WO2020226162A1 - Stratifié - Google Patents

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Publication number
WO2020226162A1
WO2020226162A1 PCT/JP2020/018582 JP2020018582W WO2020226162A1 WO 2020226162 A1 WO2020226162 A1 WO 2020226162A1 JP 2020018582 W JP2020018582 W JP 2020018582W WO 2020226162 A1 WO2020226162 A1 WO 2020226162A1
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WO
WIPO (PCT)
Prior art keywords
copper
laminate according
laminate
base material
resin base
Prior art date
Application number
PCT/JP2020/018582
Other languages
English (en)
Japanese (ja)
Inventor
直貴 小畠
牧子 佐藤
Original Assignee
ナミックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナミックス株式会社 filed Critical ナミックス株式会社
Priority to KR1020217026954A priority Critical patent/KR20220007038A/ko
Priority to CN202080027107.9A priority patent/CN113677519A/zh
Publication of WO2020226162A1 publication Critical patent/WO2020226162A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2371/00—Polyethers, e.g. PEEK, i.e. polyether-etherketone; PEK, i.e. polyetherketone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the present invention relates to a laminate.
  • Copper foil used for printed wiring boards is required to have adhesion to an insulating resin base material.
  • a method has been used in which the surface of the copper foil is roughened by etching or the like to increase the mechanical adhesive force by the so-called anchor effect.
  • flattening of the copper foil surface has been required.
  • copper surface treatment methods such as performing an oxidation step and a reduction step have been developed (International Publication No. 2014/126193).
  • the copper foil is pre-conditioned and immersed in a chemical solution containing an oxidizing agent to oxidize the surface of the copper foil to form irregularities of copper oxide, and then immersed in a chemical solution containing a reducing agent to obtain copper oxide.
  • a chemical solution containing an oxidizing agent to oxidize the surface of the copper foil to form irregularities of copper oxide
  • a chemical solution containing a reducing agent to obtain copper oxide.
  • the unevenness of the surface is adjusted and the roughness of the surface is adjusted.
  • a method for improving the adhesion in the treatment of copper foil using oxidation / reduction a method of adding a surface active molecule in the oxidation step (Japanese Patent Laid-Open No. 2013-534054), an aminothiazole compound after the reduction step, etc.
  • Japanese Patent Laid-Open No. 8-97559 A method of forming a protective film on the surface of a copper foil using the above (Japanese Patent Laid-Open No. 8-97559) has been developed. Further, there is a method of roughening the surface of a copper conductor pattern on an insulating substrate to form a plating film having metal particles dispersedly distributed on the surface on which a copper oxide layer is formed (Japanese Patent Laid-Open No. 2000-151096). It is being developed.
  • An object of the present invention is to provide a novel laminate of a composite copper member and a resin base material.
  • the present invention includes the following embodiments: [1] A laminated body of a copper member having a plurality of fine protrusions on at least a part of the surface, wherein a resin base material having a dielectric constant of 3.8 or less is laminated on the surface. A laminate having a fractal dimension of 1.25 or more on the laminated surface of the copper member and the resin base material. [2] The laminate according to [1], wherein the fractal dimension of the laminate surface is larger than 1.4.
  • a metal layer other than copper is formed on the surface of at least a part of the copper member, and the metal other than copper is Sn, Ag, Zn, Al, Ti, Bi, Cr, Fe, Co, Ni.
  • the laminate according to [4], wherein the average thickness of the metal layer other than copper in the vertical direction is 10 nm or more and 150 nm or less.
  • SEM scanning electron microscope
  • Copper members include, but are not limited to, copper foils such as electrolytic copper foils and rolled copper foils, copper wires, copper plates, and copper lead frames.
  • a copper member is a member containing 50% by mass or more of Cu, that is, a material that becomes a part of a structure, and is a copper alloy (that is, white copper, brass, aluminum bronze, etc.) or a material coated with copper (for example, copper).
  • (Copper-plated iron) may be contained, but a material made of pure copper having a Cu purity of 99.9% by mass or more is preferable, and it is more preferably formed of tough pitch copper, deoxidized copper, and oxygen-free copper. It is more preferably formed of anoxic copper having an oxygen content of 0.001% by mass to 0.0005% by mass.
  • the resin base material is not particularly limited, but may contain a thermoplastic resin or a thermosetting resin, and specifically, polyethylene (PE), polypropylene (PP), polystyrene (PS), or polyvinyl chloride. Weight of (PVC), Polyvinyl acetate (PVAc), Polyethylene (PA), Polyacetal (POM), Polycarbonate (PC), Modified polyphenylene ether (m-PPE), Polyphenylene ether containing polystyrene polymer, Triallyl cyanurate Combined or copolymer, phenol-added butadiene polymer, diallyl phthalate, divinylbenzene, polyfunctional methacryloyl, unsaturated polyester, polybutadiene, styrene-butadiene, styrene-butadiene / styrene-butadiene crosslinked polymer, bismaleimide triazine (BT) ), Polyethylene terephthalate (PET), Glass fiber reinforced polyethylene
  • Condensate a polycondensate of parahydroxybenzoic acid and 2,6-hydroxynaphthoic acid, etc.
  • a substrate containing polyether ether ketone (PEEK), thermoplastic polyimide (PI), polyamideimide (PAI) and a mixture thereof.
  • PEEK polyether ether ketone
  • PI thermoplastic polyimide
  • PAI polyamideimide
  • the resin base material may further contain an inorganic filler or glass fiber.
  • the permittivity of such a resin base material can be measured by a known method, for example, IPC TM (The Institute for Interconnecting and Packaging Electronic Circuits Test Method) -650 2.5.5.5 or IPC TM-650 2.5.5.9. It can be measured according to the standard.
  • MEGTRON6 manufactured by Panasonic; dielectric constant 3.71 (1 GHz)
  • PPE polyphenylene ether
  • silica silica
  • glass fiber glass fiber
  • the laminated surface of the resin base material and the metal layer has a plurality of fine convex portions.
  • the shape of the convex portion can be defined as the fractal dimension or the radius of the inscribed circle at the tip of the convex portion.
  • the fractal dimension can be calculated as the fractal dimension of the curve in which the laminated surface appears in the cross-sectional image created by the focused ion beam (FIB) using a scanning electron microscope (SEM).
  • the fractal dimension can be calculated using the box counting method, but the calculation method is not limited to this.
  • the inscribed circle radius of the tip of the convex portion can be calculated by measuring the convex portion in the cross-sectional image created by the focused ion beam (FIB) using a scanning electron microscope (SEM).
  • the fractal dimension is an index showing the complexity of the shape, the degree of unevenness on the surface, and the like, and the larger the value of the fractal dimension, the more complicated the unevenness.
  • the fractal dimension by the box counting method is defined as: Assuming that the number of boxes required to cover a certain figure F with a square box having a side size of ⁇ is N ⁇ (F), the fractal dimension is defined by the following equation.
  • the cross section of the laminated body is divided by a grid of equidistant ⁇ s, and the number of boxes (that is, squares formed by the grid division) containing a curve in which the laminated surface appears is calculated for a plurality of ⁇ s. Count.
  • the size of ⁇ is plotted on the log-log graph with the number of boxes counted for each ⁇ as the vertical axis, and the fractal dimension can be obtained from the slope of the graph.
  • the contour of the fine convex portion obtained from the SEM cross-sectional image (magnification 30000 times, resolution 1024x768) is attached to a sheet having a resolution of 256, 128, 64, 32, 16 or 8 pixels, and the cell containing the contour is attached.
  • the logarithm of the pixel size is on the vertical axis
  • the logarithm of the number of cells is on the horizontal axis
  • the number of cells counted for each pixel size is plotted, an approximate straight line is created, and the fractal dimension value is calculated from the slope. ..
  • the value of the fractal dimension of the curve in which the laminated surface appears is 1.250 or more or greater than 1.250, or preferably 1.300 or more or greater than 1.300, and 1.350 or more or 1.350 or more. A value greater than 1.350 is more preferred, and a value greater than or equal to 1.400 or greater than 1.400 is even more preferred.
  • the surface of the copper member may contain a copper oxide layer containing copper (I) oxide and / or copper (II) oxide.
  • a copper oxide layer may be formed by an oxidation treatment, an oxidation dissolution treatment, an oxidation reduction treatment, or an oxidation dissolution reduction treatment.
  • the oxidation treatment includes a step of converting pure copper into copper (II) oxide with an oxidizing agent.
  • the dissolution treatment includes a step of dissolving copper (II) oxide oxidized by the oxidation treatment with a dissolving agent.
  • the reduction treatment includes a step of reducing copper (II) oxide oxidized by the oxidation treatment to copper (I) oxide or pure copper with a reducing agent.
  • the oxidation treatment, dissolution treatment, and reduction treatment may include a step of forming fine protrusions (that is, fine hairs) on the surface of the copper member and a step of adjusting the shape and number of the fine protrusions.
  • the plurality of fine protrusions on the laminated surface of the resin base material and the metal layer may be caused by the fine protrusions formed by these treatments.
  • a metal layer other than copper may be formed on the surface of at least a part of the copper member.
  • the metal layer is formed on at least a part of the surface of the copper oxide layer, and a resin base material having a dielectric constant of 3.8 or less is laminated on at least a part of the surface of the metal layer.
  • the type of metal constituting the metal layer is not particularly limited, but at least one metal selected from the group consisting of Sn, Ag, Zn, Al, Ti, Bi, Cr, Fe, Co, Ni, Pd, Au and Pt. Is preferable.
  • metals having higher heat resistance than copper such as Ni, Pd, Au and Pt, are preferable.
  • the average thickness of the metal layer in the vertical direction is not particularly limited, but is preferably 6 nm or more, and more preferably 10 nm or more, 14 nm or more, 18 nm or more, or 20 nm or more. However, if it is too thick, the fine protrusions on the surface of the composite copper member will be smoothed by leveling, the value of the fractal dimension will be small, and the adhesion will be reduced. Therefore, it is preferably 150 nm or less, preferably 100 nm or less, or It is more preferably 75 nm or less.
  • a copper member is dissolved in 12% nitrate, and the obtained liquid is measured for the concentration of a metal component using an ICP emission spectrometer 5100 SVDV ICP-OES (manufactured by Azilent Technology).
  • the thickness of the metal layer as a layer can be calculated by considering the density of the metal and the surface area of the metal layer.
  • the metal layer may be formed on the surface of the copper member by plating.
  • the plating method is not particularly limited, and examples thereof include electrolytic plating, electroless plating, vacuum vapor deposition, and chemical conversion treatment, but electrolytic plating is preferable.
  • the average height of the convex portion of the curve in which the laminated surface appears in the SEM cross-sectional image of the laminated body is preferably 10 nm or more, more preferably 50 nm or more, and more preferably 100 nm or more. It is more preferably 1000 nm or less, more preferably 500 nm or less, and even more preferably 200 nm or less.
  • the height of the convex portion is, for example, the distance between the midpoint of the line segment connecting the minimum points of the concave portions adjacent to each other across the convex portion and the maximum point of the convex portion between the concave portions in the SEM cross-sectional image. can do.
  • the number of convex portions having a height of 50 nm or more on the curve in which the laminated surface appears in the SEM cross-sectional image of the laminated body is 25, 30 or 35 or more on average per 3.78 ⁇ m in cross-sectional width. You may. Alternatively, there may be an average of 6, 10 or 12 or more convex portions having a height of 100 nm or more per 3.78 ⁇ m cross-sectional width. Alternatively, there may be two or three or more convex portions having a height of 150 nm or more per 3.78 ⁇ m cross-sectional width.
  • the skin effect is a phenomenon in which the current flowing through a conductor concentrates on the surface of the conductor as the frequency increases, and the internal current density decreases.
  • the thickness of the epidermis (epidermis depth) through which current flows is inversely proportional to the square root of frequency. Due to this skin effect phenomenon, when a high-frequency signal having a frequency in the GHz band is transmitted to a conductor circuit, the skin depth becomes about 2 ⁇ m or less, and current flows only on the very surface layer of the conductor.
  • the convex portion on the surface of the copper member is large, the transmission path of the conductor formed by the copper member becomes long due to the influence of the skin effect phenomenon, and the transmission loss increases. Therefore, it is desirable that the convex portion on the surface of the copper member used in the high frequency circuit is small, but if it is too small, sufficient peel strength cannot be obtained, so that the convex portion having the above degree is preferable.
  • the radius of the inscribed circle at the tip of the convex portion can be used as an index of the thickness of the convex portion.
  • the inscribed circle radius of the tip of the fine convex portion here is parallel to the maximum point a of the convex portion having a height of 10 nm or more and the tangent line at the maximum point a of the convex portion in the SEM cross-sectional image. It is defined as the radius of a circle whose outer circumference is three points b and c, which are the intersections of a straight line 10 nm apart from each other and the outer peripheral portion of the convex portion (FIG. 2A). The larger the inscribed circle radius, the thicker the tip of the convex portion, and the smaller the inscribed circle radius, the thinner the tip of the convex portion.
  • the cohesive fracture is a state in which the resin is attached to about half or more of the area when observing the copper side of the peeled surface.
  • the deterioration rate of the laminated body in the heat resistance test may be 50% or less, but is preferably 40% or less, 30% or less, or 20% or less.
  • the deterioration rate in the heat resistance test can be measured by a known method.
  • the peel strength before and after the heat resistance test can be measured, and the difference in peel strength can be expressed as a ratio divided by the peel strength before the heat resistance test.
  • a heat resistance test for example, it can be measured according to a standard such as IPCTM-650 2.4.8.
  • One embodiment of the present invention is a method for producing a laminate, in which a first step of forming a convex portion on the surface of a copper member and a resin group on the copper surface on which the convex portion is formed or a plated surface.
  • This is a method for producing a laminate, which comprises a third step of heating and adhering the materials.
  • This manufacturing method may include a second step of plating the copper surface on which the convex portion is formed after the first step.
  • the copper surface is oxidized with an oxidizing agent to form a copper oxide layer and a convex portion on the surface.
  • a roughening treatment step such as etching is not necessary, but it may be performed.
  • Alkaline treatment may be performed to prevent acid from being brought into the degreasing cleaning or oxidation process.
  • the method of alkaline treatment is not particularly limited, but is preferably 0.1 to 10 g / L, more preferably 1 to 2 g / L in an alkaline aqueous solution, for example, a sodium hydroxide aqueous solution at 30 to 50 ° C. for 0.5 to 2 minutes. It should be processed to some extent.
  • the oxidizing agent is not particularly limited, and for example, an aqueous solution of sodium chlorite, sodium hypochlorite, potassium chlorate, potassium perchlorate or the like can be used.
  • Various additives for example, phosphates such as trisodium phosphate dodecahydrate
  • surface active molecules include porphyrin, porphyrin-membered ring, expanded porphyrin, ring-reduced porphyrin, linear porphyrin polymer, porphyrin sandwich coordination complex, porphyrin sequence, silane, tetraorgano-silane, aminoethyl-aminopropyl-trimethoxysilane.
  • (3-Aminopropyl) trimethoxysilane (1- [3- (trimethoxysilyl) propyl] urea) ((l- [3- (Trimethoxysilyl) propyl] urea)), (3-aminopropyl) triethoxy Silane, ((3-glycidyloxypropyl) trimethoxysilane), (3-chloropropyl) trimethoxysilane, (3-glycidyloxypropyl) trimethoxysilane, dimethyldichlorosilane, 3- (trimethoxysilyl) propylmethacrylate, Ethyltriacetoxysilane, triethoxy (isobutyl) silane, triethoxy (octyl) silane, tris (2-methoxyethoxy) (vinyl) silane, chlorotrimethylsilane, methyltrichlorosilane, silicon tetrachloride,
  • the oxidation reaction conditions are not particularly limited, but the liquid temperature of the oxidizing agent is preferably 40 to 95 ° C, more preferably 45 to 80 ° C.
  • the reaction time is preferably 0.5 to 30 minutes, more preferably 1 to 10 minutes.
  • the surface of the oxidized copper member may be dissolved with a dissolving agent to adjust the uneven portion of the surface of the oxidized copper member.
  • the solubilizer used in this step is not particularly limited, but a chelating agent, particularly a biodegradable chelating agent, is preferable, and ethylenediaminetetraacetic acid, diethanolglycine, L-glutamate diacetic acid / tetrasodium, ethylenediamine-N, N'- Examples include disuccinic acid, 3-hydroxy-2, 2'-sodium iminodiacetic acid, methylglycine diacetate 3 sodium, aspartate diacetate 4 sodium, N- (2-hydroxyethyl) iminodiacetic acid disodium, sodium gluconate, etc. it can.
  • the pH of the solubilizer is not particularly limited, but is preferably alkaline, more preferably 8 to 10.5, still more preferably 9.0 to 10.5, and pH 9.8 to 10.2. Is more preferable.
  • the copper oxide layer formed on the copper member may be reduced by using a chemical solution containing a reducing agent (chemical solution for reduction) to adjust the number and height of the convex portions.
  • a chemical solution containing a reducing agent chemical solution for reduction
  • DMAB dimethylamine borane
  • diborane sodium borohydride
  • hydrazine hydrazine
  • the chemical solution for reduction is a liquid containing a reducing agent, an alkaline compound (sodium hydroxide, potassium hydroxide, etc.), and a solvent (pure water, etc.).
  • a composite copper member is manufactured by plating a copper oxide layer having a convex portion with a metal other than copper.
  • a plating treatment method a known technique can be used.
  • a metal other than copper Sn, Ag, Zn, Al, Ti, Bi, Cr, Fe, Co, Ni, Pd, Au, Pt, or Various alloys can be used.
  • the plating process is not particularly limited, and plating can be performed by electroplating, electroless plating, vacuum deposition, chemical conversion treatment, or the like.
  • electroless nickel plating it is preferable to perform treatment using a catalyst.
  • a catalyst iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium, iridium and salts thereof are preferably used.
  • a uniform metal layer in which particles are not scattered can be obtained.
  • the heat resistance of the composite copper member is improved.
  • the reducing agent in which copper, copper (I) oxide and copper (II) oxide do not have catalytic activity include hypophosphates such as sodium hypophosphite.
  • the composite copper member produced in these steps may be optionally subjected to a coupling treatment using a silane coupling agent or the like or a rust preventive treatment using benzotriazoles or the like.
  • a resin base material is laminated on a copper oxide layer having a convex portion formed in the first step or a plating layer of a copper member plated in the second step to produce a laminate.
  • the method for producing the laminate is not particularly limited, and a known method can be used, for example, vacuum heating and crimping using a vacuum press.
  • the press pressure, temperature, and press time are appropriately changed depending on the resin base material used. For example, in the case of MEGTRON6 (Panasonic Corporation) containing PPE resin as the resin base material, heat crimping is performed at 0.49 MPa until the temperature reaches 110 ° C.
  • the uneven portion has an uneven shape that can withstand the temperature at the time of pressing and can exhibit sufficient peel strength even after lamination.
  • the copper member used in the laminated body may be wired in a pattern by a known method (for example, etching).
  • the laminate according to the present invention may be used in the production of a printed wiring board, or may be used in the production of an electronic component including a printed wiring board and electronic components.
  • the printed wiring board produced by using this laminated body is particularly suitable as a substrate for a high frequency band having a signal frequency of 1 GHz or more. Further, since this laminated body has an uneven shape on the laminated surface, it has excellent adhesion and is also suitable for a flexible substrate.
  • Example 1 and Comparative Example 1 MEGTRON6 (prepreg R5670KJ, manufactured by Panasonic, dielectric constant 3.71 (1 GHz), thickness 100 ⁇ m) was laminated on each copper foil. A laminated body was obtained by heat-pressing under the conditions of a press pressure of 2.9 MPa, a temperature of 210 ° C., and a press time of 120 minutes using a vacuum high-pressure press machine.
  • a PTFE base material NX9255, manufactured by Park Electrochemical Co., Ltd., dielectric constant 2.55 (10 GHz), thickness 0.762 mm
  • Example 2 and Comparative Example 2 a PTFE base material (NX9255, manufactured by Park Electrochemical Co., Ltd., dielectric constant 2.55 (10 GHz), thickness 0.762 mm) was laminated on each copper foil, and a vacuum high-pressure press was applied.
  • a laminate was obtained by heat-pressing under the conditions of a press pressure of 1.5 MPa, a temperature of 385 ° C., and a press time of 10 minutes using a machine.
  • a plurality of test pieces were prepared under the same conditions.
  • Method The cross sections of the obtained laminates (Examples 1 and 2; Comparative Examples 1 and 2) were obtained by FIB (focused ion beam) processing under the conditions of an accelerating voltage of 30 kV and a probe current of 4 nA.
  • FIB focused ion beam scanning electron microscope
  • the obtained cross section was observed under the conditions of a magnification of 30,000 times and a resolution of 1024x768, and an SEM cross section image was acquired.
  • the obtained SEM cross-sectional image is shown in FIG.
  • Method The peel strength of the laminates of Examples 1 and 2 and Comparative Examples 1 and 2 was measured according to a 90 ° peeling test (Japanese Industrial Standards (JIS) C5016).
  • Method The peel strength of the laminates of Example 1 and Comparative Example 1 was measured before and after the heat resistance test. The heat resistance test was carried out by baking at 125 ° C. for 4 hours and then floating in a solder bath at 288 ° C. for 10 seconds (IPC TM-650 2.4.8 compliant). The ratio was calculated by dividing the difference in peel strength before and after the heat resistance test by the peel strength before the heat resistance test.
  • High frequency characteristics > 1.
  • MEGTRON6 prepreg R5670KJ, manufactured by Panasonic, thickness 100 ⁇ m
  • the transmission characteristics were evaluated using a known stripline resonator method suitable for measurement in the 0 to 50 GHz band. Specifically, the S21 parameter was measured under the following conditions without a coverlay film. Measurement conditions: Microstrip structure; Base material MEGTRON6; Circuit length 150 mm; Conductor width 250 ⁇ m; Conductor thickness 18 ⁇ m; Base material thickness 100 ⁇ m; Characteristic impedance 50 ⁇
  • the copper foil FV-WS used in Comparative Example 3 has low roughness and is a copper foil for high frequency substrates that requires low transmission loss for information communication equipment such as high-end routers and servers and antenna substrates for communication base stations. However, the transmission loss of Example 1 is smaller than that of Comparative Example 3. As described above, the laminate according to the present invention is excellent in high frequency characteristics.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention a pour objet de fournir un nouveau stratifié d'un élément en cuivre composite et d'un substrat de résine. Plus précisément, l'invention fournit un stratifié dans lequel le substrat de résine de constante diélectrique inférieure ou égale à 3,8, est stratifié sur la surface de l'élément en cuivre possédant une pluralité de fines parties relief au moins sur une partie de ladite surface. La dimension fractale d'une face de stratification dudit élément en cuivre et dudit substrat de résine, est supérieure ou égale à 1,25.
PCT/JP2020/018582 2019-05-09 2020-05-07 Stratifié WO2020226162A1 (fr)

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KR1020217026954A KR20220007038A (ko) 2019-05-09 2020-05-07 적층체
CN202080027107.9A CN113677519A (zh) 2019-05-09 2020-05-07 叠层体

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JP2019089122A JP7328671B2 (ja) 2019-05-09 2019-05-09 積層体
JP2019-089122 2019-05-09

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WO2020226162A1 true WO2020226162A1 (fr) 2020-11-12

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JP (1) JP7328671B2 (fr)
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CN (1) CN113677519A (fr)
TW (1) TW202043034A (fr)
WO (1) WO2020226162A1 (fr)

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JP2009006557A (ja) * 2007-06-27 2009-01-15 Fujifilm Corp 金属表面粗化層を有する金属層積層体及びその製造方法
WO2017170781A1 (fr) * 2016-03-30 2017-10-05 旭化成株式会社 Film composite de résine comprenant une couche de microfibres de cellulose

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