中，所述第三绝缘基材层31、第四绝缘基材层41、第五绝缘基材层51、第三线路层32、第四线路层42及第五线路层52位于所述电缆区1001内。所述第一绝缘基材层11、第二绝缘基材层21、第一线路层12及第二线路层22位于所述电缆区1001及所述天线区1002内。
在本实施方式中，所述第三绝缘基材层31、第四绝缘基材层41及第五绝缘基材层51为所述柔性电路板100的电缆基材层，所述第三线路层32、第四线路层42及第五线路层52为所述柔性电路板100的电缆线路层。
具体地，所述第一绝缘基材层11包括第一电缆区基材11a及第一天线区基材11b，所述第一线路层12包括多条第一电缆区线路121及多条第一天线区线路122，所述第一电缆区基材11a及所述第三绝缘基材层31填充在多条所述第一电缆区线路121的缝隙间，所述第一天线区基材11b填充在多条所述第一天线区线路122的缝隙间。
具体地，所述第二绝缘基材层21包括第二电缆区基材21a及第二天线区基材21b，所述第二线路层22包括多条第二电缆区线路221及多条第二天线区线路222，所述第二电缆区基材21a填充在多条所述第二电缆区线路221的缝隙内，所述第二天线区基材21b填充在多条所述第二天线区线路222的缝隙间。
在本实施方式中，所述第一电缆区基材11a及所述第一天线区基材11b是所述第一绝缘基材层11的不同部分，所述第二电缆区 基材21a及所述第二天线区基材21b是所述第二绝缘基材层21的不同部分，所述第一电缆区线路121及所述第一天线区线路122是所述第一线路层12的不同部分，所述第二电缆区线路221及所述第二天线区线路222是所述第二线路层22的不同部分。
具体地，所述第三线路层32包括至少一信号线321及至少一接地线322，每条所述信号线321的相对两侧均设置有一所述接地线322。其中，所述信号线321及所述接地线322为所述第三线路层32的电缆区线路。所述第三绝缘基材层31及所述第四绝缘基材层41填充在所述信号线321及所述接地线322的间隙内。在图1中，仅绘出一条信号线。在其他实施方式中，所述信号线321的数量与所述天线120的数量相同。
具体地，所述第四线路层42包括多条第四电缆区线路421，所述第四绝缘基材层41及所述第五绝缘基材层51填充在多条所述第四电缆区线路421的间隙内。
具体地，所述第五线路层52包括多条第五电缆区线路521，所述第五绝缘基材层51填充在多条所述第五电缆区线路521的间隙内。
其中，所述第一绝缘基材层11、所述第二绝缘基材层21、第三绝缘基材层31、第四绝缘基材层41及第五绝缘基材层51的材质是液晶聚合物(liquid crystal polymer，LCP)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)或聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)、聚乙烯(polyethylene，PE)、特氟龙(Teflon)、聚氯乙烯(polyvinyl chloride polymer，PVC)等材料中的至少一种。
其中，所述集成有天线的柔性电路板100还包括多个第一导电膏101、多个第二导电膏102、多个第三导电膏103、多个第四导电膏104及多个第五导电膏105。
在本实施方式中，所述第一线路层12与所述第二线路层22之间通过所述第一导电膏101及所述第二导电膏102电连接，所述第 一线路层12与所述第三线路层32之间通过所述第三导电膏103电连接，所述第三线路层32与所述第四线路层42之间通过所述第四导电膏104电连接，所述第四线路层42与所述第五线路层52之间通过所述第五导电膏105电连接。可以理解，所述第一导电膏101及所述第二导电膏102电连接的结构不一定是规则的，如所述第一导电膏101及所述第二导电膏102的高度不一定是相等的，其接触面不一定是平整的，其外形也不一定是直的圆柱状的，等等。在其他实施方式中，所述第一线路层12与所述第二线路层22之间还可以仅通过所述第一导电膏101或第二导电膏102电连接。
在本实施方式中，所述柔性电路板100还包括一第一保护膜层60、一第二保护膜层70及一第四保护膜层82。其中，所述第一保护膜层60形成在所述第二线路层22上，所述第二保护膜层70形成在所述第五线路层52上，所述第四保护膜层82形成在所述第一天线区基材11b及所述第一天线区线路122上。具体地，所述第一保护膜层60位于所述电缆区1001及天线区1002内，所述第二保护膜层70位于所述电缆区1001内，所述第四保护膜层82位于所述天线区1002内。所述第一保护膜层60上还形成有多个开口61，部分所述第二线路层22从所述开口61内裸露出来。在图1中，所述开口61位于所述天线区1002内。所述开口61内还形成有化金层90。在本实施方式中，所述化金层90用于保护裸露的第二线路层22并用于外接开关、调谐器、滤波器、双工器、收发器等天线常用电子元件。
在本实施方式中，所述第二电缆区线路221及所述第五电缆区线路521为带状线结构。在其他实施方式中，所述第二电缆区线路221及所述第五电缆区线路521为内嵌微带线结构，以便于弯折。
请参阅图10，本申请第二实施方式揭示一种柔性电路板200，所述柔性电路板200的结构与所述柔性电路板100的结构相似，其区别点仅在于：所述柔性电路板200的第二绝缘基材层21位于所述柔性电路板200的所述第二线路层22与所述第一线路层12之 间，所述柔性电路板200的第一绝缘基材层11位于所述第一线路层12一侧且所述第三线路层32位于所述电缆区1001的所述第一绝缘基材层11的一侧，所述第四绝缘基材层41位于所述第三线路层32一侧，所述第四线路层42形成在所述第四绝缘基材层41上，所述第五绝缘基材层51位于所述第四线路层42一侧，所述第五线路层52形成在所述第五绝缘基材层51上。在本实施方式中，所述电缆110由五层线路层及四层基材层(缺少第一实施方式种的第三基材层)组成。本实施方式中的所述天线120与第一实施方式中的天线的区别在于：本实施方式中的第二天线区基材21b与第一天线区基材11b并未相贴而是被所述第一天线区线路122间隔开。另外，本实施方式中的所述第四保护膜层82是贴合在所述第一天线区基材11b上的而非是贴合在第一天线区线路122上的。
请参阅图11，本申请第三实施方式揭示一种柔性电路板300，所述柔性电路板300的结构与所述柔性电路板100的结构相似，其区别点仅在于：所述柔性电路板300的天线是由一所述第三线路层32及第一绝缘基材层11的一部分组成的。具体地，所述第三线路层32还包括多条第三天线区线路323。所述柔性电路板300的天线由所述第三天线区线路323及第一天线区基材11b组成。另外，所述柔性电路板300的结构与所述柔性电路板100的区别还在于：所述第一保护膜层60仅位于所述电缆区1001内，所述第一天线区基材11b上贴合一第三保护膜层81。在本实施方式中，所述电缆110由五层线路层及四层基材层(缺少第一实施方式种的第三基材层)组成。
当然，在其他实施方式中，所述柔性电路板300的天线还可以由任一绝缘基材层及与其相邻的任一线路层的一部分组成，并不局限于由第三线路层32及第一绝缘基材层11的一部分组成。
请参阅图12，本申请第四实施方式揭示一种柔性电路板400，所述柔性电路板400的结构与所述柔性电路板300的结构相似，其区别点仅在于：所述柔性电路板400的天线由两个线路层及一绝缘 基材层的一部分组成的。具体地，所述柔性电路板400的天线由第三天线区线路323、所述第一天线区线路122及位于所述第三天线区线路323与所述第一天线区线路122之间的第一天线区基材11b组成。
当然，在其他实施方式中，所述柔性电路板400的天线还可以由任一绝缘基材层及与其相邻的任两个线路层的一部分组成，并不局限于第一、第二实施方式中的天线的结构。
请参阅图13，本申请第五实施方式揭示一种柔性电路板500，所述柔性电路板500的结构与所述柔性电路板400的结构相似，其区别点仅在于：所述柔性电路板500的天线由三个线路层及两个绝缘基材层的一部分组成。具体地，所述柔性电路板500的天线由所述第三天线区线路323、所述第一天线区基材11b、所述第一天线区线路122、所述第二天线区基材21b及所述第二天线区线路222组成。
当然，在其他实施方式中，所述柔性电路板500的天线还可以由任两个绝缘基材层及与其相邻的任三个线路层的一部分组成，并不局限于第五实施方式中的天线的结构。
请参阅图14，本申请第六实施方式揭示一种柔性电路板600，所述柔性电路板600的结构与所述柔性电路板500的结构相似，其区别点仅在于：所述第四绝缘基材层41包括一位于所述电缆区1001内的第三电缆区基材41a及位于所述天线区1002的第三天线区基材41b。所述第五绝缘基材层51包括一位于所述电缆区1001内的第四电缆区基材51a及位于所述天线区1002的第四天线区基材51b。所述第四线路层42包括位于所述电缆区1001内的第四电缆区线路421及位于所述天线区1002内的第四天线区线路422。所述第五线路层52包括位于所述电缆区1001内的第五电缆区线路521及位于所述天线区1002内的第五天线区线路522。所述柔性电路板600的天线由四个线路层及三个绝缘基材层的一部分组成。具体地，所述柔性电路板600的天线由所述第一天线区线路122、所 述第一天线区基材11b、所述第三天线区线路323、所述第三天线区基材41b、所述第四天线区线路422、所述第四天线区基材51b及所述第五天线区线路522组成。另外，所述第二保护膜层70位于所述电缆区1001及所述天线区1002内的第五线路层52上。
当然，在其他实施方式中，所述柔性电路板400的天线还可以由任三绝缘基材层及与其相邻的任四个线路层的一部分组成，并不局限于第六实施方式中的天线的结构。
请参阅图15，本申请第七实施方式揭示一种柔性电路板700，所述柔性电路板700的结构与所述柔性电路板600的结构相似，其区别点仅在于：所述柔性电路板700的天线由四个线路层及四个绝缘基材层的一部分组成。具体地，所述柔性电路板700的天线由所述第二天线区线路222、所述第二天线区基材21b、所述第一天线区基材11b、所述第三天线区线路323、所述第三天线区基材41b、所述第四天线区线路422、所述第四天线区基材51b及所述第五天线区线路522组成。也即是说，本实施方式中的所述第一线路层12仅包括第一电缆区线路121，从而，所述第二天线区基材21b与所述第一天线区基材11b相接触。另外，所述第一保护膜层60位于所述电缆区1001及所述天线区1002内的第二线路层22上。
当然，在其他实施方式中，所述柔性电路板700的天线线路层还可以由第一、第二、第三、第四、第五线路层中的任意四个组成，所述柔性电路板700的天线基材层还可以由第一、第二、第三、第四、第五绝缘基材层中的任意四个组成且其中任意两个绝缘基材层相贴。
请参阅图16，本申请第八实施方式揭示一种柔性电路板800，所述柔性电路板800的结构与所述柔性电路板600的结构相似，其区别点仅在于：所述柔性电路板800的天线由五个线路层及四个绝缘基材层的一部分组成。具体地，所述柔性电路板800的天线由所述第二天线区线路222、所述第二天线区基材21b、所述第一天线区线路122、所述第一天线区基材11b、所述第三天线区线路323、 所述第三天线区基材41b、所述第四天线区线路422、所述第四天线区基材51b及所述第五天线区线路522组成。也即是说，本实施方式中的天线120的线路层与绝缘基材层的层数之和等于电缆110的线路层与基材层的层数之和。
当然，在其他实施方式中，电缆与天线的线路层与绝缘基材层的层数并不局限于上述所述的层数，在设计天线时，可根据实际情况灵活设计天线的线路层数及基材层数与位置。
本申请还提供一种柔性电路板的制作方法，包括：提供多个电缆电路基板及至少一天线电路基板，每个所述电缆电路基板包括电缆基材层及形成在所述电缆基材层一表面的电缆线路层，所述天线电路基板包括一电缆区及一天线区，所述天线电路基板还包括一绝缘基材层及形成在所述绝缘基材层的线路层，所述绝缘基材层包括位于所述电缆区的电缆区基材及位于所述天线区的天线区基材，所述线路层包括位于所述电缆区基材一表面的电缆区线路及位于所述天线区基材层一表面的天线区线路；及将所述电缆电路基板与所述天线电路基板压合在一起；其中，所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板压合在一起；所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板构成电缆；所述天线电路基板的所述天线区基材及所述天线区线路构成天线。
具体地，请参阅图2-9，本申请提供一种柔性电路板100的制作方法，包括步骤：
第一步，请参阅图3，提供一中间体1。所述中间体1包括一第一绝缘基材层11及形成在所述第一绝缘基材层11相背两表面上的第一线路层12及树脂层13。
其中，所述中间体1分为电缆区1001及与之毗邻的天线区1002。所述第一线路层12包括多条第一电缆区线路121及多条第一天线区线路122。所述第一电缆区线路121位于所述电缆区1001内，所述第一天线区线路122位于所述天线区1002内。所述第一 绝缘基材层11包括第一电缆区基材11a及第一天线区基材11b。所述第一电缆区基材11a位于所述电缆区1001内，所述第一天线区基材11b位于所述天线区1002内。
其中，所述第一绝缘基材层11的材质为LCP、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)或聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)、聚乙烯(polyethylene，PE)、特氟龙(Teflon)、聚氯乙烯(polyvinyl chloride polymer，PVC)等材料中的至少一种。
在本实施方式中，所述树脂层13为聚对苯二甲酸乙二酯(Polyethylene terephthalate，PET)。在其他实施方式中，所述树脂层13还可以是树脂层或其他的能够后期去除或被蚀刻掉的膜层。
第二步，请参阅图4-5，在所述中间体1上形成多个盲孔14，并在所述盲孔14内填充第一导电膏101。
其中，所述盲孔14贯穿所述树脂层13及所述第一绝缘基材层11。所述第一导电膏101的一端与所述第一线路层12电接触。
其中，可以通过激光或机械钻孔等方法形成所述盲孔14。
第三步，请参阅图6，去除所述树脂层13，得到一第一电路基板10。
其中，所述第一电路基板10包括一第一绝缘基材层11及形成在所述第一绝缘基材层11一表面上的第一线路层12。其中，所述第一电路基板10分为电缆区1001及与之毗邻的天线区1002。所述第一绝缘基材层11包括第一电缆区基材11a及第一天线区基材11b。所述第一电缆区基材11a位于所述电缆区1001内，所述第一天线区基材11b位于所述天线区1002内。所述第一线路层12包括多条第一电缆区线路121及多条第一天线区线路122。所述第一电缆区线路121位于所述电缆区1001内，所述第一天线区线路122位于所述天线区1002内。所述第一电路基板10还包括多个第一导电膏101。所述第一导电膏101的一端贯穿所述第一绝缘基材层11并与所述第一线路层12电接触，所述第一导电膏101的另一端凸 出于所述第一绝缘基材层11。
第四步，请参阅图7，提供一所述第一电路基板10、一第二电路基板20、一第三电路基板30、一第四电路基板40及一第五电路基板50。
其中，所述第二电路基板20、第三电路基板30、第四电路基板40及第五电路基板50的制作方法与所述第一电路基板10的制作方法相同。
其中，所述第二电路基板20包括一第二绝缘基材层21及形成在所述第二绝缘基材层21一表面上的第二线路层22。其中，所述第二电路基板20也分为电缆区1001及与之毗邻的天线区1002。所述第二绝缘基材层21包括第二电缆区基材21a及第二天线区基材21b。所述第二电缆区基材21a位于所述电缆区1001内，所述第二天线区基材21b位于所述天线区1002内。所述第二线路层22包括多条第二电缆区线路221及多条第二天线区线路222。所述第二电缆区线路221位于所述电缆区1001内，所述第二天线区线路222位于所述天线区1002内。所述第二电路基板20还包括多个第二导电膏102。所述第二导电膏102的一端贯穿所述第二绝缘基材层21并与所述第二线路层22电接触，所述第二导电膏102的另一端凸出于所述第二绝缘基材层21。
其中，所述第三电路基板30包括一第三绝缘基材层31及形成在所述第三绝缘基材层31一表面上的第三线路层32。所述第三线路层32包括至少一信号线321及至少两接地线322。每条所述信号线321的相对两侧均设置有一所述接地线322。其中，所述信号线321及所述接地线322构成所述第三线路层32的电缆区线路。所述第三电路基板30还包括多个第三导电膏103。所述第三导电膏103的一端贯穿所述第三绝缘基材层31并与所述第三线路层32电接触，所述第三导电膏103的另一端凸出于所述第三绝缘基材层31。
其中，所述第四电路基板40包括一第四绝缘基材层41及形成 在所述第四绝缘基材层41一表面上的第四线路层42。所述第四线路层42包括多条第四电缆区线路421。所述第四电路基板40还包括多个第四导电膏104。所述第四导电膏104的一端贯穿所述第四绝缘基材层41并与所述第四线路层42电接触，所述第四导电膏104的另一端凸出于所述第四绝缘基材层41。
其中，所述第五电路基板50包括一第五绝缘基材层51及形成在所述第五绝缘基材层51一表面上的第五线路层52。所述第五线路层52包括多条第五电缆区线路521。所述第五电路基板50还包括多个第五导电膏105。所述第五导电膏105的一端贯穿所述第五绝缘基材层51并与所述第五线路层52电接触，所述第五导电膏105的另一端凸出于所述第五绝缘基材层51。
第五步，请参阅图8，将所述第一电路基板10、第二电路基板20、第三电路基板30、第四电路基板40及第五电路基板50按照第二电路基板20、第一电路基板10、第三电路基板30、第四电路基板40及第五电路基板50的顺序堆叠并压合。其中，所述第三电路基板30、第四电路基板40及第五电路基板50位于所述电缆区1001内，所述第一电路基板10、第二电路基板20位于所述电缆区1001及所述天线区1002内。
在其他实施方式中，堆叠顺序也可以是第一电路基板10、第二电路基板20、第三电路基板30、第四电路基板40及第五电路基板50。
在其他实施方式中，还可以先将所述第一电路基板10与第二电路基板20压合在一起，将所述第一电路基板10与第二电路基板20命名为天线电路基板；将所述第三电路基板30、第四电路基板40及第五电路基板50压合在一起，并将所述第三电路基板30、第四电路基板40及第五电路基板50命名为电缆电路基板。
其中，所述第二绝缘基材层21与所述第一绝缘基材层11相贴，所述第三绝缘基材层31与所述第一线路层12相贴，所述第四绝缘基材层41与所述第三线路层32相贴，所述第五绝缘基材层51与 所述第四线路层42相贴。在压合后，所述第二绝缘基材层21与所述第一绝缘基材层11融合在一起。所述第一绝缘基材层11及所述第三绝缘基材层31填充在多条所述第一电缆区线路121及多条所述第一天线区线路122的缝隙间。所述第二绝缘基材层21填充在多条所述第二电缆区线路221及多条所述第二天线区线路222的缝隙间。所述第三绝缘基材层31及所述第四绝缘基材层41填充在所述信号线321及所述接地线322的间隙内。所述第四绝缘基材层41及所述第五绝缘基材层51填充在多条所述第四电缆区线路421的间隙内。所述第五绝缘基材层51填充在多条所述第五电缆区线路521的间隙内。
第六步，请参阅图9，在所述第二线路层22的表面贴合一第一保护膜层60，在所述第五线路层52的表面贴合一第二保护膜层70，并在位于所述第一天线区线路122的表面贴合一第四保护膜层82。
其中，在本实施方式中，所述第一保护膜层60位于所述电缆区1001及所述天线区1002内。所述第一保护膜层60上还形成有多个开口61，部分所述第二线路层22从所述开口61内裸露出来。在图9中，所述开口61位于所述天线区1002内。
第七步，请参阅图2，在所述开口61内化金形成化金层90，以得到所述柔性电路板100。
在另一实施方式中，本发明还提供另一种柔性电路板的制作方法，包括如下步骤：
提供至少一电缆电路基板及至少一单面覆铜基板，所述电缆电路基板包括至少一电缆基材层及形成在所述电缆基材层一侧的至少一电缆线路层，所述单面覆铜基板包括一电缆区及一天线区，所述单面覆铜基板还包括一绝缘基材层及形成在所述绝缘基材层一表面的覆铜层，所述绝缘基材层包括位于所述电缆区的电缆区基材及位于所述天线区的天线区基材，所述覆铜层包括位于所述电缆区基材一表面的电缆区覆铜及位于所述天线区基材层一表面的天线 区覆铜；将所述电缆电路基板与所述单面覆铜基板压合在一起；其中，所述电缆电路基板与所述单面覆铜基板的所述电缆基材压合在一起；及将所述覆铜层制作形成线路层，以将所述单面覆铜基板制作形成天线电路基板，所述线路层包括位于所述电缆区的电缆区线路以及位于所述天线区的天线区线路，所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板构成电缆；所述天线电路基板的所述天线区基材及所述天线区线路构成天线。
具体地，请参阅图17-21，本发明提供另一种制作所述柔性电路板200的制作方法，包括如下步骤：
第一步，请参阅图17，提供一电缆电路基板130，所述电缆电路基板130包括一第四绝缘基材层41及形成在所述第四绝缘基材层41相背两表面上的第三线路层32及第四线路层42。所述第三线路层32及第四线路层42之间通过第四导电膏104电连接。所述第四绝缘基材层41填充在所述第三线路层32及第四线路层42的线路之间的间隙内。
具体地，所述第四绝缘基材层41包括第三电缆区基材41a。
具体地，所述第三线路层32包括至少一信号线321及至少一接地线322，每条所述信号线321的相对两侧均设置有一所述接地线322。其中，所述信号线321及所述接地线322为所述第三线路层32的电缆区线路。所述第三电缆区基材41a填充在所述信号线321及所述接地线322的间隙内。在图1中，仅绘出一条信号线。在其他实施方式中，所述信号线321的数量与所述天线120的数量相同。
具体地，所述第四线路层42包括多条第四电缆区线路421，所述第三电缆区基材41a填充在多条所述第四电缆区线路421的间隙内。
第二步，请参阅图18，在所述第三线路层32及所述第四线路层42的表面分别压合一第一单面覆铜基板140及一第二单面覆铜基板150。其中，所述第一单面覆铜基板140包括电缆区1001及 天线区1002，所述电缆电路基板130位于电缆区1001内。所述第一单面覆铜基板140包括一形成在所述第三线路层32上的第一绝缘基材层11及形成在所述第一绝缘基材层11一表面的第一覆铜层141，所述第一绝缘基材层11包括位于所述电缆区1001的第一电缆区基材11a及位于所述天线区1002的第一天线区基材11b，所述第一覆铜层141包括位于所述第一电缆区基材11a一表面的第一电缆区覆铜141a及位于所述第一天线区基材11b一表面的第一天线区覆铜141b。所述第二单面覆铜基板150包括一形成在所述第四线路层42上的第五绝缘基材层51及形成在所述第五绝缘基材层51上的第二覆铜层151。
第三步，请参阅图19，通过影像转移制程将所述第一覆铜层141及第二覆铜层151分别制作形成第一线路层12及第五线路层52，其中，第一线路层12包括位于所述电缆区1001的第一电缆区线路121及位于所述天线区1002的第一天线区线路122，并通过第三导电膏103电连接所述第一电缆区线路121及所述第三线路层32，通过所述第五导电膏105电连接所述第四线路层42及所述第五线路层52。
其中，所述第一电缆区线路121由所述第一电缆区覆铜141a制成的，所述第一天线区线路122是由第一天线区覆铜141b制成的。
第四步，请参阅图20，在所述第一线路层12上压合一第三单面覆铜基板160，所述第三单面覆铜基板160位于所述电缆区1001内及所述天线区1002内。所述第三单面覆铜基板160包括一形成在所述第一线路层12一表面的第二绝缘基材层21及形成在所述第二绝缘基材层21一表面的第三覆铜层161，所述第二绝缘基材层21包括位于所述电缆区1001的第二电缆区基材21a及位于所述天线区1002的第二天线区基材21b，所述第三覆铜层161包括位于所述第二电缆区基材21a一表面的第二电缆区覆铜161a及位于所述第二天线区基材21b一表面的第二天线区覆铜161b。
第五步，请参阅图21，通过影像转移制程将所述第三覆铜层161制作形成第二线路层22，其中，第二线路层22包括位于所述电缆区1001的第二电缆区线路221及位于所述天线区1002的第二天线区线路222，并通过第二导电膏102电连接所述第二线路层22及所述第一线路层12。其中，所述第二绝缘基材层21填充在所述第二线路层22的线路之间的间隙内。
其中，所述第二电缆区线路221由所述第二电缆区覆铜161a制成的，所述第二天线区线路222是由第二天线区覆铜161b制成的。
第六步，请参阅图10，在所述第二线路层22上贴合一第一保护膜层60，在所述第五线路层52上贴合一第二保护膜层70，并在所述第一天线区基材11b上贴合一第四保护膜层82。其中，所述第一保护膜层60位于所述电缆区1001及所述天线区1002内，所述第二保护膜层70位于所述电缆区1001内，所述第四保护膜层82位于所述天线区1002内。所述第一保护膜层60上形成有多个开口61，所述开口61内形成有化金层90。
当然，在其他实施方式中，本发明提供的制作所述集成有天线的柔性电路板200的制作方法，也适用于制作所述集成有天线的柔性电路板300、400、500、600、700及800。
本申请提供的柔性电路板，通过业界习知的制作导电线路的方法制作柔性电路板的天线线路层与电缆线路层，天线线路层与电缆线路层同时形成，从而能够节约占地空间、简化工艺流程。另外，电缆和天线的基材层采用在毫米波频段具有低且稳定的介电常数和介质损耗以及低吸湿特性的绝缘基材，使得所述柔性电路板的整体损耗较低，从而能够满足5G天线的信号传输要求。
以上所述，仅是本申请的较佳实施方式而已，并非对本申请任何形式上的限制，虽然本申请已是较佳实施方式揭露如上，并非用以限定本申请，任何熟悉本专业的技术人员，在不脱离本申请技术方案范围内，当可利用上述揭示的技术内容做出些许更动或修饰为 等同变化的等效实施方式，但凡是未脱离本申请技术方案内容，依据本申请的技术实质对以上实施方式所做的任何简单修改、等同变化与修饰，均仍属于本申请技术方案的范围内。

Claims (10)

  1. 一种柔性电路板，所述柔性电路板包括至少一绝缘基材层及至少一线路层，其特征在于，所述柔性电路板还包括一电缆区及至少一天线区，所述电缆区设置一电缆，所述电缆包括至少一电缆基材层及至少一形成在所述电缆基材层一表面的电缆线路层，所述天线区设置至少一天线，每个所述天线包括至少一天线区基材及至少一形成在所述天线区基材一表面的天线区线路，所述天线区基材与同一平面上的电缆基材层是同一个绝缘基材层的不同部分，所述天线区线路与同一平面上的电缆线路路层同时制作形成并且是同一个线路层的不同部分。
  2. 如权利要求1所述的柔性电路板，其特征在于，所述电缆基材层及所述天线区基材的材质是液晶聚合物、特氟龙、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯、聚酰亚胺、聚乙烯、聚氯乙烯中的至少一种。
  3. 如权利要求1所述的柔性电路板，其特征在于，每个所述天线的天线区基材及天线区线路的层数之和不大于所述电缆的电缆基材层及电缆线路层的层数之和。
  4. 如权利要求1所述的柔性电路板，其特征在于，所述电缆线路层包括多条信号线路，所述信号线路的数量与所述天线的个数相同。
  5. 一种柔性电路板的制作方法，包括：
    提供多个电缆电路基板及至少一天线电路基板，每个所述电缆电路基板包括电缆基材层及形成在所述电缆基材层一表面的电缆线路层，所述天线电路基板包括一电缆区及一天线区，所述天线电路基板还包括一绝缘基材层及形成在所述绝缘基材层的线路层，所述绝缘基材层包括位于所述电缆区的电缆区基材及位于所述天线区的天线区基材，所述线路层包括位于所述电缆区基材一表面的电缆区线路及位于所述天线区基材一表面的天线区线路；及
    将所述电缆电路基板与所述天线电路基板压合在一起；其中， 所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板压合在一起；所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板构成电缆；所述天线电路基板的所述天线区基材及所述天线区线路构成天线。
  6. 如权利要求5所述的柔性电路板的制作方法，其特征在于，在将所述电缆电路基板与所述天线电路基板压合之后，还包括：
    在所述电缆电路基板的外露表面及所述天线电路基板的外露表面形成保护膜层，所述保护膜层上形成有至少一开口，部分所述天线区线路从所述开口内裸露出来。
  7. 如权利要求5所述的柔性电路板的制作方法，其特征在于，在将所述电缆电路基板与所述天线电路基板压合之前，还包括：
    将多个所述电缆电路基板、至少一天线电路基板按顺序堆叠在一起。
  8. 如权利要求5所述的柔性电路板的制作方法，其特征在于，在将所述电缆电路板与所述天线电路基板压合之前，还包括：
    将多个所述电缆电路基板压合在一起；之后再将压合后的电缆电路基板与所述天线电路基板压合。
  9. 如权利要求5所述的柔性电路板的制作方法，其特征在于，所述电缆基材层及所述绝缘基材层的材质是液晶聚合物、特氟龙、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯、聚酰亚胺、聚乙烯、聚氯乙烯中的至少一种。
  10. 一种柔性电路板的制作方法，包括：
    提供至少一电缆电路基板及至少一覆铜基板，所述电缆电路基板包括至少一电缆基材层及形成在所述电缆基材层一侧的至少一电缆线路层，所述覆铜基板包括一电缆区及一天线区，所述覆铜基板还包括位于所述电缆区的电缆区基材及在所述电缆区基材一侧的电缆区覆铜、位于所述天线区的天线区基材及形成在所述天线区基材一侧的天线区覆铜；
    将所述电缆电路基板与所述覆铜基板压合在一起；其中，所述 电缆基材与所述电缆电路基板压合在一起；及
    将所述电缆区覆铜及天线区覆铜制作形成电缆区线路及天线区线路，以将所述覆铜基板制作形成天线电路基板，所述天线电路基板的所述电缆区基材及所述电缆区线路与所述电缆电路基板构成电缆；所述天线电路基板的所述天线区基材及所述天线区线路构成天线。
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CN107516764A (zh) * 2016-06-16 2017-12-26 鹏鼎控股(深圳)股份有限公司 天线结构及其制作方法
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