KR920002935Y1 - Power amp shield case for high frequency - Google Patents
Power amp shield case for high frequency Download PDFInfo
- Publication number
- KR920002935Y1 KR920002935Y1 KR9200682U KR920000682U KR920002935Y1 KR 920002935 Y1 KR920002935 Y1 KR 920002935Y1 KR 9200682 U KR9200682 U KR 9200682U KR 920000682 U KR920000682 U KR 920000682U KR 920002935 Y1 KR920002935 Y1 KR 920002935Y1
- Authority
- KR
- South Korea
- Prior art keywords
- shield case
- cover
- high frequency
- power amplifier
- amplifier module
- Prior art date
Links
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 1
- 230000007257 malfunction Effects 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 일실시예 구성도.1 is a configuration diagram of an embodiment of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 실드 케이스 밑판 1a, 1a' : 결합용 돌출부1: Shield case base plate 1a, 1a ': Combination protrusion
2 : 실드케이스 덮개 2a, 2a' : 결합용 삽입홈2: shield case cover 2a, 2a ': insertion groove for coupling
2b, 2b' : 고정용 나사홈 2c, 2c', 2c" : 실드케이스 밑판의 납땜부2b, 2b ': Fixing screw groove 2c, 2c', 2c ": Solder part of shield case base plate
2d, 2d' : 실드케이스 덮개의 납땜부2d, 2d ': Solder of shield case cover
본 고안은 자동차 전화기와 무선기기 등에 사용되는 고주파 파워앰프 모듈의 실드(shield)케이스에 관한 것이다.The present invention relates to a shield case of a high frequency power amplifier module used in automobile telephones and wireless devices.
종래에 사용되고 있는 고주파 파워 앰프 모듈의 접지 및 장착은 주변회로 PCB를 이용하여 하우징에 접지 및 장착되어 있어, 전기적 접촉이 확실하지 않았다.Grounding and mounting of a conventional high frequency power amplifier module is grounded and mounted in a housing using a peripheral circuit PCB, so that electrical contact was not certain.
이로인해 불요 방사가 많이 생겨 다른 채널에도 악영향을 미처 통화를 방해 할 수도 있으며, 발진과 오동작동이 발생되었다.This caused a lot of unwanted radiation, which could adversely affect other channels, disrupting calls, and causing oscillations and malfunctions.
또한, 파워 앰프 모듈을 실험하기 위해 PCB를 이용하여 하우징에 고정하여야 하는 번거로움이 있었으며, 실제 파워 앰프 모듈의 정상적인 동작이 불가능한 점등의 문제점을 내포하고 있었다.In addition, there was a hassle to fix the power amplifier module to the housing by using a PCB, and the problem of lighting that the normal operation of the power amplifier module was impossible.
따라서, 본 고안은 상기 문제점을 해결하기 위해 안출된 것으로서, 장착이 아주 쉽고 접지가 확실하여 전기적 접촉이 확실하며, 접지의 불안정성이 제거되어 불요방사, 발진, 오동작등을 제거할 수 있는 고주파 앰프모듈의 실드케이스를 제공하는데 그 목적을 두고 있다.Therefore, the present invention has been devised to solve the above problems, it is very easy to install, and the ground is secure, the electrical contact is sure, the instability of the ground is eliminated to eliminate unnecessary radiation, oscillation, malfunction, etc. Its purpose is to provide a shield case.
본 고안은 상기 목적을 달성하기 위해 고주파 파워 앰프 모듈을 접지 및 장착하기 위한 실드케이스에 있어서, 상기 고주파 파워 앰프 모듈의 밑면을 지지하기 위한 실드케이스 밑판, 상기 고주파 파워 앰프 모듈을 덮도록 형성된 실드케이스 덮개, 상기 실드케이스 밑판 상에 형성된 결합용 돌출수단, 상기 돌출수단을 수용할 수 있도록 실드케이스 덮개에 형성된 결합용 삽입홈, 및 결합된 밑판 및 덮개를 하우징에 고정시키는 고정수단으로 구성되어 있으며, 상기 실드케이스 밑판 및 덮개가 각각 PCB에 부착되는 것을 특징으로 한다.The present invention is a shield case for grounding and mounting a high frequency power amplifier module to achieve the above object, a shield case bottom plate for supporting the bottom of the high frequency power amplifier module, a shield case formed to cover the high frequency power amplifier module A cover, a coupling protrusion formed on the bottom of the shield case, a coupling insertion groove formed in the shield case cover to accommodate the protrusion, and fixing means for fixing the bottom plate and the cover to the housing, The shield case bottom plate and the cover is characterized in that each attached to the PCB.
이하, 첨부된 도면을 참고하여 본 고안의 실시예를 상세히 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 고안은 일실시예의 구성도로서, 제1a도는 평면도를, 제1b도는 정면도를 나타내고, 1은 실드케이스 밑판을, 2는 실드케이스 덮개를, 1a, 1a'는 결합용 돌출부를, 2a, 2a'는 결합용 삽입홈을, 2b, 2b'는 고정용 나사홈을, 2c, 2c', 2c"는 실드케이스 밑판에 형성되어 있는 것으로 PCB 기판에 부착시키기 위한 납땜부를, 2d, 2d'는 실드케이스 덮개에 형성되어 있는 것으로 PCB기판에 부착시키기 위한 납땜부를 각각 나타낸다.1 is a block diagram of an embodiment of the present invention, Figure 1a is a plan view, Figure 1b is a front view, 1 is a shield case base plate, 2 is a shield case cover, 1a, 1a 'is a coupling protrusion, 2a, 2a 'is the insertion groove for the coupling, 2b, 2b' is the fixing screw groove, 2c, 2c ', 2c "is formed on the shield case base plate, the soldering portion for attaching to the PCB substrate, 2d, 2d 'Is formed on the shield case cover, and each solder part for attaching to the PCB substrate.
제1a도 및 제1b도에 도시한 바와 같이 실드케이스 밑판(1)을 파워앰프 모듈의 밑부분을 맞게 고정시키고 실드케이스 덮개판(2)을 모듈위에 씌운다.As shown in FIGS. 1a and 1b, the shield case bottom plate 1 is fixed to the bottom of the power amplifier module and the shield case cover plate 2 is covered on the module.
그리고 나서, 상기 밑판(1)의 상면 양측에 형성된 결합용 돌출부(1a, 1a')를 상기 덮개에 대응되는 위치에 각각 형성된 삽입홈(2a, 2a')에 끼운후 상기 돌출부(1a)를 비틀어 고정시킨다.Then, the coupling protrusions 1a and 1a 'formed on both sides of the upper surface of the bottom plate 1 are inserted into the insertion grooves 2a and 2a' respectively formed at positions corresponding to the cover, and then the protrusions 1a are twisted. Fix it.
상기 실드케이스 밑판 및 덮개에 각각 형성된 납땜부(2c, 2c', 2c", 2d, 2d')는 PCB(인쇄회로기판)에 각각 납땜으로 부착할 수 있도록 하여 기계적 강도를 더욱 튼튼히 보강 하였으며, 상기 고정용 나사홈(2b, 2b')은 마지막으로 제품을 조립할때 하우징에 고정할 수 있도록 하기 위한 것이다.Soldering parts (2c, 2c ', 2c ", 2d, 2d') formed on the shield case bottom plate and the cover, respectively, can be attached to the PCB (printed circuit board) by soldering to further strengthen the mechanical strength. Fixing screw grooves 2b and 2b 'are intended to be fixed to the housing when the product is finally assembled.
본 고안은 상기와 같이 간단하게 구성되어 있으며, 첫째, 전기적 접촉이 확실시 되므로 종래의 불요 방사를 제거, 다른 채널을 방해하지 않게 되었고, 발진 및 오동작동을 제거하여 보다 성능이 우수한 제품을 제공하게 하였고, 둘째, 파워앰프 모듈의 장착이 편리하며, 세째, 실드케이스 밑판과 덮개의 결합을 견고하게 하여 기계적 강도를 높였으며, 네째, 종래의 PCB를 이용하여 하우징에 고정시켜 시험하는 번거로움을 제거하여, 간단하게 실험 가능케 하는 효과를 갖는다.The present invention is simply configured as described above. First, since the electrical contact is assured, the conventional unnecessary radiation is eliminated, it does not disturb other channels, and the oscillation and malfunction are eliminated to provide a better product. Second, the installation of the power amplifier module is convenient, and third, the mechanical strength is increased by firmly combining the shield case base plate and the cover. Fourth, by eliminating the hassle of fixing and testing the housing by using a conventional PCB It has the effect of making it simple to experiment.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR9200682U KR920002935Y1 (en) | 1989-11-29 | 1992-01-18 | Power amp shield case for high frequency |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019890017453A KR910011108A (en) | 1989-11-29 | 1989-11-29 | High Frequency Power Amplifier Shield Case |
| KR9200682U KR920002935Y1 (en) | 1989-11-29 | 1992-01-18 | Power amp shield case for high frequency |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019890017453A Division KR910011108A (en) | 1989-11-29 | 1989-11-29 | High Frequency Power Amplifier Shield Case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR920002935Y1 true KR920002935Y1 (en) | 1992-05-08 |
Family
ID=26628129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR9200682U KR920002935Y1 (en) | 1989-11-29 | 1992-01-18 | Power amp shield case for high frequency |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR920002935Y1 (en) |
-
1992
- 1992-01-18 KR KR9200682U patent/KR920002935Y1/en not_active IP Right Cessation
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| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| LAPS | Lapse due to unpaid annual fee |