KR970004513Y1 - Substrate biasing structure of electronic device - Google Patents
Substrate biasing structure of electronic device Download PDFInfo
- Publication number
- KR970004513Y1 KR970004513Y1 KR2019940006663U KR19940006663U KR970004513Y1 KR 970004513 Y1 KR970004513 Y1 KR 970004513Y1 KR 2019940006663 U KR2019940006663 U KR 2019940006663U KR 19940006663 U KR19940006663 U KR 19940006663U KR 970004513 Y1 KR970004513 Y1 KR 970004513Y1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- screw
- chassis
- copper foil
- foil surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
내용없음.None.
Description
제1도의 a, b는 종래의 기판접지구조를 설명하기 위한 평면도 및 측면도A and b of FIG. 1 are a plan view and a side view for explaining a conventional substrate grounding structure.
제2도는 제1도의 요부사시도FIG. 2 is a view of the first part of FIG.
제3도는 본 고안에 따른 기판접지기조를 설명하기 의한 요부 분리사시도Figure 3 is an exploded perspective view of the main portion to explain the substrate folding tank according to the present invention
제4도는 제3도의 조립단면도이다.4 is an assembled cross-sectional view of FIG.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10, 20 : 샤시(chassis) 10a, 20a : 받침편10, 20: chassis 10a, 20a: backing piece
10b : 절곡편 11, 21 : 기판10b: Bending piece 11, 21: substrate
11a, 21a : 체결공 11b, 21b : 등박면11a, 21a: Fastener 11b, 21b: Back surface
12, 22 : 스크류 22a : 머리부12, 22: screw 22a: head
23 : 몸체커버 23a : 절결홈23: body cover 23a: notch groove
23b : 누름편23b: push piece
본 고안의 전기, 전자제품의 몸체커버 내부에 장착되어 각종 구동관련부품들이 실장되는 기판을 용이하게 접지시킬수 있도록 한 전기, 전자제품의 기판접지구조에 관한 것이다.The present invention relates to a substrate grounding structure of an electrical and electronic product mounted inside a body cover of an electrical and electronic product so as to easily ground a substrate on which various driving related components are mounted.
일반적으로, 기판을 접지시키기 위하여는 제1도의 a, b 및 제2도에 나타낸 바와 같이 우선, 샤시(10)의 상부 내측으로 절곡성형된 받침편(10a)상에 기판(11)을 탑재한 후 이들에 형성된 체결공(11a)을 스크류(12)로 체결함으로써 기판(11)을 샤시(10)에 고정시킨다.In general, in order to ground the substrate, as shown in FIGS. A, b, and 2 of FIG. 1, the substrate 11 is first mounted on a support piece 10a that is bent into the upper portion of the chassis 10. FIG. Then, by fastening the fastening holes (11a) formed in these with a screw 12, the substrate 11 is fixed to the chassis 10.
그후에 상기 샤시(10)의 일측에 형성된 절곡편(10b)을 기판(11)의 일측에 형성된 동박면(11b)측으로 구부려 이들을 납땜연결시킴으로써 샤시(10)와 기판(11)을 접지시키게 된다.Thereafter, the bent piece 10b formed on one side of the chassis 10 is bent to the copper foil surface 11b formed on one side of the substrate 11 to solder them to ground the chassis 10 and the substrate 11.
그러나, 이와 같은 종래의 접지구조는 샤시(10)의 절곡편(11b)과 상기 기판(11)상의 동박면(1b)이 쉽게 납땜되지 않음은 물론, 납의 소모량이 많으므로 비경제적이라는 문제가 있고, 더욱이 작업성이 용이하지 않으므로 생산성 향상에도 지장을 초래하게 된다.However, such a conventional grounding structure has a problem that the bent piece 11b of the chassis 10 and the copper foil surface 1b on the substrate 11 are not easily soldered, and of course, the consumption of lead is uneconomical. In addition, workability is not easy, which may cause productivity problems.
본 고안은 상기와 같은 종래의 문제점을 감안하여 이루어진 것으로서, 기판의 스크류 체결공 주위에 동박면을 형성하고, 이 스크류가 몸체커버와 탄력있게 접속되도록 함으로써, 별도의 납댐작업을 필요로 하지 않고도 용이하게 접지시킬 수 있도록하여 작업성 및 생산성을 향상시킬 수 있는 전기, 전자제품의 기판접지구조를 제공하는테 그 목적이 있다.The present invention has been made in view of the above-described conventional problems, and by forming a copper foil surface around the screw fastening hole of the substrate, the screw is elastically connected to the body cover, it is easy without requiring a separate lead dam work The purpose is to provide a substrate grounding structure of electrical and electronic products that can be grounded to improve the workability and productivity.
상기와 같은 목적을 달성하기 위한 본 고안의 특성은 샤시에 장착되는 기판상의 동박면을 접지시키기 위한 구조에 있어서, 상기 샤시 끝단에 절곡 성형된 받침편상에 스크류로 체결되는 기판의 체결공 주위에 동박면을 형성하고, 스크류와 동박면이 서로 접속되도록함과 동시에 스크류의 머리부가 몸체커버에 형성된 누름편에 탄력있게 밀착되도록 한 전기, 전자제품의 기판접지구조에 있다.The characteristics of the present invention for achieving the above object is in a structure for grounding the copper foil surface on the substrate to be mounted on the chassis, copper foil around the fastening hole of the substrate to be fastened by screws on the support piece bent at the end of the chassis It is a substrate grounding structure of electrical and electronic products that forms a surface, and the screw and the copper foil surface is connected to each other and at the same time elastically closely contact the pressing piece formed on the body cover.
이하, 본 고안에 따른, 전기, 전자제품의 기판접지구조에 대한 바람직한 실시예를 첨부도면에 따라 상세히 설명한다.Hereinafter, a preferred embodiment of the substrate grounding structure of the electric, electronic products according to the present invention will be described in detail according to the accompanying drawings.
제3도 및 제4도는 본 고안의 기판접지구조를 설명하기 위한 도면으로서, 샤시(20)의 상부내측으로 절곡성형된 받침편(20a)상에 기판(21)이 탑재되며, 이들에 형성된 체결공(21a)을 스크류(22)로 체결시킴으로써 샤시(20)에 기판(21)을 고정시킬 수 있게 된다.3 and 4 are diagrams for explaining the substrate grounding structure of the present invention, the substrate 21 is mounted on the support piece 20a bent into the upper inside of the chassis 20, the fastening formed in these By fastening the ball 21a with the screw 22, the substrate 21 can be fixed to the chassis 20.
이때, 상기 기판(21)의 체결공(21a) 주위엔는 동박면(21b)이 형성되어 스크류(22)의 체결시에 이 스크류(22)와 동박면(21b)이 서로 접속된다.At this time, around the fastening hole 21a of the said board | substrate 21, the copper foil surface 21b is formed, and this screw 22 and the copper foil surface 21b are mutually connected at the time of the screw 22 fastening.
또한, 상기 샤시(20)와 기판(21)의 외측으로 씌위지는 몸체커버(23)에는 상기 스크류(22)와 대향되는 위치에 절결홈(23a)이 형성되고, 그 내측으로 누름편(23b)이 절곡 성형되어 있다.In addition, a cutout groove 23a is formed at a position opposite to the screw 22 in the body cover 23 that is covered by the outside of the chassis 20 and the substrate 21, and the pressing piece 23b is inwardly formed. ) Is bent and molded.
따라서, 상기 몸체커버(23)의 조립시에 누름편(23b)이 스크류(22)의 머리부(22a)를 탄력있게 밀어 누를수 있게 된다.Therefore, when the body cover 23 is assembled, the pressing piece 23b can push the head 22a of the screw 22 elastically.
상술한 바와 같이 구성된 본 고안은, 샤시(20)의 받침편(20a)상에 기판(21)을 탑재하여 스크류(22)로 체결시킴으로써 샤시(20)에 기판(21)을 고정시킬 수 있게 되는데, 이때 상기 스크류(22)는 기판(21)의 체결공(21a) 주위에 형성된 동박면(21b)과 1차 접속된다.According to the present invention configured as described above, the substrate 21 is fixed to the chassis 20 by mounting the substrate 21 on the support piece 20a of the chassis 20 and fastening with a screw 22. In this case, the screw 22 is primarily connected to the copper foil surface 21b formed around the fastening hole 21a of the substrate 21.
그후, 상기 샤시(20) 및 기판(21)의 외측으로 몸체커버(23)를 씌워 조립시키게 되면, 이 몸체커버(23)에 형성된 누름편(23b)이 스크류(22)의 머리부(22a)를 탄력있게 밀어 누르게 되므로 스크류(22)와 몸체커버(23)가 항상 접속상태를 유지할 수 있게 된다.Then, when the body cover 23 is assembled to the outside of the chassis 20 and the substrate 21, the pressing piece 23b formed on the body cover 23 is the head 22a of the screw 22. Since it is pushed elastically so that the screw 22 and the body cover 23 can always maintain the connection state.
따라서, 기판(21)상에 유지되는 미세누설전류 등을 흡수함으로써 기존의 접지효과를 나타낼수 있게 된다.Therefore, by absorbing the minute leakage current and the like maintained on the substrate 21 it is possible to exhibit the existing grounding effect.
이상에서와 같이 본 고안은, 기판의 스크류 체결공 주위에 동박면을 형성하고, 이 스크류가 몸체커버와 탄력있게 접속되도록 함으로써, 별도의 납땜작업을 필요로 하지 않고도 용이하게 접지시킬 수 있도록하여 작업성 및 생산성을 크게 향상시킬 수 있는 것이다.As described above, the present invention forms a copper foil surface around the screw fastening hole of the substrate, so that the screw is elastically connected to the body cover, so that it can be easily grounded without the need for a separate soldering work It can significantly improve productivity and productivity.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940006663U KR970004513Y1 (en) | 1994-03-31 | 1994-03-31 | Substrate biasing structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940006663U KR970004513Y1 (en) | 1994-03-31 | 1994-03-31 | Substrate biasing structure of electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950029013U KR950029013U (en) | 1995-10-20 |
| KR970004513Y1 true KR970004513Y1 (en) | 1997-05-12 |
Family
ID=19380092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940006663U KR970004513Y1 (en) | 1994-03-31 | 1994-03-31 | Substrate biasing structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970004513Y1 (en) |
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1994
- 1994-03-31 KR KR2019940006663U patent/KR970004513Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR950029013U (en) | 1995-10-20 |
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