WO2020215973A1

WO2020215973A1 - Chip assembly and mobile terminal

Info

Publication number: WO2020215973A1
Application number: PCT/CN2020/081309
Authority: WO
Inventors: 杨子东
Original assignee: 维沃移动通信有限公司
Priority date: 2019-04-24
Filing date: 2020-03-26
Publication date: 2020-10-29
Also published as: CN110087445A

Abstract

Provided in embodiments of the present disclosure are a chip assembly and a mobile terminal, the chip assembly comprising: a motherboard; a chip module, which comprises a chip, a circuit board and a reinforcing shielding plate, wherein the chip is arranged on the circuit board, the circuit board is arranged on the reinforcing shielding plate, the reinforcing shielding plate is grounded to the motherboard, and a device installation space is formed between the reinforcing shielding plate and the motherboard; and a motherboard device, which is installed in the device installation space.

Description

Chip components and mobile terminals

Cross references to related applications

This application claims the priority of Chinese Patent Application No. 201910335070.5 filed in China on April 24, 2019, the entire content of which is incorporated herein by reference.

Technical field

The present disclosure relates to the field of communication technology, and in particular to a chip assembly and a mobile terminal.

Background technique

With the rapid development of the mobile terminal industry, the performance of the mobile terminal continues to improve, and its integrated functions are becoming more and more diversified, which poses a greater challenge to the internal space of the mobile terminal.

Take the fingerprint module as an example. The fingerprint module mainly includes a fingerprint chip, a fingerprint circuit board, and a reinforcement board. The fingerprint circuit board is arranged between the fingerprint chip and the reinforcement board. The reinforcement board is conductive to the main board shielding cover through conductive foam. The main board shielding cover is arranged on the main board of the mobile terminal to realize the shielding function.

However, when the above structure is adopted, the space occupied by the reinforcement plate, the conductive foam and the main board shielding cover is relatively large, which makes the structural design of the mobile terminal difficult. At the same time, when the reinforcing plate is electrically connected to the main board shielding cover through the conductive foam and is grounded, the conductive foam may have a certain blocking effect, resulting in poor grounding of the fingerprint chip.

Summary of the invention

The present disclosure provides a chip assembly and a mobile terminal to solve the problems of difficulty in structural design of the mobile terminal and poor grounding effect of the chip.

In order to solve the above problems, the present disclosure adopts the following technical solutions:

A chip assembly including:

Motherboard

A chip module, the chip module includes a chip, a circuit board, and a reinforcing shielding board, the chip is arranged on the circuit board, the circuit board is arranged on the reinforcing shielding board, and the reinforcing shield The board is grounded to the main board, and a device installation space is formed between the reinforced shielding board and the main board;

A motherboard device, the motherboard device is installed in the device installation space.

A mobile terminal includes the above chip assembly.

The technical solution adopted by the present disclosure can achieve the following beneficial effects:

In the chip assembly provided by the present disclosure, the chip module includes a chip, a circuit board, and a reinforced shielding plate. The reinforced shielding plate can realize the reinforcement of the chip and the circuit board on the one hand, and can be grounded with the main board on the other hand, so as The motherboard components installed on the motherboard play a shielding role, so there is no need to additionally provide a shielding cover on the motherboard, and the conductive foam between the reinforcing shielding plate and the shielding cover can also be omitted. It can be seen that the space occupied by the chip module and the motherboard after stacking is small, which makes it easier to arrange other devices in the mobile terminal, thereby reducing the difficulty of structural design of the mobile terminal. At the same time, the chip is directly grounded through the reinforced shield plate, which has a better grounding effect.

Description of the drawings

The drawings described here are used to provide a further understanding of the present disclosure and constitute a part of the present disclosure. The exemplary embodiments of the present disclosure and their descriptions are used to explain the present disclosure, and do not constitute an improper limitation of the present disclosure. In the attached picture:

FIG. 1 is a cross-sectional view of a chip assembly disclosed in an embodiment of the disclosure;

2 is a cross-sectional view of the chip module in the chip assembly disclosed in the embodiment of the disclosure;

3 is a top view of the chip module in the chip assembly disclosed in the embodiment of the disclosure;

4 is a cross-sectional view of a chip assembly disclosed in another embodiment of the disclosure.

Description of reference signs:

100-motherboard, 200-chip module, 201-device installation space, 210-chip, 220-circuit board, 230-reinforced shielding plate, 231-top plate, 232-ring side plate, 233-fastening hole, 234- Extension board, 300-motherboard device.

Detailed ways

In order to make the objectives, technical solutions, and advantages of the present disclosure clearer, the technical solutions of the present disclosure will be described clearly and completely in conjunction with specific embodiments of the present disclosure and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present disclosure.

The technical solutions disclosed in each embodiment of the present disclosure will be described in detail below with reference to the accompanying drawings.

As shown in Figures 1 to 3, the embodiments of the present disclosure disclose a mobile terminal, which includes a housing (not shown in the figure) and a chip assembly. The chip assembly can be installed in the housing as a whole or partly in the housing. in vivo. In the embodiment of the present disclosure, the chip assembly may specifically include a motherboard 100, a chip module 200, and a motherboard device 300. The main board 100 and the main board device 300 are both installed in the casing, and the main board device 300 is installed on the main board 100. The main board device 300 can be electrically connected to the main board 100, so that the main board 100 can supply power to the main board device 300 and can also control the working state of the main board device 300. Specifically, the motherboard device 300 may be a processor, a controller, a sensor, and so on.

The chip module 200 may be entirely located in the housing, or part of it may be located in the housing. The chip module 200 may include a chip 210, a circuit board 220, and a reinforcing shield plate 230. Among them, the chip 210 is the core device of the entire chip module 200, which is used to perform corresponding functions; the circuit board 220 is used to supply power to the chip 210 and control the working state of the chip 210; the reinforcing shielding board 230 can realize the chip 210 With the reinforcement of the circuit board 220, the entire chip module 200 has sufficient rigidity to facilitate the installation of the chip module 200. Therefore, the chip 210 is disposed on the circuit board 220, and the circuit board 220 is disposed on the reinforced shielding plate 230. At the same time, the reinforced shield plate 230 is grounded to the main board 100, that is, the reinforced shield plate 230 is connected to the main board 100, so that the reinforced shield plate 230 is grounded through the main board 100. A device installation space 201 is formed between the reinforcing shield plate 230 and the main board 100, and the main board device 300 is installed in the device installation space 201. That is, the reinforced shielding plate 230 covers the main board device 300, and then plays a role of signal shielding. In order to improve the shielding effect of the reinforced shielding plate 230 and the supporting effect for the chip 210 and the circuit board 220, the reinforced shielding plate 230 may be configured as a steel sheet.

It should be noted that there are usually multiple motherboard devices 300 installed on the motherboard 100. The motherboard device 300 located in the device installation space 201 described above may be one or more than one, and is protected by the reinforced shielding plate 230. The specific type and quantity of the main board device 300 to be covered can be flexibly selected according to actual needs.

In addition, the chip module 200 in the embodiment of the present disclosure may be any kind of functional module including the above-mentioned chip 210, the circuit board 220, and the reinforcing shield plate 230. In a specific embodiment, the chip module 200 may be a fingerprint module, and in the fingerprint module, the circuit board 220 may be a flexible printed circuit (FPC).

In the embodiment of the present disclosure, the reinforced shielding plate 230 can realize the reinforcement of the chip 210 and the circuit board 220 on the one hand, and can be grounded to the main board 100 on the other hand, thereby shielding the main board device 300 installed on the main board 100. Therefore, there is no need to additionally provide a shielding cover on the main board 100, and at the same time, the conductive foam between the reinforcing shielding plate 230 and the shielding cover can be omitted. It can be seen that the space occupied by the chip module 200 and the motherboard 100 after stacking is small, making it easier to arrange other devices in the mobile terminal, thereby reducing the difficulty of structural design of the mobile terminal, and reducing the cost of the mobile terminal. At the same time, the chip 210 is directly grounded through the reinforced shielding plate 230, which has a better grounding effect, thereby improving the Electro-Static Discharge (ESD) performance of the mobile terminal.

In order to improve the shielding effect, the reinforced shielding plate 230 may include a top plate 231 and an annular side plate 232, the annular side plate 232 is connected to the edge of the top plate 231, and the annular side plate 232 surrounds the top plate 231, and the top plate 231 is connected to the The main board 100 is connected. The top plate 231 may be configured as a flat plate to better support the chip 210 and the circuit board 220. After such a reinforced shielding plate 230 is connected to the main board 100, an almost enclosed device installation space 201 can be formed, so that the shielding effect can be better played. At the same time, such a reinforced shielding plate 230 can prevent impurities such as liquid and dust in the external environment from entering the device installation space 201, thereby better protecting the motherboard 100 and the motherboard device 300.

In an optional embodiment, in order to simplify the connection process between the reinforced shield plate 230 and the main board 100 and at the same time improve the connection strength between the two, the reinforced shield plate 230 may be welded to the main board 100. Optionally, the main board 100 is provided with a plurality of grounding pins, and there is a certain interval between the plurality of grounding pins; correspondingly, the reinforced shielding plate 230 is provided with a plurality of welding parts, and there is a certain interval between the plurality of welding parts. interval. It should be noted that the welding portion here may protrude relative to other parts of the reinforced shield plate 230, or may be flush with other parts of the reinforced shield plate 230, that is, the reinforced shield plate 230 faces the main board 100. One side can be flat or curved. The multiple welding parts are welded to the multiple grounding pins in one-to-one correspondence, and then multiple solder joints are formed between the reinforced shielding plate 230 and the main board 100. On the one hand, the connection strength between the two can be ensured, and on the other hand, The welding area between the two is controlled to prevent the main board 100 and the main board device 300 from being damaged due to high temperature welding.

Further, when the reinforced shielding plate 230 includes a top plate 231 and a ring-shaped side plate 232, the ring-shaped side plate 232 may be arranged in a columnar structure, and the ring-shaped side plate 232 is vertically connected to the edge of the top plate 231 and surrounds the top plate 231. The side of the board 232 facing the main board 100 is provided with the aforementioned soldering portion. For example, the cross-sectional shape of the annular side plate 232 (that is, the cross-section parallel to the main board 100) can be square, circular, elliptical, triangular, etc. The specific shape can be selected according to requirements, which is not limited herein. Such a ring-shaped side plate 232 occupies a relatively small space on the main board 100, which is more convenient for the arrangement of components on the main board 100.

As shown in FIG. 4, in another optional embodiment, the chip module 200 further includes a fastener (not shown in the figure), the reinforcing shield plate 230 has a fastening hole 233, and the fastener is connected to the fastening hole 233. The fixing hole 233 is matched, and the reinforcing shield plate 230 is detachably connected to the main board 100 through the fastener. The fastener here may be a threaded fastener, and specifically may be a structure such as a screw, a stud, or a screw assembly. When the reinforcing shield plate 230 and the main board 100 are detachably connected, the reinforcing shield plate 230 and the main board 100 can be disassembled and assembled multiple times, so this structure facilitates the maintenance of the chip module 200, the main board 100 and the main board device 300.

When the reinforced shielding plate 230 includes the above-mentioned annular side plate 232, and the annular side plate 232 has a columnar structure, the fastening hole 233 can be opened on the side of the annular side plate 232 facing the main board 100, and one end of the fastener It can pass through the main board 100 and be screwed with the fastening hole 233 to realize the connection between the main board 100 and the reinforced shield plate 230. If this structure is adopted, the fasteners need to penetrate the main board 100, which threatens the structural strength of the main board 100. To this end, an extension plate 234 may be provided at the edge of the reinforced shielding plate 230, the extension plate 234 extends in a direction parallel to the main board 100, and the extension plate 234 defines the above-mentioned fastening hole 233. When the reinforced shielding plate 230 includes the annular side plate 232 described above, the extension plate 234 here may be formed to extend from the annular side plate 232 toward the main board 100. After adopting this structure, one end of the fastener passes through the fastening hole 233 and is connected to the main board 100. The fastener does not need to penetrate the main board 100, so the structural strength of the main board 100 can be guaranteed.

It should be noted that the above-mentioned extension plate 234 may be an annular plate, and the annular plate surrounds the annular side plate 232 at this time; the extension plate 234 may also be a structure extending from a part of the annular side plate 232.

When the reinforced shield plate 230 is connected to the main board 100 by fasteners, the ground connection between the reinforced shield plate 230 and the main board 100 can be realized by an additional structure, for example, can be realized by inserting pins. However, this solution separates the detachable connection and ground connection of the reinforced shielding plate 230 and the main board 100, resulting in an overly complicated structure of the mobile terminal. In order to solve this problem, the fasteners can be arranged as conductive parts, and the reinforced shield plate 230 is grounded to the main board 100 through the fasteners. That is, the fastener can not only realize the detachable connection between the reinforced shield plate 230 and the main board 100, but also can realize the ground connection between the reinforced shield plate 230 and the main board 100, making the structure of the mobile terminal simpler and more compact.

The mobile terminal disclosed in the embodiments of the present disclosure may be a smart phone, a tablet computer, an e-book reader or a wearable device. Of course, the mobile terminal may also be other devices, which is not limited in the embodiments of the present disclosure.

The above embodiments of the present disclosure focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the conciseness of the text, here is No longer.

The foregoing descriptions are merely embodiments of the present disclosure, and are not used to limit the present disclosure. For those skilled in the art, the present disclosure can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure should be included in the scope of the claims of the present disclosure.

Claims

A chip assembly including:

Motherboard

A chip module, the chip module includes a chip, a circuit board, and a reinforcing shielding board, the chip is arranged on the circuit board, the circuit board is arranged on the reinforcing shielding board, and the reinforcing shield The board is grounded to the main board, and a device installation space is formed between the reinforced shielding board and the main board;

A motherboard device, the motherboard device is installed in the device installation space.
The chip assembly of claim 1, wherein the chip module is a fingerprint module.
The chip assembly according to claim 1, wherein the reinforcing shield plate comprises a top plate and a ring-shaped side plate, the ring-shaped side plate is connected at an edge of the top plate, and the ring-shaped side plate surrounds the top plate, The top plate is connected to the main board through the annular side plate.
The chip assembly of claim 1, wherein the reinforcing shield plate is soldered to the main board.
The chip assembly according to claim 4, wherein the main board is provided with a plurality of ground soldering feet, the reinforcing shield plate is provided with a plurality of soldering parts, and the plurality of soldering parts are connected to the plurality of ground soldering feet. Weld in one-to-one correspondence.
The chip assembly according to claim 5, wherein the reinforced shield plate comprises a top plate and a ring-shaped side plate, the ring-shaped side plate is a columnar structure, and the ring-shaped side plate is vertically connected to the edge of the top plate, and The annular side plate surrounds the top plate, and the side of the annular side plate facing the main board is provided with the welding part.
The chip assembly according to claim 1, wherein the chip module further comprises a fastener, the reinforcing shield plate is provided with a fastening hole, the fastener is matched with the fastening hole, and the patch The strong shielding board is detachably connected to the main board through the fastener.
8. The chip assembly according to claim 7, wherein an extension plate is provided at an edge of the reinforced shielding plate, the extension direction of the extension plate is parallel to the main board, and the extension plate defines the fastening hole.
8. The chip assembly according to claim 7, wherein the fastener is a conductive element, and the reinforced shielding plate is grounded to the main board through the fastener.
9. The chip assembly of any one of claims 1-9, wherein the reinforced shielding plate is a steel sheet.
A mobile terminal, comprising the chip assembly according to any one of claims 1-10.