KR19980032665U - Grounding device - Google Patents
Grounding device Download PDFInfo
- Publication number
- KR19980032665U KR19980032665U KR2019960045550U KR19960045550U KR19980032665U KR 19980032665 U KR19980032665 U KR 19980032665U KR 2019960045550 U KR2019960045550 U KR 2019960045550U KR 19960045550 U KR19960045550 U KR 19960045550U KR 19980032665 U KR19980032665 U KR 19980032665U
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- grounding device
- present
- shield plate
- Prior art date
Links
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
본 고안은 메인 샤시에 인쇄회로기판을 그라운딩(GROUNDING) 시키는 접지 장치에 관한 것이으로서,The present invention relates to a grounding device that grounds a printed circuit board to the main chassis.
메인 샤시(13)에 접지된 쉴드 플레이트(11)와, 상기 쉴드 플레이트(11)를 인쇄회로기판(15)에 장착시키는 나사(19)로 구성되는 것을 특징으로 한다.A shield plate 11 grounded to the main chassis 13 and a screw 19 for mounting the shield plate 11 to the printed circuit board 15 are characterized in that the configuration.
이것에 의해, 인쇄회로기판의 접지가 잘 이루어져 인쇄회로기판에서 발생하는 EMI의 패스가 극대화되는 효과가 있다.As a result, the grounding of the printed circuit board is well performed, thereby maximizing the EMI pass generated in the printed circuit board.
Description
본 고안은 메인 샤시에 인쇄회로기판을 그라운딩(GROUNDING) 시키는 접지 장치에 관한 것이며, 보다 상세히는 신호입력단자에 일단이 메인 샤시에 접지된 쉴드 플레이트가 나사에 의해 고정되는 접지 장치에 관한 것이다.The present invention relates to a grounding device for grounding a printed circuit board (GROUNDING) to the main chassis, and more particularly to a grounding device is fixed to the shield plate grounded on the main chassis to the signal input terminal by screws.
종래의 경우를 도 1을 참조하여 설명하면, 도 1은 종래의 모니터를 도시한 분해 사시도로서, 인쇄회로기판(5)을 접지지시는 종래의 접지 장치는 EMI용 와이어(1)로서, 인쇄회로기판(5)의 리어 부분과 상기 인쇄회로기판(5)이 장착되는 메인 샤시(3)를 연결하여 상기 인쇄회로기판(3)을 접지시켰다.1 is an exploded perspective view of a conventional monitor, and a conventional grounding device for grounding the printed circuit board 5 is a EMI wire 1, which is a printed circuit. The printed circuit board 3 is grounded by connecting the rear portion of the substrate 5 and the main chassis 3 on which the printed circuit board 5 is mounted.
그러나, 상기와 같은 종래의 접지 장치는 인쇄회로기판을 잘 접지시키지 못하는 문제점이 있었다.However, the conventional grounding device as described above has a problem in that the printed circuit board is not well grounded.
따라서, 본 고안은 상술한 종래의 문제점을 극복하기 위한 것으로서, 본 고안의 목적은 그라운딩 효과를 극대화 시킬 수 있는 접지 장치를 제공하는데 있다.Accordingly, the present invention is to overcome the above-mentioned problems, the object of the present invention is to provide a grounding device that can maximize the grounding effect.
상기 본 고안의 목적을 달성하기 위한 접지 장치의 일예로서, 메인 샤시에 접지된 쉴드 플레이트와, 상기 쉴드 플레이트를 인쇄회로기판에 장착시키는 나사로 구성되는 것을 특징으로 한다.As an example of a grounding device for achieving the object of the present invention, it is characterized in that it is composed of a shield plate grounded in the main chassis, and a screw for mounting the shield plate on a printed circuit board.
이러한 구성에 의해, 인쇄회로기판의 접지가 잘 이루어져 인쇄회로기판에서 발생하는 EMI의 패스가 극대화된다.By such a configuration, the printed circuit board is well grounded, thereby maximizing the EMI pass generated in the printed circuit board.
도 1은 종래의 모니터를 도시한 분해 사시도1 is an exploded perspective view showing a conventional monitor
도 2는 본 고안에 따른 접지 장치에 의해 인쇄회로기판이 모니터에 접지되는 상태를 도시한 측면도Figure 2 is a side view showing a state in which the printed circuit board is grounded to the monitor by the grounding device according to the present invention
도 3은 본 고안에 다른 쉴드 플레이트를 도시한 사시도3 is a perspective view showing another shield plate in the present invention
〈도면의 주요 부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
1 : EMI용 와이어 3 : 인쇄회로기판1: EMI wire 3: printed circuit board
5 : 메인 샤시 10 : 접지 장치5: main chassis 10: grounding device
11 : 쉴드 플레이트 13 : 메인 샤시11: shield plate 13: main chassis
15 : 인쇄회로기판 17 : 신호입력단자15: printed circuit board 17: signal input terminal
19 : 나사 21 : 바디19: screw 21: body
23 : 장착부 25 : 구멍23: mounting portion 25: hole
이하, 본 고안의 실시예를 도 2 및 도 3을 참조하여 상세히 설명하기로 한다. 본 고안에 따른 접지 장치(10)는 메인 샤시(13)에 접지된 쉴드 플레이트(11)가 나사(19)에 의해 인쇄회로기판(15)에 장착된 신호입력단자(17)에 접속되어, 인쇄회로기판(15)에서 발생하는 EMI(ELECTROMAGNETIC INTERFERENCE)를 패스시킨다.Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 2 and 3. In the grounding device 10 according to the present invention, the shield plate 11 grounded on the main chassis 13 is connected to the signal input terminal 17 mounted on the printed circuit board 15 by screws 19, thereby printing. EMI (ELECTROMAGNETIC INTERFERENCE) generated in the circuit board 15 is passed.
상기 쉴드 플레이트(11)는 표면이 금속제로 도포되어 있으며, 메인 샤시(13)에 장착되는 갈쿠리 형상의 바디(21)와, 상기 바디(210에서 굴절되며 나사(19)가 끼워지는 2 개의 구멍(25)이 형성된 장착부(23)로 구성된다.The shield plate 11 is coated on a metal surface, and has a cork-shaped body 21 mounted on the main chassis 13, and two holes refracted by the body 210 and fitted with screws 19. 25 is formed of a mounting portion 23 formed.
상술한 바와 같이 본 고안에 따른 접지 장치는 인쇄회로기판의 접지가 잘 이루어져 인쇄회로기판에서 발생하는 EMI의 패스가 극대화되는 효과가 있다.As described above, the grounding device according to the present invention has the effect of maximizing the path of the EMI generated in the printed circuit board because the ground of the printed circuit board is well.
이상에서 설명한 것은 본 고안에 따른 접지 장치를 실시하기 위한 하나의 실시예에 불과한 것으로서, 본 고안은 상기한 실시예에 한정되지 않고, 이하의 실용신안등록청구의 범위에서 청구하는 본 고안의 요지를 벗어남이 없이 당해 고안이 속하는 분야에서 통상의 지식을 가진자라면 누구든지 다양한 변경 실시가 가능할 것이다.What has been described above is just one embodiment for implementing the grounding device according to the present invention, the present invention is not limited to the above embodiment, the subject matter of the present invention claimed in the following utility model registration claims Various changes can be made by those skilled in the art without departing from the scope of the present invention.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960045550U KR19980032665U (en) | 1996-12-04 | 1996-12-04 | Grounding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960045550U KR19980032665U (en) | 1996-12-04 | 1996-12-04 | Grounding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980032665U true KR19980032665U (en) | 1998-09-05 |
Family
ID=53987206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960045550U KR19980032665U (en) | 1996-12-04 | 1996-12-04 | Grounding device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19980032665U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110087445A (en) * | 2019-04-24 | 2019-08-02 | 维沃移动通信有限公司 | Chip assembly and mobile terminal |
-
1996
- 1996-12-04 KR KR2019960045550U patent/KR19980032665U/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110087445A (en) * | 2019-04-24 | 2019-08-02 | 维沃移动通信有限公司 | Chip assembly and mobile terminal |
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| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |